A fanless modular small compact industrial control computer and surface treatment method thereof

Abstract

The present invention provides a fanless modular small and compact industrial control computer and its surface treatment method, which includes a heat dissipation profile, a housing, and a control circuit board; both the heat dissipation profile and the housing are made of magnesium alloy, and their surfaces are both subjected to black anodizing treatment; the heat dissipation profile includes a heat dissipation base body and a plurality of fins integrally formed on the top surface of the heat dissipation base body, the housing includes a bottom cover, an IO rear baffle, and a front cover plate assembled together, and the front cover plate is composed of a left baffle, a middle baffle, and a right baffle integrally formed into a "U" - shaped structure. The present invention optimizes the setting of the large size of the traditional industrial control computer, abandons the conventional fan, and mainly utilizes the fins on the heat dissipation profile and combines the material of the industrial control computer with its special black anodizing treatment method on the surface, so that the industrial control computer can also achieve good heat dissipation capacity, the industrial control computer realizes the purpose of light weight, is small in size and light in weight, and the modular assembly method also enables the industrial control computer to be flexibly disassembled and assembled.

Description

Technical Field

[0001] The present invention belongs to the field of industrial computer equipment, and specifically, it shows a fanless modular small compact industrial computer and a surface treatment method thereof. Background Art

[0002] Industrial computers generally refer to industrial control computers, which usually use industrial-grade standard components and have the characteristics of being sturdy, durable, and reliable. The core function of industrial computers is to monitor and control the machinery and equipment, production processes, data parameters, etc. involved in the industrial production process.

[0003] In reality, the working environment of industrial computers is relatively complex. According to the needs of the equipment, they are set up in places with extremely limited space. Therefore, there are extremely high requirements for all aspects of industrial computers, such as size, heat dissipation, corrosion resistance, etc.

[0004] Traditional industrial computers usually choose to use fans to actively dissipate heat and cool down, but adding fans requires the equipment to have a larger space, which brings great inconvenience to the size of the equipment. The equipment is difficult to miniaturize, and the operation of the fan will generate wind flow, and dust and other debris in the environment can easily be brought into the equipment, thereby affecting the normal operation of the circuit module in the equipment. Therefore, for small and compact industrial computers, fans will occupy a larger internal space of the equipment, resulting in a large body design that cannot be lightweight, which is very unfavorable for the use requirements of a relatively narrow installation environment. Moreover, most current industrial computers will choose to add conventional coatings on the surface of the equipment to improve the corrosion resistance of the equipment. Few of the coatings that can be added can provide effective heat dissipation performance for the equipment, which is worth optimizing and improving.

[0005] In addition, during the industrial production process, it is inevitable that there will be scenarios where equipment needs to be quickly inspected and maintained, which requires that the industrial computer be able to meet the requirements of convenient disassembly and assembly.

[0006] Therefore, it is of great significance to design a lightweight industrial computer that does not require a fan and can still achieve good heat dissipation performance. Summary of the invention

[0007] One of the purposes of the present invention is to provide a fanless modular small compact industrial computer with compact layout and high reliability.

[0008] The technical solution is as follows:

[0009] A fanless modular small compact industrial computer comprises a heat dissipation profile, an outer shell and a control circuit board, wherein the top of the outer shell is configured to be open and the heat dissipation profile is detachably sealed and installed at a position corresponding to the open portion, and an installation space for the control circuit board is enclosed between the inner portion of the outer shell and the heat dissipation profile;

[0010] Both the heat dissipation profile and the outer shell are made of magnesium alloy, and the surfaces are both subjected to black anodizing treatment process;

[0011] The heat dissipation profile includes a heat dissipation base body and a plurality of fins integrally formed on the top surface of the heat dissipation base body. Each fin is longitudinally arranged on the heat dissipation base body, and adjacent fins are arranged in parallel at intervals. The distance between adjacent fins is 3 mm, the height of a single fin is 1.8 mm, and the length of a single fin is 12 mm. At both ends of the top surface of the heat dissipation base body, there is a rib plate spaced from the fins, and the height of the rib plate is the same as that of the fins; a mounting area is recessed on the bottom surface of the heat dissipation base body for assembling a heat-conducting copper sheet, and the bottom surface of the heat dissipation base body is connected to the control circuit board by screw mounting;

[0012] The outer shell includes a bottom cover, an IO rear baffle and a front cover plate assembled together. The front cover plate is composed of a left baffle, a middle baffle and a right baffle integrally formed into a "U" shape structure. The two side ends of the IO rear baffle are respectively connected to the left baffle and the right baffle by screw mounting. The bottom ends of the left baffle, the middle baffle and the IO rear baffle are all vertically bent inward to form a closed folding plate. One side end of the bottom cover is in plug-in fit with the closed folding plate at the bottom end of the left baffle, and the other side end of the bottom cover is vertically bent upward to form a connecting plate, and the connecting plate is connected to the lower outer wall of the right baffle by screw mounting.

[0013] First, the industrial computer design is divided into three parts: a heat dissipation profile, an outer shell and a control circuit board. The control circuit board is mainly used to carry a CPU, a hard disk, a memory, peripherals, interfaces, etc. Therefore, the control circuit board is encapsulated in the internal installation space formed by the heat dissipation profile and the outer shell. The heat dissipation profile is used to play a heat dissipation role. The heat is mainly absorbed by the heat-conducting copper sheet and then transferred to the heat dissipation base body, and finally effectively dissipated into the air through a number of fins. The outer shell is a modular assembly design, and the disassembly and assembly are very convenient; in addition, the surfaces of both the heat dissipation profile and the overall surface of the outer shell are subjected to black anodizing treatment to improve the emissivity of their surfaces so as to enhance the radiation heat dissipation ability.

[0014] Further, the specific steps include cleaning, pickling, anodizing treatment, coloring, and sealing holes. Among them, in the anodizing treatment step, the anodic electrolyte includes a mixed solution of oxalic acid and formic acid. The concentration of oxalic acid is 35 - 45 g / L, and the concentration of formic acid is 0.48 g / L. The anodizing process conditions are: temperature 29 ± 2 °C, voltage 42 ± 2 V, current density 2 - 2.3 A / dm 2 。

[0015] Furthermore, the top of one of the ribs is horizontally bent inward to form a sealing plate, and the sealing plate is located above a fin at the outermost edge of the heat dissipation substrate, and a spacing is retained between the sealing plate and the fin.

[0016] Generally speaking, the surface of industrial computer equipment needs to be marked with information such as brand and model to help determine the specific model and related technical parameters of the equipment. This is usually done by pasting identification stickers. However, when the equipment is used for a long time in harsh environments, the stickers will become blurred or even fall off, making it impossible to accurately identify the relevant information of the equipment. This application has taken this problem into consideration, and in order to make the equipment information more eye-catching and recognizable, the design prints the relevant information on the front of the industrial computer through screen printing, that is, the surface of the cover plate bent on the rib plate. After the industrial computer is wall-mounted, it does not take up space and is intuitive and eye-catching.

[0017] Furthermore, the lower part of the heat dissipation base is shrunk inwards to form a step-shaped connection part, and the top of the IO rear baffle and the front cover plate are respectively tightly fitted with the step-shaped connection part and connected by screws. In this way, the concealment of the connection and installation of the heat dissipation profile and the outer shell can be ensured, the local part is not abrupt, the beauty of the equipment is guaranteed, and it is also conducive to the alignment and assembly of the heat dissipation profile and the outer shell, reducing the time for correcting the alignment and installation position.

[0018] Furthermore, a first plug-in board is provided at the middle of the closed folding plate at the bottom end of the left baffle plate, and two second plug-in boards are provided at both sides of one end of the bottom cover, which are symmetrical with each other. The first plug-in board is not coplanar with the closed folding plate, and the second plug-in board is not coplanar with the bottom cover. When the bottom end surface of the second plug-in board abuts against the top surface of the closed folding plate, the bottom end surface of the first plug-in board abuts against the top surface of the bottom cover. The bottom cover is designed to be flexibly plugged in, which is convenient for assembling the outer shell. When inspection or maintenance work is required at a later stage, the bottom cover can be removed from the bottom of the outer shell to inspect the components on the internal control circuit board.

[0019] Furthermore, the middle parts of the closed folding plate on the bottom end of the intermediate baffle and the closed folding plate on the bottom end of the 10 rear baffle are both extended outward to provide connecting ribs, the connecting ribs are not coplanar with the closed folding plate, the bottom end surface of the connecting ribs abuts against the top surface of the bottom cover and is fixedly connected by screws. The connecting ribs cooperate with the bottom cover to ensure that the bottom cover can be stably assembled on the bottom end of the 10 rear baffle and the front cover body plate, and avoid shaking of the bottom cover.

[0020] Furthermore, the width of the bottom cover is equal to the distance between the closed folded plate on the bottom end of the middle baffle and the closed folded plate on the bottom end of the IO rear baffle, so as to achieve a seamless docking installation effect as much as possible, which not only ensures the flatness of the bottom of the outer shell, but also has a certain dustproof effect and a certain degree of aesthetics.

[0021] Furthermore, the side ends of the left baffle and the right baffle are both extended outward to set non-coplanar fitting plates, and the two side ends of the IO rear baffle are respectively in contact with the fitting plates and are installed and connected by screws, and the outer surface of the IO rear baffle is respectively flush with the outer surface of the left baffle and the outer surface of the right baffle. The flatness and continuity of the connection position of the IO rear baffle and the front cover body plate after assembly are ensured, and the aesthetics of the equipment is improved.

[0022] Furthermore, the bottom end of the right baffle is provided with an inner plate that is not coplanar therewith, the inner wall of the connecting plate on the bottom cover is in contact with the outer wall of the inner plate and is connected by screws, and the outer surface of the connecting plate is flush with the outer surface of the right baffle. Similarly, the flatness and continuity of the connection position after the bottom cover and the front cover body plate are assembled is ensured, thereby improving the aesthetics of the equipment.

[0023] It is worth noting that the surfaces of the IO rear baffle, the left baffle, and the right baffle are all provided with a number of reserved ports, which accurately correspond to the relevant I / O interfaces on the control circuit board, so that the relevant interfaces are exposed, so that the industrial computer can exchange data with external devices.

[0024] Furthermore, two wall-mounted plates are symmetrically arranged on both sides of the bottom end surface of the bottom cover. In this way, the industrial computer can be directly hung on the wall or other planes through the two wall-mounted plates, without occupying the ground space, which is very suitable for industrial environments with limited space. In addition, the wall-mounted design has a relatively simple and quick installation process, usually only a few screws are needed to fix it, and it is also more convenient for maintenance, and the equipment can be easily approached for inspection and repair.

[0025] The second object of the present invention is to provide a surface treatment method. For the above-mentioned fanless modular small compact industrial computer, first, the outer shell and the heat dissipation profile are both made of magnesium-aluminum alloy, and the surfaces of the heat dissipation profile and the outer shell are both subjected to a black anodizing process. The specific steps are as follows:

[0026] a) Wash and then dry with cold air;

[0027] b) Soak and pickle, then blow dry with cold air;

[0028] c) Anodizing treatment: first prepare the anolyte, select oxalic acid with a concentration of 35-45 g / L, add formic acid with a concentration of 0.48 g / L to the oxalic acid, and the anodizing process conditions are: temperature control at 29±2°C, voltage control at 42±2V, current density control at 2-2.3A / dm 2 ; By applying a DC power supply, an electrolytic reaction is carried out in an anodizing treatment tank to form an oxide film on the surface, and the electrolysis time is controlled to be 60 to 90 minutes;

[0029] d) Coloring: the workpiece after anodizing is placed in a dye solution so that the pores in the oxide film on the surface of the workpiece are filled with black metal ions;

[0030] e) Sealing: put the colored material into the sealing liquid to seal the micropores in the anodized layer, wash it with clean water, and then blow it dry with cold air.

[0031] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention optimizes the large-scale setting of the traditional industrial computer, abandons the conventional fan, and mainly utilizes the fins on the heat dissipation profile and combines the material of the industrial computer with the special black anodizing treatment on its surface, so that the industrial computer can also achieve good heat dissipation capability with low cost. In addition, the industrial computer achieves the purpose of lightweight, with a small size and light weight. The modular assembly method also makes the industrial computer flexible to disassemble and assemble, and the visual appearance is also very neat and beautiful. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is one of the disassembled structural schematic diagrams of a fanless modular small compact industrial computer according to an embodiment of the present invention;

[0033] Figure 2 This is the second schematic diagram of the disassembled structure of a fanless modular small compact industrial computer according to an embodiment of the present invention;

[0034] Figure 3 It is a schematic diagram of a fanless modular small compact industrial computer in a front view according to an embodiment of the present invention;

[0035] Figure 4 It is a schematic diagram of a fanless modular small compact industrial computer in an embodiment of the present invention from an upward perspective;

[0036] Figure 5 This is a schematic diagram of disassembling an outer shell of a fanless modular small compact industrial computer according to an embodiment of the present invention;

[0037] Figure 6 This is another disassembly schematic diagram of an outer shell of a fanless modular small compact industrial computer according to an embodiment of the present invention;

[0038] Figure 7 This is a schematic diagram of an IO rear baffle in an outer shell of a fanless modular small compact industrial computer according to an embodiment of the present invention;

[0039] Relevant marks in the accompanying drawings: 1-outer shell, 2-heat dissipation profile, 3-control circuit board, 4-wall-mounted plate; 11-bottom cover, 12-IO rear baffle, 101-closing folding plate, 102-matching plate, 103-connecting ribs, 104-reserved port, 111-second plug-in board, 112-connecting plate, 13-front cover plate, 131-left baffle, 132-middle baffle, 133-right baffle, 1311-first plug-in board, 1331-embedded plate, 21-heat dissipation base, 22-fins, 23-ribs, 211-mounting area, 212-step-shaped connecting part, 231-sealing plate. DETAILED DESCRIPTION

[0040] In order to facilitate the understanding of the present invention, the present invention will be described more fully below. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0042] The overall structure of the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementations.

[0043] The present invention proposes a fanless modular small compact industrial computer, such as Figure 1 As shown, it mainly includes a heat dissipation profile 2, an outer shell 1 and a control circuit board 3. The top of the outer shell 1 is constructed to be open and the heat dissipation profile 2 is detachably closed and installed at a position corresponding to the opening, and an installation space for the control circuit board 3 is enclosed between the inside of the outer shell 1 and the heat dissipation profile 2.

[0044] That is to say, the industrial computer of the present invention is mainly divided into three parts, with an outside-inside-outside structure. The control circuit board is mainly used to carry the CPU, hard disk, memory, peripherals, interfaces, etc., and belongs to the central part of the equipment. Therefore, it is protected by the surrounding of the heat dissipation profile and the outer shell. The CPU and hard disk devices on the control circuit board will generate heat when working. If the heat cannot be effectively dissipated, it will affect its performance efficiency. The designed heat dissipation profile is used to play a heat dissipation role.

[0045] Regarding the structural design of heat dissipation profiles, such as Figure 2 , Figure 3 , Figure 4 As shown:

[0046] The heat dissipation profile 2 includes a heat dissipation base 21 and a plurality of fins 22 integrally formed on the top surface of the heat dissipation base 21. The heat dissipation base 21 is used to establish a connection with the outer shell 1. Each fin 22 is longitudinally arranged on the heat dissipation base 21, and adjacent fins 22 are arranged in parallel and spaced apart. The spacing between adjacent fins 22 is 3 mm, the height of a single fin 22 is 12 mm, and the thickness of a single fin 22 is 1.8 mm. The surface of the fin 22 can also be provided with convex points or convex patterns to improve the heat dissipation capacity. There are 29 fins in total. The FLOEFD thermal flow simulation analysis shows that the heat dissipation capacity achieved by the fin design under this data is very outstanding.

[0047] In addition, a rib 23 spaced apart from the fins 22 is provided at both ends of the top surface of the heat dissipation substrate 21. The ribs 23 on both sides can be used to protect the multiple fins 22 arranged between them. The height of the ribs 23 is consistent with the height of the fins 22 to avoid affecting the aesthetics.

[0048] The additional design of the ribs is mainly to be able to identify the product information of the industrial computer. Generally speaking, the surface of the industrial computer equipment needs to be marked with information such as brand and model to help determine the specific model and related technical parameters of the equipment. Generally, this method is adopted to stick identification stickers. However, when the equipment is used for a long time in harsh environments, this sticker will become blurred or even fall off, resulting in the inability to accurately identify the relevant information of the equipment.

[0049] The present application takes this problem into consideration, and in order to make the equipment information more eye-catching and recognizable, the top of one of the ribs 23 is horizontally bent inward to form a sealing plate 231. The sealing plate 231 is located above the edge of the fin 22 on the heat dissipation substrate 21, and a spacing is retained between the sealing plate 231 and the fin 22, while the other rib 23 is parallel to the fin 22. With this design, the relevant information can be printed on the front of the industrial computer by screen printing, that is, the surface of the sealing plate bent on the rib. After the industrial computer is wall-mounted, it does not take up space and is intuitive and eye-catching.

[0050] In addition, a mounting area 211 is provided in a recessed manner on the bottom surface of the heat dissipation base 21 for assembling a thermally conductive copper sheet (not shown in the figure). The thermally conductive copper sheet is fixed in the mounting area by screw connection. The position of the thermally conductive copper sheet corresponds to the position of the CPU and hard disk on the surface of the control circuit board. The bottom surface of the heat dissipation base is also detachably connected to the control circuit board by screws.

[0051] About the material and surface treatment design of heat dissipation profile 2:

[0052] First, the outer shell 1 and the heat dissipation profile 2 are both made of aluminum-magnesium alloy, which has excellent strength and good protection performance; aluminum-magnesium alloy has a small density and meets the lightweight design requirements; aluminum-magnesium alloy has good thermal conductivity and improves the heat dissipation performance of the industrial computer to a certain extent.

[0053] Secondly, the surface of the outer shell and heat dissipation profiles are treated with black anodizing, which specifically includes the following steps:

[0054] S1. Cleaning: This step is to clean the oil, dust and other impurities on the surface of the material to ensure the surface is clean to ensure the quality of the anodizing effect. After cleaning, blow dry with cold air.

[0055] S2, pickling, this step is to remove the oxide scale and oxide on the surface of the material to improve the anodizing effect. Generally, low concentration nitric acid is used for immersion pickling, and then cold air is blown dry after pickling.

[0056] S3, anodizing treatment, prepare the anolyte, select oxalic acid with a concentration of 35-45g / L, add formic acid with a concentration of 0.48g / L to the oxalic acid, anodizing process conditions: temperature 29±2℃, voltage 42±2V, current density 2-2.3A / dm 2 ; By applying a DC power supply, an electrolytic reaction is carried out in the anodizing treatment tank to form an oxide film on the surface. The electrolysis time can be controlled to be 60 to 90 minutes. Under this current density condition, the film formation speed is faster, which shortens the anodizing time. After the oxidation treatment, it is washed with distilled water and dried with cold air.

[0057] S4. Coloring. The anodized material enters the dye solution to fill the pores in the oxide film on the surface of the material with black metal ions, thereby changing the color of the oxide film. The dye solution is prepared by mixing 20-30 g / L of acid-washed wool ATT and 2-3 g / L of acid lake blue. The pH value of the mixed solution is 3-3.5, the coloring temperature is 50-70°C, and the coloring time is 10-15 min.

[0058] S5. Sealing: Put the colored material into the sealing liquid to seal the micropores in the anodized layer to improve the corrosion resistance and sealing performance of the aluminum plate. The sealing liquid adopts an existing low-temperature nickel sealing agent solution. Finally, clean the sealed outer shell (or heat dissipation profile) with clean water to remove the residual dye or sealing liquid, and blow dry with cold air.

[0059] With respect to the anodizing process in the current technology, this application optimizes the preparation of the anodizing liquid in the process, and adopts a mixture of oxalic acid and formic acid. Formic acid is a strong oxidant. In the electrolyte of such a system, formic acid will accelerate the dissolution of the inner layer of the oxide film, thereby making the inner layer of the oxide film also a porous layer, and the conductivity in the electrolyte is improved, which enables the oxide film to form quickly. Compared with the current method of pure oxalic acid electrolyte, the electrolyte of this application can increase the forming rate of the oxide film by 35%, and can also reduce power consumption. The power consumption of the traditional pure oxalic acid process is about 3.23 degrees / square meter, and the anode electrolyte of this application is about 2 degrees / square meter.

[0060] Different surface treatments of materials will result in different surface emissivities, leading to different heat dissipation capabilities. This application analyzes the effects of different material surface treatments on radiative heat dissipation through the following three groups of test product heat dissipation experiments.

[0061] Test item No. 1: aluminum plate, no surface treatment; Test item No. 2: aluminum plate, the surface is anodized in natural color according to the traditional process (oxidized with oxalic acid and not black); Test item No. 3: aluminum plate, the surface is anodized in black as described in this application; Test item No. 4: magnesium-aluminum alloy plate, the surface is anodized in black as described in this application. The shapes of the aluminum plate and the magnesium-aluminum alloy are kept as consistent as possible, and the heating conditions and other parameters are also kept as consistent as possible. The experimental data are shown in Table 1.

[0062] Table 1: Temperature data

[0063]

[0064]

[0065] The surface temperature of each test product was measured by an infrared radiation thermometer. The emissivity of test product No. 1 was about 0.1, and the average temperature was subjectively judged to be about 77°C. The emissivity of test product No. 2 was between 0.2 and 0.3, and the average temperature was subjectively judged to be about 74°C, but the temperature fluctuation was large; the emissivity of test product No. 3 was about 0.6, and the average temperature was subjectively judged to be about 67°C; the emissivity of test product No. 4 was about 0.85, and the average temperature was subjectively judged to be about 65°C.

[0066] It can be seen that the surface emissivity of the test product using the magnesium-aluminum alloy + black anodizing treatment of the present application is the highest, about 0.85, and the surface radiation heat dissipation capacity is strong, which can play a good heat dissipation performance for the industrial computer together with the design of the auxiliary heat dissipation profile.

[0067] Regarding the structural design of the outer shell 1, Figure 5 , Figure 6 , Figure 7 As shown:

[0068] This application designs the outer housing 1 into three modular parts, namely the bottom cover 11, the IO rear baffle 12, and the front cover plate 13. After the three are combined and connected, they will form a box-like shape with an open top; the front cover plate 13 is composed of a left baffle 131, a middle baffle 132, and a right baffle 133 formed by integral molding to form a "凵" - shaped structure. The left baffle 131 and the right baffle 133 have the same structural design and are mirror images of each other. The distinction is for better reading and understanding. The two side ends of the IO rear baffle 12 are respectively connected to the left baffle 131 and the right baffle 133 by screw installation; the bottom ends of the left baffle 131, the middle baffle 132, and the IO rear baffle 12 all vertically bend inward to form a closed folding plate 101. One side end of the bottom cover 11 and the closed folding plate 101 at the bottom end of the left baffle 131 are in an insertion - fit manner. The other side end of the bottom cover 11 vertically bends upward to form a connecting plate 112, and the connecting plate 112 and the lower outer wall of the right baffle 133 are connected by screw installation.

[0069] Around the lower part of the heat - dissipation base 21, it contracts inward in a stepped connection part 212 in a circular shape. The tops of the IO rear baffle 12 and the front cover plate 13 are respectively in close contact with the stepped connection part 212 and are connected by screw installation.

[0070] In this way, it can ensure the concealment of the connection and installation between the heat - dissipation profile and the outer housing, without being obtrusive locally, ensuring the beauty of the device, and also facilitating the alignment and assembly of the heat - dissipation profile and the outer housing, reducing the time for correcting and aligning the installation position.

[0071] Designing the outer housing in a modular assembly method is mainly for easy disassembly and assembly. The connection and cooperation among the bottom cover, the IO rear baffle, and the front cover plate are basically connected by screws. First, the cost is low, and second, the operation is simple. The bottom cover can be easily removed from the bottom end of the industrial control computer to facilitate subsequent technicians to repair and maintain the related devices inside the industrial control computer.

[0072] Specifically, regarding the insertion design of the bottom cover 11:

[0073] At the middle part of the closed folding plate 101 at the bottom end of the left baffle 131, a first insertion plate 1311 extends outward. At both sides of one end of the bottom cover 11, two second insertion plates 111 that are symmetric left and right extend outward. The first insertion plate 1311 and the closed folding plate 101 are not coplanar, and the second insertion plates 111 and the bottom cover 11 are not coplanar. When the bottom end surface of the second insertion plate 111 abuts against the top surface of the closed folding plate 101, the bottom end surface of the first insertion plate 1311 just abuts against the top surface of the bottom cover 11 at the same time.

[0074] Plugging action at one end of the bottom cover 11: just insert the two second plug-in boards 111 on the bottom cover 11 from one side into the top of the closed folding plate 101 at the bottom end of the left baffle 131, so that the two second plug-in boards 111 surround the first plug-in board 1311 in the middle. In this way, a cross connection is formed between one end of the bottom cover 11 and the closed folding plate 101 on the left baffle 131 through the first plug-in board 1311 and the second plug-in board 111, which reduces the deformation of the connection and can replace screws for fixing.

[0075] An inner plate 1331 which is not coplanar with the right baffle 133 is provided at the bottom end thereof. The inner wall of the connecting plate 112 on the bottom cover 11 abuts against the outer wall of the inner plate 1331 and is connected by screws. The outer surface of the connecting plate 112 is flush with the outer surface of the right baffle 133 .

[0076] After a cross connection is formed between one end of the bottom cover 11 and the closed folding plate 101 on the left baffle 131, it is only necessary to push the other end of the bottom cover 11 upward until the inner wall of the connecting plate 112 at the other end of the bottom cover 11 abuts against the outer wall of the embedded plate 1331 on the right baffle 133. After the docking is completed, screws are tightened in the corresponding screw holes to realize the plug-in assembly of the bottom cover.

[0077] The above scheme realizes the assembly of the two sides of the bottom cover with the rest of the outer shell. However, since the bottom cover is a thin plate-like structure, under the action of external force, the two sides of the middle part of the bottom cover will deform inward, which will easily cause a deformation gap on the bottom end surface of the outer shell.

[0078] Therefore, connecting ribs 103 are extended outward from the middle parts of the closed folding plate 101 on the bottom end of the middle baffle 132 and the closed folding plate 101 on the bottom end of the IO rear baffle 12. The connecting ribs 103 are not coplanar with the closed folding plate 101. The bottom end surface of the connecting ribs 103 is in contact with the top surface of the bottom cover 11 and is fixedly connected by screws.

[0079] When the two ends of the bottom cover 11 are respectively assembled with the left baffle 131 and the right baffle 133, the two sides in the middle of the bottom cover 11 will also be in contact with a connecting rib 103 respectively, and then fixed by driving screws into the preset screw holes to ensure that the bottom cover 11 can be stably assembled on the bottom ends of the IO rear baffle 12 and the front cover body plate 13 to avoid shaking in the middle of the bottom cover 11.

[0080] The width of the bottom cover 11 is equal to the distance between the closed folding plate 101 on the bottom end of the middle baffle 132 and the closed folding plate 101 on the bottom end of the IO rear baffle 12.

[0081] In this way, the bottom cover 11 can be connected to the IO rear baffle 12 and the front cover body plate 13 to achieve a seamless docking installation effect as much as possible, which not only ensures the flatness of the bottom of the outer shell 1, but also has a certain dust-proof effect, and also has a certain degree of aesthetics.

[0082] The matching connection between the IO rear baffle 12 and the front cover body plate 13:

[0083] Non-coplanar mating plates 102 are extended outward from the side ends of the left baffle 131 and the right baffle 133, and the two side ends of the IO rear baffle 12 are respectively in contact with the mating plates 102 and installed and connected by screws, and the outer surfaces of the IO rear baffle 12 are respectively flush with the outer surfaces of the left baffle 131 and the right baffle 133.

[0084] This design can ensure the flatness and continuity of the connection position between the IO rear baffle and the front cover plate after assembly, improve the appearance of the equipment, and facilitate assembly and disassembly.

[0085] A plurality of reserved ports 104 are correspondingly provided on the surface of the right baffle 133. According to different installation environments, an external guide rail can be connected through the reserved port to realize the guide rail installation of the industrial computer. In this way, the two flexible options of wall-mounted installation and guide rail installation of the industrial computer are realized, and the applicability is wide.

[0086] In order to improve the applicability of this industrial computer, two wall-mounted plates 4 are symmetrically arranged on both sides of the bottom end surface of the bottom cover 11. The wall-mounted plates 4 and the bottom cover 11 are respectively provided with corresponding screw holes in the upper and lower directions, and the screws driven in are used to fix the wall-mounted plates and the bottom cover.

[0087] In this way, the industrial computer can be hung directly on the wall or other flat surfaces through two wall-mounted plates without taking up ground space. It is very suitable for industrial environments with limited space. In addition, the wall-mounted design makes the installation process relatively simple and quick, usually only requiring a few screws to fix. It is also more convenient for maintenance, and the equipment can be easily approached for inspection and repair.

[0088] The present invention optimizes the large-scale setting of the traditional industrial computer and abandons the conventional fan. The final designed industrial computer has a size of 157×112.5×54.5mm and a weight of about 0.85kg. The industrial computer achieves the purpose of lightweighting with a compact size and light weight.

[0089] The present invention designs the industrial computer as a modular assembly mainly consisting of three parts: a heat dissipation profile, an outer shell and a control circuit board, and the outer shell is also a modular assembly consisting of three parts: a bottom cover, an IO rear baffle and a front cover plate. The overall structure is compact, and the modular assembly method also enables the industrial computer to be flexibly disassembled and assembled, and the visual appearance is also very neat and beautiful.

[0090] Although the present invention abandons the conventional fan, it utilizes the fins on the heat dissipation profile and combines the material of the industrial computer with the special black anodizing treatment method on its surface, so that the industrial computer can also achieve good heat dissipation capacity with low cost.

[0091] The present invention optimizes the anodic electrolyte formula in the traditional black anodizing process, so that an oxide film can be quickly formed on the surface of the magnesium-aluminum alloy. The film formation speed is fast, the anodizing time is shortened, and compared with the method of pure oxalic acid electrolyte, the power consumption is reduced and energy is saved.

[0092] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the creative concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A fanless modular small compact industrial computer, characterized by: It includes a heat dissipation profile (2), an outer casing (1), and a control circuit board (3). The top of the outer casing (1) is configured to be open, and the heat dissipation profile (2) is detachably and sealingly installed at a position corresponding to the opening. An installation space for the control circuit board (3) is formed between the inside of the outer casing (1) and the heat dissipation profile (2). Both the heat dissipation profile (2) and the outer casing (1) are made of magnesium alloy, and the surfaces are both subjected to a black anodizing treatment process. The heat dissipation profile (2) includes a heat dissipation base (21) and a plurality of fins (22) integrally formed on the top surface of the heat dissipation base (21). Each fin (22) is longitudinally arranged on the heat dissipation base (21), and adjacent fins (22) are arranged in parallel at intervals. The distance between adjacent fins (22) is 3 mm, the height of a single fin (22) is 12 mm, and the thickness of a single fin (22) is 1.8 mm. A rib plate (23) spaced from the fins (22) is provided at both ends of the top surface of the heat dissipation base (21), and the height of the rib plate (23) is the same as that of the fins (22). A mounting area (211) is recessed on the bottom surface of the heat dissipation base (21) for assembling a heat-conducting copper sheet. The bottom surface of the heat dissipation base (21) is fixedly connected to the control circuit board (3) by screws. The outer casing (1) includes a bottom cover (11), an IO rear baffle (12), and a front cover plate (13) assembled together. The front cover plate (13) is formed into a "U" - shaped structure by an integrally formed left baffle (131), a middle baffle (132), and a right baffle (133). The two side ends of the IO rear baffle (12) are respectively fixedly connected to the left baffle (131) and the right baffle (133) by screws. The bottom ends of the left baffle (131), the middle baffle (132), and the IO rear baffle (12) are all vertically bent inward to form a closed flap (101). One side end of the bottom cover (11) is in an insertion - fit manner with the closed flap (101) at the bottom end of the left baffle (131). The other side end of the bottom cover (11) is vertically bent upward to form a connecting plate (112), and the connecting plate (112) is fixedly connected to the lower outer wall of the right baffle (133) by screws.

2. A fanless modular small compact industrial computer according to claim 1, characterized in that: In the process of performing black anodizing treatment on the surface of the heat dissipation profile (2) and the outer shell (1), the anodic electrolyte comprises a mixture of oxalic acid and formic acid, the oxalic acid concentration is 35-45 g / L, the formic acid concentration is 0.48 g / L, and the anodizing process conditions are: temperature 29±2°C, voltage 42±2V, current density 2-2.3A / dm 2 .

3. A fanless modular small compact industrial computer according to claim 1, characterized in that: The top of one of the rib plates (23) is horizontally bent inward to form a sealing plate (231). The sealing plate (231) is located above the outermost fin (22) on the heat dissipation base (21), and there is a gap between the sealing plate (231) and the fin (22).

4. A fanless modular small compact industrial computer according to claim 1, characterized in that: The periphery of the lower part of the heat dissipation base (21) is shrunk inward in a stepped - shaped connecting portion (212). The tops of the IO rear baffle (12) and the front cover plate (13) are respectively in close contact with the stepped - shaped connecting portion (212) and are fixedly connected by screws.

5. The fanless modular small compact industrial computer according to claim 1, characterized in that: A first plug-in board (1311) is provided extending outward from the middle of the closed folding plate (101) at the bottom end of the left baffle (131), and two second plug-in boards (111) are provided extending outward from both sides of one end of the bottom cover (11) in a left-right symmetrical manner. The first plug-in board (1311) is not coplanar with the closed folding plate (101), and the second plug-in board (111) is also not coplanar with the bottom cover (11). When the bottom end surface of the second plug-in board (111) is in contact with the top surface of the closed folding plate (101), the bottom end surface of the first plug-in board (1311) is also in contact with the top surface of the bottom cover (11).

6. A fanless modular small compact industrial computer according to claim 5, characterized in that: The middle parts of the closed folding plate (101) on the bottom end of the intermediate baffle (132) and the closed folding plate (101) on the bottom end of the 10 rear baffle (12) are both extended outward to provide connecting ribs (103), the connecting ribs (103) are not coplanar with the closed folding plate (101), and the bottom end surface of the connecting ribs (103) is in contact with the top surface of the bottom cover (11) and is fixedly connected by screws.

7. The fanless modular small compact industrial computer according to claim 1, characterized in that: The side ends of the left baffle plate (131) and the side ends of the right baffle plate (133) are both extended outward to be provided with non-coplanar mating plates (102), and the two side ends of the IO rear baffle plate (12) are respectively in contact with the mating plates (102) and are installed and connected by screws, and the outer surface of the IO rear baffle plate (12) is respectively flush with the outer surface of the left baffle plate (131) and the outer surface of the right baffle plate (133).

8. The fanless modular small compact industrial computer according to claim 1, characterized in that: The bottom end of the right baffle (133) is provided with an inner plate (1331) which is not coplanar with the right baffle; the inner wall of the connecting plate (112) on the bottom cover (11) is in contact with the outer wall of the inner plate (1331) and is connected by screws; the outer surface of the connecting plate (112) is flush with the outer surface of the right baffle (133).

9. The fanless modular small compact industrial computer according to claim 1, characterized in that: Two wall-mounted plates (102) are symmetrically arranged on both sides of the bottom end surface of the bottom cover (11), and a plurality of reserved ports (104) are correspondingly opened on the surface of the right baffle (133).

10. A surface treatment method for a fanless modular small compact industrial computer according to any one of claims 1 to 9, characterized in that: The outer shell (1) and the heat dissipation profile (2) are both made of magnesium-aluminum alloy, and the surfaces of the heat dissipation profile (2) and the outer shell (1) are both subjected to a black anodizing process. The specific steps are as follows: a) Wash and then dry with cold air; b) Soak and pickle, then blow dry with cold air; c) Anodizing treatment: first prepare the anolyte, select oxalic acid with a concentration of 35-45 g / L, add formic acid with a concentration of 0.48 g / L to the oxalic acid, and the anodizing process conditions are: temperature control at 29±2°C, voltage control at 42±2V, current density control at 2-2.3A / dm 2 ; By applying a DC power supply, an electrolytic reaction is carried out in an anodizing treatment tank to form an oxide film on the surface, and the electrolysis time is controlled to be 60 to 90 minutes; d) Coloring: the workpiece after anodizing is placed in a dye solution so that the pores in the oxide film on the surface of the workpiece are filled with black metal ions; e) Sealing: put the colored material into the sealing liquid to seal the micropores in the anodized layer, wash it with clean water, and then blow it dry with cold air.

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