Composite structure low-resistance high-transmittance conductive film and preparation device thereof

Abstract

The invention discloses a composite structure low-resistance high-transmittance conducting film and a preparation device thereof, and belongs to the technical field of conducting films, the conducting film comprises a hardened layer, a conducting layer and a base material layer which are sequentially arranged from top to bottom, every two adjacent layers are tightly connected, a supporting layer is further arranged on the upper side of the hardened layer, and the supporting layer and the hardened layer are connected through hot pressing. A plurality of air holes are formed in the supporting layer; the preparation device comprises an upper heating assembly, a lower heating assembly and a pressure system for driving the upper heating assembly and the lower heating assembly to generate relative displacement, a lower groove used for installing the conductive film is formed in the upper surface of the lower heating assembly, and a supporting layer of the conductive film faces the side where the upper heating assembly is located. An upper groove corresponding to the conductive film is formed in the lower surface of the upper heating assembly, and a gas collecting groove is formed in the bottom of the upper groove. According to the device, corrosive gas can be released in the laminating process, corrosion to the mold is avoided, the service life of the mold is prolonged, and the quality of a laminated product is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of conductive films, and in particular relates to a composite structure low-resistance and high-transmittance conductive film and a preparation device thereof. Background Art

[0002] Transparent conductive films are generally divided into three layers, the outermost is a protective hardening layer, the middle is a supporting substrate layer, and the innermost is a conductive layer. Some conductive films use a lamination process to press the three layers of materials together under high temperature and high pressure to form a whole. This method can ensure close contact and good bonding performance between the three-layer structure. In the existing conductive film remanufacturing process, due to the poor chemical compatibility between the mold material and the laminated material, chemical reactions may occur during the lamination process, leading to problems such as mold surface corrosion and material performance degradation. For example, some plastic materials may release corrosive gases at high temperatures. Due to the overflow of corrosive gases, the composite use of traditional ITO films and other film materials is prone to problems such as interlayer peeling on the film surface, which causes corrosion to the mold surface and affects the service life of the mold and the quality of the laminated products. Summary of the invention

[0003] In view of this, the purpose of the present invention is to provide a composite structure low-resistance and high-transmittance conductive film and a preparation device thereof, which can release corrosive gases during the lamination process to avoid corrosion to the mold, increase the service life of the mold and the quality of the laminated product.

[0004] In order to achieve the above object, the present invention provides the following technical solutions:

[0005] The present invention discloses a composite structure low-resistance and high-transmittance conductive film, which includes a hardening layer, a conductive layer and a substrate layer arranged in sequence from top to bottom, and the two adjacent layers are tightly connected. A supporting layer is also arranged on the upper side of the hardening layer, and the supporting layer and the hardening layer are connected by hot pressing. The supporting layer is provided with a plurality of air holes.

[0006] A preparation device for a composite structure low-resistance and high-transmittance conductive film, the conductive film adopts the conductive film as described above, the preparation device includes an upper heating component, a lower heating component, and a pressure system that drives relative displacement between the upper heating component and the lower heating component, the upper surface of the lower heating component forms a lower groove for installing the conductive film, the support layer of the conductive film faces the side where the upper heating component is located, the lower surface of the upper heating component forms an upper groove corresponding to the conductive film, the bottom of the upper groove is provided with a gas collecting groove, and the end of the gas collecting groove forms a step for limiting the support layer; the inner side of the upper heating component is also formed with a gas collecting cavity, a gas collecting channel and an exhaust channel, the gas collecting channel and the exhaust channel are respectively located on the lower and upper sides of the gas collecting cavity, the gas collecting groove is connected with the gas collecting cavity through the gas collecting channel, and the gas collecting cavity is connected with the outside through the exhaust channel.

[0007] Furthermore, the upper heating assembly includes an upper heating block and a core block detachably connected to the upper heating block, a groove corresponding to the core block is formed on the lower side of the upper heating block, and the air collecting cavity is formed between the upper surface of the core block and the groove surface of the groove.

[0008] Furthermore, a pressing block is fixedly mounted on the upper surface of the upper heating block, a screw is fixed on the upper side of the core block, the screw passes through the upper heating block and the pressing block and is connected with a nut, and the nut is rotatably mounted on the inner side of the pressing block.

[0009] Furthermore, an open slot for installing a nut is provided on the pressing block, a rotating handle is fixedly connected to the upper side of the nut, and the rotating handle extends out of the open slot.

[0010] Furthermore, an upper hard block is installed at the bottom of the groove, a ball is rotatably installed in the upper hard block, a lower hard block is installed on the upper side of the core block, and the ball is installed between the upper hard block and the lower hard block.

[0011] Furthermore, a main air intake channel and a branch air intake channel are formed on the inner side of the lower heating component. One end of the main air intake channel is connected to the outside, and the other end extends to the inner side of the lower heating component. One end of the branch air intake channel is connected to the main air intake channel, and the other end is connected to the lower groove. A one-way valve is installed on the inner side of the branch air intake channel.

[0012] Furthermore, a guide column is installed on the lower heating component, a guide hole corresponding to the guide column is opened on the upper heating component, a limiting groove is opened on the outer side of the upper end of the guide column, a blockage is installed on the inner side of the upper heating component, and a limiting bead is installed on the blockage through a spring. The limiting bead is slidably arranged in a transverse channel opened on the inner side of the upper heating component, and the limiting bead corresponds to the limiting groove.

[0013] The beneficial effects of the present invention are:

[0014] In a composite structure low-resistance and high-transmittance conductive film disclosed by the present invention, a support layer is provided with air holes on the support layer. When the conductive film is being laminated, it can adapt to temperature changes and the like to ensure the overall structural integrity of the dimming film. At the same time, with the support of the support layer, the conductive film is prevented from being too closely fitted to the mold during lamination. Therefore, corrosive gases can be released during the lamination process to avoid corrosion to the mold, thereby increasing the service life of the mold and the quality of the laminated product.

[0015] In the preparation device disclosed in the present invention, by providing a gas collecting cavity, a gas collecting channel and an exhaust channel, the gas can be released in time, and the corrosion of the mold caused by the residual gas can be avoided as much as possible, and the influence of the residual gas pressure on the surface of the conductive film can also be avoided. Under the support of the support layer, the conductive film surface can be formed, so the flatness of the conductive film can be guaranteed, thereby ensuring the quality of the laminated product.

[0016] Other advantages, objectives and features of the present invention will be described in the following description and will be apparent to those skilled in the art to some extent, or those skilled in the art may be taught from the practice of the present invention. The objectives and other advantages of the present invention may be realized and obtained through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to make the purpose, technical solution and beneficial effects of the present invention clearer, the present invention provides the following drawings for illustration:

[0018] Figure 1 It is a structural schematic diagram of the preparation device of the present invention;

[0019] Figure 2 A top view of the preparation device of the present invention;

[0020] Figure 3 for Figure 1 The enlarged view of point A in the middle;

[0021] Figure 4 for Figure 1 Enlarged view of point B in the middle.

[0022] The markings in the accompanying drawings are as follows: hardening layer 1, conductive layer 2, substrate layer 3, supporting layer 4, upper heating component 5, lower heating component 6, lower groove 7, upper groove 8, gas collecting groove 9, step 10, gas collecting cavity 11, gas collecting channel 12, exhaust channel 13, upper heating block 14, core block 15, groove 16, pressing block 17, screw 18, nut 19, opening groove 20, rotating handle 21, upper hard block 22, ball 23, lower hard block 24, main air intake channel 25, branch air intake channel 26, one-way valve 27, guide column 28, guide hole 29, limit groove 30, plug 31, spring 32, limit bead 33. DETAILED DESCRIPTION

[0023] like Figures 1 to 4 As shown, a composite structure low-resistance and high-transmittance conductive film disclosed in the present invention includes a hardened layer 1, a conductive layer 2 and a substrate layer 3 arranged in sequence from top to bottom. Some substrate materials may also generate corrosive gases during the lamination process. Some polymer substrates may generate small molecule gases due to thermal decomposition during high-temperature lamination. The two adjacent layers are tightly connected, and a support layer 4 is also provided on the upper side of the hardened layer 1. The hardened layer 1 can be made of conventional PET material. The support layer 4 is connected to the hardened layer 1 by hot pressing, and can be directly connected to the hardened layer 1. A number of air holes are provided on the support layer 4, which can be used for ventilation. In an embodiment of the present invention, the area of ​​the support layer 4 is larger than that of the hardened layer 1, and can withstand a larger hot pressing area, which is also more conducive to the air permeability effect during hot pressing. The hardened layer 1 can also be used to protect the conductive layer 2 during hot pressing to ensure the integrity of the conductive layer 2.

[0024] A preparation device for a composite structure low-resistance and high-transmittance conductive film, the conductive film adopts the conductive film as described above, and the preparation device includes an upper heating component 5, a lower heating component 6, and a pressure system that drives the upper heating component 5 and the lower heating component 6 to have relative displacement. The pressure system can adopt a hydraulic cylinder, the output end of which is connected to the upper heating component 5 and can drive the upper heating component 5 to move vertically to control the distance between the upper heating component 5 and the lower heating component 6 to achieve hot pressing. The upper heating component 5 and the lower heating component 6 are heated as needed during lamination, which helps the surface molecules of the two adjacent layers of materials to diffuse and fuse with each other under the action of heat and pressure, thereby improving the interlayer bonding strength.

[0025] A lower groove 7 for installing a conductive film is formed on the upper surface of the lower heating component 6. The specifications of the lower groove 7 are adapted to the specifications of the conductive film. The support layer 4 of the conductive film faces the side where the upper heating component 5 is located. An upper groove 8 corresponding to the conductive film is formed on the lower surface of the upper heating component 5. A gas collecting groove 9 is provided at the bottom of the upper groove 8. A step 10 for limiting the support layer 4 is formed at the end of the gas collecting groove 9. When the step 10 cooperates with the support layer 4, the gas collecting groove 9 can absorb the gas released from the surface of the support layer 4.

[0026] The inner side of the upper heating assembly 5 is also formed with a gas collecting cavity 11, a gas collecting channel 12 and an exhaust channel 13. The gas collecting channel 12 and the exhaust channel 13 are respectively located at the lower and upper sides of the gas collecting cavity 11. The gas collecting groove 9 is connected to the gas collecting cavity 11 through the gas collecting channel 12, and the gas collecting cavity 11 is connected to the outside through the exhaust channel 13. The gas coming out of the gas collecting groove 9 enters the gas collecting cavity 11 through the gas collecting channel 12, and then is released through the exhaust channel 13, so as to avoid corrosion to the mold caused by residual gas as much as possible, and also avoid the influence of residual air pressure on the surface of the conductive film. Under the support of the support layer 4, it can be used for the surface molding of the conductive film, so that the flatness of the conductive film can be guaranteed, thereby ensuring the quality of the laminated product.

[0027] In this embodiment, the upper heating assembly 5 includes an upper heating block 14, a core block 15 detachably connected to the upper heating block 14, a groove 16 corresponding to the core block 15 is formed on the lower side of the upper heating block 14, and a gas collecting cavity 11 is formed between the upper surface of the core block 15 and the groove surface of the groove 16. In the device disclosed in the present invention, the gas collecting cavity 11 is an overall bowl-shaped structure with an opening facing downward, which is conducive to the upward flow of gas and reduces the residual gas in the cavity. The overall thickness of the gas collecting cavity 11 is basically consistent, avoiding the influence of unstable air pressure on the conductive film structure, and can further improve the quality of the conductive film.

[0028] The present invention provides a detachable core block 15, so that the core block 15 can be removed in time for maintenance to remove impurities in the cavity, thereby avoiding blockage 31. In addition, the surface of the core block 15 can be trimmed in time to ensure that the spatial structure of the gas collecting cavity 11 is not affected, and the gas collecting cavity 11 can be easily molded to reduce the process difficulty.

[0029] In this embodiment, a pressing block 17 is fixedly mounted on the upper surface of the upper heating block 14, and a screw 18 is fixed on the upper side of the core block 15. The screw 18 passes through the upper heating block 14 and the pressing block 17 and is connected to a nut 19, which is rotatably mounted on the inner side of the pressing block 17. By providing a rotatable nut 19, when the nut 19 is rotated, the gap between the core block 15 and the upper heating block 14 can be adjusted, thereby fine-tuning the compression position of the support layer 4. Since the conductive film may have a certain rebound, after the core block 15 is moved, the thickness of the conductive film is ensured while ensuring that the gas can be completely released.

[0030] In this embodiment, an open slot 20 for installing a nut 19 is formed on the pressing block 17 , and a rotating handle 21 is fixedly connected to the upper side of the nut 19 . The rotating handle 21 extends from the open slot 20 to facilitate the operation of rotating the nut 19 .

[0031] In this embodiment, an upper hard block 22 is installed at the bottom of the groove 16, and a ball 23 is rotatably installed in the upper hard block 22. A lower hard block 24 is installed on the upper side of the core block 15, and the ball 23 is installed between the upper hard block 22 and the lower hard block 24. By setting the ball 23, the extreme position of the core block 15 can be limited, which can facilitate operation.

[0032] In this embodiment, a main air inlet channel 25 and a branch air inlet channel 26 are formed on the inner side of the lower heating assembly 6. One end of the main air inlet channel 25 is connected to the outside, and the other end extends to the inner side of the lower heating assembly 6. One end of the branch air inlet channel 26 is connected to the main air inlet channel 25, and the other end is connected to the lower groove 7. A one-way valve 27 is installed on the inner side of the branch air inlet channel 26. By providing the main air inlet channel 25 and the branch air inlet channel 26, pressure can be provided for the lower end of the conductive film after lamination, which facilitates demolding.

[0033] In this embodiment, a guide post 28 is installed on the lower heating assembly 6, a guide hole 29 corresponding to the guide post 28 is provided on the upper heating assembly 5, a limiting groove 30 is provided on the outer side of the upper end of the guide post 28, a plug 31 is installed on the inner side of the upper heating assembly 5, a limiting bead 33 is installed on the plug 31 through a spring 32, and the limiting bead 33 is slidably arranged in a transverse channel provided on the inner side of the upper heating assembly 5, and the limiting bead 33 corresponds to the limiting groove 30. By limiting the guide post 28, after the position between the upper heating assembly 5 and the lower heating assembly 6 is determined, the two can be limited to ensure stability during the lamination process.

[0034] Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made in form and details without departing from the scope defined by the claims of the present invention.

Claims

1. A composite structure low-resistance and high-transmittance conductive film, characterized in that: It includes a hardening layer, a conductive layer and a substrate layer arranged in sequence from top to bottom, and the adjacent layers are tightly connected. A support layer is also arranged on the upper side of the hardening layer. The support layer and the hardening layer are connected by hot pressing, and a plurality of air holes are opened on the support layer.

2. A device for preparing a composite structure low-resistance and high-transmittance conductive film, characterized in that: The conductive film adopts the conductive film as claimed in claim 1, and the preparation device includes an upper heating component, a lower heating component, and a pressure system for driving relative displacement between the upper heating component and the lower heating component. The upper surface of the lower heating component forms a lower groove for installing the conductive film, and the supporting layer of the conductive film faces the side where the upper heating component is located. The lower surface of the upper heating component forms an upper groove corresponding to the conductive film, and the bottom of the upper groove is provided with a gas collecting groove, and the end of the gas collecting groove forms a step for limiting the supporting layer; the inner side of the upper heating component is also formed with a gas collecting cavity, a gas collecting channel and an exhaust channel, and the gas collecting channel and the exhaust channel are respectively located on the lower and upper sides of the gas collecting cavity, and the gas collecting groove is connected with the gas collecting cavity through the gas collecting channel, and the gas collecting cavity is connected with the outside through the exhaust channel.

3. The device for preparing a composite structure low-resistance and high-transmittance conductive film according to claim 2, characterized in that: The upper heating assembly includes an upper heating block and a core block detachably connected to the upper heating block. A groove corresponding to the core block is formed on the lower side of the upper heating block. The upper surface of the core block and the groove surface of the groove are separated to form the air collecting cavity.

4. The device for preparing a composite structure low-resistance and high-transmittance conductive film according to claim 3, characterized in that: A pressing block is also fixedly mounted on the upper surface of the upper heating block, a screw is fixed on the upper side of the core block, the screw passes through the upper heating block and the pressing block and is connected with a nut, and the nut is rotatably mounted on the inner side of the pressing block.

5. The device for preparing a composite structure low-resistance and high-transmittance conductive film according to claim 4, characterized in that: The pressing block is provided with an open slot for installing a nut, and a rotating handle is fixedly connected to the upper side of the nut, and the rotating handle extends out of the open slot.

6. The device for preparing a composite structure low-resistance and high-transmittance conductive film according to claim 2, characterized in that: An upper hard block is installed at the bottom of the groove, a ball is rotatably installed in the upper hard block, a lower hard block is installed on the upper side of the core block, and the ball is installed between the upper hard block and the lower hard block.

7. The device for preparing a composite structure low-resistance and high-transmittance conductive film according to claim 2, characterized in that: A main air intake channel and a branch air intake channel are formed on the inner side of the lower heating component. One end of the main air intake channel is connected to the outside, and the other end extends to the inner side of the lower heating component. One end of the branch air intake channel is connected to the main air intake channel, and the other end is connected to the lower groove. A one-way valve is installed on the inner side of the branch air intake channel.

8. A device for preparing a composite structure low-resistance and high-transmittance conductive film according to any one of claims 2 to 7, characterized in that: A guide column is installed on the lower heating component, and a guide hole corresponding to the guide column is opened on the upper heating component. A limiting groove is opened on the outer side of the upper end of the guide column. A blockage is installed on the inner side of the upper heating component. The blockage is installed with a limiting bead through a spring. The limiting bead is slidably arranged in a transverse channel opened on the inner side of the upper heating component, and the limiting bead corresponds to the limiting groove.

Images