Composite structure low-resistance high-transparency conductive film and preparation device thereof

Abstract

The application discloses a kind of composite structure low-resistance high-transparency conductive film and its preparation device, belong to conductive film technical field, and conductive film includes from top to bottom sequentially arranged hardening layer, conductive layer and substrate layer, and the upper side of hardening layer is also provided with support layer, and support layer is connected with hardening layer by heat pressing, and a plurality of air holes are formed in support layer;Preparation device includes upper heating assembly, lower heating assembly, pressure system for driving the relative displacement between upper heating assembly and lower heating assembly, and the upper surface of lower heating assembly forms lower groove for installing conductive film, and the support layer of conductive film is towards the side where upper heating assembly is located, and the lower surface of upper heating assembly forms upper groove corresponding to conductive film, and the bottom of upper groove is provided with gas collection groove.The device can release corrosive gas during lamination process, avoid corrosion to mold, increase the service life of mold and the quality of laminated product.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of conductive films, and particularly relates to a composite structure low-resistance high-transparency conductive film and a preparation device thereof. BACKGROUND

[0002] The transparent conductive film is generally divided into three layers, the outermost layer is a hardening layer for protection, the middle layer is a substrate layer for support, and the innermost layer is a conductive layer for conduction. Some conductive films adopt a laminating process to press the three layers together at high temperature and high pressure, so that the three layers form an integral whole. This method can ensure the close contact and good bonding performance between the three layers. In the existing conductive film remanufacturing process, due to the poor chemical compatibility between the mold material and the laminated material, chemical reactions may occur during the laminating process, resulting in problems such as corrosion of the mold surface, degradation of material performance, etc. For example, some plastic materials may release corrosive gases at high temperatures, and due to the overflow of corrosive gases, the composite use of traditional ITO films and other thin film materials is prone to cause problems such as interlayer peeling on the surface of the thin film, corrosion of the mold surface, and influence the service life of the mold and the quality of the laminated product. SUMMARY

[0003] Therefore, the purpose of the present application is to provide a composite structure low-resistance high-transparency conductive film and a preparation device thereof, which can release corrosive gases during the laminating process, avoid corrosion of the mold, increase the service life of the mold and the quality of the laminated product.

[0004] To achieve the above-mentioned purpose, the present application provides the following technical scheme:

[0005] The composite structure low-resistance high-transparency conductive film disclosed by the present application comprises, from top to bottom, a hardening layer, a conductive layer and a substrate layer, the adjacent two layers are tightly connected, the upper side of the hardening layer is further provided with a support layer, the support layer and the hardening layer are connected through heat pressing, and a plurality of air holes are formed in the support layer.

[0006] The preparation device of the composite structure low-resistance high-transparency conductive film adopts the conductive film as described above, and comprises an upper heating assembly, a lower heating assembly, a pressure system for driving the relative displacement between the upper heating assembly and the lower heating assembly, and a lower groove formed on the upper surface of the lower heating assembly for mounting the conductive film, wherein the support layer of the conductive film is located on the side of the upper heating assembly, and an upper groove corresponding to the conductive film is formed on the lower surface of the upper heating assembly, and a gas collection groove is formed at the bottom of the upper groove, and a step for limiting the support layer is formed at the end of the gas collection groove; a gas collection cavity, a gas collection channel and an exhaust channel are further formed on the inner side of the upper heating assembly, and the gas collection channel and the exhaust channel are respectively located on the lower and upper sides of the gas collection cavity, the gas collection groove is communicated with the gas collection cavity through the gas collection channel, and the gas collection cavity is communicated with the outside through the exhaust channel.

[0007] Further, the upper heating assembly comprises an upper heating block and a core block detachably connected with the upper heating block, a type groove corresponding to the core block is formed on the lower side of the upper heating block, and the upper surface of the core block is separated from the groove surface of the type groove to form the gas collection cavity.

[0008] Further, a pressing block is further fixedly mounted on the upper surface of the upper heating block, and a screw rod is fixedly connected to the upper side of the core block, the screw rod passes through the upper heating block and the pressing block and is connected with a nut, and the nut is rotatably mounted on the inner side of the pressing block.

[0009] Further, an opening groove for mounting the nut is formed on the pressing block, a rotating handle is fixedly connected to the upper side of the nut, and the rotating handle extends out of the opening groove.

[0010] Further, an upper hard block is mounted at the bottom of the type groove, a ball is rotatably mounted in the upper hard block, a lower hard block is mounted on the upper side of the core block, and the ball is mounted between the upper hard block and the lower hard block.

[0011] Further, a main air inlet channel and a branch air inlet channel are formed on the inner side of the lower heating assembly, one end of the main air inlet channel is connected to the outside, the other end extends to the inner side of the lower heating assembly, one end of the branch air inlet channel is communicated with the main air inlet channel, the other end is communicated with the lower groove, and a one-way valve is mounted on the inner side of the branch air inlet channel.

[0012] Further, a guide column is mounted on the lower heating assembly, a guide hole corresponding to the guide column is formed on the upper heating assembly, a limiting groove is formed on the outer side of the upper end of the guide column, a plug is mounted on the inner side of the upper heating assembly, a limiting ball is mounted on the plug through a spring, the limiting ball is slidably arranged in a horizontal channel formed on the inner side of the upper heating assembly, and the limiting ball corresponds to the limiting groove.

[0013] The beneficial effects of the present application are as follows:

[0014] The low-resistance high-transparency conductive film with the composite structure has the support layer, and the air holes are formed in the support layer, so that the overall structural integrity of the light-adjusting film can be ensured when the conductive film is laminated, and the conductive film is prevented from being too closely combined with the mold during lamination, so that the corrosive gas can be released during the lamination process, the mold is prevented from being corroded, and the service life of the mold and the quality of the laminated product are increased.

[0015] The preparation device has the gas collecting cavity, the gas collecting channel and the exhaust channel, so that the gas can be released in time, the corrosion of the mold caused by the residual gas is avoided, and the influence of the residual gas pressure on the surface of the conductive film is also avoided. Under the support of the support layer, the surface of the conductive film can be formed, so that the flatness of the conductive film is ensured, and the quality of the laminated product is ensured.

[0016] Other advantages, objects, and features of the present application will be apparent to those skilled in the art from the following specification, and it is intended to cover any alternatives, modifications, or equivalents included within the scope of the present application. The objectives and other advantages of the present application can be realized and attained by the structure particularly pointed out in the specification. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to make the purposes, technical solutions and beneficial effects of the present application clearer, the present application provides the following drawings for illustration:

[0018] Figure 1 The figure is a structural schematic view of the preparation device of the present application;

[0019] Figure 2 The figure is a top view of the preparation device of the present application;

[0020] Figure 3 The figure is Figure 1 The figure is an enlarged view of A in the figure;

[0021] Figure 4 The figure is Figure 1 The figure is an enlarged view of B in the figure.

[0022] In the drawings, the following marks are used: hardened layer 1, conductive layer 2, base material layer 3, support layer 4, upper heating assembly 5, lower heating assembly 6, lower groove 7, upper groove 8, gas collecting groove 9, step 10, gas collecting cavity 11, gas collecting channel 12, exhaust channel 13, upper heating block 14, core block 15, mold groove 16, pressing block 17, screw rod 18, nut 19, open groove 20, rotating handle 21, upper hard block 22, ball 23, lower hard block 24, main air inlet channel 25, branch air inlet channel 26, one-way valve 27, guide column 28, guide hole 29, limiting groove 30, plug 31, spring 32, limiting ball 33. Detailed Implementation

[0023] like Figures 1 to 4 As shown, this invention discloses a composite low-resistance, high-permeability conductive film, comprising a hardened layer 1, a conductive layer 2, and a substrate layer 3 arranged sequentially from top to bottom. Some substrate materials may generate corrosive gases during lamination. Some polymer substrates may generate small-molecule gases due to thermal decomposition during high-temperature lamination. Adjacent layers are tightly connected. A support layer 4 is also provided on the upper side of the hardened layer 1. The hardened layer 1 can be made of conventional PET material. The support layer 4 is connected to the hardened layer 1 via hot pressing and can be directly connected to the hardened layer 1. The support layer 4 has several vent holes for ventilation. In this embodiment, the area of ​​the support layer 4 is larger than that of the hardened layer 1, allowing it to withstand a larger hot-pressing area and improving ventilation during hot pressing. The hardened layer 1 also protects the conductive layer 2 during hot pressing, ensuring its integrity.

[0024] An apparatus for preparing a composite low-resistance, high-permeability conductive film is disclosed. The conductive film is as described above. The apparatus includes an upper heating component 5, a lower heating component 6, and a pressure system that drives relative displacement between the upper and lower heating components 5 and 6. The pressure system can be a hydraulic cylinder, with its output end connected to the upper heating component 5 and capable of driving the upper heating component 5 to move vertically, thereby controlling the distance between the upper and lower heating components 5 and 6 to achieve hot pressing. The upper and lower heating components 5 and 6 are heated as needed during lamination, which helps the surface molecules of adjacent layers diffuse and fuse under the action of heat and pressure, improving the interlayer bonding strength.

[0025] The upper surface of the lower heating component 6 forms a lower groove 7 for mounting the conductive film. The specifications of the lower groove 7 are adapted to the specifications of the conductive film. The support layer 4 of the conductive film faces the side where the upper heating component 5 is located. The lower surface of the upper heating component 5 forms an upper groove 8 corresponding to the conductive film. A gas collecting groove 9 is provided at the bottom of the upper groove 8. A step 10 for limiting the support layer 4 is formed at the end of the gas collecting groove 9. When the step 10 is engaged with the support layer 4, the gas collecting groove 9 can absorb the gas released from the surface of the support layer 4.

[0026] The inner side of the upper heating component 5 also forms a gas collecting chamber 11, a gas collecting channel 12, and an exhaust channel 13. The gas collecting channel 12 and the exhaust channel 13 are located on the lower and upper sides of the gas collecting chamber 11, respectively. The gas collecting groove 9 is connected to the gas collecting chamber 11 through the gas collecting channel 12, and the gas collecting chamber 11 is connected to the outside through the exhaust channel 13. The gas coming out of the gas collecting groove 9 enters the gas collecting chamber 11 through the gas collecting channel 12, and then is released through the exhaust channel 13, minimizing the corrosion of the mold caused by residual gas and preventing residual gas pressure from affecting the surface of the conductive film. Under the support of the support layer 4, it can be used for the surface molding of the conductive film, thus ensuring the flatness of the conductive film and guaranteeing the quality of the laminated product.

[0027] In this embodiment, the upper heating assembly 5 includes an upper heating block 14 and a core block 15 detachably connected to the upper heating block 14. A groove 16 corresponding to the core block 15 is formed on the lower side of the upper heating block 14. A gas collecting cavity 11 is formed between the upper surface of the core block 15 and the groove surface of the groove 16. In the device disclosed in this invention, the gas collecting cavity 11 has an overall bowl-shaped structure with the opening facing downwards, which facilitates the upward flow of gas and reduces the residual gas in the cavity. The overall thickness of the gas collecting cavity 11 is basically uniform, avoiding the influence of unstable gas pressure on the conductive film structure, and can further improve the quality of the conductive film.

[0028] This invention, by providing a detachable core block 15, allows for timely removal of the core block 15 for maintenance, removal of impurities from the cavity, and thus prevention of blockage 31. Furthermore, the surface of the core block 15 can be promptly trimmed, ensuring that the spatial structure of the gas collecting cavity 11 remains unaffected, facilitating the molding of the gas collecting cavity 11, and reducing process complexity.

[0029] In this embodiment, a pressure block 17 is also fixedly installed on the upper surface of the upper heating block 14, and a screw 18 is fixed on the upper side of the core block 15. The screw 18 passes through the upper heating block 14 and the pressure block 17 and is connected to a nut 19. The nut 19 is rotatably installed inside the pressure block 17. By setting a rotatable nut 19, the gap between the core block 15 and the upper heating block 14 can be adjusted when the nut 19 is rotated, thereby fine-tuning the compression position of the support layer 4. Since the conductive film may have a certain degree of rebound, after the core block 15 is moved, the gas can be completely released while ensuring the thickness of the conductive film.

[0030] In this embodiment, the pressure block 17 has an opening slot 20 for installing the nut 19. A rotating handle 21 is fixedly connected to the upper side of the nut 19. The rotating handle 21 extends out from the opening slot 20 to facilitate the rotation of the nut 19.

[0031] In the embodiment, the bottom of the mold groove 16 is provided with an upper hard block 22, the upper hard block 22 is rotatably provided with a ball 23, the upper side of the mold block 15 is provided with a lower hard block 24, the ball 23 is installed between the upper hard block 22 and the lower hard block 24, the limit position of the mold block 15 can be limited by the ball 23, and the operation is facilitated.

[0032] In the embodiment, the inner side of the lower heating assembly 6 is formed with a main air inlet channel 25 and a branch air inlet channel 26, one end of the main air inlet channel 25 is connected to the outside, the other end extends to the inner side of the lower heating assembly 6, one end of the branch air inlet channel 26 communicates with the main air inlet channel 25, the other end communicates with the lower groove 7, and the inner side of the branch air inlet channel 26 is provided with a one-way valve 27. By setting the main air inlet channel 25 and the branch air inlet channel 26, the lower end of the conductive film can be provided with pressure after the lamination is completed, and the demolding is facilitated.

[0033] In the embodiment, the lower heating assembly 6 is provided with a guide column 28, the upper heating assembly 5 is provided with a guide hole 29 corresponding to the guide column 28, the outer side of the upper end of the guide column 28 is provided with a limiting groove 30, the inner side of the upper heating assembly 5 is provided with a plug 31, the plug 31 is provided with a limiting ball 33 through a spring 32, the limiting ball 33 is slidably arranged in the transverse channel provided in the inner side of the upper heating assembly 5, and the limiting ball 33 corresponds to the limiting groove 30. By limiting the guide column 28, after the position between the upper heating assembly 5 and the lower heating assembly 6 is determined, the two can be limited to ensure the stability during the lamination process.

[0034] Finally, it should be pointed out that the above preferred embodiments are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made in form and details without departing from the scope defined by the claims of the present application.

Claims

1. An apparatus for preparing a composite structure low-resistance, high-permeability conductive film, characterized in that: The conductive film comprises, from top to bottom, a hardening layer, a conductive layer and a substrate layer, the adjacent two layers are tightly connected, the upper side of the hardening layer is further provided with a supporting layer, the supporting layer and the hardening layer are connected through hot pressing, and a plurality of air holes are formed in the supporting layer.

2. The preparation device of a composite structure low-resistance high-transparency conductive film according to claim 1, characterized in that: The upper heating assembly comprises an upper heating block, a core block detachably connected with the upper heating block, the lower side of the upper heating block forms a core groove corresponding to the core block, and the upper surface of the core block is separated from the groove surface of the core groove to form the air collecting cavity.

3. The device for preparing a low-resistance and high-transparency conductive film of a composite structure according to claim 2, characterized in that: The upper surface of the upper heating block is further fixedly provided with a pressing block, the upper side of the core block is fixedly provided with a screw rod, the screw rod penetrates through the upper heating block and the pressing block and is connected with a nut, and the nut is rotatably installed on the inner side of the pressing block.

4. The preparation device of a composite structure low-resistance high-transparency conductive film according to claim 3, characterized in that: An opening groove for installing the nut is formed in the pressing block, a rotating handle is fixedly connected to the upper side of the nut, and the rotating handle extends out of the opening groove.

5. The preparation device of a composite structure low-resistance high-transparency conductive film according to claim 2, characterized in that: An upper hard block is installed at the bottom of the core groove, a ball is rotatably installed in the upper hard block, a lower hard block is installed at the upper side of the core block, and the ball is installed between the upper hard block and the lower hard block.

6. The preparation device of a composite structure low-resistance high-transparency conductive film according to claim 1, characterized in that: The inner side of the lower heating assembly is formed with a main air inlet channel and a branch air inlet channel, one end of the main air inlet channel is connected to the outside, the other end extends to the inner side of the lower heating assembly, one end of the branch air inlet channel communicates with the main air inlet channel, the other end communicates with the lower groove, and a one-way valve is installed on the inner side of the branch air inlet channel.

7. The preparation device of a composite structure low resistance high transparent conductive film according to any one of claims 1-6, characterized in that: A guide column is installed on the lower heating assembly, a guide hole corresponding to the guide column is formed in the upper heating assembly, a limiting groove is formed on the outer side of the upper end of the guide column, a plug is installed on the inner side of the upper heating assembly, a limiting ball is installed in the plug through a spring, the limiting ball is slidably arranged in a transverse channel formed in the inner side of the upper heating assembly, and the limiting ball corresponds to the limiting groove.

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