A thin coupled inductor, a manufacturing method thereof and a power module

By designing a thin coupled inductor structure using nanocrystalline strips, the problem of difficult to meet the characteristics of high steady-state inductance, low dynamic inductance and high saturation current in the prior art is solved, and the high power density and excellent steady-state and dynamic performance of the power module are achieved.

CN119786208APending Publication Date: 2025-04-08SHANGHAI METAPWR ELECTRONICS CO LTD
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Patent Information

Application Number
CN202411392328.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-10-08
Filing Date
2024-10-08
Publication Date
2025-04-08

AI Technical Summary

Technical Problem

The prior art is difficult to meet the characteristics of high steady-state sensing, low dynamic sensing and high saturation current, especially in power modules with increasingly thin thickness requirements.

Method used

Using nanocrystal strips as magnetic material, a thin coupling inductor structure is designed. By stacking multiple thin layers of magnetic material and insulating layers, a thin layer composite structure is formed, thereby achieving a coupling inductor with high saturation current, high steady-state inductance and low dynamic inductance.

Benefits of technology

It improves the power density, steady-state performance and dynamic performance of the power module, and meets the demand for thin and efficient inductors of high-frequency power supply technology.

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Abstract

The present invention discloses a thin coupled inductor, comprising a first component, a first magnetic core and a second magnetic core; the first component comprises a first winding body, a second winding body and a third magnetic core combination; the first magnetic core and the second magnetic core have a thin layer composite structure. On the other hand, the present invention also discloses a method for manufacturing a thin coupled inductor, comprising arranging a third magnetic core combination and a winding body in a frame, pressing PP materials, and forming a stack. On the other hand, the present invention also discloses a power module, comprising a thin coupled inductor, a first switching element, a second switching element, an input capacitor and an output capacitor. The control signals of the first switching element and the second switching element are out of phase by 180°. The present invention proposes a thin coupled inductor structure based on nanocrystalline strips and a corresponding process method, thereby obtaining a thin, high saturation current, high steady-state inductance and low dynamic inductance coupled inductor, so as to improve the power density, steady-state performance and dynamic performance of the power module.
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Description

Technical Field

[0001] The present invention belongs to the technical field of high-frequency power supply, and in particular relates to a thin coupled inductor, a manufacturing method thereof and a power supply module. Background Art

[0002] In recent years, with the development of technology in the fields of data centers, artificial intelligence and supercomputers, more and more powerful ASICs have been applied, such as CPUs, GPUs, machine learning accelerator chips, network switch chips, etc. They consume a lot of current, for example, the required current can reach thousands of amperes; and their current has the characteristics of rapid jump. Traditionally, a voltage regulator module composed of a buck circuit (Buck) is used to supply this load. The voltage regulator module is also called VoltageRegulator Modules, referred to as VRM, that is, the power module involved in the present invention. At the same time, in order to meet the requirements of load peak current, conversion efficiency and rapid load jump, the VRM requires the inductor in the buck circuit to have the characteristics of high steady-state inductance and low dynamic inductance and high saturation current capability. However, although the saturation flux density of the currently commonly used magnetic powder core material is high, the equivalent relative permeability is indeed low (usually less than 60); and the ferrite material with high equivalent relative permeability has a low saturation flux density (usually less than 0.5T); neither can meet the characteristics of high steady-state inductance, low dynamic inductance and high saturation current. As the thickness of the voltage regulator module is required to be thinner and thinner, there is an urgent need for a thin inductor with high steady-state inductance, low dynamic inductance and high saturation current characteristics.

[0003] The present invention adopts nanocrystalline ribbon as magnetic material to realize the inductance in VRM. The nanocrystalline ribbon is a thin strip-shaped magnetic material with a thickness of less than 30um and a width of less than 100mm. The nanocrystalline ribbon combines the advantages of ferrite material and magnetic powder core material, has a higher equivalent relative magnetic permeability (greater than 300), a higher saturation magnetic flux density (up to 1.2T), and a lower core loss density. Therefore, the characteristics of the strip-shaped nanocrystalline magnetic material are very suitable for the inductance of the step-down circuit. When the inductance in the multi-phase step-down circuit is a coupled inductance, the performance of the nanocrystalline ribbon has a more obvious advantage. Summary of the invention

[0004] In view of this, one of the objects of the present invention is to provide a thin coupled inductor and a power supply module thereof, based on a coupled inductor structure of nanocrystalline strips, so as to obtain a thin, high saturation current, high steady-state inductance and low dynamic inductance coupled inductor, so as to improve the power density, steady-state performance and dynamic performance of the power supply module.

[0005] In one aspect, the present invention provides a thin coupled inductor, comprising a first component, a first magnetic core and a second magnetic core;

[0006] The first magnetic core, the first component and the second magnetic core are stacked; the first component is arranged between the first magnetic core and the second magnetic core;

[0007] The first component includes a first winding body, a second winding body and a third magnetic core combination, wherein the third magnetic core combination, the first winding body and the second winding body are arranged in the same layer; the first winding body and the second winding body are arranged in parallel, and at least a part of the third magnetic core combination is arranged outside the first winding body and the second winding body;

[0008] Both ends of the first winding body and both ends of the second winding body are provided with winding ends, and the winding ends are arranged along the stacking direction;

[0009] The first magnetic core and the second magnetic core have a thin layer composite structure; the thin layer composite structure includes a plurality of thin layers of magnetic material and an insulating layer arranged between the magnetic material sheets.

[0010] Preferably, the thin coupled inductor has a first surface, a second surface, a first side surface, a second side surface, a third side surface and a fourth side surface; the first surface is opposite to the second surface, the first side surface is opposite to the third side surface, and the second side surface is opposite to the fourth side surface;

[0011] The thin coupled inductor further includes a first copper layer, a second copper layer, an insulating layer, a power connector and a signal connector;

[0012] The first copper layer, the first magnetic core, the first component, the second magnetic core and the second copper layer are stacked in sequence from top to bottom; the insulating layers are respectively arranged between the first copper layer and the first magnetic core, between the first magnetic core and the first component, between the first component and the second magnetic core, and between the second magnetic core and the second copper layer;

[0013] The power connector is electrically connected to the first copper layer and the second copper layer, and is disposed adjacent to the second side surface and the fourth side surface; the signal connector is electrically connected to the first copper layer and the second copper layer, and is disposed adjacent to the first side surface and the third side surface.

[0014] Preferably, the winding end includes a first winding first end, a first winding second end, a second winding first end and a second winding second end; the first winding first end and the first winding second end are connected to the first winding body, and the second winding first end and the second winding second end are connected to the second winding body; the first winding first end and the second winding first end respectively extend from the corresponding winding body to the first copper layer and are electrically connected to the first copper layer; the first winding second end and the second winding second end respectively extend from the corresponding winding body to the second copper layer and are electrically connected to the second copper layer.

[0015] Preferably, the first magnetic core and the second magnetic core are respectively provided with slots, and the winding ends are arranged in the slots.

[0016] Preferably, the winding end is a plated metal part, or the winding end is a welded metal part, or the winding end and the corresponding winding body are integrally formed.

[0017] Preferably, the third magnetic core assembly is made of magnetic powder core material.

[0018] Preferably, the third magnetic core combination includes a third magnetic core, a fourth magnetic core and a fifth magnetic core;

[0019] The third magnetic core, the first winding body, the fifth magnetic core, the second winding body and the fourth magnetic core are arranged in sequence.

[0020] Preferably, there are air gaps with a total height of gap1 between the third magnetic core and the first magnetic core, and between the third magnetic core and the second magnetic core; there are also air gaps with a total height of gap1 between the fourth magnetic core and the first magnetic core, and between the fourth magnetic core and the second magnetic core; there are air gaps with a total height of gap2 between the fifth magnetic core and the first magnetic core, and between the fifth magnetic core and the second magnetic core.

[0021] Preferably, the height sum gap1 does not exceed the height sum gap2.

[0022] Preferably, the height sum gap1 is the height sum of the assembled air gaps.

[0023] Preferably, the first component also includes a first auxiliary winding body and a second auxiliary winding body; the first auxiliary winding body and the first winding body are arranged in parallel and coupled; the second auxiliary winding body and the second winding body are arranged in parallel and coupled; auxiliary winding ends are arranged at both ends of the first auxiliary winding body and both ends of the second auxiliary winding body, and the auxiliary winding ends are arranged along the stacking direction.

[0024] Preferably, the first magnetic core and the second magnetic core are respectively provided with slots; the winding ends are arranged in the slots; and the auxiliary winding ends are all arranged in the slots located in the second magnetic core.

[0025] Preferably, the first component further includes a PP material area and an outer frame; the first winding body, the second winding body and the third magnetic core combination are arranged in the outer frame, and the PP material area fills the gap between the third magnetic core combination and the winding body.

[0026] Preferably, the thin layer of magnetic material includes at least one of nanocrystalline magnetic material, amorphous ribbon magnetic material or magnetic metal film.

[0027] Preferably, the insulating layer is a PP layer; the first copper layer, the first magnetic core, the first component, the second magnetic core, the second copper layer and the insulating layer are pressed together to form a stack.

[0028] Preferably, the thin coupled inductor further comprises a plastic package; the plastic package covers the outer surface of the stacked body, the power connector and the signal electrical connector are arranged along the surface of the plastic package; the winding end is exposed on the surface of the plastic package.

[0029] Preferably, a through hole is formed on the stacked body and passes through from the first surface to the second surface, and the power electrical connector and the signal electrical connector are arranged in the through hole.

[0030] Preferably, the first winding body, the second winding body and the third magnetic core combination have the same thickness, the third magnetic core combination is a connected area, the third magnetic core combination is made of magnetic powder core material, the third magnetic core combination surrounds at least three sides of the first winding body, and the third magnetic core combination surrounds at least three sides of the second winding body; the first winding body, the second winding body and the third magnetic core combination are pressed together to form a first component.

[0031] Another aspect of the present invention provides a method for manufacturing a thin coupled inductor, comprising the following steps:

[0032] Layout: a frame is arranged on the tape, a third magnetic core combination, a first winding body and a second winding body are arranged in the frame, a gap is left between the third magnetic core combination and the first winding body, and a gap is left between the third magnetic core combination and the second winding body;

[0033] Lamination: Laminating the PP material in the frame and removing the tape to form a first assembly;

[0034] And, stacking: stacking a PP layer, a first magnetic core, another PP layer and a first copper layer in sequence in the top surface direction of the first component; stacking a PP layer, a second magnetic core, another PP layer and a second copper layer in sequence in the bottom surface direction of the first component, and forming a stacked body after pressing;

[0035] The first winding body and the second winding body are arranged in parallel; at least a part of the third magnetic core combination is arranged on the outside of the first winding body and the second winding body; winding ends are arranged at both ends of the first winding body and both ends of the second winding body, and the winding ends are arranged along the stacking direction.

[0036] Preferably, the winding end is arranged on the first component by welding, or the winding end and the corresponding winding body are integrally formed; the first magnetic core and the second magnetic core have a thin layer composite structure; the thin layer composite structure includes a plurality of thin layers of magnetic material and an insulating layer arranged between magnetic material sheets, and the thin layer of magnetic material is wrapped with at least one of nanocrystalline magnetic material, amorphous strip magnetic material or magnetic metal film.

[0037] Preferably, the preparation method further comprises the following steps:

[0038] Opening holes: a through hole and a half hole are opened on the stacked body, the half hole is arranged at a corresponding position of the winding end; the through hole is arranged at a position avoiding the winding body;

[0039] And, electroplating: electroplating the side walls of the half holes and the through holes to form winding ends and electrical connectors, wherein the electrical connectors include power electrical connectors and signal electrical connectors.

[0040] Preferably, the preparation method further comprises the following steps:

[0041] Plastic sealing: plastic sealing the surface of the stacked body to form a plastic sealed body;

[0042] And, arranging electrical connectors: arranging power electrical connectors and signal electrical connectors on the surface of the plastic package body;

[0043] The winding end is exposed on the surface of the plastic package body.

[0044] Preferably, during the layout, a first auxiliary winding body and a second auxiliary winding body are further arranged in the frame; the first auxiliary winding body and the first winding body are adjacent to each other, arranged in parallel and with a gap; the second auxiliary winding body and the second winding body are adjacent to each other, arranged in parallel and with a gap; auxiliary winding ends are arranged at both ends of the first auxiliary winding body and both ends of the second auxiliary winding body, and the winding ends are arranged toward the bottom surface.

[0045] Preferably, during layout, a plurality of third magnetic core combinations, a plurality of first winding bodies and a plurality of second winding bodies are arranged in the frame; after removing the tape, a plurality of first components are formed by panel cutting.

[0046] Preferably, the plurality of first winding bodies and the plurality of second winding bodies corresponding to different first components are a common whole when laid out.

[0047] On the other hand, the present invention also discloses a power supply module, including the aforementioned thin coupled inductor, the power supply module also including a first switch unit, a second switch unit, an input capacitor and an output capacitor; the first switch unit and the second switch unit are arranged on the top surface of the power supply module; the power supply module has an input positive terminal, an output positive terminal and a ground terminal, and the input positive terminal, the output positive terminal and the ground terminal are arranged on the bottom surface of the power supply module; the two winding ends corresponding to the first winding body are electrically connected to the first switch unit and the output positive terminal respectively, and the two winding ends corresponding to the second winding body are electrically connected to the second switch unit and the output positive terminal respectively; the control signals of the first switch unit and the second switch unit are staggered by 180°; the input capacitor is connected across the input positive terminal and the ground terminal, and the output capacitor is connected across the output positive terminal and the ground terminal.

[0048] Preferably, the thin coupled inductor is specifically a thin coupled inductor having an auxiliary winding body and an auxiliary winding end; the auxiliary winding ends are all facing the bottom surface of the power module; the first auxiliary winding body, the second auxiliary winding body and the auxiliary winding end are used to form a TLVR closed loop through a series electrical connection. .

[0049] The beneficial effects of the present invention are:

[0050] (1) The present invention proposes a coupled inductor structure based on nanocrystalline strips and a corresponding process method; thereby obtaining a coupled inductor with a thin structure, high saturation current, high steady-state inductance and low dynamic inductance, so as to improve the power density, steady-state performance and dynamic performance of the power module. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0052] Figure 1A and Figure 1B is a schematic diagram of a step-down circuit;

[0053] Figure 2A and Figure 2B Schematic diagram of nanocrystalline sheet;

[0054] FIG. 3A to FIG. 3C is a schematic diagram of an inductor component 200a;

[0055] FIG. 4A to FIG. 4C is a schematic diagram of an inductor component 200b;

[0056] Figure 5A and Figure 5B is a three-dimensional schematic diagram of an inductor component 200c;

[0057] Figure 5C and Figure 5D is a schematic diagram of an assembly 260;

[0058] FIG. 6A to FIG. 6E is a schematic diagram of a first connecting member;

[0059] Fig. 6F and Figure 6G is another schematic diagram of the assembly 260;

[0060] Figure 6H This is a schematic diagram of continuous production;

[0061] 7A to 7C is a three-dimensional schematic diagram of an inductor component 200c;

[0062] FIG. 8A to FIG. 8E is a three-dimensional schematic diagram of the inductor component 200d;

[0063] in:

[0064] 1a / 1b step-down circuit; 11 / 12 switch unit; 101 tape; 102 glue; 110 nanometer chip material; 200a / 200b / 200c / 200d inductor component; 201 first side; 202 second side; 203 first side; 204 second side; 205 third side; 206 fourth side; 211 first magnetic core; 211a / 211b / 212a / 212b / 212c / 212d slot; 212 second magnetic core; 213 third magnetic core; 214 fourth magnetic core; 215 fifth magnetic core; 221 first winding; 222 second winding; 221a / 222a first end; 221a1 / 222a1 / 221b1 / 222b1 blind hole; 221a2 / 222a2 / 221b2 / 222b2 electroplating layer; 221b / 222b second end; 221c / 222c winding body; 221d / 222d first end surface; 221e / 222e second end surface; 221f1 / 222f1 / 231f / 232f / 241f / 242f / 251f / 252f pad; 223 first auxiliary winding; 224 second auxiliary winding; 231 / 232 first power connector; 231c / 232c / 241c / 242c / 251c / 252c through hole; 231d / 232d / 241d / 242d / 251d / 252d electroplating layer; 231e filling column;

[0065] 241 / 242 second power connector; 251 / 252 signal connector; 260 / 262 assembly; 2601 frame; 261 first component; 261a second component; 261b third component; 263 fourth component; 264 fifth component; 271 first PP layer; 272 second PP layer; 273 third PP layer; 274 fourth PP layer; 275 fifth PP layer; 281 first copper layer; 282 second copper layer;

[0066] Cin input capacitor; Co output capacitor; GND ground terminal; gap1 first air gap total height; gap2 second air gap total height; L1 / L2 inductor; L11 first auxiliary winding; L12 second auxiliary winding; Le additional inductor; Rload load; Signal signal terminal; SW1 / SW2 SW terminal; Vin+ input positive terminal; Vo1+ / Vo2+ / Vo+

[0067] Input positive terminal. DETAILED DESCRIPTION

[0068] One of the cores of the present invention is to provide a coupled inductor structure based on nanocrystalline strips and a corresponding process method; thereby obtaining a thin, high saturation current, high steady-state inductance and low dynamic inductance coupled inductor to improve the power density, steady-state performance and dynamic performance of the power module.

[0069] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0070] The step-down circuit 1a shown in 1A is a conventional Buck circuit with two phases in parallel. Figure 1BThe buck circuit 1b shown has a two-phase parallel Buck circuit with TLVR inductors. Buck circuits 1a and 1b both include an input positive terminal Vin+, an output positive terminal Vo+, a ground terminal GND, switch units 11 and 12, inductors L1 and L2, an input capacitor Cin and an output capacitor Co, the second end Vo1+ of the inductor L1 and the second end Vo2+ of the inductor L2 are electrically connected to the output positive terminal Vo+, the first end of the inductor L1 is electrically connected to the switch unit 11, and the first end of the inductor L2 is electrically connected to the switch unit 12. The two ends of the half-bridge arms of the switch units 11 and 12 are connected across the input positive terminal Vin+ and the ground terminal GND of the buck circuit, thereby forming the input positive terminal Vin+ and the ground terminal GND of the switch units 11 and 12; the input capacitor Cin is connected across the input positive terminal Vin+ and the ground terminal GND of the switch units 11 and 12. The output capacitor Co is connected across the output positive terminal Vo+ and the ground terminal GND of the buck circuit. The control signals of the switch units 11 and 12 are out of phase by 180 degrees. The step-down circuit 1b further includes auxiliary windings L11 and L12 and an external inductor Le, which are sequentially connected in series to form a closed loop (TLVR closed loop) to implement the TLVR technology; the first end of the auxiliary winding L11 and the first end of the inductor L1 are the same-named ends, marked as the first point end; the first end of the auxiliary winding L12 and the first end of the inductor L2 are the same-named ends, marked as the second point end; the second end of the auxiliary winding L11 is electrically connected to the first end of the auxiliary winding L12.

[0071] The present invention cuts the nanocrystalline ribbon material into nanocrystalline wafers 101, overlaps multiple nanocrystalline wafers 101 and bonds each nanocrystalline wafer 101 together with glue 102 to form a nanocrystalline plate 110. Figure 2A and Figure 2B As shown. In addition to the bonding effect, the glue 102 can also achieve reliable insulation between the sheets because the resistivity of the nanocrystalline chip material 101 is relatively low, thereby reducing the eddy current loss of the nanocrystalline plate 110 and achieving the purpose of reducing the loss density of the magnetic material. Since the glue 102 does not have magnetic conductivity, it is hoped that the glue between the nanocrystalline chip materials 101 is as thin as possible. One of the solutions is to coat the surface of the nanocrystalline chip material 101 by means of molecular lamination, so that an extremely thin insulating coating layer is formed on the surface of the nanocrystalline chip material 101; and then multiple sheets of nanocrystalline chip materials 101 are bonded together by glue 102. The present invention only takes nanocrystalline magnetic materials as an example, but the following embodiments are not limited to nanocrystalline magnetic materials. The same structure and process are also applicable to amorphous ribbon magnetic materials and metal thin film composite materials (Metal Flake Composite), etc.

[0072] Embodiment 1

[0073] Figure 3A Shown Figure 1A The inductors L1 and L2 are made of nanocrystalline plates. Figure 3B FIG. 2 is a schematic diagram of a three-dimensional exploded view of the inductor component 200a. FIG. 3A to FIG. 3B As shown, the inductor assembly 200a includes a first magnetic core 211, a second magnetic core 212, a third magnetic core 213, a fourth magnetic core 214, a fifth magnetic core 215, a first winding 221, and a second winding 222. The first magnetic core 211 is an upper magnetic cover of the inductor assembly; the second magnetic core 212 is a lower magnetic cover of the inductor assembly; the third magnetic core 213 and the fourth magnetic core 214 are side pillars of the inductor assembly; and the fifth magnetic core 215 is a middle pillar of the inductor assembly. The magnetic cores 211 to 215 are all made of nanocrystalline sheet 110, wherein the first magnetic core 211 and the second magnetic core 212 are formed by die stamping or by wire cutting to form slots 211a, 211b, 212a, and 212b, and the slots 211a, 211b, 212a, and 212b are used to set winding ends or other power connectors similar to copper pillars. In other embodiments, since the nanocrystalline plate 110 has high hardness and is difficult to punch, the nanocrystalline sheet 101 may be punched or wire-cut to form the required slots, and then the slotted sheet is glued together with glue 102. Figure 3B The first magnetic core 211 and the second magnetic core 212 are shown; the advantage of this is that the difficulty of stamping the sheet material is reduced and the production cost is reduced.

[0074] In this embodiment, the third magnetic core 213, the first winding 221, the fifth magnetic core 215, the second winding 222 and the fourth magnetic core 214 are arranged in sequence. The first winding 221 includes a first end 221a, a winding body 221c and a second end 221b; the second winding 222 includes a first end 222a, a winding body 222c and a second end 222b. The first end 221a of the first winding 221 extends from the winding body 221c to the first magnetic core 211, passes through the slot 211a and forms a SW1 pin 221d on the top surface of the inductor component 200a for connecting the switch unit 11; the second end 221b extends from the winding body 221c to the second magnetic core 212, passes through the slot 212a and forms a Vo1+ pin on the bottom surface of the inductor component 200a; the first end 222a of the second winding 222 extends from the winding body 222c to the first magnetic core 211, passes through the slot 211b and forms a SW2 pin 222d on the top surface of the inductor component 200a for connecting the switch unit 12; the second end 222b extends from the winding body 222c to the second magnetic core 212, passes through the slot 212b and forms a Vo2+ pin on the bottom surface of the inductor component 200a. In the inductor assembly 200a shown in this embodiment, the third magnetic core 213, the fourth magnetic core 214, the fifth magnetic core 215 and the first winding 221 and the second winding 222 can be independent of each other, or can be pressed into one piece and then assembled with the first magnetic core 211 and the second magnetic core 212. Here, the third magnetic core 213, the fourth magnetic core 214 and the fifth magnetic core 215 are collectively referred to as the third magnetic core assembly 213a.

[0075] Figure 3C for Figure 3A In the cross-sectional schematic diagram of the AA position shown in the figure, the third magnetic core 213, the first winding 221, the fifth magnetic core 215, the second winding 222 and the fourth magnetic core 214 are arranged in sequence. An air gap is set between the third magnetic core 213 and the first magnetic core 211 and the second magnetic core 212, respectively, which is recorded as the first air gap, and the total height thereof is gap1; similarly, an air gap is set between the fourth magnetic core 214 and the first magnetic core 211 and the second magnetic core 212, respectively, which is also the first air gap, and the total height thereof is also gap1. An air gap is set between the fifth magnetic core 215 and the first magnetic core 211 and the second magnetic core 212, respectively, which is recorded as the second air gap, and the total height thereof is gap2. The total height of the first air gap gap1 is used to adjust the coupling coefficient and the mutual inductance between the first winding and the second winding; the total height of the second air gap gap2 is used to adjust the leakage inductance between the first winding and the second winding.

[0076] When the inductor component 200a is applied to Figure 1AIn the two-phase Buck circuit shown, the current flows in from the SW1 pin 221d and the SW2 pin 222d, and flows out from the Vo1+ pin and the Vo2+ pin, and the currents flowing through the winding bodies 221c and 222c are in opposite directions, so that the inductor component 200a works in an anti-coupling state, forming a pair of anti-coupled inductors; the magnetic flux generated by the current flowing through the first winding 221 and the magnetic flux generated by the current flowing through the second winding 222 are mutually reinforced in the fifth magnetic core 215. The inductor component 200a shown in this embodiment has a higher saturation current, low dynamic inductance and high steady-state inductance, which meets the requirements of high conversion efficiency while improving the dynamic performance of the buck circuit 1a. At the same time, the setting of the first air gap total height gap1 and the second air gap total height gap2 can flexibly adjust the size of the steady-state inductance and the dynamic inductance to meet the requirements of different loads. The preferred setting is that the height of the first air gap total height gap1 is less than the second air gap total height gap2. Furthermore, the total height of the first air gap gap1 is close to 0;

[0077] Figure 3B The structure shown is a magnetic core with slots and an inductor assembly, which is also applicable to conventional E-shaped magnetic cores, U-shaped magnetic cores, etc., and is not limited here.

[0078] In other embodiments, the first magnetic core 211 and the second magnetic core 212 can be set as nanocrystalline materials, and the third magnetic core 213, the fourth magnetic core 214, and the fifth magnetic core 215 can be set as magnetic powder core materials. Nanocrystalline materials have a high relative magnetic permeability, and the first magnetic core 211 and the second magnetic core 212 are set on the mutual magnetic flux path of the inductor component, so the coupling coefficient of the inductor component is high and the coupling performance is good. The magnetic powder core material has a high saturation magnetic flux density and a low equivalent magnetic permeability; the total height gap2 of the second air gap between the fifth magnetic core 215 and the first magnetic core and the second magnetic core can be used to adjust the size of the leakage inductance; at the same time, the total height gap2 of the second air gap can be set to be close to 0, only the assembly air gap exists, and the size of the leakage inductance is adjusted only by adjusting the relative magnetic permeability of the fifth magnetic core 215. Similarly, the total height gap1 of the first air gap can be set to be close to 0, and only the assembly air gap exists; in this way, the size of the coupling coefficient and the mutual inductance can be achieved by adjusting the relative magnetic permeability of the third magnetic core 213 and the fourth magnetic core 214. In this embodiment, the number of air gaps is reduced by the above method, which can simplify the inductor manufacturing process; the fifth magnetic core is set to a magnetic powder core material with a high saturation magnetic flux density, which can increase the saturation current of the inductor component.

[0079] Compared with the prior art (the first magnetic core 211 to the fifth magnetic core 215 are all made of magnetic powder core material, or the magnetic cores 211 to 215 are all made of ferrite material), the inductor component 200a of this embodiment uses nanocrystalline material for the first magnetic core 211 and the second magnetic core 212, which not only increases the equivalent steady-state inductance of the two oppositely coupled inductors, but also increases the anti-saturation capability of the two oppositely coupled inductors under large current conditions. Furthermore, the inductor component 200a of this embodiment uses magnetic powder core material for the fifth magnetic core 215, which further increases the anti-saturation capability of the two oppositely coupled inductors under large current conditions. This method of using magnetic powder core material for the fifth magnetic core 215 to improve the anti-saturation capability of the two oppositely coupled inductors under large current conditions is not only applicable to the case where the first magnetic core 211 and the second magnetic core 212 are made of nanocrystalline material, but also to the case where the first magnetic core 211 and the second magnetic core 212 are made of ferrite material.

[0080] Embodiment 2

[0081] Figure 4A Shown Figure 1B The three-dimensional structure diagram of the TLVR inductor is shown in FIG. Figure 4B for Figure 4A Schematic diagram of the three-dimensional decomposition of. Figure 3A ,exist Figure 4A In the inductor assembly 200b shown, a first auxiliary winding 223 and a second auxiliary winding 224 are added. The first auxiliary winding 223 is arranged between the first winding 221 and the fifth magnetic core 215, and is arranged adjacent to the first winding 221, and is magnetically coupled with the first winding 221; a high temperature resistant insulating material (not shown) is arranged between the first auxiliary winding 223 and the first winding 221, for achieving insulation between the first auxiliary winding 223 and the first winding 221. The second auxiliary winding 224 is arranged between the second winding 222 and the fifth magnetic core 215, and is arranged adjacent to the second winding 222, and is magnetically coupled with the second winding 222; an insulating material is arranged between the second auxiliary winding 224 and the second winding 222. The first end 223a and the second end 223b of the first auxiliary winding 223 and the first end 224a and the second end 224b of the second auxiliary winding 224 all extend toward the bottom surface of the inductor assembly 200b. Correspondingly, slots 212c and 212d are added to the second magnetic core 212. The slot 212a allows the second end 221b of the first winding 221 and the second end 223b of the first auxiliary winding 223 to pass through; the slot 212b allows the second end 222b of the second winding 222 and the second end 224b of the second auxiliary winding 224 to pass through; the slot 212c allows the first end 223a of the first auxiliary winding 223 to pass through, and the slot 212d allows the first end 224a of the second auxiliary winding 224 to pass through.

[0082] The inductor assembly 200b shown in this embodiment, referring to Figure 4A The side section diagram of the AA section line is as follows: Figure 4C As shown, the third magnetic core 213, the first winding 221, the first auxiliary winding 223, the fifth magnetic core 215, the second auxiliary winding 224, the second winding 222 and the fourth magnetic core 214 are arranged in sequence. The setting of the first air gap total height gap1 and the second air gap total height gap2 is the same as that of the inductor component 200a, and will not be repeated here. As with the inductor component 200a, the first to fifth magnetic cores are made of nanocrystalline materials, and the same technical effects as the inductor component 200a can also be obtained; in addition, the first magnetic core 211 and the second magnetic core 212 can also be made of nanocrystalline materials, and the third to fifth magnetic cores can be made of magnetic powder core materials, and the setting of the first air gap total height gap1 and the second air gap total height gap2, as well as the setting of their magnetic permeability are also the same as those of the inductor component 200a, and the same technical features and benefits can also be obtained.

[0083] In this embodiment, the control signals in the two-phase parallel Buck circuit are staggered by 180 degrees. Combined with the structure of the inductor component, the inductor component in the power module can operate in a reverse coupling state, thereby achieving a smaller dynamic inductance and a higher steady-state inductance. In addition, an auxiliary winding is added on the basis of the reverse coupling inductor to implement the TLVR technology, thereby further reducing the dynamic inductance and meeting the steady-state performance and dynamic performance requirements of the power module.

[0084] Embodiment 3

[0085] In order to further reduce the thickness of the inductor component and thus meet the thickness requirement of the power module, the present invention proposes another inductor component structure and manufacturing process. Figure 5A FIG. 2 is a schematic diagram of a three-dimensional structure of an inductor component 200c. Figure 5B2 is a schematic diagram of a three-dimensional decomposition of an inductor component 200c. In this embodiment, the inductor component 200c includes a first surface 201 and a second surface 202 that are opposite to each other, and also includes a first side surface 203, a second side surface 204, a third side surface 205 and a fourth side surface 206 that are adjacent to each other in a counterclockwise direction; the first surface 201 is the top surface of the inductor component 200c; and the second surface 202 is the bottom surface of the inductor component 200c. The inductor component 200c also includes a first magnetic core 211, a second magnetic core 212, a third magnetic core 213, a fourth magnetic core 214, a fifth magnetic core 215, a first winding 221, a second winding 222, a first power connector 231 / 232, a second power connector 241 / 242, signal connectors 251 and 252, and a combination 260. The pad 221f1 of the first winding 221, the pad 222f1 of the second winding 222, the pad 231f / 232f of the first power connector 231 / 232, the pad 241f / 242f of the second power connector 241 / 242, and the pad 251f / 252f of the signal connector 251 / 252 are arranged on the first surface 201 of the inductor component 200c; correspondingly, corresponding pads (not shown) are also arranged on the second surface 202 of the inductor component 200c. In the inductor component 200c, the first to fifth magnetic cores can be made of nanocrystalline materials, amorphous ribbon magnetic materials or metal thin film composite materials (Metal Flake Composite), etc., or some of the magnetic cores can be made of magnetic powder core materials, all of which can achieve the technical features and benefits disclosed in the present invention.

[0086] In this embodiment, the first end 221a of the first winding 221 and the first end 222a of the second winding 222 extend from the winding body 221c and 222c to the first surface 201 of the inductor component 200c respectively; the second end 221b of the first winding 221 and the second end 222b of the second winding 222 extend from the winding body 221c and 222c to the second surface 202 of the inductor component 200c respectively. The structure of the first winding 221 and the second winding 222 and the arrangement of the current flow direction are the same as those in the previous embodiment, and are not repeated here. The first power connector 231 and the second power connector 241 are arranged adjacent to the fourth side surface 206 of the inductor component 200c, the first power connector 232 and the second power connector 242 are arranged adjacent to the second side surface 204, the signal connector 251 is arranged adjacent to the first side surface 203, and the signal connector 252 is arranged adjacent to the third side surface 205.

[0087] Furthermore, Figure 5CAs shown, the assembly 260 includes a first component 261, a second PP layer 272, a third PP layer 273, a fourth PP layer 274, a fifth PP layer 275, a first copper layer 281 and a second copper layer 282; and the layers in the assembly 260 are stacked in the order of the first copper layer 281, the fourth PP layer 274, the second PP layer 272, the first component 261, the third PP layer 273, the fifth PP layer 275 and the second copper layer 282. Figure 5D As shown in the side cross-sectional view, in the inductor component 200c, the first magnetic core 211 is arranged between the second PP layer 272 and the fourth PP layer 274; the second magnetic core 212 is arranged between the third PP layer 273 and the fifth PP layer 275. The total height gap1 of the first air gap and the total height gap2 of the second air gap of the inductor component 200c can be set by the thickness of the second PP layer 272 and the third PP layer 273, and the size of the air gap can also be adjusted by setting the thickness of the third magnetic core 213, the fourth magnetic core 214 and the fifth magnetic core 215, so as to achieve the purpose of adjusting the coupling performance between the first winding 221 and the second winding 222. The first component 261 includes the first PP layer 271, the third magnetic core 213, the fourth magnetic core 214, the fifth magnetic core 215, the first winding body 221c and the second winding body 222c. Among them, the third magnetic core 213, the first winding body 221c, the fifth magnetic core 215, the second winding body 222c and the fourth magnetic core 214 are arranged in sequence.

[0088] The manufacturing process of the first component 261 can refer to FIG. 6A to FIG. 6E The detailed steps are as follows:

[0089] S1 layout: a frame 2601 is set on the tape 101, and the third magnetic core 213, the first winding body 221c, the fifth magnetic core 215, the second winding body 222c and the fourth magnetic core 214 are sequentially arranged in the frame 2601. There needs to be a gap between each winding body and the adjacent magnetic core to ensure electrical isolation between the winding and the adjacent magnetic core. The frame 2601 can be a printed circuit board core board frame, but is not limited thereto.

[0090] S2 Lamination: Lamination of a prepreg (PP) in the frame 2601, lamination of the frame 2601, the third magnetic core 213, the first winding body 221c, the fifth magnetic core 215, the second winding body 222c and the fourth magnetic core 214 into one body, and forming a first PP layer 271 in the frame 2601; after removing the tape 101, the first component 261 can be obtained. The first PP layer 271 covers the third magnetic core 213, the first winding body 221c, the fifth magnetic core 215, the second winding body 222c and the fourth magnetic core 214; and the gap between the winding body and the magnetic core is filled with PP material, so that the insulation between the winding and the magnetic core can be achieved.

[0091] Reference Figure 5C , the second PP layer 272 and the third PP layer 273 are placed on the top and bottom surfaces of the first component 261 respectively; then the first magnetic core 211 is placed on the top surface of the second PP layer 272, and the second magnetic core 212 is placed on the bottom surface of the third PP layer 273; the fourth PP layer 274 and the fifth PP layer 275 are placed on the top and bottom respectively; finally, the first copper layer 281 is placed on the top surface of the fourth PP layer 274, and the second copper layer 282 is placed on the bottom surface of the fifth PP layer 275; after the above layers are stacked, they are pressed together to obtain Fig. 6F The pressing process here can be pressed according to the process of printed circuit board, but it is not limited to this, as long as the above structure can be achieved. In addition, the pressing sequence of the assembly 262 can also refer to Figure 6G As shown, the first copper layer 281, the first magnetic core 211, and the fourth PP layer 274 are pressed into the second component 261a; the fifth PP layer 275, the second magnetic core 212, and the second copper layer 282 are pressed into the third component 261b; and then the first component 261, the second component 261a and the third component 261b are pressed into the assembly 262 through the second PP layer 272 and the third PP layer 273. The assembly 262 is composed of the second component 261a, the first component 261, and the third component 261b from top to bottom.

[0092] In addition, the assembly 262 can also be manufactured by first pressing the sheets together and then dividing them, such as Figure 6H As shown, only two assemblies 262 are connected as an example for explanation. The frame 2601 includes two cavities, and each cavity is provided with a third magnetic core 213, a first winding body 221c, a fifth magnetic core 215, a second winding body 222c, and a fourth magnetic core 214 from left to right; here, the two cavities share a first winding body 221c and a second winding body 222c. Two independent assemblies 262 are formed by first pressing the connected pieces together, then dividing the plates and cutting the first winding body and the second winding body. The two cavities here can also each adopt an independent first winding body 221c and a second winding body 222c, but are not limited to this.

[0093] In this embodiment, the inductor assembly 200c further includes through holes 231c / 241c, 232c / 242c, 251c and 252c and blind holes 221a1 and 222a1. The through holes 231c / 241c, 232c / 242c, 251c and 252c are arranged in the assembly 262 perpendicular to the frame 2601 to avoid the magnetic core part. The blind hole 221a1 is arranged at a position corresponding to the slot 211a of the first magnetic core 211, and is used to set the first end 221a of the first winding 221; the blind hole 222a1 is arranged at a position corresponding to the slot 211b of the first magnetic core 211, and is used to set the first end 222a of the second winding 222; the openings of the blind holes 221a1 and 222a1 are exposed to the first copper layer 281, and the depth is only to the position of the winding. The assembly 200c further includes blind holes 221b1 and 222b1 (not shown), the openings of the blind holes 221b1 and 222b1 are exposed to the second copper layer 282, and the depth of the blind holes 221b1 and 222b1 is only to the position of the winding, and is used to respectively set the second end 221b of the first winding 221 and the second end 222b of the second winding 222. The through holes 231c / 241c, 232c / 242c, 251c and 252c and the blind holes 221a1, 222a1, 221b1 and 222b1 are subjected to copper electroplating; refer to Figure 7B The blind hole plating layers 221a2, 222a2, 221b2 and 222b2 are elongated slot ring columns, one end of which is connected to the corresponding winding, and the other end extends to the top surface or the bottom surface of the assembly 200c to form the first end or the second end of the corresponding winding; and the first end surface of the corresponding winding is formed on the top surface of the assembly 200c, and the second end surface of the corresponding winding is formed on the bottom surface of the assembly 200c. The through-hole plating 231d / 241d, 232d / 242d and 251d / 252d are circular ring columns with a certain plating thickness; the cylindrical rings are respectively exposed to the top and bottom surfaces of the assembly 262, and realize the electrical connection between the corresponding pads on the first copper layer 281 and the corresponding pads on the second copper layer 282, forming power connectors 231 / 232 / 241 / 242 and signal connectors 251 / 252; the through-hole plating 231d / 241d and 232d / 242d are used to realize the connection and transmission of power between the bottom and top surfaces of the assembly 262; the through-hole plating 251d / 252d is used to realize the connection and transmission of signals between the bottom and top surfaces of the assembly 262. In this embodiment, the through hole plating layers 231d / 241d, 232d / 242d and 251d / 252d and the blind hole plating layers 221a2, 222a2, 221b2 and 222b2 are all or partially hollow. Figure 7CAs shown, the through hole 231c is used as an example for explanation. The through hole 231c is subjected to copper plating to form a plating layer 231d, and then filled with an insulating material (such as epoxy resin) to form a filling column 231e. In another embodiment, the through hole plating layers 231d / 241d, 232d / 242d and 251d / 252d and the blind hole plating layers 221a2, 222a2, 221b2 and 222b2 are all conductive materials, which are used to enhance the current carrying capacity of the power connector and the first and second ends of the winding, and improve the transmission efficiency of the inductor component. The pads on the top and bottom surfaces of the assembly 262 can be formed by chemical etching to form the first and second end faces of the winding, the pads of the power connector, and the pads of the signal connector.

[0094] Embodiment 4

[0095] The present invention also proposes an inductor component 200d, such as Fig. 8A The structural diagram of the inductor component 200d is shown in FIG. Figure 8B The figure shows a three-dimensional exploded schematic diagram of the inductor component 200d. Fig. 8A and Figure 8B The inductor component 200d includes a first surface 201 and a second surface 202, a first side surface 203, and a second side surface 204, a third side surface 205, and a fourth side surface 206 that are adjacent in a counterclockwise direction. The first surface 201 is the top surface of the inductor component 200d; the second surface 202 is the bottom surface of the inductor component 200d. The inductor component 200d also includes a first component 261, a first magnetic core 211, a second magnetic core 212, a first power connector 231 / 232, a second power connector 241 / 424, a signal connector 251 / 252, and a combination 260. The first power connector 231 and the second power connector 241 cover part of the first surface 201, part of the side surface on the fourth side surface 206, and part of the second surface 202; the first power connector 232 and the second power connector 242 cover part of the first surface 201, part of the second side surface 204 and the second surface 202; the signal connector 251 covers part of the first surface 201, part of the first side surface 203 and part of the bottom surface 202, and the signal connector 252 covers part of the first surface 201, part of the third side surface 205 and part of the bottom surface 202.

[0096] The inductor component 200d in the fourth embodiment disclosed in this embodiment has substantially the same internal structure as the inductor component 200c in the third embodiment, and also has the same technical effect as the third embodiment; the difference is as to the implementation process of the first component 261 and the winding end. The first component 261 in the inductor component 200d includes a first winding 221, a second winding 222 and a third magnetic core combination 213a. The third magnetic core combination 213a adopts magnetic powder core material; the first winding 221, the second winding 222 and the magnetic powder core material are formed by one-time pressing and molding to form the first component 261. The magnetic powder core material has the characteristic of high resistivity, so it has good insulation performance between the first winding 221 and the third magnetic core combination 213a and between the second winding 222 and the third magnetic core combination 213a, and no additional insulation treatment is required to meet the requirements. In this embodiment, the third magnetic core assembly 213a has the same thickness as the first winding 221 and the second winding 222 (excluding the ends of the windings); and the third magnetic core assembly 213a surrounds at least three sides of the first winding 221, and the first end 221a of the first winding 221 protrudes upward from the third magnetic core assembly 213a, and the second end 221b of the first winding 221 protrudes downward from the third magnetic core assembly 213a; similarly, the third magnetic core assembly 213a surrounds at least three sides of the second winding 222, and the first end 222a of the second winding 222 protrudes upward from the third magnetic core assembly 213a, and the second end 222b of the second winding 222 protrudes downward from the third magnetic core assembly 213a. The first component 261 is assembled with the first magnetic core 211 and the second magnetic core 212 to form a fourth component 263, Figure 8C is a three-dimensional schematic diagram of the fourth component 263, Fig.8D It is a side schematic diagram of the fourth component 263. In other embodiments, the thickness of the third core combination 213a between the two windings or the outer part of the two windings can also be set to be lower than the thickness of the windings to meet different inductive coupling requirements. Here, the third core combination 213a between the two windings can be understood as the middle column of the fourth component 263; the third core combination 213a outside the two windings can be understood as the side column of the fourth component 263. When the thickness of the third core combination 213a between the two windings is lower than the thickness of the windings, it is equivalent to the middle column of the fourth component 263 having an air gap; when the thickness of the core combination 213a outside the two windings is lower than the thickness of the windings, it is equivalent to the side column of the fourth component 263 having an air gap. The first winding 221 and the second winding 222 here can be an integrally formed copper bar pressed with magnetic material; in another embodiment, the first winding body 221c and the second winding body 222c can also be pressed with magnetic material, and then the first end 221a and 222a and the second end 221b and 222b are respectively welded to the corresponding winding body to form the first winding 221 and the second winding 222.

[0097] Because the first magnetic core 211 and the second magnetic core 212 are conductive, insulation treatment needs to be performed between the first magnetic core 211 and the first winding 221 and the second winding 222; similarly, insulation treatment needs to be performed between the second magnetic core 212 and the first winding 221 and the second winding 222. In this embodiment, the fourth component 263 is integrally sealed to form a fifth component 264, such as Fig. 8E As shown, an integrated inductor element can be formed, and insulation treatment between the winding and the magnetic core can be achieved. Metallization treatment is performed on the surface of the fifth component 264, and power connectors 231 / 241 and 232 / 242 and signal connectors 251 / 252 are electroplated to obtain the inductor component 200d. The structure and process method of the inductor component disclosed in this embodiment not only meet the requirements of thin inductor components and high power density, but also simplify the process.

[0098] The inductor assembly disclosed in the present invention can be applied to a vertical structure power module, combined with Figure 1A and Figure 1B In the circuit diagram of the power module shown, the switch units 11 and 12 can be arranged on the top surface of the inductor component and electrically connected to the pads of the winding on the top surface of the inductor component or the power connector pads and / or the signal connector pads. The first power connector 231 / 232 is used to electrically connect the input positive terminal Vin+ on the bottom surface of the power module with the input positive terminal Vin+ of the switch unit, and the second power connector 241 / 242 is used to electrically connect the ground terminal GND on the bottom surface of the power module with the ground terminal GND of the switch unit. The power module is fixed and electrically connected to the pin adapter board or the system board through the pads on the bottom surface of the inductor component, receives input power from the system board, or provides power to the load on the system board, and realizes signal transmission between the switch unit and the system board through the signal connector.

[0099] The switch unit disclosed in the present invention can be SiMOSFET, SiCMOSFET, GaNdeviceT or IGBT, etc., all of which can realize the switch function disclosed in the present invention.

[0100] The power module described in the above embodiment may also be a part of an electronic device, and can satisfy the technical features and benefits disclosed by the present invention.

[0101] The “equal”, “same” or “equal” disclosed in the present invention must take into account the parameter distribution of the project, and the error distribution is within ±30%; the definition of two line segments or two straight lines being “parallel” is that the angle between the two line segments or two straight lines is less than or equal to 45 degrees; the definition of two line segments or two straight lines being “perpendicular” is that the angle between the two line segments or two straight lines is within the range of [60, 120] degrees; the definition of phase “misalignment” also needs to take into account the parameter distribution of the project, and the error distribution of the misalignment degree is within ±30%.

[0102] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0103] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A thin coupled inductor, characterized in that: comprising a first component, a first magnetic core and a second magnetic core; The first magnetic core, the first component and the second magnetic core are stacked; the first component is arranged between the first magnetic core and the second magnetic core; The first component includes a first winding body, a second winding body and a third magnetic core combination, wherein the third magnetic core combination, the first winding body and the second winding body are arranged in the same layer; the first winding body and the second winding body are arranged in parallel; at least a part of the third magnetic core combination is arranged outside the first winding body and the second winding body; Both ends of the first winding body and both ends of the second winding body are provided with winding ends, and the winding ends are arranged along the stacking direction; The first magnetic core and the second magnetic core have a thin layer composite structure; the thin layer composite structure includes a plurality of thin layers of magnetic material and an insulating layer arranged between the thin layers of magnetic material.

2. The thin coupled inductor according to claim 1, characterized in that: The thin coupled inductor has a first surface, a second surface, a first side surface, a second side surface, a third side surface and a fourth side surface; the first surface and the second surface are opposite to each other, the first side surface and the third side surface are opposite to each other, and the second side surface and the fourth side surface are opposite to each other; The thin coupled inductor further includes a first copper layer, a second copper layer, an insulating layer, a power connector and a signal connector; The first copper layer, the first magnetic core, the first component, the second magnetic core and the second copper layer are stacked in sequence from top to bottom; the insulating layers are respectively arranged between the first copper layer and the first magnetic core, between the first magnetic core and the first component, between the first component and the second magnetic core, and between the second magnetic core and the second copper layer; The power connector is electrically connected to the first copper layer and the second copper layer, and is disposed adjacent to the second side surface and the fourth side surface; the signal connector is electrically connected to the first copper layer and the second copper layer, and is disposed adjacent to the first side surface and the third side surface.

3. The thin coupled inductor according to claim 2, characterized in that: The winding end includes a first winding first end, a first winding second end, a second winding first end and a second winding second end; the first winding first end and the first winding second end are connected to the first winding body, and the second winding first end and the second winding second end are connected to the second winding body; the first winding first end and the second winding first end respectively extend from the corresponding winding body to the first copper layer and are electrically connected to the first copper layer; the first winding second end and the second winding second end respectively extend from the corresponding winding body to the second copper layer and are electrically connected to the second copper layer.

4. The thin coupled inductor according to claim 1, characterized in that: The first magnetic core and the second magnetic core are respectively provided with slots, and the winding ends are arranged in the slots.

5. The thin coupled inductor according to claim 4, characterized in that: The winding end is a plated metal part, or the winding end is a welded metal part, or the winding end and the corresponding winding body are integrally formed.

6. The thin coupled inductor according to claim 1, characterized in that: The third magnetic core assembly is made of magnetic powder core material.

7. The thin coupled inductor according to claim 1, characterized in that: The third magnetic core combination includes a third magnetic core, a fourth magnetic core and a fifth magnetic core; The third magnetic core, the first winding body, the fifth magnetic core, the second winding body and the fourth magnetic core are arranged in sequence.

8. The thin coupled inductor according to claim 7, characterized in that: There are air gaps with a total height of gap1 between the third magnetic core and the first magnetic core, and between the third magnetic core and the second magnetic core; there are also air gaps with a total height of gap1 between the fourth magnetic core and the first magnetic core, and between the fourth magnetic core and the second magnetic core; there are air gaps with a total height of gap2 between the fifth magnetic core and the first magnetic core, and between the fifth magnetic core and the second magnetic core.

9. The thin coupled inductor according to claim 8, characterized in that: The height sum gap1 does not exceed the height sum gap2.

10. The thin coupled inductor according to claim 8, characterized in that: The height sum gap1 is the height sum of the assembled air gaps.

11. The thin coupled inductor according to claim 1, characterized in that: The first component also includes a first auxiliary winding body and a second auxiliary winding body; the first auxiliary winding body and the first winding body are arranged in parallel and coupled; the second auxiliary winding body and the second winding body are arranged in parallel and coupled; auxiliary winding ends are arranged at both ends of the first auxiliary winding body and both ends of the second auxiliary winding body, and the auxiliary winding ends are arranged along the stacking direction.

12. The thin coupled inductor according to claim 11, characterized in that: The first magnetic core and the second magnetic core are respectively provided with slots; the winding ends are arranged in the slots; and the auxiliary winding ends are all arranged in the slots located in the second magnetic core.

13. The thin coupled inductor according to claim 1, characterized in that: The first component also includes a PP material area and an outer frame; the first winding body, the second winding body and the third magnetic core combination are arranged in the outer frame, and the PP material area fills the gap between the third magnetic core combination and the winding body.

14. The thin coupled inductor according to claim 1, characterized in that: The thin layer of magnetic material includes at least one of nanocrystalline magnetic material, amorphous ribbon magnetic material or magnetic metal film.

15. The thin coupled inductor according to claim 2, characterized in that: The insulating layer is a PP layer; the first copper layer, the first magnetic core, the first component, the second magnetic core, the second copper layer and the insulating layer are pressed together to form a stacked body.

16. The thin coupled inductor according to claim 15, characterized in that: It also includes a plastic package; the plastic package covers the outer surface of the stacked body, the power connector and the signal electrical connector are arranged along the surface of the plastic package; the winding end is exposed on the surface of the plastic package.

17. The thin coupled inductor according to claim 15, characterized in that: The stacked body is provided with a through hole which penetrates from the first surface to the second surface, and the power electrical connector and the signal electrical connector are arranged in the through hole.

18. The thin coupled inductor according to claim 1, characterized in that: The first winding body, the second winding body and the third magnetic core combination have the same thickness, the third magnetic core combination is a connected area, the third magnetic core combination is made of magnetic powder core material, the third magnetic core combination surrounds at least three sides of the first winding body, and the third magnetic core combination surrounds at least three sides of the second winding body; the first winding body, the second winding body and the third magnetic core combination are pressed together to form a first component.

19. A method for manufacturing a thin coupled inductor, characterized in that: The steps include: Layout: a frame is arranged on the tape, a third magnetic core combination, a first winding body and a second winding body are arranged in the frame, a gap is left between the third magnetic core combination and the first winding body, and a gap is left between the third magnetic core combination and the second winding body; Lamination: Laminating the PP material in the frame and removing the tape to form a first assembly; And, stacking: stacking a PP layer, a first magnetic core, another PP layer and a first copper layer in sequence in the top surface direction of the first component; stacking a PP layer, a second magnetic core, another PP layer and a second copper layer in sequence in the bottom surface direction of the first component, and forming a stacked body after pressing; The first winding body and the second winding body are arranged in parallel; at least a part of the third magnetic core combination is arranged on the outside of the first winding body and the second winding body; winding ends are arranged at both ends of the first winding body and both ends of the second winding body, and the winding ends are arranged along the stacking direction.

20. The manufacturing method according to claim 19, characterized in that: The winding end is arranged on the first component by welding, or the winding end and the corresponding winding body are integrally formed; The first magnetic core and the second magnetic core have a thin layer composite structure; the thin layer composite structure includes a plurality of thin layers of magnetic material and an insulating layer arranged between the thin layers of magnetic material, and the thin layers of magnetic material include at least one of nanocrystalline magnetic material, amorphous ribbon magnetic material or magnetic metal film.

21. The method according to claim 19, characterized in that: The following steps are also included: Opening holes: a through hole and a half hole are opened on the stacked body, the half hole is arranged at a corresponding position of the winding end; the through hole is arranged at a position avoiding the winding body; And, electroplating: electroplating the side walls of the half holes and the through holes to form winding ends and electrical connectors, wherein the electrical connectors include power electrical connectors and signal electrical connectors.

22. The manufacturing method according to claim 19, characterized in that: The following steps are also included: Plastic sealing: plastic sealing the surface of the stacked body to form a plastic sealed body; And, arranging electrical connectors: arranging power electrical connectors and signal electrical connectors on the surface of the plastic package body; The winding end is exposed on the surface of the plastic package body.

23. The manufacturing method according to claim 19, characterized in that: During layout, a first auxiliary winding body and a second auxiliary winding body are further arranged in the frame; the first auxiliary winding body and the first winding body are adjacent to each other, arranged in parallel and with a gap; the second auxiliary winding body and the second winding body are adjacent to each other, arranged in parallel and with a gap; auxiliary winding ends are arranged at both ends of the first auxiliary winding body and both ends of the second auxiliary winding body, and the winding ends are arranged toward the bottom surface.

24. The method according to claim 19, characterized in that: During layout, a plurality of third magnetic core combinations, a plurality of first winding bodies and a plurality of second winding bodies are arranged in the frame; after the adhesive tape is removed, a plurality of first components are formed by cutting the panels.

25. The manufacturing method according to claim 24, characterized in that: The multiple first winding bodies and the multiple second winding bodies corresponding to different first components are a common whole when laid out.

26. A power module, characterized in that: The power module comprises a thin coupled inductor as claimed in any one of claims 1 to 18, wherein the power module further comprises a first switch unit, a second switch unit, an input capacitor and an output capacitor; the first switch unit and the second switch unit are arranged on the top surface of the power module; the power module has an input positive terminal, an output positive terminal and a ground terminal, and the input positive terminal, the output positive terminal and the ground terminal are arranged on the bottom surface of the power module; the two winding ends corresponding to the first winding body are electrically connected to the first switch unit and the output positive terminal respectively, and the two winding ends corresponding to the second winding body are electrically connected to the second switch unit and the output positive terminal respectively; The control signals of the first switch unit and the second switch unit are out of phase by 180°; the input capacitor is connected between the input positive terminal and the ground terminal, and the output capacitor is connected between the output positive terminal and the ground terminal.

27. The power module according to claim 26, characterized in that: The thin coupled inductor is specifically the thin coupled inductor as claimed in claim 11; the ends of the auxiliary windings are all facing the bottom surface of the power module; the first auxiliary winding body, the second auxiliary winding body and the auxiliary winding ends are used to form a TLVR closed loop through series electrical connection.