3results about "Liquid application" patented technology

Coatings comprising iron alloys that include iron and at least another metal (e.g., cobalt and / or nickel) for wireless recharging devices are generally described. The coatings may be directly applied to a substrate, such as a print circuit board.

The application belongs to the technical field of electronic information materials, and specifically provides a method for preparing M-type barium ferrite monocrystal thin film under low temperature conditions; the method is characterized by innovative design of liquid phase raw materials and strict design of liquid phase epitaxy process parameters, and can grow the M-type barium ferrite monocrystal thin film with excellent performance on SGGG (111) substrate by liquid phase epitaxy method under low temperature conditions of 830-850 DEG C, which is not only simple in process and low in cost, but also has high crystallization quality, no impurities and defects. The M-type barium ferrite monocrystal thin film prepared by the method is a single crystal material, the film thickness is up to 150 mu m, the saturation magnetization is about 4500 Oe, the remanence is about 1000 Oe, the easy magnetization axis (c axis) is perpendicular to the film surface, has high uniaxial magnetic crystal anisotropy field, and is very beneficial to realize self-bias design of the device.

Aspects of the present disclosure include systems, structures, circuits, and methods providing planar transformers and planar transformer structures. The planar transformers and transformer structures can include first and second core layers of soft ferromagnetic material on opposite sides of an electrical substrate. First and second coils can be configured as conductive traces disposed on the opposite sides of the substrate. The first and second soft ferromagnetic layers are in contact in a contact region. One or more holes are disposed in either or both of the soft ferromagnetic layers and contain soft ferromagnetic material to reduce reluctance of the transformer structure. The planar transformer can be included in integrated circuit (chip) packages or modules. The packages and modules may include various types of circuits; in some examples, chip packages or modules may include a gate driver or other high voltage circuit.