6results about How to "Improve high frequency characteristics" patented technology

The application discloses a power magnetic core common mode inductor and a preparation method thereof, and belongs to the technical field of electronic component manufacturing, and comprises a winding execution unit, a magnetic circuit assembly unit and a material flow transfer module, wherein the winding execution unit comprises a main shaft rotating motor and a wire arranging servo module, the magnetic circuit assembly unit comprises a servo press and a glue injection nozzle, and the material flow transfer module is connected with the winding execution unit and the magnetic circuit assembly unit. The scheme physically increases the average distance of interlayer conductors through staggered span actions, changes the distribution direction of electric field vectors, effectively reduces the parasitic capacitance between windings, directly improves the high-frequency characteristics of the common mode inductor, expands the high-frequency impedance bandwidth, and enables the common mode inductor to more effectively inhibit high-frequency noise transmission.

The present invention provides a composite cable that improves high-frequency characteristics. The composite cable (1) has a signal transmission cable (2), a pair of power lines (3), an integral braided shielding layer (5), and a sheath (6); the signal transmission cable (2) has a pair of signal lines (21) arranged parallel to each other in the cable length direction and arranged to contact each other, and a shielding layer (22) integrally covering the pair of signal lines (21); the pair of power lines (3) are arranged to contact each other and to contact the shielding layer (22); the integral braided shielding layer (5) integrally covers the periphery of the cable core (4) formed by the signal transmission cable (2) and the pair of power lines (3); the sheath (6) covers the periphery of the integral braided shielding layer (5); wherein the integral braided shielding layer (5) is arranged along the outline of the shielding layer (22) and is tightly connected to the shielding layer (22).

This invention discloses a perforated chip capacitor and its manufacturing method. The capacitor uses an integral aluminum plate with multiple through holes forming a perforated structure, and at least some of the through holes penetrate the aluminum plate. An oxide layer is formed on the entire surface of the aluminum plate, including the inner surface of the through holes. The manufacturing method includes: welding an anode lead plate to the aluminum plate; laser drilling the aluminum plate to form through holes; acid etching to increase the specific surface area; anodizing to form an oxide layer; and sequentially forming a polymer layer, a graphite layer, and a silver paste layer. This invention, through its integrated porous aluminum plate structure, replaces the traditional multi-layer laminated structure, effectively improving the problems of high leakage current, poor heat dissipation, and insufficient vibration resistance of multilayer capacitors. It also achieves high specific capacitance and low ESR, significantly improving the overall performance and reliability of the capacitor.

The application discloses an electric connector and a connector combination, the electric connector comprising: a plurality of first conductive terminals arranged along the left-right direction, the first conductive terminals having a first contact part, a first connecting part and a first lead-in part connected in sequence, the first contact part being located in front of the first lead-in part, the plurality of first conductive terminals comprising a first differential signal pair, a first ground terminal and a second differential signal pair arranged in sequence, the first contact part of the first differential signal pair and the first contact part of the second differential signal pair being arranged staggered along the front-back direction, the first contact part of the first ground terminal being between the first contact parts of the two, and the first lead-in part of the first differential signal pair and the first lead-in part of the second differential signal pair being arranged staggered along the front-back direction, the first lead-in part of the first ground terminal being between the first lead-in parts of the two, the distance between the signal pairs being enlarged, thereby reducing crosstalk and improving high frequency.

This invention discloses a frequency tuning method and resonator for a quartz crystal tuning fork oscillator. The method includes: a coating step: cleaning the quartz crystal blank and depositing a base metal layer after cleaning; a coarse tuning step: repeatedly printing conductive paste in the tuning area of ​​the tuning fork arm and curing it to form a printed tuning layer, adjusting the frequency of the tuning fork oscillator to a preset frequency range; and a fine tuning step: performing an excitation test to obtain the current frequency F1, using a laser to perform targeted ablation on the printed tuning layer, stopping when the frequency reaches the target value F2, thus completing the frequency tuning of the quartz crystal tuning fork oscillator. This invention adopts a layered coating architecture, abandoning the full vacuum process, and using a stacked structure of "one-time vacuum coating (base conductive / reflective layer) + two-time printed coating (tuning weight-adding layer)," which solves the problem of material waste and achieves nanometer-level precise frequency locking.

The application discloses an electric connector and a connector combination, the electric connector comprising: a plurality of first conductive terminals arranged along the left-right direction, the first conductive terminals having a first contact part, a first connecting part and a first lead-in part connected in sequence, the first contact part being located in front of the first lead-in part, the plurality of first conductive terminals comprising a first terminal group and a second terminal group arranged adjacently, the first terminal group comprising a first differential signal pair and two first ground terminals located on the left and right sides of the first differential signal pair, the second terminal group comprising a second differential signal pair and two second ground terminals located on the left and right sides of the second differential signal pair, the first contact part of the first terminal group being offset on one side in the front-back direction relative to the first contact part of the second terminal group, and the first lead-in part of the first terminal group being offset on the same side in the front-back direction relative to the first lead-in part of the second terminal group, the distance between the differential signal pair and the signal pair being enlarged, so that the crosstalk is reduced, and the effect of improving high frequency is achieved.