This invention discloses a perforated
chip capacitor and its manufacturing method. The
capacitor uses an integral aluminum plate with multiple through holes forming a perforated structure, and at least some of the through holes penetrate the aluminum plate. An
oxide layer is formed on the entire surface of the aluminum plate, including the inner surface of the through holes. The manufacturing method includes:
welding an
anode lead plate to the aluminum plate;
laser drilling the aluminum plate to form through holes;
acid etching to increase the specific surface area;
anodizing to form an
oxide layer; and sequentially forming a
polymer layer, a
graphite layer, and a
silver paste layer. This invention, through its integrated porous aluminum plate structure, replaces the traditional multi-layer laminated structure, effectively improving the problems of high leakage current, poor heat dissipation, and insufficient vibration resistance of multilayer capacitors. It also achieves high specific
capacitance and low ESR, significantly improving the overall performance and reliability of the
capacitor.