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56results about How to "Reduce uneven thickness" patented technology

Display device, display panel and manufacturing method thereof

The invention relates to a display device, a display panel and a manufacturing method thereof. The display panel comprises a substrate, a conducting layer, a grid insulating layer, a grid layer, an interlayer dielectric layer and a wiring layer. The conducting layer is arranged on one side of the substrate; the grid insulating layer is arranged on one side, away from the substrate, of the conducting layer; the grid layer is arranged on one side, away from the substrate, of the grid insulating layer; and the thickness of the grid layer is greater than that of the conducting layer. The grid layer comprises a plurality of gate lines. The gate lines form grooves which extend towards the substrate and cut off the gate lines; the grooves are opposite to the conducting layer; and the broken gatelines at the two sides of the grooves penetrate through the grid insulating layer and are connected with the conducting layer. The interlayer dielectric layer is arranged on one side, away from the substrate, of the grid layer, and covers the conducting layer and fills the grooves; the wiring layer is arranged on the side, away from the substrate, of the interlayer dielectric layer; the wiring layer comprises a plurality of auxiliary electrode wires; and the orthographic projections of the auxiliary electrode wires on the grid layer intersect with the gate wires in the grooves, and the orthographic projections of the intersection parts on the grid layer are completely located in the grooves.
Owner:BOE TECH GRP CO LTD +1

Manufacturing process of crystal diode

The invention relates to a manufacturing process of a crystal diode. The manufacturing process comprises the following steps: (S1) wafer cutting; (S2) wafer assembly, namely putting a wafer lead on a lead track, sequentially grabbing each wafer to put into the wafer lead, and cutting the wafer lead into wafer lead segments of 216-360 products through a segmentation machine, and sequentially putting the wafer lead segments into the lead box; (S3) wire soldering, namely transferring the lead box with the wafer lead segments into a work bench of a wire soldering machine, adjusting the power of the wire soldering machine to be 30-50mW, the pressure to be 250-350mN and the temperature to be 240-320 DEG C, putting each wafer lead segment in the lead box on the wire soldering machine for wire soldering, so as to obtain the wafers with pins; (S4) injection molding; (S5) electroplating; (S6) separating; (S7) testing; and (S8) band loading, namely loading the tested and qualified crystal diodes to a stripped carrier band with a band loading mechanism, and carrying out plastic packaging to obtain the product. The manufacturing process has the advantages that transportation is facilitated in the manufacturing process; the product quality is improved; and classified transportation or storage is facilitated.
Owner:SICHUAN BLUE COLOR ELECTRONICS TECH

Shell of ring-in-ring casting of K4169 high-temperature alloy

The invention relates to a shell of a ring-in-ring casting of K4169 high-temperature alloy. The shell comprises a shell surface layer and a multi-layer type shell back layer. The shell surface layer is formed by shell surface layer slurry and surface layer stuccoing materials in a solidification combination manner. The grain size of zircon powder for preparing the slurry as in the shell surface layer slurry ranges from 300 meshes to 1, 250 meshes. The aggregate of a surface layer stuccoing layer is the zircon powder, and the grain size of the aggregate ranges from 100 meshes to 150 meshes. Theshell back layer is formed by shell back layer slurry and back layer stuccoing materials in a solidification combination manner. The grain size of melted quartz powder and the grain size of melted quartz sand for preparing the slurry as in the shell back layer slurry range from 100 meshes to 1, 250 meshes. The aggregate of the back layer stuccoing layer is the quartz sand with the grain size ranging from 10 meshes to 50 meshes. Because the zircon powder is used as the surface layer slurry of the shell, and the melted quartz with an extremely small expansion coefficient is used as the back layer slurry, the coefficient of thermal expansion of an obtained shell is small, the grain size of used powder is strictly controlled, and the difference between the coefficient of thermal expansion ofthe shell surface layer and the coefficient of thermal expansion of the shell back layer is narrowed down.
Owner:SHANGHAI WANZE PRECISION CASTING CO LTD

A graphite disc base

The invention discloses a graphite plate base, and belongs to the technical field of photoelectrons. The graphite plate base comprises a base body and multiple pockets for growing epitaxial wafers, wherein the pockets comprise a first pocket and multiple second pockets; the first pocket is arranged at the center position of the base body; the second pockets are circumferentially distributed around the center position of the base body; the depth of the first pocket is greater than that of each second pocket; the first pocket is provided with a bottom surface and an annular side wall; and the bottom surface of the first pocket comprises an annular plane connected with the annular side wall of the first pocket and a curved surface located on the bottom surface of the first pocket. By enabling the depth of the first pocket to be greater than that of each second pocket, in an epitaxial wafer growing process, a distance between the epitaxial wafer in the first pocket and a hole, which is used for conveying a raw material, in a cover plate is increased, so that the raw material can be dispersed in the graphite plate base more easily, aggregation of the raw material is avoided, and the problem of non-uniform thickness of the epitaxial wafer growing in the first pocket can be relieved.
Owner:HC SEMITEK ZHEJIANG CO LTD

Multifunctional fitness device and operation method

The invention discloses a multifunctional fitness device and an operation method. The device comprises a bottom plate, an outer roller carrier, an outer roller, a frame, pedals, a first synchronous wheel, a crank, a third synchronous wheel, a second synchronous belt, a fourth synchronous wheel, a distance adjusting seat, a guide rod, a shaft, a second synchronous wheel, a second synchronous wheel hole, a lead screw, a nut, a roller seat, a roller, a connecting rod, a first synchronous belt, a pull belt, a turbine speed reducer, a winding drum, a winding shaft, a transmission shaft, a spring, a rotating shaft and a nut. The outer side of the bottom plate is fixedly connected with a hood, the left side of the bottom plate is fixedly connected with the frame, the middle of the frame is provided with a frame groove, the upper portion of the frame is provided with a pedal hole, the upper portion of the pedal hole is provided with a crank hole, the middle of the pedal hole is provided with a pedal shaft, the pedal shaft penetrates through the pedal hole, the pedal shaft is rotatably connected with the pedal hole and rotates in the pedal hole, and the two sides of the pedal shaft are fixedly connected with the pedals. A first synchronizing wheel is arranged in the middle of the frame groove.
Owner:JIAMUSI UNIVERSITY
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