141results about How to "Reduce the impedance value" patented technology

Techniques are provided for estimating left atrial pressure (LAP) or other cardiac performance parameters based on measured conduction delays. In particular, LAP is estimated based interventricular conduction delays. Predetermined conversion factors stored within the device are used to convert the various the conduction delays into LAP values or other appropriate cardiac performance parameters. The conversion factors may be, for example, slope and baseline values derived during an initial calibration procedure performed by an external system, such as an external programmer. In some examples, the slope and baseline values may be periodically re-calibrated by the implantable device itself. Techniques are also described for adaptively adjusting pacing parameters based on estimated LAP or other cardiac performance parameters. Still further, techniques are described for estimating conduction delays based on impedance or admittance values and for tracking heart failure therefrom.

The invention relates to the technical field of antennas, in particular to a millimeter-wave microstrip array antenna. The millimeter-wave microstrip array antenna comprises a dielectric plate, patch array antennas and a feed network, wherein the dielectric plate comprises a double-layer plate body, and a metal ground is clamped between the two layers of the double-layer plate body; the feed network is a one-to-n path of T-type power dividing circuit, each branch port of the feed network is provided with a feed point, the patch array antennas are arranged in n columns, and central symmetry points of the patch array antennas are provided with coaxial feed probes which penetrate the dielectric plate vertically so as to connect the feed points with the patch array antenna; and on the same column of the patch array antennas, the coaxial feed probes are directly connected between relatively proximate microstrip patches on a group of patch units, and are interconnected between relatively proximate microstrip patches on another group of patch units by means of 180-degree phase shifters. The millimeter-wave microstrip array antenna has the advantages of high gain, low sidelobe and miniaturization, and can effectively realize the high integration and miniaturization requirements of the whole antenna structure.

A matching layer for ultrasound transducers has a gradient in impedance value from one surface to the other surface of the matching layer. The matching layer is composed of a plurality of sublayers made of composite materials and securely attached together and is disposed on the surface of the transducer element. The first sublayer adjacent to the transducer element has an impedance value less than or equal to that of the transducer element. The last sublayer adjacent to the target has an impedance value greater than or equal to that of the target. The impedance values of the sublayers decrease monotonically from the first to the last sublayer.

The present invention relates to a semiconductor package and a method for making the same. The semiconductor package includes a substrate, a first passivation layer, a first metal layer, a second passivation layer, a second metal layer and a third metal layer. The substrate has a surface having at least one first pad and at least one second pad. The first passivation layer covers the surface of the substrate and exposes the first pad and the second pad. The first metal layer is formed on the first passivation layer and is electrically connected to the second pad. The second passivation layer is formed on the first metal layer and exposes the first pad and part of the first metal layer. The second metal layer is formed on the second passivation layer and is electrically connected to the first pad. The third metal layer is formed on the second passivation layer and is electrically connected to the first metal layer.

The invention relates to a manufacturing process of a leakage liquid detection sensor of a circuit formed by utilizing ion sputtering coating. A heat-resistant and corrosion-resistant material is adopted to be taken as a substrate film, an insulating substance coating is formed on the upper surface of the substrate film by utilizing ion sputtering coating process, and two double-conduction lines are fabricated on the insulating coating through adoption of an ion sputtering coating manner; the upper surface of insulating coating is provided with a bonding layer and a protective film layer which are attached to each other; if a uniform conductive film is formed on a surface of the whole body of the substrate film or the insulating coating, film coating is performed after further coverage of a shielding adhesive tape, the shielding adhesive tape is removed after the ion sputtering coating process, and then a conduction line is formed; and a liquid leakage detection device is fabricated. The manufacturing process is advantageous in that various liquids or moisture can be prevented from resulting in corrosion occurring in the conduction line, leakage of a conductive liquid can be accurately detected, and occurrence of false alarms is minimized; reliability of the liquid leakage detection device is improved; and improvement of a bonding force between the film layers is facilitated, the stripping possibility of the upper-layer protective film layer is reduced, and the reject ratio of products is reduced.

The invention discloses a cell electrochemical sensor for analyzing joint toxicity of fungaltoxin, belonging to the fields of analysis and detection of food quality. According to the cell electrochemical sensor, the sensitivity of the sensor is increased by virtue of electroplating gold nanoparticles, an in-vivo physiological living environment of cells is simulated by virtue of laminin, and a three-dimensional model is constructed by virtue of rat tail collagens so as to relatively truly reappear cell morphology; and the constructed cell electrochemical sensor can rapidly and sensitively respond to the influences caused by the fungaltoxin to human hepatoma carcinoma cells, equipment is convenient and rapid and low in production cost, and by combining with an electrochemical resistance value and a joint index method, the type and degree of a joint action of the fungaltoxin can be rapidly judged. The constructed portable cell electrochemical sensor is successfully applied to the toxicity analysis of the fungaltoxin in foods and has good application prospects in the analysis of the joint toxicity of the fungaltoxin.

A method of executing a bag of tasks application in a cluster over a distributed computing system, the cluster having a cluster resource manager. The method includes requesting that the cluster resource manager authorize access by a remote user of the distributed computing system to any idle nodes of the cluster, submitting a bag of tasks slave process to the cluster resource manager, loading the bag of tasks slave process in one of the idle nodes without an allocation operation, sequentially scheduling tasks from the bag of tasks to the bag of tasks slave process, and executing the bag of tasks slave process either until finished or until the node in which the bag of tasks slave process is loaded is required owing to a local allocation request.

An apparatus includes an circuit and a latching micromagnetic switch that controls energy flow through the circuit. The latching micromagnetic switch includes a cantilever, a permanent magnet, and a coil configured to latch the latching micromagnetic switch in one of two positions each time energy passes through the coil. The electrical device and the latching micromagnetic switch can be integrated on a same substrate. Otherwise, the electrical device and the latching micromagnetic switch can be located on separate substrates and coupled together. The circuit can be a transistor or an array of transistors connected in parallel. If the circuit is an array of transistors, there can be an array of the switches, where each one of the switches is coupled to a corresponding one of the transistors. The switches are coupled to at least one of a source, drain, or gate of the corresponding transistor.

The invention discloses a near field communication antenna and a manufacturing method thereof, a display module and a display system, wherein the near field communication antenna comprises a substrate, wherein an annular antenna is arranged on the substrate; the annular antenna comprises a line-crossing area and an annular wire; the annular antenna further comprises a first electrode terminal anda second electrode terminal; the annular wire is connected with the first electrode terminal and the second electrode terminal, so that signals of the annular antenna can reach the second electrode terminal from the first electrode terminal; the annular wire comprises an M1 bottom layer structure and an M2 top layer structure, wherein the M1 bottom layer structure is arranged on the substrate, andthe M2 top layer structure is in contact with the bottom layer structure and is far away from the substrate; and the line-crossing area comprises an M1 bottom layer structure arranged on the substrate, an insulating layer in contact with the bottom layer structure, and an M2 top layer structure in contact with the insulating layer and far from the insulating layer. By virtue of the near field communication antenna and the manufacturing method thereof, the display module and the display system provided by the invention, the problem that the signal transmitting performance of an NFC antenna ofan existing display screen is relatively poor is solved.

A liquid crystal display with metal electrodes is provided. The liquid crystal display includes a first substrate, a plurality of metal electrode layers formed on the first substrate, a plurality of transparent electrode layers formed on the metal electrode layers, and a second substrate coupled to the first substrate with a seal.

The invention relates to a high-power chip flexible interconnection module and a processing method. The invention provides a more advanced surface interconnection technology to replace traditional lead bonding, and aims to solve the problems of reduction of conductivity and bonding strength and the like caused by thermal mismatching and growth of intermetallic compounds in aluminum wire bonding and realize an interconnection technology with lower impedance value, higher thermal conductivity and longer service life. The contact area between flexible copper foil and a surface of the power chip is increased, the uniform distribution condition of heat on the surface of the chip is effectively improved, hot spots on the surface of the chip are reduced, and meanwhile, the current-carrying capacity is improved by 30% compared with that of a lead bonding process. The high-power chip low-loss flexible circuit interconnection technology is of great significance for promoting realization of deployment of a new-generation remote sensing common platform and a high-resolution earth observation satellite in the morning and promoting early application of a wide bandgap semiconductor device in an aerospace electronic product, and also providing a reference for continuous improvement of the performance of a commercial power module.

The present invention provides display unit panel and circuit component structure and manufacturing method. Display unit panel mainly includes substrate and circuit component formed on substrate, wherein said circuit component including first boundary layer and first conducting layer, all formed from copper containing material, the first boundary layer material at least including first conducting layer formed material's reactant or mixture. Said Manufacturing method mainly includes: firstly forming first boundary layer on substrate, forming first conducting layer on first boundary layer, and etching first conducting layer and first boundary layer for forming pattern. Through setting first boundary layer, it can reduce diffusing infiltration substrate status in forming first conducting layer, capable of raising first conducting layer with substrate adhesion strength.

The invention provides a data reading method for a memory cell and a sensitive amplifier used for a multi-level cell (MLC) flash memory. The method comprises the following steps: carrying out primary reading, applying read voltages to the memory cell and a first reference unit, and converting the current generated by the memory unit and the first reference unit into voltages; comparing the voltages of the two; if the preset condition is satisfied, judging the data state of the memory cell, and if not, carrying out secondary reading; lifting or reducing the read voltages applied to the memory cell and the residue (2n-2) numbered reference units except for the first reference unit according to the preset condition, and converting the current generated by the memory cell and the residue (2n-2) numbered reference units into voltages; comparing the voltages of the memory cell and the reference units and judging the data state of the memory cell; and finally outputting data information according to the judged data state. In the invention, the current variation range is small, and the difference between the obtained voltages is relatively stable, thus the data state can be accurately recognized, and the method of the invention has the advantage of reducing the reading time compared with the serial reading method.

A circuit substrate includes a first pair of ground lines, a second pair of ground lines, a plurality of first connection lines, a plurality of second connection lines and a plurality of conductive pillars. The first and second pairs of ground lines are located on first and second surfaces of the substrate, respecteively. The pillars are located in the substrate and vertically conducted between the first pair of ground lines and the second connection lines and between the second pair of ground lines and the first connection lines, and the first and second pairs of ground lines are conducted, so that a 3-D grounding circuit loop is formed. Moreover, a first pair of signal lines is disposed between the first connection lines for grounding and a second pair of signal lines is disposed between the second connection lines for grounding to get a better signal integrity.

The reagent volume dispensed into wells (3) of a test plate (2) is determined by moving an upper electrode (5) of specific profile into each well to an optimum position above the well bottom, by determining the capacitance value of the capacitor formed by the upper electrode in each well and a lower electrode (6) arranged adjacent to the lower outside surface (11) of the test plate below each well, and by comparing the measured capacitance value with reference calibration values.

A combined antenna is composed of a first antenna having directivity in a roof direction, a ground plate grounded as the first antenna and a second antenna having directivity in a horizontal direction. The second antenna as an improved dipole antenna has an upper and a lower arm parts which extend in parallel to the ground plate. At least a part of the ground plate is included in the arm parts of the second antenna.

The invention relates to a lithium ion battery and a preparation method thereof. The lithium ion battery negative electrode active material is an MOF-coated tin disulfide-loaded Mxene composite material, wherein MOF is a metal carbon framework, and Mxene is a material with a two-dimensional layered structure; the MOF and tin disulfide loaded Mxene are compounded to form a double-carbon framework material, and a more stable lithium ion de-intercalation carrier is formed; the MOF is used as a shell frame to provide a lithium ion transmission channel and provide a skeleton supporting effect, tindisulfide is prevented from volume collapse and pulverization in the charging and discharging process, the layered structure has more excellent stability, tin disulfide loading is facilitated, the Li+de-intercalation number is increased, and the specific capacity of tin disulfide can be greatly improved.