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Display device panel structure and producing method thereof

A technology for a display device and a manufacturing method, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, and electrical solid-state devices, etc., can solve the problems of complicated processes, increased time and money costs, and increased product defect rates.

Active Publication Date: 2007-01-03
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the process of the isolation layer 20 often complicates the overall process, resulting in increased time and money costs
In addition, when performing the etching process, due to the difference in materials between the isolation layer 20 and the copper film 30, different etching conditions need to be used for etching, and it is easy to cause etching problems such as residue, which increases the defective rate of the product.

Method used

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  • Display device panel structure and producing method thereof
  • Display device panel structure and producing method thereof
  • Display device panel structure and producing method thereof

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Embodiment Construction

[0039] The invention provides a panel structure of a display device and a manufacturing method thereof. In a preferred embodiment, the panel structure of the display device includes a display panel of a liquid crystal display device; however, in different embodiments, the panel structure of a display device may also include a panel structure of an OLED display device or other display devices.

[0040] figure 2Shown is an embodiment of the panel structure of the display device of the present invention. In this embodiment, the panel structure of the display device mainly includes a substrate 100 and a circuit element 300 . The substrate 100 is preferably a glass substrate formed of glass; however, in different embodiments, the substrate 100 may also be a polymer substrate formed of a polymer, such as a plastic substrate. In addition, the circuit element 300 preferably includes a transistor, such as an amorphous silicon thin-film transistor (a-Si Thin-Film-Transistor, a-Si TFT...

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Abstract

The present invention provides display unit panel and circuit component structure and manufacturing method. Display unit panel mainly includes substrate and circuit component formed on substrate, wherein said circuit component including first boundary layer and first conducting layer, all formed from copper containing material, the first boundary layer material at least including first conducting layer formed material's reactant or mixture. Said Manufacturing method mainly includes: firstly forming first boundary layer on substrate, forming first conducting layer on first boundary layer, and etching first conducting layer and first boundary layer for forming pattern. Through setting first boundary layer, it can reduce diffusing infiltration substrate status in forming first conducting layer, capable of raising first conducting layer with substrate adhesion strength.

Description

technical field [0001] The present invention relates to a display device panel structure and a manufacturing method thereof; in particular, the present invention relates to a display device panel and a structure and a manufacturing method of circuit elements thereon. Background technique [0002] As the times change, the average person's requirements for audio-visual enjoyment are increasing day by day. Especially because of the rapid development of science and technology, all kinds of display devices focus on increasing the area of ​​the output screen. Especially in the field of panel displays, how to increase the size of the display panels has always been the goal of major manufacturers. [0003] As the size of the display panel increases, the resistance value of the traditionally used aluminum or aluminum alloy electrodes no longer meets the requirements. In order to reduce the electrode resistance, it is necessary to use silver or copper as a substitute material in the...

Claims

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Application Information

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IPC IPC(8): H01L29/49H01L29/78H01L23/522H01L21/28H01L21/336H01L21/768
Inventor 林俊男杜国源吴淑芬蔡文庆
Owner AU OPTRONICS CORP
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