Ceramic moulding body, ceramic component, and manufacturing method of ceramic moulding body and ceramic component

A molded body and ceramic technology, which is applied in the direction of electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problem of multi-layering of unsuitable conductor patterns, and achieve the effect of thickening thickness and easy impedance value
CN101353259AActive Publication Date: 2009-01-28NGK INSULATORS LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NGK INSULATORS LTD
Publication Date
2009-01-28

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Abstract

The present invention relates to a ceramic compact, ceramic part, method for porducing ceramic compact, and method for producing ceramicpart. A ceramic compact (10B) having a patterned conductor (12) is obtained by coating the patterned conductor (12) with a slurry (18) and then by hardening the slurry (18). The slurry (18) is prepared by mixing a thermosetting resin precursor, a ceramic powder, and a medium. In the ceramic compact (10B), an isocyanate- or isothiocyanate-containing gelling agent and a hydroxyl-containing polymer are reacted and hardened to produce a thermosetting resin. The hydroxyl-containing polymer is preferably a butyral resin, an ethylcellulose-based resin, a polyethyleneglycol-based resin, or a polyether-based resin.
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Description

technical field

[0001] The present invention relates to a ceramic molded body in which a conductor is embedded, a ceramic component, a method for manufacturing a ceramic molded body, and a method for manufacturing a ceramic component. A method for producing a molded body and a method for producing a ceramic part. Background technique

[0002] In the production of active components using dielectric substrates, the material formed by printing conductive patterns on green sheets containing ceramic powder and resin is laminated and integrated, then molded, and then fired (For example, refer to JP-A-40-19975 and JP-A-2-58816).

[0003] At this time, since the conductive pattern is formed in a convex shape on the printed circuit board, when the printed circuit board is laminated, the pressure does not act on the periphery of the conductive pattern, and peeling occurs after lamination, or the end of the conductive pattern is crushed. Degrades the electrical characteristics of the...

Claims

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