Edge coupling photoelectric device packaging structure and preparation method thereof

Abstract

The invention belongs to the field of photoelectric devices and relates to an edge coupling photoelectric device packaging structure. The edge coupling photoelectric device packaging structure comprises an optical chip, an optical coupling structure block and a transparent resin protection structure block; the edge coupling structure is arranged on the optical chip; the optical coupling structureblock abuts against the side coupling structure; a through hole used for fixing an optical fiber is formed in the optical coupling structure block; the transparent resin protection structure block isarranged between the optical chip and the optical coupling structure block and is used for covering the coupling surface of the optical chip so as to ensure normal light transmission; and the opticalchip, the coupling structure block and the transparent protection resin are all located in a packaging layer. In the use process of the edge coupling photoelectric device packaging structure, it justneeds to directly insert the optical fiber into the through hole so as to be fixed, so that high-precision alignment between the optical fiber and the optical chip can be achieved. The edge couplingphotoelectric device packaging structure has the advantages of passive alignment, simple structure, high precision and easiness in assembling process and mass production.

Description

technical field [0001] The invention relates to the field of optoelectronic devices, in particular to an edge-coupled optoelectronic device packaging structure and a preparation method thereof. Background technique [0002] With the rapid development of various mobile consumer electronic products, mobile consumer electronic products have higher and higher requirements on the quality of network communication speed and delay, and optical communication technology satisfies the corresponding requirements well. Among them, in the silicon In the photosynthetic photoelectric integrated system, in order to meet the requirements of long-distance, high-bandwidth, and high-quality signal transmission, single-mode laser transmission technology is usually required. [0003] Single-mode laser transmission technology has the advantages of long-distance, high-bandwidth, and high-quality signal transmission, but the mode spot of single-mode laser is small, and its radius is only within 10 μm...

AI Technical Summary

Problems solved by technology

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defects of high equipment investment cost, low efficiency, low yield, and unsuitability for mass production of optoelectronic devices in the active coupling alignment method in the prior art, thereby providing an edge Coupled optoelectronic device packaging structure and preparation method thereof

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