Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component including: a body having first and second surfaces opposite to each other in a first direction, third and fourth surfaces opposite to each other in a second direction, and fifth and sixth surfaces opposite to each other in a third direction, the main body comprises a capacitor forming part and a covering part, and the capacitor forming part comprises a dielectric layer and an inner electrode; and an external electrode. When maximum sizes of the multilayer electronic component in the first direction, the second direction, and the third direction are L, W, and T, respectively, and average sizes of the cover portion, the dielectric layer, and the inner electrode in the first direction are tc, td, and te, respectively, 0.75 mm < = L < = 1.25 mm, 0.25 mm < = W < = 0.75 mm, and Tlt are satisfied; 28 [mu] m < = tc < = 34 [mu] m, 0.4 [mu] m < = td < = 0.5 [mu] m, and 0.4 [mu] m < = te < = 0.5 [mu] m.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0132660 filed on October 5, 2023 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to a multi-layer electronic assembly. Background Art

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) are chip capacitors that are mounted on printed circuit boards of various types of electronic products, such as imaging devices (including liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones, and mobile phones, and used to charge or discharge them. Multilayer ceramic capacitors are used as components of various electronic devices because they have a small size, ensure high capacitance, and are easy to mount.

[0004] According to the demand for miniaturization of multilayer ceramic capacitors and realization of high capacitance, research has been conducted to reduce the size of MLCCs while increasing the capacitance of the MLCCs.

[0005] The size of a commonly used MLCC may be 1005 (length: about 1.0 mm, width: about 0.5 mm), and a 1005-size MLCC may be mainly installed in small information technology (IT) products. Currently, a 1005-size MLCC generally has a thickness of about 0.5 mm, but the thickness has been increased to 0.65 mm to 0.75 mm to achieve the effective capacitance required by customers. However, as electronic components in which MLCCs are installed are miniaturized, it is necessary to control the thickness of MLCCs to less than 0.5 mm.

[0006] However, since the MLCC has a small size, it may be more susceptible to chipping or cracking occurring at the edge of the body of the MLCC. When such chipping or cracking occurs in the body of the MLCC, the MLCC may have reduced reliability due to penetration of plating solution or external moisture.

[0007] Therefore, it is necessary to study the design structure of MLCC that can miniaturize MLCC while preventing the occurrence of chipping and cracks to ensure reliability and achieve the capacitance required by customers. Summary of the invention

[0008] One aspect of the present disclosure provides a multilayer electronic component having excellent capacitance per unit volume and reliability.

[0009] However, aspects of the present disclosure are not limited to those set forth herein and will be more readily understood in the course of describing specific example embodiments of the present disclosure.

[0010] According to one aspect of the present disclosure, a multilayer electronic component is provided. The multilayer electronic component includes: a main body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction. The main body includes a capacitance forming portion and a covering portion. The capacitance forming portion includes a dielectric layer and inner electrodes alternately arranged with the dielectric layer in the first direction. The covering portion is disposed on two surfaces of the capacitance forming portion opposite to each other in the first direction; and outer electrodes disposed on the third surface and the fourth surface. When the maximum dimension of the multilayer electronic component in the second direction is L, the maximum dimension of the multilayer electronic component in the third direction is W, the maximum dimension of the multilayer electronic component in the first direction is T, the average dimension of the covering portion in the first direction is tc, the average dimension of the dielectric layer in the first direction is td, and the average dimension of the inner electrode in the first direction is te, 0.75 mm ≤ L ≤ 1.25 mm, 0.25 mm ≤ W ≤ 0.75 mm, T < 0.5 mm, 28 μm ≤ tc ≤ 34 μm, 0.4 μm ≤ td ≤ 0.5 μm, and 0.4 μm ≤ te ≤ 0.5 μm can be satisfied.

[0011] According to one aspect of the present disclosure, a multilayer electronic component is provided. The multilayer electronic component includes: a main body including a capacitance forming portion and a covering portion. The capacitance forming portion includes a dielectric layer and inner electrodes alternately arranged with the dielectric layer in the thickness direction. The covering portion is disposed on opposite surfaces of the capacitance forming portion in the thickness direction; side edge portions disposed on opposite surfaces of the main body in the width direction; and outer electrodes disposed on opposite surfaces of the main body and the side edge portions in the length direction, wherein the thickness T of the multilayer electronic component in the thickness direction, the average dimension tc of the covering portion in the thickness direction, and the average dimension wm of the side edge portions in the width direction satisfy the following relationship: 0.056 < tc / T < 0.068, and 0.028 ≤ wm / T < 0.042.

[0012] According to an exemplary embodiment of the present disclosure, the multilayer electronic component can have excellent capacitance per unit volume and reliability. Description of the Drawings

[0013] By combining the accompanying drawings and the following detailed description, the above and other aspects, features, and advantages of the present disclosure will be more clearly understood. In the drawings: Figure 1is a schematic perspective view of a multilayer electronic assembly according to an example embodiment of the present disclosure; Figure 2 yes Figure 1 A schematic exploded perspective view of the main body and side edge portions of FIG. Figure 3 is along Figure 1 A schematic cross-sectional view taken along line II' of ; Figure 4 is along Figure 1 A schematic cross-sectional view taken along line II-II'; and Figures 5 to 7 is a schematic perspective view of a method of manufacturing a multilayer electronic component according to an example embodiment of the present disclosure. DETAILED DESCRIPTION

[0014] Hereinafter, example embodiments of the present disclosure are described with reference to the accompanying drawings. However, the present disclosure may be illustrated in many different forms and should not be construed as being limited to the specific example embodiments set forth herein. In addition, example embodiments of the present disclosure may be provided to more fully describe the present disclosure to those skilled in the art. Therefore, for clarity of description, the shapes and sizes of the elements in the accompanying drawings may be exaggerated, and the elements represented by the same reference numerals in the accompanying drawings may be the same elements.

[0015] In order to clearly illustrate the present disclosure, parts irrelevant to the description are omitted, and the size (e.g., thickness) is exaggerated to clearly indicate layers and regions, and similar parts having the same function within the same scope are represented by similar reference numerals throughout the specification. Throughout the specification, unless otherwise specifically stated, when an element is referred to as "comprising" or "including", it means that the element may also include other elements without excluding other elements.

[0016] In the drawings, a first direction may be defined as a thickness direction, a second direction may be defined as a length direction, and a third direction may be defined as a width direction.

[0017] Multilayer electronic components Figure 1 is a schematic perspective view of a multilayer electronic assembly according to an example embodiment of the present disclosure.

[0018] Figure 2 yes Figure 1 Schematic exploded perspective view of the main body and side edge parts.

[0019] Figure 3 is along Figure 1 Schematic cross-sectional view taken along line II'.

[0020] Figure 4 is along Figure 1Schematic cross-sectional view taken along line II-II'.

[0021] In the following, reference will be made to Figures 1 to 4 A multilayer electronic component 100 according to an exemplary embodiment of the present disclosure is described in detail. In addition, a multilayer ceramic capacitor is described as an example of a multilayer electronic component, but the present disclosure is not limited thereto and may be applied to various electronic products such as inductors, piezoelectric elements, varistors, thermistors, etc.

[0022] The multilayer electronic component 100 according to the example embodiment of the present disclosure may have a size of 1005 (length: 1.0 mm ± 0.25 mm, width: 0.5 mm ± 0.25 mm). That is, when the maximum dimension of the multilayer electronic component 100 in the second direction is L and the maximum dimension of the multilayer electronic component 100 in the third direction is W, 0.75 mm ≤ L ≤ 1.25 mm and 0.25 mm ≤ W ≤ 0.75 mm may be satisfied. Depending on the accuracy of the manufacturing process, 0.85 mm ≤ L ≤ 1.15 mm and 0.35 mm ≤ W ≤ 0.65 mm may be satisfied, but the present disclosure is not limited thereto.

[0023] The multilayer electronic component 100 may include a body 110 including a dielectric layer 111 and internal electrodes 121 and 122 , and external electrodes 131 and 132 .

[0024] The specific shape of the main body 110 is not particularly limited. Figure 1 and Figure 2 As shown, the body 110 may have a hexahedral shape or a shape similar to the hexahedral shape. During the sintering process, the ceramic powder included in the body 110 may shrink, or the edge portion of the body 110 may be polished, so that the body 110 may not have a hexahedral shape having perfect straight lines, but may generally have a hexahedral shape.

[0025] The body 110 may have a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and opposite to each other in a third direction.

[0026] The body 110 may include dielectric layers 111 and internal electrodes 121 and 122 alternately disposed with the dielectric layers 111. The plurality of dielectric layers 111 included in the body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other so that boundaries therebetween are not easily recognized without using a scanning electron microscope (SEM).

[0027] The dielectric layer 111 may include, for example, a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 may be, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which calcium (Ca) and / or zirconium (Zr) is partially solid-solved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0028] The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122 that are alternately arranged in a first direction, and the dielectric layer 111 is located therebetween. The first inner electrode 121 and the second inner electrode 122 may be electrically isolated from each other by the dielectric layer 111 interposed therebetween.

[0029] The first inner electrode 121 may be arranged to be exposed from the third surface 3, spaced apart from the fourth surface 4, and extend to the fifth surface 5 and the sixth surface 6. The second inner electrode 122 may be arranged to be exposed from the fourth surface 4, spaced apart from the third surface 3, and extend to the fifth surface 5 and the sixth surface 6.

[0030] The conductive metal included in the inner electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and their alloys, and more preferably, the conductive metal included in the inner electrodes 121 and 122 may be Ni, but the present disclosure is not limited thereto.

[0031] The main body 110 may include a capacitance forming portion Ac and covering portions 112 and 113. The capacitance forming portion Ac includes the dielectric layer 111 and the inner electrodes 121 and 122 that are alternately arranged with the dielectric layer 111 in a first direction. The covering portions 112 and 113 are respectively arranged on two surfaces of the capacitance forming portion Ac that face each other in the first direction. The capacitance forming portion Ac may be arranged within the main body 110, and the first inner electrode 121 and the second inner electrode 122 may be alternately arranged with the dielectric layer 111 interposed between the first inner electrode 121 and the second inner electrode 122 to form the capacitance of the multilayer electronic component 100.

[0032] The covering parts 112 and 113 may include a first covering part 112 and a second covering part 113 respectively provided on two surfaces of the capacitance forming part Ac opposite to each other in the first direction, and the covering parts 112 and 113 may be mainly used to prevent damage to the internal electrodes caused by physical stress or chemical stress. The covering parts 112 and 113 may have the same configuration as that of the dielectric layer 111 except that the internal electrodes 121 and 122 are not included.

[0033] The side edge portions 141 and 142 may be disposed on the fifth surface 5 and the sixth surface 6 of the multilayer electronic component 100 according to the example embodiment of the present disclosure. Specifically, the multilayer electronic component 100 may include a first side edge portion 141 disposed on the fifth surface 5 and a second side edge portion 142 disposed on the sixth surface 6. The side edge portions 141 and 142 may be used to prevent damage to the internal electrodes 121 and 122 caused by physical stress or chemical stress. The side edge portions 141 and 142 may have a configuration similar to that of the dielectric layer 111 except that the internal electrodes 121 and 122 are not included. That is, the side edge portions 141 and 142 may include a perovskite compound represented by ABO3 as a main component.

[0034] The external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4, respectively, and may extend to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and / or a portion of the sixth surface 6. The external electrodes 131 and 132 may include a first external electrode 131 connected to the first internal electrode 121 and a second external electrode 132 connected to the second internal electrode 122.

[0035] The external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110 , and each may include a base electrode layer connected to the internal electrodes 121 and 122 and a plating layer disposed on the base electrode layer.

[0036] The substrate electrode layer may include metal and glass. The metal included in the substrate electrode layer may be used to ensure electrical connectivity, and the glass included in the substrate electrode layer may be used to improve the bonding strength with the body 110. The metal included in the substrate electrode layer may include Cu, Ni, Pd, Pt, Au, Ag, Pb, and / or alloys thereof, but the present disclosure is not limited thereto.

[0037] The plating layer can improve the mounting performance. The type of the plating layer is not particularly limited, and can be a plating layer including Ni, Sn, Pd and / or an alloy thereof, and can be formed by multiple layers. The plating layer can be, for example, a Ni plating layer or a Sn plating layer, or can be a Ni plating layer and a Sn plating layer formed in sequence. In addition, the plating layer can also include multiple Ni plating layers and / or multiple Sn plating layers.

[0038] Although the drawings illustrate a structure in which the multilayer electronic component 100 has two external electrodes 131 and 132 , the present disclosure is not limited thereto, and the number or shape of the external electrodes 131 and 132 may vary according to the shapes of the internal electrodes 121 and 122 or other purposes.

[0039] According to an example embodiment of the present disclosure, when the average size of each of the covering parts 112 and 113 in the first direction is tc, 28μm≤tc≤34μm may be satisfied. Here, the average size tc of each of the covering parts 112 and 113 in the first direction may refer to the average size of each of the first covering part 112 and the second covering part 113 in the first direction.

[0040] According to research, the critical force for fragmentation (P C ) can be compared with t×h 3 / 2 (t: toughness of ceramic included in the body 110, h: straight-line distance from the outer surface of the body 110 to the capacitance forming portion Ac). A small component with a size of 1005 and a relatively small h value may be structurally susceptible to a defect of chipping at the edge of the body 110. When chipping occurs, plating solution or external moisture may penetrate into the capacitance forming portion Ac, resulting in reduced reliability of the multilayer electronic component 100.

[0041] In contrast, in the exemplary embodiment of the present disclosure, tc may satisfy 28 μm or more, so that the distance that the external impact reaches the capacitance forming portion Ac may be increased, thereby preventing chipping or cracking from occurring in the body 110. In the case of a small component having a size of 1005 (0.75 mm ≤ L ≤ 1.25 mm and 0.25 mm ≤ W ≤ 0.75 mm), tc may preferably be 34 μm or less in order to achieve the target capacitance of the multilayer electronic component 100.

[0042] In order to achieve miniaturization of the multilayer electronic component 100, the maximum dimension T in the first direction of the multilayer electronic component 100 may be limited. When tc is 28 μm or more within the limited T value, the dimension of the capacitance forming part Ac in the first direction may inevitably be reduced, and thus the multilayer electronic component 100 may have reduced capacitance.

[0043] According to an exemplary embodiment of the present disclosure, when the average size of the dielectric layer 111 in the first direction is td, 0.4 μm ≤ td ≤ 0.5 μm may be satisfied. In the multilayer electronic component 100 according to an exemplary embodiment of the present disclosure, td may satisfy 0.5 μm or less, so that the thickness of the dielectric layer 111 may be reduced. As a result, even when the size of the capacitance forming portion Ac in the first direction is reduced, the target capacitance of the multilayer electronic component 100 may be achieved. When the thickness of the dielectric layer 111 is excessively reduced, the breakdown voltage of the multilayer electronic component 100 may be reduced, so that td may preferably be 0.4 μm or more.

[0044] As described above, in order to achieve miniaturization of the multilayer electronic component 100, the maximum dimension T in the first direction of the multilayer electronic component 100 may be limited. When tc is 28 μm or more within the limited T value, the dimension of the capacitance forming portion Ac in the first direction may be inevitably reduced, so that the multilayer electronic component 100 may have a reduced effective capacitance.

[0045] Therefore, according to an example embodiment of the present disclosure, when the average size of each of the internal electrodes 121 and 122 in the first direction is te, 0.4μm≤te≤0.5μm may be satisfied. In the multilayer electronic component 100 according to an example embodiment of the present disclosure, te may satisfy 0.5μm or less, so that the thickness of each of the internal electrodes 121 and 122 may be reduced. As a result, even when the size of the capacitance forming part Ac in the first direction is reduced, the target capacitance of the multilayer electronic component 100 may be achieved. When the thickness of each of the internal electrodes 121 and 122 is excessively reduced, the breakdown voltage of the multilayer electronic component 100 may be reduced, so that td may preferably be 0.4μm or more.

[0046] In order to realize capacitance of the multilayer electronic component 100 , the number of layers of the internal electrodes 121 and 122 may be 400 layers or more, but the present disclosure is not limited thereto.

[0047] The thickness of each of the side edge portions 141 and 142 is not particularly limited. However, when the average size of each of the side edge portions 141 and 142 in the third direction is wm, 13μm≤wm≤21μm may be satisfied. Here, the average size wm of each of the side edge portions 141 and 142 in the third direction may refer to the average size of each of the first side edge portion 141 and the second side edge portion 142 in the third direction.

[0048] As described above, since a small component with a size of 1005 may be susceptible to a chipping defect, wm may preferably be 13 μm or more. As a result, the distance for an external impact to reach the capacitor forming portion Ac can be increased, thereby suppressing the occurrence of a chipping defect. In order to achieve the target capacitance of the multilayer electronic component 100, for a small component with a size of 1005, wm may preferably be 21 μm or less.

[0049] In the prior art, the side edge portion may have a thickness that varies greatly depending on the position. Specifically, in the prior art, the thickness of the portion of the first side edge portion or the second side edge portion corresponding to the central area of ​​the main body in the first direction may be formed to be greater than the thickness of other portions. As described, when the side edge portion has a thickness that varies greatly depending on the position, the portion occupied by the side edge portion may increase compared to a multilayer electronic component of the same size, so that a relatively large size of the capacitor forming portion may not be ensured, resulting in a reduction in the capacitance per unit volume of the multilayer electronic component. However, the multilayer electronic component 100 (a small component with a size of 1005) according to an example embodiment of the present disclosure may be designed to ensure maximum capacitance per unit volume.

[0050] In the multilayer electronic component 100 according to the exemplary embodiment of the present disclosure, as will be described below, the side edge portions 141 and 142 may be formed by bringing the side edge portion sheet into close contact with the two surfaces of the main body in the third direction and pressing the resulting structure, so that the thickness of each of the side edge portions 141 and 142 may vary according to the position less than the thickness of the side edge portion according to the prior art. For example, the ratio w2 / w1 of the dimension w2 of the portion of the first side edge portion 141 or the second side edge portion 142 in the third direction that contacts the end of the outermost internal electrode 121 or 122 in the first direction to the dimension w1 of the portion of the first side edge portion 141 or the second side edge portion 142 corresponding to the central area of ​​the main body 110 in the first direction in the third direction may satisfy greater than or equal to 0.9 and less than or equal to 1.0. For example, w2 and w1 may be the minimum size and the maximum size of the first side edge portion 141 or the second side edge portion 142 in the third direction, respectively, and therefore, the ratio of the minimum size of the first side edge portion 141 or the second side edge portion 142 in the third direction to the maximum size of the first side edge portion 141 or the second side edge portion 142 in the third direction may be in the range of 0.9 to 1.0. When w2 / w1 satisfies the above range, the size of each of the side edge portions 141 and 142 in the third direction may be reduced, thereby improving the capacitance per unit volume of the multilayer electronic component 100.

[0051] In addition, as the size of each of the side edge portions 141 and 142 in the third direction decreases, the ratio tc / wm of tc to wm can be 2.0 or greater. The upper limit of tc / wm is not particularly limited, but can be, for example, 2.25.

[0052] For a multilayer electronic component with dimensions of 1005 (length: 1.0 mm ± 0.25 mm, width: 0.5 mm ± 0.25 mm) according to the prior art, the maximum dimension T in the first direction can be approximately equal to the maximum dimension W in the third direction of the multilayer electronic component. Optionally, the number of internal electrodes can be increased to achieve the target capacitance, such that the maximum dimension T in the first direction of the multilayer electronic component can be greater than the maximum dimension W in the third direction of the multilayer electronic component.

[0053] Compared with the case where T is approximately equal to or greater than W according to the prior art, when T is less than W, it may be advantageous in terms of miniaturization, but may be disadvantageous in terms of preventing fragmentation defects and ensuring effective capacitance. On the contrary, according to an exemplary embodiment of the present disclosure, even when T is less than W, 28 μm ≤ tc ≤ 34 μm, 0.4 μm ≤ td ≤ 0.5 μm, and / or 0.4 μm ≤ te ≤ 0.5 μm can be satisfied, thereby preventing fragmentation defects and ensuring the capacitance of the multilayer electronic component 100. Therefore, in the exemplary embodiment of the present disclosure, T < W can be satisfied to miniaturize the multilayer electronic component 100. More specifically, T can satisfy T < 0.5 mm. According to an exemplary embodiment of the present disclosure, even when T is less than 0.5 mm, the multilayer electronic component 100 can have a capacitance of 12 μF or greater.

[0054] More preferably, L can satisfy 1.0 mm ≤ L ≤ 1.15 mm, W can satisfy 0.55 mm < W ≤ 0.65 mm, and T can satisfy 0.46 mm ≤ T < 0.5 mm. Considering the manufacturing process or effective capacitance of the multilayer electronic component 100, the ratio T / W of T to W can be greater than or equal to 0.70 and less than 0.85, but the present disclosure is not limited thereto.

[0055] In order to prevent fragmentation defects and achieve the capacitance of the multilayer electronic component 100, the ratio tc / T of tc to T can satisfy 0.056 < tc / T < 0.068, and the ratio wm / T of wm to T can satisfy 0.028 ≤ wm / T < 0.042.

[0056] In example embodiments, when the average distance between the third surface 3 and the second inner electrode 122 in the second direction is L1, 30 μm ≤ L1 ≤ 50 μm may be satisfied. In the case of a small component having a size of 1005, when L1 is less than 30 μm, it may be difficult to stably ensure insulation between the second inner electrode 122 and the first outer electrode 131. When L1 is greater than 50 μm, the area of ​​the capacitance forming portion Ac may be reduced, making it difficult to achieve the target capacitance of the multilayer electronic component 100.

[0057] When the average distance between the fourth surface 4 and the first internal electrode 121 in the second direction is L2, 30 μm≤L2≤50 μm may be satisfied.

[0058] Hereinafter, an example of a method of measuring tc, td, te, L1, L2, and wm will be described.

[0059] First, the average size tc of each of the covering parts 112 and 113 in the first direction can be obtained by scanning the cross section of the body 110 in the first direction and the second direction with an SEM. For example, tc can be obtained by measuring the size of each of the covering parts 112 and 113 in the first direction at a plurality of points of each of the covering parts 112 and 113 (for example, five points equally spaced from each other in the second direction), and then calculating the average value of the size in the first direction.

[0060] For example, the average size td of the dielectric layer 111 in the first direction and the average size te of each of the internal electrodes 121 and 122 in the first direction can be obtained by scanning the cross section of the body 110 in the first direction and the second direction with a SEM at a magnification of 10000. More specifically, td can be obtained by measuring the size of one dielectric layer 111 in the first direction at a plurality of points of the dielectric layer 111 (for example, thirty points equally spaced from each other in the second direction), and calculating the average value of the size in the first direction. te can be obtained by measuring the size of each of the internal electrodes 121 and 122 in the first direction at a plurality of points of each of the internal electrodes 121 and 122 (for example, thirty points equally spaced from each other in the second direction), and calculating the average value of the size in the first direction. Thirty points equally spaced from each other can be specified in the capacitance forming portion Ac. In addition, when such average value calculation is performed for ten dielectric layers 111 and ten internal electrodes 121 and 122, td and te can be more generalized.

[0061] For example, the average distance L1 between the third surface 3 and the second internal electrode 122 in the second direction can be obtained as follows: Scanning the cross-section of the main body 110 in the first and second directions with an SEM, then measuring the distances between ten or more second internal electrodes 122 spaced apart from each other by five dielectric layers or more dielectric layers and the third surface 3 in the second direction, and then calculating the average value thereof. In the same manner, for example, the average distance L2 between the fourth surface 4 and the first internal electrode 121 in the second direction can be obtained as follows: Scanning the cross-section of the main body 110 in the first and second directions with an SEM, then measuring the distances between ten or more first internal electrodes 121 spaced apart from each other by five dielectric layers or more dielectric layers and the fourth surface 4 in the second direction, and then calculating the average value thereof.

[0062] For example, the average dimension wm in the third direction of each of the side edge portions 141 and 142 can be obtained as follows: Scanning the cross-section of the multilayer electronic component 100 passing through the center of the main body 110 in the second direction in the first and third directions with an SEM, measuring the dimensions in the third direction of each of the side edge portions 141 and 142 at a plurality of points (for example, five points equally spaced from each other in the first direction) in each of the side edge portions 141 and 142, and then calculating the average value of the dimensions in the third direction.

[0063] Figures 5 to 7 is a schematic perspective view of a method for manufacturing a multilayer electronic component according to an exemplary embodiment of the present disclosure. Hereinafter, reference will be made to Figures 5 to 7 Describe an example of a method for manufacturing the above-mentioned multilayer electronic component 100.

[0064] A ceramic slurry including ceramic powder, an organic solvent, and a binder can be prepared, and the ceramic slurry can be coated and dried on a carrier film to prepare a green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained using it. For example, barium titanate-based materials, lead composite perovskite-based materials, or strontium titanate-based materials can be used for the ceramic powder. Examples of the ceramic powder may include (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1) obtained by partially solid-solubilizing Ca and / or Zr in BaTiO3.

[0065] Then, if Figure 5 As shown, first and second ceramic green sheets 211a and 211b for forming the capacitance forming portion Ac and first and second covering portion sheets 212 and 213 for forming the covering portions 112 and 113 may be stacked to manufacture a ceramic laminate.

[0066] A first internal electrode pattern 221 for forming a first internal electrode 121 may be formed on the first ceramic green sheet 211a, and a second internal electrode pattern 222 for forming a second internal electrode 122 may be formed on the second ceramic green sheet 211b. Specifically, a plurality of first internal electrode patterns 221 disposed at predetermined intervals may be formed on the first ceramic green sheet 211a. The plurality of first internal electrode patterns 221 have a strip shape and may be formed to be parallel to each other. In addition, a plurality of second internal electrode patterns 222 disposed at predetermined intervals may be formed on the second ceramic green sheet 211b. The plurality of second internal electrode patterns 222 may have a strip shape and may be formed to be parallel to each other. The internal electrode patterns 221 and 222 may be formed by printing a conductive paste for internal electrodes including metal powder, a binder, a solvent, etc. using a screen printing method, a gravure printing method, or the like.

[0067] The cover sheets 212 and 213 may have a configuration similar to that of the ceramic green sheets 211 a and 211 b . However, the internal electrode patterns are not formed on the cover sheets 212 and 213 .

[0068] Subsequently, the manufactured ceramic laminate may be pressed and then cut along cutting lines C1 and C2. Specifically, the ceramic laminate may be cut along a plurality of first cutting lines C1 parallel to the second direction and a plurality of second cutting lines C2 parallel to the third direction. The cutting lines C1 and C2 may intersect the first and second internal electrode patterns 221 and 222.

[0069] As a result, it is possible to produce Figure 6 The multilayer sheet 210 is shown. The multilayer sheet 210 may include ceramic green sheets 211 and cut first and second internal electrode patterns 221 and 222 alternately disposed with the ceramic green sheets 211. In addition, the multilayer sheet 210 may include cover sheet 212 and 213 for forming the cover 112 and 113.

[0070] Subsequently, the side edge sheets 241 and 242 for forming the side edge portions 141 and 142 may be pressed and brought into contact with the two surfaces of the multilayer sheet 210 in the third direction. Thereafter, the multilayer sheet 210 to which the side edge sheets 241 and 242 are attached may be sintered to form the body 110 and the side edge portions 141 and 142. The sintering temperature is not particularly limited. For example, the sintering may be performed at a temperature greater than or equal to 1100° C. and less than or equal to 1300° C. In addition, before sintering the multilayer sheet 210, an adhesive removal process, a drum polishing process, etc. may be performed as needed.

[0071] Subsequently, the external electrodes 131 and 132 may be formed. First, the body 110 on which the side edge portions 141 and 142 are formed may be dipped in a conductive paste including metal powder and glass, and then sintered to form a base electrode layer. Thereafter, a plating layer may be formed on the base electrode layer. The method of forming the plating layer is not particularly limited. For example, an electrolytic plating method and / or an electroless plating method may be used.

[0072] However, the above-described manufacturing method is an example, and the method of manufacturing the multilayer electronic component 100 is not limited to the above-described manufacturing method.

[0073] In addition, the term "exemplary embodiment" as used herein does not refer to the same exemplary embodiment, but is provided to emphasize a specific feature or characteristic that is different from a specific feature or characteristic of another exemplary embodiment. However, the exemplary embodiments provided herein are considered to be able to be implemented by combining with each other in whole or in part. For example, unless an opposite or contradictory description is provided in another exemplary embodiment, an element described in a specific exemplary embodiment, even if not described in another exemplary embodiment, can also be understood as a description related to another exemplary embodiment.

[0074] As used herein, the terms "first," "second," etc. may be used to distinguish a component from another component, and may not limit the order and / or importance associated with the components, etc. In some cases, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component, without departing from the scope of example embodiments.

[0075] While example embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a main body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction, the main body comprising a capacitor forming part and a covering part, the capacitor forming part comprising a dielectric layer and inner electrodes alternately arranged with the dielectric layer in the first direction, the covering part being arranged on two surfaces of the capacitor forming part opposite to each other in the first direction; as well as external electrodes, disposed on the third surface and the fourth surface, Wherein, when the maximum dimension of the multilayer electronic component in the second direction is L, the maximum dimension of the multilayer electronic component in the third direction is W, the maximum dimension of the multilayer electronic component in the first direction is T, the average dimension of the covering part in the first direction is tc, the average dimension of the dielectric layer in the first direction is td, and the average dimension of the internal electrode in the first direction is te, 0.75mm≤L≤1.25mm, 0.25mm≤W≤0.75mm, T<0.5mm, 28μm≤tc≤34μm, 0.4μm≤td≤0.5μm and 0.4μm≤te≤0.5μm are satisfied.

2. The multilayer electronic component of claim 1, wherein: Meet T <W。 3. The multilayer electronic component according to claim 1, further comprising side edge portions provided on the fifth surface and the sixth surface of the body, in, The internal electrode includes a first internal electrode and a second internal electrode, the first internal electrode and the second internal electrode are alternately arranged in the first direction and the dielectric layer is interposed between the first internal electrode and the second internal electrode, The first inner electrode is disposed to be exposed from the third surface and extend to the fifth surface and the sixth surface, and The second internal electrode is disposed to be exposed from the fourth surface and to extend to the fifth surface and the sixth surface.

4. The multilayer electronic component of claim 3, wherein: When the average dimension of the side edge portion in the third direction is wm, 13 μm≤wm≤21 μm is satisfied.

5. The multilayer electronic component of claim 1, wherein: The internal electrode includes a first internal electrode and a second internal electrode, the first internal electrode and the second internal electrode are alternately arranged in the first direction and the dielectric layer is interposed between the first internal electrode and the second internal electrode, The first inner electrode is disposed to be exposed from the third surface and spaced apart from the fourth surface, and the second inner electrode is disposed to be exposed from the fourth surface and spaced apart from the third surface, and When an average distance between the third surface and the second internal electrode in the second direction is L1, 30 μm≤L1≤50 μm is satisfied.

6. The multilayer electronic component of claim 1, wherein: The capacitance of the multilayer electronic component is 12 μF or greater.

7. The multilayer electronic component of claim 4, wherein: The ratio of the minimum dimension of the side edge portion in the third direction to the maximum dimension of the side edge portion in the third direction is in the range of 0.9 to 1.

0.

8. The multilayer electronic component of claim 3, wherein: The ratio tc / wm of the average dimension tc of the covering portion in the first direction to the average dimension wm of the side edge portion in the third direction is in the range of 2.0 to 2.

25.

9. The multilayer electronic component of claim 1, wherein: Satisfy 0.056 < tc / T < 0.

068.

10. The multilayer electronic component of claim 4, wherein: Satisfy 0.028 ≤ wm / T < 0.

042.

11. The multilayer electronic component of claim 2, wherein: Satisfy 0.70 ≤ T / W < 0.

85.

12. The multilayer electronic component of claim 1, wherein: Satisfy 1.0 mm ≤ L ≤ 1.15 mm, satisfy 0.55 mm < W ≤ 0.65 mm, and satisfy 0.46 mm ≤ T < 0.5 mm.

13. A multilayer electronic component, comprising: A main body, including a capacitor forming portion and a covering portion, the capacitor forming portion includes a dielectric layer and inner electrodes alternately arranged with the dielectric layer in the thickness direction, and the covering portion is provided on the opposite surface of the capacitor forming portion in the thickness direction; Side edge portions, provided on the opposite surfaces of the main body in the width direction; And External electrodes, provided on the opposite surfaces of the main body and the side edge portions in the length direction, wherein, the thickness T of the multilayer electronic component in the thickness direction, the average dimension tc of the covering portion in the thickness direction, and the average dimension wm of the side edge portion in the width direction satisfy the following relationships: 0.056 < tc / T < 0.068, and 0.028 ≤ wm / T < 0.

042.

14. The multilayer electronic component of claim 13, wherein: T is less than 0.5 mm, and The ratio of the minimum dimension of the side edge portion in the width direction to the maximum dimension of the side edge portion in the width direction is in the range of 0.9 to 1.

0.

15. The multilayer electronic component of claim 13, wherein: tc / wm is in the range of 2.0 to 2.

25.

16. The multilayer electronic component of claim 13, wherein: The length L of the multilayer electronic component in the length direction satisfies 0.75 mm ≤ L ≤ 1.25 mm, the width W of the multilayer electronic component in the width direction satisfies 0.25 mm ≤ W ≤ 0.75 mm, and the average dimension tc of the covering portion in the thickness direction satisfies 28 μm ≤ tc ≤ 34 μm.

17. The multilayer electronic component of claim 13, wherein: The average dimension te of the inner electrode in the thickness direction satisfies 0.4 μm ≤ te ≤ 0.5 μm, and The average dimension td of the dielectric layer in the thickness direction satisfies 0.4 μm ≤ td ≤ 0.5 μm.

18. The multilayer electronic assembly of claim 13, wherein: The average dimension wm of the side edge portion in the width direction satisfies 13 μm ≤ wm ≤ 21 μm.

Images