Test sorting machine and chip test sorting method

Abstract

The invention discloses a testing and sorting machine and a chip testing and sorting method with the testing and sorting machine, the testing and sorting machine comprises a workbench, two conveying discs, a testing seat, a moving mechanism, a material taking mechanism and an amplifying mechanism, and the conveying discs can reciprocate on the workbench in the first direction; the testing seat is arranged on the workbench and is arranged at one end of a moving path of the conveying disc; the moving mechanism is transversely arranged above the conveying disc and can move in a reciprocating mode in the first direction. The material taking mechanism is arranged on the moving mechanism in a sliding mode, the material taking mechanism reciprocates in the second direction, and the material taking mechanism is used for conveying the chips on the conveying disc to the testing seat or conveying the chips on the testing seat to the conveying disc; the amplification mechanism is slidably arranged on the workbench, and the amplification mechanism is used for shooting the chip located on the test seat. The number of the testing seats is multiple, and the testing seats are arranged in the second direction. The chips are loaded and unloaded in a full-automatic manner, and the efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing equipment, and in particular to a testing sorting machine and a chip testing sorting method. Background Art

[0002] The test sorting machine is a device for testing storage chips, such as a spectral test and screening device for semiconductor light-emitting chip components with announcement number CN217425587U, which includes a base plate and three-dimensional fine-tuning frame 1, three-dimensional fine-tuning frame 2, probe 1, probe 2, temperature control module, three-dimensional fine-tuning frame 3 and light receiver respectively installed on the top of the base plate. The temperature control module includes a tube shell installed on the top of the base plate and a semiconductor refrigerator welded to the bottom of the inner side of the tube shell. A gold-plated metal heat sink is welded on the top of the semiconductor refrigerator. A groove 1 is opened on the top of the gold-plated metal heat sink. The semiconductor light-emitting chip component is placed in the groove 1, and the front light output direction of the semiconductor light-emitting chip component is toward the light receiver. A transition block and a thermistor are also welded on the top of the gold-plated metal heat sink. Most of them only have measurement components, and loading and unloading still need to be done manually. The degree of automation is low, resulting in low chip sorting efficiency. On the other hand, during the chip test sorting process, it is also impossible to control the chip to be tested in a specific state, such as selecting certain specific temperatures. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a test sorting machine that can improve the sorting efficiency of chips.

[0004] The present invention also provides a chip testing and sorting method having the above-mentioned testing and sorting machine.

[0005] According to the first aspect of the present invention, the test sorting machine includes a workbench, a conveyor tray, a test seat, a moving mechanism, a material picking mechanism and an amplifying mechanism. Two conveyor trays are provided, and the conveyor trays can reciprocate along the first direction on the workbench; the test seat is provided on the workbench, and the test seat is provided at one end of the moving path of the conveyor tray; the moving mechanism is horizontally arranged above the conveyor tray, and the moving mechanism can reciprocate along the first direction; the material picking mechanism can be slidably arranged on the moving mechanism, and the material picking mechanism can reciprocate along the second direction, and the material picking mechanism is used to transport the chip on the conveyor tray to the test seat, or transport the chip on the test seat to the conveyor tray; the amplifying mechanism can be slidably arranged on the workbench, and the amplifying mechanism is used to photograph the pin card located on the test seat, and the amplifying mechanism can reciprocate along the second direction. Wherein, there are multiple test seats, and they are arranged along the second direction.

[0006] The test sorting machine according to the embodiment of the present invention has at least the following beneficial effects: fully automatic loading and unloading of chips, thereby improving efficiency.

[0007] According to some embodiments of the present invention, the test socket includes a machine platform, a lifting seat, a test mounting seat, a heat uniformity module, and a PCB fine-tuning mechanism. The machine platform is fixed on the workbench; the lifting seat is installed on the machine platform and can move up and down in the machine platform; the test mounting seat is arranged on the surface of the lifting seat, and a test station is arranged on the surface of the test mounting seat; the heat uniformity module is built in the test mounting seat, and the heat uniformity module is used to adjust the surface temperature of the test mounting seat; the PCB fine-tuning mechanism includes a rotating seat and an L-shaped support arm. One end of the L-shaped support arm is pivotally installed in the rotating seat, and the other end is detachably connected with a needle card. The L-shaped support arm is provided with a shooting through hole, and the shooting through hole and the observation port of the needle card are correspondingly arranged. Wherein, the L-shaped support arm can rotate so that the shooting through hole and the test station are correspondingly arranged; wherein, along the arrangement direction of the plurality of test mounting seats, the temperatures of the plurality of test stations increase or decrease equally.

[0008] According to some embodiments of the present invention, the heat uniformity module includes a heat uniformity cavity and spoiler vanes. A rotating shaft is built in the heat uniformity cavity, and the rotating shaft can pivot in the heat uniformity cavity. A heating wire is built in the heat uniformity cavity; there are a plurality of spoiler vanes, and the plurality of spoiler vanes are arranged around the side wall of the rotating shaft, and the plurality of spoiler vanes are inclined in the same direction.

[0009] According to some embodiments of the present invention, a lifting cylinder is connected to the bottom surface of the machine platform, the driving shaft of the lifting cylinder and the bottom of the lifting seat are correspondingly arranged, and the lifting cylinder can abut against the lifting seat to drive the lifting seat to rise.

[0010] According to some embodiments of the present invention, the machine platform is provided with a vertical track, and the lifting seat is slidably connected with the vertical track.

[0011] According to some embodiments of the present invention, the workbench is provided with two groups of first guide rails, and two conveying trays are respectively slidably connected to the two groups of first guide rails. A plurality of trays are arranged in a matrix on the conveying tray, and a plurality of placement grooves for placing chips are arranged on the surface of the tray.

[0012] According to some embodiments of the present invention, the moving mechanism is in a shape of "冖", two second guide rails are arranged on both sides of the workbench, and both sides of the moving mechanism are respectively slidably connected with the two second guide rails so that the moving mechanism can reciprocate along the second guide rails.

[0013] According to some embodiments of the present invention, the material picking mechanism includes a sliding seat and an adsorption mechanism, the sliding seat and the upper beam of the moving mechanism are slidably connected, the adsorption mechanism is slidably connected to the surface of the sliding seat, and the adsorption mechanism can be raised and lowered to pick up or place chips on the test seat or the conveying tray.

[0014] According to some embodiments of the present invention, the amplification mechanism includes a vertical rod, a third guide rail, an amplifier and a display screen. The third guide rail is arranged on the workbench along the second direction. One end of the vertical rod is slidably connected to the third guide rail, and the other end is fixedly connected to the display screen. The amplifier is slidably connected to the vertical rod, and the shooting direction of the amplifier is toward the test socket. The amplifier and the display screen are electrically connected to transmit the captured image to the display screen.

[0015] The chip test sorting method according to the second aspect of the present invention is used to control the test sorting machine according to the first aspect of the present invention, comprising the following steps: Step 1: Place the chip on one of the conveyor trays, and use the conveyor tray to convey the chip to one end close to the test seat; Step 2: Move the material taking mechanism to the corresponding position, and let the material taking mechanism take the chip out from the conveyor tray; Step 3: The moving mechanism moves in the first direction to move the material picking mechanism to the corresponding test seat position, and the material picking mechanism places the chip to be tested on the test seat; Step 4: The photographing mechanism photographs the chip to be tested, and the chip and the needle card on the test socket are amplified and sampled by the magnifying mechanism; Step 5: Use the material removal mechanism to remove the tested chip from the test seat; Step 6: The picking mechanism moves along the second direction on the moving mechanism so that the picking mechanism and another conveying tray are in corresponding positions, and the moving mechanism moves in the first direction so that the picking mechanism can place the chip on the conveying tray; Repeat steps 1 to 6.

[0016] The chip testing and sorting method according to the embodiment of the present invention has at least the following beneficial effects: fully automatic loading and unloading of chips, thereby improving efficiency.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 A three-dimensional schematic diagram of a test sorting machine according to an embodiment of the present invention; Figure 2 A schematic top view of a test sorting machine according to an embodiment of the present invention; Figure 3 A flowchart of a chip testing and sorting method according to an embodiment of the present invention; Figure 4 A schematic diagram of a test socket of a test sorting machine according to an embodiment of the present invention; Figure 5 A schematic diagram of a uniform heating module of a test sorting machine according to an embodiment of the present invention; Figure 6 A schematic diagram of a rotating shaft and spoiler blades of a test sorting machine according to an embodiment of the present invention; Figure 7 A schematic diagram of a working table, a conveying tray, a moving mechanism and a material taking mechanism of a test sorting machine according to an embodiment of the present invention from one angle; Figure 8 A schematic diagram of a working table, a conveying tray, a moving mechanism and a material taking mechanism of a test sorting machine according to an embodiment of the present invention from another angle; Fig. 9 A schematic diagram of a conveyor tray of a test sorting machine according to an embodiment of the present invention; Fig.10 A flowchart of chip testing and sorting according to another embodiment of the present invention; Fig.11 Schematic diagram of an amplification mechanism of a test sorting machine according to an embodiment of the present invention.

[0019] 100, workbench; 110, first guide rail; 120, second guide rail; 200, conveying tray; 210, tray; 211, placement slot; 300, test seat; 310, machine table; 311, lifting cylinder; 320, lifting seat; 330, test mounting seat; 331, test station; 3311, temperature sensor; 340, uniform heating module; 341, uniform heating cavity; 3411, insulation cavity; 3412, rotating bearing; 3413, heating wire; 342, rotating shaft; 343, spoiler blade; 350, PCB fine-tuning mechanism; 351, rotating seat; 352, L-shaped arm; 3521, needle card; 3522, shooting through hole; 360, vertical track; 400, mobile mechanism; 500, material taking mechanism; 510, sliding seat; 520, adsorption mechanism; 530, barcode scanner; 540, shooting mechanism 600, magnifying mechanism; 610, vertical rod; 620, third guide rail; 630, amplifier; 640, display screen; DETAILED DESCRIPTION

[0020] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0021] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0022] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0023] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0024] Reference Figure 1 and Figure 2 The test sorting machine of the embodiment of the present invention comprises a workbench 100, a conveyor tray 200, a test seat 300, a moving mechanism 400, a material taking mechanism 500 and an amplifying mechanism 600. Two conveyor trays 200 are provided, and the conveyor trays 200 can reciprocate on the workbench 100 along a first direction; the test seat 300 is arranged on the workbench 100, and the test seat 300 is arranged at one end of the moving path of the conveyor tray 200; the moving mechanism 400 is horizontally arranged above the conveyor tray 200, and the moving mechanism 400 can reciprocate along the first direction ( Figure 7 B direction) reciprocatingly; the material taking mechanism 500 can be slidably arranged on the moving mechanism 400, and the material taking mechanism 500 reciprocates along the second direction. The material taking mechanism 500 is used to transport the chip on the conveying tray 200 to the test seat 300, or transport the chip on the test seat 300 to the conveying tray 200; the magnifying mechanism 600 can be slidably arranged on the workbench 100, and the magnifying mechanism 600 is used to magnify the needle card located in the test seat 300. The magnifying mechanism 600 can be moved along the second direction ( Figure 7The test socket 300 is provided with a plurality of test sockets 300 and arranged along the second direction, and the first direction and the second direction are perpendicular to each other.

[0025] Among them, in this test sorting machine, the two conveyor trays 200 are respectively used to place the chips to be tested and the tested chips, and the movement between the two conveyor trays 200 is relatively independent, that is, the movement of one of the conveyor trays 200 will not affect the movement of the other conveyor tray 200, and the chips to be tested and the tested chips can be transported in different directions respectively. Furthermore, multiple chips can be placed on the conveyor tray 200, so the positions of different chips on the conveyor tray 200 are different. At this time, the movable moving mechanism 400 can be used to cooperate with the material picking mechanism 500 along the second direction to cooperate with the chips at different positions, and the chips can be picked up (from the conveyor tray 200) or placed (placed on the conveyor tray 200). On the other hand, in this solution, the material picking mechanism 500 can also cooperate with the test seat 300 to pick up the chips that have been tested. Therefore, in summary, the chips are loaded and unloaded in a fully automated manner to improve efficiency.

[0026] Specifically, refer to Figure 3 The test sorting machine in the above scheme is controlled by the chip test sorting method, which specifically includes the following steps: Step 1: Place the chip on one of the conveying trays 200, and use the conveying tray 200 to convey the chip to one end close to the test seat 300; Step 2: Move the material taking mechanism 500 to a corresponding position, and use the material taking mechanism 500 to take the chip out from the conveying tray 200; Step 3: The moving mechanism 400 moves in the first direction to move the material picking mechanism 500 to the corresponding position of the test seat 300, and the material picking mechanism 500 places the chip to be tested on the test seat 300; Step 4: The photographing mechanism 540 photographs the chip to be tested, and the magnifying mechanism 600 magnifies and samples the chip and the needle card on the test socket 300; Step 5: Use the material taking mechanism 500 to remove the tested chip from the test socket 300; Step 6: The picking mechanism 500 moves along the second direction on the moving mechanism 400 so that the picking mechanism 500 and another conveying tray 200 are positioned correspondingly, and the moving mechanism 400 moves in the first direction so that the picking mechanism 500 can place the chip on the conveying tray 200; Repeat steps 1 to 6.

[0027] In some embodiments, the test seat 300 is used to place the chip to be tested and allow the inspector to test the chip. Different chips usually have different test conditions. For different temperature conditions required by the chip, refer to Figures 4 to 6 The test seat 300 includes a platform 310, a lifting seat 320, a test mounting seat 330, a uniform heat module 340 and a PCB fine-tuning mechanism 350. The platform 310 is fixed on the workbench 100; the lifting seat 320 is installed on the platform 310 and can be lifted up and down in the platform 310 (along the Figure 4 D direction); a test mount 330 is arranged on the surface of the lifting seat 320, and a test station 331 is arranged on the surface of the test mount 330; a uniform heating module 340 is built in the test mount 330, and the uniform heating module 340 is used to adjust the surface temperature of the test mount 330; the PCB fine-tuning mechanism 350 includes a rotating seat 351 and an L-shaped arm 352, one end of the L-shaped arm 352 is pivotally mounted in the rotating seat 351, and the other end is detachably connected with a needle card 3521, and the L-shaped arm 352 is provided with a shooting through hole 3522, and the shooting through hole 3522 and the observation port of the needle card 3521 are correspondingly arranged, wherein the L-shaped arm 352 can rotate so that the shooting through hole 3522 and the test station 331 are correspondingly arranged; wherein, along the arrangement direction of the plurality of test mounts 330, the temperatures of the plurality of test stations 331 increase or decrease by the same amount.

[0028] In the actual testing process, the chip has different standards under different temperature tests. Therefore, by driving the material picking mechanism 500 to move on the moving mechanism 400 and matching with the test seat 300 at different positions (different temperatures), the chip to be tested can be placed in the test seat 300 at a suitable temperature for comprehensive testing. It should be emphasized that the uniform heating mechanism in the test seat 300 can uniformly heat the surface of the test station 331, so that the chip on the test station 331 can obtain the most suitable testing conditions. In addition, the needle card 3521 installed on the L-shaped support arm 352 is used to cooperate with the lifting seat 320 to provide convenience for the inspection personnel. Through the rise of the lifting seat 320, in conjunction with the observation port and shooting through hole 3522 of the needle card 3521, the magnifying mechanism 600 can conveniently magnify the surface of the chip and the needle card for testing and adjustment by the inspection personnel.

[0029] Specifically, refer to Figure 5 The heat uniformity module 340 includes a heat uniformity cavity 341 and a spoiler blade 343. The heat uniformity cavity 341 has a built-in rotating shaft 342, which can pivot in the heat uniformity cavity 341. The heat uniformity cavity 341 has a built-in heating wire 3413. The spoiler blade 343 is provided with a plurality of spoilers, which are arranged around the side wall of the rotating shaft 342. Figure 6 , multiple spoiler blades 343 face the same direction ( Figure 6 The rotating shaft 342 is tilted (in the opposite direction of the C direction) and rotates around the C direction.

[0030] The rotating shaft 342 is driven to rotate (rotate around the C direction) through an external driving device, so that it pivots in the uniform heating chamber 341. During the pivoting process of the rotating shaft 342, the spoiler blades 343 will be driven to swing. The multiple spoiler blades 343 with the same inclination direction will promote the continuous flow of the heated gas (which can be air or other inert gases), so that the internal gas continues to circulate, so that the temperature of each position of the uniform heating chamber 341 tends to be consistent, thereby making the temperature of the test station 331 more uniform.

[0031] Further, refer to Figure 5 Insulating cavities 3411 are provided on both sides of the heat-uniform cavity 341 to prevent heat from being transferred to the outside of the entire test mount 330, and both ends of the rotating shaft 342 penetrate the insulating cavities 3411 on both sides. A rotating bearing 3412 is installed in the insulating cavity 3411. The rotating bearing 3412 and the rotating shaft 342 are matched in transmission to improve the support of the transmission shaft, prevent the rotating shaft 342 from being deformed and unable to rotate due to high temperature, and improve the rotation stability of the rotating shaft 342. The driving device can be a micro motor and is built into one of the insulating cavities 3411. It should be emphasized that the heat-uniform cavity 341 and the rotating shaft 342 need to be sealed to prevent the heated gas from entering the insulating cavity 3411.

[0032] In the above technical solution, referring to Figure 5 A temperature sensor 3311 is also provided at the test station 331. The temperature sensor 3311 is electrically connected to the above-mentioned heating wire 3413 and is used to adjust the heating power of the heating wire 3413. When the temperature of the test station 331 is higher than the set value, the heating power of the heating wire 3413 is reduced. When the temperature of the test station 331 is lower than the set value, the heating power of the heating wire 3413 is increased.

[0033] Specifically, the test sorting method in the above scheme includes the following steps: Step 1: Place the chip on one of the conveying trays 200, and use the conveying tray 200 to convey the chip to one end close to the test seat 300; Step 2: Move the material taking mechanism 500 to a corresponding position, and use the material taking mechanism 500 to take the chip out from the conveying tray 200; Step 3: The moving mechanism 400 moves in the first direction to move the material picking mechanism 500 to the position of the test socket 300 that matches the test conditions, and the material picking mechanism 500 places the chip to be tested on the test socket 300; Step 4: The imaging mechanism 540 images the chip to be tested, and the magnifying mechanism 600 magnifies and samples the chip and the needle card on the test socket 300. Step 5: The chip taking mechanism 500 removes the tested chip from the test socket 300. Step 6: The chip taking mechanism 500 moves along the second direction on the moving mechanism 400, so that the chip taking mechanism 500 corresponds to the position of another conveying tray 200, and the moving mechanism 400 moves in the first direction, so that the chip taking mechanism 500 can place the chip on the conveying tray 200. Repeat Steps 1 to 6.

[0034] In some embodiments, referring to Figure 4 , a lifting cylinder 311 is connected to the bottom surface of the machine platform 310. The driving shaft of the lifting cylinder 311 and the bottom of the lifting seat 320 are correspondingly arranged. The lifting cylinder 311 can abut against the lifting seat 320 to drive the lifting seat 320 to rise. By driving the lifting seat 320 to rise through the lifting cylinder 311, the chip can be close to the needle card 3521, and it is convenient for the magnifying mechanism 600 to take samples by imaging. Among them, in order to restrict the lifting trajectory of the lifting seat 320, the machine platform 310 is provided with a vertical track 360, and the lifting seat 320 is slidably connected to the vertical track 360. So that the lifting seat 320 can stably move up and down along the vertical track 360.

[0035] In some embodiments, referring to Figure 7 , the moving mechanism 400 is in the shape of "冖". Two second guide rails 120 are arranged on both sides of the workbench 100. Both sides of the moving mechanism 400 are respectively slidably connected to the two second guide rails 120, so that the moving mechanism 400 can reciprocate along the second guide rails 120.

[0036] It should be mentioned that, referring to Figure 7 and Figure 8 , the workbench 100 is provided with two groups of first guide rails 110. Two conveying trays 200 are respectively slidably connected to the two groups of first guide rails 110. Among them, referring to Fig. 9 , a plurality of trays 210 are arranged in a matrix on the conveying tray 200. A plurality of placement grooves 211 for placing chips are arranged on the surface of the tray 210. Specifically, each group of first guide rails 110 has two and is arranged in parallel. Each conveying tray 200 slides on different first guide rails 110 without interference. One is used to convey the chips to be tested, and the other is used to convey the tested chips. Among them, the trays 210 on the conveying tray 200 are detachable. Through the detachable trays 210, it is convenient for the user to place the chips on the trays 210.

[0037] Furthermore, the entire test sorting machine has a central processing module, the tray 210 is provided with independent two-dimensional codes, and the central processing module is built with multiple input modules, each input module corresponds to each two-dimensional code, and the material picking mechanism 500 is provided with a scanner 530, the scanner 530 is used to scan the two-dimensional code on the tray 210 to obtain the data in the two-dimensional code, wherein the data in the two-dimensional code comes from the input module, and the central processing module can control the actions of the conveyor tray 200, the moving mechanism 400 and the material picking mechanism 500; wherein, reference Figure 8 , the barcode scanner 530 and the shooting mechanism 540 are integrated into one part.

[0038] Specifically, refer to Fig.10 In the above scheme, the conveyor trays 200 are respectively a loading conveyor tray 200 and a unloading conveyor tray 200. The test sorting method of the scheme includes the following steps: Step 1: Place multiple chips under the same test conditions on the tray 210 of the loading conveyor tray 200; Step 2: Enter the test conditions of the chip corresponding to the module input in the central processing module, and make data correspondence between the test conditions and the corresponding QR code; Step 3: Move the material taking mechanism 500 to the corresponding position, and take the chip from the conveying tray 200 by the material taking mechanism 500. At the same time, use the barcode scanner 530 to scan the QR code of the corresponding tray 210 to obtain the test conditions of the series of chips; Step 4: The central processing module calculates the moving path, and moves the chip to the corresponding test socket 300 by moving the moving mechanism 400 in the first direction and the picking mechanism 500 in the second direction; Step 5: The material taking mechanism 500 places the chip on the corresponding test socket 300; Step 6: The photographing mechanism 540 photographs the chip to be tested, and the magnifying mechanism 600 magnifies and samples the chip and the needle card on the test socket 300; Step 7: Using the material taking mechanism 500 to take the tested chip off the test socket 300; Step 8: Use the material taking mechanism 500 to transport the tested chips to the tray 210 of the unloading conveyor tray 200; Repeat steps 1 to 8.

[0039] It is worth mentioning that, refer to Figure 8The material picking mechanism 500 includes a sliding seat 510 and an adsorption mechanism 520. The sliding seat 510 is slidably connected to the upper beam of the moving mechanism 400. The adsorption mechanism 520 is slidably connected to the surface of the sliding seat 510. The adsorption mechanism 520 can be lifted up and down to pick up or put down the chips on the test seat 300 or the conveying tray 200. Specifically, when the material picking mechanism 500 performs the material picking action, the material picking mechanism 500 moves to the top of the corresponding tray 210, and the adsorption mechanism 520 descends to fit the surface of the chip. Specifically, the adsorption mechanism 520 can be a suction cup, and the vacuum adsorption force of the suction cup is used to lift the chip, wherein a corresponding sliding track is provided on the sliding seat 510, and the entire adsorption mechanism 520 is slidably connected to the sliding track, and the above-mentioned barcode scanner 530 is also integrated into the adsorption mechanism 520.

[0040] In some embodiments, reference Fig.11 The magnification mechanism 600 includes a vertical rod 610, a third guide rail 620, an amplifier 630 and a display screen 640. The third guide rail 620 is arranged on the workbench 100 along the second direction. One end of the vertical rod 610 is slidably connected to the third guide rail 620, and the other end is fixedly connected to the display screen 640. The amplifier 630 is slidably connected to the vertical rod 610. The shooting direction of the amplifier 630 is toward the test socket 300. The amplifier 630 and the display screen 640 are electrically connected to transmit the enlarged image to the display screen 640.

[0041] In the present solution, a plurality of test sockets 300 are arranged along the second direction. Therefore, the third guide rail 620 arranged along the second direction can provide a moving direction for the vertical rod 610, so that the amplifier 630 can correspond to different positions of the test sockets 300 respectively. The amplifier 630 is electrically connected to the display screen 640 to realize data transmission. The amplifier 630 amplifies the surface of the chip through the shooting through hole 3522 and the needle card 3521, so as to facilitate the inspection and testing by the inspection personnel.

[0042] The process of "placing the chip on the test socket 300 → using the amplification mechanism 600 to amplify and sample the chip and the needle card on the test socket 300 → removing the chip from the test socket 300" includes the following steps: Step 1: The L-shaped support arm 352 rotates on the rotating base 351 and is located above the test base 300; Step 2: Use the moving mechanism 400 to bring the material picking mechanism 500 to the top of the test seat 300, and place the chip on the test seat 300 by the material picking mechanism 500; Step 3: The magnifying mechanism 600 moves to the corresponding test socket 300, and the inspector performs multiple tests on the chip through the needle card 3521 and the magnifying mechanism 600 (visually inspected through the display screen 640); Step 4: The amplifying mechanism 600 moves away from the test seat 300, and the L-shaped arm 352 rotates on the rotating seat 351 and moves out from above the test seat 300; Step 5: Using the material taking mechanism 500 to take the chip out of the test socket 300; Step 6: Transport the chips to the transport tray 200 .

[0043] During the whole process, the L-shaped arm 352 equipped with the needle card 3521, the magnifying mechanism 600 and the material picking mechanism 500 are prevented from having a stacked position, thereby avoiding motion interference. Furthermore, the whole moving process can be centrally controlled by the above-mentioned central processing module.

[0044] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A test sorting machine, characterized in that: include: Workbench(100); Two conveying trays (200) are provided, and the conveying trays (200) can reciprocate on the workbench (100) along a first direction; A test seat (300) is arranged on the workbench (100), and the test seat (300) is arranged at one end of a moving path of the conveying plate (200); A moving mechanism (400) is disposed horizontally above the conveying plate (200), and the moving mechanism (400) can move back and forth along a first direction; A material taking mechanism (500) is slidably arranged on the moving mechanism (400), the material taking mechanism (500) reciprocates along the second direction, the material taking mechanism (500) is used to transport the chips on the conveying tray (200) to the test seat (300), or to transport the chips on the test seat (300) to the conveying tray (200), and the material taking mechanism (500) is built with a shooting mechanism; An amplifying mechanism (600) is slidably disposed on the workbench (100), the amplifying mechanism (600) is used to amplify the needle card located on the test seat (300), and the amplifying mechanism (600) can reciprocate along the second direction; There are a plurality of test sockets (300) arranged along the second direction.

2. The test sorting machine according to claim 1, characterized in that: The test socket (300) comprises: A machine platform (310) fixed on the workbench (100); A lifting seat (320) is installed on the machine platform (310) and can be lifted up and down in the machine platform (310); A test mounting seat (330) is arranged on the surface of the lifting seat (320), and a test station (331) is arranged on the surface of the test mounting seat (330); A heat-uniform module (340) is built into the test mount (330), and the heat-uniform module (340) is used to adjust the surface temperature of the test mount (330); The PCB fine-tuning mechanism (350) comprises a rotating seat (351) and an L-shaped support arm (352), wherein one end of the L-shaped support arm (352) is pivotally mounted in the rotating seat (351), and the other end is detachably connected to a needle card (3521), and the L-shaped support arm (352) is provided with a shooting through hole (3522), and the shooting through hole (3522) and the observation port of the needle card (3521) are correspondingly arranged, wherein the L-shaped support arm (352) can rotate so that the shooting through hole (3522) and the test station (331) are correspondingly arranged; Wherein, along the arrangement direction of the plurality of test mounts (330), the temperatures of the plurality of test stations (331) increase or decrease by the same amount.

3. The test sorting machine according to claim 2, characterized in that: The heat uniformity module (340) comprises: A heat-uniform cavity (341) is provided with a rotating shaft (342) therein, wherein the rotating shaft (342) is capable of pivoting within the heat-uniform cavity (341), and a heating wire (3413) is provided within the heat-uniform cavity (341); The spoiler vanes (343) are provided in plurality, and the plurality of spoiler vanes (343) are arranged around the side wall of the rotating shaft (342), and the plurality of spoiler vanes (343) are inclined in the same direction.

4. The test sorting machine according to claim 2, characterized in that: A lifting cylinder (311) is connected to the bottom surface of the machine platform (310), the driving shaft of the lifting cylinder (311) and the bottom of the lifting seat (320) are correspondingly arranged, and the lifting cylinder (311) can abut against the lifting seat (320) to drive the lifting seat (320) to rise.

5. The test sorting machine according to claim 2 or 4, characterized in that: The machine platform (310) is provided with a vertical track (360), and the lifting seat (320) is slidably connected to the vertical track (360).

6. The test sorting machine according to claim 1, characterized in that: The workbench (100) is provided with two groups of first guide rails (110), two of the conveying trays (200) are respectively slidably connected to the two groups of first guide rails (110), a plurality of trays (210) are arranged in a matrix on the conveying tray (200), and a plurality of placement grooves (211) for placing chips are arranged on the surface of the tray (210).

7. The test sorting machine according to claim 1, characterized in that: The moving mechanism (400) is in the shape of "冖", two second guide rails (120) are arranged on both sides of the workbench (100), and both sides of the moving mechanism (400) are respectively slidably connected to the two second guide rails (120) so that the moving mechanism (400) can reciprocate along the second guide rail (120).

8. The test sorting machine according to claim 7, characterized in that: The chip taking mechanism (500) includes a sliding seat (510) and an adsorption mechanism (520), the sliding seat (510) is slidably connected to the upper beam of the moving mechanism (400), the adsorption mechanism (520) is slidably connected to the surface of the sliding seat (510), and the adsorption mechanism (520) can move up and down to pick up or place the chips on the test seat (300) or the conveying tray (200).

9. The test sorting machine according to claim 1, characterized in that: The magnifying mechanism (600) includes a vertical rod (610), a third guide rail (620), an amplifier (630) and a display screen (640), the third guide rail (620) is arranged on the workbench (100) along the second direction, one end of the vertical rod (610) is slidably connected to the third guide rail (620), and the other end is fixedly connected to the display screen (640), the amplifier (630) is slidably connected to the vertical rod (610), the shooting direction of the amplifier (630) faces the test seat (300), and the amplifier (630) is electrically connected to the display screen (640) to transmit the captured image to the display screen (640).

10. A chip testing and sorting method, characterized in that: The test sorting machine for controlling any one of claims 1 to 9 includes the following steps: Step 1: Place the chip on one of the conveying trays (200), and the conveying tray (200) conveys the chip to one end close to the test seat (300); Step 2: Move the chip taking mechanism (500) to the corresponding position, and the chip taking mechanism (500) takes out the chip from the conveying tray (200); Step 3: The moving mechanism (400) is moved in a first direction to move the material taking mechanism (500) to a corresponding position of the test seat (300), and the material taking mechanism (500) places the chip to be tested on the test seat (300); Step 4: The chip to be tested is photographed by the photographing mechanism (540), and the chip and the needle card on the test socket (300) are amplified and sampled by the amplifying mechanism (600); Step 5: Using the material taking mechanism (500) to take the tested chip off the test seat (300); Step 6: The picking mechanism (500) is moved on the moving mechanism (400) along the second direction so that the picking mechanism (500) and another conveying tray (200) are positioned correspondingly, and the moving mechanism (400) is moved in the first direction so that the picking mechanism (500) can place the chip on the conveying tray (200); Repeat steps 1 to 6.

Images