Chip loading and unloading device and loading and unloading method thereof

Abstract

The invention provides a chip feeding and discharging device and a feeding and discharging method thereof.A visual system arranged in a preset space is used for covering a working plane of a stacking module with the visual range of the visual system so that visual information of chips on the stacking module can be transmitted to a control unit to be processed; the operation stroke of the material taking system covers the areas corresponding to the material stacking module and the bonding module respectively. And the control unit is used for controlling the material taking system to take the chips between the material stacking module and the bonding module according to the visual information so as to complete corresponding processes respectively. The visual system is used for pre-aligning a chip; and the visual system, the stacking system and the bonding system are subjected to complete machine coordinate association in a preset space through a manipulator of the material taking system. Real-time monitoring is achieved, loading is fast, the positioning precision is improved, and therefore high-precision and high-yield chip transfer is achieved. And meanwhile, the transfer of chips with different specifications can be realized, the transfer is not limited to specific specifications, and the applicability is relatively high.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a chip loading and unloading device and a chip loading and unloading method. Background Art

[0002] With the development of high integration and high performance of semiconductors, the bonding process can interconnect chips made at different process points with high density, achieving system-level integration with smaller size, higher performance and finer power consumption.

[0003] However, the chip transfer in the prior art is only for grabbing chips of specific shapes and specifications, and the chip transfer at different positions cannot be achieved during the transfer process. The chip positioning accuracy is relatively low, and the chip loading cannot be monitored in real time.

[0004] Therefore, a new solution for chip loading and unloading is needed. Summary of the invention

[0005] In view of this, the embodiments of this specification provide a chip loading and unloading device and a chip loading and unloading method.

[0006] The embodiments of this specification provide the following technical solutions:

[0007] The embodiment of this specification provides a chip loading and unloading device, comprising:

[0008] The visual system, the material taking system, the material stacking module, the bonding module and the control unit are respectively arranged in the preset space;

[0009] The visual system is used to cover the working plane of the stacking module with its visual range, so as to transmit the visual information of the chips on the stacking module to the control unit for processing;

[0010] The running stroke of the material taking system covers the corresponding areas of the stacking module and the bonding module respectively;

[0011] The control unit is used to control the material taking system to take the chips between the stacking module and the bonding module according to the visual information, so as to complete the corresponding processes respectively;

[0012] Wherein, before bonding, the chip is placed in the stacking module, and the visual system is used to photograph the first position of the chip in the storage bin, so as to obtain the coordinates corresponding to the first position through the control unit;

[0013] The reclaiming system includes a robot,

[0014] The material picking system is used to receive the coordinates corresponding to the first position converted into the coordinates of the second position of the manipulator by the control unit, and control the manipulator to grab the chip to the bonding module; wherein the visual system, the stacking system and the bonding system are associated with the coordinates of the whole machine in a preset space through the manipulator of the material picking system;

[0015] After bonding is completed, the robot grabs the bonded chips from the bonding area to the stacking area;

[0016] The robot grasps the first chip and the second chip in sequence, and places the first chip and the second chip in preset positions of the bonding area in sequence, and places the outer contours of the first chip and the second chip correspondingly.

[0017] The embodiment of this specification also provides a chip loading and unloading method, using the chip loading and unloading device as described in the above technical solution, the chip loading and unloading method includes:

[0018] Before bonding, the chip is placed in the stacking module, and the visual system is used to photograph the first position of the chip in the storage bin to obtain the coordinates corresponding to the first position through the control unit;

[0019] The material picking system is used to receive the coordinates corresponding to the first position converted into the coordinates of the second position of the manipulator by the control unit, and control the manipulator to grab the chip to the bonding module; wherein the visual system, the stacking system and the bonding system are mutually associated with the coordinates of the whole machine in a preset space through the manipulator of the material picking system;

[0020] After bonding is completed, the robot grabs the bonded chips from the bonding area to the stacking area;

[0021] The robot grasps the first chip and the second chip in sequence, and places the first chip and the second chip in preset positions of the bonding area in sequence, and places the outer contours of the first chip and the second chip correspondingly.

[0022] Compared with the prior art, the at least one technical solution adopted in the embodiments of this specification can achieve the following beneficial effects:

[0023] The embodiment of this specification uses a visual system to pre-align the chip before bonding, and uses a material taking system to realize full-process automatic chip loading and unloading, and takes the chip between the stacking module and the bonding module to complete the bonding process. Real-time monitoring is realized, which not only speeds up loading, but also improves the positioning accuracy, thereby realizing high-precision and high-yield chip transfer. At the same time, it can also realize the transfer of chips of different specifications, not limited to specific specifications, and has high applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 It is a schematic diagram of the structure of a chip loading and unloading device provided in an embodiment of this specification;

[0026] Figure 2 is a schematic diagram of the structure of a visual system provided in an embodiment of this specification;

[0027] Figure 3 It is a structural schematic diagram of a material taking system provided in an embodiment of this specification;

[0028] Figure 4 is a schematic diagram of the structure of the gripper provided in the embodiment of this specification;

[0029] Figure 5 It is a structural schematic diagram of a stacking module provided in an embodiment of this specification.

[0030] Among them, 1. Vision system, 11. Pre-alignment vision, 12. Precision alignment vision, 13. First fixed frame, 14. Second fixed frame, 2. Material picking system, 21. Base, 22. Four-axis robot, 23. Connecting frame, 24. Fixed ring, 25. Hollow motor, 26. Gripper, 261. Fixed seat, 262. Rotary joint, 263. Stud sleeve, 264. Suction nozzle, 3. Stacking module, 31. Fixed column, 32. Limit plate, 33. Storage frame, 34. Pallet, 35. Limit block, 4. Bonding module, 5. Workbench, 6. Pneumatic control unit. DETAILED DESCRIPTION

[0031] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0032] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.

[0033] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present application, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspect described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.

[0034] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. The drawings only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0035] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the examples can be practiced without these specific details.

[0036] The prior art bonding process lacks a device for chip transfer, which results in time-consuming and complicated chip transfer before bonding, resulting in low bonding accuracy and low bonding efficiency.

[0037] The existing chip transfer can only grab and transfer chips of specific shapes and specifications, and the chip transfer at different positions cannot be achieved during the transfer process. The chip positioning accuracy is relatively low, which makes it impossible to apply it to the transfer of chips in the bonding process.

[0038] Based on this, the embodiment of this specification proposes a new chip loading and unloading scheme: the visual range of the visual system is set to cover the working plane of the stacking module, the visual system is used to pre-align the chips on the stacking module, and the visual system, the stacking module and the bonding module are linked to the whole machine with the help of the material taking system, and the material taking system is used to realize the full process of automatic chip loading and unloading, that is, the chip is taken between the stacking module and the bonding module to complete the bonding process. An efficient chip loading and unloading device is realized.

[0039] The following is a description of the technical solutions provided by various embodiments of the present application in conjunction with the accompanying drawings. Figure 1As shown, a chip loading and unloading device provided in the embodiment of this specification includes a visual system 1, a material taking system 2, a stacking module 3, a bonding module 4 and a control unit (such as a gas control unit 6). The control unit includes but is not limited to mechanical control, air pressure control, electric control and vacuum suction cup control. The embodiment of this specification takes the gas control unit as an example.

[0040] A visual system 1, a material taking system 2, a material stacking module 3, a bonding module 4 and a control unit (such as an air control unit 6) are respectively arranged in a preset space for chip manufacturing.

[0041] The visual system 1 is used to cover the working plane of the stacking module 3 with its visual range, that is, to transmit the visual information of the chips on the stacking module 3 to the control unit for processing; the operation stroke of the picking system 2 covers the areas corresponding to the stacking module 3 and the bonding module 4 respectively; the control unit is used to control the picking system 2 to pick up the chips between the stacking module 3 and the bonding module 4 according to the visual information, so as to complete the corresponding processes respectively.

[0042] Specifically, before bonding, the chip is placed in the stacking module, and the visual system is used to photograph the first position of the chip to obtain the coordinates corresponding to the first position through the control unit;

[0043] The material picking system includes a manipulator, which is used to receive the coordinates corresponding to the first position converted into the coordinates of the second position of the manipulator by the control unit, and control the manipulator to grab the chip to the bonding module according to the second position coordinates. The manipulator is used to associate the coordinates of various modules, systems, etc. of the whole machine in the preset space, so that the visual system pre-positions the chip before bonding, and realizes the full-automatic loading of the chip from the stacking module to the bonding module. After the bonding is completed, the manipulator unloads the bonded chip from the bonding area to the stacking area according to the fixed position of the bonding area, realizing the full-automatic process of chip loading and unloading.

[0044] It should be noted that the embodiments of this specification rationally arrange the visual system, material picking system, stacking module, bonding module and control unit in a preset space, and use the robot in the material picking system to link the whole machine composed of the above modules / systems, so as to realize automatic loading and unloading of chips throughout the entire process.

[0045] The visual system can first give the pre-grabbing position of the chip, thus providing a basis for the precise positioning of the robot. The visual system can not only pre-position the chips on the stacking module, but also obtain relevant information such as the chip type, thereby realizing the bonding of various types of chips.

[0046] In some embodiments, a vision system is disposed above the stacking module, the optical axis of the camera in the vision system is located at the center of the stacking module, and the minimum distance from the camera to the stacking module is the working distance of the camera; the stacking module and the bonding module are disposed adjacent to each other; one side of the material picking system faces the same side of the stacking module and the bonding module, and the operating stroke of the material picking system covers the areas corresponding to the stacking module and the bonding module respectively; a control unit is disposed on the other side of the material picking system.

[0047] The visual system 1 is arranged above the stacking module 3, the optical axis of the camera in the visual system 1 is located at the center of the stacking module 3, and the minimum distance from the camera to the stacking module 3 is the working distance of the camera, so that the visual range of the visual system 1 covers the working plane of the stacking module 3;

[0048] The stacking module 3 and the bonding module 4 are arranged adjacent to each other;

[0049] One side of the material taking system 2 faces the same side of the stacking module 3 and the bonding module 4, and the running stroke of the material taking system 2 covers the areas corresponding to the stacking module 3 and the bonding module 4 respectively;

[0050] The material taking system includes a manipulator for taking; a control unit is arranged on the other side of the material taking system;

[0051] The control unit 2 is used to control the material taking system to take the chip between the stacking module and the bonding module according to the visual information transmitted by the visual system, such as controlling the manipulator to take the chip between the stacking module 3 and the bonding module 4, so as to complete the corresponding processes respectively;

[0052] Before bonding, the chip is placed in a storage bin on the stacking module 3, and the visual system 1 is used to photograph a first position of the chip in the storage bin to obtain coordinates corresponding to the first position through the control unit;

[0053] The material picking system 2 is used to receive the coordinates corresponding to the first position converted into the second position coordinates of the manipulator by the control unit, and control the manipulator to grab the chip to the fixed area of ​​the bonding module 4 according to the second position coordinates, and then the manipulator returns to the waiting area; wherein the material picking system 2 forms coordinate associations between the whole machine consisting of the visual system 1, the stacking module, the bonding system and the material picking system with the help of the material picking system; that is, by converting the coordinates of the above modules / systems, the coordinates of the chip positioning can be converted into the position coordinates of the manipulator picking up the chip.

[0054] After bonding is completed, the robot grabs the bonded chips from the bonding area to the stacking area;

[0055] The robot grasps the first chip and the second chip in sequence, and places the first chip and the second chip in preset positions of the bonding area in sequence, and places the outer contours of the first chip and the second chip correspondingly.

[0056] The embodiment of this specification realizes real-time monitoring, not only fast loading, but also improves positioning accuracy, thereby realizing high-precision and high-yield chip transfer. At the same time, the chip loading and unloading device of the embodiment of this specification can also realize the transfer of chips of different specifications, not limited to specific specifications, and has high applicability.

[0057] In some embodiments, Figure 2 As shown, the visual system 1 includes a pre-alignment vision 11 and a fine alignment vision 12. The pre-alignment vision 11 and the fine alignment vision 12 are fixed by a first fixing frame 13 and a second fixing frame 14 respectively; the window range of the pre-alignment vision 11 is 5120mm×5120mm; the window range of the fine alignment vision 12 is 50mm×50mm.

[0058] The pre-alignment vision 11 includes a first camera and a first lens; the fine alignment vision includes a second camera and a second lens; wherein, the optical axis of the first camera is located at the center of the stacking module, and the minimum distance from the first camera to the stacking module is the working distance of the first camera; after the robot grabs the chip, the chip is moved from the visual range of the first lens to the visual range of the second lens, and the actual position of the chip is recalibrated to convert the first position coordinates of the chip into the second position coordinates of the robot, so that the robot can take the chip from the stacking module to the bonding module according to the second position coordinates.

[0059] The first fixing frame is used to fix the first camera and the first lens, and the position of the first camera and the first lens on the first fixing frame is adjustable. That is, the pre-alignment vision uses a large field of view such as 5120mm×5120mm and a large working distance camera to complete the rough positioning, which can meet the positioning of multiple groups of chips. The fine alignment vision includes a second camera and a second lens, and the window range of the second lens is 50mm×50mm. The second fixing frame fixes the second camera and the second lens, and the position of the second camera and the second lens on the second fixing frame is adjustable to adapt to different working distance adjustments, that is, the pre-alignment vision and the fine alignment vision are respectively adjusted on their respective corresponding fixing frames to obtain the working distance to achieve the best visual effect.

[0060] The high-precision dual-camera positioning system is used to first determine the grasping position and then accurately position it. Combined with a high-precision four-axis robot, the loading and bonding accuracy is improved. That is, after the robot grasps the chip, the chip is moved to the window range of the second camera and the second lens, and the actual position of the chip is recalibrated again and converted into the relative coordinates of the robot, effectively improving the loading accuracy. The ultra-large working field, combined with network transmission technology, can observe the chip loading status in real time.

[0061] In some embodiments, such as Figure 3As shown, the material picking system 2 also includes at least one four-axis robot 22. Each four-axis robot 22 includes four degrees of freedom X / Y / Z / RZ, and the maximum working radius is 400mm. With the high precision, high speed, and high stability of the four-axis robot, the large-stroke four-axis robot can realize the cross-region transfer of chips, such as between the stacking module and the bonding module.

[0062] The four-axis robot is fixed on a base 21, and the base 21 has high rigidity; a connecting frame 23 is provided on the four-axis robot, and the connecting frame 23 is fixed to the end of the Z axis of the four-axis robot through a fixing ring 24;

[0063] The manipulator includes a hollow motor 25 and a gripper 26; the hollow motor is fixed to the flange surface of the connecting frame by screws, the end of the hollow center axis of the hollow motor 25 is threaded, and the gripper 26 is connected to the hollow motor 25 by threads.

[0064] The hollow motor 25 includes a closed-loop encoder to control the gripper 26 to pick up the chips, completing the cycle of chips from the stacking module 3 to the bonding module 4 and from the bonding module 4 back to the stacking module 3, completing the placement of each group of chips.

[0065] In some embodiments, Figure 3 and Figure 4 As shown, the gripper 26 is symmetrically provided with two groups of suction nozzles, such as an upper suction nozzle and a lower suction nozzle, and the heights corresponding to the planes where the upper suction nozzle and the lower suction nozzle are located are symmetrical relative to the plane where the axis of the hollow motor is located, thereby improving stability during the grasping process.

[0066] The embodiment of this specification uses a high-precision, high-speed four-axis robot, combined with a fast grasping system, to achieve fast and stable grasping and transfer of chips. The upper and lower nozzles are used to grasp two types of chips such as A / B respectively, and the materials are loaded at the same time, which reduces the chip transfer time and further improves efficiency.

[0067] The nozzle is made of relatively soft silicone material and can be used at a temperature of 250° to avoid damage to the chip during the suction process.

[0068] In some embodiments, Figure 4 As shown, the gripper 26 includes a fixing seat 261 , a rotating joint 262 , a stud sleeve 263 , and a suction nozzle 264 .

[0069] The fixing seat is a three-sided structure, including an upper side, a lower side and a front side; the front side is provided with a threaded hole corresponding to the thread of the hollow motor. The fixing seat 261 is a three-sided rectangular parallelepiped structure, with a threaded hole on the front side to be threadedly connected with the hollow motor 25, and a tightening screw is added to the outside of the fixing seat. Figure 4 In the example, the three-sided structure includes a three-sided rectangular parallelepiped structure. The structure and shape of the fixing seat 261 can be specifically set according to actual conditions.

[0070] The upper side and the lower side of the fixing seat 261 are respectively provided with coaxial threaded holes to embed the stud sleeve 263 into at least one of the upper side and the lower side of the fixing seat 261 ; for example, the stud sleeve 263 is embedded in the fixing seat 261 .

[0071] The rotary joint 262 and the suction nozzle 264 are respectively connected to the two sides of the stud sleeve 263 by threads. The rotary joint 262 and the suction nozzle 264 can be divided into two groups, the upper and lower groups, and the installation method is the same as above. Specifically, one end of the rotary joint 262 is fixed to the front of the fixing seat by threads, and the other end of the rotary joint 262 is connected to the first end of the stud sleeve 263 by threads;

[0072] The second end of the stud sleeve 263 is connected to the suction nozzle 26 via a thread.

[0073] The suction nozzle 264 adopts a small suction nozzle suction method, and through precise adjustment of the control system, it can grab chips of different specifications and models.

[0074] In order to cooperate with the visual system to improve the accuracy of chip grabbing and positioning, some embodiments, such as Figure 5 As shown, the stacking module 3 includes a limiting plate 32, a material storage frame 33 and a tray 34;

[0075] The limiting plate 32 is fixed on the fixing column 31, and the fixing column 31 is fixed on the workbench through the bottom plate;

[0076] The limiting plate 32 includes two limiting blocks 35 placed opposite to each other;

[0077] The material storage frame 33 is placed flat on the limiting plate 32 through the limiting block 35;

[0078] The material storage frame 33 is provided with four slots, and the trays 34 are evenly placed in the four slots of the material storage frame. The trays 34 and the material storage frame 33 are positioned by corner limiters to cooperate with the visual system to perform preliminary positioning of the chip.

[0079] The stacking module of the embodiment of the present specification is provided with a multi-slot, quick-loading chip storage bin to achieve quick loading, thereby further improving productivity.

[0080] In some embodiments, a precision air control unit is provided to lift the suction nozzle, such as controlling a small suction nozzle to grab chips of different specifications and models. Figure 1 In the embodiment, the control unit is the gas control unit 6.

[0081] The air control unit 6 is used to control the suction nozzle 264 corresponding to the gripper 26 of the manipulator. The air pipe (not shown) of the air control unit passes through the internal air pipe of the four-axis robot 22, passes through the hollow shaft of the hollow motor 25 corresponding to the manipulator, and is connected to the interface of the rotary joint 262 corresponding to the gripper.

[0082] Each gas control unit includes a solenoid valve, a pressure reducing valve, a vacuum generator, a flow switch, and an air pipe.

[0083] In some embodiments, in order to improve productivity, the air control unit 6 is divided into two air control units, which are respectively used to control two groups of symmetrically arranged suction nozzles.

[0084] The air control unit 6 is divided into two air control units, which respectively control the upper suction nozzle and the lower suction nozzle of the gripper 26, and are connected in the middle by an air pipe. After the air pipe comes out of the air control unit, it enters the internal air pipe of the four-axis robot 22, passes through the hollow shaft of the hollow motor 25, and is respectively connected to the interface of the upper / lower rotary joint 262. Each air control includes a solenoid valve, a pressure reducing valve, a vacuum generator, and a flow switch, which are connected in the middle by an air pipe. A high-precision air control unit is used, and a high-temperature resistant soft small suction nozzle is used to avoid structural damage to the chip. Branch control is used to avoid the influence on the position of other chips during the grasping process.

[0085] The suction nozzle 264 adopts a small suction nozzle suction method, which can be adjusted by precisely adjusting the air control system to grab chips of different specifications and models.

[0086] In some embodiments, Figure 1 As shown, the visual system 1 is fixed to the column of the workbench 5 through an adapter plate, and the material picking system 2, the stacking module 3, the bonding module 4 and the control unit (such as the air control unit 6) are respectively installed on the desktop of the workbench 5 through corresponding base support frames.

[0087] Specifically, the visual system 1 is fixed on the column of the workbench 5 through an adapter plate. The material taking system 2, the stacking module 3, the bonding module 4, the workbench 5, and the air control unit 6 are all installed on the desktop of the workbench 5 through corresponding bottom plate support frames.

[0088] The visual range of the visual system 1 needs to completely cover the stacking module 3, the movement range of the material taking system 2 completely covers the area where the stacking module 3 and the bonding module 4 are located, and the air control unit 6 can accurately control the material taking and placing process of the material taking system 2. Each module is designed relatively independently to simplify the complexity of the structural design and avoid introducing too many structural errors. However, they are interrelated and compensated for each other during operation, with clear division of labor, improved efficiency and reduced errors.

[0089] In combination with the above embodiments, a high-precision, high-yield, strong controllability, high reliability, large stroke, fully automatic automatic wafer loading and unloading device that can be used for semiconductor bonding equipment is provided.

[0090] In combination with the above embodiments, the chip loading and unloading device of the embodiments of this specification can also be applied to large-load, sub-micron precision workbenches in various fields such as chemical industry, metallurgy, forging, testing, and medicine.

[0091] In combination with the above embodiments, the embodiments of this specification also provide a chip loading and unloading method: before bonding, the chip is placed in a storage bin on the stacking module, and the visual system is used to capture the first position of the chip in the storage bin to obtain the coordinates corresponding to the first position through the control unit; the picking system is used to receive the coordinates corresponding to the first position converted by the control unit into the second position coordinates of the manipulator, and control the manipulator to grab the chip to a fixed area of ​​the bonding module, and the manipulator returns to the waiting area; wherein the visual system, stacking module, bonding module, control unit and picking system constitute a complete machine device in a preset space, and the coordinates of the complete machine are interconnected with the help of the manipulator in the picking system, that is, the conversion of the coordinates of the above modules / systems realizes the conversion of the coordinates of the chip positioning into the position coordinates of the manipulator picking up, etc.

[0092] After bonding is completed, the robot grabs the bonded chip from the bonding area to the stacking area; wherein the robot grabs the first chip and the second chip in turn, and places the first chip and the second chip in preset positions of the bonding area in turn, and places the outer contours of the first chip and the second chip correspondingly.

[0093] Specifically, the chip is stored in the storage bin on the stacking module 3, and the specific position of the chip (such as X, Y, Z, R) is photographed by the visual system 1, and the detailed coordinates obtained by the control unit are sent to the material picking system 2. After receiving the chip position, the material picking system 2 quickly converts it into the position coordinates of the manipulator (such as X1, Y1, Z1, R1) and completes the chip grabbing. This step is to correlate the visual system, the robot coordinates and the whole machine coordinates, improve the accurate positioning of the chip position, facilitate the accurate grabbing of the chip by the manipulator, and improve the bonding accuracy.

[0094] After further completing the chip grabbing, the grabbed chip is placed in the fixed area of ​​the bonding module 4 by a high-speed, high-precision, and high-stability four-axis robot. The grabbed chip can be placed in the fixed area of ​​the bonding module 4. The manipulator returns to the waiting area, that is, the placement is completed, and the manipulator returns to the waiting area. This step is to improve the loading efficiency and increase the yield. After waiting for the bonding to be completed, the manipulator quickly grabs the bonded chip to the stacking area 3. That is, the manipulator quickly grabs the bonded chip to the stacking area 3, and this process is equivalent to a cycle completion. Repeat the above actions to complete the placement of the next group of chips.

[0095] In the above process, the bonded chips are a pair of chips of different specifications. The material taking system 2 needs to take chip a first, and then take the corresponding chip b, and place chip a first and then the corresponding chip b at the bonding area 4, and ensure that the outer contours of chips a and b are completely corresponding.

[0096] Using a dual-camera vision system, after the robot grabs the chip through the pre-alignment vision, the chip is moved into the window range of the precision alignment vision, and the actual position of the chip is recalibrated again and converted into the relative coordinates of the robot.

[0097] In some embodiments, it also includes: there are at least two first chips or at least two second chips in the chips to be bonded, and before bonding, a pre-alignment detection is performed on each first chip and second chip through a visual system, and multiple manipulators provided in the material picking system are used to batch load the first chips / second chips at the same time.

[0098] Specifically, a bunch of chips that need to be bonded are pre-aligned and then loaded at the same time, which can effectively improve the bonding accuracy and yield. The whole process uses a visual system and a four-axis robot to transfer chips, realize fully automatic loading and unloading, and avoid manual intervention.

[0099] In summary, the chip loading and unloading device and the chip loading and unloading method according to the embodiments of this specification have the following beneficial effects:

[0100] 1. High precision: Adopt high-precision dual-camera positioning system, first give the grasping position, then accurately position it, combined with high-precision four-axis robot, to improve the loading accuracy and bonding accuracy.

[0101] 2. Real-time monitoring: It adopts dual-camera positioning system, ultra-large working field of view, combined with network transmission technology, to observe the chip loading status in real time.

[0102] 3. High productivity: High-precision, high-speed four-axis robot is used, combined with a fast grasping system, to achieve fast and stable grasping and transfer of chips. Upper and lower nozzles are used to grasp A / B chips respectively, and the materials are loaded at the same time, which reduces the chip transfer time and further improves efficiency.

[0103] 4. Large stroke: The use of a large-stroke four-axis robot can realize the cross-regional transfer of chips.

[0104] 5. Fully automatic: Combined with the visual system, a robot is used to transfer the chips, which does not require any human intervention. This improves efficiency while reducing the risk of casualties during machine operation.

[0105] 6. Fast loading: Multi-slot, fast-loading chip storage unit further improves productivity.

[0106] 7. Reduce the possibility of chip damage: Use high-precision air control unit and high-temperature resistant soft small nozzle to avoid structural damage to the chip.

[0107] 8. High applicability: It adopts a small suction nozzle to absorb chips of different specifications and models through precise adjustment of the air control system.

[0108] The same or similar parts between the various embodiments in this specification can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the product embodiment described later, since it corresponds to the method, the description is relatively simple, and the relevant parts can be referred to the partial description of the system embodiment.

[0109] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A chip loading and unloading device, characterized in that: include: The visual system, the material taking system, the material stacking module, the bonding module and the control unit are respectively arranged in the preset space; The visual system is used to cover the stacking module with its visual range, so as to transmit the visual information of the chips on the stacking module to the control unit for processing; The running stroke of the material taking system covers the corresponding areas of the stacking module and the bonding module respectively; The control unit is used to control the material taking system to take the chips between the stacking module and the bonding module according to the visual information, so as to complete the corresponding processes respectively; Wherein, before bonding, the chip is placed in the stacking module, and the visual system is used to photograph the first position of the chip, so as to obtain the coordinates corresponding to the first position through the control unit; The reclaiming system includes a robot, The material picking system is used to receive the coordinates corresponding to the first position converted into the second position coordinates of the manipulator by the control unit, and control the manipulator to grab the chip to the bonding module according to the second position coordinates; wherein the visual system, the stacking system and the bonding system are associated with the coordinates of the whole machine in a preset space through the manipulator of the material picking system; After bonding is completed, the robot grabs the bonded chips from the bonding area to the stacking area; The robot grasps the first chip and the second chip in sequence, and places the first chip and the second chip in preset positions of the bonding area in sequence, and places the outer contours of the first chip and the second chip correspondingly.

2. The chip loading and unloading device according to claim 1, characterized in that: The visual system is arranged above the stacking module, the optical axis of the camera in the visual system is located at the center of the stacking module, and the minimum distance from the camera to the stacking module is the working distance of the camera; The stacking module and the bonding module are arranged adjacent to each other; One side of the material taking system faces the same side of the material stacking module and the bonding module, and the running stroke of the material taking system covers the areas corresponding to the material stacking module and the bonding module respectively; A control unit is arranged on the other side of the material taking system.

3. The chip loading and unloading device according to claim 1, characterized in that: The visual system includes: pre-alignment vision and precision alignment vision; A first fixing frame and a second fixing frame are respectively used to fix the pre-alignment vision and the fine alignment vision; The pre-alignment vision includes a first camera and a first lens; the fine alignment vision includes a second camera and a second lens; the pre-alignment vision and the fine alignment vision are respectively adjusted on their respective corresponding fixed frames to obtain a working distance; The optical axis of the first camera is located at the center of the stacking module, and the minimum distance from the first camera to the stacking module is the working distance of the first camera; After the robot grabs the chip, the chip is moved from the visual range of the first lens to the visual range of the second lens, and the actual position of the chip is recalibrated to convert the coordinates of the first position of the chip into the coordinates of the second position of the robot.

4. The chip loading and unloading device according to claim 1, characterized in that: The material taking system also includes at least one four-axis robot, each of which includes four degrees of freedom: X / Y / Z / RZ; The four-axis robot is fixed on the base; a connecting frame is provided on the four-axis robot, and the connecting frame is fixed to the end of the Z axis of the four-axis robot through a fixing ring; The manipulator includes a hollow motor and a gripper; the hollow motor is fixed to the flange surface of the connecting frame by screws, a thread is arranged at the end of the hollow center shaft of the hollow motor, and the gripper is connected to the hollow motor by the thread; The hollow motor includes a closed-loop encoder to control the gripper to pick up the chip between the stacking module and the bonding module.

5. The chip loading and unloading device according to claim 4, characterized in that: The gripper is symmetrically provided with two groups of suction nozzles, including an upper suction nozzle and a lower suction nozzle; the heights corresponding to the planes where the upper suction nozzle and the lower suction nozzle are located are symmetrical relative to the plane where the axis of the hollow motor is located; The suction nozzle is configured to be made of silicone material; Alternatively, the gripper comprises: a fixing seat, a rotating joint, a stud sleeve, and a suction nozzle; The fixing seat is a three-sided structure, including an upper side surface, a lower side surface and a front surface; the front surface is provided with a threaded hole corresponding to the thread of the hollow motor; The upper side and the lower side of the fixing seat are respectively provided with coaxial threaded holes so as to embed the stud sleeve into at least one side of the upper side and the lower side of the fixing seat; One end of the rotary joint is fixed to the front face by means of threads, and the other end of the rotary joint is connected to the first end of the stud sleeve by means of threads; The second end of the stud sleeve is connected to the suction nozzle through a thread; Wherein, the three-sided structure includes a three-sided rectangular parallelepiped structure.

6. The chip loading and unloading device according to claim 1, characterized in that: The stacking module includes a limiting plate, a material storage frame and a tray; The limit plate is fixed on the fixed column, and the fixed column is fixed on the workbench through the bottom plate; The limiting plate includes two limiting blocks placed opposite to each other; The material storage frame is placed flat on the limit plate through the limit block; The material storage frame is provided with four slots, and the trays are evenly placed in the four slots of the material storage frame. The positioning between the trays and the material storage frame is completed by the corner limiter.

7. The chip loading and unloading device according to claim 1, characterized in that: The control unit includes an air control unit, which is used to control the suction nozzle on the gripper, and the air pipe of the air control unit passes through the internal air pipe of the four-axis robot, passes through the hollow shaft of the hollow motor, and is connected to the interface of the rotary joint; Each gas control unit includes a solenoid valve, a pressure reducing valve, a vacuum generator, a flow switch, and an air pipe; Alternatively, the air control unit is divided into two air control units, which are respectively used to control two groups of symmetrically arranged suction nozzles.

8. The chip loading and unloading device according to claim 1, characterized in that: The visual system is fixed on the column of the workbench through an adapter plate, and the material taking system, the stacking module, the bonding module and the control unit are respectively installed on the desktop of the workbench through corresponding bottom plate support frames.

9. A chip loading and unloading method, characterized in that: The chip loading and unloading device according to any one of claims 1 to 8 is used, and the chip loading and unloading method comprises: Before bonding, the chip is placed in the stacking module, and the visual system is used to photograph the first position of the chip in the storage bin to obtain the coordinates corresponding to the first position through the control unit; The material picking system is used to receive the coordinates corresponding to the first position converted into the coordinates of the second position of the manipulator by the control unit, and control the manipulator to grab the chip to the bonding module; wherein the visual system, the stacking system and the bonding system are mutually associated with the coordinates of the whole machine in a preset space through the manipulator of the material picking system; After bonding is completed, the robot grabs the bonded chips from the bonding area to the stacking area; The robot grasps the first chip and the second chip in sequence, and places the first chip and the second chip in preset positions of the bonding area in sequence, and places the outer contours of the first chip and the second chip correspondingly.

10. The chip loading and unloading method according to claim 9, characterized in that: Also includes: There are at least two first chips or at least two second chips in the chips to be bonded. Before bonding, a pre-alignment detection is performed on each of the first chip and the second chip by the visual system, and a plurality of manipulators arranged in the material taking system are used to simultaneously load the first chips / the second chips in batches.

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