Full-automatic stripping equipment for wafer chip

Abstract

The invention relates to the technical field of wafer chip production, in particular to wafer chip full-automatic stripping equipment which comprises a rack, and a machine cover is mounted at the top end of the rack; an XY picking platform mechanism is installed on one side of the surface of the rack, and a feeding and conveying mechanism is fixed to the position, located on one side of the XY picking platform mechanism, of the surface of the rack. One side of the XY pickup platform mechanism is provided with a good product and bad product sending-out module, and the surface of the rack is provided with a turret type pickup mechanism. A wafer disc lifting and turning-over module and a substrate edge transplanting and disc placing mechanism are mounted on the surface of the rack, and a wafer disc transferring and transplanting mechanism is mounted on one side of the surface of the rack; and a base plate edge stripping mechanism and an empty disc stacking assembly are mounted on the surface of the rack and located on the two sides of the base plate edge transplanting and disc placing mechanism correspondingly. According to the device, the automation degree and the working efficiency are improved, manual auxiliary operation is not needed in the stripping process, the labor intensity is reduced, and the stripping position is accurate.

Description

Technical Field

[0001] The invention relates to the technical field of wafer chip production, and in particular to a fully automatic wafer chip stripping device. Background Art

[0002] A wafer refers to the silicon chip used to make silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. Various circuit component structures can be processed on the silicon wafer to become IC products with specific electrical functions. When the wafer chip is peeled off from the wafer disk, a peeling device is required.

[0003] At present, the existing wafer chips are all manually operated during peeling, and the degree of automation is low, which increases the labor intensity during peeling and reduces work efficiency; and because the entire peeling process needs to be completed with manual assistance, the position during peeling is not accurate enough, which brings great trouble to people's use. Summary of the invention

[0004] The object of the present invention is to provide a fully automatic wafer chip peeling device to solve the problems of low efficiency and inaccurate peeling position in the manual peeling process mentioned in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a fully automatic wafer chip stripping device, comprising a frame, a hood is installed on the top of the frame, and a control panel is fixedly connected to the surface of the hood; an XY pick-up platform mechanism is installed on one side of the frame surface, and a loading and feeding mechanism is fixed on the surface of the frame and on one side of the XY pick-up platform mechanism, and the loading and feeding mechanism is used to load the wafer disc onto the XY pick-up platform mechanism; a good product and a bad product delivery module are arranged on one side of the XY pick-up platform mechanism, and a turret pick-up mechanism is installed on the surface of the frame. The picking mechanism is used for transferring the wafer chips on the wafer disc in the XY picking platform mechanism to the good and bad product delivery modules; the surface of the frame is respectively installed with a wafer disc lifting and flipping module and a substrate edge transfer and swinging mechanism, and one side of the frame surface is installed with a wafer disc transfer and transfer mechanism, which is used for transferring the wafer disc after being flipped by the wafer disc lifting and flipping module to the substrate edge transfer and swinging mechanism; the frame surface and the two sides of the substrate edge transfer and swinging mechanism are respectively installed with a substrate edge peeling mechanism and an empty disc stacking component.

[0006] Preferably, the XY picking platform mechanism includes a Y-axis slide, a Y-axis linear motor module, an X-axis linear motor module, a wafer positioning platform and a ejector module. The surface of the frame is fixedly connected to the Y-axis slide, and the surface of the Y-axis slide is slidably connected to the Y-axis linear motor module.

[0007] Preferably, the surface of the Y-axis linear motor module is slidably connected to the X-axis linear motor module, and a wafer disk positioning platform is fixed to the sliding end of the X-axis linear motor module, and a ejector module is installed on the surface of the Y-axis slide.

[0008] Preferably, the loading and feeding mechanism is composed of a lift, a plug, a feeding linear module and a cylinder clamp. The lift is installed on the surface of the frame, and a plug for placing the wafer disc is installed on the lifting seat of the lift. The plug is fixed to the surface of the machine cover, and a cylinder clamp is installed on the sliding end of the plug. The cylinder clamp is used to clamp the wafer disc inside the plug and place it on the surface of the wafer disc positioning platform.

[0009] Preferably, the good and defective product delivery module is composed of a screw module, a defective barrel and a good product barrel. The screw module is fixed to the surface of the frame, and the sliding end of the screw module is equipped with a defective barrel and a good product barrel, which are used to hold NG wafer chips and Pass wafer chips, respectively.

[0010] Preferably, the turret picking mechanism is composed of a gantry, a DD motor, a turret nozzle assembly and a picking vision guidance camera. The gantry is fixed to the surface of the frame, and a picking vision guidance camera is fixed on the surface of the gantry. The picking vision guidance camera is used for visual inspection of wafer chips on the wafer disk.

[0011] Preferably, a DD motor is fixed on the surface of the gantry, and a turret nozzle assembly is installed on the output end of the DD motor, and the turret nozzle assembly is used to clamp the Pass wafer chips and NG wafer chips on the wafer disk into the good product barrel and the bad product barrel respectively.

[0012] Preferably, the substrate edge moving and swinging plate mechanism is composed of an X-axis linear module, a substrate edge peeling positioning platform and a clamping cylinder. The X-axis linear module is fixedly connected to the surface of the frame, and the substrate edge peeling positioning platform is installed on the sliding seat of the X-axis linear module. The four corner positions of the substrate edge peeling positioning platform are fixedly connected to the clamping cylinder, which is used for clamping the wafer disc.

[0013] Preferably, the wafer disc transfer and transplanting mechanism includes a three-axis module and a suction cup module. The three-axis module is fixedly connected to the surface of the frame, and the sliding end of the three-axis module is equipped with a suction cup module, which is used to transport the wafer disc after being flipped over by the wafer disc lifting and flipping module to the substrate edge peeling positioning platform.

[0014] Preferably, the substrate edge peeling mechanism includes a three-axis motion assembly, a CCD camera and a screw motor ejector pin. The three-axis motion assembly is fixedly connected to the surface of the frame, and the CCD camera and the screw motor ejector pin are respectively installed on the sliding seat of the three-axis motion assembly. The CCD camera is used for visual inspection of the substrate edge before peeling, and the screw motor ejector pin is used to press down the substrate edge of the wafer disc for peeling.

[0015] Compared with the prior art, the beneficial effect of the present invention is that when the fully automatic wafer chip stripping equipment is implemented, the wafer disc with the wafer chip is loaded onto the XY picking platform mechanism through the loading and feeding mechanism, and then the turret picking mechanism clamps the wafer chip on the XY picking platform mechanism and places it into the good and bad delivery modules, and the empty wafer disc is turned over by the wafer disc lifting and turning module, and after turning over, the wafer disc transfer and transplanting mechanism transports it to the substrate edge transfer and swing mechanism, and then the substrate edge stripping mechanism is used to strip the substrate edge, and after stripping, the substrate edge transfer and swing mechanism drives the wafer disc to reset, and finally the wafer disc is transported to the empty disc stacking assembly by the wafer disc transfer and transplanting mechanism for stacking and collection. The present invention realizes automatic loading of stuck materials, uses a visual system to guide the picking position, the wafer disc moves in XY direction to cooperate with the ejector of the ejector module to disengage, the substrate edge is peeled off by using a screw motor to push the ejector downward, and the wafer disc is flipped over and positioned by a lifting and flipping module; at the same time, double-station throwing positions for Pass products and NG products are provided, and empty wafer discs can be stacked and collected, thereby improving the degree of automation, eliminating the need for manual auxiliary operation during the peeling process, reducing labor intensity, and improving work efficiency; and the peeling position is also relatively accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional appearance structure of the present invention;

[0017] Figure 2 It is a schematic diagram of the internal structure of the present invention;

[0018] Figure 3 It is a schematic diagram of an enlarged top view of the structure of the present invention;

[0019] Figure 4 It is a schematic diagram of the explosion structure of the present invention;

[0020] Figure 5 It is an enlarged structural schematic diagram of the loading and feeding mechanism of the present invention;

[0021] Figure 6 It is a partial enlarged structural schematic diagram of the present invention;

[0022] Figure 7 It is an enlarged structural schematic diagram of the wafer disc transport and transplanting mechanism of the present invention;

[0023] Figure 8It is an enlarged structural schematic diagram of the substrate edge peeling mechanism of the present invention.

[0024] In the figure: 1, frame; 2, machine cover; 21, control panel; 3, loading and feeding mechanism; 31, lifting machine; 32, plug; 33, feeding linear module; 34, cylinder clamp; 4, XY picking platform mechanism; 41, Y-axis slide; 42, Y-axis linear motor module; 43, X-axis linear motor module; 44, wafer disk positioning platform; 45, ejector module; 5, turret picking mechanism; 51, gantry; 52, DD motor; 53, turret nozzle assembly; 54, picking vision guidance camera ; 6. Good and defective product sending module; 61. Screw module; 62. Defective barrel; 63. Good product barrel; 7. Wafer plate lifting and flipping module; 8. Wafer plate transfer and transplanting mechanism; 81. Three-axis module; 82. Suction cup module; 9. Substrate edge transfer and swing mechanism; 91. X-axis linear module; 92. Substrate edge peeling positioning platform; 93. Clamping cylinder; 10. Substrate edge peeling mechanism; 101. Three-axis motion assembly; 102. CCD camera; 103. Screw motor ejector; 11. Empty plate stacking assembly. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. In addition, the terms "first", "second", "third", "upper, lower, left, right", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. At the same time, in the description of the present invention, unless otherwise clearly specified and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0026] The structure of a fully automatic wafer chip stripping device provided by the present invention is as follows: Figure 1 as well as Figure 6As shown, it includes a frame 1, a hood 2 is installed on the top of the frame 1, and a control panel 21 is fixedly connected to the surface of the hood 2; an XY picking platform mechanism 4 is installed on one side of the surface of the frame 1, and the XY picking platform mechanism 4 includes a Y-axis slide 41, a Y-axis linear motor module 42, an X-axis linear motor module 43, a wafer disk positioning platform 44 and a pin module 45; a Y-axis slide 41 with a large opening in the middle is fixedly connected to the surface of the frame 1, the surface of the Y-axis slide 41 is slidably connected to the Y-axis linear motor module 42, the surface of the Y-axis linear motor module 42 is slidably connected to the X-axis linear motor module 43, and the sliding end of the X-axis linear motor module 43 is fixed with a wafer disk positioning platform 44, and an ejector module 45 is installed on the surface of the Y-axis slide 41, and the opening of the ejector module 45 that runs through the Y-axis slide 41 in the working state is used for lifting the wafer chip on the wafer disk.

[0027] During implementation, the Y-axis linear motor module 42 and the X-axis linear motor module 43 cooperate to drive the wafer on the surface of the wafer positioning platform 44 to move, and the ejector module 45 sequentially lifts the Pass or NG wafer chips.

[0028] Furthermore, if Figure 2 as well as Figure 5 As shown, a loading and feeding mechanism 3 is fixed on the surface of the frame 1 and on one side of the XY picking platform mechanism 4. The loading and feeding mechanism 3 is used to load the wafer disc onto the XY picking platform mechanism 4. The loading and feeding mechanism 3 is composed of a lifting machine 31, a plug 32, a feeding linear module 33 and a cylinder clamp 34. The lifting machine 31 is installed on the surface of the frame 1, and a plug 32 for placing the wafer disc is installed on the lifting seat of the lifting machine 31. The plug 32 is fixedly connected to the surface of the machine cover 2, and a cylinder clamp 34 is installed on the sliding end of the plug 32. The cylinder clamp 34 is used to clamp the wafer disc inside the plug 32 and place it on the surface of the wafer disc positioning platform 44.

[0029] During implementation, the lifter 31 drives the wafer disc in the plug 32 to rise to the material taking position of the cylinder clamp 34 in sequence, and then the feeding linear module 33 drives the cylinder clamp 34 to move to take the material and send the wafer disc to the wafer disc positioning platform 44.

[0030] Furthermore, if Figure 3 as well as Figure 6 As shown, a good and defective product sending module 6 is provided on one side of the XY picking platform mechanism 4. The good and defective product sending module 6 is composed of a screw module 61, a defective barrel 62 and a good product barrel 63. The screw module 61 is fixed to the surface of the frame 1, and the sliding end of the screw module 61 is installed with a defective barrel 62 and a good product barrel 63. The defective barrel 62 and the good product barrel 63 are used to hold NG wafer chips and Pass wafer chips respectively.

[0031] During implementation, the Pass and NG wafer chips are placed in the good barrel 63 and the bad barrel 62 respectively, and then the screw module 61 transports the Pass and NG wafer chips placed in the good barrel 63 and the bad barrel 62 out.

[0032] Furthermore, if Figure 4 as well as Figure 6 As shown, a turret picking mechanism 5 is installed on the surface of the frame 1, and the turret picking mechanism 5 is used to transport the wafer chips on the wafer disk in the XY picking platform mechanism 4 to the good and defective delivery module 6. The turret picking mechanism 5 is composed of a gantry 51, a DD motor 52, a turret suction nozzle assembly 53 and a picking vision guidance camera 54. The gantry 51 is fixed to the surface of the frame 1, and a picking vision guidance camera 54 is fixed on the surface of the gantry 51. The picking vision guidance camera 54 is used for visual inspection of the wafer chips on the wafer disk. A DD motor 52 is fixed on the surface of the gantry 51, and a turret suction nozzle assembly 53 is installed on the output end of the DD motor 52. The turret suction nozzle assembly 53 is used to clamp the Pass wafer chips and NG wafer chips on the wafer disk into the good product barrel 63 and the defective barrel 62 respectively.

[0033] During implementation, the picking vision guidance camera 54 will perform visual selection and inspection on the NG wafer chips and Pass wafer chips on the wafer disk, and the turret nozzle assembly 53 will absorb the Pass or NG wafer chips and place them into the corresponding good product barrel 63 or bad product barrel 62 respectively, and then transport them out through the screw module 61.

[0034] Furthermore, if Figure 3 as well as Figure 7 As shown, the surface of the frame 1 is respectively installed with a wafer disc lifting and flipping module 7 and a substrate edge transferring and swinging plate mechanism 9, the wafer disc lifting and flipping module 7 includes a lifting module installed on the frame 1 and a flipping cylinder fixed on the lifting module sliding seat and a suction cup installed at the output end of the flipping cylinder, a wafer disc transfer and transferring mechanism 8 is installed on one side of the surface of the frame 1, the wafer disc transfer and transferring mechanism 8 is used to transport the wafer disc after being flipped by the wafer disc lifting and flipping module 7 to the substrate edge transferring and swinging plate mechanism 9, the wafer disc transfer and transferring mechanism 8 includes a three-axis module 81 and a suction cup module 82, the three-axis module 81 is fixed on the surface of the frame 1, and the sliding end of the three-axis module 81 is installed with a suction cup module 82, the suction cup module 82 is used to transport the wafer disc after being flipped by the wafer disc lifting and flipping module 7 to the substrate edge peeling positioning platform 92.

[0035] During implementation, the wafer is lifted up by the lifting module of the wafer lifting and flipping module 7, and then the wafer is flipped by the flipping cylinder of the wafer lifting and flipping module 7; after flipping, the three-axis module 81 drives the suction cup module 82 to suck the empty wafer from the wafer lifting and flipping module 7 and put it into the surface of the substrate edge peeling positioning platform 92.

[0036] Furthermore, if Figure 2 as well as Figure 6 As shown, the substrate edge transfer and swinging mechanism 9 is composed of an X-axis linear module 91, a substrate edge stripping positioning platform 92 and a clamping cylinder 93. The X-axis linear module 91 is fixedly connected to the surface of the frame 1, and the substrate edge stripping positioning platform 92 with a board edge receiving box is installed on the sliding seat of the X-axis linear module 91. The four corner positions of the substrate edge stripping positioning platform 92 are fixedly connected to the clamping cylinder 93, which is used for clamping the wafer disc.

[0037] During implementation, the clamping cylinder 93 presses down to clamp the wafer, and then the X-axis linear module 91 drives the wafer on the surface of the substrate edge peeling positioning platform 92 to move to the substrate edge peeling mechanism 10 .

[0038] Furthermore, if Figure 3 as well as Figure 8 As shown, a substrate edge stripping mechanism 10 and an empty disk stacking assembly 11 are respectively installed on the surface of the frame 1 and on both sides of the substrate edge transferring and swinging mechanism 9. The substrate edge stripping mechanism 10 includes a three-axis motion assembly 101, a CCD camera 102 and a screw motor ejector pin 103. The three-axis motion assembly 101 is fixedly connected to the surface of the frame 1, and a CCD camera 102 and a screw motor ejector pin 103 are respectively installed on the sliding seat of the three-axis motion assembly 101. The CCD camera 102 is used for visual inspection of the substrate edge before stripping, and the screw motor ejector pin 103 is used for pressing down the substrate edge of the wafer disk for stripping.

[0039] During implementation, the three-axis motion component 101 drives the CCD camera 102 to perform visual inspection on the edge of the substrate to be peeled off. After the inspection, the three-axis motion component 101 drives the screw motor ejector 103 to move, and the screw motor of the screw motor ejector 103 drives the ejector to press down to peel off the edge of the substrate.

[0040] Working principle: When in use, first the wafer disc with wafer chips is loaded onto the XY picking platform mechanism 4 through the loading and feeding mechanism 3, and then the turret picking mechanism 5 clamps the wafer chips on the XY picking platform mechanism 4 into the good and bad product delivery module 6, and the empty wafer disc is turned over by the wafer disc lifting and turning module 7, and after turning over, the wafer disc transfer and transplanting mechanism 8 transports it to the substrate edge transfer and swing mechanism 9, and then the substrate edge peeling mechanism 10 is used to peel the substrate edge, and after peeling, the substrate edge transfer and swing mechanism 9 drives the wafer disc to reset, and finally the wafer disc is transported to the empty disc stacking assembly 11 by the wafer disc transfer and transplanting mechanism 8 for stacking and collection.

[0041] Specifically, the lifting machine 31 drives the wafer disc in the plug 32 to rise to the material picking position of the cylinder clamp 34 in sequence, and then the feeding linear module 33 drives the cylinder clamp 34 to move to pick up the material and send the wafer disc to the wafer disc positioning platform 44, and then the Y-axis linear motor module 42 drives the wafer disc to move to the bottom of the turret suction nozzle assembly 53, and then the Y-axis linear motor module 42 and the X-axis linear motor module 43 cooperate to drive the wafer disc on the surface of the wafer disc positioning platform 44 to move, so that each wafer chip of the wafer disc passes through the picking visual guidance camera 54, and the picking The vision guidance camera 54 will perform visual selection and inspection on the NG wafer chips and Pass wafer chips on the wafer disk. After a selection and inspection, the ejector pin module 45 will lift the Pass or NG wafer chips in turn and be adsorbed by the turret nozzle assembly 53. After adsorption, the turret nozzle assembly 53 will be rotated to the top of the defective barrel 62 or the good barrel 63 by the DD motor 52, and the Pass or NG wafer chips selected by the vision guidance camera 54 will be placed in the corresponding good barrel 63 or defective barrel 62 respectively, and then transported out by the screw module 61.

[0042] The empty wafer disk is transported to the wafer disk lifting and flipping module 7 by the Y-axis linear motor module 42, and the wafer disk is lifted up by the lifting module of the wafer disk lifting and flipping module 7, and then the flipping cylinder of the wafer disk lifting and flipping module 7 drives the wafer disk to flip over. After flipping, the three-axis module 81 drives the suction cup module 82 to suck the empty wafer disk from the wafer disk lifting and flipping module 7 and put it on the surface of the substrate edge peeling positioning platform 92. After putting it in, it is pressed down and clamped by the clamping cylinder 93, and then the X-axis linear module 91 drives the wafer disk on the surface of the substrate edge peeling positioning platform 92 to move to the substrate edge At the peeling mechanism 10, the three-axis motion component 101 drives the CCD camera 102 to perform visual inspection on the edge of the substrate to be peeled. After the inspection, the three-axis motion component 101 drives the screw motor ejector 103 to move, and the screw motor of the screw motor ejector 103 drives the ejector to press down to peel off the edge of the substrate. The peeled substrate edge will directly fall into the board edge collection box on the substrate edge peeling positioning platform 92. After peeling, the X-axis linear module 91 drives the wafer disk to return to its position, and then the three-axis module 81 drives the suction cup module 82 to move the wafer disk to the empty disk stacking assembly 11 for stacking and collection.

[0043] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and range of equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A fully automatic wafer chip peeling device, comprising a frame (1), characterized in that: A hood (2) is installed on the top of the frame (1), and a control panel (21) is fixedly connected to the surface of the hood (2); an XY picking platform mechanism (4) is installed on one side of the surface of the frame (1); a loading and feeding mechanism (3) is fixed on the surface of the frame (1) and located on one side of the XY picking platform mechanism (4); the loading and feeding mechanism (3) is used to load the wafer disc onto the XY picking platform mechanism (4); a good product and bad product delivery module (6) is arranged on one side of the XY picking platform mechanism (4); a turret picking mechanism (5) is installed on the surface of the frame (1), and the turret picking mechanism (5) is used to load the XY picking platform mechanism (4) onto the wafer disc; The wafer chips on the wafer disc in the platform mechanism (4) are transported to the good product and bad product delivery module (6); the surface of the frame (1) is respectively installed with a wafer disc lifting and flipping module (7) and a substrate edge transfer and swinging mechanism (9); one side of the surface of the frame (1) is installed with a wafer disc transfer and transfer mechanism (8), and the wafer disc transfer and transfer mechanism (8) is used to transfer the wafer disc flipped by the wafer disc lifting and flipping module (7) to the substrate edge transfer and swinging mechanism (9); the surface of the frame (1) and on both sides of the substrate edge transfer and swinging mechanism (9) are respectively installed with a substrate edge peeling mechanism (10) and an empty disc stacking assembly (11).

2. The fully automatic wafer chip peeling device according to claim 1, characterized in that: The XY picking platform mechanism (4) comprises a Y-axis slide plate (41), a Y-axis linear motor module (42), an X-axis linear motor module (43), a wafer disk positioning platform (44) and a ejector pin module (45); the surface of the frame (1) is fixedly connected with the Y-axis slide plate (41), and the surface of the Y-axis slide plate (41) is slidably connected with the Y-axis linear motor module (42).

3. The fully automatic wafer chip peeling device according to claim 2, characterized in that: The surface of the Y-axis linear motor module (42) is slidably connected to the X-axis linear motor module (43), and a wafer disk positioning platform (44) is fixed to the sliding end of the X-axis linear motor module (43), and a ejector module (45) is installed on the surface of the Y-axis slide plate (41).

4. The fully automatic wafer chip peeling device according to claim 1, characterized in that: The loading and feeding mechanism (3) is composed of a lift (31), a plug (32), a feeding linear module (33) and a cylinder clamp (34); the lift (31) is mounted on the surface of a frame (1), and a plug (32) for placing a wafer disk is mounted on a lifting seat of the lift (31); the plug (32) is fixed to the surface of a machine cover (2), and a cylinder clamp (34) is mounted on a sliding end of the plug (32); the cylinder clamp (34) is used to clamp the wafer disk inside the plug (32) and place it on the surface of a wafer disk positioning platform (44).

5. The fully automatic wafer chip peeling device according to claim 1, characterized in that: The good and defective product delivery module (6) is composed of a screw module (61), a defective barrel (62) and a good product barrel (63). The screw module (61) is fixed to the surface of the frame (1), and the sliding end of the screw module (61) is installed with the defective barrel (62) and the good product barrel (63). The defective barrel (62) and the good product barrel (63) are used to contain NG wafer chips and Pass wafer chips respectively.

6. The fully automatic wafer chip peeling device according to claim 1, characterized in that: The turret picking mechanism (5) is composed of a gantry (51), a DD motor (52), a turret suction nozzle assembly (53) and a picking vision guidance camera (54). The gantry (51) is fixed to the surface of the frame (1). The surface of the gantry (51) is fixed with a picking vision guidance camera (54). The picking vision guidance camera (54) is used for visual inspection of wafer chips on a wafer disk.

7. The fully automatic wafer chip peeling device according to claim 6, characterized in that: A DD motor (52) is fixed on the surface of the gantry (51), and a turret nozzle assembly (53) is installed at the output end of the DD motor (52). The turret nozzle assembly (53) is used to clamp the pass wafer chips and the NG wafer chips on the wafer disk into the good product barrel (63) and the bad product barrel (62) respectively.

8. The fully automatic wafer chip peeling device according to claim 1, characterized in that: The substrate edge transfer and swinging mechanism (9) is composed of an X-axis linear module (91), a substrate edge peeling positioning platform (92) and a clamping cylinder (93); the X-axis linear module (91) is fixedly connected to the surface of the frame (1), and the substrate edge peeling positioning platform (92) is installed on the sliding seat of the X-axis linear module (91); the four corner positions of the substrate edge peeling positioning platform (92) are fixedly connected to the clamping cylinder (93), and the clamping cylinder (93) is used for clamping the wafer disc.

9. The fully automatic wafer chip peeling device according to claim 1, characterized in that: The wafer disk transfer and transplanting mechanism (8) comprises a three-axis module (81) and a suction cup module (82); the three-axis module (81) is fixedly connected to the surface of the frame (1); and the suction cup module (82) is installed at the sliding end of the three-axis module (81); the suction cup module (82) is used to transport the wafer disk turned over by the wafer disk lifting and flipping module (7) to the substrate edge peeling positioning platform (92).

10. The fully automatic wafer chip peeling device according to claim 1, characterized in that: The substrate edge stripping mechanism (10) comprises a three-axis motion component (101), a CCD camera (102) and a screw motor ejector pin (103); the three-axis motion component (101) is fixedly connected to the surface of a frame (1), and the CCD camera (102) and the screw motor ejector pin (103) are respectively mounted on the sliding seat of the three-axis motion component (101); the CCD camera (102) is used for visual inspection before substrate edge stripping, and the screw motor ejector pin (103) is used for pressing down the substrate edge of a wafer disk for stripping.

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