Full-automatic wafer chip stripping equipment

Abstract

The application relates to the technical field of wafer chip production, in particular to a full-automatic stripping equipment for wafer chips, which comprises a rack, a machine cover is arranged at the top end of the rack, an XY pickup platform mechanism is arranged on one side of the surface of the rack, a feeding and feeding mechanism is fixed on the surface of the rack and located at one side of the XY pickup platform mechanism, a good product and a poor product sending-out module is arranged on one side of the XY pickup platform mechanism, a turret pickup mechanism is arranged on the surface of the rack, a wafer disc lifting and overturning module and a substrate edge transplanting and tray arranging mechanism are respectively arranged on the surface of the rack, a wafer disc transfer and transplanting mechanism is arranged on one side of the surface of the rack, and a substrate edge stripping mechanism and a empty tray stacking assembly are respectively arranged on the surface of the rack and located at the two sides of the substrate edge transplanting and tray arranging mechanism. The application improves the automation degree and work efficiency, does not need manual auxiliary operation in the stripping process, reduces the labor intensity, and the stripping position is relatively accurate.

Description

TECHNICAL FIELD

[0001] The present application relates to wafer chip production technology field, specifically to a kind of full-automatic stripping equipment of wafer chip. BACKGROUND

[0002] Wafer refers to the silicon wafer used for the manufacture of silicon semiconductor integrated circuits, since its shape is circular, it is called wafer; Various circuit element structures can be processed and manufactured on the silicon wafer to become IC products with specific electrical properties, wafer chips need stripping equipment when stripping from wafer disc.

[0003] At present, the existing wafer chip is manually operated when stripping, and the degree of automation is low, so the labor intensity during stripping is increased, and the work efficiency is reduced; And since the whole stripping process needs to be completed by manual assistance, the position during stripping is not accurate enough, thereby causing great trouble to people's use. SUMMARY

[0004] The present application aims to provide a kind of full-automatic stripping equipment of wafer chip to solve the problem of low work efficiency and inaccurate stripping position proposed in the above background art.

[0005] To achieve the above object, the present application provides the following technical scheme: a kind of full-automatic stripping equipment of wafer chip, including rack, the top of the rack is installed with machine cover, and the surface of machine cover is fixed with control panel;XY pickup platform mechanism is installed on one side of the surface of the rack, the surface of the rack and located on one side of XY pickup platform mechanism is fixed with feeding and feeding mechanism, which is used to feed wafer disc to XY pickup platform mechanism;Good and bad send out module is arranged on one side of the XY pickup platform mechanism, a turret pickup mechanism is installed on the surface of the rack, which is used to carry wafer chip on wafer disc in XY pickup platform mechanism to good and bad send out module;Wafer disc lifting and turning over module and substrate edge transplanting and placing mechanism are respectively installed on the surface of the rack, wafer disc transfer and transplanting mechanism is installed on one side of the surface of the rack, which is used to carry wafer disc after wafer disc lifting and turning over module turns over to substrate edge transplanting and placing mechanism;Wafer edge stripping mechanism and empty disc stacking assembly are respectively installed on both sides of substrate edge transplanting and placing mechanism on the surface of the rack.

[0006] Preferably, the XY pickup platform mechanism includes Y-axis sliding plate, Y-axis linear motor module, X-axis linear motor module, wafer disc positioning platform and thimble module, the surface of the rack is fixed with Y-axis sliding plate, the surface of the Y-axis sliding plate is slidably connected with Y-axis linear motor module.

[0007] Preferably, the surface of the Y-axis linear motor module is slidably connected with an X-axis linear motor module, and the sliding end of the X-axis linear motor module is fixed with a wafer disc positioning platform, and the surface of the Y-axis sliding plate is mounted with a thimble module.

[0008] Preferably, the feeding and feeding mechanism is composed of an elevator, a cassette, a feeding linear module and a cylinder clamp jaw, the elevator is mounted on the surface of the rack, and the lifting seat of the elevator is mounted with a cassette for placing a wafer disc, the cassette is fixed on the surface of the machine cover, and the sliding end of the cassette is mounted with a cylinder clamp jaw for clamping and placing the wafer disc inside the cassette on the surface of the wafer disc positioning platform.

[0009] Preferably, the good and bad sending module is composed of a lead screw module, a bad barrel and a good barrel, the lead screw module is fixed on the surface of the rack, and the sliding end of the lead screw module is mounted with a bad barrel and a good barrel, which are respectively used for containing NG wafer chips and Pass wafer chips.

[0010] Preferably, the turret pickup mechanism is composed of a gantry, a DD motor, a turret suction nozzle assembly and a pickup visual guidance mechanism, the gantry is fixed on the surface of the rack, and the surface of the gantry is fixed with a pickup visual guidance camera for visual detection of the wafer chips on the wafer disc.

[0011] Preferably, the surface of the gantry is fixed with a DD motor, and the output end of the DD motor is mounted with a turret suction nozzle assembly for clamping and placing the Pass wafer chips and NG wafer chips on the wafer disc into the good barrel and the bad barrel respectively.

[0012] Preferably, the substrate edge transplanting and disc placing mechanism is composed of an X-axis linear module, a substrate edge peeling positioning platform and a pressing cylinder, the X-axis linear module is fixed on the surface of the rack, and the sliding seat of the X-axis linear module is mounted with a substrate edge peeling positioning platform, and the four corner positions of the substrate edge peeling positioning platform are fixed with pressing cylinders for pressing the wafer disc.

[0013] Preferably, the wafer disc transfer and transplanting mechanism comprises a three-axis module and a suction disc module, the three-axis module is fixed on the surface of the rack, and the sliding end of the three-axis module is mounted with a suction disc module for carrying the wafer disc after the wafer disc is turned over by the wafer disc lifting and turning over module to the substrate edge peeling positioning platform.

[0014] Preferably, the substrate edge peeling mechanism comprises a three-axis motion assembly, a CCD camera and a lead screw motor needle, the three-axis motion assembly is fixed on the surface of the frame, and the sliding seat of the three-axis motion assembly is respectively provided with the CCD camera and the lead screw motor needle, the CCD camera is used for visual inspection before substrate edge peeling, and the lead screw motor needle is used for pressing and peeling the substrate edge of the wafer disc.

[0015] Compared with the prior art, the wafer chip full-automatic peeling equipment has the following beneficial effects: the wafer disc with a wafer chip is fed to the XY pickup platform mechanism through the feeding and feeding mechanism, then the turret pickup mechanism clamps and places the wafer chip on the XY pickup platform mechanism into the good product and poor product feeding-out module, the empty wafer disc is turned over through the wafer disc lifting and turning module, the wafer disc is transported to the substrate edge transfer and placement mechanism after turning over, then the substrate edge peeling mechanism is used for peeling the substrate edge, the substrate edge transfer and placement mechanism drives the wafer disc to reset after peeling, and finally the wafer disc is transported to the empty disc stacking assembly for stacking and collecting. The wafer chip full-automatic peeling equipment realizes automatic feeding, uses a vision system to guide the pickup position, cooperates the needle of the needle module to separate the wafer disc, uses the lead screw motor needle to realize peeling, the wafer disc is turned over and positioned through the lifting and turning module, and the empty wafer disc is discharged to realize stacking and collecting, the degree of automation is improved, manual auxiliary operation is not needed in the peeling process, labor intensity is reduced, work efficiency is improved, and the peeling position is relatively accurate. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a three-dimensional appearance structure schematic view of the present application;

[0017] Figure 2 It is an internal structure schematic view of the present application;

[0018] Figure 3 It is a top enlarged structure schematic view of the present application;

[0019] Figure 4 It is an explosion structure schematic view of the present application;

[0020] Figure 5 It is an enlarged structure schematic view of the feeding and feeding mechanism of the present application;

[0021] Figure 6 It is a partial enlarged structure schematic view of the present application;

[0022] Figure 7 It is an enlarged structure schematic view of the wafer disc transfer and placement mechanism of the present application;

[0023] Figure 8The application provides a substrate edge peeling mechanism.

[0024] In the figure: 1, frame; 2, machine cover; 21, control panel; 3, feeding and feeding mechanism; 31, elevator; 32, jam; 33, feeding linear module; 34, cylinder clamping jaw; 4, XY pickup platform mechanism; 41, Y-axis sliding plate; 42, Y-axis linear motor module; 43, X-axis linear motor module; 44, wafer disc positioning platform; 45, thimble module; 5, turret pickup mechanism; 51, gantry; 52, DD motor; 53, turret suction nozzle assembly; 54, pickup visual guidance camera; 6, good and bad sending module; 61, lead screw module; 62, bad barrel; 63, good barrel; 7, wafer disc lifting and turning over module; 8, wafer disc transfer and transplanting mechanism; 81, three-axis module; 82, suction disc module; 9, substrate edge transplanting and tray arranging mechanism; 91, X-axis linear module; 92, substrate edge peeling positioning platform; 93, compression cylinder; 10, substrate edge peeling mechanism; 101, three-axis motion assembly; 102, CCD camera; 103, lead screw motor thimble; 11, empty disc stacking assembly. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, not all the embodiments of the application. In addition, the terms "first", "second", "third", "upper", "lower", "left", "right" and the like are only used for description purposes, and cannot be understood as indicating or implying relative importance. In the description of the application, unless otherwise explicitly specified and limited, the terms "connected", "connected" should be understood in a broad sense, for example, can be fixedly connected, can be detachably connected, or integrally connected; can be mechanically connected, or electrically connected; can be directly connected, or indirectly connected through an intermediate medium. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the application.

[0026] The structure of the full-automatic peeling equipment for a wafer chip provided by the application is as shown in Figure 1 and Figure 6As shown, including rack 1, the top end of rack 1 is mounted with a hood 2, and the surface of the hood 2 is fixedly connected with a control panel 21; one side of the surface of the rack 1 is mounted with an XY pickup platform mechanism 4, the XY pickup platform mechanism 4 comprises a Y-axis sliding plate 41, a Y-axis linear motor module 42, an X-axis linear motor module 43, a wafer disc positioning platform 44 and a needle module 45, the surface of the rack 1 is fixedly connected with the Y-axis sliding plate 41 with a large opening in the middle, the surface of the Y-axis sliding plate 41 is slidably connected with the Y-axis linear motor module 42, the surface of the Y-axis linear motor module 42 is slidably connected with the X-axis linear motor module 43, and the sliding end of the X-axis linear motor module 43 is fixedly connected with the wafer disc positioning platform 44, and the surface of the Y-axis sliding plate 41 is mounted with the needle module 45, which is used for lifting the wafer chip on the wafer disc in the working state.

[0027] In implementation, the Y-axis linear motor module 42 and the X-axis linear motor module 43 drive the wafer disc on the surface of the wafer disc positioning platform 44 to move, and the needle module 45 lifts the Pass or NG wafer chip in turn.

[0028] Further, as shown in Figure 2 and Figure 5 , the surface of the rack 1 and one side of the XY pickup platform mechanism 4 are fixedly connected with a feeding and feeding mechanism 3, which is used for feeding the wafer disc to the XY pickup platform mechanism 4, and the feeding and feeding mechanism 3 is composed of an elevator 31, a clamp 32, a feeding linear module 33 and a cylinder clamp 34, the elevator 31 is installed on the surface of the rack 1, and the lifting seat of the elevator 31 is installed with the clamp 32 used for placing the wafer disc, the clamp 32 is fixedly connected with the surface of the hood 2, and the sliding end of the clamp 32 is installed with the cylinder clamp 34, which is used for clamping and placing the wafer disc in the clamp 32 to the surface of the wafer disc positioning platform 44.

[0029] In implementation, the elevator 31 drives the wafer disc in the clamp 32 to rise to the material taking position of the cylinder clamp 34 in turn, and then the feeding linear module 33 drives the cylinder clamp 34 to move to take the material and send the wafer disc to the wafer disc positioning platform 44.

[0030] Further, as shown in Figure 3 and Figure 6 , one side of the XY pickup platform mechanism 4 is provided with a good and bad sending module 6, the good and bad sending module 6 is composed of a lead screw module 61, a bad barrel 62 and a good barrel 63, the lead screw module 61 is fixedly connected with the surface of the rack 1, and the sliding end of the lead screw module 61 is installed with the bad barrel 62 and the good barrel 63, the bad barrel 62 and the good barrel 63 are respectively used for containing the NG wafer chip and the Pass wafer chip.

[0031] During implementation, Pass and NG wafer chips are placed into good product bin 63 and defective bin 62 respectively, and then the lead screw module 61 delivers the Pass and NG wafer chips placed in good product bin 63 and defective bin 62.

[0032] Furthermore, such as Figure 4 as well as Figure 6 As shown, a turret-type pickup mechanism 5 is mounted on the surface of the rack 1. This turret-type pickup mechanism 5 is used to transport the wafer chips on the wafer disk in the XY pickup platform mechanism 4 to the good and bad product delivery module 6. The turret-type pickup mechanism 5 consists of a gantry 51, a DD motor 52, a turret nozzle assembly 53, and a pickup vision guidance camera 54. The gantry 51 is fixed to the surface of the rack 1, and the pickup vision guidance camera 54 is fixed on the surface of the gantry 51. The pickup vision guidance camera 54 is used for visual inspection of the wafer chips on the wafer disk. The DD motor 52 is fixed on the surface of the gantry 51, and the turret nozzle assembly 53 is mounted on the output end of the DD motor 52. The turret nozzle assembly 53 is used to clamp the Pass wafer chips and NG wafer chips on the wafer disk into the good product bin 63 and the bad product bin 62, respectively.

[0033] During implementation, the pickup vision guidance camera 54 performs visual selection and inspection on the NG wafer chips and Pass wafer chips on the wafer disk. The turret nozzle assembly 53 picks up the Pass or NG wafer chips and puts them into the corresponding good product bin 63 or bad product bin 62 respectively. After being put in, they are transported out through the lead screw module 61.

[0034] Furthermore, such as Figure 3 as well as Figure 7 As shown, a wafer disk lifting and flipping module 7 and a substrate edge transfer and placement mechanism 9 are respectively installed on the surface of the rack 1. The wafer disk lifting and flipping module 7 includes a lifting module installed on the rack 1, a flipping cylinder fixed to the sliding seat of the lifting module, and a suction cup installed at the output end of the flipping cylinder. A wafer disk transfer and placement mechanism 8 is installed on one side of the surface of the rack 1. The wafer disk transfer and placement mechanism 8 is used to transport the wafer disk flipped by the wafer disk lifting and flipping module 7 to the substrate edge transfer and placement mechanism 9. The wafer disk transfer and placement mechanism 8 includes a three-axis module 81 and a suction cup module 82. The three-axis module 81 is fixed to the surface of the rack 1, and the sliding end of the three-axis module 81 is equipped with a suction cup module 82. The suction cup module 82 is used to transport the wafer disk flipped by the wafer disk lifting and flipping module 7 to the substrate edge peeling and positioning platform 92.

[0035] During implementation, the wafer disk is lifted by the lifting module of the wafer disk lifting and flipping module 7, and then the flipping cylinder of the wafer disk lifting and flipping module 7 flips the wafer disk. After flipping, the three-axis module 81 drives the suction cup module 82 to pick up the empty wafer disk from the wafer disk lifting and flipping module 7 and place it on the surface of the substrate edge peeling and positioning platform 92.

[0036] Further, as shown in Figure 2 and Figure 6 , the substrate edge transplanting and tray placing mechanism 9 is composed of an X-axis linear module 91, a substrate edge stripping positioning platform 92 and a pressing cylinder 93. The X-axis linear module 91 is fixedly connected to the surface of the rack 1, and the substrate edge stripping positioning platform 92 with a substrate edge stripping box is installed on the sliding seat of the X-axis linear module 91. The pressing cylinder 93 is fixedly connected to the four corner positions of the substrate edge stripping positioning platform 92, and is used for pressing the wafer disc.

[0037] In implementation, the pressing cylinder 93 presses and clamps the wafer disc, and then the X-axis linear module 91 drives the wafer disc on the surface of the substrate edge stripping positioning platform 92 to move to the substrate edge stripping mechanism 10.

[0038] Further, as shown in Figure 3 and Figure 8 , the rack 1 surface and located on both sides of the substrate edge transplanting and tray placing mechanism 9 are respectively installed with the substrate edge stripping mechanism 10 and the empty disc stacking assembly 11. The substrate edge stripping mechanism 10 includes a three-axis motion assembly 101, a CCD camera 102 and a lead screw motor needle 103. The three-axis motion assembly 101 is fixedly connected to the surface of the rack 1, and the CCD camera 102 and the lead screw motor needle 103 are respectively installed on the sliding seat of the three-axis motion assembly 101. The CCD camera 102 is used for visual detection before substrate edge stripping, and the lead screw motor needle 103 is used for substrate edge stripping work.

[0039] In implementation, the CCD camera 102 is driven by the three-axis motion assembly 101 to visually detect the substrate edge to be stripped. After detection, the lead screw motor needle 103 is driven by the three-axis motion assembly 101 to move. The lead screw motor of the lead screw motor needle 103 drives the needle to press down and strip the substrate edge.

[0040] Working principle: in use, the wafer disc with wafer chips is first fed to the XY pickup platform mechanism 4 through the feeding and feeding mechanism 3, and then the wafer chips on the XY pickup platform mechanism 4 are clamped and placed into the good and bad product feeding module 6 by the turret pickup mechanism 5. The empty wafer disc is turned over by the wafer disc lifting and turning over module 7, and then the wafer disc is transported to the substrate edge transplanting and tray placing mechanism 9 by the wafer disc transfer and transplanting mechanism 8. The substrate edge is stripped by the substrate edge stripping mechanism 10, and then the wafer disc is reset by the substrate edge transplanting and tray placing mechanism 9. Finally, the wafer disc is transported to the empty disc stacking assembly 11 for stacking and collecting by the wafer disc transfer and transplanting mechanism 8.

[0041] Specifically, the hoist 31 drives the wafer disc in the cassette 32 to sequentially rise to the taking position of the cylinder clamp jaw 34, then the feeding linear module 33 drives the cylinder clamp jaw 34 to move to take the wafer disc and send it to the wafer disc positioning platform 44, then the Y-axis linear motor module 42 drives the wafer disc to move to the position directly below the turret suction nozzle assembly 53, then the Y-axis linear motor module 42 and the X-axis linear motor module 43 cooperate to drive the wafer disc on the surface of the wafer disc positioning platform 44 to move, so that each wafer chip of the wafer disc passes through the picking visual guide camera 54, the picking visual guide camera 54 will visually select and detect the NG wafer chip and the Pass wafer chip on the wafer disc, after one round of selection and detection, the ejector pin module 45 sequentially ejects the Pass or NG wafer chip to be adsorbed by the turret suction nozzle assembly 53, the turret suction nozzle assembly 53 is adsorbed and then rotates to the upper side of the defective barrel 62 or the good barrel 63 through the DD motor 52, and the Pass or NG wafer chip selected by the picking visual guide camera 54 is respectively put into the corresponding good barrel 63 or defective barrel 62, and then is transported out through the lead screw module 61.

[0042] The empty wafer disc is transported to the wafer disc lifting and turning module 7 by the Y-axis linear motor module 42, is driven to rise by the lifting module of the wafer disc lifting and turning module 7, then is turned over by the turning-over cylinder of the wafer disc lifting and turning module 7, after turning over, the three-axis module 81 drives the suction disc module 82 to suck the empty wafer disc from the wafer disc lifting and turning module 7 and put it on the surface of the substrate edge peeling positioning platform 92, after being put in, is clamped by being pressed down by the pressing cylinder 93, then the X-axis linear module 91 drives the wafer disc on the surface of the substrate edge peeling positioning platform 92 to move to the substrate edge peeling mechanism 10, the CCD camera 102 is driven by the three-axis movement assembly 101 to visually detect the substrate edge that needs to be peeled, after detection, the lead screw motor ejector pin 103 is driven by the three-axis movement assembly 101 to move, the lead screw motor of the lead screw motor ejector pin 103 drives the ejector pin to press down to peel the substrate edge, the peeled substrate edge will directly fall into the substrate edge collection box on the substrate edge peeling positioning platform 92, after peeling, the X-axis linear module 91 drives the wafer disc to return, and then the suction disc module 82 is driven by the three-axis module 81 to carry the wafer disc to the empty disc stacking assembly 11 to be stacked and collected.

[0043] It will be apparent to those skilled in the art that the application is not limited to the details of the above-described exemplary embodiments, but that the application can be implemented in other concrete forms without departing from the spirit or essential characteristics of the application. Therefore, the embodiments should be considered in all respects as illustrative and not restrictive, and the scope of the application should be defined by the appended claims rather than the above description, and it is intended to encompass all changes falling within the meaning and scope of the equivalent elements of the claims. Any reference signs in the claims should not be considered as limiting the claims involved.

Claims

1. A fully automatic wafer chip stripping apparatus comprising a frame (1), characterized in that: The top end of the rack (1) is provided with a hood (2), and the surface of the hood (2) is fixedly connected with a control panel (21); one side of the surface of the rack (1) is provided with an XY pickup platform mechanism (4), and one side of the surface of the rack (1) and located at the XY pickup platform mechanism (4) is fixedly provided with a feeding and feeding mechanism (3), which is used for feeding a wafer disc to the XY pickup platform mechanism (4); one side of the XY pickup platform mechanism (4) is provided with a good and bad sending-out module (6), and the surface of the rack (1) is provided with a turret pickup mechanism (5), which is used for carrying a wafer chip on a wafer disc in the XY pickup platform mechanism (4) to the good and bad sending-out module (6); the surface of the rack (1) is respectively provided with a wafer disc lifting and turning module (7) and a substrate edge transplanting and disc placing mechanism (9), and one side of the surface of the rack (1) is provided with a wafer disc transfer and transplanting mechanism (8), which is used for carrying the wafer disc after the wafer disc lifting and turning module (7) is turned over to the substrate edge transplanting and disc placing mechanism (9); the surface of the rack (1) and located at both sides of the substrate edge transplanting and disc placing mechanism (9) is respectively provided with a substrate edge stripping mechanism (10) and an empty disc stacking assembly (11).

2. The full-automatic wafer die debonding apparatus according to claim 1, wherein: The XY pickup platform mechanism (4) comprises a Y-axis sliding plate (41), a Y-axis linear motor module (42), an X-axis linear motor module (43), a wafer disc positioning platform (44) and a thimble module (45), and the surface of the rack (1) is fixedly connected with the Y-axis sliding plate (41), and the surface of the Y-axis sliding plate (41) is slidably connected with the Y-axis linear motor module (42).

3. The full-automatic wafer die debonding apparatus according to claim 2, wherein: The surface of the Y-axis linear motor module (42) is slidably connected with the X-axis linear motor module (43), and the sliding end of the X-axis linear motor module (43) is fixedly connected with the wafer disc positioning platform (44), and the surface of the Y-axis sliding plate (41) is provided with the thimble module (45).

4. The full-automatic wafer die debonding apparatus of claim 1, wherein: The feeding and feeding mechanism (3) is composed of an elevator (31), a cassette (32), a feeding linear module (33) and a cylinder clamp jaw (34), the elevator (31) is installed on the surface of the rack (1), and the lifting seat of the elevator (31) is provided with the cassette (32) for placing the wafer disc, the cassette (32) is fixedly connected on the surface of the hood (2), and the sliding end of the cassette (32) is provided with the cylinder clamp jaw (34), which is used for clamping and placing the wafer disc in the cassette (32) on the surface of the wafer disc positioning platform (44).

5. The full-automatic wafer die debonding apparatus according to claim 1, wherein: The good and bad sending-out module (6) is composed of a lead screw module (61), a bad barrel (62) and a good barrel (63), the lead screw module (61) is fixedly connected on the surface of the rack (1), and the sliding end of the lead screw module (61) is provided with the bad barrel (62) and the good barrel (63), which are respectively used for containing NG wafer chips and Pass wafer chips.

6. The full-automatic wafer die debonding apparatus according to claim 1, wherein: The rotating tower pickup mechanism (5) is composed of a gantry (51), a DD motor (52), a rotating tower suction nozzle assembly (53) and a pickup visual guidance camera (54), the gantry (51) is fixed on the surface of the rack (1), the surface of the gantry (51) is fixed with the pickup visual guidance camera (54), which is used for visual detection of wafer chips on the wafer disc.

7. The full-automatic wafer chip stripping apparatus according to claim 6, characterized in that: The surface of the gantry (51) is fixed with the DD motor (52), and the output end of the DD motor (52) is provided with the rotating tower suction nozzle assembly (53), which is used for clamping and placing the Pass wafer chips and NG wafer chips on the wafer disc into the good barrel (63) and the bad barrel (62) respectively.

8. The full-automatic wafer die debonding apparatus of claim 1, wherein: The substrate edge stripping and transplanting disc mechanism (9) is composed of an X-axis linear module (91), a substrate edge stripping positioning platform (92) and a pressing cylinder (93), the X-axis linear module (91) is fixed on the surface of the rack (1), and the sliding seat of the X-axis linear module (91) is provided with the substrate edge stripping positioning platform (92), the four corner positions of the substrate edge stripping positioning platform (92) are fixed with the pressing cylinder (93), which is used for pressing the wafer disc.

9. The full-automatic wafer die debonding apparatus of claim 1, wherein: The wafer disc transfer and transplanting mechanism (8) comprises a three-axis module (81) and a suction disc module (82), the three-axis module (81) is fixed on the surface of the rack (1), and the sliding end of the three-axis module (81) is provided with the suction disc module (82), which is used for carrying the wafer disc after being turned over by the wafer disc lifting and turning over mechanism (7) to the substrate edge stripping positioning platform (92).

10. The full-automatic wafer chip stripping apparatus according to claim 1, wherein: The substrate edge stripping mechanism (10) comprises a three-axis motion assembly (101), a CCD camera (102) and a lead screw motor thimble (103), the three-axis motion assembly (101) is fixed on the surface of the rack (1), and the sliding seat of the three-axis motion assembly (101) is respectively provided with the CCD camera (102) and the lead screw motor thimble (103), the CCD camera (102) is used for visual detection before substrate edge stripping, and the lead screw motor thimble (103) is used for substrate edge pressing and stripping work of the wafer disc.

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