Wafer edge processing device

Abstract

The invention relates to the technical field of semiconductor manufacturing, and provides a wafer edge processing device which comprises a posture adjusting unit and an execution unit. The posture adjusting unit is used for supporting the periphery of a wafer and driving the wafer to rotate; and the execution unit is arranged on the posture adjustment unit and is used for operating the edge of the wafer when the wafer rotates. The device is supported on the periphery of the wafer and can drive the wafer to rotate, the edge of the wafer can be processed in the wafer rotating process, the wafer processing process is simplified, and pollution to the wafer caused by manual contact can be avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a wafer edge processing device. Background Art

[0002] In semiconductor manufacturing, it is often necessary to process the edges of wafers.

[0003] For example, in the physical vapor deposition (PVD) process of the wafer, it is necessary to use a ring-shaped part to press and fix the edge of the wafer. The edge pressing is required to be uniform (the radial size of the edge of the wafer should be kept consistent), so it is necessary to monitor the edge pressing. The usual processing method is to measure the size of the annular area on the edge of the wafer after the wafer has completed the physical vapor deposition process (because the edge of the wafer is pressed, the position where the edge is pressed cannot be deposited, so a significant annular area will be generated). The existing measurement method is to measure manually, and the starting position needs to be judged by the naked eye, which affects the measurement accuracy. In addition, it is usually required to avoid touching the wafer with hands during the measurement process to prevent contamination of the wafer. This makes the manual measurement process more difficult, there is a large uncertainty, and it is easy to scratch the surface of the wafer. In addition, during the measurement process, the wafer needs to be taken out of the wafer boat and placed in a flat position for measurement (generally placed in a dust-free book). There is no fixed detection placement position, which increases the uncertainty of wafer measurement and the risk of scratches and breakage.

[0004] For example, there are usually burrs and residual glue on the edge of the wafer, and the edge needs to be cleaned before the physical vapor deposition process. The existing processing method is usually to clean it manually with a handheld tool, and this cleaning process also has a high risk of scratching and breaking.

[0005] To this end, the present invention provides a wafer edge processing device to improve the above-mentioned technical problems in processing the wafer edge. Summary of the invention

[0006] The object of the present invention is to provide a wafer edge processing device, which is supported on the periphery of the wafer and can drive the wafer to rotate. The edge of the wafer can be processed during the wafer rotation process, thereby simplifying the wafer processing process and avoiding contamination of the wafer by manual contact.

[0007] The present invention provides a wafer edge processing device, comprising: a posture adjustment unit and an execution unit; the posture adjustment unit is used to support the periphery of the wafer and drive the wafer to rotate; the execution unit is arranged in the posture adjustment unit, and is used to operate the edge of the wafer when the wafer rotates. The posture adjustment unit is supported on the outer peripheral surface of the wafer and can drive the wafer to rotate, so as to facilitate the execution unit to process the edge of the wafer (for example, measure, de-glue, deburr or clean). The wafer edge processing device can be used in conjunction with the existing wafer rack. On the one hand, batch processing of wafers can be achieved. On the other hand, manual contact with the wafer is not required during the transfer and edge processing of the wafer, which can prevent contamination of the wafer. By setting the execution unit to perform the processing operation of the wafer edge, it is conducive to realizing the standardization of edge processing, reducing the uncertainty caused by human operation factors, and helping to improve processing accuracy and reduce the risk of wafer scratches and fragments. The above-mentioned wafer edge processing device has a relatively simple operation process, which helps to improve the efficiency of wafer edge processing, and has a specific placement position during wafer edge processing, which can improve the phenomenon of uncertain processing accuracy caused by random wafer placement position during existing manual processing.

[0008] Optionally, the posture adjustment unit includes an adjustment member, the adjustment member is used to support the outer periphery of the wafer, and the adjustment member is arranged to rotate to drive the wafer to rotate. The posture adjustment component drives the wafer to rotate by rotating. On the one hand, it can adapt to the shape of the existing wafer, facilitate the adjustment of the circumferential position of the wafer, and cooperate with the existing wafer rack to realize batch processing of wafers. On the other hand, it is also conducive to improving the rotation accuracy of the wafer.

[0009] Optionally, the adjustment member includes a first rotating shaft and a second rotating shaft, the first rotating shaft and the second rotating shaft are arranged to rotate around their own central axes, and the first rotating shaft and the second rotating shaft are arranged in parallel.

[0010] Optionally, the execution unit includes an execution member, and the execution member is movably arranged on the posture adjustment unit.

[0011] Optionally, when the posture adjustment unit includes an adjustment member,

[0012] The actuator moves relative to the posture adjustment unit in a direction parallel to the rotation center axis of the adjustment member. The actuator moves in this manner so that the actuator is adapted to the position of each wafer in the wafer rack to perform corresponding processing operations on each wafer.

[0013] Optionally, the execution unit further comprises a bracket, the bracket is arranged on the posture adjustment unit, and the execution member is movably arranged on the bracket.

[0014] Optionally, the bracket includes a fixed bracket and a movable bracket, the fixed bracket is fixedly arranged on the posture adjustment unit, the movable bracket is movably arranged on the fixed bracket, and the actuator is movably arranged on the movable bracket.

[0015] Optionally, the movable bracket is rotatably arranged on the fixed bracket;

[0016] And / or, the movable bracket is a rod-type structure, and the actuator is slidably mounted on the movable bracket.

[0017] Optionally, the execution unit further includes a locking member, which is disposed on the movable bracket and / or the execution member and is used to lock the position of the execution member relative to the movable bracket.

[0018] Optionally, at least a portion of the actuator is a ruler or a tool.

[0019] To summarize, the wafer edge processing device includes: a posture adjustment unit and an execution unit; the posture adjustment unit is used to support the periphery of the wafer and drive the wafer to rotate; the execution unit is arranged in the posture adjustment unit, and is used to operate the edge of the wafer when the wafer rotates.

[0020] Configured in this way, the wafer edge processing device in the present invention is supported on the outer peripheral surface of the wafer by the posture adjustment unit and can drive the wafer to rotate, so as to facilitate the execution unit to process the edge of the wafer (such as measuring, degumming, deburring or cleaning). The setting of the wafer edge processing device can be used in conjunction with the existing wafer rack. On the one hand, batch processing of wafers can be achieved. On the other hand, there is no need to manually touch the wafer during the transfer and edge processing of the wafer, which can prevent contamination of the wafer. By setting the execution unit to perform the processing operation of the wafer edge, it is beneficial to realize the standardization of edge processing, reduce the uncertainty caused by human operation factors, help improve processing accuracy and reduce the risk of wafer scratches and fragments.

[0021] The above-mentioned wafer edge processing device has a relatively simple operation process, which helps to improve the efficiency of wafer edge processing, and has a specific placement position during wafer edge processing, which can improve the phenomenon of uncertain processing accuracy caused by random wafer placement position during existing manual processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of a wafer edge processing device according to an embodiment of the present invention;

[0023] Figure 2 FIG. 4 is a schematic structural diagram of a wafer edge processing device according to another embodiment of the present invention.

[0024] Among them, in the attached drawings:

[0025] 10-posture adjustment unit; 11-adjusting member; 111-first rotating shaft; 112-second rotating shaft; 113-base; 114-belt; 115-first outer jacket; 116-second outer jacket;

[0026] 20-Execution unit;

[0027] 21-actuator; 211-mounting hole; 212-threaded hole; 213-scale; 214-tool;

[0028] 22-movable bracket; 221-fixed bracket; 222-movable bracket; 223-hinge shaft;

[0029] 23-Locking piece. DETAILED DESCRIPTION

[0030] The wafer edge processing device proposed in the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer according to the following description. It should be noted that the accompanying drawings are all in a very simplified form and are not in precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0031] As used in the present invention, the singular forms "one", "an" and "the" include plural objects, the term "or" is usually used to include the meaning of "and / or", the term "several" is usually used to include the meaning of "at least one", and the terms "at least two" or "multiple" are usually used to include the meaning of "two or more". In addition, the terms "first", "second" and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" and "third" can explicitly or implicitly include one or at least two of the features. In addition, as used in the present invention, "installed", "connected", "connected", and one element "set" on another element should be understood in a broad sense, usually only indicating that there is a connection, coupling, matching or transmission relationship between the two elements, and the connection, coupling, matching or transmission between the two elements can be direct or indirect through an intermediate element, and cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, one element can be in any orientation such as inside, outside, above, below or on one side of another element, unless the content clearly indicates otherwise. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, directional terms such as above, below, up, down, upward, downward, left, right, etc. are used with respect to the exemplary embodiments as they are shown in the figures, with the upward or upper direction toward the top of the corresponding figure, and the downward or lower direction toward the bottom of the corresponding figure.

[0032] Please refer to Figure 1 As shown, this embodiment provides a wafer edge processing device, including: a posture adjustment unit 10 and an execution unit 20;

[0033] The posture adjustment unit 10 is used to support the outer circumference of the wafer and drive the wafer to rotate.

[0034] The execution unit 20 is arranged on the posture adjustment unit 10, and is used to operate the edge of the wafer when the wafer rotates. The operation here refers to performing corresponding process actions on the edge of the wafer, such as performing a measurement action when detecting whether the annular area formed by the edge pressing of the wafer is uniform; performing a cleaning action when cleaning the residual glue on the edge of the wafer; performing a cleaning action when removing the burrs on the edge of the wafer; performing a cleaning action when cleaning the edge of the wafer, or performing corresponding process actions in other process scenarios.

[0035] Please refer to Figure 1 As shown, the posture adjustment unit 10 includes an adjustment member 11, and the adjustment member 11 is rotatable. During the rotation of the adjustment member 11, the wafer supported thereon is driven to rotate.

[0036] Specifically, the adjustment member 11 includes a first rotating shaft 111 and a second rotating shaft 112. The first rotating shaft 111 is arranged to rotate around its own central axis, and the second rotating shaft 112 is arranged to rotate around its own central axis. The first rotating shaft 111 and the second rotating shaft 112 are arranged in parallel (their central axes are parallel).

[0037] In addition, the adjusting member 11 further includes a base 113 . The base 113 is a flat plate structure and serves as the base of the entire wafer edge processing device.

[0038] The first rotating shaft 111 and the second rotating shaft 112 are rotatably arranged on the base 113, and the axes of the first rotating shaft 111 and the second rotating shaft 112 are parallel to the length direction of the base 113. Two bearing seats are respectively arranged on both sides of the base 113 along the length direction, and the first rotating shaft 111 and the second rotating shaft 112 are rotatably installed on the base 113 through the corresponding bearing seats.

[0039] In normal use, the first rotating shaft 111 and the second rotating shaft 112 should be arranged horizontally, and the wafer is supported vertically on the first rotating shaft 111 and the second rotating shaft 112. At this time, the axial direction of the wafer is approximately parallel to the axial direction of the first rotating shaft 111 and the second rotating shaft 112, and the distance between the first rotating shaft 111 and the second rotating shaft 112 should be less than the diameter of the wafer. When the first rotating shaft 111 and the second rotating shaft 112 rotate synchronously and at the same speed in the same direction, the wafer supported on the first rotating shaft 111 and the second rotating shaft 112 can be driven to rotate.

[0040] Usually, the wafer is placed upright on a wafer rack (not shown in the figure). The wafer rack is usually provided with a plurality of slots arranged vertically, each of which can be inserted upright with a wafer, and the wafer rack can accommodate a batch of wafers at the same time.

[0041] In addition, the wafer rack is located in the middle of the slot and has a hollow structure, that is, when the wafer is inserted into the slot, the two sides of the bottom of the wafer are located in the slot, and the bottom of the wafer is opposite to the hollow area, so the bottom of the wafer is exposed.

[0042] Therefore, the above-mentioned wafer edge processing device can be used in conjunction with a wafer rack, and the wafer rack is placed on the posture adjustment unit 10, and it is ensured that the first rotating shaft 111 and the second rotating shaft 112 are facing the middle hollow area of ​​the wafer rack upward, so that the first rotating shaft 111 and the second rotating shaft 112 can be supported at the position where the bottom of the wafer is exposed outside the wafer rack. At this time, the outer peripheral surface of the first rotating shaft 111 and the outer peripheral surface of the second rotating shaft 112 are engaged with the outer peripheral surface of the wafer. The bottom position of the wafer should be located between the first rotating shaft 111 and the second rotating shaft 112. The horizontal distance between the first rotating shaft 111 and the second rotating shaft 112 should be smaller than the size of the exposed area in the middle of the wafer rack to avoid interference between the first rotating shaft 111 and the second rotating shaft 112 and the wafer rack.

[0043] When the first rotating shaft 111 and the second rotating shaft 112 are supported on the bottom of the wafer, it should be ensured that the wafer is slightly lifted up so that the wafer is separated from the bottom of the slot on the wafer rack or the contact force between the wafer and the bottom of the slot is reduced, so as to eliminate or reduce the friction between the wafer and the bottom of the slot when the wafer rotates. Therefore, the setting height of the first rotating shaft 111 and the second rotating shaft 112 can be adjusted based on the specific structure of the wafer rack, and the installation height should meet the following requirements: when the wafer is supported on the first rotating shaft 111 and the second rotating shaft 112, the wafer is lifted up and completely separated from or slightly contacted with the bottom of the slot on the wafer rack, and the edge of the wafer should still be located in the slot on the wafer rack (not completely out of the slot).

[0044] When the wafer needs to be adjusted, the first rotating shaft 111 and the second rotating shaft 112 can be driven to rotate in the same direction and at the same speed to drive the wafer to rotate.

[0045] The above-mentioned wafer edge processing device is supported on the outer peripheral surface of the wafer by the posture adjustment unit 10 and can drive the wafer to rotate, so as to facilitate the execution unit 20 to process the edge of the wafer (such as measuring, degumming, deburring or cleaning). The setting of the wafer edge processing device can be used in conjunction with the existing wafer rack. On the one hand, batch processing of wafers can be achieved. On the other hand, there is no need to manually touch the wafer during the transfer and edge processing of the wafer, which can prevent contamination of the wafer. By setting the execution unit 20 to perform the processing operation of the wafer edge, it is conducive to standardizing the edge processing, reducing the uncertainty caused by human operation factors, helping to improve the processing accuracy and reduce the risk of wafer scratches and fragments.

[0046] The above-mentioned wafer edge processing device has a relatively simple operation process, which helps to improve the efficiency of wafer edge processing, and has a specific placement position during wafer edge processing, which can improve the phenomenon of uncertain processing accuracy caused by random wafer placement position during existing manual processing.

[0047] In addition, the posture adjustment component 10 drives the wafer to rotate by rotating. On the one hand, it can adapt to the shape of the existing wafer, facilitate the adjustment of the circumferential position of the wafer, and be used in conjunction with the existing wafer rack to realize batch processing of wafers. On the other hand, it is also beneficial to improve the rotation accuracy of the wafer. The wafer is supported on the first rotating shaft 111 and the second rotating shaft 112, and the stability of the wafer is also improved when the wafer rotates.

[0048] Please continue to refer to Figure 1 As shown, in order to better guide the wafer to rotate, the first rotating shaft 111 and the second rotating shaft 112 should rotate in the same direction and at the same speed during rotation, otherwise at least one of the two rotating shafts will produce a linear speed difference with the wafer, and then generate friction with the outer periphery of the wafer. In order to ensure that the first rotating shaft 111 and the second rotating shaft 112 rotate in the same direction and at the same speed, a belt 114 is added in this embodiment, wherein a first pulley (not shown in the figure) is installed on the first rotating shaft 111, and a second pulley (not shown in the figure) is installed on the second rotating shaft 112. The specifications of the first pulley and the second pulley are consistent, and they are matched through the transmission of the belt 114. The belt 114 realizes the same direction and uniform speed rotation of the first pulley and the second pulley, thereby driving the first rotating shaft 111 and the second rotating shaft 112 to rotate in the same direction and at the same speed.

[0049] In other alternative embodiments, the first rotating shaft 111 and the second rotating shaft 112 can also realize the same direction and uniform speed rotation of the first rotating shaft 111 and the second rotating shaft 112 through gear transmission, friction transmission, sprocket transmission, etc. Or the first rotating shaft 111 and the second rotating shaft 112 can be respectively driven to rotate by a motor directly, and the same direction and uniform speed rotation of the first rotating shaft 111 and the second rotating shaft 112 can be realized by controlling the rotation speed of the two motors.

[0050] Please continue to refer to Figure 1 As shown, one end of the first rotating shaft 111 ( Figure 1 The left end of the second rotating shaft 112) Figure 1The left end of the first rotating shaft 111 and the left end of the second rotating shaft 112 extend to the same side along the length direction of the base 113 and exceed the base 113, so that the end of the first rotating shaft 111 and the end of the second rotating shaft 112 are in a cantilever-like state. This arrangement facilitates the manual and flexible rotation of the first rotating shaft 111 or the second rotating shaft 112 based on actual needs. In addition, the belt 114 is located directly above the base 113, and the belt 114 is arranged on the side of the first rotating shaft 111 and the second rotating shaft 112 close to their cantilever ends. The setting position of the belt 114 does not exceed the range of the base 113 with the cantilever ends of the first rotating shaft 111 and the second rotating shaft 112, which can prevent the hand from interfering with the belt 114 when rotating the first rotating shaft 111 or the second rotating shaft 112, and also helps to prevent components outside the base 113 from interfering with the belt 114.

[0051] In other alternative embodiments, the cantilever end of the first rotating shaft 111 and the cantilever end of the second rotating shaft 112 can be driven to rotate by an external peripheral device, for example, an external motor or other driving component can be used to drive the first rotating shaft 111 or the second rotating shaft 112 to rotate.

[0052] In this embodiment, the posture adjustment unit 10 uses a double roller to realize the self-rotation of the wafer. In other alternative embodiments, a single roller, multiple rollers (such as three rollers, four rollers or more rollers) or a single drum can also be used to realize the self-rotation of the wafer.

[0053] In this embodiment, the posture adjustment unit 10 drives the wafer to rotate by rotation. In other alternative embodiments, the posture adjustment unit 10 may also use a linear motion. For example, the posture adjustment unit 10 has a support plane, which is supported on the bottom of the wafer. When the posture adjustment unit 10 moves horizontally in a direction parallel to the support plane, it can drive the wafer to rotate in the slot of the wafer rack to adjust the wafer posture. The posture adjustment unit 10 can also use other known motion methods to achieve the rotation of the wafer, which will not be described here one by one.

[0054] In this embodiment, the base 113 of the posture adjustment component 10 is a plate structure. In other alternative embodiments, the base 113 can be a box structure with an open top, and the execution unit 20 is arranged inside the base 113. The specific shape of the base 113 can be flexibly adjusted based on actual needs.

[0055] Furthermore, in this embodiment, the adjustment member 11 also includes a first outer jacket 115 and a second outer jacket 116, wherein the first outer jacket 115 is sleeved on the first rotating shaft 111, and the second outer jacket 116 is sleeved on the second rotating shaft 112. The first outer jacket 115 and the second outer jacket 116 are used to contact with the periphery of the wafer, and preferably the first outer jacket 115 and the second outer jacket 116 are made of elastic material, such as Teflon rubber. The provision of the first outer jacket 115 and the second outer jacket 116 can, on the one hand, increase the friction with the periphery of the wafer, making it easier to drive the wafer to rotate; on the other hand, it has a buffering effect, avoiding damage to the wafer caused by rigid contact with the periphery of the wafer. At the same time, the first outer jacket 115 and the second outer jacket 116 also serve as consumable parts, which are convenient for later replacement and reduce later maintenance costs.

[0056] In this embodiment, the first rotating shaft 111 and the second rotating shaft 112 are made of aluminum alloy, so they are used in conjunction with the first outer cover 115 and the second outer cover 116. In other alternative embodiments, the first rotating shaft 111 and the second rotating shaft 112 can be made of materials such as polyurethane and alumina ceramics. The materials of the first rotating shaft 111 and the second rotating shaft 112 can be selected based on their use requirements. If the materials of the first rotating shaft 111 and the second rotating shaft 112 themselves have the functions of buffering and increasing friction of the first outer cover 115 and the second outer cover 116, the first outer cover 115 and the second outer cover 116 may not be provided.

[0057] Please continue to refer to Figure 1 As shown, the execution unit 20 includes an execution element 21, and the execution element 21 is used to operate the edge of the wafer when the wafer rotates. The processing includes measuring, degumming, deburring or cleaning the edge of the wafer.

[0058] The actuator 21 is configured to move relative to the posture adjustment unit 10 .

[0059] For the specific movement of actuator 21, please refer to Figure 1 As shown;

[0060] The actuator 21 can move relative to the posture adjustment unit 10 in a direction parallel to the rotation center axis of the adjustment member 11 (i.e., the rotation center axis of the first rotation shaft 111 or the second rotation shaft 112). When the wafer rack is placed above the posture adjustment unit 10, the wafers in the wafer rack are arranged in the direction of the rotation center axis of the adjustment member 11. The movement of the actuator 21 is to adapt the actuator 21 to the position of each wafer in the wafer rack so as to perform corresponding processing operations on each wafer.

[0061] In addition, the actuator 21 can move relative to the posture adjustment unit 10 in a direction close to or away from the posture adjustment unit 10. This movement is for the actuator 21 to avoid. For example, when the wafer rack needs to cooperate with the posture adjustment unit 10, the actuator 21 is away from the posture adjustment unit 10, which can provide a placement space for the wafer rack to prevent interference with the actuator 21 during the placement of the wafer rack.

[0062] Please continue to refer to Figure 1 As shown, the execution unit 20 further includes a bracket 22 , and the bracket 22 is disposed on the posture adjustment unit 10 , and the execution member 21 is movably disposed on the bracket 22 .

[0063] Specifically, the bracket 22 includes a fixed bracket 221 and a movable bracket 222 . The fixed bracket 221 is vertically fixed to the posture adjustment unit 10 , the movable bracket 222 is movably arranged on the fixed bracket 221 , and the actuator 21 is movably arranged on the movable bracket 222 .

[0064] In this embodiment, one end of the movable bracket 222 is rotatably arranged on the fixed bracket 221 through the hinge shaft 223; the rotation center axis of the movable bracket 222 is perpendicular to the center axis of the first rotating shaft 111 and the second rotating shaft 112, so that Figure 1 The free end of the movable bracket 222 can swing up and down. Therefore, when the movable bracket 222 rotates, it can drive the actuator 21 away from or close to the posture adjustment unit 10. Figure 1 When the actuator 21 rotates upward, it moves away from the posture adjustment unit 10 .

[0065] In this embodiment, the movable bracket 222 is a rod-type structure, and the actuator 21 is slidably mounted on the movable bracket 222. When the movable bracket 222 rotates relative to the fixed bracket 221, it has at least a first posture ( Figure 1 The posture corresponding to the movable bracket 222 is the first posture). In the first posture, the movable bracket 222 is parallel to the central axis of the first rotating shaft 111 and the second rotating shaft 112, and the movable bracket 222 is perpendicular to the fixed bracket 221. At this time, when the actuator 21 slides along the movable bracket 222, the actuator 21 moves relative to the posture adjustment unit 10 along the central axis direction of the first rotating shaft 111 and the second rotating shaft 112. At this time, the movement direction of the actuator 21 matches the arrangement direction of each wafer in the wafer rack.

[0066] When the movable bracket 222 is in the first posture, its posture should be kept stable. During the rotation of the movable bracket 222, the rotation angle of the movable bracket 222 can be limited by the upper end of the fixed bracket 221. For example, when the movable bracket 222 abuts against the upper end of the fixed bracket 221 during the rotation, the rotation is limited. At this time, the posture of the movable bracket 222 is the first posture. Alternatively, the movable bracket 222 can maintain its posture through other structures, such as limiting the rotation angle of the hinge shaft 223 through a brake shoe or adjusting the rotation angle of the hinge shaft 223 through an external motor to make the movable bracket 222 hover at any angle. The posture of the movable bracket 222 can be maintained by other known rotation limiting methods, which will not be repeated here.

[0067] In other alternative embodiments, the rotation center axis of the movable bracket 222 may be parallel to the center axis of the first rotating shaft 111 and the second rotating shaft 112. In this case, the fixed bracket 221 may be connected to Figure 1 The front or rear side of the middle base 113. Alternatively, the rotation center axis of the movable bracket 222 can be arranged perpendicular to the base 113 so that Figure 1 The movable bracket 222 can rotate horizontally. The rotation mode of the movable bracket 222 and the position where the fixed bracket 221 is connected to the base 113 can be adjusted based on actual use requirements.

[0068] In this embodiment, the movable bracket 222 and the fixed bracket 221 are in a rotational fit relationship. In other alternative embodiments, the movable bracket 222 can be disposed on the fixed bracket 221 by linear motion, for example, the movable bracket 222 can be disposed on the fixed bracket 221 by linear motion in a direction perpendicular to the base 113 or in an oblique direction. The motion mode of the movable bracket 222 relative to the fixed bracket 221 can be adjusted based on actual use requirements.

[0069] In this embodiment, the fixed bracket 221 is configured as a rod-type structure, and the fixed bracket 221 is configured perpendicular to the base 113. In other alternative embodiments, the fixed bracket 221 can be configured as a frame structure or other known structures, and the specific structure of the fixed bracket 221 can be adjusted based on actual needs.

[0070] In this embodiment, the movable bracket 222 is configured as a rod-type structure with a rectangular cross section, and the actuator 21 is slidably mounted on the movable bracket 222. In other alternative embodiments, the movable bracket 222 may be a rod-type structure with a T-shaped cross section or a similar I-beam or channel steel, and the cross section of the movable bracket 222 may be flexibly adjusted based on actual use requirements. In addition, in other alternative embodiments, the movable bracket 222 may also be a frame-type structure or other known shapes, and the specific shape of the movable bracket 222 may be adjusted based on actual use requirements.

[0071] In this embodiment, the bracket 22 is a connecting rod structure consisting of a fixed bracket 221 and a movable bracket 222. In other alternative embodiments, the bracket 22 as a whole can be a multi-degree-of-freedom mechanical arm or other bracket structures that can meet the requirements of the movement freedom of the actuator 21, and the overall structure of the bracket 22 can be adjusted based on the requirements of the movement freedom of the actuator 21.

[0072] Please continue to refer to Figure 1 As shown, the actuator 21 is in a square frame structure as a whole, and a mounting hole 211 is opened in the middle thereof. The cross section of the mounting hole 211 is larger than the cross section of the movable bracket 222 .

[0073] The cross section of the movable bracket 222 is square, and the cross section of the mounting hole 211 is rectangular. Figure 1 In the embodiment, the height of the cross section of the mounting hole 211 is greater than the side length of the movable bracket 222 .

[0074] When the movable bracket 222 is in Figure 1 In the first posture shown in FIG. 1 , the difference in the above cross-sections enables the actuator 21 to be mounted on the movable bracket 222 in a direction perpendicular to the base 113 ( Figure 1 This arrangement allows the actuator 21 to be adaptively raised and lowered when sliding along the movable bracket 222 to avoid the wafer located below.

[0075] Please continue to refer to Figure 1 As shown, the execution unit 20 further includes a locking member 23 , which is disposed on the execution member 21 and is used to lock the position of the execution member 21 relative to the movable bracket 222 .

[0076] In this embodiment, the locking member 23 is a bolt, and a threaded hole 212 connected to the mounting hole 211 is provided on the actuator 21. The locking member 23 is threadedly connected to the threaded hole 212. When the locking member 23 is tightened, its end abuts against the movable bracket 222 to limit the movement of the actuator 21 relative to the movable bracket 222, thereby locking the position of the actuator 21.

[0077] In this embodiment, Figure 1 Taking the perspective shown as an example, the threaded hole 212 is opened on the upper surface of the actuator 21, and the threaded hole 212 is opened vertically and communicates downward with the mounting hole 211. In other alternative embodiments, the threaded hole 212 can be opened on the side wall of the actuator 21 and communicates horizontally with the mounting hole 211, or opened on the lower surface of the actuator 21 and communicates upward with the mounting hole 211. The opening direction of the threaded hole 212 can be flexibly adjusted based on actual use requirements.

[0078] In other alternative embodiments, the locking member 23 may be an electromagnetic force member that is locked by magnetic force or an eccentric wheel that is locked by eccentricity, etc. The locking member 23 may adopt other existing locking structures, which will not be described in detail here. In addition, the locking member 23 may be adaptively adjusted based on its locking method, for example, the locking member 23 may also be set on the movable bracket 222.

[0079] Please continue to refer to Figure 1 In the embodiment, the position of the actuator 21 close to the base 113 is a scale 213, and scales are arranged on the scale 213. The scale 213 is a transparent sheet structure, and the edge size of the wafer can be conveniently observed through the scale 213.

[0080] The movable bracket 222 is Figure 1 In the first posture shown in , the scale 213 is perpendicular to the central axis of the first rotating shaft 111 and the second rotating shaft 112. This setting also makes the scale 213 parallel to the wafer when the wafer is supported on the first rotating shaft 111 and the second rotating shaft 112. The scale 213 is located at the edge of the wafer, and rotating the first rotating shaft 111 or the second rotating shaft 112 causes the wafer to rotate. During the wafer rotation process, all positions of the edge of the wafer pass through the scale 213 in turn to detect whether the annular area formed by the edge pressing of the wafer is uniform. The scale 213 is perpendicular to the central axis of the first rotating shaft 111 and the second rotating shaft 112. During the detection process, it can also be fitted and supported on the edge side of the wafer to play a role in straightening the wafer.

[0081] Please refer to Figure 2 FIG. 1 shows another processing scenario of the wafer edge processing device mentioned above.

[0082] The wafer edge processing device is used to clean the residual adhesive on the edge of the wafer. Figure 1 Execution 21 and Figure 2 The difference between the middle actuator 21 lies in the difference in the functional parts thereon. Figure 1 The functional part on the middle actuator 21 is a scale 213. Figure 2 The functional part on the middle actuator 21 is a tool 214. Figure 2 As shown, the position of the actuator 21 close to the base 113 is a cutter 214, and the specific structure of the cutter 214 is selected based on its use function. When cleaning the residual adhesive of the wafer, the actuator 21 is tightened by the top locking member 23, and the residual adhesive at all positions of the edge of the wafer can be checked by rotating the first rotating shaft 111 or the second rotating shaft 112, and the residual adhesive can be cleaned by the cutter 214.

[0083] In other alternative embodiments, the functional parts of the actuator 21 can be adaptively adjusted based on its functional use. For example, a cleaning component is provided on the actuator 21 to clean the edge of the wafer. The role of the functional parts on the actuator 21 can be adaptively adjusted based on actual usage requirements.

[0084] The actuator 21 can adjust its function based on its use function. The actuator 21 is detachably mounted on the movable bracket 222. The actuator 21 with corresponding functions can be selected based on actual needs and installed on the movable bracket 222 to meet various processing scenarios of the wafer.

[0085] In addition, the functional parts on the actuator 21 can be detachably arranged, and in this case, based on its use requirements, only the corresponding functional parts need to be replaced.

[0086] The actuator 21 has two usage states, one is a free state, in which the actuator 21 is freely mounted on the movable bracket 222 without being locked by the locking member 23 ; the other is a locked state, in which the actuator 21 is locked by the locking member 23 .

[0087] The actuator 21 can select its usage state based on different usage requirements.

[0088] For example, when measuring the edge size, the actuator 21 will not generate vertical force on the wafer, and the actuator 21 can be in a free state. Figure 1 In the first posture, the actuator 21 is naturally supported on the movable bracket 222 by its own weight, and the top inner wall of the mounting hole 211 on the actuator 21 is supported on the upper surface of the movable bracket 222. When the actuator 21 slides along the movable bracket 222 (along the central axis direction of the first rotating shaft 111 and the second rotating shaft 112), it is necessary to avoid the wafers located below. At this time, the actuator 21 can be lifted so that the bottom inner wall of the mounting hole 211 is supported on the lower surface of the movable bracket 222 to slide.

[0089] When the movable bracket 222 rotates, in order to prevent the actuator 21 from sliding freely on the movable bracket 222, the actuator 21 can be in a locked state. Or when the actuator 21 needs to perform operations such as degumming and deburring, the actuator 21 will be subjected to the vertical reaction force of the wafer, and the actuator 21 can be in a locked state. When the locked state is adopted, the locking member 23 is tightened so that the locking member 23 abuts against the upper surface of the movable bracket 222, and the actuator 21 adaptively moves upward so that the bottom side wall of the mounting hole 211 abuts against the lower surface of the movable bracket 222, and the position of the actuator 21 is locked.

[0090] The above-mentioned wafer edge processing device requires manual assistance when the first rotating shaft 111 and the second rotating shaft 112 rotate, when the movable bracket 222 rotates relative to the fixed bracket 221, when the actuator 21 slides relative to the movable bracket 222, and when the locking member 23 moves. In other alternative embodiments, the above-mentioned components can be automatically operated by configuring an external driving device, for example, by externally connecting a first rotating driving member to the first rotating shaft 111 or the second rotating shaft 112, externally connecting a second rotating driving member to the hinge shaft 223 between the movable bracket 222 and the fixed bracket 221, externally connecting a third rotating driving member to the locking member 23, and externally connecting a linear driving member to the actuator 21, and the movement of each component is realized through the coordinated cooperation of each driving member. In addition, it can also be used in conjunction with an image recognition unit, a distance detection unit, etc. to detect the position of the wafer and the condition of the wafer edge, and a control unit can be equipped to receive signals from the image recognition unit, the distance detection unit and each drive component or send a control signal, and then coordinate with the above-mentioned drives to achieve automatic processing of the wafer edge. At this time, the entire wafer edge processing device can be completely set in an independent space for automatic operation, and manual operation only needs remote control.

[0091] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0092] The above description is only a description of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. Any changes or modifications made by a person skilled in the art in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A wafer edge processing device, characterized in that: include: Attitude adjustment unit and execution unit; The posture adjustment unit is used to support the periphery of the wafer and drive the wafer to rotate; The execution unit is arranged on the posture adjustment unit, and is used for operating the edge of the wafer when the wafer rotates.

2. The wafer edge processing device according to claim 1, characterized in that: The posture adjustment unit includes an adjustment member, the adjustment member is used to support the outer periphery of the wafer, and the adjustment member is rotatably arranged to drive the wafer to rotate.

3. The wafer edge processing device according to claim 2, characterized in that: The adjusting member comprises a first rotating shaft and a second rotating shaft, the first rotating shaft is arranged to rotate around and the second rotating shaft is arranged to rotate around its own central axis, and the first rotating shaft and the second rotating shaft are arranged in parallel.

4. The wafer edge processing device according to any one of claims 1 to 3, characterized in that: The execution unit includes an execution member, and the execution member is movably arranged on the posture adjustment unit.

5. The wafer edge processing device according to claim 4, characterized in that: When the posture adjustment unit includes an adjustment member, The actuator is arranged to move relative to the posture adjustment unit at least in a direction parallel to a rotation center axis of the adjustment member.

6. The wafer edge processing device according to claim 4, characterized in that: The execution unit further comprises a bracket, the bracket is arranged on the posture adjustment unit, and the execution member is movably arranged on the bracket.

7. The wafer edge processing device according to claim 6, characterized in that: The bracket includes a fixed bracket and a movable bracket, the fixed bracket is fixedly arranged on the posture adjustment unit, the movable bracket is movably arranged on the fixed bracket, and the actuator is movably arranged on the movable bracket.

8. The wafer edge processing device according to claim 7, characterized in that: The movable bracket is rotatably arranged on the fixed bracket; And / or, the movable bracket is a rod-type structure, and the actuator is slidably mounted on the movable bracket.

9. The wafer edge processing device according to claim 7, characterized in that: The execution unit further includes a locking member, which is disposed on the movable bracket and / or the execution member and is used to lock the position of the execution member relative to the movable bracket.

10. The wafer edge processing device according to claim 4, characterized in that: At least a part of the actuator is a scale or a tool.

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