Heat dissipation assembly, power device and vehicle

Abstract

The invention relates to a heat dissipation assembly, a power device and a vehicle, and the heat dissipation assembly carries out the heat dissipation of a part to be cooled, and comprises a substrate, a micro-channel layer and a manifold layer. The substrate is covered with a hot spot area corresponding to the piece to be cooled. The micro-channel layer is provided with micro-channels and is located on the side, away from the part to be cooled, of the substrate, and the manifold layer is located on the side, away from the substrate, of the micro-channel layer. Wherein the manifold layer comprises an inflow channel communicated with the micro-channel, and the inflow channel is arranged corresponding to the hot spot area. As the inflow channel is arranged corresponding to the hot spot area, heat dissipation of the hot spot area can be enhanced, the temperature of the hot spot area is prevented from being too high, and the temperature distribution uniformity of the part to be cooled is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a heat dissipation component, a power device and a vehicle. Background Art

[0002] The continuous development of integrated circuit technology has led to a gradual reduction in the characteristic size of semiconductor devices and an increasing power density. They are gradually tending towards miniaturization and high power density, which puts higher requirements on the thermal management technology of semiconductor devices.

[0003] In the field of semiconductor heat dissipation, semiconductor devices are often cooled by manifold heat dissipation components. However, common manifold heat dissipation components have a simple structure and cannot solve the problem of local hot spots on semiconductor devices, which will cause uneven temperature distribution on high-power semiconductor devices. Summary of the invention

[0004] The embodiment of the present application provides a heat dissipation assembly, which can improve the uniformity of temperature distribution on a heat dissipation element to be cooled, so as to at least partially solve the above-mentioned technical problems.

[0005] In order to achieve the above object, an embodiment of the present application provides a heat dissipation assembly, including:

[0006] A substrate, the substrate being covered with a hot spot area corresponding to the heat dissipation element;

[0007] a microfluidic layer, having microfluidic channels and located on a side of the substrate away from the heat dissipation element; and

[0008] a manifold layer, located on a side of the microfluidic layer away from the substrate;

[0009] Wherein, the manifold layer includes an inflow channel connected to the microchannel, and the inflow channel is arranged corresponding to the hot spot area.

[0010] In some embodiments, an orthographic projection of the inflow channel on the substrate at least partially overlaps with the hot spot region.

[0011] In some embodiments, the hot spot area includes a first local hot spot area and a second local hot spot area, the first local hot spot area is located on at least one side of the second local hot spot area, the first local hot spot area has a first hot spot temperature, the second local hot spot area has a second hot spot temperature, and the first hot spot temperature is greater than the second hot spot temperature;

[0012] The inflow channel is arranged corresponding to the first local hot spot area.

[0013] In some embodiments, an orthographic projection of the inflow channel onto the first surface at least partially overlaps with the first local hot spot region.

[0014] In some embodiments, the substrate is further covered with a non-hotspot area adjacent to the hotspot area, and the temperature of the non-hotspot area is lower than the temperature of the hotspot area;

[0015] The manifold layer further includes a first outflow channel in communication with the microchannel, wherein an orthographic projection of the first outflow channel on the substrate at least partially overlaps with the non-hotspot region.

[0016] In some embodiments, the non-hotspot area includes a first sub-non-hotspot area and a second sub-non-hotspot area, the first sub-non-hotspot area and the second sub-non-hotspot area are respectively located on both sides of the hotspot area along a first direction, and the first direction is parallel to the substrate;

[0017] The first outflow channel includes a first sub-outflow channel and a second sub-outflow channel connected to the microchannel, the first sub-outflow channel at least partially overlaps with the first sub-non-hotspot area, the second sub-outflow channel at least partially overlaps with the second sub-non-hotspot area, and the first sub-outflow channel and the second sub-outflow channel are respectively located on both sides of the inflow channel along the first direction.

[0018] In some embodiments, the first sub-outflow channel and the second sub-outflow channel both extend along the second direction;

[0019] The dimension of the first sub-outflow channel along the second direction is greater than or equal to the dimension of the microchannel layer along the second direction; and

[0020] The second direction is parallel to the first surface and intersects with the first direction.

[0021] In some embodiments, in an inflow channel corresponding to a hot spot area, the inflow channel includes a plurality of sub-inflow channels arranged at intervals along a first direction, and one sub-inflow channel is arranged corresponding to one of the first local hot spot areas, and the first direction is parallel to the first surface.

[0022] In some embodiments, the manifold layer further includes a second outflow channel communicating with the microfluidic channel, and an orthographic projection of the second outflow channel on the first surface at least partially overlaps with the second local hot spot region.

[0023] In some embodiments, the second outflow channel extends along a second direction and is located between two adjacent sub-inflow channels, and the second direction is parallel to the first surface and intersects with the first direction.

[0024] In some embodiments, the first local hot spot region includes a first sub-local hot spot region and a second sub-local hot spot region, the second sub-local hot spot region is located on both sides of the first sub-local hot spot region along a second direction, the temperature of the first sub-local hot spot region is greater than the temperature of the second sub-local hot spot region, and the second direction is parallel to the first surface and intersects the first direction; and

[0025] The sub-inflow channel includes a first channel portion and a second channel portion, the first channel portion is arranged corresponding to the first sub-local hotspot area, the second channel portion is arranged corresponding to the second sub-local hotspot area, and the size of the first channel portion along the first direction is larger than the size of the second channel portion along the first direction.

[0026] In some embodiments, the substrate is covered with a plurality of the hot spot areas arranged at intervals, and each of the hot spot areas is correspondingly provided with at least one sub-inflow channel.

[0027] In some embodiments, the invention further includes an inlet located on a side of the manifold layer away from the substrate, wherein the inlet is connected to the inlet channel and is disposed corresponding to one of the hot spots.

[0028] In some embodiments, the manifold layer further includes a diversion channel, one end of which is connected to the inlet, and the other end of which is connected to the inlet channel.

[0029] In some embodiments, the method further includes an outlet located on a side of the manifold layer away from the substrate, wherein the outlet is connected to the first outflow channel and is disposed corresponding to the hot spot area.

[0030] In some embodiments, the manifold layer further includes a confluence channel communicating with the outlet, wherein the confluence channel is connected to the first outflow channel.

[0031] In some embodiments, the hot spots are arranged at intervals along a second direction, the second direction is parallel to the first surface and intersects the first direction;

[0032] The non-hotspot area further includes a third sub-non-hotspot area, and the third sub-non-hotspot area is located between adjacent hotspot areas.

[0033] In some embodiments, the microchannels extend along the first direction and are arranged at intervals along the second direction, and the second direction is parallel to the first surface and intersects with the first direction.

[0034] In some embodiments, the microfluidic channel includes a plurality of first sub-microfluidic channels and a plurality of second sub-microfluidic channels, the plurality of first sub-microfluidic channels are arranged corresponding to the hot spot area, and the plurality of second sub-microfluidic channels are arranged corresponding to the third non-hot spot area; and

[0035] There is a first distance between two adjacent first sub-microchannels, and there is a second distance between two adjacent second sub-microchannels, and the first distance is smaller than the second distance.

[0036] In some embodiments, the microchannel is a wavy channel or a straight channel extending along a first direction, and the first direction is parallel to the substrate.

[0037] The present application also provides a power device, including:

[0038] The heat dissipation assembly in any of the above embodiments; and

[0039] The heat dissipation component is located on the substrate of the heat dissipation component.

[0040] An embodiment of the present application also provides a vehicle, comprising the power device in the above embodiment.

[0041] The embodiments of the present application provide a heat dissipation component, a power device and a vehicle. The heat dissipation component dissipates heat from a heat dissipation component, and the heat dissipation component includes a substrate, a microfluidic layer and a manifold layer. The substrate is covered with a hot spot area corresponding to the heat dissipation component. The microfluidic layer has a microfluidic channel and is located on the side of the substrate away from the heat dissipation component, and the manifold layer is located on the side of the microfluidic layer away from the substrate. Among them, the manifold layer includes an inflow channel connected to the microfluidic channel, and the inflow channel is arranged corresponding to the hot spot area. Since the inflow channel is arranged corresponding to the hot spot area, the heat dissipation of the hot spot area can be enhanced to avoid excessive temperature in the hot spot area, thereby improving the uniformity of temperature distribution on the heat dissipation component.

[0042] Other features and advantages of the present application will be described in detail in the subsequent specific implementation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0044] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same figure numbers represent the same parts in the following description.

[0045] Figure 1 is an exploded view of a heat dissipation assembly provided in some embodiments of the present application;

[0046] Figure 2 is a top view of a heat dissipation assembly provided in some embodiments of the present application;

[0047] Figure 3 is a schematic diagram of the structure of the cooling channel provided by some embodiments of the present application;

[0048] Figure 4 Some embodiments of the present application provide Figure 1 Schematic diagram of the enlarged structure of the microfluidic layer at A;

[0049] Figure 5 is a schematic diagram of temperature distribution of hot spots provided in some embodiments of the present application;

[0050] Figure 6 Some embodiments of the present application provide Figure 3 A schematic side view of the cooling channel;

[0051] Figure 7 Some embodiments of the present application provide Figure 6 Schematic diagram of the cross section at B-B1;

[0052] Figure 8 Some embodiments of the present application provide Figure 6 Schematic diagram of the cross section at C-C1;

[0053] Fig. 9 Some embodiments of the present application provide Figure 6 The cross-sectional diagram at D-D1 in the middle;

[0054] Fig.10 Some embodiments of the present application provide Figure 6 The cross-sectional diagram at E-E1 in the middle;

[0055] Fig.11 is a schematic diagram of the structure of a liquid tank provided in some embodiments of the present application;

[0056] Fig.12 Some embodiments of the present application provide Fig.11 A schematic side view of the middle liquid tank;

[0057] Fig.13 Some embodiments of the present application provide Fig.12 Schematic diagram of the cross-sectional structure of the middle liquid tank at F-F1;

[0058] Fig.14 Some embodiments of the present application provide Fig.12 Schematic diagram of the cross-sectional structure of the middle liquid tank at G-G1;

[0059] Fig.15 Some embodiments of the present application provide Fig.12 Schematic diagram of the cross-sectional structure of the middle liquid tank at H-H1;

[0060] Fig.16It is a temperature cloud diagram corresponding to the hot spot area of ​​the heat dissipation component provided in some embodiments of the present application;

[0061] Fig.17 is a fluid streamline diagram in a heat sink provided by some embodiments of the present application;

[0062] Fig.18 is a fluid pressure distribution diagram in a heat sink provided by some embodiments of the present application;

[0063] Fig.19 It is a temperature cloud diagram corresponding to the hot spot area of ​​the heat dissipation component provided in some embodiments of the present application;

[0064] Fig. 20 It is a temperature cloud diagram of the hot spot area corresponding to the heat dissipation component provided in some embodiments of the present application. DETAILED DESCRIPTION

[0065] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0066] The common manifold heat dissipation component has a simple structure, and the local hot spot temperature of the chip is too high, which will cause uneven temperature distribution on the high-power semiconductor device.

[0067] In order to improve the above-mentioned problem, an embodiment of the present application provides a heat dissipation component capable of improving the uniformity of temperature distribution on a heat dissipation element.

[0068] The heat dissipation component dissipates heat from a heat dissipation element, and the heat dissipation component includes a substrate, a microfluidic layer and a manifold layer. The substrate is covered with a hot spot area corresponding to the heat dissipation element. The microfluidic layer has a microfluidic channel and is located on a side of the substrate away from the heat dissipation element, and the manifold layer is located on a side of the microfluidic layer away from the substrate. The manifold layer includes an inflow channel connected to the microfluidic channel, and the inflow channel is arranged corresponding to the hot spot area.

[0069] Since the inflow channel is arranged corresponding to the hot spot area, the heat dissipation of the hot spot area can be enhanced to avoid the hot spot area from being too high, thereby improving the uniformity of temperature distribution on the heat dissipation component.

[0070] The structure of the heat dissipation assembly is described below in conjunction with the accompanying drawings.

[0071] See also Figure 1 to Figure 3 , Figure 1 is an exploded view of a heat dissipation assembly provided in some embodiments of the present application, Figure 2is a top view of a heat dissipation assembly provided in some embodiments of the present application, Figure 3 It is a schematic diagram of the structure of the cooling channel provided in some embodiments of the present application.

[0072] The heat dissipation assembly 100 dissipates heat from a heat dissipation element 200, and the heat dissipation assembly 100 includes a substrate 10, a microfluidic layer 20, and a manifold layer 30. The substrate 10 is covered with a hot spot area 11 corresponding to the heat dissipation element 200. The microfluidic layer 20 has a microfluidic channel 21 and is located on a side of the substrate 10 away from the heat dissipation element 200, and the manifold layer 30 is located on a side of the microfluidic layer 20 away from the substrate 10. The manifold layer 30 includes an inflow channel 31 connected to the microfluidic channel 21, and the inflow channel 31 is arranged corresponding to the hot spot area 11.

[0073] like Figure 1 As shown, the substrate 10 may include a first surface 101 and a second surface 102 that are opposite to each other along a third direction Z, the heat dissipation element 200 is located on the first surface 101, and the microfluidic layer 20 is located on the second surface 102. The first surface 101 is covered with the hot spot area 11 corresponding to the heat dissipation element 200, and the third direction Z may be the thickness direction of the substrate 10.

[0074] In some embodiments, the heat dissipation element 200 may include a chip, such as a high-power chip. The heat dissipation assembly 100 is used to dissipate heat from the heat dissipation element 200. Since the heat dissipation element 200 is located on the first surface 101, the hot spot area 11 on the first surface 101 can represent the hot spot area of ​​the heat dissipation element 200, that is, the high temperature area on the heat dissipation element 200 corresponds to the high temperature area on the first surface 101.

[0075] In some examples, the hot spot area 11 may be a heat concentration area or a high heat flux density area of ​​the heat dissipation element 200 to be cooled.

[0076] In some examples, the first surface 101 is covered with a plurality of the hot spots 11 arranged at intervals.

[0077] The heat dissipation element 200 can be connected to the substrate 10 through the insulating layer 40. For example, the insulating layer 40 can be a ceramic substrate, and copper can be attached to the upper and lower surfaces to increase thermal conductivity. The insulating layer 40 and the heat dissipation element 200 are welded once using a nano-silver sintering process, and the insulating layer 40 and the substrate 10 are welded twice using a nano-silver sintering process to combine the heat dissipation element 200 and the substrate 10 and increase thermal conductivity.

[0078] The microfluidic layer 20 represents a physical structure, and the microfluidic channel 21 represents a virtual channel in the microfluidic layer 20 . The microfluidic layer 20 and the heat dissipation element 200 may be located on two opposite sides of the substrate 10 along the third direction Z, respectively.

[0079] In some embodiments, the microfluidic layer 20 is connected to the substrate 10. The microfluidic layer 20 can be formed by etching a portion of the initial substrate and formed integrally with the substrate 10. The unetched portion of the initial substrate forms the substrate 10, and the etched portion can form a plurality of mutually parallel microfluidics 21. Heat exchange is performed between the microfluidic channels 21 and the substrate 10, thereby achieving heat dissipation of the heat sink 200.

[0080] The exemplary material of the substrate 10 may be copper or pure aluminum with high thermal conductivity to improve the heat exchange performance between the microchannel layer 20 and the substrate 10. The heat exchange between the microchannel layer 20 and the substrate 10 is completed by heat conduction through the solid copper material on the one hand, and on the other hand, after the cooling medium enters the microchannel 21, it exchanges heat with the substrate 10 through convection heat exchange.

[0081] See also Figure 4 , Figure 4 Some embodiments of the present application provide Figure 1 Schematic diagram of the enlarged structure of the microfluidic layer at A.

[0082] In some embodiments, the microchannels 21 extend along a first direction X and are arranged along a second direction Y. Both the first direction X and the second direction Y are parallel to the first surface 101 and intersect each other (e.g., perpendicular to each other). The microchannels 21 of this layer are densely arranged and play a leading role in the heat exchange of the heat dissipation component 100. Since the heat dissipation component 100 is located below the heat dissipation element 200 to be dissipated, the heat dissipation element 200 to be dissipated does not need to bear the pressure brought by the heat dissipation component 100 and the cooling medium.

[0083] In some embodiments, a straight flow channel may be used as the microchannel 21 to reduce pressure drop and pump work.

[0084] In some embodiments, the microchannel 21 may also be designed as a wavy channel extending along the first direction X, so as to break the thermal boundary layer, enhance fluid turbulence mixing, and further strengthen heat exchange, but the flow resistance will also increase accordingly.

[0085] like Figure 1 As shown, the heat dissipation component 100 may include a liquid tank 50, and the manifold layer 30 may be formed in the liquid tank 50. The exemplary material of the liquid tank 50 may be aluminum. The manifold layer 30 may represent a virtual flow channel including an inflow channel 31. The liquid tank 50 may also include a groove 51 located above the manifold layer 30. The groove 51 may be used to accommodate the microfluidic layer 20, that is, the microfluidic layer 20 is located between the substrate 10 and the manifold layer 30.

[0086] The microchannel layer 20 is placed in the groove 51 and combined with the manifold layer 30 for packaging. It can be understood that the microchannels 21 in the microchannel layer 20 and the manifold layer 30 are both cooling channels (such as Figure 3 shown).

[0087] In some embodiments, the orthographic projection of the inflow channel 31 on the first surface 101 at least partially overlaps with the hot spot area 11. For example, the hot spot area 11 may completely fall within the range of the inflow channel 31, or the inflow channel 31 may completely fall within the range of the hot spot area 11, or the orthographic projection of the inflow channel 31 may just completely overlap with the range of the hot spot area 11.

[0088] See also Figure 5 , Figure 5 is a schematic diagram of temperature distribution of hot spots provided in some embodiments of the present application. It should be noted that: Figure 5 It is not a test result diagram of the heat dissipation effect of the heat dissipation component 100 provided in the embodiment of the present application. It is only to use different colors to intuitively show the distribution of hot spot areas 11 caused by some heat dissipation components 200, and to contrast with the heat dissipation effect of the heat dissipation component 100 in the present application, wherein the higher the temperature, the darker the color.

[0089] In some embodiments, the hot spot area 11 includes a first local hot spot area 111 and a second local hot spot area 112, the first local hot spot area 111 is located at least on one side of the second local hot spot area 112, the first local hot spot area 111 has a first hot spot temperature, the second local hot spot area 112 has a second hot spot temperature, and the first hot spot temperature is greater than the second hot spot temperature. In other words, in the hot spot area 11, there are also areas with higher local temperatures and areas with lower local temperatures.

[0090] In some examples, the first local hot spot area 111 may be located on both sides of the second local hot spot area 112 along the first direction X, that is, Figure 5 The temperature is higher near the upper and lower edges.

[0091] It should be noted that the first hot spot temperature and the second hot spot temperature are the temperatures corresponding to the first local hot spot area 111 and the second local hot spot area 112 respectively when the hot spot area 11 has not yet been subjected to heat exchange. After the cooling medium is passed into the cooling channel for heat dissipation, the temperature of the corresponding area will drop.

[0092] In some embodiments, the inflow channel 31 is arranged corresponding to the first local hot spot area 111, so that the heat source position can be further targeted for heat exchange, thereby improving the temperature distribution uniformity of the heat element 200 to be cooled after heat exchange.

[0093] In some embodiments, an orthographic projection of the inflow channel 31 on the first surface 101 at least partially overlaps with the first local hot spot area 111 .

[0094] In some embodiments, in combination Figure 5 and Figure 3 In an inflow channel 31 corresponding to a hot spot area 11, the inflow channel 31 includes a plurality of sub-inflow channels 311 arranged at intervals along a first direction X, and one sub-inflow channel 311 is arranged corresponding to one of the first local hot spot areas 111, and the first direction X is parallel to the first surface 101.

[0095] In some embodiments, the first surface 101 includes a plurality of hot spots 11 ( Figure 1 and Figure 5 Three hot spot areas 11 are shown, and each of the hot spot areas 11 is correspondingly provided with at least one sub-inflow channel 311, which can well improve the uniformity of the overall temperature distribution.

[0096] It should be noted that the embodiment of the present application does not restrict the arrangement of the hot spot area 11, and the arrangement of the first local hot spot area 111 and the second local hot spot area 112 in the hot spot area 11. Therefore, the embodiment of the present application can determine the structure and size of the inflow channel 31 in the manifold layer 30 according to the size of the heat dissipation component 200 itself and the heat dissipation requirements to meet the requirements under different working conditions and usage scenarios.

[0097] In some embodiments, the sub-inflow channel 311 extends along the second direction Y to connect multiple microchannels 21 .

[0098] In some embodiments, the sub-inflow channel 311 may be a straight flow channel.

[0099] In some embodiments, the first local hotspot area 111 includes a first sub-local hotspot area and a second sub-local hotspot area, the second sub-local hotspot area is located on both sides of the first sub-local hotspot area along the second direction Y, and the temperature of the first sub-local hotspot area is greater than the temperature of the second sub-local hotspot area.

[0100] For example, the first sub-local hot spot area has a first local hot spot temperature, the second sub-local hot spot area has a second local hot spot temperature, and the first local hot spot temperature is greater than the second local hot spot temperature. In other words, the local temperatures at both ends of the first local hot spot area 111 are low, and the local temperature in the middle is high.

[0101] Correspondingly, the sub-inflow channel 311 includes a first channel portion and a second channel portion, the first channel portion is arranged corresponding to the first sub-local hot spot area, and the second channel portion is arranged corresponding to the second sub-local hot spot area, that is, the second channel portion is located on both sides of the first channel portion along the second direction Y, and the size of the first channel portion along the first direction X is larger than the size of the second channel portion along the first direction X. By arranging a wider flow channel corresponding to the area with high local temperature and a narrower flow channel corresponding to the area with low local temperature, the sub-inflow channel 311 is a flow channel with a gradually deformed size, thereby enhancing the heat exchange of the first sub-local hot spot area with a higher temperature, so as to improve the uniformity of the overall temperature distribution.

[0102] In some embodiments, the manifold layer 30 further includes a first outflow channel 32 communicating with the microchannel 21 , and the cooling medium enters the microchannel 21 from the inflow channel 31 and then flows out from the first outflow channel 32 .

[0103] In some embodiments, the first surface 101 is also covered with a non-hot spot area 12 adjacent to the hot spot area 11, and the temperature of the non-hot spot area 12 is lower than the temperature of the hot spot area 11. For example, the hot spot area 11 has a hot spot temperature, and the non-hot spot area 12 has a non-hot spot temperature, and the non-hot spot temperature is lower than the hot spot temperature. That is, before heat exchange, the temperature of the non-hot spot area 12 is lower than the temperature of the hot spot area 11.

[0104] In some embodiments, the orthographic projection of the first outflow channel 32 on the first surface 101 at least partially overlaps with the non-hot spot area 12. Since the temperature of the cooling medium is relatively high when it flows out from the first outflow channel 32, disposing the first outflow channel 32 corresponding to the non-hot spot area 12 can reduce the influence of the cooling medium on the temperature of the hot spot area 11 when it flows out, thereby enhancing the heat exchange effect of the hot spot area 11.

[0105] In some embodiments, the orthographic projection of the microfluidic layer 20 on the substrate 10 may be within the range of the substrate 10, and both the hot spot area 11 and the non-hot spot area 12 may be within the orthographic projection range of the microfluidic layer 20. In other words, the area of ​​the substrate 10 is larger than the area of ​​the microfluidic layer 20, and the area of ​​the microfluidic layer 20 is larger than the sum of the areas of the hot spot area 11 and the non-hot spot area 12, that is, the non-hot spot area 12 may also be within the orthographic projection range of the microfluidic layer 20. In other embodiments, at least part of the non-hot spot area 12 is within the orthographic projection range of the microfluidic layer 20.

[0106] In some embodiments, Figure 1As shown, the non-hotspot area 12 includes a first sub-non-hotspot area 121 and a second sub-non-hotspot area 122, and the first sub-non-hotspot area 121 and the second sub-non-hotspot area 122 are respectively located on both sides of the hotspot area 11 along a first direction X, and the first direction X is parallel to the first surface 101.

[0107] Correspondingly, the first outflow channel 32 includes a first sub-outflow channel 321 and a second sub-outflow channel 322 connected to the microchannel 21, the first sub-outflow channel 321 at least partially overlaps with the first sub-non-hotspot area 121, and the second sub-outflow channel 322 at least partially overlaps with the second sub-non-hotspot area 122. The first sub-outflow channel 321 and the second sub-outflow channel 322 are respectively located on both sides of the inflow channel 31 along the first direction X. Therefore, after passing through the sub-inflow channel 311, the cooling medium can enter the microchannel 21 from the upper and lower sides, and then flow out from the first sub-outflow channel 321 and the second sub-outflow channel 322 on both sides, which can reduce the flow resistance and thus reduce the pump work.

[0108] In some embodiments, the first sub-outflow channel 321 and the second sub-outflow channel 322 both extend along the second direction Y, and the size of the first sub-outflow channel 321 along the second direction Y is greater than or equal to the size of the microfluidic layer 20 along the second direction Y, so that the first sub-outflow channel 321 can be connected to as many microfluidic channels 21 as possible. In some embodiments, the size of the second sub-outflow channel 322 along the second direction Y is greater than or equal to the size of the microfluidic layer 20 along the second direction Y, so that the second sub-outflow channel 322 can be connected to as many microfluidic channels 21 as possible.

[0109] In some embodiments, the manifold layer 30 further includes a second outflow channel 33 in communication with the microchannel 21, and the orthographic projection of the second outflow channel 33 on the first surface 101 at least partially overlaps with the second local hot spot area 112. The added second outflow channel 33 is arranged at a position with a lower local hot spot temperature in the hot spot area 11, but is not arranged corresponding to the first local hot spot area 111, so that the heat exchange capacity of the first local hot spot area 111 can be enhanced, and the temperature uniformity of the first local hot spot area 111 and the second local hot spot area 112 can be improved.

[0110] In some embodiments, the second outflow channel 33 extends along the second direction Y and is located between two adjacent sub-inflow channels 311. The added second outflow channel 33 is equivalent to increasing the flow path of the cooling medium, thereby reducing flow resistance and pressure drop.

[0111] In some embodiments, the hot spot areas 11 are arranged at intervals along the second direction Y, and the non-hot spot area 12 further includes a third sub-non-hot spot area 113, and the third sub-non-hot spot area 113 is located between adjacent hot spot areas 11. It should be noted that before the cooling fluid performs heat exchange, the temperature of the third sub-non-hot spot area 113 is lower than the temperature of the hot spot area 11.

[0112] In some embodiments, the microchannel 21 includes a plurality of first sub-microchannels and a plurality of second sub-microchannels, wherein the plurality of first sub-microchannels are arranged corresponding to the hot spot area 11, and the plurality of second sub-microchannels are arranged corresponding to the third sub-non-hot spot area 113. There is a first spacing between two adjacent first sub-microchannels, and there is a second spacing between two adjacent second sub-microchannels, and the first spacing is smaller than the second spacing. In other words, the microchannel 21 corresponding to the hot spot area 11 below can be called the first sub-microchannel, and the microchannel 21 corresponding to the third non-hot spot area 12 below can be called the second sub-microchannel.

[0113] The heat dissipation assembly 100 may further include an inlet 60 located on a side of the manifold layer 30 away from the substrate 10, the inlet 60 being connected to the inflow channel 31 and arranged corresponding to one of the hot spots 11. The inlet 60 is located at the bottom of the hot spot 11, and can form a jet flow, thereby enhancing the heat transfer effect.

[0114] The heat dissipation assembly 100 may further include an outlet 70 located on the side of the manifold layer 30 away from the substrate 10, the outlet 70 is connected to both the first outflow channel 32 and the second outflow channel 33, and is arranged corresponding to the hot spot area 11, for example, one outlet 70 is arranged corresponding to one hot spot area 11. The cooling medium enters the inflow channel 31 from the inlet 60, then passes through the microchannel 21 to reach the first outflow channel 32 and the second outflow channel 33, and finally flows out from the outlet 70. Since the inlet 60 and the outlet 70 are arranged in a targeted manner according to the position of the heat source (i.e., arranged below the corresponding hot spot area 11), a jet-like impact effect can be generated to further effectively improve the heat transfer performance of the microchannel 21.

[0115] The inlet 60 and the outlet 70 may both be formed in the liquid tank 50 .

[0116] In some embodiments, the manifold layer 30 further includes a shunt channel 34, one end of which is in communication with the inlet 60, and the other end of which is in communication with the inlet channel 31. That is, the shunt channel 34 is connected between the inlet channel 31 and the inlet 60, and is used to shunt the cooling medium coming in from the inlet 60 to distribute the flow of the cooling medium inlet 60, so that the shunt channel 34 can play a role in reducing the pressure drop.

[0117] In some embodiments, the manifold layer 30 may further include a confluence channel 35 in communication with the outlet 70, the confluence channel 35 is in communication with the first outflow channel 32, and the confluence channel 35 may be connected between the outlet 70 and the first outflow channel 32. The confluence channel 35 may also be connected between the outlet 70 and the second outflow channel 33, so that the cooling medium flows out from the first outflow channel 32 and the second outflow channel 33 and finally reaches the outlet 70 through the confluence channel 35.

[0118] In some embodiments, a plurality of inlets 60 and outlets 70 may be provided.

[0119] Therefore, the embodiment of the present application can improve the local hot spot problem and pressure drop problem by correspondingly designing the positions of the inlet channel 31, the first outflow channel 32 and the second outflow channel 33, and the positions of the inlet 60 and the outlet 70 according to the heat exchange requirements of the heat dissipation element 200.

[0120] See also Figure 6 to Figure 10 , Figure 6 Some embodiments of the present application provide Figure 3 Side view of the cooling channel. Figure 7 Some embodiments of the present application provide Figure 6 The cross-sectional diagram at B-B1 in the figure is as follows: Figure 8 Some embodiments of the present application provide Figure 6 The cross-sectional diagram at C-C1 in the figure is as follows: Fig. 9 Some embodiments of the present application provide Figure 6 The cross-sectional diagram at D-D1 in the figure is as follows: Fig.10 Some embodiments of the present application provide Figure 6 Schematic diagram of the cross section at E-E1 in the middle.

[0121] In some embodiments, Figure 7 As shown, the microchannels 21 may be arranged at equal intervals, that is, the intervals between two adjacent microchannels 21 are equal.

[0122] In some embodiments, the spacing between the microchannels 21 can be different. In the hot spot area 11, that is, the high heat flux density area, the microchannels 21 can be densely distributed with a small spacing to increase the heat exchange area. In the non-main heat exchange area, the spacing between the microchannels 21 can be appropriately increased, and the number can be appropriately reduced to facilitate reducing the pressure difference and regulating the flow distribution to enhance heat exchange, reduce flow resistance, and increase the uniformity of the overall temperature distribution of the heat element 200 to be cooled.

[0123] For example, the hot spot areas 11 are arranged at intervals along the second direction Y, and the non-hot spot area 12 further includes a third sub-non-hot spot area 113, and the third sub-non-hot spot area 113 is located between adjacent hot spot areas 11. It should be noted that before the cooling fluid performs heat exchange, the temperature of the third sub-non-hot spot area 113 is lower than the temperature of the hot spot area 11.

[0124] The microchannel 21 includes a plurality of first sub-microchannels and a plurality of second sub-microchannels, wherein the plurality of first sub-microchannels are arranged corresponding to the hot spot area 11, and the plurality of second sub-microchannels are arranged corresponding to the non-hot spot area 12. There is a first spacing between two adjacent first sub-microchannels, and there is a second spacing between two adjacent second sub-microchannels, and the first spacing is smaller than the second spacing. In other words, the microchannel 21 corresponding to the hot spot area 11 below can be called the first sub-microchannel, and the microchannel 21 corresponding to the third non-hot spot area 12 below can be called the second sub-microchannel. By setting the second spacing between adjacent second sub-microchannels to be larger and the first spacing between adjacent first sub-microchannels to be smaller, the uniformity of the surface temperature distribution of the heat element 200 to be cooled can be improved.

[0125] In some embodiments, the width of different microchannels 21 can be set according to the heat generation power and temperature limit of the heat dissipation element 200. For example, a high power density chip should use a smaller channel width, because a smaller channel width makes the hydraulic diameter smaller, the specific surface area larger, and the heat dissipation performance better.

[0126] like Figure 8 As shown, in the cross-section at the C-C1 position, the manifold layer 30 may include 6 sub-inflow channels 311, which are respectively arranged corresponding to the 6 first local hot spots 111, a first sub-outflow channel 321 and a second sub-outflow channel 322 are respectively located on both sides of the inflow channel 31, and a second outflow channel 33 extends along the second direction Y and is located between two adjacent sub-inflow channels 311.

[0127] like Fig. 9 As shown, the cross section at the position D-D1 shows the shunt channel 34, the sub-inflow channel 311, the first sub-outflow channel 321 and the second sub-outflow channel 322, but does not show the second outflow channel 33, indicating that the shunt channel 34 is located on the side of the microchannel layer 20 away from the substrate 10. Therefore, the manifold layer 30 in the embodiment of the present application is composed of two layers of manifold channels. Figure 8 The corresponding structure is a layer of manifold channels. Fig. 9 The corresponding structure in is another layer of manifold channels, because Figure 8 and Fig. 9 The cooling channels shown are not on the same layer. The manifold channels on these two layers are well connected and the fluid flow resistance is small.

[0128] like Fig.10 As shown, the inlet 60 and the outlet 70 are both located at the bottom of the heat sink, and the two outlets 70 are respectively located on both sides of the inlet 60, which can improve the problem of excessive temperature difference.

[0129] The heat dissipation assembly 100 provided in the embodiment of the present application can improve the uniformity of temperature distribution on the heat dissipation element 200 to be dissipated, enhance the heat transfer effect of the heat dissipation assembly, and reduce the pressure drop of the heat dissipation assembly.

[0130] See also Figure 11 to Figure 15 , Fig.11 is a schematic diagram of the structure of the liquid tank provided in some embodiments of the present application, Fig.12 Some embodiments of the present application provide Fig.11 A side view of the liquid tank. Fig.13 Some embodiments of the present application provide Fig.12 Schematic diagram of the cross-sectional structure of the middle liquid tank at F-F1. Fig.14 Some embodiments of the present application provide Fig.12 Schematic diagram of the cross-sectional structure of the middle liquid tank at G-G1. Fig.15 Some embodiments of the present application provide Fig.12 Schematic diagram of the cross-sectional structure of the middle liquid tank at H-H1.

[0131] Since the manifold layer 30 is formed in the liquid tank 50, Fig.11 The dashed line shows Figure 3 The structure of the manifold layer 30, Fig.11 Except for the manifold layer 30 , other structures are the solid structures of the liquid tank 50 .

[0132] contrast Fig.13 and Figure 8 It can be seen that the second outflow channel 33 extends along the second direction Y, but Fig.13 The position of the outlet 70 connected to the second outflow channel 33 is shown, combined with Figure 3 It can be seen that the position corresponding to F-F1 is closer to the exit 70 side than the position of C-C1, so Fig.13 The location of exit 70 can be seen in the figure.

[0133] contrast Fig.14 and Fig. 9 It can be seen that Fig.14 It can be seen that the position of the inlet 60 is equivalent to the position of G-G1 being closer to the inlet 60 side than the position of D-D1. Fig.13 and Fig.14 Arrows are used to show the direction of cooling fluid flow.

[0134] contrast Fig.15 and Fig.10 It can be seen that Fig.10 Only import 60 and export 70 can be seen, and Fig.15 The confluence channel 35 and the first sub-outflow channel 321 and the second sub-outflow channel 322 can also be seen, which is equivalent to the position of the section line H-H1 being closer to the confluence channel 35 side than the position of the section line E-E1.

[0135] In some examples, the length (dimension along the second direction Y) of the substrate 10 is 163mm, the width (dimension along the first direction X) is 99mm, and the height (dimension along the third direction Z) is 3mm. The length (dimension along the first direction X) of the microchannel 21 of the microchannel layer 20 is 57.1mm, and the height (dimension along the third direction Z) is 6mm. The microchannel 21 is arranged in an array at the center of one side of the substrate 10 with equal spacing, and the design spacing is 0.5mm or 1mm. In actual use, it can be changed according to the requirements of the specific application scenario. The height (dimension along the third direction Z) of the second outflow channel 33 is 4mm, and the length (dimension along the second direction Y) is 143.5mm; the height (dimension along the third direction Z) of the first sub-outflow channel 321 and the second sub-outflow channel 322 are both 13mm, and the length (dimension along the second direction Y) is 143.5mm. The height (dimension along the third direction Z) of the sub-inflow channel 311 is 7mm. The structural form is designed according to the size and position of the heat source to distribute the cooling medium of the inlet 60 to the hot spot area 11 (specifically, it can be distributed to the first local hot spot area 111). The inlet 60 has a diameter of 12mm and a height (dimension along the third direction Z) of 9mm. It is located at the center of the bottom of the liquid tank 50 and is connected to the sub-inflow channel 311. The outlet 70 is located on both sides of the bottom of the liquid tank 50, 50.64mm away from the inlet 60, with a diameter of 8mm and a height (dimension along the third direction Z) of 3mm. It is connected to the first sub-outflow channel 321, the second sub-outflow channel 322 and the second outflow channel 33. The overall inlet and outlet 70 pipe diameter and relative position can be adjusted according to the structural changes of the heat dissipation element 200 and the heat dissipation assembly 100 to be cooled, and can be designed as 2 in 1 out or other multiple inlet and outlet 70 forms. The liquid tank 50 has an overall length (dimension along the second direction Y) of 223 mm, a width (dimension along the first direction X) of 119 mm, and a height of 22 mm. The inside is chiseled with the above-mentioned two-layer manifold channels (corresponding to the following Figure 8 and Fig. 9 The arrangement of the microchannels 21 and the manifold layer 30 in a single layer and the spacing between the two layers can be adjusted according to the overall structural dimensions of the heat dissipation component 100 itself and the size and position of the hot spot area 11.

[0136] See also Figure 16 to Figure 18 , Fig.16 is a temperature cloud diagram of a hot spot area corresponding to a heat dissipation component provided in some embodiments of the present application, Fig.17 is a fluid flow diagram in a heat sink provided in some embodiments of the present application, Fig.181 is a fluid pressure distribution diagram in a heat sink provided in some embodiments of the present application, wherein the spacing between the microchannels 21 in the heat sink assembly 100 is 0.5 mm.

[0137] It can be seen that when the spacing of the microchannels 21 of the heat dissipation assembly 100 provided in the embodiment of the present application is 0.5 mm, the maximum temperature on the heat dissipation element 200 is 102.9°C, the average temperature is 94.87°C, and the pressure difference between the inlet and outlet 70 is 3931Pa. Fig.19 and Fig. 20 , Fig.19 is a temperature cloud diagram of a hot spot area corresponding to a heat dissipation component provided in some embodiments of the present application, Fig. 20 The temperature cloud diagram of the hot spot area of ​​the heat dissipation component provided in some embodiments of the present application is shown in FIG. 1 . The spacing of the microchannels 21 in the heat dissipation component 100 is 0.5 mm, but other parameters may be different from FIG. Fig.16 The temperature cloud diagram results are different because the embodiments are different. The spacing of the microchannels 21 in the heat dissipation component 100 is 1 mm. Fig. 20 Other parameters in the embodiment are Fig.19 The embodiments are the same, and the purpose is only to compare the influence of different micro-channel 21 intervals on the temperature of the heat sink 200 .

[0138] contrast Fig.19 and Fig. 20 It can be seen that after the spacing between the microchannels 21 is reduced, the maximum temperature, the minimum temperature, the average temperature and the temperature difference of the heat dissipation element 200 are correspondingly reduced.

[0139] The liquid tank of the heat dissipation component described in the present application can first be processed into the required manifold layer, with only the inlet 60 and the outlet 70 arranged in the liquid tank, and then the different manifold layers and liquid tanks are connected together through vacuum brazing or other methods to achieve manufacturing and application, without limiting the specific processing implementation method.

[0140] The embodiment of the present application designs a manifold-type multi-layer microchannel heat dissipation component that improves local hot spots, which can enhance the heat exchange performance of the heat dissipation component 100 while ensuring low flow resistance, and can improve the uniformity of the overall temperature distribution to avoid thermal stress concentration. That is, in addition to the advantage of improving local hot spots, the heat dissipation component provided by the embodiment of the present application also has very good flow heat transfer performance, strong heat dissipation effect and low fluid flow resistance compared to other existing heat dissipation structures.

[0141] The manifold-type multi-layer microchannel heat dissipation component can achieve the optimal heat dissipation performance under different working conditions by adjusting the hydraulic diameter of the channel, and meet various complex heat dissipation working conditions and requirements. The structure form and characteristic size of the microchannel layer 20 and the matching structure form and size of the manifold layer 30 can also be determined according to the size and heat dissipation requirements of the heat dissipation element 200 to be radiated, so as to meet the requirements under different working conditions and usage scenarios.

[0142] This structure has strong heat dissipation capability and small voltage drop, and can be used in lithium-ion battery heat dissipation, semiconductor heat dissipation, microchannel heat dissipation technology, electronic equipment heat dissipation technology and other fields.

[0143] The present application also provides a power device, which includes the heat dissipation assembly and a heat dissipation component in any of the above embodiments, wherein the heat dissipation component is located on a substrate of the heat dissipation assembly. The power device has all the beneficial effects of the above heat dissipation assembly, which will not be described in detail in this disclosure.

[0144] An embodiment of the present application also provides a vehicle, which includes the power device in the above embodiment. The vehicle has all the beneficial effects of the above power device, which will not be described in detail in this disclosure.

[0145] The vehicle may be a fuel vehicle, a plug-in hybrid vehicle, a new energy vehicle, etc., and the present disclosure does not make any specific limitation on this.

[0146] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0147] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0148] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0149] The above are only preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A heat dissipation assembly (100) for dissipating heat from a heat dissipation element (200); characterized in that: include: A substrate (10), the substrate (10) being covered with a hot spot area (11) corresponding to the heat element (200) to be cooled; a microchannel layer (20) having microchannels (21) and located on a side of the substrate (10) facing away from the heat element (200) to be dissipated; and a manifold layer (30), located on a side of the microfluidic channel layer (20) facing away from the substrate (10); Wherein, the manifold layer (30) comprises an inflow channel (31) connected to the microchannel (21), and the inflow channel (31) is arranged corresponding to the hot spot area (11).

2. The heat dissipation assembly (100) according to claim 1, characterized in that: The orthographic projection of the inflow channel (31) on the substrate (10) at least partially overlaps with the hot spot area (11).

3. The heat dissipation assembly (100) according to claim 1, characterized in that: The hot spot area (11) comprises a first local hot spot area (111) and a second local hot spot area (112), the first local hot spot area (111) is located on at least one side of the second local hot spot area (112), the first local hot spot area (111) has a first hot spot temperature, the second local hot spot area (112) has a second hot spot temperature, and the first hot spot temperature is greater than the second hot spot temperature; The inflow channel (31) is arranged corresponding to the first local hot spot area (111).

4. The heat dissipation assembly (100) according to claim 3, characterized in that: The orthographic projection of the inflow channel (31) on the first surface (101) at least partially overlaps with the first local hot spot area (111).

5. The heat dissipation assembly (100) according to claim 1, characterized in that: The substrate (10) is also covered with a non-hot spot area (12) adjacent to the hot spot area (11), and the temperature of the non-hot spot area (12) is lower than the temperature of the hot spot area (11); The manifold layer (30) further comprises a first outflow channel (32) connected to the microchannel (21), wherein an orthographic projection of the first outflow channel (32) on the substrate (10) at least partially overlaps with the non-hotspot area (12).

6. The heat dissipation assembly (100) according to claim 5, characterized in that: The non-hotspot area (12) comprises a first sub-non-hotspot area (121) and a second sub-non-hotspot area (122), wherein the first sub-non-hotspot area (121) and the second sub-non-hotspot area (122) are respectively located on two sides of the hotspot area (11) along a first direction (X), and the first direction (X) is parallel to the substrate (10); The first outflow channel (32) comprises a first sub-outflow channel (321) and a second sub-outflow channel (322) which are connected to the microchannel (21); the first sub-outflow channel (321) at least partially overlaps with the first sub-non-hotspot area (121); the second sub-outflow channel (322) at least partially overlaps with the second sub-non-hotspot area (122); and the first sub-outflow channel (321) and the second sub-outflow channel (322) are respectively located on both sides of the inflow channel (31) along the first direction (X).

7. The heat dissipation assembly (100) according to claim 6, characterized in that: The first sub-outflow channel (321) and the second sub-outflow channel (322) both extend along a second direction (Y); The dimension of the first sub-outflow channel (321) along the second direction (Y) is greater than or equal to the dimension of the microchannel layer (20) along the second direction (Y); and The second direction (Y) is parallel to the first surface (101) and intersects with the first direction (X).

8. The heat dissipation assembly (100) according to claim 3, characterized in that: In one of the inflow channels (31) corresponding to one of the hot spot areas (11), the inflow channel (31) comprises a plurality of sub-inflow channels (311) arranged at intervals along a first direction (X), and one of the sub-inflow channels (311) is arranged corresponding to one of the first local hot spot areas (111), and the first direction (X) is parallel to the first surface (101).

9. The heat dissipation assembly (100) according to claim 8, characterized in that: The manifold layer (30) further comprises a second outflow channel (33) connected to the microchannel (21), wherein the orthographic projection of the second outflow channel (33) on the first surface (101) at least partially overlaps with the second local hot spot area (112).

10. The heat dissipation assembly (100) according to claim 9, characterized in that: The second outflow channel (33) extends along a second direction (Y) and is located between two adjacent sub-inflow channels (311), and the second direction (Y) is parallel to the first surface (101) and intersects with the first direction (X).

11. The heat dissipation assembly (100) according to claim 8, characterized in that: The first local hot spot area (111) includes a first sub-local hot spot area and a second sub-local hot spot area, the second sub-local hot spot area is located on both sides of the first sub-local hot spot area along a second direction (Y), the temperature of the first sub-local hot spot area is greater than the temperature of the second sub-local hot spot area, and the second direction (Y) is parallel to the first surface (101) and intersects with the first direction (X); and The sub-inflow channel (311) includes a first channel portion and a second channel portion, wherein the first channel portion is arranged corresponding to the first sub-local hot spot area, and the second channel portion is arranged corresponding to the second sub-local hot spot area, and the size of the first channel portion along the first direction (X) is greater than the size of the second channel portion along the first direction (X).

12. The heat dissipation assembly (100) according to claim 8, characterized in that: The substrate (10) is covered with a plurality of hot spot areas (11) arranged at intervals, and each hot spot area (11) is correspondingly provided with at least one sub-inflow channel (311).

13. The heat dissipation assembly (100) according to claim 1, characterized in that: It also includes an inlet (60) located on the side of the manifold layer (30) away from the substrate (10), wherein the inlet (60) is connected to the inlet channel (31) and is arranged corresponding to one of the hot spots (11).

14. The heat dissipation assembly (100) according to claim 13, characterized in that: The manifold layer (30) further comprises a flow-dividing channel (34), one end of which is in communication with the inlet (60), and the other end of which is in communication with the inlet channel (31).

15. The heat dissipation assembly (100) according to claim 5, characterized in that: It also includes an outlet (70) located on the side of the manifold layer (30) away from the substrate (10), wherein the outlet (70) is connected to the first outflow channel (32) and is arranged corresponding to the hot spot area (11).

16. The heat dissipation assembly (100) according to claim 15, characterized in that: The manifold layer (30) further comprises a confluence channel (35) in communication with the outlet (70), wherein the confluence channel (35) is in communication with the first outflow channel (32).

17. The heat dissipation assembly (100) according to claim 6, characterized in that: The hot spot areas (11) are arranged at intervals along a second direction (Y), and the second direction (Y) is parallel to the first surface (101) and intersects with the first direction (X); The non-hotspot area (12) further comprises a third sub-non-hotspot area (113), and the third sub-non-hotspot area (113) is located between adjacent hotspot areas (11).

18. The heat dissipation assembly (100) according to claim 17, characterized in that: The microchannels (21) extend along the first direction (X) and are arranged at intervals along the second direction (Y), and the second direction (Y) is parallel to the first surface (101) and intersects with the first direction (X).

19. The heat dissipation assembly (100) according to claim 18, characterized in that: The microchannel (21) comprises a plurality of first sub-microchannels and a plurality of second sub-microchannels, the plurality of first sub-microchannels being arranged corresponding to the hotspot area (11), and the plurality of second sub-microchannels being arranged corresponding to the third non-hotspot area (12); and There is a first distance between two adjacent first sub-microchannels, and there is a second distance between two adjacent second sub-microchannels, and the first distance is smaller than the second distance.

20. The heat dissipation assembly (100) according to claim 1, characterized in that: The microchannel (21) is a wavy channel or a straight channel extending along a first direction (X), and the first direction (X) is parallel to the substrate (10).

21. A power device, characterized in that: include: The heat dissipation assembly (100) according to any one of claims 1 to 20; and The heat dissipation element (200) is located on the substrate (10) of the heat dissipation assembly (100).

22. A vehicle, characterized in that: Comprising the power device as claimed in claim 21.

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