Network equipment

Abstract

The present invention provides a network device, comprising: a switching board having a switching chip; a heat sink arranged on the switching chip, used to absorb the heat of the switching chip and exchange heat with the airflow passing through the heat sink; and a control board, which is communicatively connected to the switching board, wherein the setting position of the control board is staggered with the airflow path after heat exchange. The network device of the present invention staggers the setting position of the control board with the airflow path after heat exchange, so that the airflow after heat exchange does not flow through the control board, thereby avoiding the influence of the high-temperature airflow on the control board, so that the control board can be kept at a normal operating temperature, thereby improving the stability and reliability of the control board, and reducing the risk of damage to the control board.

Description

Technical Field

[0001] The present invention relates to the field of communication technology, and in particular to a network device. Background Art

[0002] As data traffic grows, the development and deployment of high-bandwidth services place greater demands on network equipment. Data centers, as the largest terminal application for switches, account for up to 50%. With the development of AI (artificial intelligence) technology, AI applications need to process large amounts of data and have higher requirements for data transmission speeds, requiring more and higher-speed switches to support real-time data transmission.

[0003] Increasing switch bandwidth faces numerous challenges. As port speeds increase, the signal rates of the electrical interfaces used for hardware interconnects have also increased. In just a decade or so, this has increased from 10G to 100G. Consequently, the switching chips used in high-bandwidth switches consume significant power, with a single chip potentially exceeding 500W. Within the compact design space, the heat dissipated by the switching chips can easily overheat adjacent control components, reducing switch efficiency or even damaging them. Therefore, improving the heat dissipation capabilities of switches is a pressing issue in this field. Summary of the Invention

[0004] The embodiments of the present invention aim to at least solve the problem in the prior art that heat dissipated by a switching chip easily causes the temperature of adjacent control components to be too high, resulting in reduced working efficiency or even damage to network equipment, and provide a network device.

[0005] An embodiment of the present invention discloses a network device, comprising: a switching board having a switching chip; a radiator arranged on the switching chip and used to absorb heat from the switching chip and exchange heat with airflow passing through the radiator; and a control board communicatively connected to the switching board, wherein the setting position of the control board is staggered with the flow path of the airflow after heat exchange.

[0006] Optionally, the exchange board and the control board are split structures.

[0007] Optionally, the signal attenuation amplitude of the switching board is smaller than the signal attenuation amplitude of the control board.

[0008] Optionally, the network device has a first heat dissipation duct for providing airflow, the first heat dissipation duct is arranged along a first direction parallel to the plane where the exchange board is located, and the radiator is located in the first heat dissipation duct; in a second direction perpendicular to the plane where the exchange board is located, the control board and the exchange board are spaced apart.

[0009] Optionally, the exchange plate has a first side and a second side that are arranged opposite to each other, the first heat dissipation duct is located on the first side of the plane where the exchange plate is located, and the control board is located on the second side of the plane where the exchange plate is located.

[0010] Optionally, the control board is parallel to the plane where the exchange board is located, and the control board and the exchange board are spaced apart in the first direction.

[0011] Optionally, the network device also includes: an expansion board, which is communicatively connected to the switch board and the control board respectively, the expansion board and the control board are located in the same plane, and the setting position of the expansion board corresponds to the position of the switch board, and a second heat dissipation duct is formed between the expansion board and the switch board.

[0012] Optionally, the network device also includes: a shell having a first end and a second end along a first direction, the first end of the shell being provided with a first air outlet, the second end of the shell being provided with a second air outlet, the exchange board and the control board being both provided in the shell; the exchange board being provided at the first end of the shell, and the control board being provided at the second end of the shell; the first heat dissipation duct being formed between the exchange board and the inner wall of the shell located on its first side, the first heat dissipation duct being connected to the first air outlet; a third heat dissipation duct being formed between the control board and the inner wall of the shell located on the first side of the exchange board, the first heat dissipation duct being connected to the third heat dissipation duct, and the third heat dissipation duct being connected to the second air outlet.

[0013] Optionally, the network device also includes: an expansion board, which is arranged at the first end inside the shell and is respectively communicated with the switching board and the control board, the expansion board is arranged parallel to the second side of the switching board, and a second heat dissipation duct is formed between the expansion board and the switching board, and the two ends of the second heat dissipation duct are respectively connected to the first air outlet and the third heat dissipation duct.

[0014] Optionally, the network device further includes: an auxiliary radiator, which is arranged in the shell, the auxiliary radiator is connected to the radiator, part of the auxiliary radiator is located in the third heat dissipation duct, and the auxiliary radiator is used to expand the heat exchange area between the radiator and the airflow.

[0015] Optionally, the network device also includes: a power adapter board, which is arranged at the second end of the shell and located in the third heat dissipation duct, the power adapter board is communicatively connected to the control board, and the power adapter board is used to supply power to the switching board and the control board.

[0016] Optionally, the network device further includes: a fan, disposed at the second air outlet position of the shell, for driving the airflow to flow in the first direction, and the power adapter plate is electrically connected to the fan to supply power to the fan.

[0017] Optionally, the power adapter plate is perpendicular to the exchange plate, a avoidance opening is provided on the power adapter plate, and the fan corresponds to the avoidance opening.

[0018] Optionally, the network device has a first heat dissipation duct for providing airflow, the first heat dissipation duct is arranged along a first direction parallel to the plane where the exchange board is located, and the radiator is located in the first heat dissipation duct; the control board and the exchange board are located in the same plane, and the exchange board and the control board are distributed in sequence in a third direction perpendicular to the first direction and parallel to the plane where the exchange board is located.

[0019] During the use of network equipment, as the data throughput increases, the heat emitted by the switching chip during operation also increases. By setting a radiator on the switching chip, the heat emitted by the switching chip can be absorbed by the radiator. After absorbing the heat, the radiator exchanges heat with the airflow flowing through it, thereby taking away the heat through the airflow, thereby reducing the temperature of the heat exchange chip. Therefore, the temperature of the airflow will also increase along the path of the airflow. In order to avoid the influence of high-temperature airflow on the control board. The network equipment of the present invention staggers the setting position of the control board and the airflow path after heat exchange, so that the airflow after heat exchange does not flow through the control board, thereby avoiding the influence of high-temperature airflow on the control board, so that the control board can be maintained at a normal operating temperature, improving the stability and reliability of the control board, and reducing the risk of damage to the control board. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the structure of a network device according to the first embodiment of the present invention;

[0021] Figure 2 This is a structural diagram of a switch board of a network device according to the first embodiment of the present invention;

[0022] Figure 3 A schematic diagram of the structure of the control panel of the network device according to the first embodiment of the present invention

[0023] Figure 4 This is a schematic structural diagram of an expansion board of a network device according to a first embodiment of the present invention;

[0024] Figure 5 This is a schematic diagram of the structure of a network device according to the second embodiment of the present invention;

[0025] Figure 6 This is a schematic diagram of the structure of a network device according to a third embodiment of the present invention;

[0026] Figure 7 This is a schematic perspective view of a network device according to a third embodiment of the present invention;

[0027] Figure 8 This is a schematic diagram of the structure of a network device according to a fourth embodiment of the present invention;

[0028] List of reference numerals:

[0029] 10. Switch board; 11. Switch chip; 12. First low-speed connector; 13. First optical module cage; 14. First high-speed connector; 20. Radiator; 30. Control board; 31. Second low-speed connector; 32. Central processing unit; 33. BMC; 34. Fourth low-speed connector; 41. First cooling air duct; 42. Second cooling air duct; 43. Third cooling air duct; 50. Expansion board; 51. Second high-speed connector; 52. Third low-speed connector; 53. Second optical module cage; 60. Housing; 61. First air outlet; 62. Second air outlet; 63. Top plate; 64. Bottom plate; 70. Auxiliary radiator; 80. Power adapter board; 81. Fifth low-speed connector; 82. Avoidance; 90. Fan. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the technical solution of the present invention, the network device provided by the present invention is described in detail below with reference to the accompanying drawings.

[0031] Example embodiments will be described more fully hereinafter with reference to the accompanying drawings, but example embodiments may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of this disclosure to those skilled in the art.

[0032] like Figure 1 The first embodiment of the present invention, shown in FIG. , discloses a network device comprising a switch board 10, a heat sink 20, and a control board 30. The switch board 10 is provided with a switch chip 11. The heat sink 20 is disposed on the switch chip 11 to absorb heat from the switch chip 11 and exchange heat with air flowing through the heat sink 20. The control board 30 is communicatively connected to the switch board 10, and the location of the control board 30 is staggered with respect to the airflow path after heat exchange.

[0033] During the use of the network device, as the data throughput increases, the heat emitted by the switching chip 11 during operation also increases. By providing a heat sink 20 on the switching chip 11, the heat emitted by the switching chip 11 can be absorbed by the heat sink 20. After absorbing the heat, the heat sink 20 exchanges heat with the airflow flowing through it, thereby taking away the heat through the airflow, thereby reducing the temperature of the heat exchange chip 11. Therefore, the temperature of the airflow will also increase along the path of the airflow. In order to prevent the high-temperature airflow from affecting the control board 30, the network device of the present invention staggers the setting position of the control board 30 with the airflow path after heat exchange, so that the airflow after heat exchange does not flow through the control board 30, thereby preventing the high-temperature airflow from affecting the control board 30, allowing the control board 30 to be maintained at a normal operating temperature, improving the stability and reliability of the control board 30, and reducing the risk of damage to the control board 30.

[0034] like Figure 1 As shown, the switch board 10 and the control board 30 are split. That is, each is a separate PCB (printed circuit board). A first low-speed connector 12 is provided on the switch board 10, and a second low-speed connector 31 is provided on the control board 30. Signal lines connect the first and second low-speed connectors 12 and 31. By making the switch board 10 and the control board 30 split, different PCB materials can be used based on the signal transmission characteristics of the switch board 10 and the control board 30, thereby reducing overall costs.

[0035] Specifically, in this embodiment, Figure 2 As shown, the switch board 10 is the core board of the system. The first side of the switch board 10 is equipped with a switch chip 11, a first low-speed connector 12, a first optical module cage 13 (for example, ten 2×4 and two 2×2 QSFP112 ports), and a heat sink 20. The switch chip 11 is used for forwarding and processing primary services. The heat sink 20 is provided on the switch chip 11. The first low-speed connector 12 is used to communicate with the control board 30, thereby exchanging control signals with the control board 30. The second side of the switch board 10 is also equipped with the first optical module cage 13. In addition, a first high-speed connector 14 is provided for extracting some of the high-speed serial and deserialization interface signals of the switch chip 11, which can be used to connect to the expansion board 50. Therefore, the switch board 10 needs to use a high-speed board that matches the high-speed rate.

[0036] It should be noted that in PCB board design, DK and DF are two important parameters used to describe the electrical properties of dielectric materials.

[0037] DK (dielectric constant) is a measure of a material's electrical conductivity. It indicates the relative capacitance between the material and an electrical space. The higher the DK value, the better the material's conductivity. Common DK values ​​for PCB materials range from 2.2 to 5.0.

[0038] DF (dissipation factor) measures the degree of electrical energy loss in a material, also known as the material's loss angle. The lower the DF value, the lower the material's loss. Generally, a good PCB material should have a DF value above 0.001. In this embodiment, the high-speed board material required for switch board 10 is made of a very low-loss material, with a DF value of 0.0017 and a DK value of 3.1.

[0039] like Figure 3 As shown, the control board 30 is equipped with a second low-speed connector 31, a central processing unit 32, a baseboard management controller (BMC) 33, and a fourth low-speed connector 34. The central processing unit 32 is the core unit for system control and management, and serves as the functional carrier for the operation and storage of the device system's business software. The second low-speed connector 31 is used to communicate with the switch board 10 and expansion board 50 via signal lines (line bus), enabling control signal exchange with the switch board 10 and expansion board 50 to perform control and management functions, such as initializing the configuration of the switch chip 11 on the switch board 10, issuing, reading, writing, and managing various forwarding tables, and configuring port access on the board. The BMC 33 and the fourth low-speed connector 34 are used to monitor and adjust the speed of electronic tags, ambient temperature, power supply, and fan 90.

[0040] Since the maximum signal rate of the control board 30 does not exceed 10G, low-speed boards (for example, epoxy glass cloth laminates with a DF value of 0.02 and a DK value of 4.4) can be used. However, the serial-to-deserialization interface signal rate of the switch board 10 exceeds 100G, so high-speed boards are required. The difference between high-speed boards and low-speed boards is that the signal attenuation on high-speed boards is less than that on low-speed boards. Therefore, the cost of high-speed boards is higher than that of low-speed boards. In other words, the signal attenuation on the switch board 10 is less than that on the control board 30. Since the switch board 10 and the control board 30 are separated, PCBs of different materials can be used for the control board 30. There is no need to use high-speed boards for all of them, which reduces equipment costs. The split design also allows different PCBs to be reused in different devices as needed, reducing the cost of repeated development.

[0041] The following combination Figure 1 The first embodiment shown here specifically describes the network device of the present invention.

[0042] like Figure 1 As shown, the network device has a first heat dissipation duct 41 for providing airflow. The first heat dissipation duct 41 is arranged along a first direction parallel to the plane where the switch board 10 is located. The radiator 20 is located in the first heat dissipation duct 41. In a second direction perpendicular to the plane where the switch board 10 is located, the control board 30 is spaced apart from the switch board 10. In other words, Figure 1 In the illustrated first embodiment, airflow moves in a first direction, thereby forming a first cooling duct 41 along the airflow path. Since the radiator 20 is located along the airflow path, it is equivalent to being located within the first cooling duct 41 and, therefore, can exchange heat with the airflow within the first cooling duct 41. By spacing the control board 30 and the exchange board 10 in the second direction, the control board 30 avoids the first cooling duct 41, preventing the airflow after heat exchange from flowing through the control board 30. This prevents the high-temperature airflow from affecting the control board 30, allowing the control board 30 to maintain a normal operating temperature, improving the operational stability and reliability of the control board 30 and reducing the risk of damage to the control board 30.

[0043] like Figure 1 As shown, the exchange board 10 has a first side and a second side that are arranged opposite each other. The first heat dissipation duct 41 is located on the first side of the plane in which the exchange board 10 is located, and the control board 30 is located on the second side of the plane in which the exchange board 10 is located. That is, in this embodiment, the control board 30 and the switch chip 11 are located on either side of the exchange board 10, respectively. Therefore, the radiator 20 and the control board 30 are also located on either side of the exchange board 10, respectively. Therefore, while saving space, the control board 30 can be kept as far away from the radiator 20 as possible and away from the first heat dissipation duct 41, thereby maximizing space utilization, preventing the impact of hot air flow on the control board 30, improving the stability and reliability of the control board 30, and reducing the risk of damage to the control board 30.

[0044] It can be understood that, in this embodiment, the control board 30 is parallel to the plane where the exchange board 10 is located, and the control board 30 and the exchange board 10 are spaced apart in the first direction, such as Figure 1As shown, the control board 30 and the exchange board 10 are parallel to each other. This arrangement allows space for airflow between the two, thereby improving the heat dissipation effect. Moreover, this parallel arrangement effectively utilizes space and maximizes space utilization. In addition, it can be seen that the control board 30 and the exchange board 10 are staggered in both the first and second directions. Since the exchange chip 11 and the radiator 20 both radiate heat to the surroundings, by staggering the control board 30 and the exchange board 10 in both the first and second directions, the control board 30 can be kept as far away from the exchange chip 11 and the radiator 20 as possible. While avoiding the influence of hot airflow on the control board 30, the heat radiation received is further reduced, thereby reducing the influence of the exchange chip 11 and the radiator 20 on the heat radiation of the control board 30, improving the stability and reliability of the control board 30, and reducing the risk of damage to the control board 30.

[0045] like Figure 1 As shown, in the first embodiment, the network device further includes: an expansion board 50, which is respectively communicated with the switch board 10 and the control board 30 through signal lines. The expansion board 50 and the control board 30 are located in the same plane, and the setting position of the expansion board 50 corresponds to the position of the switch board 10, and a second heat dissipation duct 42 is formed between the expansion board 50 and the switch board 10.

[0046] like Figure 4 As shown, the expansion board 50 is provided with a second high-speed connector 51 that matches the first high-speed connector 14. After the second high-speed connector 51 is plugged into the first high-speed connector 14, a communication connection is achieved between the expansion board 50 and the switch board 10 to achieve the interaction of high-speed serial and deserialization interface signals. The expansion board 50 is also provided with a third low-speed connector 52 for communication connection with the control board 30. A second optical module cage 53 is provided on the lower panel side of the expansion board 50. Since the maximum signal rate of the expansion board 50 exceeds 100G, a high-speed board material that matches the high-speed rate is required.

[0047] In this embodiment, if Figure 1 As shown, by setting the expansion board 50, the interface expansion function can be realized, thereby increasing the number of connectable devices. Since the control board 30 and the switch board 10 are staggered, Figure 1 The space below the middle switch board 10 is perfectly suited for mounting the expansion board 50, fully utilizing the assembly space. Furthermore, since the expansion board 50 is arranged parallel to the switch board 10, a second heat dissipation duct 42 is formed between the expansion board 50 and the switch board 10, thereby enhancing heat dissipation.

[0048] In this embodiment, if Figure 1As shown, communication connections are established between the second low-speed connector 31 of the control board 30 and the first low-speed connector 12 of the switch board 10, and between the second low-speed connector 31 of the control board 30 and the third low-speed connector 52 of the expansion board 50 via signal lines, such as busbars. This approach ensures the separate structure of the switch board 10, control board 30, and expansion board 50 while also ensuring reliable data transmission and facilitating assembly.

[0049] It should be noted that, in this embodiment, the control board 30 and the exchange board 10 are staggered in both the first direction and the second direction. Figure 1 As shown, the control panel 30 is located at Figure 1 The first heat dissipation duct 41 is located below the heat dissipation duct 41, thereby avoiding the airflow after heat exchange. However, this is not restrictive. Figure 5 The structure of the second embodiment shown is basically the same as that of the first embodiment, except that, in the second embodiment, the exchange plates 10 and the control plates 30 are distributed in sequence in a third direction perpendicular to the first direction and parallel to the plane where the exchange plates 10 are located. Figure 5 It is a top view in the second direction, from Figure 5 It can be seen that in this embodiment, the control panel 30 avoids the airflow after heat exchange from the third direction. In this way, the influence of the hot airflow on the control panel 30 can also be avoided, the working stability and reliability of the control panel 30 can be improved, and the risk of damage to the control panel 30 can be reduced. Therefore, it is also within the scope of protection of the present invention.

[0050] Preferably, in the second embodiment, the control board 30 and the switch board 10 can be arranged in the same plane, thereby further reducing space occupation and reducing the volume of the network device.

[0051] It should also be noted that in the above-mentioned embodiments 1 and 2, the exchange board 10, the control board 30 and the expansion board 50 can be fixed by using a connecting bracket or fixed by being installed in the shell. The connection and fixing method between the exchange board 10, the control board 30 and the expansion board 50 belongs to the conventional technology in the field. Those skilled in the art can set it according to actual needs, so it will not be repeated here.

[0052] like Figure 6 As shown, the third embodiment of the present invention further discloses a network device, which is basically the same as the first embodiment, except that, in this embodiment, the network device further includes: a housing 60 and a fan 90 (see Figure 7 ).

[0053] The housing 60 has a first end and a second end along a first direction. A first air outlet 61 is provided at the first end of the housing 60, and a second air outlet 62 is provided at the second end of the housing 60. The exchange plate 10 and the control board 30 are both disposed within the housing 60. The exchange plate 10 is disposed at the first end of the housing 60, and the control board 30 is disposed at the second end of the housing 60. A first heat dissipation duct 41 is formed between the exchange plate 10 and the inner wall of the housing 60 located on a first side thereof, and the first heat dissipation duct 41 is connected to the first air outlet 61. A third heat dissipation duct 43 is formed between the control board 30 and the inner wall of the housing 60 located on the first side of the exchange plate 10, and the first heat dissipation duct 41 is connected to the third heat dissipation duct 43, and the third heat dissipation duct 43 is connected to the second air outlet 62. A fan 90 is disposed at the second air outlet 62 of the housing 60 to drive airflow in the first direction.

[0054] The network device of the present invention positions the switch board 10 at the first end of the housing 60 and the control board 30 at the second end of the housing 60, staggering the switch board 10 and the control board 30. This allows the control board 30 to be positioned away from the switch chip 11 and the radiator 20, reducing the amount of heat radiation it receives. Furthermore, because the control board 30 is located on the second side of the switch board 10, the third heat dissipation duct 43 formed between the switch board 10 and the housing 60 is relatively large, providing ample space to dissipate heat after heat exchange with the radiator 20. This also provides ample space for the radiator 20 to dissipate heat, ensuring the heat dissipation efficiency of both the switch board 10 and the control board 30. Furthermore, by providing a fan 90, airflow is driven from the first air outlet 61 into the first heat dissipation duct 41 to exchange heat with the radiator 20. The hot air after heat exchange passes through the third heat dissipation duct 43 and is discharged from the second air outlet 62, thereby removing heat from the network device.

[0055] like Figure 6 As shown, in this embodiment, the shell 60 is relatively provided with a top plate 63 and a bottom plate 64 along the second direction. The top plate 63 and the bottom plate 64 are parallel to the exchange plate 10. The top plate 63 is located on the first side of the exchange plate 10, and the bottom plate 64 is located on the second side of the exchange plate 10. A first heat dissipation duct 41 is formed between the exchange plate 10 and the top plate 63, and a third heat dissipation duct 43 is formed between the control board 30 and the top plate 63. Compared with the exchange plate 10, the control board 30 is closer to the bottom plate 64, that is, the control board 30 is farther away from the top plate 63. Therefore, after the hot air flow in the second heat dissipation duct 42 enters the third heat dissipation duct 43, sufficient space can be maintained between the control board 30 and the incoming hot air flow to avoid the influence of the hot air flow on the control board 30.

[0056] like Figure 6As shown, in the third embodiment, the network device further includes: an expansion board 50, which is arranged at the first end in the shell 60 and is respectively communicated with the switch board 10 and the control board 30, and the expansion board 50 is arranged parallel to the second side of the switch board 10, and a second heat dissipation duct 42 is formed between the expansion board 50 and the switch board 10, and the two ends of the second heat dissipation duct 42 are respectively connected to the first air outlet 61 and the third heat dissipation duct 43.

[0057] By arranging an expansion board 50 parallel to the second side of the exchange board 10, while realizing the expansion function, a second heat dissipation duct 42 can also be formed between the expansion board 50 and the exchange board 10. By connecting with the first air outlet 61, external air flow can be introduced from the first air outlet 61 and the air flow is guided to the control board 30, thereby realizing heat dissipation of the control board 30, so that the control board 30 can be maintained at a normal operating temperature, improving the stability and reliability of the control board 30, and reducing the risk of damage to the control board 30.

[0058] It is understandable that in Figure 6 In the third embodiment shown, the network device also includes: a power adapter board 80, which is arranged at the second end of the shell 60 and located in the third heat dissipation duct 43, and the power adapter board 80 is communicatively connected to the control board 30. The power board is used to supply power to the switching board 10, the control board 30 and the fan 90.

[0059] In this embodiment, if Figure 6 As shown, a fifth low-speed connector 81 is provided on the power adapter board 80, and the fifth low-speed connector 81 is communicatively connected to the fourth low-speed connector 34 of the control board 30 through a signal line so that the control board 30 can control it. At the same time, the power adapter board 80 is also electrically connected to the switching board 10, the control board 30, the fan 90 and other components through power lines (copper busbars) so that the power adapter board 80 can supply power to the switching board 10, the fan 90 and other components. The control board 30 completes the control of the power adapter board 80 through signal interaction with the power adapter board 80. The control board 30 controls the state and speed of the fan 90 through the central processing unit 32. Since the maximum signal rate on the power adapter board 80 does not exceed 10G, a low-speed board can be used. As shown Figure 7 As shown, the power adapter board 80 is perpendicular to the switch board 10, and a clearance opening 82 is provided on the power adapter board 80. The fan 90 corresponds to the clearance opening 82. By providing the clearance opening 82 on the power adapter board 80, the fan 90 can be placed at the position of the clearance opening 82, so that air can pass through the clearance opening 82, reducing interference with the airflow of the power adapter board 80, thereby improving the heat dissipation effect.

[0060] like Figure 8The fourth embodiment of the present invention shown in FIG. 1 further discloses a network device, which is substantially the same as the third embodiment, except that, in this embodiment, the network device further includes: an auxiliary radiator 70, which is disposed in the housing 60, is connected to the radiator 20, and a portion of the auxiliary radiator 70 is located in the third heat dissipation duct 43, and is used to expand the heat exchange area between the radiator 20 and the airflow. Figure 8 As shown, in this embodiment, the auxiliary radiator 70 is a metal heat sink, which is connected to the radiator 20. Most of the auxiliary radiator 70 is located in the third heat dissipation duct 43. Since the distance between the control board 30 and the top plate 63 is large, while ensuring sufficient heat dissipation space, the auxiliary radiator 70 can also be accommodated, so that the heat dissipation area of ​​the radiator 20 can be increased through the auxiliary radiator 70, thereby improving the heat exchange efficiency with the airflow and improving the overall heat dissipation effect.

[0061] In the above embodiments, the network devices include switches, routers, etc.

[0062] The network device of the present invention optimizes the positions of the switching board 10 and the control board 30 in the housing 60, making full use of the internal space of the housing 60. While ensuring the heat dissipation of the switching chip 11, the split modular design enables the reuse of different PCB boards, reducing development costs. In addition, suitable boards can be selected according to the electrical signal rates of different PCB boards, thereby reducing hardware costs and improving product competitiveness.

[0063] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0064] The terms used herein are used only to describe specific embodiments and are not intended to limit the present disclosure. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It will also be understood that when the terms "comprising" and / or "made of" are used in this specification, they specify the presence of features, wholes, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or groups thereof.

[0065] In the absence of conflicts, the various embodiments of the present disclosure and the various features therein may be combined with each other. The embodiments herein may be described with reference to plan views and / or cross-sectional views with the aid of ideal schematic diagrams of the present disclosure. Therefore, the example illustrations may be modified according to manufacturing techniques and / or tolerances. Therefore, the embodiments are not limited to the embodiments shown in the accompanying drawings, but include modifications of configurations formed based on manufacturing processes. Therefore, the areas illustrated in the accompanying drawings have schematic properties, and the shapes of the areas shown in the figures illustrate the specific shapes of the areas of the elements, but are not intended to be limiting.

[0066] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted as having an idealized or overly formal meaning unless expressly defined as such herein.

[0067] It will be understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present invention, and the present invention is not limited thereto. Those skilled in the art will appreciate that various modifications and improvements can be made without departing from the spirit and substance of the present invention, and such modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A network device, characterized in that: include: A switching board (10) having a switching chip (11); A heat sink (20) is arranged on the switching chip (11) and is used to absorb heat from the switching chip (11) and to exchange heat with an airflow passing through the heat sink (20); The control panel (30) is in communication connection with the exchange panel (10), and the setting position of the control panel (30) is staggered with the flow path of the airflow after heat exchange.

2. The network device according to claim 1, characterized in that: The exchange plate (10) and the control plate (30) are of split structure.

3. The network device according to claim 1, characterized in that: The signal attenuation amplitude of the switching board (10) is smaller than the signal attenuation amplitude of the control board (30).

4. The network device according to claim 1, characterized in that: The network device has a first heat dissipation duct (41) for providing airflow, the first heat dissipation duct (41) being arranged along a first direction parallel to the plane where the exchange board (10) is located, and the radiator (20) is located in the first heat dissipation duct (41); In a second direction perpendicular to the plane where the exchange plate (10) is located, the control plate (30) is spaced apart from the exchange plate (10).

5. The network device according to claim 4, characterized in that: The exchange plate (10) has a first side and a second side that are arranged opposite to each other, the first heat dissipation duct (41) is located on the first side of the plane where the exchange plate (10) is located, and the control board (30) is located on the second side of the plane where the exchange plate (10) is located.

6. The network device according to claim 5, characterized in that: The control plate (30) is parallel to the plane where the exchange plate (10) is located, and the control plate (30) and the exchange plate (10) are arranged at a distance in the first direction.

7. The network device according to claim 6, characterized in that: The network device also includes: The expansion board (50) is respectively connected to the exchange board (10) and the control board (30) for communication; the expansion board (50) and the control board (30) are located in the same plane, and the setting position of the expansion board (50) corresponds to the position of the exchange board (10); a second heat dissipation duct (42) is formed between the expansion board (50) and the exchange board (10).

8. The network device according to claim 1, characterized in that: The network device has a first heat dissipation duct (41) for providing airflow, the first heat dissipation duct (41) being arranged along a first direction parallel to the plane where the exchange board (10) is located, and the radiator (20) is located in the first heat dissipation duct (41); In a third direction perpendicular to the first direction and parallel to the plane where the exchange plate (10) is located, the exchange plate (10) and the control plate (30) are distributed in sequence.

9. The network device according to claim 5, characterized in that: The network device also includes: A shell (60) having a first end and a second end along a first direction, the first end of the shell (60) being provided with a first air outlet (61), the second end of the shell (60) being provided with a second air outlet (62), the exchange plate (10) and the control plate (30) being both arranged in the shell (60); The exchange plate (10) is arranged at a first end of the housing (60), and the control plate (30) is arranged at a second end of the housing (60); The first heat dissipation duct (41) is formed between the exchange plate (10) and the inner wall of the shell (60) located on the first side thereof, and the first heat dissipation duct (41) is connected to the first air outlet (61); A third heat dissipation duct (43) is formed between the control board (30) and the inner wall of the shell (60) located on the first side of the exchange board (10); the first heat dissipation duct (41) is connected to the third heat dissipation duct (43); and the third heat dissipation duct (43) is connected to the second air outlet (62).

10. The network device according to claim 9, characterized in that: The network device also includes: An expansion board (50) is arranged at a first end in the shell (60) and is respectively connected to the exchange board (10) and the control board (30) for communication; the expansion board (50) is arranged in parallel on a second side of the exchange board (10); a second heat dissipation duct (42) is formed between the expansion board (50) and the exchange board (10); and two ends of the second heat dissipation duct (42) are respectively connected to the first air outlet (61) and the third heat dissipation duct (43).

11. The network device according to claim 9, characterized in that: The network device also includes: A power adapter board (80) is arranged at the second end of the housing (60) and is located in the third heat dissipation duct. The power adapter board (80) is communicatively connected with the control board (30). The power adapter board (80) is used to supply power to the exchange board (10) and the control board (30).

12. The network device according to claim 11, characterized in that: The network device also includes: The fan (90) is arranged at the second air outlet (62) of the housing (60) and is used to drive the airflow to flow in a first direction. The power adapter plate (80) is electrically connected to the fan (90) to supply power to the fan (90).

13. The network device according to claim 12, characterized in that: The power adapter plate (80) is perpendicular to the exchange plate (10), a clearance opening (82) is provided on the power adapter plate (80), and the fan (90) corresponds to the clearance opening (82).

14. The network device according to claim 9, characterized in that: The network device also includes: An auxiliary radiator (70) is arranged in the housing (60), the auxiliary radiator (70) is connected to the radiator (20), a portion of the auxiliary radiator (70) is located in the third heat dissipation duct (43), and the auxiliary radiator (70) is used to expand the heat exchange area between the radiator (20) and the airflow.

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