Low-power-consumption network switch with efficient heat dissipation structure

Abstract

The invention discloses a low-power-consumption network switch with an efficient heat dissipation structure, and relates to the technical field of network switches, the low-power-consumption network switch comprises a switch shell, a control processor and a passive heat dissipation module, the control processor is fixedly installed at the bottom of the inner wall of the switch shell, and the passive heat dissipation module is fixedly installed on the side face of the inner wall of the switch shell. The top of the outer wall of the control processor is in contact with the passive heat dissipation module through a high-heat-conduction metal interface to conduct heat. The passive heat dissipation module is installed, so that the uniform heat dissipation function is achieved, the problem that heat dissipation is not uniform due to the fact that a traditional network switch adopts a single fan for heat dissipation is solved, the heat dissipation effect is improved, the network switch is suitable for being used in various changing environments, and energy consumption is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of network switches, and in particular to a low-power consumption network switch with a high-efficiency heat dissipation structure. Background Art

[0002] In recent years, with the rapid development of data centers, cloud computing, and edge computing, network switches have put forward higher requirements for high performance, low power consumption, and high reliability. In high-density integrated devices, the high-speed operation of multiple chips will generate a lot of heat, and the traditional solution that relies on a single fan or a simple heat sink has the defects of uneven heat dissipation and high energy consumption.

[0003] These deficiencies make the equipment prone to performance degradation or even damage during long-term operation. Therefore, how to achieve efficient heat dissipation while ensuring low power consumption has become a key technical problem in the design of network switches. Against this background, developing a new heat dissipation structure that combines active and passive heat dissipation technologies and achieves precise temperature control is of great significance to improving the overall heat dissipation efficiency of the equipment, extending its service life, and meeting the needs of future high-performance networks.

[0004] Patent document CN112135203B discloses an energy-saving and environmentally friendly network switch heat dissipation mechanism. The above patent has greatly improved the heat dissipation effect, avoided safety accidents caused by heat accumulation, ensured the safe use of the equipment, and to a certain extent improved the service life of the equipment, greatly saved the user's cost, improved the practicability and safety of the equipment, and reduced the energy waste caused by the cooling fan.

[0005] In summary, the above patents achieve good heat dissipation effects, but there is still room for optimization in the heat dissipation structure; To this end, the present application proposes a low-power network switch with an efficient heat dissipation structure that can achieve active and passive heat dissipation combined to reduce energy consumption. Summary of the invention

[0006] The object of the present invention is to provide a low-power network switch with an efficient heat dissipation structure to solve the technical problems of uneven heat dissipation and high energy consumption proposed in the above background technology.

[0007] To achieve the above object, the present invention provides the following technical solution: a low-power network switch with an efficient heat dissipation structure, comprising a switch housing, a control processor and a passive heat dissipation module, wherein the control processor is fixedly mounted on the bottom of the inner wall of the switch housing, the passive heat dissipation module is fixedly mounted on the side of the inner wall of the switch housing, and the top of the outer wall of the control processor contacts the passive heat dissipation module through a high thermal conductivity metal interface to conduct heat; The passive heat dissipation module comprises: a modular high thermal conductivity substrate, a phase change material heat dissipation unit and a micro heat pipe; A modular high thermal conductivity substrate is fixedly installed on the side of the inner wall of the switch housing, a micro heat pipe is fixedly installed on the bottom of the inner wall of the modular high thermal conductivity substrate, a phase change material heat dissipation unit is fixedly connected to the top of the outer wall of the micro heat pipe, and the micro heat pipe and the phase change material heat dissipation unit are both installed in a steam chamber formed inside the modular high thermal conductivity substrate, and the passive heat dissipation module cooperates with the active heat dissipation module installed in the switch housing to perform efficient heat dissipation.

[0008] Preferably, the micro heat pipe is filled with a working fluid, and local high heat is conducted to the edge of the modular high thermal conductivity substrate through the phase change heat principle. The phase change material heat dissipation unit is supported by microcapsule or thin film encapsulation technology and is distributed in an array covering the heat source area. The surface of the high thermal conductivity metal interface is coated with a graphene enhanced coating to reduce thermal resistance.

[0009] Preferably, a heat dissipation pipe is fixedly installed on the side of the outer wall of the phase change material heat dissipation unit, and the side of the outer wall of the modular high thermal conductivity substrate is connected to a convection component fixedly installed on the side of the outer wall of the switch housing.

[0010] Preferably, a convection component is fixedly installed on the side of the outer wall of the switch housing, and the convection component is used to conduct heat dissipation from the micro heat pipe; The convection assembly includes: a first micro motor, a first rotating shaft and a first blade; A convection duct is fixedly installed on the outer wall side of the switch housing, a first micro motor is fixedly installed on the inner side of the convection duct, a first rotating shaft is fixedly installed on the output port on the outer wall side of the first micro motor, a first blade is fixedly mounted on the outer wall side of the first rotating shaft, and a protective filter is fixedly mounted on the outer wall side of the convection duct.

[0011] Preferably, an active heat dissipation module is fixedly installed on the top of the inner wall of the switch housing, and the active heat dissipation module is used to actively dissipate heat and cool down at high temperatures; The active heat dissipation module includes: a second micro motor, a guide groove and an opening and closing component; A siphon hood is fixedly installed on the side of the inner wall of the switch housing, an array of S-shaped guide grooves are opened on the side of the inner wall of the siphon hood, a second micro motor is fixedly installed on the bottom of the outer wall of the siphon hood, a second rotating shaft is fixedly installed on the output port at the top of the outer wall of the second micro motor, a second blade is fixedly sleeved on the top of the outer wall of the second rotating shaft, a guide hood is fixedly installed on the top of the outer wall of the siphon hood, and an opening and closing component is fixedly installed on the top of the outer wall of the guide hood.

[0012] Preferably, the opening and closing component is used to dynamically open and close for active heat dissipation; The opening and closing assembly includes: a third micro motor, a driving ring and a guide plate; A window is fixedly installed on the top of the outer wall of the switch housing, a third micro motor is fixedly installed on the side of the inner wall of the window, a third rotating shaft is fixedly installed on the output port on the side of the outer wall of the third micro motor, a driving roller is fixedly mounted on the side of the outer wall of the third rotating shaft, a guide plate is fixedly mounted on the outer wall of the driving roller, a rotating rod is fixedly mounted on the outer wall of the driving roller, a driving ring is fixedly mounted on the outer wall of the rotating rod, and a linkage belt is mounted between the driving rings.

[0013] Preferably, a plug-in interface is fixedly installed on the front of the outer wall of the switch housing, and the plug-in interface is connected to the control processor through a signal line, and a radio frequency antenna is fixedly installed on the back of the outer wall of the switch housing, and the radio frequency antenna is connected to the control processor through a signal line.

[0014] Preferably, a plurality of ventilation holes are opened at the bottom of the outer wall of the switch housing, a lifting rod is fixedly installed at the bottom of the outer wall of the switch housing, a micro-electric hydraulic cylinder is fixedly installed at the bottom of the inner wall of the fixed base, and a lifting rod is fixedly installed at the output port at the top of the outer wall of the micro-electric hydraulic cylinder.

[0015] Preferably, the switch casing is made of metal material through a die-casting process, and a plurality of guide holes and channels are preset on the outer wall of the switch casing to assist in forming an internal stable natural convection heat dissipation structure, thereby further improving the overall heat dissipation efficiency.

[0016] Preferably, the network switch has an embedded judgment algorithm module, which predicts future temperature change trends through historical temperature data collected by a temperature sensor fixedly installed on the inner wall side of the switch casing, and adjusts the startup timing and working parameters of the active heat dissipation module in advance according to the prediction results, so as to optimize the heat dissipation effect and reduce energy consumption.

[0017] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention realizes uniform heat dissipation by installing a passive heat dissipation module, solves the problem of uneven heat dissipation caused by the traditional network switch using a single fan for heat dissipation, improves the heat dissipation effect, adapts to a variety of changing environments, and saves energy consumption; 2. The present invention realizes active heat dissipation function by installing an active heat dissipation module, improves heat dissipation efficiency, prevents rapid temperature rise from damaging network switch components, and prolongs the service life of the equipment; 3. The present invention realizes the function of preventing heat reflux by installing an array of S-shaped guide grooves, and can eliminate the noise generated by active heat dissipation, improve heat dissipation efficiency, and improve environmental protection; 4. The present invention realizes heat dissipation and protection functions by installing an opening and closing component, thereby improving the heat dissipation efficiency and working safety of the network switch. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a front view structural schematic diagram of the present invention; Figure 2 It is a front structural schematic diagram of the present invention; Figure 3 It is a schematic diagram of the structure of the opening and closing component of the present invention; Figure 4 It is a structural schematic diagram of the active heat dissipation module of the present invention; Figure 5 It is a schematic diagram of the fixed base structure of the present invention; Figure 6 It is a schematic diagram of the passive heat dissipation module structure of the present invention; Figure 7 It is a schematic diagram of the structure of the convection air duct of the present invention; Figure 8 It is a schematic diagram of the siphon hood structure of the present invention.

[0019] In the figure: 1. fixed base; 2. switch housing; 3. RF antenna; 4. plug-in interface; 5. window; 6. convection duct; 7. heat dissipation duct; 8. linkage belt; 9. control processor; 10. third micro motor; 11. third rotating shaft; 12. drive roller; 13. guide plate; 14. rotating rod; 15. drive ring; 16. guide cover; 17. siphon cover; 18. guide groove; 19. second micro motor; 20. second rotating shaft; 21. second blade; 22. modular high thermal conductivity substrate; 23. ventilation channel; 24. micro electro-hydraulic cylinder; 25. lifting rod; 26. phase change material heat dissipation unit; 27. micro heat pipe; 28. high thermal conductivity metal interface; 29. ​​first micro motor; 30. first rotating shaft; 31. first blade; 32. protective filter. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0022] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] See also Figure 1 , Figure 2 , Figure 4 and Figure 6 , an embodiment provided by the present invention: a low-power network switch with an efficient heat dissipation structure, comprising a switch housing 2, a control processor 9 and a passive heat dissipation module, wherein the control processor 9 is fixedly mounted on the bottom of the inner wall of the switch housing 2, the passive heat dissipation module is fixedly mounted on the side of the inner wall of the switch housing 2, and the top of the outer wall of the control processor 9 contacts the passive heat dissipation module through a high thermal conductivity metal interface 28 to conduct heat; The passive heat dissipation module comprises: a modular high thermal conductivity substrate 22, a phase change material heat dissipation unit 26 and a micro heat pipe 27; A modular high thermal conductivity substrate 22 is fixedly installed on the inner wall side of the switch housing 2, a micro heat pipe 27 is fixedly installed on the bottom of the inner wall of the modular high thermal conductivity substrate 22, a phase change material heat dissipation unit 26 is fixedly connected to the top of the outer wall of the micro heat pipe 27, and the micro heat pipe 27 and the phase change material heat dissipation unit 26 are both installed in the steam chamber formed inside the modular high thermal conductivity substrate 22, and the passive heat dissipation module cooperates with the active heat dissipation module installed in the switch housing 2 to perform efficient heat dissipation; The micro heat pipe 27 is filled with a working fluid, and conducts local high heat to the edge of the modular high thermal conductivity substrate 22 through the phase change heat principle. The phase change material heat dissipation unit 26 is supported by microcapsule or thin film packaging technology and is distributed in an array and covers the heat source area. The surface of the high thermal conductivity metal interface 28 is coated with a graphene enhanced coating to reduce thermal resistance. The heat dissipation pipe 7 is fixedly installed on the outer wall side of the phase change material heat dissipation unit 26, and the outer wall side of the modular high thermal conductivity substrate 22 is connected to the convection component fixedly installed on the outer wall side of the switch housing 2; Furthermore, when the network switch is working, the control processor 9 will generate local heat. The high thermal conductivity metal interface 28 will guide the heat generated by the control processor 9 into the micro heat pipe 27. The micro heat pipe 27 will conduct the heat to the phase change material heat dissipation unit 26 in the modular high thermal conductivity matrix 22 through the phase change heat principle of the internal filling medium. At this time, the phase change material inside the phase change material heat dissipation unit 26 changes from solid to liquid when it reaches a certain temperature after receiving heat, absorbs a large amount of thermal energy, and returns to solid after the temperature drops, releasing the stored heat, reducing temperature fluctuations, and ensuring that the heat is transferred to the next external heat dissipation level through the heat dissipation pipe 7 during absorption and release, absorbing and storing the local heat generated by the control processor 9, reducing the local high temperature generated by the control processor 9 during operation, causing the control processor 9 to delay in operation, preventing high temperature from damaging the control processor 9, protecting the control processor 9, improving the operating efficiency and safety of the control processor 9, effectively assisting heat dissipation, improving heat dissipation efficiency, and saving energy consumption.

[0024] See also Figure 2 , Figure 4 , Figure 6 and Figure 7 , an embodiment provided by the present invention: a low-power network switch with an efficient heat dissipation structure, wherein a heat dissipation pipe 7 is fixedly installed on the outer wall side of the phase change material heat dissipation unit 26, and the outer wall side of the modular high thermal conductivity substrate 22 is connected to a convection component fixedly installed on the outer wall side of the switch housing 2; A convection component is fixedly installed on the side of the outer wall of the switch housing 2, and the convection component is used to conduct heat dissipation from the micro heat pipe 27; The convection assembly includes: a first micro motor 29, a first rotating shaft 30 and a first blade 31; A convection fan 6 is fixedly mounted on the outer wall side of the switch housing 2, a first micro motor 29 is fixedly mounted on the inner side of the convection fan 6, a first rotating shaft 30 is fixedly mounted on the output port of the outer wall side of the first micro motor 29, a first blade 31 is fixedly mounted on the outer wall side of the first rotating shaft 30, and a protective filter 32 is fixedly mounted on the outer wall side of the convection fan 6; Furthermore, the phase change material heat dissipation unit 26 temporarily absorbs and stores heat, and releases the heat after the temperature drops, and exports it to the next heat dissipation level through the heat dissipation pipe 7, thereby realizing the conduction and discharge of heat; at the same time, the convection component starts to export and dissipate the heat escaped during the heat conduction of the micro heat pipe 27, and the first micro motor 29 is started, and the first micro motor 29 drives the first rotating shaft 30 to rotate, and the first rotating shaft 30 drives the first blade 31 to rotate. The first blade 31 rotates to blow out or suck out the hot air inside the modular high thermal conductivity matrix 22 through the convection fan 6, thereby reducing the temperature in the steam chamber inside the modular high thermal conductivity matrix 22. The protective filter 32 is used to protect and filter dust, thereby preventing external dust and impurities from entering the switch housing 2 and the modular high thermal conductivity matrix 22 when the convection component is in standby mode, causing static electricity to affect the operation of the control processor 9, thereby improving the working efficiency of the network switch.

[0025] See also Figure 2 , Figure 3 and Figure 8 , an embodiment provided by the present invention: a low-power network switch with an efficient heat dissipation structure, wherein an active heat dissipation module is fixedly installed on the top of the inner wall of the switch housing 2, and the active heat dissipation module is used for active heat dissipation and cooling at high temperatures; The active heat dissipation module includes: a second micro motor 19, a guide groove 18 and an opening and closing component; A siphon cover 17 is fixedly mounted on the inner wall side of the switch housing 2, an array of S-shaped flow guide grooves 18 are opened on the inner wall side of the siphon cover 17, a second micro motor 19 is fixedly mounted on the bottom of the outer wall of the siphon cover 17, a second rotating shaft 20 is fixedly mounted on the output port of the top outer wall of the second micro motor 19, a second blade 21 is fixedly sleeved on the top outer wall of the second rotating shaft 20, a flow guide cover 16 is fixedly mounted on the top outer wall of the siphon cover 17, and an opening and closing component is fixedly mounted on the top outer wall of the flow guide cover 16; The opening and closing component is used to dynamically open and close for active heat dissipation; The opening and closing assembly includes: a third micro motor 10, a driving ring 15 and a guide plate 13; A window 5 is fixedly installed on the top of the outer wall of the switch housing 2, a third micro motor 10 is fixedly installed on the side of the inner wall of the window 5, a third rotating shaft 11 is fixedly installed on the output port of the outer wall side of the third micro motor 10, a driving roller 12 is fixedly mounted on the side of the outer wall of the third rotating shaft 11, a guide plate 13 is fixedly mounted on the outer wall of the driving roller 12, a rotating rod 14 is fixedly mounted on the outer wall of the driving roller 12, a driving ring 15 is fixedly mounted on the outer wall of the rotating rod 14, and a linkage belt 8 is mounted between the driving rings 15; Further, when the operating temperature of the control processor 9 in the switch housing 2 exceeds the set threshold, the system automatically starts the active heat dissipation module and the opening and closing component to actively dissipate heat and cool the network switch, and cooperates with the passive heat dissipation module to perform efficient heat dissipation and cooling. At this time, the third micromotor 10 is started, the third micromotor 10 drives the third rotating shaft 11 to rotate, the third rotating shaft 11 drives the driving roller 12 to rotate, the driving roller 12 drives the rotating rod 14 to rotate, the rotating rod 14 drives the driving ring 15 to rotate, and the driving rings 15 drive each other to rotate through the linkage belt 8. At the same time, the rotating rod 14 drives the remaining passive driving rollers 12 to rotate, and the driving roller 12 drives the guide plate 13 to rotate. The rotation directions and angles of several guide plates 13 are consistent, and the guide plates 13 rotate from a connected sealed state to an interval open state, and channels are formed between the guide plates 13; the second micromotor 19 is started, the second micromotor 19 drives the second rotating shaft 20 to rotate, the second rotating shaft 20 drives the second blade 21 to rotate, and the second blade 21 rotates. The siphon hood 17 forms an upward negative pressure lift, and the heat in the switch housing 2 is introduced into the window 5 through the siphon hood 17 and the guide hood 16. The array S-shaped guide grooves 18 opened on the inner wall side of the siphon hood 17 can make the hot air flow in the switch housing 2 rise and discharge in an orderly manner, avoiding the heat reflux effect caused by air flow turbulence. At the same time, the S-shaped guide grooves 18 can form a muffler to eliminate the noise generated by the operation of the second micro motor 19 and the second blade 21, and play a mute role; the heat is discharged out of the switch housing 2 through the interval between the guide plates 13, the temperature in the switch housing 2 is reduced, and the operating temperature of the control processor 9 is reduced, which plays an active heat dissipation and cooling role; and when the opening and closing components are closed, the guide plates 13 are changed from open rotation to closed, and the connected and closed guide plates 13 can form a heat preservation and dustproof effect, so that in a low temperature environment, the control processor 9 in the switch housing 2 is protected from the influence of the external low temperature, thereby improving the operating efficiency and playing a protective and dustproof role.

[0026] See also Figure 1 and Figure 5 , an embodiment provided by the present invention: a low-power network switch with an efficient heat dissipation structure, wherein a plug-in interface 4 is fixedly installed on the front of the outer wall of the switch housing 2, and the plug-in interface 4 is connected to the control processor 9 through a signal line, and a radio frequency antenna 3 is fixedly installed on the back of the outer wall of the switch housing 2, and the radio frequency antenna 3 is connected to the control processor 9 through a signal line; The bottom of the outer wall of the switch housing 2 is provided with a plurality of ventilation channels 23, a lifting rod 25 is fixedly installed at the bottom of the outer wall of the switch housing 2, a micro-electric hydraulic cylinder 24 is fixedly installed at the bottom of the inner wall of the fixed base 1, and a lifting rod 25 is fixedly installed at the output port at the top of the outer wall of the micro-electric hydraulic cylinder 24; An active heat dissipation module is fixedly installed on the top of the inner wall of the switch housing 2, and the active heat dissipation module is used to actively dissipate heat and cool down at high temperatures; The active heat dissipation module includes: a second micro motor 19, a guide groove 18 and an opening and closing component; A siphon cover 17 is fixedly mounted on the inner wall side of the switch housing 2, an array of S-shaped flow guide grooves 18 are opened on the inner wall side of the siphon cover 17, a second micro motor 19 is fixedly mounted on the bottom of the outer wall of the siphon cover 17, a second rotating shaft 20 is fixedly mounted on the output port of the top outer wall of the second micro motor 19, a second blade 21 is fixedly sleeved on the top outer wall of the second rotating shaft 20, a flow guide cover 16 is fixedly mounted on the top outer wall of the siphon cover 17, and an opening and closing component is fixedly mounted on the top outer wall of the flow guide cover 16; Further, the plug-in interface 4 is used to plug in the network connector, the radio frequency antenna 3 is used to receive and send wireless radio frequency, and the control processor 9 is used to process network programs. When active heat dissipation is required, the micro-electro-hydraulic cylinder 24 is started, and the micro-electro-hydraulic cylinder 24 lifts the switch housing 2 through the lifting rod 25. At this time, the second micro-motor 19 is started, and the second micro-motor 19 drives the second rotating shaft 20 to rotate, and the second rotating shaft 20 drives the second blade 21 to rotate. The rotation of the second blade 21 forms an upward negative pressure lift in the siphon cover 17, and the vent 23 at the bottom of the switch housing 2 and the interval between the guide plate 13 form a convection channel, which accelerates the air flow in the switch housing 2, and introduces the heat in the switch housing 2 into the window 5 through the siphon cover 17 and the guide cover 16, and discharges it outside the switch housing 2 through the interval between the guide plates 13, thereby reducing the temperature in the switch housing 2 and reducing the operating temperature of the control processor 9; When there is no need to actively cool down the switch casing 2, the micro electro-hydraulic cylinder 24 is started, and the switch casing 2 is lowered to be close to the surface of the fixed base 1 through the lifting rod 25. At this time, the opening and closing components are closed to form a relatively sealed and heat-insulating space in the switch casing 2, ensuring that the network switch can maintain its internal temperature in a low-temperature environment, free from the influence of low temperature, increase the operating temperature of the control processor 9, and improve work efficiency.

[0027] See also Figure 1 and Figure 2 , an embodiment provided by the present invention: a low-power network switch with an efficient heat dissipation structure, wherein the switch housing 2 is made of metal material through a die-casting process, and a plurality of guide holes and channels are preset on the outer wall of the switch housing 2 to assist in forming an internal stable natural convection heat dissipation structure, thereby further improving the overall heat dissipation efficiency; The network switch has an embedded judgment algorithm module, which predicts the future temperature change trend through the historical temperature data collected by the temperature sensor fixedly installed on the inner wall side of the switch housing 2, and adjusts the start-up timing and working parameters of the active heat dissipation module in advance according to the prediction results, so as to optimize the heat dissipation effect and reduce energy consumption; Furthermore, the switch housing 2 is made of metal material through a die-casting process. A plurality of precisely designed guide holes and channels are preset on the outer wall of the switch housing 2. These channels are optimized and designed according to computational fluid dynamics simulation, and can form a stable airflow path inside the network switch. When the network switch is in operation, the control processor 9 generates heat, causing the local temperature inside the switch housing 2 to rise. Due to the design of the guide holes and channels of the switch housing 2, hot air forms an ascending airflow inside the switch housing 2. At the same time, relatively low-temperature air from the outside enters the device from the air inlet, and takes away the heat by the principle of natural convection, lowering the internal temperature, achieving a passive heat dissipation effect, effectively assisting heat dissipation, improving heat dissipation efficiency, and saving energy consumption. A plurality of temperature sensors are fixedly installed on the inner wall side of the switch housing 2. These temperature sensors monitor the local temperature inside the switch housing 2 in real time and transmit the collected temperature data to the embedded control unit inside the network switch. The embedded judgment algorithm module uses the collected historical temperature data, combined with the pre-set temperature threshold and change trend model, to predict the temperature change trend in the short future time. For example, when the algorithm detects that the temperature in a key area is rising at a faster rate, it predicts that the temperature may exceed the safe working threshold in the next few seconds. Then the algorithm outputs a warning signal. Based on the prediction result, the embedded control unit starts or accelerates the local active heat dissipation module in advance to achieve dynamic matching of active and passive heat dissipation, ensuring that the temperature fluctuation is maintained within a reasonable range.

[0028] Working principle: The real-time temperature data in the switch housing 2 is monitored by the temperature sensor in real time, and the monitored data is transmitted to the embedded control unit in the judgment algorithm module for analysis to determine whether the temperature exceeds the standard operating temperature threshold; When the temperature does not exceed the upper limit of the set threshold, the network switch can absorb and release the local heat generated by the control processor 9 by relying only on the passive heat dissipation module, thereby reducing the temperature inside the switch housing 2 and saving energy consumption; When the temperature exceeds the upper limit of the standard threshold, the network switch starts the passive cooling module, the active cooling module and the opening and closing component, and opens the convection channel in the switch casing 2 through the opening and closing component to discharge the hot air in the switch casing 2, taking away the local high heat generated by the control processor 9, while also reducing noise and achieving efficient heat dissipation of the network switch.

[0029] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and range of equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A low-power network switch with an efficient heat dissipation structure, comprising a switch housing (2), a control processor (9) and a passive heat dissipation module, characterized in that: A control processor (9) is fixedly mounted on the bottom of the inner wall of the switch housing (2), a passive heat dissipation module is fixedly mounted on the side of the inner wall of the switch housing (2), and the top of the outer wall of the control processor (9) contacts the passive heat dissipation module through a high thermal conductivity metal interface (28) to transfer heat; The passive heat dissipation module comprises: a modular high thermal conductivity substrate (22), a phase change material heat dissipation unit (26) and a micro heat pipe (27); A modular high thermal conductivity matrix (22) is fixedly mounted on the side of the inner wall of the switch housing (2); a micro heat pipe (27) is fixedly mounted on the bottom of the inner wall of the modular high thermal conductivity matrix (22); a phase change material heat dissipation unit (26) is fixedly connected to the top of the outer wall of the micro heat pipe (27); and both the micro heat pipe (27) and the phase change material heat dissipation unit (26) are mounted in a steam chamber formed inside the modular high thermal conductivity matrix (22); the passive heat dissipation module cooperates with the active heat dissipation module mounted in the switch housing (2) to efficiently dissipate heat.

2. A low-power network switch with an efficient heat dissipation structure according to claim 1, characterized in that: The micro heat pipe (27) is filled with a working fluid, and conducts local high heat to the edge of the modular high thermal conductivity substrate (22) through the phase change heat principle. The phase change material heat dissipation unit (26) is supported by microcapsule or thin film packaging technology and is distributed in an array and covers the heat source area. The surface of the high thermal conductivity metal interface (28) is coated with a graphene enhanced coating to reduce thermal resistance.

3. The low-power network switch with an efficient heat dissipation structure according to claim 1, characterized in that: A heat dissipation pipe (7) is fixedly mounted on the outer wall side of the phase change material heat dissipation unit (26), and the outer wall side of the modular high thermal conductivity matrix (22) is connected to a convection component fixedly mounted on the outer wall side of the switch housing (2).

4. The low-power network switch with an efficient heat dissipation structure according to claim 1, characterized in that: A convection component is fixedly mounted on the side of the outer wall of the switch housing (2), and the convection component is used to conduct heat dissipation from the micro heat pipe (27); The convection component comprises: a first micro motor (29), a first rotating shaft (30) and a first blade (31); A convection fan (6) is fixedly mounted on the side of the outer wall of the switch housing (2); a first micro motor (29) is fixedly mounted on the inner side of the convection fan (6); a first rotating shaft (30) is fixedly mounted on the output port of the outer wall of the first micro motor (29); a first blade (31) is fixedly mounted on the side of the outer wall of the first rotating shaft (30); and a protective filter (32) is fixedly mounted on the side of the outer wall of the convection fan (6).

5. The low-power network switch with an efficient heat dissipation structure according to claim 1, characterized in that: An active heat dissipation module is fixedly mounted on the top of the inner wall of the switch housing (2), and the active heat dissipation module is used to actively dissipate heat and cool down at high temperatures; The active heat dissipation module comprises: a second micro motor (19), a guide groove (18) and an opening and closing component; A siphon hood (17) is fixedly mounted on the inner wall side of the switch housing (2); an array of S-shaped flow guide grooves (18) are provided on the inner wall side of the siphon hood (17); a second micro motor (19) is fixedly mounted on the bottom of the outer wall of the siphon hood (17); a second rotating shaft (20) is fixedly mounted on the output port at the top of the outer wall of the second micro motor (19); a second blade (21) is fixedly sleeved on the top of the outer wall of the second rotating shaft (20); a flow guide hood (16) is fixedly mounted on the top of the outer wall of the siphon hood (17); and an opening and closing component is fixedly mounted on the top of the outer wall of the flow guide hood (16).

6. The low-power network switch with a high-efficiency heat dissipation structure according to claim 5, characterized in that: The opening and closing component is used to dynamically open and close for active heat dissipation; The opening and closing assembly comprises: a third micro motor (10), a drive ring (15) and a guide plate (13); A window (5) is fixedly mounted on the top of the outer wall of the switch housing (2); a third micro motor (10) is fixedly mounted on the side of the inner wall of the window (5); a third rotating shaft (11) is fixedly mounted on the output port on the side of the outer wall of the third micro motor (10); a driving roller (12) is fixedly mounted on the side of the outer wall of the third rotating shaft (11); a guide plate (13) is fixedly mounted on the outer wall of the driving roller (12); a rotating rod (14) is fixedly mounted on the outer wall of the driving roller (12); a driving ring (15) is fixedly mounted on the outer wall of the rotating rod (14); and a linkage belt (8) is mounted between the driving rings (15).

7. The low-power network switch with an efficient heat dissipation structure according to claim 1, characterized in that: A plug-in interface (4) is fixedly mounted on the front side of the outer wall of the switch housing (2), and the plug-in interface (4) is connected to the control processor (9) via a signal line; a radio frequency antenna (3) is fixedly mounted on the back side of the outer wall of the switch housing (2), and the radio frequency antenna (3) is connected to the control processor (9) via a signal line.

8. The low-power network switch with a high-efficiency heat dissipation structure according to claim 1, characterized in that: The bottom of the outer wall of the switch housing (2) is provided with a plurality of ventilation channels (23); a lifting rod (25) is fixedly mounted on the bottom of the outer wall of the switch housing (2); a micro-electric hydraulic cylinder (24) is fixedly mounted on the bottom of the inner wall of the fixed base (1); and a lifting rod (25) is fixedly mounted on the output port at the top of the outer wall of the micro-electric hydraulic cylinder (24).

9. The low-power network switch with a high-efficiency heat dissipation structure according to claim 1, characterized in that: The switch housing (2) is manufactured using a metal material through a die-casting process, and a plurality of air guide holes and channels are preset on the outer wall of the switch housing (2) to assist in forming an internal stable natural convection heat dissipation structure, thereby further improving the overall heat dissipation efficiency.

10. The low-power network switch with a high-efficiency heat dissipation structure according to claim 1, characterized in that: The network switch has an embedded judgment algorithm module, which predicts future temperature change trends through historical temperature data collected by a temperature sensor fixedly installed on the inner wall side of the switch housing (2), and adjusts the start-up timing and working parameters of the active heat dissipation module in advance according to the prediction results, thereby optimizing the heat dissipation effect and reducing energy consumption.

Images