Isolated ground via hole positioning method for optimizing signal via hole crosstalk

Abstract

The invention relates to an isolated ground via hole positioning method for optimizing signal via hole crosstalk. The method comprises the following steps: step 1, establishing a preliminary model; step 2, adding a group of isolation ground via holes with a moving attribute, wherein the two isolation ground via holes can move relatively; step 3, parameterization setting; defining moving directions and displacements of the first isolation ground via hole and the second isolation ground via hole, and setting the displacements as variables; step 4, scanning variables and simulation results; and step 5, determining the position of the isolation ground via hole according to a simulation result. The method comprises the following steps: firstly, building a preliminary model containing differential signal via holes, adding a pair of isolated ground via holes with relative movement characteristics, and symmetrically placing the isolated ground via holes in a gap between two pairs of differential signal via holes; by means of 3D simulation software, displacement variables are established and scanned, and the position is flexibly and accurately adjusted. Therefore, the optimal solution is quickly screened out, the position of the isolated ground via hole with the minimum signal crosstalk under the specific frequency is accurately positioned, the time is greatly saved, and the design efficiency of the circuit board is improved.

Description

Technical Field

[0001] The present invention relates to the field of circuit design, and in particular to an isolation ground via positioning method for optimizing signal via crosstalk. Background Art

[0002] In the field of circuit board design, a pair of differential signal vias is two paired vias used to transmit differential signals. Both vias run from the top layer of the PCB to the bottom layer or a certain inner layer, and the two vias are located in an anti-pad area. The function of the anti-pad is to reduce unnecessary capacitive coupling between the via and the adjacent plane layer. On the top layer, the two traces of the differential signal are connected to the corresponding via pads respectively, so that the signal can reach the bottom layer or inner layer through the via, and finally lead out from the lower layer; whether on the top layer or the lower layer, the two differential signal lines maintain a fixed spacing throughout the entire process.

[0003] There is inevitably superposition and interference of electromagnetic radiation fields between the two pairs of differential signal vias, resulting in obvious signal crosstalk. The general practice is to add isolation ground vias in the gap between the two pairs of differential signal vias, so as to guide the electromagnetic interference current into the ground plane with the help of the low-impedance channel constructed by the ground vias, thereby reducing the signal crosstalk between the two pairs of differential signal vias.

[0004] However, in the actual PCB design process, it is quite difficult to determine the best location for the isolation ground vias. Most engineers can only try to layout based on vague experience. They often need to repeatedly adjust the location of the isolation ground vias in the design software and perform electromagnetic simulation processes multiple times, which consumes a lot of time and energy and may not even achieve the desired effect in the end.

[0005] Therefore, the industry is in urgent need of finding a solution for quickly obtaining the placement position and setting structure of the isolated ground vias, so as to achieve the best effect in suppressing the signal crosstalk between the two pairs of differential signal vias. Summary of the invention

[0006] In order to overcome the problem in existing solutions for signal crosstalk between differential signal vias that determining the position of the isolation ground via relies on trial and error, which is time-consuming and difficult to obtain ideal results, the present invention provides an isolation ground via positioning method for optimizing signal via crosstalk.

[0007] The technical solution of the present invention is as follows:

[0008] A method for locating an isolation ground via hole for optimizing signal via hole crosstalk comprises the following steps:

[0009] Step 1: Establish a preliminary model;

[0010] Inserting the first pair of differential signal vias and the second pair of differential signal vias, and aligning the two pairs of differential signal vias;

[0011] Step 2, adding a set of relatively movable isolation ground vias;

[0012] In the gap area between the two pairs of differential signal vias, add a set of isolation ground vias and set the two isolation ground vias to have the property of relative movement;

[0013] Step 3: Parameterization setting;

[0014] Defining the moving direction and displacement of the first isolation ground via and the second isolation ground via, and setting the displacement as a variable;

[0015] Step 4, scan variables and simulate results;

[0016] Iterate the variable value within the set range and simulate to obtain multiple sets of crosstalk results;

[0017] Step 5: Determine the location of the isolation ground via according to the simulation results.

[0018] As a preferred technical solution of the present invention, the step 1 comprises the following steps:

[0019] Step 101, open the simulation software and create a blank initial PCB model;

[0020] Step 102, retrieve a pair of differential signal vias from the component library, and draw them in the initial setting area of ​​the initial PCB model;

[0021] Step 103, retrieve another pair of differential signal vias from the component library, place them on one side of the first pair of differential signal vias, and align them with the first pair of differential signal vias;

[0022] Step 104: Fill in various parameters of the differential signal via.

[0023] Furthermore, the differential signal via structure includes two pairs of signal vias, two pairs of return ground vias and an anti-pad area.

[0024] Furthermore, the parameters in step 104 include via aperture, routing path and line width, fan-out routing layer position, and anti-pad area size.

[0025] As a preferred technical solution of the present invention, the step 2 specifically includes the following steps:

[0026] Step 201, inserting a first isolation ground via hole at the left side of the center of the gap area between the two pairs of differential signal via holes;

[0027] Step 202, select the first isolation ground via, and use the mirror copy function in the software copy function to copy the second isolation ground via with the gap center point O as the center;

[0028] Step 203: Select the first isolation ground via and the second isolation ground via and set them as movable objects.

[0029] As a preferred technical solution of the present invention, the step 3 specifically includes the following steps:

[0030] Step 301, establishing a coordinate system;

[0031] The center of one of the first pair of differential signal vias is taken as the origin, the direction from the origin to the center of the other signal via in the same pair is taken as the Y axis, and the direction from the origin to the second pair of differential signal vias is taken as the X axis;

[0032] Step 302, defining the moving direction;

[0033] The moving direction of the first isolation ground via hole is defined as the positive direction of the Y axis, and the moving direction of the second isolation ground via hole is defined as the negative direction of the Y axis;

[0034] Step 303: setting displacement parameters;

[0035] The displacements of the first isolation ground via hole and the second isolation ground via hole are set to be equal and expressed by a displacement parameter S, where the displacement parameter of the first isolation ground via hole is S and the displacement parameter of the second isolation ground via hole is -S;

[0036] Step 304, setting parameter variable range;

[0037] Set the variation range and step value of the displacement parameter S.

[0038] Furthermore, the displacement parameter S varies in a range of 0 to 35 mil, and the step value of the displacement parameter S is 5 mil, 3 mil or 1 mil.

[0039] Furthermore, the step 4 specifically includes the following steps:

[0040] Step 401, start the scanning process;

[0041] According to the displacement parameter S set in step 3, starting from the initial value, the step value is gradually increased. Each time the displacement parameter S is adjusted, the first isolation ground via is moved toward the positive direction of the Y axis by a distance S, and the second isolation ground via is moved toward the negative direction of the Y axis by a distance S;

[0042] Step 402, calculating the via-to-via crosstalk result;

[0043] After each displacement change of the two isolation ground vias, the software automatically calculates the crosstalk results between the two pairs of differential signal vias;

[0044] Step 403, drawing and displaying a crosstalk curve comparison diagram;

[0045] Each time the crosstalk calculation under the displacement parameters is completed, the result is automatically recorded, and the crosstalk curves of all the results are automatically exported in the same chart to obtain a comparison chart of multiple groups of crosstalk curves.

[0046] As a preferred technical solution of the present invention, the specific steps of step 5 are:

[0047] An optimal result is screened out from multiple groups of crosstalk results, and an isolation ground via displacement corresponding to the optimal result is obtained, thereby determining an optimal isolation ground via position.

[0048] The present invention according to the above scheme has the following beneficial effects:

[0049] The present invention builds a preliminary model including differential signal vias, and then adds a pair of isolation ground vias with relative movement characteristics. The two isolation ground vias are symmetrically distributed and arranged in the gap area between the two pairs of differential signal vias, and move toward each other in a mirror-symmetrical path. 3D simulation software is used to establish displacement variables and scan variables, accurately and flexibly adjust the positions of the two isolation ground vias, quickly screen out the optimal solution from a large number of results, and accurately locate the positions of a pair of isolation ground vias that can minimize the signal crosstalk of the two pairs of differential signal vias at a specific frequency of interest, greatly reducing the time required to determine the positions of the isolation ground vias, and significantly improving the work efficiency of the entire circuit board design link in this regard. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 is a flow chart of the method of the present invention;

[0051] Figure 2 It is a structural schematic diagram of the present invention;

[0052] Figure 3 A schematic diagram of the movement of two isolated vias in the simulation process in the present invention;

[0053] Figure 4 It is a comparison chart of multiple groups of crosstalk curves;

[0054] Figure 5 for Figure 4 An enlarged schematic diagram of the dotted box part.

[0055] In the figure,

[0056] 100. a first pair of differential signal vias;

[0057] 200, a second pair of differential signal vias;

[0058] 1. Signal vias; 2. Reflow ground vias; 3. Anti-pad area;

[0059] 4. Isolation ground vias. DETAILED DESCRIPTION

[0060] In order to better understand the purpose, technical scheme and technical effect of the present invention, the present invention is further explained in conjunction with the accompanying drawings and embodiments. It should be noted that similar numbers and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. At the same time, it is stated that the embodiments described below are only used to explain the present invention and are not used to limit the present invention.

[0061] It should be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it may be directly on the other element or there may also be a central element, and when an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time.

[0062] The indicated orientation or position relationship is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the application product is usually placed when in use, or the orientation or position relationship commonly understood by those skilled in the art, or the orientation or position relationship in which the application product is usually placed when in use. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present application. The terms "first" and "second" are only used for the convenience of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features.

[0063] like Figures 1 to 3 As shown, a method for locating an isolation ground via hole for optimizing signal via hole crosstalk comprises the following steps:

[0064] Step 1: Establish a preliminary model;

[0065] Inserting the first pair of differential signal vias 100 and the second pair of differential signal vias 200, and aligning the two pairs of differential signal vias;

[0066] Step 1 specifically includes the following steps:

[0067] Step 101. Open the 3D circuit design simulation software and create a blank PCB project file as the initial PCB model. Specifically, select the "New Project" command, and a project creation window will pop up. In this window, enter a custom project name, specify the storage path of the project, and select a basic template suitable for PCB design from the preset template list. After completing the above operations, click the "OK" button to successfully create a blank PCB project file, preparing the basic framework for the subsequent circuit model construction.

[0068] Step 102, retrieve a pair of differential signal vias from the component library and draw them on the initial PCB model; specifically, enter the rich component library built into the software, retrieve the differential signal vias and place them in the pre-planned initial setting area.

[0069] Step 103, retrieve another pair of differential signal vias from the component library, place them on the side of the first pair of differential signal vias 100, enable the alignment auxiliary function of the software, and align the left signal vias and the right signal vias of the two pairs of differential signal vias, that is, align the left signal vias of the first pair of differential signal vias 100 with the left signal vias of the second pair of differential signal vias 200, and align the right signal vias of the first pair of differential signal vias 100 with the right signal vias of the second pair of differential signal vias 200;

[0070] Step 104, fill in various parameters of the differential signal vias, including via aperture, routing path and line width, fan-out routing layer position, and the size of the anti-pad area 3; specifically, select the first pair of differential signal vias 100, right-click to call out the property editing window, set the via aperture, routing path and line width, fan-out routing layer position, and the size of the anti-pad area 3; after completing the parameter setting of the first pair of differential signal vias 100, fill in various parameters for the second pair of differential signal vias 200 using the same process and standards.

[0071] In this embodiment, the differential signal vias include two pairs of signal vias 1, two pairs of return ground vias 2, that is, a signal via pair and a return ground via pair, and also include an anti-pad area 3. Each signal via 1 runs from the top board to the bottom board or the inner board, and is connected to a surface signal trace on the top board, and is connected to a fan-out signal trace on the bottom board or the inner board. The two return ground vias 2 are respectively arranged on both sides of the signal via pair, and the signal via pair is located in the anti-pad area 3, and the return ground via pair is located outside the anti-pad area 3.

[0072] Step 2, adding a set of relatively movable isolation ground vias;

[0073] In the gap area between the two pairs of differential signal vias, a group of isolation ground vias 4 is added, and the two isolation ground vias 4 are set to have a property of relative movement.

[0074] Step 2 specifically includes the following steps:

[0075] Step 201, inserting a first isolation ground via on the left side of the center of the gap area between the two pairs of differential signal vias; specifically, selecting a suitable point on the left side of the center of the gap area, retrieving an isolation ground via 4 with a suitable aperture and pad size from the component library of the software as the first isolation ground via, and accurately inserting it into the selected point;

[0076] Step 202, select the first isolation ground via, use the mirror copy function in the software copy function, take the gap center point O as the center, and copy to obtain the second isolation ground via; specifically, select the first isolation ground via that has just been inserted, enter the edit menu of the software, find the mirror copy option in the copy function, capture the center point O of the gap area of ​​the two pairs of differential signal vias, set it as the center point of the symmetry axis of the mirror copy, generate a second isolation ground via that is symmetrical with the first isolation ground via about the center point O, and the two isolation ground vias 4 are distributed in the gap area in a relatively regular and symmetrical manner;

[0077] Step 203, select the first isolation ground via and the second isolation ground via, and set them as movable objects; specifically, select the first isolation ground via and the second isolation ground via at the same time, call out the object property setting panel of the software, find the setting option related to the object mobility, check and activate it, so that the two isolation ground vias 4 have the property of free movement.

[0078] Step 3: Model parameterization setting;

[0079] The moving directions and displacements of the first isolation ground via and the second isolation ground via are defined, and the displacements are set as variables.

[0080] Step 3 specifically includes the following steps:

[0081] Step 301, establishing a coordinate system;

[0082] Take the center of one of the signal vias 1 of the first pair of differential signal vias 100 as the origin, the direction from the origin to the center of the other signal via 1 in the same pair of differential signal vias as the Y axis, and the direction from the origin to the second pair of differential signal vias 200 as the X axis; specifically, select one of the signal vias 1 of the first pair of differential signal vias 100, lock the geometric center of the via, and set it as the origin of the coordinate system; along the direction of the line connecting the two vias in the same pair of differential signal vias, determine the vector direction from the origin to the center of the other signal via 1, and define this direction as the positive direction of the Y axis; starting from the origin, toward the location of the second pair of differential signal vias 200, establish the X axis direction perpendicular to the Y axis direction; and construct a two-dimensional rectangular coordinate system that fits the layout of the two pairs of differential signal vias.

[0083] Step 302, defining the moving direction;

[0084] The moving direction of the first isolation ground via is defined as the positive direction of the Y axis, and the moving direction of the second isolation ground via is defined as the negative direction of the Y axis. The symmetrical moving direction setting helps to systematically explore the suppression effect of a group of isolation ground vias on the electromagnetic interference between two pairs of differential signal vias under different spacing layouts.

[0085] Step 303: setting displacement parameters;

[0086] The displacements of the first isolation ground via and the second isolation ground via are set to be equal and are represented by a displacement parameter S. The displacement parameter of the first isolation ground via is S, that is, the first isolation ground via is displaced in the positive direction of the Y axis according to the S value; the displacement parameter of the second isolation ground via is -S, that is, the second isolation ground via is displaced in the negative direction of the Y axis, ensuring that the two isolation ground vias always maintain a relatively symmetrical positional relationship. In this way, when adjusting the position of the isolation ground vias later, you only need to pay attention to one variable to clearly grasp the relative position changes of the two.

[0087] Step 304, setting the initial position of the isolation ground via;

[0088] In this embodiment, the initial positions of the first isolation ground via and the second isolation ground via are set between the return ground vias 2 on the corresponding sides of the two pairs of differential signal vias. Specifically, the initial position of the first isolation ground via is between the two return ground vias 2 on the left sides of the two pairs of differential signal vias, and the initial position of the second isolation ground via is between the two return ground vias 2 on the right sides of the two pairs of differential signal vias.

[0089] Step 305, setting parameter variable range;

[0090] The variation range and step value of the displacement parameter S are set. Specifically, the variation range of the displacement parameter S is set to be 0 to 35 mil, and the step value of the displacement parameter is set to be 5 mil, 3 mil or 1 mil.

[0091] Step 4, scan variables and simulate results;

[0092] The software iterates the variable value within the set range and simulates multiple sets of crosstalk results. Before starting the variable scan, the software automatically initializes the environment of the model with the current set parameters, and integrates a virtual circuit operation scenario that fits the actual situation based on the preset PCB material characteristic parameters, the preset values ​​of the surrounding electromagnetic environment, and the electrical rules set in the early stage.

[0093] Step 4 specifically includes the following steps:

[0094] Step 401, start the scanning process;

[0095] Activate the variable scanning program built into the software. According to the displacement parameter S set in step 3, the scanning starts from the initial value of the displacement parameter and increases gradually according to the preset step value. Whenever the value of the displacement parameter S changes, the first isolation ground via moves a distance S from its initial position toward the positive direction of the Y axis, and the second isolation ground via moves a distance S from its initial position toward the negative direction of the Y axis.

[0096] Step 402, calculating the via-to-via crosstalk result;

[0097] After each displacement change of the two isolation ground vias 4, the software performs an electromagnetic characteristic calculation. Specifically, under the influence of the grounding effect of the two isolation ground vias 4 on the equivalent impedance of the signal transmission line, the software automatically analyzes the electromagnetic field distribution state instantly formed around the two pairs of differential signal vias, considers key factors such as signal frequency and phase, and automatically calculates the crosstalk results caused by the superposition of electromagnetic radiation fields between the first pair of differential signal vias and the second pair of differential signal vias.

[0098] Step 403, drawing and displaying a crosstalk curve comparison diagram;

[0099] Each time a crosstalk calculation under a displacement parameter is completed, the software quickly records the key results, including the value of the displacement parameter S, the corresponding crosstalk value and other key information; and uses the data visualization module to automatically draw the crosstalk curves of all results in the same chart, obtain a comparison chart of multiple groups of crosstalk curves, and automatically mark the crosstalk values ​​at the frequency of concern.

[0100] Step 5: Determine the location of the isolation ground via according to the simulation results;

[0101] From multiple groups of crosstalk results, the best result is screened out at the frequency of interest, and the displacement of the isolation ground via 4 corresponding to the best result is obtained, and the best position of the isolation ground via 4 is determined based on this.

[0102] In a specific embodiment, the displacement parameter S has a value range of (0, 35 mil), and the scanning step value is 5 mil. For a comparison diagram of multiple groups of crosstalk curves obtained in step 4, please refer to Figure 4 and Figure 5 As can be seen from the figure, at the frequency of interest of 12.5GHz, the crosstalk result of curve a is the best, which is 30.25dB, and its corresponding displacement parameter S=25mil. Therefore, the position of the first isolation ground via and the second isolation ground via after moving 25mil from their respective initial positions to the center point 0 is the best setting position for the two isolation ground vias.

[0103] In summary, in the field of circuit board design, the signal crosstalk problem between two pairs of differential signal vias has always troubled engineers. The traditional approach of relying on empirical rules to try to layout isolated ground vias not only requires engineers to repeatedly modify design files in design software and import simulations multiple times, which consumes a lot of manpower and time costs, but also often makes it difficult to obtain ideal signal crosstalk suppression effects. In response to this technical problem, the present invention systematically builds a preliminary model including differential signal vias, and then adds a pair of isolated ground vias with relative movement characteristics. The two isolated ground vias are arranged in a symmetrical distribution structure in the gap area between the two pairs of differential signal vias, and move toward each other in a mirror-symmetrical path. 3D simulation software is used to establish displacement variables and scan variables, accurately and flexibly adjust the positions of the two isolated ground vias, quickly screen out the optimal solution from a large number of results, and accurately locate the positions of a pair of isolated ground vias that can minimize the signal crosstalk of the two pairs of differential signal vias at a specific frequency of interest, greatly reducing the time required to determine the positions of the isolated ground vias, and significantly improving the work efficiency of the entire circuit board design link in this regard. Furthermore, a pair of isolated ground via structures work in a collaborative manner to build a more stable electromagnetic shielding "defense line", which can more deeply reduce the signal crosstalk between the two pairs of differential signal vias compared to a single isolated ground via.

[0104] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0105] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for locating isolated ground vias for optimizing signal via crosstalk, characterized in that: The following steps are involved: Step 1: Establish a preliminary model; Inserting the first pair of differential signal vias and the second pair of differential signal vias, and aligning the two pairs of differential signal vias; Step 2, adding a set of relatively movable isolation ground vias; In the gap area between the two pairs of differential signal vias, add a set of isolation ground vias and set the two isolation ground vias to have the property of relative movement; Step 3: Parameterization setting; Defining the moving direction and displacement of the first isolation ground via and the second isolation ground via, and setting the displacement as a variable; Step 4, scan variables and simulate results; Iterate the variable value within the set range and simulate to obtain multiple sets of crosstalk results; Step 5: Determine the location of the isolation ground via according to the simulation results.

2. The isolation ground via positioning method for optimizing signal via crosstalk according to claim 1, characterized in that: The step 1 specifically comprises the following steps: Step 101, create a blank initial PCB model; Step 102, retrieve a pair of differential signal vias from the component library, and draw them in the initial setting area of ​​the initial PCB model; Step 103, retrieve another pair of differential signal vias from the component library, place them on one side of the first pair of differential signal vias, and align them with the first pair of differential signal vias; Step 104: Fill in various parameters of the differential signal via.

3. The isolation ground via positioning method for optimizing signal via crosstalk according to claim 2, characterized in that: The differential signal vias include two pairs of signal vias, two pairs of return ground vias, and an anti-pad area.

4. The isolation ground via positioning method for optimizing signal via crosstalk according to claim 2, characterized in that: In step 104, the parameters include via aperture, routing path and line width, fan-out routing layer position, and anti-pad area size.

5. The isolation ground via positioning method for optimizing signal via crosstalk according to claim 1, characterized in that: The step 2 specifically includes the following steps: Step 201, inserting a first isolation ground via hole at the left side of the center of the gap area between the two pairs of differential signal via holes; Step 202, select the first isolation ground via, and copy it to obtain the second isolation ground via with the center point of the gap as the center; Step 203: Select the first isolation ground via and the second isolation ground via and set them as movable objects.

6. The isolation ground via positioning method for optimizing signal via crosstalk according to claim 1, characterized in that: The step 3 specifically comprises the following steps: Step 301, establishing a coordinate system; The center of one of the first pair of differential signal vias is taken as the origin, the direction from the origin to the center of the other signal via in the same pair of differential signal vias is taken as the Y axis, and the direction from the origin to the second pair of differential signal vias is taken as the X axis; Step 302, defining the moving direction; The moving direction of the first isolation ground via hole is defined as the positive direction of the Y axis, and the moving direction of the second isolation ground via hole is defined as the negative direction of the Y axis; Step 303: setting displacement parameters; The displacements of the first isolation ground via hole and the second isolation ground via hole are set to be equal and expressed by a displacement parameter S, where the displacement parameter of the first isolation ground via hole is S and the displacement parameter of the second isolation ground via hole is -S; Step 304, setting the initial position of the isolation ground via; Step 305, setting parameter variable range; Set the variation range and step value of the displacement parameter S.

7. The isolation ground via positioning method for optimizing signal via crosstalk according to claim 6, characterized in that: In step 305, the displacement parameter varies in the range of 0 to 35 mil.

8. The isolation ground via positioning method for optimizing signal via crosstalk according to claim 6 or 7, characterized in that: In step 305, the step value of the displacement parameter is 5 mil, 3 mil or 1 mil.

9. The isolation ground via positioning method for optimizing signal via crosstalk according to claim 6, characterized in that: The step 4 specifically comprises the following steps: Step 401, start the scanning process; According to the displacement parameter S set in step 3, starting from the initial value, the step value is gradually increased. Each time the displacement parameter S is adjusted, the first isolation ground via is moved toward the positive direction of the Y axis by a distance S, and the second isolation ground via is moved toward the negative direction of the Y axis by a distance S; Step 402, calculating the via-to-via crosstalk result; After each displacement change of the two isolation ground vias, the software automatically calculates the crosstalk results between the two pairs of differential signal vias; Step 403, drawing and displaying a crosstalk curve comparison diagram; Each time the crosstalk calculation under the displacement parameters is completed, the result is automatically recorded, and the crosstalk curves of all the results are automatically exported in the same chart to obtain a comparison chart of multiple groups of crosstalk curves.

10. The isolation ground via positioning method for optimizing signal via crosstalk according to claim 9, characterized in that: The specific steps of step 5 are: selecting the best result from multiple groups of crosstalk results, obtaining the displacement of the isolation ground via hole corresponding to the best result, and determining the best position of the isolation ground via hole based on the displacement.

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