PCB bonding pad protection system

Abstract

The invention provides a PCB bonding pad protection system which comprises a conveying line, a bonding pad protection device is placed on the conveying line, and the bonding pad protection device comprises a magnetic type buckle; a production line is arranged on the side close to the conveying line, and PCBs are placed on the production line and driven by the production line to move; disassembling and assembling mechanisms are arranged at the two ends, close to the conveying line, of the production line correspondingly and used for changing the adsorption state of the magnetic attraction type buckles so that the magnetic attraction type buckles can adsorb or loosen the PCBs. When the dismounting and mounting mechanism is used for mounting and dismounting the bonding pad protection device, the dismounting and mounting mechanism adsorbs or loosens the magnetic suction type buckle by powering on and powering off the dismounting and mounting mechanism, so that the adsorption state of the magnetic suction type buckle is changed, the magnetic suction type buckle can be clamped into a PCB or separated from the PCB, and automatic mounting and automatic dismounting of the PCB and the bonding pad protection device are achieved. The production efficiency is greatly improved, and meanwhile, the recyclable bonding pad protection device is used for protecting the PCB during welding, so that the cost is reduced, and the product quality is also improved.

Description

Technical Field

[0001] The present invention relates to the technical field of air conditioning, and in particular to a pad protection system for a PCB. Background Art

[0002] Controller motherboard production is an important part of air-conditioning production. According to the production technology requirements and the current production process arrangement, it is necessary to first check and install some electronic components, then perform wave soldering, then insert the power module, and then use selective welding to solder the power module.

[0003] In the above production situation, there is a situation where solder sticks to the power module pad during the wave soldering process. In order to avoid the occurrence of abnormalities, the current method is to add automatic pasting equipment to paste high-temperature adhesive tape to protect the power module pad position. However, this situation will result in increased production costs, increased personnel, and the occurrence of quality risks.

[0004] Therefore, a recyclable pad protection device is needed to protect the PCB pad position and automatically disassemble and install the pad protection device. Summary of the invention

[0005] In order to overcome the problems existing in the related art, the purpose of the present invention is to provide a PCB pad protection system, which utilizes a reusable pad protection device to protect the PCB pad position and can automatically disassemble and install the pad protection device.

[0006] A pad protection system for a PCB comprises a transport line, on which a pad protection device is placed, the pad protection device comprising a magnetic buckle; a production line is arranged on one side close to the transport line, a PCB is placed on the production line, and the production line drives the PCB to move; disassembly and assembly mechanisms are respectively arranged at both ends of the production line close to the transport line, the disassembly and assembly mechanisms are used to change the adsorption state of the magnetic buckle so that the magnetic buckle adsorbs or releases the PCB.

[0007] In a preferred technical solution of the present invention, the magnetic buckle includes a sliding assembly and a connecting rod assembly, the sliding assembly is hinged to the connecting rod assembly, and the sliding assembly is used to drive the connecting rod assembly to move so as to stretch or fold the connecting rod assembly.

[0008] In a preferred technical solution of the present invention, the sliding assembly includes a guide column, on which a slider is sleeved; both sides of the slider are hinged to the connecting rod assembly, and the slider moves along the axial direction of the guide column to drive the change of the working state of the connecting rod assembly.

[0009] In a preferred technical solution of the present invention, the sliding assembly further comprises a fixed block and a snap-on shell, the fixed block is fixedly connected to the inner side of the snap-on shell, and the guide column passes through the fixed block.

[0010] In a preferred technical solution of the present invention, the connecting rod assembly includes a first connecting rod and a second connecting rod, the first connecting rod is provided with a first connecting end and a second connecting end on both sides, and the second connecting rod is provided with a third connecting end and a fourth connecting end on both sides; the first connecting end is hinged to the slider, the second connecting end is hinged to the third connecting end, and the fourth connecting end is hinged to the fixed block.

[0011] In a preferred technical solution of the present invention, the pad protection device also includes a protection tool, the magnetic buckle is inserted into the protection tool, and the protection tool is used to protect the pad of the PCB.

[0012] In a preferred technical solution of the present invention, guide mechanisms are provided at both ends of the transport line, and the guide mechanisms include two guide frames arranged opposite to each other, and a discharge port is formed between the two guide frames.

[0013] In a preferred technical solution of the present invention, a cylinder clamp is arranged near the discharge port, and a clamping cylinder is connected below the cylinder clamp; the clamping cylinder is connected to a cylinder connecting plate, and a lifting cylinder is connected below the cylinder connecting plate.

[0014] In a preferred technical solution of the present invention, gantry brackets are connected to both sides of the production line, and the disassembly and assembly mechanism is connected to the gantry bracket; the disassembly and assembly mechanism includes a pushing cylinder, and the pushing cylinder is mounted on the gantry bracket; a cylinder mounting plate is connected to the bottom of the pushing cylinder, and an electromagnet is provided on the side of the cylinder mounting plate away from the pushing cylinder.

[0015] In a preferred technical solution of the present invention, it also includes a wave soldering device, the production line passes through the wave soldering device, the disassembly and assembly mechanism is provided on both sides of the wave soldering device, and the wave soldering device is used to perform wave soldering on the pads of the power module on the PCB.

[0016] In a preferred technical solution of the present invention, a blocking cylinder is arranged above the production line, and the blocking cylinder is used to block two adjacent PCBs on the production line to control the flow time interval of the PCB boards.

[0017] The beneficial effects of the present invention are:

[0018] The present invention provides a pad protection system for a PCB, comprising a transport line, on which a pad protection device is placed, and the pad protection device includes a magnetic buckle; a production line is arranged on one side close to the transport line, on which a PCB is placed, and the production line drives the PCB to move; disassembly and assembly mechanisms are respectively arranged on both ends of the production line close to the transport line, and the disassembly and assembly mechanisms are used to change the adsorption state of the magnetic buckle so that the magnetic buckle adsorbs or releases the PCB. The first end of the transport line is close to the first disassembly and assembly mechanism, and the second end of the transport line is close to the second disassembly and assembly mechanism. The first disassembly and assembly mechanism is used to install the pad protection device on the PCB, and the second disassembly and assembly mechanism is used to remove the pad protection device from the PCB. The transport line drives the pad protection device to be transported from the second end of the transport line to the first end of the transport line, so that the pad protection device removed from the PCB is reused by the PCB, which greatly reduces the production cost. When the disassembly and assembly mechanism installs or removes the pad protection device on the PCB, the disassembly and assembly mechanism is powered on and off to adsorb or release the magnetic buckle to change the adsorption state of the magnetic buckle, so that the magnetic buckle can be inserted into the PCB or detached from the PCB, so as to realize automatic installation and removal of the PCB and the pad protection device, greatly improving the production efficiency. At the same time, the pad protection device is used to protect the PCB and improve product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of a pad protection system for a PCB of the present invention;

[0020] Figure 2 It is a schematic diagram of the structure of the transportation line and the production line of the present invention;

[0021] Figure 3 It is a structural schematic diagram of the disassembly and assembly mechanism of the present invention;

[0022] Figure 4 is a schematic diagram of the guide mechanism and the cylinder fixture of the present invention;

[0023] Figure 5 is a schematic structural diagram of a pad protection device of the present invention;

[0024] Figure 6 is a schematic diagram of the magnetic buckle of the present invention in a non-adsorbed state;

[0025] Figure 7 It is a schematic diagram of the magnetic buckle of the present invention in an adsorbed state.

[0026] Figure numerals: 1. transport line; 2. pad protection device; 3. magnetic buckle; 4. production line; 5. PCB; 6. disassembly and assembly mechanism; 7. sliding assembly; 8. connecting rod assembly; 9. guide column; 10. slider; 11. fixing block; 12. buckle housing; 13. first connecting rod; 14. second connecting rod; 15. protection tooling; 16. guide mechanism; 17. guide frame; 18. discharge port; 19. cylinder clamp; 20. clamping claw cylinder; 21. cylinder connecting plate; 22. rising cylinder; 23. gantry bracket; 24. pushing cylinder; 25. cylinder mounting plate; 26. electromagnet; 27. wave soldering device; 28. blocking cylinder. DETAILED DESCRIPTION

[0027] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0028] Example 1

[0029] like Figures 1 to 7 As shown, this embodiment provides a PCB pad protection system, including a transportation line 1, on which a pad protection device 2 is placed, and the pad protection device 2 includes a magnetic buckle 3; a production line 4 is arranged on one side close to the transportation line 1, and a PCB 5 is placed on the production line 4, and the production line 4 drives the PCB 5 to move; disassembly and assembly mechanisms 6 are respectively arranged at both ends of the production line 4 close to the transportation line 1, and the disassembly and assembly mechanisms 6 are used to change the adsorption state of the magnetic buckle 3 so that the magnetic buckle 3 adsorbs or releases the PCB 5.

[0030] The transport line 1 is an arc-shaped transport line 1, and both ends of the transport line 1 are located below the production line 4. The first end of the transport line 1 is close to the first disassembly and assembly mechanism 6, and the second end of the transport line 1 is close to the second disassembly and assembly mechanism 6. The first disassembly and assembly mechanism 6 is used to install the pad protection device 2, and the second disassembly and assembly mechanism 6 is used to disassemble the pad protection device 2. The transport line 1 is responsible for transporting the pad protection device 2 disassembled by the second disassembly and assembly mechanism 6 from the second end of the transport line 1 to the first end of the transport line 1, so as to provide the pad protection device 2 to the first disassembly and assembly mechanism 6 for installation and use, so that the pad protection device 2 can be reused by the PCB 5.

[0031] The production line 4 is provided with a first disassembly and assembly station and a second disassembly and assembly station. The first disassembly and assembly mechanism 6 is located above the first disassembly and assembly station, and the second disassembly and assembly mechanism 6 is located above the second disassembly and assembly station.

[0032] When the production line 4 drives the PCB5 to move to the first disassembly and assembly station, the first disassembly and assembly mechanism 6 moves downward until it contacts the magnetic buckle 3 of the pad protection device 2. At this time, power is supplied to the first disassembly and assembly mechanism 6, and the first disassembly and assembly mechanism 6 starts to adsorb the magnetic buckle 3 after being powered on, so that the magnetic buckle 3 changes from a state of not being adsorbed to a state of being adsorbed. When the magnetic buckle 3 is in the state of being adsorbed, the position of the magnetic buckle 3 changes, and the magnetic buckle 3 changes from a released state to a retracted state, so that the magnetic buckle 3 can be directly inserted into the PCB5. After the magnetic buckle 3 is inserted into the PCB5, the first disassembly and assembly mechanism 6 is powered off, and the first disassembly and assembly mechanism 6 no longer adsorbs the magnetic buckle 3 after being powered off, so that the magnetic buckle 3 changes from a state of being adsorbed to a state of not being adsorbed. When the magnetic buckle 3 is in a non-adsorbed state, the position of the magnetic buckle 3 is restored, and the magnetic buckle 3 changes from a retracted state to a released state, so that the magnetic buckle 3 is directly fixed on the PCB5 after being snapped into the PCB5, thereby fixing the pad protection device 2 on the PCB5.

[0033] When the production line 4 drives the PCB5 with the pad protection device 2 fixed to move to the second disassembly and assembly station, the second disassembly and assembly mechanism 6 moves downward until it contacts the magnetic buckle 3 of the pad protection device 2 fixed on the PCB5. At this time, power is supplied to the second disassembly and assembly mechanism 6, and the second disassembly and assembly mechanism 6 begins to absorb the magnetic buckle 3, and the magnetic buckle 3 changes from the non-absorbed state to the absorbed state, and the magnetic buckle 3 changes from the released state to the retracted state, so that the magnetic buckle 3 is separated from the PCB5. When the magnetic buckle 3 is separated from the PCB5, the power is cut off to the second disassembly and assembly mechanism 6, and the second disassembly and assembly mechanism 6 no longer absorbs the magnetic buckle 3, and the magnetic buckle 3 changes from the absorbed state to the non-absorbed state. Under the action of gravity, the pad protection device 2 falls directly on the second end of the transport line 1, and the transport line 1 transports the pad protection device 2 removed from the second disassembly and assembly station to the first end of the transport line 1 to provide it to the PCB5 on the first disassembly and assembly station for reuse.

[0034] A pad protection system for a PCB in the present embodiment includes a transport line 1, on which a pad protection device 2 is placed, and the pad protection device 2 includes a magnetic buckle 3; a production line 4 is provided on one side close to the transport line 1, on which a PCB 5 is placed, and the production line 4 drives the PCB 5 to move; disassembly and assembly mechanisms 6 are respectively provided on both ends of the production line 4 close to the transport line 1, and the disassembly and assembly mechanisms 6 are used to change the adsorption state of the magnetic buckle 3 so that the magnetic buckle 3 adsorbs or releases the PCB 5. The first end of the transport line 1 is close to the first disassembly and assembly mechanism 6, and the second end of the transport line 1 is close to the second disassembly and assembly mechanism 6. The first disassembly and assembly mechanism 6 is used to install the pad protection device 2 on the PCB5, and the second disassembly and assembly mechanism 6 is used to remove the pad protection device 2 from the PCB5. The transport line 1 drives the pad protection device 2 to be transported from the second end of the transport line 1 to the first end of the transport line 1, so that the pad protection device 2 removed from the PCB5 can be reused by the PCB5, which greatly reduces the production cost. When the disassembly and assembly mechanism 6 installs or removes the pad protection device 2 on the PCB5, the disassembly and assembly mechanism 6 is powered on and off to make the disassembly and assembly mechanism 6 absorb or release the magnetic buckle 3 to change the absorption state of the magnetic buckle 3, so that the magnetic buckle 3 can be inserted into the PCB5 or detached from the PCB5, so as to realize the automatic installation and removal of the PCB5 and the pad protection device 2, which greatly improves the production efficiency, and at the same time uses the pad protection device 2 to protect the PCB5 and improve the product quality.

[0035] Example 2

[0036] like Figures 1 to 7 As shown, this embodiment provides a PCB pad protection system, including a transportation line 1, on which a pad protection device 2 is placed, and the pad protection device 2 includes a magnetic buckle 3; a production line 4 is arranged on one side close to the transportation line 1, and a PCB 5 is placed on the production line 4, and the production line 4 drives the PCB 5 to move; disassembly and assembly mechanisms 6 are respectively arranged at both ends of the production line 4 close to the transportation line 1, and the disassembly and assembly mechanisms 6 are used to change the adsorption state of the magnetic buckle 3 so that the magnetic buckle 3 adsorbs or releases the PCB 5.

[0037] The magnetic buckle 3 includes a sliding assembly 7 and a connecting rod assembly 8. The sliding assembly 7 is hinged to the connecting rod assembly 8. The sliding assembly 7 is used to drive the connecting rod assembly 8 to move so as to stretch or fold the connecting rod assembly 8.

[0038] The sliding assembly 7 includes a guide column 9, on which a slider 10 is sleeved; both sides of the slider 10 are hinged to the connecting rod assembly 8, and the slider 10 moves along the axial direction of the guide column 9 to drive the change of the working state of the connecting rod assembly 8.

[0039] The sliding assembly 7 further includes a fixing block 11 and a buckle housing 12 . The fixing block 11 is fixedly connected to the inner side of the buckle housing 12 , and the guide column 9 passes through the fixing block 11 .

[0040] The connecting rod assembly 8 includes a first connecting rod 13 and a second connecting rod 14, and the first connecting rod 13 is respectively provided with a first connecting end and a second connecting end on both sides, and the second connecting rod 14 is respectively provided with a third connecting end and a fourth connecting end on both sides; the first connecting end is hinged to the slider 10, the second connecting end is hinged to the third connecting end, and the fourth connecting end is hinged to the fixed block 11.

[0041] The pad protection device 2 further includes a protection tool 15 , the magnetic buckle 3 is inserted into the protection tool 15 , and the protection tool 15 is used to protect the pad of the PCB 5 .

[0042] When the magnetic buckle 3 is adsorbed, the slider 10 moves along the axial direction of the guide column 9 in a direction away from the fixed block 11. When the slider 10 moves, it drives the first connecting rod 13 to move, and the first connecting rod 13 drives the second connecting rod 14 to move until the first connecting rod 13 and the second connecting rod 14 are in the same vertical direction. At this time, the first connecting rod 13 and the second connecting rod 14 are fully stretched, and the slider 10 reaches the maximum movement distance. At this time, the slider 10 is balanced in force and is in a static state. The working state of the magnetic buckle 3 is the adsorption state. The position of the connecting rod assembly 8 changes, and the second connecting end of the first connecting rod 13 and the third connecting end of the second connecting rod 14 are moved from the outside of the buckle shell 12 to the inside of the buckle shell 12, so that the magnetic buckle 3 can pass through the mounting hole of the PCB 5.

[0043] When the magnetic buckle 3 is disconnected from adsorption, the slider 10 moves along the guide column 9 towards the fixed block 11 under the action of gravity, and the slider 10 drives the first connecting rod 13 and the second connecting rod 14 to move until the first connecting rod 13 and the second connecting rod 14 are folded to the minimum angle with each other, and the slider 10 stops moving. The working state of the magnetic buckle 3 is a non-adsorption state, and the position of the connecting rod assembly 8 changes. The second connecting end of the first connecting rod 13 and the third connecting end of the second connecting rod 14 are moved from the inside of the buckle shell 12 to the outside of the buckle shell 12, so that the magnetic buckle 3 is directly fixed on the PCB5 after passing through the mounting hole of the PCB5.

[0044] The magnetic buckle 3 is a columnar structure, and the buckle housing 12 of the magnetic buckle 3 is also provided with a positioning column, which is located on the side of the buckle housing 12 away from the fixing block 11. The protective tooling 15 is provided with a positioning hole, and the positioning column is inserted into the positioning hole, so that the magnetic buckle 3 is fixed on the protective tooling 15. After the magnetic buckle 3 is inserted into the PCB5, the magnetic buckle 3 drives the protective tooling 15 to be fixed on the PCB5, so that the protective tooling 15 protects the pads of the PCB5.

[0045] The magnetic buckle 3 of this embodiment includes a sliding assembly 7 and a connecting rod assembly 8. The sliding assembly 7 is hinged to the connecting rod assembly 8. The sliding assembly 7 is used to drive the connecting rod assembly 8 to move so as to stretch or fold the connecting rod assembly 8.

[0046] The sliding assembly 7 includes a guide column 9, on which a slider 10 is sleeved; the two sides of the slider 10 are hinged to the connecting rod assembly 8, and the slider 10 moves along the axial direction of the guide column 9 to drive the change of the working state of the connecting rod assembly 8. The sliding assembly 7 also includes a fixed block 11 and a buckle shell 12, the fixed block 11 is fixedly connected to the inner side of the buckle shell 12, and the guide column 9 passes through the fixed block 11. The connecting rod assembly 8 includes a first connecting rod 13 and a second connecting rod 14, the first connecting rod 13 is provided with a first connecting end and a second connecting end on both sides, and the second connecting rod 14 is provided with a third connecting end and a fourth connecting end on both sides; the first connecting end is hinged to the slider 10, the second connecting end is hinged to the third connecting end, and the fourth connecting end is hinged to the fixed block 11. The pad protection device 2 also includes a protection tool 15, the magnetic buckle 3 is inserted into the protection tool 15, and the protection tool 15 is used to protect the pad of the PCB5. When the magnetic buckle 3 is adsorbed, the sliding assembly 7 drives the connecting rod assembly 8 to move upward, so that the position of the connecting rod assembly 8 is displaced from the outside of the buckle shell 12 to the inside of the buckle shell 12, so that the magnetic buckle 3 can be snapped into the PCB 5. Then, the adsorption of the magnetic buckle 3 is disconnected, and the sliding assembly 7 drives the connecting rod assembly 8 to move downward under the action of gravity, so that the connecting rod assembly 8 returns to the initial position, and the position of the connecting rod assembly 8 is displaced from the inside of the buckle shell 12 to the outside of the buckle shell 12, so that the magnetic buckle 3 is directly fixed on the PCB 5 after being snapped into the PCB 5, so as to achieve the purpose of protecting the soldering pads of the PCB 5.

[0047] Example 3

[0048] like Figures 1 to 7As shown, this embodiment provides a PCB pad protection system, including a transportation line 1, on which a pad protection device 2 is placed, and the pad protection device 2 includes a magnetic buckle 3; a production line 4 is arranged on one side close to the transportation line 1, and a PCB 5 is placed on the production line 4, and the production line 4 drives the PCB 5 to move; disassembly and assembly mechanisms 6 are respectively arranged at both ends of the production line 4 close to the transportation line 1, and the disassembly and assembly mechanisms 6 are used to change the adsorption state of the magnetic buckle 3 so that the magnetic buckle 3 adsorbs or releases the PCB 5.

[0049] A guide mechanism 16 is disposed at both ends of the transport line 1 . The guide mechanism 16 includes two guide frames 17 disposed opposite to each other, and a discharge port 18 is formed between the two guide frames 17 .

[0050] A cylinder clamp 19 is provided near the discharge port 18 , and a clamping cylinder 20 is connected below the cylinder clamp 19 ; the clamping cylinder 20 is connected to a cylinder connecting plate 21 , and a lifting cylinder 22 is connected below the cylinder connecting plate 21 .

[0051] The guide frame 17 includes a vertical portion and a bent portion, the vertical portion and the bent portion are connected or integrally formed, the first end of the bent portion is connected to the side wall of the transport line 1, and the second end of the bent portion is connected to the vertical portion. A support rod is also connected to one side of the vertical portion close to the side wall of the transport line 1, the first end of the support rod is connected to the side wall of the transport line 1, and the second end of the support rod is connected to the side wall of the vertical portion.

[0052] When the transport line 1 drives the pad protection device 2 to move to the guide mechanism 16, the guide frame 17 guides the pad protection device 2, and the pad protection device 2 passes through the bending part and the vertical part in sequence along the direction of the guide frame 17. The bending part guides the pad protection device 2 to the vertical part, and the vertical part guides the pad protection device 2 to the discharge port 18 until the pad protection device 2 moves to the discharge port 18.

[0053] When the pad protection device 2 is located at the discharge port 18, the clamping claw cylinder 20 is started, driving the cylinder clamp 19 to move horizontally to clamp the pad protection device 2. After the cylinder clamp 19 clamps the pad protection device 2, the rising cylinder 22 is started, and the rising cylinder 22 drives the cylinder connecting plate 21 to move upward, and the cylinder connecting plate 21 drives the clamping claw cylinder 20 to move upward, and the clamping claw cylinder 20 drives the cylinder clamp 19 to move upward, so as to drive the pad protection device 2 to move in the direction close to the first disassembly and assembly station.

[0054] The two ends of the transport line 1 of this embodiment are provided with a guide mechanism 16, and the guide mechanism 16 includes two guide frames 17 arranged opposite to each other, and a discharge port 18 is formed between the two guide frames 17. A cylinder clamp 19 is provided near the discharge port 18, and a clamping cylinder 20 is connected below the cylinder clamp 19; the clamping cylinder 20 is connected to a cylinder connecting plate 21, and a lifting cylinder 22 is connected below the cylinder connecting plate 21. When the transport line 1 drives the pad protection device 2 to move to the guide mechanism 16, the two guide frames 17 guide the pad protection device 2 and guide the pad protection device 2 to the discharge port 18. When the pad protection device 2 is located at the discharge port 18, the clamping cylinder 20 is started, driving the cylinder clamp 19 to move horizontally to clamp the pad protection device 2, and then the rising cylinder 22 is started, driving the cylinder connecting plate 21 to move upward, and the cylinder connecting plate 21 drives the clamping cylinder 20 to move upward, and the clamping cylinder 20 drives the cylinder clamp 19 to move upward, so as to drive the pad protection device 2 to move in the direction close to the first disassembly and assembly station, so as to achieve the purpose of accurately positioning the pad protection device 2 before installation.

[0055] Example 4

[0056] like Figures 1 to 7 As shown, this embodiment provides a PCB pad protection system, including a transportation line 1, on which a pad protection device 2 is placed, and the pad protection device 2 includes a magnetic buckle 3; a production line 4 is arranged on one side close to the transportation line 1, and a PCB 5 is placed on the production line 4, and the production line 4 drives the PCB 5 to move; disassembly and assembly mechanisms 6 are respectively arranged at both ends of the production line 4 close to the transportation line 1, and the disassembly and assembly mechanisms 6 are used to change the adsorption state of the magnetic buckle 3 so that the magnetic buckle 3 adsorbs or releases the PCB 5.

[0057] Gantry brackets 23 are connected to both sides of the production line 4, and the disassembly and assembly mechanism 6 is connected to the gantry bracket 23; the disassembly and assembly mechanism 6 includes a pushing cylinder 24, and the pushing cylinder 24 is mounted on the gantry bracket 23; a cylinder mounting plate 25 is connected below the pushing cylinder 24, and an electromagnet 26 is provided on the side of the cylinder mounting plate 25 away from the pushing cylinder 24.

[0058] It also includes a wave soldering device 27, the production line 4 passes through the wave soldering device 27, the disassembly and assembly mechanism 6 is provided on both sides of the wave soldering device 27, and the wave soldering device 27 is used to perform wave soldering on the pads of the power module on the PCB 5.

[0059] A blocking cylinder 28 is disposed above the production line 4 , and the blocking cylinder 28 is used to block two adjacent PCBs 5 on the production line 4 to control the flow time interval of the PCBs 5 .

[0060] When the production line 4 drives the PCB 5 to move to the first disassembly and assembly station, the blocking cylinder 28 is activated, and the lever of the blocking cylinder 28 is extended to stop the PCB 5 from continuing to move, so that the PCB 5 stays at the first disassembly and assembly station. Then the rising cylinder 22 drives the pad protection device 2 to move upward to the first target position, and at the same time, the pushing cylinder 24 of the first disassembly and assembly mechanism 6 is activated, and the pushing cylinder 24 drives the cylinder mounting plate 25 to move downward, so as to drive the electromagnet 26 to move downward to the second target position, which is the contact position between the electromagnet 26 and the magnetic buckle 3, and the second target position is located above the first target position.

[0061] Then, the electromagnet 26 is powered, and after the electromagnet 26 is powered, it starts to attract the magnetic buckle 3, and the working state of the magnetic buckle 3 changes from the non-attracting state to the adsorbing state, and the active buckle position of the magnetic buckle 3 changes. At the same time, the rising cylinder 22 drives the pad protection device 2 to continue to move upward, so as to drive the magnetic buckle 3 to move upward. During the upward movement, the magnetic buckle 3 is inserted into the mounting hole of the PCB 5 until it moves to the second target position and contacts the electromagnet 26.

[0062] Then stop supplying power to the electromagnet 26. After the electromagnet 26 is powered off, it no longer attracts the magnetic buckle 3. The working state of the magnetic buckle 3 changes from the adsorbed state to the non-adsorbed state. The movable buckle of the magnetic buckle 3 returns to the initial position. The pad protection device 2 is fixed on the PCB5. At this time, the lever of the blocking cylinder 28 is retracted and no longer blocks the PCB5. The production line 4 drives the PCB5 to continue to move forward. At the same time, the push cylinder 24 of the first disassembly and assembly mechanism 6 moves upward, driving the cylinder mounting plate 25 to move to the initial position. After the pad protection device 2 is fixed on the PCB5, the clamping claw cylinder 20 drives the cylinder clamp 19 to move, so that the cylinder clamp 19 releases the pad protection device 2, and then the rising cylinder 22 moves downward and returns to the initial position.

[0063] The production line 4 drives the PCB5 with the pad protection device 2 installed to continue to move forward. When passing through the wave soldering device 27, the wave soldering device 27 performs wave soldering on the pads of the power module on the PCB5, and the pad protection device 2 protects the pad position of the power module of the PCB5. After the PCB5 passes through the wave soldering, the PCB5 continues to move to the second disassembly and assembly station, and the blocking cylinder 28 extends to block the PCB5 from continuing to move, so that the PCB5 stays at the second disassembly and assembly station. The push cylinder 24 of the second disassembly and assembly mechanism 6 is started, and the push cylinder 24 drives the cylinder mounting plate 25 to move downward until the electromagnet 26 of the cylinder mounting plate 25 contacts the magnetic buckle 3, and the electromagnet 26 is powered. After the electromagnet 26 is powered on, it starts to absorb the magnetic buckle 3, so that the active buckle position of the magnetic buckle 3 changes, and the magnetic buckle 3 is detached from the PCB5. When the magnetic buckle 3 is detached from the PCB 5, the power supply to the electromagnet 26 is stopped, and the electromagnet 26 no longer attracts the magnetic buckle 3. The pad protection device 2 falls on the transportation line 1 under the action of gravity, and the transportation line 1 drives the pad protection device 2 to move to the discharge port 18 to provide it to the first disassembly and assembly mechanism 6 for installation and use, so as to realize the reuse of the pad protection device 2.

[0064] The production line 4 of this embodiment is connected to gantry brackets 23 on both sides, and the disassembly mechanism 6 is connected to the gantry bracket 23; the disassembly mechanism 6 includes a push cylinder 24, and the push cylinder 24 is mounted on the gantry bracket 23; the cylinder mounting plate 25 is connected below the push cylinder 24, and an electromagnet 26 is provided on the side of the cylinder mounting plate 25 away from the push cylinder 24. It also includes a wave soldering device 27, through which the production line 4 passes, and the disassembly mechanism 6 is provided on both sides of the wave soldering device 27, and the wave soldering device 27 is used to perform wave soldering on the pads of the power module on the PCB 5. A blocking cylinder 28 is provided above the production line 4, and the blocking cylinder 28 is used to block two adjacent PCBs 5 on the production line 4 to control the flow time interval of the PCB 5. After the PCB5 is blocked by the blocking cylinder 28, the first disassembly and assembly mechanism 6 installs the pad protection device 2 on the PCB5, so that when the PCB5 passes through the wave soldering device 27 for wave soldering, the pad protection device 2 protects the pad position of the power module of the PCB5, thereby ensuring the product quality of the PCB5. After the PCB5 passes through the wave soldering, the blocking cylinder 28 blocks the PCB5 again, and the second disassembly and assembly mechanism 6 removes the pad protection device 2 from the PCB5. Under the action of gravity, the pad protection device 2 falls on the transportation line 1, and the transportation line 1 then drives the pad protection device 2 to move to the discharge port 18 to provide it to the first disassembly and assembly mechanism 6 for installation and use, so as to realize the reuse of the pad protection device 2. By energizing and de-energizing the electromagnet 26 of the disassembly and assembly mechanism 6 to change the adsorption state of the magnetic buckle 3, the rapid disassembly and installation of the pad protection device 2 on the PCB5 is realized, which not only reduces the labor cost, but also greatly improves the production efficiency.

[0065] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the application. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a restriction. Therefore, other examples of exemplary embodiments can have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in the subsequent accompanying drawings.

[0066] It should be understood that spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is inverted, a device described as "above" or "above" other devices or structures would then be positioned "below" or "below" the other devices or structures. Thus, the exemplary term "above" can include both the orientations of "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used herein should be interpreted accordingly.

[0067] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0068] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A PCB pad protection system, characterized in that: It comprises a transport line, on which a pad protection device is placed, and the pad protection device comprises a magnetic buckle; a production line is arranged on one side close to the transport line, on which a PCB is placed, and the production line drives the PCB to move; disassembly and assembly mechanisms are respectively arranged on both ends of the production line close to the transport line, and the disassembly and assembly mechanisms are used to change the adsorption state of the magnetic buckle so that the magnetic buckle adsorbs or releases the PCB.

2. The PCB pad protection system according to claim 1, characterized in that: The magnetic buckle includes a sliding assembly and a connecting rod assembly, wherein the sliding assembly is hinged to the connecting rod assembly, and the sliding assembly is used to drive the connecting rod assembly to move so as to stretch or fold the connecting rod assembly.

3. The PCB pad protection system according to claim 2, characterized in that: The sliding assembly comprises a guide column, on which a sliding block is sleeved; two sides of the sliding block are hinged to the connecting rod assembly, and the sliding block moves along the axial direction of the guide column to drive the change of the working state of the connecting rod assembly.

4. The PCB pad protection system according to claim 3, characterized in that: The sliding assembly also includes a fixing block and a buckle shell, the fixing block is fixedly connected to the inner side of the buckle shell, and the guide column passes through the fixing block.

5. The PCB pad protection system according to claim 4, characterized in that: The connecting rod assembly includes a first connecting rod and a second connecting rod, the first connecting rod is provided with a first connecting end and a second connecting end on both sides, and the second connecting rod is provided with a third connecting end and a fourth connecting end on both sides; the first connecting end is hinged to the slider, the second connecting end is hinged to the third connecting end, and the fourth connecting end is hinged to the fixed block.

6. The PCB pad protection system according to claim 1, characterized in that: The pad protection device also includes a protection tool, the magnetic buckle is inserted into the protection tool, and the protection tool is used to protect the pad of the PCB.

7. The PCB pad protection system according to claim 1, characterized in that: A guide mechanism is arranged at both ends of the transport line, and the guide mechanism comprises two guide frames arranged opposite to each other, and a discharge port is formed between the two guide frames.

8. The PCB pad protection system according to claim 7, characterized in that: A cylinder clamp is arranged near the discharge port, and a clamping claw cylinder is connected below the cylinder clamp; the clamping claw cylinder is connected to a cylinder connecting plate, and a lifting cylinder is connected below the cylinder connecting plate.

9. The PCB pad protection system according to claim 1, characterized in that: Gantry brackets are connected to both sides of the production line, and the disassembly and assembly mechanism is connected to the gantry bracket; the disassembly and assembly mechanism includes a pushing cylinder, and the pushing cylinder is mounted on the gantry bracket; a cylinder mounting plate is connected below the pushing cylinder, and an electromagnet is provided on the side of the cylinder mounting plate away from the pushing cylinder.

10. The PCB pad protection system according to claim 1, characterized in that: It also includes a wave soldering device, the production line passes through the wave soldering device, the disassembly and assembly mechanism is arranged on both sides of the wave soldering device, and the wave soldering device is used to perform wave soldering on the pads of the power module on the PCB.

11. The PCB pad protection system according to claim 1, characterized in that: A blocking cylinder is arranged above the production line, and the blocking cylinder is used to block two adjacent PCBs on the production line to control the flow time interval of the PCB boards.

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