A hot pressing forming device with printed circuit board forming thickness monitoring function

Abstract

The invention discloses a hot pressing forming device with a function of monitoring the forming thickness of a printed circuit board, and relates to the technical field of circuit board production. The device comprises a frame, a gantry frame is arranged on the upper side of the frame, a loading plate is arranged on the lower side of the frame, a lifting cylinder is installed on the gantry frame, a lifting plate is installed on the telescopic rod of the lifting cylinder, a heating plate is arranged on the lower side of the lifting plate, a cleaning plate is installed on the outer side of the heating plate, the loading plate is used to place printed circuit boards and PP cured sheets, a scraping plate is installed on the outer side of the loading plate, the heating plate melts the PP cured sheets to make the upper and lower groups of printed circuit boards adhere, the scraping plate scrapes the overflowed materials on the outer side of the printed circuit board, and the cleaning plate cleans the scraping plate.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board production, in particular to hot pressing forming equipment with a printed circuit board forming thickness monitoring function. Background Art

[0002] A multi-layer circuit board is a circuit board with multiple routing layers. It is composed of at least three conductive layers and dielectric layers, and the electrical interconnection between layers is achieved through metallized holes. It expands circuit wiring by combining single-sided and double-sided circuit boards. It has the advantages of high assembly density, small size, light weight, high reliability, and flexible design. It can meet the needs of special functions and is widely used in the manufacture of electronic products. With the development of large-scale integrated circuits, multi-layer circuit boards are moving towards high density, high precision, and high digitization. However, it is expensive, the production process is complicated, and it requires the latest mechanical equipment and expert operation. It also takes a long time to make and is difficult to troubleshoot errors.

[0003] During the production of multi-layer circuit boards, multiple circuit boards need to be stacked and a PP curing sheet is stacked between two adjacent circuit boards. The circuit boards are then formed using a hot pressing device. Existing hot pressing devices for circuit boards have the following problems: (1) The material overflowing from the circuit boards is not scraped off and needs to be cleaned manually, which is time-consuming and labor-intensive. (2) The circuit boards and the PP curing sheet are not aligned, resulting in the molded product not meeting the requirements. (3) The molded product is not cooled and needs a certain amount of time to cool down, resulting in low molding efficiency. Summary of the invention

[0004] The object of the present invention is to provide a hot pressing forming device with a printed circuit board forming thickness monitoring function to solve the problems raised in the prior art.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a hot pressing forming equipment with a printed circuit board forming thickness monitoring function, comprising a frame, a gantry is arranged on the upper side of the frame, a loading plate is arranged on the lower side of the frame, a lifting cylinder is installed on the gantry, a lifting plate is installed on the telescopic rod of the lifting cylinder, a heating plate is arranged on the lower side of the lifting plate, a cleaning plate is installed on the outer side of the heating plate, the loading plate is used to place printed circuit boards and PP cured sheets, a scraping plate is installed on the outer side of the loading plate, the heating plate melts the PP cured sheet and causes the upper and lower groups of printed circuit boards to adhere, the scraping plate scrapes the material overflowing from the outer side of the printed circuit board, and the cleaning plate cleans the scraping plate.

[0006] The heating plate is located below the cleaning plate, a plurality of fixing plates are arranged on the upper side of the heating plate, a plurality of temperature sensors are arranged in the middle of the heating plate, a heating wire is arranged on the lower side of the heating plate, the plurality of fixing plates are made of metal material, and the temperature sensors and the heating wire are electrically connected to the control system; The lifting plate opposite to the cleaning plate is rotatably mounted with a follower plate through a bearing, the upper side of the cleaning plate is connected to the follower plate through multiple sets of telescopic cylinders, a number of magnets are arranged in the middle of the cleaning plate, and a brush plate and a scraper are alternately arranged on the lower side of the cleaning plate. The telescopic cylinder is a telescopic structure, and both ends of the telescopic cylinder are rotatably mounted on the cleaning plate and the follower plate through bearings, and the fixed plate is located in the magnetic field of the magnet.

[0007] The scraper plate is installed on the frame, a square chamber is arranged in the middle of the scraper plate, a scraper frame is slidably installed in the square chamber, a first spring is connected between the bottom of the scraper frame and the scraper plate, a plurality of cooling chambers are arranged inside the scraper frame, a horizontal axis is arranged in the scraper frame located in the cooling chamber, a plurality of refrigeration plates are arranged on the horizontal axis, a disc is arranged in the middle of the horizontal axis, a telescopic spring is sleeved on the horizontal axis, the middle of the telescopic spring is installed on the disc, and both ends of the telescopic spring are electrically connected to the control system through wires.

[0008] Sealing plates are slidably installed at both ends of the horizontal axis, shielding films are connected between the two ends of the telescopic spring and the sealing plates respectively, a tympanic membrane is connected between each turn of the telescopic spring, a cooling pipe is installed on the outside of the telescopic spring, the cooling pipe is made of a spiral, and both ends of the cooling pipe are installed on the scraping frame, the shielding film and the tympanic membrane are made of elastic material and are provided with a plurality of folds.

[0009] The scraping frame is provided with a plurality of air jets on one side close to the carrier plate, and the air jets are directly facing the printed circuit board. One end of the cooling pipe passes through the scraping frame through a pipeline and is connected to the outlet of the vacuum pump. The other end of the cooling pipe is connected to the plurality of air jets through a pipeline. The inlet of the vacuum pump is connected to the external air. The vacuum pump is installed on the frame, and a one-way valve is installed in the air jet.

[0010] Multiple groups of telescopic cylinders and multiple groups of positioning cylinders are alternately installed on the outer side of the scraper plate, and the telescopic cylinders and the positioning cylinders are both installed on the frame. Detection plates are installed on the telescopic rods of the multiple groups of telescopic cylinders, and positioning plates are installed on the telescopic rods of the multiple groups of positioning cylinders. Several temperature difference plates A are arranged on the lower side of the detection plate, and several temperature difference plates B are arranged on the outer side of the scraper plate, and the temperature difference plates A and the temperature difference plates B correspond to each other one by one.

[0011] The temperature difference plate A, the temperature difference plate B and the refrigeration plate are all provided with semiconductors of two different materials and a metal plate, one end of the semiconductors of the two different materials are connected to the metal plate, the two semiconductors on the temperature difference plate A and the two semiconductors on the temperature difference plate B are connected by wires, one of which is connected to the control system, and the two semiconductors on the refrigeration plate are electrically connected to the control system through the wires.

[0012] The two semiconductors and metal plate on the cooling plate are the cooling end of the Peltier effect. The cooling end cools the air in the cavity between the eardrum, the telescopic spring and the shielding membrane. The air in the cavity cools the eardrum, and the air on the outside of the cooling tube is cooled through the eardrum, thereby achieving cooling of the air in the cooling tube.

[0013] Therefore, the larger the area of ​​the eardrum, the better the eardrum's cooling effect on the air in the cooling tube. The control system can adjust the degree of wrinkles of the eardrum, and then adjust the cooling area of ​​the eardrum to achieve different cooling effects; the control system energizes both ends of the telescopic spring, and a mutually attractive magnetic field is generated between each turn of the telescopic spring. Since the middle part of the telescopic spring is installed on the vertical axis, the telescopic spring gradually contracts under the action of the mutually attractive magnetic field of each turn, and the telescopic spring drives the eardrum from its original flat state to a wrinkled state, reducing the cooling area of ​​the eardrum. At the same time, the telescopic spring pulls the sealing plate to slide on the horizontal axis, and the shielding film moves following the expansion and contraction of the telescopic spring.

[0014] The inner side of the follower plate is provided with a tooth shape, and the follower plate is meshed with a gear through the tooth shape. A driving motor is installed in the middle of the gear, and the driving motor is installed on the lifting plate. The driving motor is located on the upper side of the lifting plate.

[0015] A second spring is sleeved on the outer side of the telescopic cylinder, and the telescopic cylinder and the scraper plate are connected to the outlet of the vacuum pump through a pipeline; The pipeline connected to the vacuum pump is installed with a solenoid valve, a flow meter and a pressure sensor, and the solenoid valve, the flow meter and the pressure sensor are electrically connected to the control system.

[0016] A control panel is arranged on the frame, and a control system is arranged inside the control panel.

[0017] Compared with the prior art, the present invention has the following beneficial effects: 1. Scrape off the overflowed materials to reduce the workload of workers. The control system opens the solenoid valve in the pipe between the outlet of the vacuum pump and the scraper plate. The vacuum pump pressurizes the external air and delivers it to the inside of the scraper plate. The pressurized air pushes the scraper frame upward and stretches the first spring. The scraper frame moves upward to scrape off the overflowed materials attached to the outside of the printed circuit board. There is no need to manually clean up the overflowed materials, which reduces the workload and improves the efficiency of hot pressing.

[0018] 2. Cool down the formed product circuit board to improve the forming efficiency. The control system opens the solenoid valve in the pipeline between the vacuum pump and the cooling pipe, and connects the two semiconductors on the cooling plate to the circuit. The vacuum pump pressurizes the external air and delivers it to the cooling pipe. The two semiconductors and metal plate on the cooling plate are the cooling end of the Peltier effect. The cooling end cools the air in the cooling pipe through the tympanic membrane. The cooled air is delivered to the air jet through the cooling pipe and sprayed on the printed circuit board after hot pressing through the air jet, so that the formed printed circuit is quickly cooled to improve the forming efficiency.

[0019] 3. The circuit board and the PP curing sheet are aligned without manual processing. The control system drives the positioning plate to move through multiple sets of positioning cylinders, and multiple sets of positioning plates push the edges of the stacked printed circuit boards and PP curing sheets to a flush state for subsequent hot pressing molding. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 yes Figure 1 A partial enlarged view of the middle A area; Figure 3 yes Figure 1 The main view of Figure 4 yes Figure 2 Cross-sectional view at the middle BB position; Figure 5 yes Figure 4 A partial enlarged view of the middle C area; Figure 6 yes Figure 4 A three-dimensional diagram without the lifting cylinder, gantry, telescopic cylinder, detection plate, positioning cylinder, temperature difference plate A and temperature difference plate B; Figure 7 yes Figure 6 Schematic diagram of the structure after removing the lifting plate; Figure 8 yes Figure 7 Bottom view without the drive motor, gears, and follower board; Fig. 9 yes Figure 8 Top view after removing the rack and cleaning plate, etc.; Fig.10 yes Fig. 9 Partial cross-sectional view at the middle DD position; Fig.11 yes Fig.10 A partial enlarged view of the middle E area; Fig.12 It is a schematic diagram of the installation structure of the scraper plate and the scraper frame (the scraper frame moves upward and extends).

[0021] In the figure: 1. control panel; 11. rack; 111. gantry; 112. loading plate; 12. scraper plate; 121. temperature difference plate B; 13. telescopic cylinder; 131. detection plate; 132. temperature difference plate A; 14. gear; 141. drive motor; 15. positioning cylinder; 2. lifting cylinder; 21. lifting plate; 211. following plate; 22. heating plate; 221. fixing plate; 23. cleaning plate; 231. telescopic cylinder; 232. magnet; 24. scraper frame; 241. horizontal axis; 242. telescopic spring; 243. refrigeration plate; 244. sealing plate; 245. shielding film; 246. tympanic membrane; 25. cooling tube. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] Example: Figure 1-Figure 12 As shown, the present invention provides a technical solution of a hot pressing forming device with a thickness monitoring function for printed circuit boards, comprising a frame 11, a gantry 111 is arranged on the upper side of the frame 11, a loading plate 112 is arranged on the lower side of the frame 11, a lifting cylinder 2 is installed on the gantry 111, a lifting plate 21 is installed on the telescopic rod of the lifting cylinder 2, a heating plate 22 is arranged on the lower side of the lifting plate 21, a cleaning plate 23 is installed on the outer side of the heating plate 22, the loading plate 112 is used to place printed circuit boards and PP cured sheets, a scraping plate 12 is installed on the outer side of the loading plate 112, the heating plate 22 melts the PP cured sheet to make the upper and lower groups of printed circuit boards adhere, the scraping plate 12 scrapes the overflow material on the outer side of the printed circuit board, the cleaning plate 23 cleans the scraping plate 12, a control panel 1 is arranged on the frame 11, and a control system is arranged in the control panel 1.

[0024] The heating plate 22 is located below the cleaning plate 23, and a plurality of fixed plates 221 are arranged on the upper side of the heating plate 22, a plurality of temperature sensors are arranged in the middle of the heating plate 22, and a heating wire is arranged on the lower side of the heating plate 22. The plurality of fixed plates 221 are made of metal material, and the temperature sensors and the heating wires are electrically connected to the control system; the lifting plate 21 opposite to the cleaning plate 23 is rotatably mounted with a follower plate 211 through a bearing, and the upper side of the cleaning plate 23 is connected to the follower plate 211 through a plurality of groups of telescopic cylinders 231, respectively, and a plurality of magnets 232 are arranged in the middle of the cleaning plate 23, and a brush plate and a scraper are alternately arranged on the lower side of the cleaning plate 23, and the telescopic cylinder 231 is a telescopic structure, and the two ends of the telescopic cylinder 231 are arranged on the lower side of the cleaning plate 23. The ends are rotatably mounted on the cleaning plate 23 and the following plate 211 through bearings, the fixed plate 221 is located in the magnetic field of the magnet 232, a second spring is sleeved on the outer side of the telescopic cylinder 231, the telescopic cylinder 231 and the scraping plate 12 are connected to the outlet of the vacuum pump through a pipeline; solenoid valves, flow meters and pressure sensors are installed in the pipelines connected to the vacuum pump, the solenoid valves, flow meters and pressure sensors are electrically connected to the control system, a tooth shape is arranged on the inner side of the following plate 211, the following plate 211 is meshed with a gear 14 through the tooth shape, a driving motor 141 is installed in the middle of the gear 14, the driving motor 141 is installed on the lifting plate 21, and the driving motor 141 is located on the upper side of the lifting plate 21.

[0025] The scraper plate 12 is mounted on the frame 11, a square chamber is provided in the middle of the scraper plate 12, a scraper frame 24 is slidably mounted in the square chamber, a first spring is connected between the bottom of the scraper frame 24 and the scraper plate 12, a plurality of cooling chambers are provided inside the scraper frame 24, a horizontal axis 241 is provided in the scraper frame 24 in the cooling chamber, a plurality of refrigeration plates 243 are provided on the horizontal axis 241, a disc is provided in the middle of the horizontal axis 241, a telescopic spring 242 is sleeved on the horizontal axis 241, and the middle of the telescopic spring 242 is installed in the disc. On the disk, both ends of the telescopic spring 242 are electrically connected to the control system through wires; sealing plates 244 are slidably installed at both ends of the horizontal axis 241, and shielding films 245 are connected between both ends of the telescopic spring 242 and the sealing plates 244, and a tympanic membrane 246 is connected between each turn of the telescopic spring 242. A cooling pipe 25 is installed on the outside of the telescopic spring 242, and the cooling pipe 25 is made of a spiral. Both ends of the cooling pipe 25 are installed on the scraping frame 24, and the shielding film 245 and the tympanic membrane 246 are made of elastic material and are provided with a plurality of folds.

[0026] A plurality of air jets are arranged on one side of the scraping frame 24 near the carrier plate 112, and the air jets are directly facing the printed circuit board. One end of the cooling pipe 25 passes through the scraping frame 24 through a pipeline and is connected to the outlet of the vacuum pump. The other end of the cooling pipe 25 is connected to the plurality of air jets through a pipeline. The inlet of the vacuum pump is connected to the external air. The vacuum pump (not shown) is installed on the frame 11, and a one-way valve is installed in the air jet. Multiple groups of telescopic cylinders 13 and multiple groups of positioning cylinders 15 are alternately installed on the outer side of the scraping plate 12. The telescopic cylinders 13 and the positioning cylinders 15 are both installed on the frame 11. The telescopic rods of the multiple groups of telescopic cylinders 13 are equipped with detection plates 131. The telescopic rods of the multiple groups of positioning cylinders 15 are A positioning plate is installed on the rod, a plurality of temperature difference plates A132 are arranged on the lower side of the detection plate 131, and a plurality of temperature difference plates B121 are arranged on the outer side of the scraper plate 12, and the temperature difference plates A132 and the temperature difference plates B121 correspond to each other one by one; the temperature difference plates A132, B121 and the refrigeration plate 243 are all provided with semiconductors and metal plates of two different materials, and one end of the semiconductors of the two different materials are connected to the metal plate, and the two semiconductors on the temperature difference plate A132 and the two semiconductors on the temperature difference plate B121 are connected by wires, one of which is connected to the control system, and the two semiconductors on the refrigeration plate 243 are electrically connected to the control system through wires.

[0027] The two semiconductors and the metal plate on the cooling plate 243 are the cooling end of the Peltier effect. The cooling end is used to cool the air in the chamber between the eardrum 246, the telescopic spring 242 and the shielding membrane 245. The air in the chamber cools the eardrum 246, and the air outside the cooling tube 25 is cooled through the eardrum 246, thereby cooling the air in the cooling tube 25.

[0028] Therefore, when the area of ​​the eardrum 246 is larger, the better the cooling effect of the eardrum 246 on the air in the cooling tube 25 is, and the control system can adjust the degree of wrinkles of the eardrum 246, and then adjust the cooling area of ​​the eardrum 246 to achieve different cooling effects; the control system energizes both ends of the telescopic spring 242, and a mutually attractive magnetic field is generated between each turn of the telescopic spring 242. Since the middle part of the telescopic spring 242 is installed on the vertical axis, the telescopic spring 242 gradually shrinks under the action of the mutually attractive magnetic field of each turn, and the telescopic spring 242 drives the eardrum 246 from the original flat state to the wrinkled state, so that the cooling area of ​​the eardrum 246 is reduced, and the telescopic spring 242 simultaneously pulls the sealing plate 244 to slide on the horizontal axis 241, and the shielding film 245 moves following the expansion and contraction of the telescopic spring 242.

[0029] Working principle: The staff alternately stacks the printed circuit boards and the PP cured sheets on the carrier plate 112, and then presses the start button on the control panel 1 to start the hot pressing molding equipment. The control system drives the positioning plates to move through multiple groups of positioning cylinders 15. The multiple groups of positioning plates push the edges of the stacked printed circuit boards and the PP cured sheets to a flush state to facilitate subsequent hot pressing molding.

[0030] When the printed circuit board and the PP cured sheet are in a flush state, the pressure sensors in the multiple positioning cylinders 15 feed back data to the control system, and the control system controls the lifting cylinder 2 to drive the lifting plate 21 to move downward, and the lifting plate 21 drives the heating plate 22 and the cleaning plate 23 to move downward, so that the heating plate 22 contacts the printed circuit board. When the heating plate 22 contacts the printed circuit board, the lifting cylinder 2 feeds back the thickness of the stacked printed circuit boards and PP cured sheets to the control system to monitor the molding thickness.

[0031] When the heating plate 22 contacts the printed circuit board, the lifting cylinder 2 feeds back the displacement signal of the heating plate 22 to the control system, and the control system controls the driving motor 141 to drive the gear 14 to rotate, and the gear 14 drives the following plate 211 to rotate, and the following plate 211 drives the cleaning plate 23 to rotate through a plurality of telescopic cylinders 231, and a plurality of magnets 232 inside the cleaning plate 23 follow the rotation. Since the fixed plate 221 is made of metal and is within the magnetic field range of the magnet 232, the fixed plate 221 cuts the magnetic flux lines in the magnetic field of the magnet 232 and generates current. The current generated in the fixed plate 221 will generate heat, and the fixed plate 221 conducts the heat to the printed circuit board through the heating plate 22, and the printed circuit board conducts the heat to the PP curing sheet, and the PP curing sheet melts due to the heat, and the upper and lower sets of printed circuit boards are adhered to each other.

[0032] While the cleaning plate 23 rotates, the encoder inside the drive motor 141 feeds back data to the control system, and the control system detects the temperature of the heating plate 22 through the temperature sensor. When the detected temperature is lower than the set temperature, the control system connects the heating wire to the circuit, and heats the heating plate 22 through the heating wire and the fixed plate 221 at the same time, so as to achieve the purpose of rapid heating until the required molding temperature is reached.

[0033] After the printed circuit board is heated by the heating plate 22, the lifting cylinder 2 drives the heating plate 22 and the cleaning plate 23 to move upward through the lifting plate 21. Then, the telescopic cylinder 13 drives the detection plate 131 to be located on the upper side of the printed circuit board. The detection plate 131 drives the temperature difference plate A132 to move to the upper side of the printed circuit board. The residual heat of the printed circuit board after hot pressing is conducted to several temperature difference plates A132, and the temperature difference plate B121 is located on the outer side of the scraper plate 12. The temperature of the temperature difference plate B121 is equivalent to room temperature. The two semiconductors and the metal plate on the temperature difference plate A132 are the hot end of the Seebeck effect, the two semiconductors and the metal plate on the temperature difference plate B121 are the cold end of the Seebeck effect, and the two semiconductors and the metal plate on the cooling plate 243 are the cooling end of the Peltier effect. Therefore, the temperature of the hot end is higher than that of the cold end. The hot end and the cold end generate current through the Seebeck effect and transmit it to the control system. The control system uses the current for cooling treatment at the cooling end after rectification and voltage conversion. By recycling the residual heat after hot pressing, the energy consumption of the hot pressing equipment is reduced.

[0034] When the current generated by the Seebeck effect at the hot end and the cold end is small, the telescopic cylinder 13 drives the temperature difference plate A132 away from the printed circuit board through the detection plate 131. After that, the control system opens the solenoid valve in the pipeline between the outlet of the vacuum pump and the scraper plate 12. The vacuum pump pressurizes the external air and transports it to the inside of the scraper plate 12. The pressurized air pushes the scraper frame 24 to move upward and stretches the first spring. The scraper frame 24 moves upward to scrape the overflow material attached to the outside of the printed circuit board upward. There is no need to manually clean the overflow material, which reduces the work intensity and improves the efficiency of hot pressing. The overflow material is deposited on the scraper frame 24.

[0035] When the scraping frame 24 moves to the uppermost side, the vacuum pump feeds back the data of the pressure sensor in the pipe connecting the scraping plate 12 to the control system, and the control system controls the electromagnetic valve in the pipe between the outlet of the vacuum pump and the scraping plate 12 to be closed, so that the air on the lower side of the scraping frame 24 cannot overflow, so that the scraping frame 24 remains stationary. After that, the control system opens the electromagnetic valve in the pipe between the vacuum pump and the cooling pipe 25, and connects the two semiconductors on the refrigeration plate 243 to the circuit. The vacuum pump pressurizes the external air and transports it to the cooling pipe 25. The two semiconductors and the metal plate on the refrigeration plate 243 are the refrigeration ends of the Peltier effect. The refrigeration end cools the air in the cooling pipe 25 through the tympanic membrane 246. The cooled air is transported to the air jet through the cooling pipe 25, and is sprayed on the printed circuit board after hot pressing through the air jet, so that the formed printed circuit is quickly cooled to improve the forming efficiency.

[0036] After the formed printed circuit board is cooled to the set time, the control system closes the solenoid valve in the pipeline between the vacuum pump and the cooling pipe 25, and there is no need to spray pressurized air on the printed circuit to cool it down. The solenoid valve in the pipeline between the vacuum pump and the telescopic cylinder 231 is opened, and the vacuum pump pressurizes the external air and transports it into the telescopic cylinder 231. As the pressurized air continues to enter the telescopic cylinder 231, the telescopic cylinder 231 becomes longer downward, and the telescopic cylinder 231 pushes the cleaning plate 23 to move downward, so that the cleaning plate 23 is located below the heating plate 22.

[0037] When the cleaning plate 23 is located below the heating plate 22, the vacuum pump feeds back the data of the pressure sensor in the pipe connected to the telescopic cylinder 231 to the control system, and the control system controls the lifting cylinder 2 to drive the cleaning plate 23 to move downward through the lifting plate 21, so that the scraper and brush plate on the lower side of the cleaning plate 23 contact the scraping frame 24, and then the driving motor 141 drives the cleaning plate 23 to rotate through the gear 14, the follower plate 211 and the telescopic cylinder 231, and the cleaning plate 23 drives the brush plate and the scraper to scrape the overflow material on the scraping frame 24, and throw it outward onto the frame 11 for subsequent collection and processing.

[0038] After the scraping frame 24 is cleaned, the control system drives the lifting plate 21 to move upward through the lifting cylinder 2, and the lifting plate 21 drives the cleaning plate 23 and the heating plate 22 to move upward. After that, the positioning cylinder 15 and the positioning plate cooperate to release the formed printed circuit board, and the staff will take it out.

[0039] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A hot press forming equipment with a printed circuit board forming thickness monitoring function, characterized in that: The hot pressing forming equipment comprises a frame (11), a gantry (111) is arranged on the upper side of the frame (11), a loading plate (112) is arranged on the lower side of the frame (11), a lifting cylinder (2) is installed on the gantry (111), a lifting plate (21) is installed on the telescopic rod of the lifting cylinder (2), a heating plate (22) is arranged on the lower side of the lifting plate (21), a cleaning plate (23) is installed on the outer side of the heating plate (22), the loading plate (112) is used to place a printed circuit board and a PP cured sheet, a scraping plate (12) is installed on the outer side of the loading plate (112), the heating plate (22) melts the PP cured sheet and causes the upper and lower groups of printed circuit boards to adhere, the scraping plate (12) scrapes off the material overflowing from the outer side of the printed circuit board, and the cleaning plate (23) cleans the scraping plate (12).

2. The hot pressing forming equipment with a printed circuit board forming thickness monitoring function according to claim 1, characterized in that: The heating plate (22) is located below the cleaning plate (23), a plurality of fixing plates (221) are arranged on the upper side of the heating plate (22), a plurality of temperature sensors are arranged in the middle of the heating plate (22), a heating wire is arranged on the lower side of the heating plate (22), the plurality of fixing plates (221) are made of metal material, and the temperature sensors and the heating wires are electrically connected to the control system; The lifting plate (21) facing the cleaning plate (23) is rotatably mounted with a follower plate (211) via a bearing, the upper side of the cleaning plate (23) is connected to the follower plate (211) via a plurality of telescopic cylinders (231), a plurality of magnets (232) are arranged in the middle of the cleaning plate (23), a brush plate and a scraper are alternately arranged on the lower side of the cleaning plate (23), the telescopic cylinder (231) is a telescopic structure, and both ends of the telescopic cylinder (231) are rotatably mounted on the cleaning plate (23) and the follower plate (211) via bearings, and the fixed plate (221) is located in the magnetic field of the magnet (232).

3. The hot pressing forming equipment with a printed circuit board forming thickness monitoring function according to claim 2, characterized in that: The scraper plate (12) is mounted on a frame (11); a square chamber is arranged in the middle of the scraper plate (12); a scraper frame (24) is slidably mounted in the square chamber; a first spring is connected between the bottom of the scraper frame (24) and the scraper plate (12); a plurality of cooling chambers are arranged inside the scraper frame (24); a transverse axis (241) is arranged on the scraper frame (24) in the cooling chamber; a plurality of refrigeration plates (243) are arranged on the transverse axis (241); a disc is arranged in the middle of the transverse axis (241); a telescopic spring (242) is sleeved on the transverse axis (241); the middle of the telescopic spring (242) is mounted on the disc; and both ends of the telescopic spring (242) are electrically connected to a control system via a wire.

4. The hot pressing forming equipment with a printed circuit board forming thickness monitoring function according to claim 3, characterized in that: Sealing plates (244) are slidably mounted at both ends of the transverse axis (241); shielding films (245) are respectively connected between the two ends of the telescopic spring (242) and the sealing plates (244); a tympanic membrane (246) is connected between each turn of the telescopic spring (242); a cooling tube (25) is mounted on the outside of the telescopic spring (242); the cooling tube (25) is made of a spiral; both ends of the cooling tube (25) are mounted on the scraping frame (24); the shielding film (245) and the tympanic membrane (246) are both made of elastic material and are provided with a plurality of folds.

5. The hot pressing forming equipment with a printed circuit board forming thickness monitoring function according to claim 4, characterized in that: The scraping frame (24) is provided with a plurality of air jets on one side close to the carrier plate (112), and the air jets are directly opposite to the printed circuit board. One end of the cooling pipe (25) passes through the scraping frame (24) through a pipeline and is connected to the outlet of a vacuum pump. The other end of the cooling pipe (25) is connected to the plurality of air jets through a pipeline. The inlet of the vacuum pump is connected to the external air. The vacuum pump is installed on the frame (11), and a one-way valve is installed in the air jet.

6. The hot pressing forming equipment with a printed circuit board forming thickness monitoring function according to claim 5, characterized in that: Multiple groups of telescopic cylinders (13) and multiple groups of positioning cylinders (15) are alternately installed on the outer side of the scraper plate (12); the telescopic cylinders (13) and the positioning cylinders (15) are both installed on the frame (11); detection plates (131) are installed on the telescopic rods of the multiple groups of telescopic cylinders (13); positioning plates are installed on the telescopic rods of the multiple groups of positioning cylinders (15); a plurality of temperature difference plates A (132) are arranged on the lower side of the detection plate (131); a plurality of temperature difference plates B (121) are arranged on the outer side of the scraper plate (12); the temperature difference plates A (132) and the temperature difference plates B (121) correspond to each other one by one.

7. The hot pressing forming equipment with a printed circuit board forming thickness monitoring function according to claim 6, characterized in that: The temperature difference plate A (132), the temperature difference plate B (121) and the refrigeration plate (243) are each provided with a semiconductor made of two different materials and a metal plate, one end of the semiconductors made of two different materials are connected to the metal plate, the two semiconductors on the temperature difference plate A (132) and the two semiconductors on the temperature difference plate B (121) are connected via wires, one of the wires being connected to a control system, and the two semiconductors on the refrigeration plate (243) are electrically connected to the control system via the wires.

8. The hot pressing forming equipment with a printed circuit board forming thickness monitoring function according to claim 7, characterized in that: The inner side of the follower plate (211) is provided with a tooth shape, and the follower plate (211) is meshed with a gear (14) through the tooth shape. A drive motor (141) is installed in the middle of the gear (14), and the drive motor (141) is installed on the lifting plate (21). The drive motor (141) is located on the upper side of the lifting plate (21).

9. The hot pressing forming equipment with a printed circuit board forming thickness monitoring function according to claim 8, characterized in that: A second spring is sleeved on the outside of the telescopic cylinder (231), and the telescopic cylinder (231) and the scraper plate (12) are both connected to the outlet of the vacuum pump via a pipeline; The pipeline connected to the vacuum pump is installed with a solenoid valve, a flow meter and a pressure sensor, and the solenoid valve, the flow meter and the pressure sensor are electrically connected to the control system.

10. The hot pressing forming equipment with a printed circuit board forming thickness monitoring function according to claim 9, characterized in that: A control panel (1) is provided on the frame (11), and a control system is provided inside the control panel (1).

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