Circuit backboard, display panel and electronic equipment

Abstract

The invention provides a circuit backboard, a display panel and electronic equipment, and relates to the technical field of circuits, and the circuit backboard comprises a backboard layer; the first cavity array layer comprises a plurality of first cavities, and the first cavity array layer covers the first surface of the backboard layer; the first vibrating diaphragm layer is located on the side, away from the first surface, of the first cavity array layer, the first vibrating diaphragm layer comprises a first vibrating film, and the first vibrating film is configured to vibrate based on an alternating current electric field. Based on the scheme, the heat dissipation capability of the circuit backboard is improved.

Description

Technical Field

[0001] The present application relates to the field of circuit technology, and more specifically, to a circuit backplane, a display panel and an electronic device. Background Art

[0002] As the power of electronic components continues to increase, the performance of electronic equipment has been greatly improved, but this has also led to the heat dissipation problem of electronic equipment becoming more prominent. If the heat dissipation is not good, the temperature of the electronic equipment will be too high, affecting the stability and reliability of the electronic equipment operation, and may even burn the circuit board.

[0003] In view of this, how to improve the heat dissipation capacity of the circuit backplane is an issue that needs to be urgently addressed. Summary of the invention

[0004] The present application provides a circuit backplane, a display panel and an electronic device, which can improve the heat dissipation capacity of the circuit backplane.

[0005] In a first aspect, a display panel is provided, comprising: a back plate layer; a first chamber array layer, comprising a plurality of first chambers, the first chamber array layer covering a first surface of the back plate layer; a first diaphragm layer, the first diaphragm layer being located on a side of the first chamber array layer away from the first surface, the first diaphragm layer comprising a first vibrating film, and the first vibrating film being configured to vibrate based on an alternating electric field.

[0006] In combination with the first aspect, in some implementations of the first aspect, the first diaphragm layer also includes a first electrode layer and a second electrode layer, the first vibration film is located between the first electrode layer and the second electrode layer, and the second electrode layer is located on a side of the first vibration film close to the first chamber array layer.

[0007] In combination with the first aspect, in some implementations of the first aspect, the first diaphragm layer further includes a plurality of first through holes, and the first through holes are connected to the first chamber.

[0008] In combination with the first aspect, in certain implementations of the first aspect, two adjacent first chambers are separated by a retaining wall, and the first diaphragm layer further includes a plurality of first through holes, and the first through holes penetrate the retaining wall.

[0009] In combination with the first aspect, in certain implementations of the first aspect, the circuit backplane also includes: a base layer, the base layer is located between the first chamber array layer and the backplane layer; a plurality of support parts, the first end of the support part is fixed to the first surface, and the second end of the support part is fixed to the base layer; wherein the base layer includes a plurality of second through holes, and the second through holes are connected to the first through holes.

[0010] In combination with the first aspect, in some implementations of the first aspect, the first through hole is a tapered hole.

[0011] In combination with the first aspect, in certain implementations of the first aspect, the first through hole and the second through hole are tapered holes, and the air outlet of the first through hole and the air inlet of the second through hole are arranged in the first chamber, or the air outlet of the first through hole and the air inlet of the second through hole are connected.

[0012] In combination with the first aspect, in some implementations of the first aspect, two adjacent first chambers are connected via a third through hole.

[0013] In combination with the first aspect, in some implementations of the first aspect, the first electrode layer includes a plurality of first electrodes, and a vertical projection of the first electrodes onto the first chamber array layer is located in the first chamber.

[0014] In combination with the first aspect, in certain implementations of the first aspect, the circuit backplane also includes: a third electrode layer, including multiple second electrodes, the second electrodes are located in the first cavity, the third electrode layer is configured to receive a DC voltage, and the first electrode layer is configured to receive an AC voltage.

[0015] In a second aspect, a circuit backplane is provided, comprising a backplane layer; a second diaphragm layer, the second diaphragm layer covers a first surface of the backplane layer, the second diaphragm layer includes a second vibration film, and the second vibration film is configured to vibrate based on an alternating electric field; a second chamber array layer, including a plurality of second chambers, the second chamber array layer is located on a side of the second diaphragm layer away from the first surface; a base layer, located on a side of the second chamber array layer away from the first surface; a first chamber array layer, including a plurality of first chambers, the first chamber array layer is located on a side of the base layer away from the first surface; a first diaphragm layer, the first diaphragm layer is located on a side of the first chamber array layer away from the first surface, the first diaphragm layer includes a first vibration film, and the first vibration film is configured to vibrate based on an alternating electric field.

[0016] In combination with the second aspect, in certain implementations of the second aspect, the second diaphragm layer also includes a fourth electrode layer, which is located on the side of the second vibration film close to the first surface; the first diaphragm layer also includes a first electrode layer, which is located on the side of the first vibration film away from the first surface.

[0017] In combination with the second aspect, in certain implementations of the second aspect, the first diaphragm layer also includes a plurality of first through holes, which are connected to the first chamber; the base layer also includes a plurality of second through holes, which are connected to the first through holes; the second diaphragm layer also includes a plurality of fourth through holes, which are connected to the second through holes.

[0018] In combination with the second aspect, in certain implementations of the second aspect, the first through hole, the second through hole and the fourth through hole are tapered holes, and the air outlet of the first through hole and the air inlet of the second through hole are arranged in the first chamber, and the air outlet of the second through hole and the air inlet of the fourth through hole are arranged in the second chamber.

[0019] In combination with the second aspect, in some implementations of the second aspect, two adjacent first chambers are connected via a third through hole, and two adjacent second chambers are connected via a fifth through hole.

[0020] In combination with the second aspect, in some implementations of the second aspect, the base layer is configured to receive a direct current voltage and an alternating current voltage.

[0021] In a third aspect, a display panel is provided, comprising a circuit backplane in any possible implementation of the circuit backplane design of the first aspect and the second aspect, wherein the backplane layer is a glass backplane, and the display panel further comprises: a pixel layer, comprising a plurality of pixels, the pixels being located in a first cavity, or the pixel layer belongs to a first cavity array layer, the first cavity being located between two adjacent pixels, or the pixel layer being located on the side of the first diaphragm layer facing away from the first surface.

[0022] In combination with the third aspect, in some implementations of the third aspect, the glass back panel includes a plurality of columns, and a first distance is spaced between two adjacent columns.

[0023] In combination with the third aspect, in certain implementations of the third aspect, the glass back panel includes a plurality of through-glass holes, and the through-glass holes are connected to the first chamber.

[0024] In a fourth aspect, an electronic device is provided, comprising a display panel in any possible implementation of the display panel design of the third aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic structural diagram of a circuit backplane 100 proposed in an embodiment of the present application;

[0026] Figure 2 is a structural schematic diagram of another circuit backplane 100 proposed in an embodiment of the present application;

[0027] Figure 3 is a structural schematic diagram of another circuit backplane 100 proposed in an embodiment of the present application;

[0028] Figure 4 is a structural schematic diagram of another circuit backplane 100 proposed in an embodiment of the present application;

[0029] Figure 5 is a structural schematic diagram of another circuit backplane 100 proposed in an embodiment of the present application;

[0030] Figure 6 is a structural schematic diagram of another circuit backplane 100 proposed in an embodiment of the present application;

[0031] Figure 7is a structural schematic diagram of another circuit backplane 100 proposed in an embodiment of the present application;

[0032] Figure 8 is a schematic diagram of a vibration array element proposed in an embodiment of the present application;

[0033] Fig. 9 is a schematic structural diagram of a display panel 900 proposed in an embodiment of the present application;

[0034] Fig.10 is a structural schematic diagram of another display panel 900 proposed in an embodiment of the present application;

[0035] Fig.11 is a schematic structural diagram of another display panel 900 proposed in an embodiment of the present application;

[0036] Fig.12 is a structural schematic diagram of another display panel 900 proposed in an embodiment of the present application;

[0037] Fig.13 is a structural schematic diagram of another display panel 900 proposed in an embodiment of the present application;

[0038] Fig.14 It is a schematic diagram of a preparation process of a display panel 900 proposed in an embodiment of the present application. DETAILED DESCRIPTION

[0039] The technical solution in this application will be described below in conjunction with the accompanying drawings.

[0040] The embodiments of the present application will present various aspects, embodiments or features around a system including multiple devices, components, modules, etc. It should be understood and appreciated that each system may include additional devices, components, modules, etc., and / or may not include all devices, components, modules, etc. discussed in conjunction with the figures. In addition, combinations of these schemes may also be used.

[0041] In addition, in the embodiments of the present application, words such as "exemplary" and "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplary" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of the word "exemplary" is intended to present concepts in a concrete way.

[0042] The business scenarios described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Ordinary technicians in this field can know that with the evolution of technology and the emergence of new business scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0043] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0044] In the embodiments of the present application, "at least one" refers to one or more, and "plurality" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can be represented by: including the existence of A alone, the existence of A and B at the same time, and the existence of B alone, where A and B can be singular or plural. The character " / " generally indicates that the previous and subsequent associated objects are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can be represented by: a, b, c, ab, ac, bc, or abc, where a, b, c can be single or multiple.

[0045] In the description of the embodiments of the present application, the directions or positional relationships indicated by terms such as "up", "down", "left", "right", "inside", "outside", "vertical" and "horizontal" are defined relative to the directions or positions of the components schematically placed in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, rather than indicating or implying that the device or component referred to must have a specific direction, or be constructed and operated in a specific direction. They may change accordingly according to changes in the directions of the components placed in the drawings, and therefore cannot be understood as limitations on the present application.

[0046] In the embodiments of the present application, the same reference numerals are used to represent the same components or parts. For the same parts in the embodiments of the present application, only one of the parts or parts may be marked with a reference numeral in the figure. It should be understood that the reference numerals are also applicable to other identical parts or parts. In addition, the various parts in the drawings are not drawn to scale, and the sizes and dimensions of the parts shown in the drawings are only exemplary and should not be understood as limiting the present application.

[0047] As the power of electronic components continues to increase, the performance of electronic equipment has been greatly improved, but this has also led to the heat dissipation problem of electronic equipment becoming more prominent. When electronic equipment is running, excessively high temperatures will affect the performance of electronic components, such as reducing the life of capacitors and resistors, degrading the performance of transformers and insulation materials, and causing transistor failure. In addition, excessively high temperatures can also cause damage to electronic equipment, thermal aging of materials, cracking of low-melting-point welds, solder joint shedding, reduced mechanical strength, and other problems, which directly affect product quality. It can be seen that circuit backplane heat dissipation is of great significance to ensuring stable operation of equipment, extending equipment service life, and improving product quality.

[0048] In view of this, the embodiments of the present application propose a circuit backplane, a display panel and an electronic device, so that the circuit backplane can have a stronger heat dissipation capability, thereby ensuring the stable operation of the circuit backplane and extending the service life of the electronic device.

[0049] Figure 1 It is a structural schematic diagram of a circuit backplane 100 proposed in an embodiment of the present application. Figure 1 is a side cross-sectional view of the circuit backplane 100 .

[0050] refer to Figure 1 As shown, the circuit backplane 100 includes:

[0051] Back plate layer 110;

[0052] A first chamber array layer 120 includes a plurality of first chambers 121 . The first chamber array layer 120 covers the first surface 111 of the backplane layer 110 .

[0053] The first diaphragm layer 130 is located on a side of the first cavity array layer 120 away from the first surface 111 . The first diaphragm layer 130 includes a first vibration film 131 . The first vibration film 131 is configured to vibrate based on an alternating electric field.

[0054] In some possible embodiments, the plurality of first chambers 121 may be arranged in a plurality of rows and columns to form a film layer composed of the first chambers 121, namely, a first chamber array layer 120. The plane corresponding to the first chamber array layer 120 is parallel to the first surface 111.

[0055] In some possible embodiments, the first chamber array layer 120 covers the first surface 111 of the backplane layer 110, which may mean that the first chamber array layer 120 covers at least a portion of the first surface 111 of the backplane layer 110. In addition, the first chamber array layer 120 may be in direct contact with the first surface 111, and other film layers, such as an adhesive layer, may be present between the first chamber array layer 120 and the first surface 111.

[0056] In some possible embodiments, the number of first chambers 121 included in the first chamber array layer 120 and the number of rows and columns in which the plurality of first chambers 121 are arranged are related to the effective area of ​​the backplane layer 110. The effective area of ​​the backplane layer 110 refers to the area of ​​the first surface 111 of the backplane layer 110 corresponding to the electronic components.

[0057] In some possible embodiments, the first vibration film 131 includes a piezoelectric material, which can convert mechanical pressure into a charge signal or convert an electric field into a mechanical motion, thereby realizing the function of the first vibration film 131 vibrating based on an alternating electric field.

[0058] For example, the first vibration film 131 may include a piezoelectric polymer, such as polyvinylidene fluoride (PVDF), or a PVDF copolymer, such as polyvinylidene fluoride-trifluoroethylene (poly(vinylidene fluoride-trifluoroethylene)), etc., so that the first vibration film 131 has good thermal conductivity and transparency. The thickness of the first vibration film 131 may be in the range of [10 μm, 50 μm].

[0059] During the vibration of the first vibration film 131 based on the AC electric field, the entire first diaphragm layer 130 will be driven to vibrate, and then the vibration will be transmitted to the first chamber array layer 120, so that the multiple first chambers 121 in the first chamber array layer 120 will also vibrate. Since the first chamber 121 is a hollow structure, the influence of the vibration can be further enhanced, that is, the multiple first chambers 121 can vibrate with a larger amplitude, which helps to take away the heat from the back plate layer 110 and / or other circuit parts.

[0060] Based on the above technical solution, by introducing the first chamber array layer 120 and the first diaphragm layer 130 into the circuit backplane 100, based on the vibration effect of the first diaphragm layer 130 and the vibration amplification effect of the first chamber array layer 120, the heat dissipation performance of the circuit backplane 100 is improved.

[0061] In some possible embodiments, reference Figure 1 As shown, the first diaphragm layer 130 further includes: a first electrode layer 132 and a second electrode layer 133 , wherein the first vibration film 131 is located between the first electrode layer 132 and the second electrode layer 133 , and the second electrode layer 133 is located on a side of the first vibration film 131 close to the first chamber array layer 120 .

[0062] In some possible embodiments, the first electrode layer 132 and the second electrode layer 133 are used to provide an alternating electric field for the first vibration film 131 .

[0063] For example, the first electrode layer 132 can be used to receive an AC voltage, i.e., connected to an AC power source, and the second electrode layer 133 can be used for grounding; or, the first electrode layer 132 can be used for grounding, and the second electrode layer 133 can be used to receive an AC voltage, i.e., connected to an AC power source.

[0064] For example, the first electrode layer 132 and the second electrode layer 133 may include indium tin oxide (ITO), so that the first electrode layer 132 and the second electrode layer 133 have good conductivity and transparency. The thickness of the first electrode layer 132 and the second electrode layer 133 may be in the range of [0.1 μm, 0.2 μm].

[0065] In some possible embodiments, the surface of the first electrode layer 132 and / or the second electrode layer 133 may be patterned, and accordingly, the surface of the first vibration film 131 may also be patterned, thereby helping to improve the electrical performance of the first vibration film layer 130 .

[0066] In some possible embodiments, reference Figure 1 As shown, the first electrode layer 132 includes a plurality of first electrodes 1321 , and a vertical projection of the first electrode 1321 to the first chamber array layer 120 is located in the first chamber 121 .

[0067] In some possible embodiments, when the number of the first chambers 121 is N, N is greater than 1, and the number of the first electrodes 1321 may also be N.

[0068] In the above Figure 1 In the film layer structure shown, a first electrode 1321 corresponds to a designated first chamber 121, and the first electrode 1321, the first vibration film 131, the second electrode layer 133 and the first chamber 121 are arranged in a Figure 1 The projections in the vertical direction overlap, so in the vertical direction, the part of the membrane structure from the first electrode 1321 to the first chamber 121 constitutes a vibration array element. Multiple first electrodes 1321 correspond to multiple first chambers 121 one by one, thereby forming multiple vibration array elements. Driven by the AC voltage, the multiple vibration array elements vibrate to take away the heat from the back plate layer 110 and / or other circuit parts. Moreover, the voltage difference between the multiple first electrodes 1321 can be controlled within a very small range, so the difference in vibration intensity between the multiple vibration array elements is small.

[0069] In some possible embodiments, the second electrode layer 133 and the first chamber array layer 120 may be fixed by an adhesive layer, and the adhesive layer may be a film adhesive, and the thickness of the adhesive layer may be in the range of [50 μm, 100 μm], or in the range of [10 μm, 20 μm]; or the second electrode layer 133 and the first chamber array layer 120 may also be fixed by chemical bonding.

[0070] Based on the above technical solution, the first electrode layer 132 is designed to include a structure of multiple independent first electrodes 1321, and the first electrodes 1321 correspond to the first chamber 121 and constitute a vibration array element, so that the vibration intensity distribution of the multiple chambers 121 is more uniform, which helps to further enhance the heat dissipation performance of the circuit backplane 100.

[0071] In some possible embodiments, reference Figure 1 As shown, the circuit backplane 100 may further include: a third electrode layer 160, the third electrode layer 160 includes a plurality of second electrodes 161, the second electrode 161 is located in the first chamber 121 of the first chamber array layer 120; at this time, the third electrode layer 160 is configured to receive a DC voltage, and the first electrode layer 132 is configured to receive an AC voltage.

[0072] In some possible embodiments, in the circuit backplane 100 including the third electrode layer 160 , the second electrode layer 133 may be configured to be grounded, or the second electrode layer 133 may be removed from the first diaphragm layer 130 .

[0073] In some possible embodiments, when the number of the first chambers 121 is N, N is greater than 1, and the number of the second electrodes 161 may also be N. It can be seen that any first electrode 1321 may correspond to a specified first chamber 121, and accordingly, since the second electrode 161 is also provided in the first chamber 121, any first electrode 1321 may also correspond to a specified second electrode 161. Based on this, the vibration array element mentioned above may further include a second electrode 161.

[0074] In the above Figure 1 Under the membrane layer architecture shown, the DC voltage received by the third electrode layer 160 can be understood as a DC bias voltage. Under the excitation of the DC bias voltage, the first vibration film 131 is deformed in the initial vibration state, thereby further increasing the vibration amplitude of the first vibration film 131, thereby increasing the vibration intensity of the first vibration membrane layer 130.

[0075] Based on the above technical solution, by introducing the third electrode layer 160 into the first diaphragm layer 130 , the vibration intensity of the first diaphragm layer 130 can be further increased, thereby further enhancing the heat dissipation performance of the circuit backplane 100 .

[0076] Figure 2 It is a structural schematic diagram of another circuit backplane 100 proposed in an embodiment of the present application. Figure 2 is a side cross-sectional view of the circuit backplane 100 .

[0077] In some possible embodiments, reference Figure 2 As shown, compared to Figure 1 The circuit backplane 100 shown in FIG. Figure 2 In the circuit backplane 100 shown, the first diaphragm layer 130 further includes a plurality of first through holes 134 , wherein the first through holes 134 are in communication with the first chamber 121 .

[0078] In some possible embodiments, when the number of the first chambers 121 is N, N is greater than 1, and the number of the first through holes 134 may also be N, that is, the plurality of first through holes 134 may correspond one-to-one to the plurality of first chambers 121 .

[0079] Taking a vibration array element as an example, based on the above Figure 2 The circuit backplane 100 shown in the figure may include a first through hole 134, and when the first vibration film 131 vibrates based on the AC electric field, the entire vibration element is driven to vibrate. Based on the first through hole 134, the hot air inside the first chamber 121 can be squeezed out of the membrane structure of the entire circuit backplane 100 through the first through hole 134, thereby further increasing the heat dissipation rate.

[0080] Figure 3 It is a structural schematic diagram of another circuit backplane 100 proposed in an embodiment of the present application. Figure 3 is a side cross-sectional view of the circuit backplane 100 .

[0081] In some possible embodiments, in the circuit backplane 100, two adjacent first chambers 121 may be separated by a barrier wall 101. Figure 3 As shown, compared to Figure 1 The circuit backplane 100 shown in FIG. Figure 3 In the circuit back plate 100 shown, the first diaphragm layer 130 may further include a plurality of first through holes 134 , and the first through holes 134 penetrate through the retaining wall 101 .

[0082] In some possible embodiments, the first through hole 134 may eventually be connected to the outside of the film layer structure of the entire circuit backplane 100 .

[0083] Figure 4It is a structural schematic diagram of another circuit backplane 100 proposed in an embodiment of the present application. Figure 5 It is a structural schematic diagram of another circuit backplane 100 proposed in an embodiment of the present application. Figure 4 and Figure 5 They are side cross-sectional views of the circuit backplane 100 .

[0084] In some possible embodiments, reference Figure 4 or Figure 5 As shown, compared to Figure 2 or Figure 3 The circuit backplane 100 shown, Figure 4 or Figure 5 The circuit backplane 100 shown also includes: a base layer 140, which is located between the first chamber array layer 120 and the backplane layer 110; a plurality of support portions 150, wherein the first end of the support portion 150 is fixed to the first surface 111, and the second end of the support portion 150 is fixed to the base layer 140; wherein the base layer 140 includes a plurality of second through holes 141, which are connected to the above-mentioned first through holes 134.

[0085] Among them, reference Figure 4 As shown, the second through hole 141 is connected with the first through hole 134 , which means that the first through hole 134 and the second through hole 141 are connected with the same first chamber 121 , thereby achieving the connection between the second through hole 141 and the first through hole 134 .

[0086] In some possible embodiments, reference Figure 4 As shown, two adjacent first chambers 121 may also be connected via the third through hole 123 .

[0087] The through hole disposed between two adjacent first chambers 121 in the embodiment of the present application can be understood as a lateral through hole of the circuit back plate 100 , and the first through hole 134 and the second through hole 141 can be understood as a longitudinal through hole of the circuit back plate 100 .

[0088] In addition, reference Figure 5 As shown, the second through hole 141 is connected with the first through hole 134 , which means that one end of the first through hole 134 is directly connected with one end of the second through hole 141 , so as to realize the connection between the second through hole 141 and the first through hole 134 .

[0089] In some possible embodiments, reference Figure 5 As shown, two adjacent first chambers 121 may also be connected via the third through hole 123 .

[0090] Since the second through hole 141 is connected to the first through hole 134, and the base layer 140 and the backplane layer 110 are supported by the support part 150, a gap including a suspended part is formed between the base layer 140 and the backplane layer 110. The gap can be connected to the outside of the entire membrane structure of the circuit backplane 100, that is, it presents an open structure. Therefore, based on the membrane structure, the fluidity of the hot air inside the membrane structure can be increased, and the hot air can be directly driven by vibration to form an airflow, and flow out of the membrane structure through the above-mentioned first through hole 134 and the second through hole 141.

[0091] In some possible embodiments, the plurality of support portions 150 and the back panel layer 110 may also be fixed via an adhesive layer, and the adhesive layer may be a film adhesive.

[0092] In some possible embodiments, the diameter of the air inlet of the second through hole 141 may be consistent with the diameter of the air outlet of the first through hole 134 .

[0093] Based on the above technical solution, the flowability of the airflow in the film layer structure of the circuit back plate 100 can be enhanced, thereby further enhancing the heat dissipation performance of the circuit back plate 100 .

[0094] Figure 6 It is a structural schematic diagram of another circuit backplane 100 proposed in an embodiment of the present application. Figure 6 is a top perspective view of the circuit backplane 100 .

[0095] In some possible embodiments, reference Figure 6 As shown, two adjacent first chambers 121 may be connected by one or more other through holes, and the extension direction of the other holes may be different from the extension direction of the third through hole 123 .

[0096] refer to Figure 6 As shown in (a), the first through hole 134 and the second through hole 141 are connected through the first chamber 121, corresponding to Figure 4 The circuit backplane 100 is shown. Figure 6 As can be seen from (b) in FIG. 1 , the first through hole 134 is directly connected to the second through hole 141 by penetrating the retaining wall 101 .

[0097] In some possible embodiments, the one or more other through holes and the third through hole 123 may be connected to each other.

[0098] Based on the above technical solution, by setting at least one lateral through hole between the first chambers 121, the connectivity between the film layer structures of the circuit backplane 100 is further enhanced, which in turn helps to increase the flow of hot air inside the film layer structure, further enhancing the heat dissipation performance of the circuit backplane 100.

[0099] In some possible embodiments, refer to the above Figures 2 to 5 , the first through hole 134 can be a tapered hole.

[0100] The shape feature of the tapered hole is that its aperture gradually decreases from one end to the other end, usually forming a cone-like structure, wherein the aperture change of the tapered hole can be linear or nonlinear.

[0101] Based on the characteristics of the hot and cold cycle of the airflow, during the operation of the circuit backplane 100, a temperature difference will be caused in the environment around the circuit backplane 100, thereby generating the phenomenon of hot and cold cycle of the airflow. Under the vibration drive of the first diaphragm layer, the airflow can be directed in the through hole of the circuit backplane 100, and the flow direction can be affected by the aperture of the through hole. Taking the tapered hole as an example, the airflow is more likely to flow in from the opening with the largest aperture in the tapered hole, so the opening with the largest aperture in the tapered hole is defined as the air inlet, and the opening with the smallest aperture in the tapered hole is defined as the air outlet. According to the law of conservation of mass in fluid flow, when the airflow passes through the tapered hole, the airflow velocity will increase to maintain mass conservation due to the gradual reduction of the aperture of the through hole. Therefore, as the airflow flows from the air inlet of the tapered hole to the air outlet, the flow velocity of the airflow will gradually increase, and then the airflow pressure will gradually decrease, making it easier for the airflow to flow from the air inlet to the air outlet, and achieving continuous flow of the airflow.

[0102] In some possible embodiments, since the second through hole 141 is connected to the first through hole 134, in order to further ensure the smoothness of the air flow through the second through hole 141 and the first through hole 134, when the first through hole 134 is a tapered hole, the second through hole 141 is also a tapered hole, and the air outlet of the first through hole 134 and the air inlet of the second through hole 141 are arranged in the first chamber 121 (see Figure 4 As shown), or the air outlet of the first through hole 134 is connected to the air inlet of the second through hole 141 (see Figure 5 shown).

[0103] In some possible embodiments, the third through hole 123 may also be a tapered hole.

[0104] In practical applications, the orientations and locations of the air inlets and outlets of the various through holes mentioned above can be adaptively adjusted according to different circuit designs and thermal cycle designs, which are not listed in detail in the embodiments of the present application.

[0105] In some possible embodiments, the electronic device to which the circuit back plate 100 is applied may further include a fan to further enhance the airflow flowing through the through holes of the circuit back plate 100 .

[0106] Based on the above technical solution, by designing the through holes as tapered holes, the airflow in the circuit backplane 100 is further enhanced, so that hot air can flow out of the circuit backplane 100 faster, thereby further enhancing the heat dissipation performance of the circuit backplane 100.

[0107] Figure 7 It is a structural schematic diagram of another circuit backplane 100 proposed in an embodiment of the present application. Figure 7 is a side cross-sectional view of the circuit backplane 100 .

[0108] In some possible embodiments, reference Figure 7 As shown, the circuit backplane 100 includes:

[0109] Back plate layer 110;

[0110] A second diaphragm layer 170 , the second diaphragm layer 170 covers the first surface 111 of the back plate layer 110 , the second diaphragm layer includes a second vibration film 171 , and the second vibration film 171 is configured to vibrate based on an alternating electric field;

[0111] A second chamber array layer 180 includes a plurality of second chambers 181 . The second chamber array layer 180 is located on a side of the second diaphragm layer 170 away from the first surface 111 .

[0112] The base layer 140 is located on a side of the second chamber array layer 180 away from the first surface 111;

[0113] A first chamber array layer 120 including a plurality of first chambers 121 , wherein the first chamber array layer 120 is located on a side of the base layer 140 away from the first surface 111 ;

[0114] The first diaphragm layer 130 is located on a side of the first cavity array layer 120 away from the first surface 111 . The first diaphragm layer 130 includes a first vibration film 131 . The first vibration film 131 is configured to vibrate based on an alternating electric field.

[0115] Among them, the operating principle of the second diaphragm layer 170 is the same as the operating principle of the first diaphragm layer 130, and the operating principle of the second chamber array layer 180 is the same as the operating principle of the first chamber array layer 120. For detailed expansion examples of the second diaphragm layer 170 and the second chamber array layer 180, please refer to the aforementioned expansion examples of the first diaphragm layer 130 and the first chamber array layer 120, which will not be repeated here.

[0116] Based on the above technical solution, two layers of chamber arrays (first chamber array layer 120 and second chamber array layer 180) are introduced into the circuit backplane 100, and two vibration films (first vibration film 131 and second vibration film 171) are introduced, which increases the number of chambers inside the circuit backplane 100 and increases the overall vibration strength of the membrane structure, thereby improving the heat dissipation performance of the circuit backplane 100.

[0117] In some possible embodiments, reference Figure 7 As shown, the second diaphragm layer 170 further includes a fourth electrode layer 172 , which is located on a side of the second diaphragm 171 close to the first surface 111 ; the first diaphragm layer 130 further includes a first electrode layer 132 , which is located on a side of the first diaphragm 131 away from the first surface 111 .

[0118] In some possible embodiments, the fourth electrode layer 172 and the back plate layer 110 may also be supported by a plurality of support portions 150 to form a hollow structure, thereby further enhancing the flow of air.

[0119] Figure 8 It is a schematic diagram of a vibration array element proposed in an embodiment of the present application. Figure 8 is a lateral cross-sectional view of a vibration array element, which belongs to Figure 7 The film structure shown.

[0120] In some possible embodiments, reference Figure 8 As shown, a vibration array element includes: a first diaphragm layer 130, a first chamber 121, a base layer 140, a second chamber 181 and a second diaphragm layer 170, wherein the base layer 140 is configured to receive a DC voltage and an AC voltage, wherein the DC voltage may be a DC bias voltage.

[0121] Correspondingly, the first electrode layer 132 of the first diaphragm layer 130 and the fourth electrode layer 172 of the second diaphragm layer 170 can be grounded. Based on the circuit architecture, when the base layer 140 is connected to direct current, the first diaphragm layer 130 and the second diaphragm layer 170 will deform toward the base layer 140, that is, they will be recessed toward the base layer 140; when the base layer 140 is connected to alternating current, the first diaphragm layer 130 vibrates based on the first vibration film 131, and the second diaphragm layer 170 vibrates based on the second vibration film 171, and due to the influence of the DC bias voltage, the amplitudes of the first vibration film 131 and the second vibration film 171 will be larger.

[0122] In some possible embodiments, the fourth electrode layer 172 and the substrate layer 140 may be configured to be grounded, and accordingly, the first electrode layer 132 may be configured to receive a DC voltage and an AC voltage; or, the first electrode layer 132 and the substrate layer 140 may be configured to be grounded, and accordingly, the fourth electrode layer 172 may be configured to receive a DC voltage and an AC voltage; or, any two of the first diaphragm layer 130, the fourth electrode layer 172 and the substrate layer 140 may be configured to be connected to a DC voltage and an AC voltage, respectively, and the remaining conductive layer may be configured to be grounded.

[0123] Based on the above technical solution, the heat dissipation performance of the circuit backplane 100 can be further improved.

[0124] In some possible embodiments, Figures 2 to 6 Similar, reference Figure 7 As shown, the above-mentioned first diaphragm layer 130 also includes a plurality of first through holes 134, wherein the first through holes 134 are connected to the first chamber 121; the base layer 140 also includes a plurality of second through holes 141, wherein the second through holes 141 are connected to the first through holes 134; the second diaphragm layer 170 also includes a plurality of fourth through holes 174, wherein the fourth through holes 174 are connected to the second through holes 141.

[0125] In some possible embodiments, the first through hole 134, the second through hole 141 and the fourth through hole 174 are tapered holes, and the air outlet of the first through hole 134 and the air inlet of the second through hole 141 are arranged in the first chamber 121, and the air outlet of the second through hole 141 and the air inlet of the fourth through hole 174 are arranged in the second chamber 181.

[0126] In some possible embodiments, two adjacent first chambers 121 are connected via the third through hole 123 , and two adjacent second chambers 181 are connected via the fifth through hole 185 .

[0127] The first through hole 134 to the fifth through hole 185 are extended descriptions, please refer to the corresponding contents above for details, and will not be repeated here.

[0128] Based on the above technical solution, by introducing through holes in the film layer structure of the circuit back plate 100 , the heat dissipation performance of the circuit back plate 100 is further improved.

[0129] The circuit backplane 100 proposed in the embodiment of the present application can also be applied to the screen. In view of this, the embodiment of the present application also proposes a display panel, which includes any circuit backplane proposed in the embodiment of the present application, so as to increase the heat dissipation performance of the pixels in the display panel, thereby helping to extend the service life of the screen.

[0130] Fig. 9It is a schematic diagram of the structure of a display panel 900 proposed in an embodiment of the present application. Fig. 9 is a side cross-sectional view of the display panel 900 .

[0131] refer to Fig. 9 As shown, the back plate layer 110 is a glass back plate 910, and the display panel 900 further includes:

[0132] The pixel layer 920 includes a plurality of pixels 921 , wherein the pixels 921 are located in the first chamber 121 .

[0133] Taking a red green blue (RGB) pixel as an example, a pixel 921 includes three sub-pixels corresponding to red R, green G and blue B respectively.

[0134] In some possible embodiments, the number of the pixels 921 may be the same as the number of the first chambers 121 . Based on this, one pixel 921 may be disposed in one first chamber 121 .

[0135] In some possible embodiments, a first chamber 121 may also be provided with a plurality of pixels 921 .

[0136] In some possible embodiments, the pixel layer 920 may further include a plurality of pixel electrodes, each of which is connected to a pixel 921 , that is, the plurality of pixel electrodes correspond to the plurality of pixels 921 one by one, so as to realize the light-emitting function of the pixel 921 .

[0137] In some possible embodiments, the first diaphragm layer 130 may include a plurality of first through holes 134 , and the first through holes 134 are in communication with the first chamber 121 .

[0138] Fig.10 It is a schematic diagram of the structure of another display panel 900 proposed in an embodiment of the present application. Fig.10 is a side cross-sectional view of the display panel 900 .

[0139] In some possible embodiments, reference Fig.10 As shown, compared to Fig. 9 , Fig.10 The pixel layer 920 in the display panel 900 is shown located on a side of the first diaphragm layer 130 facing away from the first surface 111 .

[0140] In some possible embodiments, the first electrode layer 132 includes a plurality of first electrodes 1321, and the vertical projection of the first electrode 1321 to the first chamber array layer 120 is located in the first chamber 121. Correspondingly, the vertical projection of the plurality of pixels 921 to the first chamber array layer 120 is also located in the first chamber 121. Since the closer the vertical distance to the first electrode 1321, the greater the vibration intensity received, based on this design, the vibration intensity received by the pixel 921 can be as large as possible, thereby further enhancing the heat dissipation performance of the pixel 921.

[0141] In addition, the first diaphragm layer 130 may also include a plurality of first through holes 134 , and the first through holes 134 are connected to the first chamber 121 .

[0142] Fig.11 It is a schematic diagram of the structure of another display panel 900 proposed in an embodiment of the present application. Fig.12 It is a schematic diagram of the structure of another display panel 900 proposed in an embodiment of the present application. Fig.11 and Fig.12 is a side cross-sectional view of the display panel 900 .

[0143] in, Fig.11 The display panel 900 shown is based on Fig. 9 The structure of the display panel 900 shown is deformed. Fig.12 The display panel 900 shown is a Fig.10 The structure of the display panel 900 shown is deformed.

[0144] In some possible embodiments, reference Fig.11 As shown, the glass back plate 910 includes a plurality of columns 911 , and a first distance is spaced between two adjacent columns 911 .

[0145] In some possible embodiments, the first chamber array layer 120 or the pixel layer 920 and the plurality of pillars 911 may be fixed by an adhesive layer or by chemical bonding.

[0146] In some possible embodiments, the second electrode layer 133 may also include a plurality of electrodes 1331 , and vertical projections of the plurality of electrodes 1331 onto the glass back plate 910 are located in the interval between two adjacent columns 911 on the glass back plate 910 .

[0147] In some possible embodiments, for Fig.11 The display panel 900 shown in the figure can eliminate the first cavity array layer 120 , and based on this solution, the thickness of the display panel 900 can be further reduced.

[0148] In some possible embodiments, reference Fig.12As shown, the glass back plate 910 includes a plurality of through-glass holes 912 , and the through-glass holes 912 are connected to the first chamber 121 , and further connected to the first through-holes 134 .

[0149] In some possible embodiments, the through glass hole 912 may also be a tapered hole.

[0150] In some possible embodiments, Fig.12 The glass back panel 910 of the display panel 900 shown in the figure can also be replaced by Fig.11 The structure shown includes a plurality of pillars 911 .

[0151] Fig.13 It is a schematic diagram of the structure of another display panel 900 proposed in an embodiment of the present application. Fig.13 is a side cross-sectional view of the display panel 900 .

[0152] In some possible embodiments, reference Fig.13 As shown, compared to Fig. 9 , Fig.13 The pixel layer 920 in the illustrated display panel 900 belongs to the first chamber array layer 120 .

[0153] The pixels 921 in the pixel layer 920 can be used as the retaining wall 101 of the first cavity 121, so the gap between two adjacent pixels 921 forms the first cavity 121. Based on this solution, the thickness of the display panel 900 can be further reduced.

[0154] In some possible embodiments, Fig.13 The glass back plate 910 of the display panel 900 shown may also be made into the above-mentioned structure including a plurality of columns.

[0155] In addition, the embodiments of the present application are Fig.10 Taking the display panel 900 shown as an example, a method for preparing the display panel 900 is provided. Based on the preparation method, the display panel 900 including the first cavity 121 and various through holes is prepared.

[0156] Fig.14 Schematic diagram of a manufacturing process of a display panel 900 proposed in an embodiment of the present application. The process can be used to prepare the above Fig.12 The display panel 900 shown in the figure can adaptively adjust the preparation process flow for display panels 900 of other structures or for the preparation of any circuit backplane 100 proposed in the embodiment of the present application.

[0157] refer to Fig.14 As shown, before the preparation process starts, a glass back panel needs to be obtained. The preparation process includes:

[0158] S1410: depositing a sacrificial layer on the glass backplane.

[0159] The sacrificial layer includes a plurality of metal blocks, and the metal blocks are spaced apart by a preset distance.

[0160] In some possible embodiments, the metal block may be a patterned metal block.

[0161] S1420: depositing an intermediate layer on the plurality of metal blocks and in intervals between the metal blocks, and partially reserving a first hole in the intermediate layer deposited on each metal block.

[0162] The intermediate layer may be silicon nitride (SiNx).

[0163] S1430: Etching a plurality of metal blocks through the first reserved holes to form a plurality of chambers.

[0164] For example, a first etching solution may be poured from the first reserved hole, and the first etching solution is used to etch the metal block.

[0165] S1440: Seal the first reserved hole.

[0166] For example, before executing S1440 , the first etching solution and residual metal may be cleaned.

[0167] For example, the first reserved hole may be sealed by continuously depositing an intermediate layer or spin-coating an organic material.

[0168] After etching, the metal block is removed and the middle layer is retained, and the middle layer can form a chamber (such as the first chamber). The middle layer deposited on the metal block is the top of the chamber, and the middle layer deposited in the interval between the metal blocks is the side wall of the chamber.

[0169] S1450: depositing a second electrode layer, a first vibration film and a first electrode layer on the middle layer and performing patterning, and setting a plurality of second reserved holes during the patterning process, wherein the positions of the plurality of second reserved holes correspond one-to-one to the positions of the plurality of chambers.

[0170] The second reserved hole is a blind hole, and the bottom of the hole is the capping of the above-mentioned chamber.

[0171] S1460: depositing an insulating layer on the first electrode layer and in the reserved holes.

[0172] The insulating layer is made of the same material as the intermediate layer, which may be SiNx.

[0173] S1470: depositing a plurality of pixel electrodes on the insulating layer, and depositing pixels on the pixel electrodes.

[0174] S1480: Etching the position of the first second reserved hole, and the etching depth reaches the above-mentioned chamber.

[0175] S1490: drilling holes in the glass back panel to form a plurality of through-glass holes, wherein the through-glass holes are connected to the above-mentioned chamber.

[0176] Based on the above preparation process, the above Fig.12 The display panel 900 shown has good heat dissipation performance.

[0177] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0178] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0179] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A circuit backplane, characterized in that: include: Backing layer; A first chamber array layer, comprising a plurality of first chambers, wherein the first chamber array layer covers a first surface of the backplane layer; A first diaphragm layer, wherein the first diaphragm layer is located on a side of the first chamber array layer away from the first surface, the first diaphragm layer comprises a first vibration film, and the first vibration film is configured to vibrate based on an alternating electric field.

2. The circuit backplane according to claim 1, characterized in that: The first diaphragm layer further includes a first electrode layer and a second electrode layer. The first vibration film is located between the first electrode layer and the second electrode layer. The second electrode layer is located on a side of the first vibration film close to the first chamber array layer.

3. The circuit backplane according to claim 1 or 2, characterized in that: The first diaphragm layer further includes a plurality of first through holes, and the first through holes are connected to the first chamber.

4. The circuit backplane according to claim 1 or 2, characterized in that: Two adjacent first chambers are separated by a retaining wall, and the first diaphragm layer further includes a plurality of first through holes, and the first through holes penetrate the retaining wall.

5. The circuit backplane according to claim 3 or 4, characterized in that: The circuit backplane also includes: A base layer, the base layer is located between the first chamber array layer and the back plate layer; A plurality of support parts, wherein a first end of each support part is fixed to the first surface, and a second end of each support part is fixed to the base layer; Wherein, the base layer includes a plurality of second through holes, and the second through holes are connected to the first through holes.

6. The circuit backplane according to any one of claims 3 to 5, characterized in that: The first through hole is a tapered hole.

7. The circuit backplane according to claim 5, characterized in that: The first through hole and the second through hole are tapered holes, and the air outlet of the first through hole and the air inlet of the second through hole are arranged in the first chamber, or the air outlet of the first through hole and the air inlet of the second through hole are butted against each other.

8. The circuit backplane according to any one of claims 1 to 7, characterized in that: Two adjacent first chambers are connected via a third through hole.

9. The circuit backplane according to any one of claims 2 to 8, characterized in that: The first electrode layer includes a plurality of first electrodes, and vertical projections of the first electrodes to the first chamber array layer are located in the first chamber.

10. The circuit backplane according to any one of claims 2 to 9, characterized in that: The circuit backplane also includes: The third electrode layer includes a plurality of second electrodes, wherein the second electrodes are located in the first chamber, the third electrode layer is configured to receive a direct current voltage, and the first electrode layer is configured to receive an alternating current voltage.

11. A circuit backplane, characterized in that: include: Back plate layer; a second diaphragm layer, the second diaphragm layer covering the first surface of the back plate layer, the second diaphragm layer comprising a second diaphragm film, and the second diaphragm film is configured to vibrate based on an alternating electric field; A second chamber array layer, comprising a plurality of second chambers, wherein the second chamber array layer is located on a side of the second diaphragm layer away from the first surface; a base layer, located on a side of the second chamber array layer facing away from the first surface; A first chamber array layer, comprising a plurality of first chambers, wherein the first chamber array layer is located on a side of the base layer away from the first surface; A first diaphragm layer, wherein the first diaphragm layer is located on a side of the first chamber array layer away from the first surface, the first diaphragm layer comprises a first vibration film, and the first vibration film is configured to vibrate based on an alternating electric field.

12. The circuit backplane according to claim 11, characterized in that: The second vibration membrane layer further includes a fourth electrode layer, and the fourth electrode layer is located on a side of the second vibration film close to the first surface; The first vibration membrane layer further includes a first electrode layer, and the first electrode layer is located on a side of the first vibration film away from the first surface.

13. The circuit backplane according to claim 12, characterized in that: The first diaphragm layer further includes a plurality of first through holes, wherein the first through holes are connected to the first chamber; The base layer further includes a plurality of second through holes, wherein the second through holes are connected to the first through holes; The second diaphragm layer further includes a plurality of fourth through holes, and the fourth through holes are connected to the second through holes.

14. The circuit backplane according to claim 13, characterized in that: The first through hole, the second through hole and the fourth through hole are tapered holes, and the air outlet of the first through hole and the air inlet of the second through hole are arranged in the first chamber, and the air outlet of the second through hole and the air inlet of the fourth through hole are arranged in the second chamber.

15. The circuit backplane according to any one of claims 11 to 14, characterized in that: Two adjacent first chambers are connected via a third through hole, and two adjacent second chambers are connected via a fifth through hole.

16. The circuit backplane according to any one of claims 11 to 15, characterized in that: The substrate layer is configured to receive a direct current voltage and an alternating current voltage.

17. A display panel, characterized in that: The circuit backplane according to any one of claims 1 to 16, wherein the backplane layer is a glass backplane, and the display panel further comprises: A pixel layer includes a plurality of pixels, wherein the pixels are located in the first cavity, or the pixel layer belongs to the first cavity array layer, and the first cavity is located between two adjacent pixels, or the pixel layer is located on a side of the first diaphragm layer away from the first surface.

18. The display panel according to claim 17, characterized in that: The glass back plate includes a plurality of columns, and a first distance is spaced between two adjacent columns.

19. The display panel according to claim 17, characterized in that: The glass back plate includes a plurality of through-glass holes, and the through-glass holes are connected to the first cavity.

20. An electronic device, characterized in that: Comprising the display panel as claimed in any one of claims 17 to 19.

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