Ultra-flexible encapsulation structure of perovskite photoelectric component and encapsulation method and application thereof

Abstract

The application belongs to the technical field of photovoltaic cells, and relates to a super-flexible packaging structure of a perovskite photoelectric assembly, a packaging method thereof and application, the super-flexible packaging structure comprising a first packaging assembly and a second packaging assembly arranged on two side surfaces of a flexible module respectively; wherein the first packaging assembly comprises a cloth-based substrate, a first adhesive film and a first inorganic barrier layer arranged in layers; the second packaging assembly comprises a polymer film, a second adhesive film and a second inorganic barrier layer arranged in layers; the first inorganic barrier layer and the second inorganic barrier layer are arranged on the two side surfaces of the flexible module respectively; and the flexible module is a perovskite module prepared based on a flexible conductive substrate. The super-flexible packaging structure provided by the application significantly improves the flexibility, foldability and portability of the packaging structure while ensuring that the water and oxygen barrier property and weather resistance of the super-flexible packaging structure are at an excellent level through the synergistic effect between the inorganic barrier layer and the adhesive film.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of photovoltaic cells, and relates to a perovskite photoelectric assembly, in particular to an ultra-flexible packaging structure of a perovskite photoelectric assembly and an encapsulation method and application thereof. BACKGROUND

[0002] Perovskite photovoltaic cells have shown great commercial application potential due to their excellent theoretical photoelectric conversion efficiency, simple preparation process and flexible preparation characteristics, especially in the fields of wearable devices and portable photovoltaic devices. However, the sensitivity of perovskite materials to water and oxygen and the insufficient stability of perovskite materials themselves have put forward more stringent requirements for packaging technology.

[0003] At present, the packaging technology of perovskite photovoltaic assemblies mainly includes rigid packaging and flexible packaging. The rigid packaging usually includes cover glass, substrate glass, edge sealant, adhesive film and module active layer (including transparent electrode, electron transport layer, perovskite layer, hole transport layer, metal electrode and other functional layers). In contrast, the flexible packaging includes double-layer water and oxygen barrier film / layer (such as polymer water and oxygen barrier film or flexible glass layer), adhesive film (such as POE, EVA, PVB film, etc.), edge sealant (mainly butyl rubber) and flexible module (i.e. a photovoltaic assembly in which the perovskite active layer is constructed on a flexible conductive substrate).

[0004] However, the rigid packaging is not suitable for the field of wearable devices due to its limited portability. Although the commonly used water and oxygen barrier film in the flexible packaging is made of PET, PEN, CPI or their composite materials, it still needs to balance the weather resistance, water and oxygen barrier property, flexibility, foldability and portability, which are still insufficient in practical application. In addition, the flexible glass needs to be improved in terms of lightness and bending resistance, thereby affecting the user experience of the flexible perovskite photovoltaic product.

[0005] Therefore, how to provide an encapsulation method of a perovskite photoelectric assembly, which can ensure that the water and oxygen barrier property and the weather resistance of the perovskite photoelectric assembly are at an excellent level, and improve the flexibility, foldability and portability of the packaging structure, has become an urgent problem to be solved by those skilled in the art. SUMMARY

[0006] In view of the deficiencies of the prior art, the purpose of the present application is to provide an ultra-flexible packaging structure of a perovskite photoelectric assembly and an encapsulation method and application thereof. The ultra-flexible packaging structure can improve the flexibility, foldability and portability of the packaging structure by the synergistic effect between the inorganic barrier layer and the adhesive film while ensuring that the water and oxygen barrier property and the weather resistance of the perovskite photoelectric assembly are at an excellent level.

[0007] To achieve the purpose of the present application, the following technical solutions are adopted:

[0008] In a first aspect, the present application provides a super-flexible encapsulation structure of a perovskite photoelectric module, which comprises a first encapsulation component and a second encapsulation component respectively arranged on two side surfaces of a flexible module.

[0009] The first encapsulation component comprises a cloth-based substrate, a first adhesive film and a first inorganic barrier layer arranged in layers; the second encapsulation component comprises a polymer film, a second adhesive film and a second inorganic barrier layer arranged in layers; and the first inorganic barrier layer and the second inorganic barrier layer are respectively arranged on the two side surfaces of the flexible module.

[0010] The flexible module is a perovskite module prepared based on a flexible conductive substrate.

[0011] Compared with a traditional single encapsulation material, the super-flexible encapsulation structure provided by the present application effectively meets the stringent requirements of the perovskite photoelectric module for water and oxygen barrier properties through the synergistic effect of the inorganic barrier layer and the adhesive film due to the extremely low water and oxygen transmission rate of the inorganic barrier layer and the adhesive film. The cloth-based substrate and the polymer film have excellent flexibility and environmental stability, which significantly improves the flexibility, portability and weather resistance of the encapsulation structure, fully meets the outdoor use requirements of photovoltaic products, and improves the practicability and product competitiveness of the perovskite photoelectric module in the wearable and portable application fields.

[0012] Preferably, the material of the first inorganic barrier layer and the second inorganic barrier layer respectively independently comprises any one or a combination of at least two of a metal oxide, a non-metal oxide or a nitride, further preferably a metal oxide, and more preferably aluminum oxide.

[0013] Preferably, the thickness of the first inorganic barrier layer and the second inorganic barrier layer is respectively independently 10-50 nm.

[0014] Preferably, the first adhesive film and the second adhesive film respectively independently comprise any one of an EVA (polyethylene-polyvinyl acetate copolymer) adhesive film, a POE (polyolefin elastomer) adhesive film or a PVB (polyvinyl butyral) adhesive film.

[0015] Preferably, the thickness of the first adhesive film and the second adhesive film is respectively independently 0.01-0.7 mm.

[0016] Preferably, the polymer film comprises an ETFE (ethylene-tetrafluoroethylene copolymer) film.

[0017] Preferably, the thickness of the polymer film is 20-80 μm.

[0018] Preferably, the battery structure of the flexible module comprises a p-i-n structure or an n-i-p structure.

[0019] In a second aspect, the present application provides a packaging method of a perovskite photoelectric assembly, which is used to form the super-flexible packaging structure according to the first aspect, and the packaging method comprises the following steps:

[0020] (1) Depositing an inorganic barrier layer on both sides of the flexible module to obtain an intermediate module;

[0021] (2) Laminating the base substrate, the first adhesive film, the intermediate module, the second adhesive film and the polymer film in sequence under high temperature and vacuum to obtain the super-flexible packaging structure.

[0022] Preferably, the deposition method of the inorganic barrier layer in step (1) comprises any one of atomic layer deposition, physical vapor deposition or chemical vapor deposition, and further preferably atomic layer deposition.

[0023] Preferably, the deposition temperature of the atomic layer deposition is 100-150℃.

[0024] Preferably, the lamination temperature of the high-temperature vacuum lamination in step (2) is 100-140℃.

[0025] Preferably, the applied pressure of the high-temperature vacuum lamination in step (2) is 40-80kPa.

[0026] Preferably, the lamination time of the high-temperature vacuum lamination in step (2) is 10-30min.

[0027] In a third aspect, the present application provides a perovskite photovoltaic cell, wherein the photoelectric assembly in the perovskite photovoltaic cell comprises the super-flexible packaging structure according to the first aspect.

[0028] Compared with the prior art, the present application has the following beneficial effects:

[0029] Compared with the traditional single packaging material, the super-flexible packaging structure provided by the present application has extremely low water and oxygen permeability of the inorganic barrier layer and the adhesive film, and effectively meets the strict requirements of the perovskite photoelectric assembly on water and oxygen barrier properties through the synergistic effect between the two. The base substrate and the polymer film have excellent flexibility and environmental stability, which significantly improves the flexibility, portability and weather resistance of the packaging structure, fully meets the outdoor use requirements of photovoltaic products, and improves the practicability and product competitiveness of the perovskite photoelectric assembly in wearable and portable application fields. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 is an exploded view of the super-flexible packaging structure provided by the present application.

[0031] Wherein: 10-first encapsulation assembly; 11-cloth-based substrate; 12-first adhesive film; 13-first inorganic barrier layer; 20-second encapsulation assembly; 21-polymer film; 22-second adhesive film; 23-second inorganic barrier layer; 30-flexible module. DETAILED DESCRIPTION

[0032] The technical solutions of the present application will be further described below through specific embodiments. Those skilled in the art should understand that the embodiments are only to help understand the present application and should not be regarded as specific limitations of the present application.

[0033] Some embodiments in the present application provide a super-flexible encapsulation structure of perovskite photoelectric assembly, which comprises a first encapsulation assembly and a second encapsulation assembly respectively arranged on two side surfaces of a flexible module.

[0034] Wherein, the first encapsulation assembly comprises a cloth-based substrate, a first adhesive film and a first inorganic barrier layer arranged in layers; the second encapsulation assembly comprises a polymer film, a second adhesive film and a second inorganic barrier layer arranged in layers; and the first inorganic barrier layer and the second inorganic barrier layer are respectively arranged on the two side surfaces of the flexible module.

[0035] The flexible module is a perovskite module prepared based on a flexible conductive substrate.

[0036] Compared with the traditional single encapsulation material, the super-flexible encapsulation structure provided by the present application, by virtue of the extremely low water and oxygen permeability of the inorganic barrier layer and the adhesive film, effectively meets the stringent requirements of perovskite photoelectric assembly on water and oxygen barrier property through the synergistic effect between the two, and the cloth-based substrate and the polymer film have excellent flexibility and environmental stability, which significantly improves the flexibility, portability and weather resistance of the encapsulation structure, fully meets the outdoor use requirements of photovoltaic products, and improves the practicability and product competitiveness of perovskite photoelectric assembly in wearable and portable application fields.

[0037] It should be emphasized that the inorganic barrier layer and the adhesive film in the present application cannot be used alone: if the inorganic barrier layer is used alone, it will be easily damaged by a large amount of water and oxygen in the air, resulting in the loss of water and oxygen barrier property of the encapsulation structure; if the adhesive film is used alone, it cannot meet the water and oxygen barrier requirements of perovskite photoelectric assembly. Therefore, the inorganic barrier layer and the adhesive film are used simultaneously in the present application, and the synergistic effect between the two is used to finally significantly improve the water and oxygen barrier property of the encapsulation structure.

[0038] In some embodiments, the first and second inorganic barrier layers each independently comprise any one or a combination of at least two of a metal oxide, a non-metal oxide, or a nitride, typically but not limited to a combination of a metal oxide and a non-metal oxide, a non-metal oxide and a nitride, a metal oxide and a nitride, or a metal oxide, a non-metal oxide, and a nitride, further preferably a metal oxide, and more preferably aluminum oxide.

[0039] In some embodiments, the first and second inorganic barrier layers each independently have a thickness of 10-50 nm, such as 10 nm, 15 nm, 20 nm, 25 nm, 30 nm, 35 nm, 40 nm, 45 nm, or 50 nm, but not limited to the listed values, and other values within the range are also applicable.

[0040] In the present application, the thickness of the first and second inorganic barrier layers needs to be limited within a reasonable range. When the thickness is less than 10 nm, the water and oxygen barrier property of the encapsulation structure is significantly deteriorated; when the thickness is greater than 50 nm, it will lead to a long deposition time, and a long time in a high temperature environment is easy to cause structural damage to the perovskite module.

[0041] In some embodiments, the first and second adhesive films each independently comprise any one of an EVA (polyethylene-vinyl acetate copolymer) film, a POE (polyolefin elastomer) film, or a PVB (polyvinyl butyral) film.

[0042] In some embodiments, the first and second adhesive films each independently have a thickness of 0.01-0.7 mm, such as 0.01 mm, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, or 0.7 mm, but not limited to the listed values, and other values within the range are also applicable.

[0043] In the present application, the thickness of the first and second adhesive films is directly related to the flexibility. When the thickness is greater than 0.7 mm, the bendability of the adhesive film is not ideal.

[0044] In some embodiments, the polymer film comprises an ETFE (ethylene-tetrafluoroethylene copolymer) film.

[0045] In some embodiments, the polymer film has a thickness of 20-80 μm, such as 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, or 80 μm, but not limited to the listed values, and other values within the range are also applicable.

[0046] In some embodiments, the battery structure of the flexible module comprises a p-i-n structure or an n-i-p structure.

[0047] In the present application, the flexible module is a perovskite module prepared based on a flexible conductive substrate, which is commonly used in the art, i.e., the super-flexible packaging structure provided by the present application is applicable to any type of flexible module as long as the corresponding function of the flexible module can be achieved, and therefore the specific structure of the flexible module is not particularly limited herein.

[0048] Some embodiments of the present application also provide a packaging method for a perovskite photoelectric assembly, which is used to form the super-flexible packaging structure of any of the above embodiments, and the packaging method comprises the following steps:

[0049] (1) Depositing an inorganic barrier layer on both sides of the flexible module, respectively, to obtain an intermediate module;

[0050] (2) Stacking the base substrate, the first adhesive film, the intermediate module, the second adhesive film and the polymer film in sequence and performing high-temperature vacuum lamination to obtain the super-flexible packaging structure.

[0051] In some embodiments, the deposition method of the inorganic barrier layer in step (1) comprises any one of atomic layer deposition, physical vapor deposition or chemical vapor deposition, and is further preferably atomic layer deposition.

[0052] In some embodiments, the deposition temperature of the atomic layer deposition is 100-150℃, for example, it can be 100℃, 105℃, 110℃, 115℃, 120℃, 125℃, 130℃, 135℃, 140℃, 145℃ or 150℃, but is not limited to the listed values, and other values not listed in this range are also applicable.

[0053] In the present application, the deposition temperature of the atomic layer deposition needs to be limited within a reasonable range. When the deposition temperature is lower than 100℃, the obtained inorganic barrier layer has more defects, thereby significantly reducing the water and oxygen barrier property of the packaging structure; when the deposition temperature is higher than 150℃, the perovskite module is also prone to structural damage.

[0054] In some embodiments, the lamination temperature of the high-temperature vacuum lamination in step (2) is 100-140℃, for example, it can be 100℃, 105℃, 110℃, 115℃, 120℃, 125℃, 130℃, 135℃ or 140℃, but is not limited to the listed values, and other values not listed in this range are also applicable.

[0055] In some embodiments, the pressure applied in the high-temperature vacuum lamination of step (2) is 40-80 kPa, for example, it can be 40 kPa, 45 kPa, 50 kPa, 55 kPa, 60 kPa, 65 kPa, 70 kPa, 75 kPa or 80 kPa, but not limited to the listed values, other values not listed in the range are also applicable.

[0056] In some embodiments, the lamination time of the high-temperature vacuum lamination of step (2) is 10-30 min, for example, it can be 10 min, 12 min, 14 min, 16 min, 18 min, 20 min, 22 min, 24 min, 26 min, 28 min or 30 min, but not limited to the listed values, other values not listed in the range are also applicable.

[0057] Some embodiments of the present application also provide a perovskite photovoltaic cell, wherein the photoelectric assembly in the perovskite photovoltaic cell comprises the super-flexible packaging structure of any of the above embodiments.

[0058] The numerical ranges recited in the present application include not only the explicitly recited point values, but also any point values between the explicitly recited point values in the range, and the present application does not exhaustively list the specific point values included in the range for the sake of brevity and simplicity. Embodiment 1

[0059] The present embodiment provides a super-flexible packaging structure of a perovskite photoelectric assembly, as shown in Figure 1 The super-flexible packaging structure comprises a first packaging assembly 10 and a second packaging assembly 20 arranged on the two side surfaces of the flexible module 30, respectively.

[0060] Specifically, the first packaging assembly 10 comprises a cloth-based substrate 11, a first adhesive film 12 and a first inorganic barrier layer 13 arranged in layers; the second packaging assembly 20 comprises a polymer film 21, a second adhesive film 22 and a second inorganic barrier layer 23 arranged in layers; the first inorganic barrier layer 13 and the second inorganic barrier layer 23 are arranged on the two side surfaces of the flexible module 30, respectively; the flexible module 30 is a perovskite module prepared based on a flexible conductive substrate.

[0061] Specifically, the material of the first inorganic barrier layer 13 and the second inorganic barrier layer 23 is both aluminum oxide, and the thickness of each is 20 nm; the first adhesive film 12 and the second adhesive film 22 are both EVA adhesive films, and the thickness of each is 0.3 mm; the polymer film 21 is an ETFE high-transparency film, and the thickness is 50 μm.

[0062] The battery structure of the flexible module 30 used in this embodiment is a p-i-n structure, which includes a PET conductive substrate, a hole transport layer (Meo-4PACZ), a perovskite layer, a passivation layer (F-PEAI), an electron transport layer (C60 and BCP), and an electrode layer (a copper electrode) which are stacked.

[0063] This embodiment also provides a packaging method of a perovskite photoelectric assembly, and the above-mentioned super-flexible packaging structure is formed by using the packaging method, and specifically includes the following steps.

[0064] (1) An atomic layer deposition device is used to deposit inorganic barrier layers (a first inorganic barrier layer 13 and a second inorganic barrier layer 23) on the two side surfaces of the flexible module 30, respectively, the deposition temperature is controlled to be 100°C, and an intermediate module is obtained.

[0065] (2) The base substrate 11, the first adhesive film 12, the intermediate module, the second adhesive film 22, and the polymer film 21 are sequentially stacked, high-temperature vacuum lamination is performed in a vacuum laminator, the lamination temperature is controlled to be 120°C, the pressure is 60kPa, and the lamination time is 20min, and a super-flexible packaging structure is obtained. Embodiment 2

[0066] This embodiment provides a super-flexible packaging structure of a perovskite photoelectric assembly, as shown in Figure 1 The super-flexible packaging structure includes a first packaging assembly 10 and a second packaging assembly 20 which are respectively arranged on the two side surfaces of a flexible module 30.

[0067] The first packaging assembly 10 includes a base substrate 11, a first adhesive film 12, and a first inorganic barrier layer 13 which are stacked; the second packaging assembly 20 includes a polymer film 21, a second adhesive film 22, and a second inorganic barrier layer 23 which are stacked; the first inorganic barrier layer 13 and the second inorganic barrier layer 23 are respectively arranged on the two side surfaces of the flexible module 30; and the flexible module 30 is a perovskite module prepared based on a flexible conductive substrate.

[0068] Specifically, the material of the first inorganic barrier layer 13 and the second inorganic barrier layer 23 is both aluminum oxide, and the thickness of the first inorganic barrier layer 13 and the second inorganic barrier layer 23 is both 10nm; the first adhesive film 12 and the second adhesive film 22 are both POE adhesive films, and the thickness of the first adhesive film 12 and the second adhesive film 22 is both 0.1mm; and the polymer film 21 is an ETFE high-transparency film, and the thickness of the polymer film 21 is 20μm.

[0069] The battery structure of the flexible module 30 used in this embodiment is a p-i-n structure, which includes a PET conductive substrate, a hole transport layer (Meo-4PACZ), a perovskite layer, a passivation layer (F-PEAI), an electron transport layer (C60 and BCP), and an electrode layer (a copper electrode) which are stacked.

[0070] The embodiment also provides a packaging method of the perovskite photoelectric assembly, and the super-flexible packaging structure is formed by using the packaging method, and specifically includes the following steps:

[0071] (1) An atomic layer deposition device is used to deposit inorganic barrier layers (a first inorganic barrier layer 13 and a second inorganic barrier layer 23) on two side surfaces of the flexible module 30, a deposition temperature is controlled to be 120 DEG C, and an intermediate module is obtained;

[0072] (2) The base cloth substrate 11, the first adhesive film 12, the intermediate module, the second adhesive film 22 and the polymer film 21 are sequentially laminated, high-temperature vacuum lamination is performed in a vacuum laminator, a lamination temperature is controlled to be 100 DEG C, a pressure is applied to be 40 kPa, a lamination time is 30 min, and a super-flexible packaging structure is obtained. Embodiment 3

[0073] The embodiment provides a super-flexible packaging structure of a perovskite photoelectric assembly, as shown in the figure, the super-flexible packaging structure includes a first packaging assembly 10 and a second packaging assembly 20 arranged on two side surfaces of a flexible module 30. Figure 1

[0074] The first packaging assembly 10 includes the base cloth substrate 11, the first adhesive film 12 and the first inorganic barrier layer 13 which are laminated; the second packaging assembly 20 includes the polymer film 21, the second adhesive film 22 and the second inorganic barrier layer 23 which are laminated; the first inorganic barrier layer 13 and the second inorganic barrier layer 23 are arranged on the two side surfaces of the flexible module 30; and the flexible module 30 is a perovskite module prepared based on a flexible conductive substrate.

[0075] Specifically, the first inorganic barrier layer 13 and the second inorganic barrier layer 23 are both made of aluminum oxide and have a thickness of 50 nm; the first adhesive film 12 and the second adhesive film 22 are both PVB adhesive films and have a thickness of 0.7 mm; and the polymer film 21 is an ETFE high-transparency film and has a thickness of 80 microns.

[0076] The battery structure of the flexible module 30 used in the embodiment is a p-i-n structure and includes a PET conductive substrate, a hole transport layer (Meo-4PACZ), a perovskite layer, a passivation layer (F-PEAI), an electron transport layer (C60 and BCP) and an electrode layer (a copper electrode) which are laminated.

[0077] The embodiment also provides a packaging method of the perovskite photoelectric assembly, and the super-flexible packaging structure is formed by using the packaging method, and specifically includes the following steps:

[0078] ​(1) The inorganic barrier layer (first inorganic barrier layer 13 and second inorganic barrier layer 23) is deposited on both sides of the flexible module 30 by using an atomic layer deposition device, and the deposition temperature is controlled at 150°C to obtain an intermediate module;

[0079] (2) The base substrate 11, the first adhesive film 12, the intermediate module, the second adhesive film 22 and the polymer film 21 are sequentially laminated, and high-temperature vacuum lamination is performed in a vacuum laminator, the lamination temperature is controlled at 140°C, the pressure is 80kPa, and the lamination time is 10min to obtain a super-flexible packaging structure. Example 4

[0080] The present embodiment provides a super-flexible packaging structure of a perovskite photoelectric assembly and a packaging method thereof. Except that the material of the first inorganic barrier layer 13 and the second inorganic barrier layer 23 is changed to titanium oxide, the rest of the structure and conditions are the same as those in Example 1, so they are not described here. Example 5

[0081] The present embodiment provides a super-flexible packaging structure of a perovskite photoelectric assembly and a packaging method thereof. Except that the material of the first inorganic barrier layer 13 and the second inorganic barrier layer 23 is changed to aluminum nitride, the rest of the structure and conditions are the same as those in Example 1, so they are not described here. Example 6

[0082] The present embodiment provides a super-flexible packaging structure of a perovskite photoelectric assembly and a packaging method thereof. Except that the thickness of the first inorganic barrier layer 13 and the second inorganic barrier layer 23 is changed to 8nm, the rest of the structure and conditions are the same as those in Example 1, so they are not described here. Example 7

[0083] The present embodiment provides a super-flexible packaging structure of a perovskite photoelectric assembly and a packaging method thereof. Except that the thickness of the first adhesive film 12 and the second adhesive film 22 is changed to 0.8mm, the rest of the structure and conditions are the same as those in Example 1, so they are not described here. Example 8

[0084] The present embodiment provides a super-flexible packaging structure of a perovskite photoelectric assembly and a packaging method thereof. Except that the deposition temperature of the inorganic barrier layer in step (1) is changed to 80°C, the rest of the steps and conditions are the same as those in Example 1, so they are not described here. Example 9

[0085] The present embodiment provides a super-flexible packaging structure of a perovskite photoelectric assembly and a packaging method thereof. Except that the deposition temperature of the inorganic barrier layer in step (1) is changed to 160°C, the rest of the steps and conditions are the same as those in Example 1, so they are not described here. Comparative Example 1

[0086] The comparative example provides a super-flexible packaging structure of a perovskite photoelectric component and a packaging method thereof. Except that only the first inorganic barrier layer 13 is removed, the rest of the structure and conditions are the same as those of Example 1, and thus are not described here. Comparative Example 2

[0087] The comparative example provides a super-flexible packaging structure of a perovskite photoelectric component and a packaging method thereof. Except that only the second inorganic barrier layer 23 is removed, the rest of the structure and conditions are the same as those of Example 1, and thus are not described here. Comparative Example 3

[0088] The comparative example provides a super-flexible packaging structure of a perovskite photoelectric component and a packaging method thereof. Except that the first inorganic barrier layer 13 and the second inorganic barrier layer 23 are directly removed, the rest of the structure and conditions are the same as those of Example 1, and thus are not described here. Comparative Example 4

[0089] The comparative example provides a super-flexible packaging structure of a perovskite photoelectric component and a packaging method thereof. Except that only the first adhesive film 12 is removed, the rest of the structure and conditions are the same as those of Example 1, and thus are not described here. Comparative Example 5

[0090] The comparative example provides a super-flexible packaging structure of a perovskite photoelectric component and a packaging method thereof. Except that only the second adhesive film 22 is removed, the rest of the structure and conditions are the same as those of Example 1, and thus are not described here. Comparative Example 6

[0091] The comparative example provides a super-flexible packaging structure of a perovskite photoelectric component and a packaging method thereof. Except that the first adhesive film 12 and the second adhesive film 22 are directly removed, the rest of the structure and conditions are the same as those of Example 1, and thus are not described here.

[0092] Performance test

[0093] In order to ensure the accuracy and comparability of the data, in the present test experiment, all the packaged perovskite photovoltaic components used are strictly selected from independent samples.

[0094] Water and oxygen barrier test: reference standard IEC 61215.

[0095] Water and oxygen gradually erode perovskite photoelectric components, eventually leading to a decrease in photoelectric conversion efficiency. In particular, harsh environments of high humidity and high temperature increase the water and oxygen permeability of organic materials, thereby accelerating the process of water and oxygen erosion of the perovskite active layer. The present test experiment is based on the above principle and aims to evaluate the effectiveness of different packaging structures in blocking water and oxygen permeation.

[0096] Conditions: temperature: 85±2℃; humidity: 85±2%RH; duration: 1000h.

[0097] Evaluation index: photoelectric conversion efficiency decay rate (required to be less than 10%); appearance inspection (no obvious discoloration, whitening or yellowing phenomenon, no obvious cracking or delamination phenomenon).

[0098] Flexibility test: refer to the standard IEC 61215.

[0099] The flexible photovoltaic module was repeatedly bent along a self-made cylinder with a bending radius of 5 mm (this bending radius is much lower than the bending radius required by most standards commonly followed in the current flexible device industry, i.e., a more stringent flexibility test method is adopted in the present application), and the bending number was 1000 times.

[0100] Evaluation index: photoelectric conversion efficiency decay rate (required to be less than 10%); appearance inspection (no obvious cracking or delamination phenomenon).

[0101] Weather resistance test: refer to the standard IEC 61215.

[0102] The photovoltaic module was placed under a xenon lamp (light wavelength range 300-1200 nm) for irradiation test, the light intensity was set to five times that of natural sunlight, and the irradiation duration was more than 150 h, which corresponds to the simulation of the light effect of outdoor environment for 2.5 years.

[0103] Evaluation index: appearance inspection (no obvious yellowing, cracking or powdering phenomenon).

[0104] The above water and oxygen barrier property, flexibility and weather resistance tests were performed on the ultra-flexible packaging structure of the perovskite photovoltaic module obtained from Examples 1-9 and Comparative Examples 1-6, and the relevant test results are shown in Table 1 below.

[0105] Table 1

[0106]

[0107] From Table 1, it can be seen that:

[0108] (1) By comparing Examples 1-3 with Example 6, it is found that when aluminum oxide is deposited as a water and oxygen barrier layer by atomic layer deposition (ALD) technology, the thickness of the inorganic barrier layer needs to be maintained within an appropriate range, so as to exhibit excellent water and oxygen barrier performance.

[0109] (2) By comparing Example 1 with Examples 4-5, it is found that among the aluminum oxide, titanium oxide and aluminum nitride deposited at 100°C, aluminum oxide exhibits better water and oxygen barrier performance; in contrast, aluminum nitride usually requires a higher deposition temperature to achieve the best water and oxygen barrier effect.

[0110] (3) By comparing Example 1 with Example 7, it is found that the thickness of the adhesive film has a direct impact on the bending performance of the packaged assembly, and the thicker the adhesive film made of the same material, the worse the bending performance of the assembly.

[0111] (4) By comparing Example 1 with Examples 8-9, it is found that the deposition temperature of the inorganic barrier layer has a significant impact on its water and oxygen barrier property and photoelectric conversion efficiency: too low deposition temperature leads to incomplete reaction of the precursor, forming more defects and thus weakening the water and oxygen barrier effect; although too high deposition temperature has no adverse effect on its water and oxygen barrier property, high temperature is easy to cause decomposition of the perovskite active layer, thereby adversely affecting the photoelectric conversion efficiency of the perovskite assembly.

[0112] (5) By comparing Example 1 with Comparative Examples 1-6, it is found that the use of inorganic barrier layer or adhesive film alone cannot meet the strict requirements of perovskite photovoltaic assembly for water and oxygen barrier. Only when the two are used together can a synergistic effect be achieved, realizing the effect of "1+1>2". This synergistic effect mainly comes from two factors: one is that the adhesive film fills the defects of the inorganic barrier layer during lamination, thereby further improving the water and oxygen barrier capability; the other is that the inorganic barrier layer is easily damaged in extreme water and oxygen environment, leading to a decrease in its barrier property, while the presence of the adhesive film provides additional protection. In addition, only when the inorganic barrier layer and the adhesive film are applied to both the front and back surfaces of the flexible module can the comprehensive demand of perovskite photovoltaic assembly for water and oxygen barrier be met.

[0113] As can be seen, compared with the traditional single packaging material, the ultra-flexible packaging structure provided by the present application, with the extremely low water and oxygen transmission rate of the inorganic barrier layer and the adhesive film, effectively meets the stringent requirements of perovskite photovoltaic assembly for water and oxygen barrier through the synergistic effect between the two, and the cloth substrate and the polymer film have excellent flexibility and environmental stability, significantly improving the flexibility, portability and weather resistance of the packaging structure, fully meeting the outdoor use demand of photovoltaic products, and improving the practicability and product competitiveness of perovskite photovoltaic assembly in wearable and portable application fields.

[0114] The above merely provides a specific implementation of the present application, but the protection scope of the present application is not limited thereto. It should be understood by those skilled in the art that any changes or replacements within the technical scope disclosed by the present application can be easily conceived by those skilled in the art, and all such changes or replacements fall within the protection scope and disclosure scope of the present application.

Claims

1. A super-flexible encapsulation structure of a perovskite photoelectric component, characterized in that, The super-flexible packaging structure comprises a first packaging component and a second packaging component respectively arranged on two side surfaces of the flexible module; The first packaging component comprises a cloth-based substrate, a first adhesive film and a first inorganic barrier layer arranged in layers; the second packaging component comprises a polymer film, a second adhesive film and a second inorganic barrier layer arranged in layers; the first inorganic barrier layer and the second inorganic barrier layer are respectively arranged on the two side surfaces of the flexible module, and the thickness of the first inorganic barrier layer and the second inorganic barrier layer is independently 10-50 nm, the deposition method is atomic layer deposition, and the deposition temperature is 100-150℃; The flexible module is a perovskite module prepared based on a flexible conductive substrate.

2. The ultra-flex package structure of claim 1, wherein, The material of the first inorganic barrier layer and the second inorganic barrier layer independently comprises any one or a combination of at least two of a metal oxide, a non-metal oxide or a nitride.

3. The ultra-flex package structure of claim 2, wherein, The material of the first inorganic barrier layer and the second inorganic barrier layer is a metal oxide.

4. The ultra-flex package structure of claim 3, wherein, The material of the first inorganic barrier layer and the second inorganic barrier layer is aluminum oxide.

5. The ultra-flex package structure of claim 1, wherein, The first adhesive film and the second adhesive film independently comprise any one of an EVA adhesive film, a POE adhesive film or a PVB adhesive film.

6. The ultra-flex package structure of claim 1, wherein, The thickness of the first adhesive film and the second adhesive film is independently 0.01-0.7 mm.

7. The ultra-flex package structure of claim 1, wherein, The polymer film comprises an ETFE film.

8. The ultra-flex package structure of claim 1, wherein, The thickness of the polymer film is 20-80 μm.

9. The ultra-flex package structure of claim 1, wherein, The battery structure of the flexible module comprises a p-i-n structure or an n-i-p structure.

10. A method for encapsulating a perovskite photovoltaic assembly, by which a super flexible encapsulation structure as claimed in any one of claims 1 to 9 is formed, characterized in that The packaging method comprises the following steps: (1) depositing an inorganic barrier layer on the two side surfaces of the flexible module respectively to obtain an intermediate module; (2) sequentially laminating a cloth-based substrate, a first adhesive film, the intermediate module, a second adhesive film and a polymer film at high temperature and under vacuum to obtain a super-flexible packaging structure.

11. The packaging method according to claim 10, characterized in that, The lamination temperature of the high-temperature vacuum lamination in step (2) is 100-140℃.

12. The packaging method of claim 10, wherein, The applied pressure of the high-temperature vacuum lamination in step (2) is 40-80 kPa.

13. The packaging method of claim 10, wherein, The lamination time of the high-temperature vacuum lamination in step (2) is 10-30 min.

14. A perovskite photovoltaic cell, characterized in that, The photoelectric assembly in the perovskite photovoltaic cell comprises the super-flexible packaging structure according to any one of claims 1-9.

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