Perovskite solar module, preparation method thereof and solar panel

Abstract

The invention relates to a perovskite solar module, a preparation method thereof and a solar panel. The preparation method comprises the following steps: providing a substrate; constructing a plurality of perovskite solar devices on the substrate; the surface, away from the substrate, of each perovskite solar device is coated with a first packaging layer, and the side wall of each perovskite solar device is coated with a second packaging layer; a cover plate is attached to the surface of each perovskite solar device through a first packaging layer; the orthographic projection of each perovskite solar device on the substrate is located in the orthographic projection of the cover plate on the substrate; by cutting the substrate and the cover plate, a plurality of small-size perovskite solar modules can be obtained from one substrate at the same time. The first packaging layer can be used for pasting a cover plate, and the second packaging layer can further protect the perovskite solar device when the substrate and the cover plate are cut.

Description

Technical Field

[0001] The present application belongs to the technical field of solar cells, and in particular to a perovskite solar module and a preparation method thereof, and a solar panel. Background Art

[0002] At present, the traditional packaging method of solar photovoltaic modules is usually to use two layers of glass and packaging materials to cover the silicon crystal solar device as a package. Most outdoor solar photovoltaic modules use this module packaging design method. Summary of the invention

[0003] The purpose of this application is to provide a perovskite solar module and its preparation method and solar panel, aiming to solve the problems existing in traditional solar photovoltaic modules.

[0004] A first aspect of an embodiment of the present application provides a method for preparing a perovskite solar module, comprising: providing a substrate; constructing a plurality of perovskite solar devices on the substrate; coating a first encapsulation layer on the surface of each perovskite solar device away from the substrate, and coating a second encapsulation layer on the side wall of each perovskite solar device; attaching a cover plate to the surface of each perovskite solar device through the first encapsulation layer; the orthographic projection of each perovskite solar device on the substrate is located within the orthographic projection of the cover plate on the substrate; cutting the substrate and the cover plate to obtain a plurality of perovskite solar modules; the perovskite solar module comprises a sub-substrate, the perovskite solar device and a sub-cover plate which are stacked in sequence; the sub-substrate is obtained by cutting the substrate, and the sub-cover plate is obtained by cutting the cover plate.

[0005] In one embodiment, the method further includes: constructing a third encapsulation layer on the side wall of each of the perovskite solar modules, wherein the third encapsulation layer covers two surfaces of the sub-substrate opposite to the sub-cover plate and a surface of the second encapsulation layer.

[0006] In one embodiment, the third packaging layer also covers at least a portion of the side wall of the sub-cover plate.

[0007] In one embodiment, the third encapsulation layer also covers the sidewalls of the sub-cover plate and the edge of a side surface of the sub-cover plate away from the sub-substrate.

[0008] In one embodiment, the perovskite solar device includes a first transmission layer, a light absorption layer, a second transmission layer and a first electrode layer stacked in sequence on the substrate in a direction away from the substrate; or, the perovskite solar device includes a second electrode layer, a first transmission layer, a light absorption layer, a second transmission layer and a first electrode layer stacked in sequence on the substrate in a direction away from the substrate.

[0009] In one embodiment, the orthographic projection of the sub-cover plate on the sub-substrate is located inside the sub-substrate.

[0010] In one embodiment, the material of the first encapsulation layer, the second encapsulation layer and the third encapsulation layer includes at least one of acrylic resin, epoxy resin and polyurethane; the material of the sub-cover plate and the sub-substrate includes at least one of glass and plastic.

[0011] In one embodiment, the surface of the perovskite solar device is covered with the first encapsulation layer.

[0012] A second aspect of an embodiment of the present application provides a perovskite solar module, comprising a sub-substrate, a perovskite solar device, a first encapsulation layer and a sub-cover plate stacked in sequence; and also comprising a second encapsulation layer filled between the sub-substrate and the sub-cover plate, wherein the second encapsulation layer at least covers the side walls of the perovskite solar device.

[0013] A third aspect of an embodiment of the present application provides a solar panel, comprising a perovskite solar module prepared by the preparation method as described above.

[0014] Compared with the prior art, the embodiments of the present application have the following beneficial effects: by cutting the substrate and the cover plate, multiple small-sized perovskite solar panels can be obtained from one substrate at the same time. The first encapsulation layer can be used to stick the cover plate, and the second encapsulation layer can further protect the perovskite solar device when cutting the substrate and the cover plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A flow chart of a method for preparing a perovskite solar module provided in one embodiment of the present application;

[0016] Figure 2 A schematic diagram of the arrangement of a perovskite solar device provided in one embodiment of the present application;

[0017] Figure 3 A schematic cross-sectional view of a device after executing step S200 according to an embodiment of the present application;

[0018] Figure 4 A schematic cross-sectional view of a device after executing step S400 according to an embodiment of the present application;

[0019] Figure 5 A schematic cross-sectional view of a device after executing step S500 according to an embodiment of the present application;

[0020] Figure 6 A schematic cross-sectional view of a device after executing step S600 provided in an embodiment of the present application;

[0021] Figure 7 A schematic cross-sectional view of another device after executing step S600 according to an embodiment of the present application;

[0022] Figure 8 A schematic cross-sectional view of another device after executing step S400 provided in an embodiment of the present application. DETAILED DESCRIPTION

[0023] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0024] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0025] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0027] Figure 1 The flowchart of the method for preparing the perovskite solar module provided in the first embodiment of the present application is shown. For the convenience of explanation, only the part related to the present embodiment is shown, which is described in detail as follows:

[0028] A method for preparing a perovskite solar module includes: steps S100 to S500.

[0029] Step S100: providing a substrate.

[0030] Step S200: constructing a plurality of perovskite solar devices on a substrate.

[0031] like Figure 2 , Figure 3 As shown, in some embodiments, a plurality of perovskite solar devices 200 are arranged in an array on a substrate 100 .

[0032] Step S300: coating a first encapsulation layer on a surface of each perovskite solar device away from the substrate, and coating a second encapsulation layer on a sidewall of each perovskite solar device.

[0033] Step S400: attach the cover plate to the surface of each perovskite solar device through multiple first encapsulation layers. The orthographic projection of each perovskite solar device 200 on the substrate 100 is located within the orthographic projection of the cover plate 300 on the substrate 100. That is, each perovskite solar device 200 is located between the substrate 100 and the cover plate 300. The thickness of the first encapsulation layer 400 is less than 1000um.

[0034] like Figure 4 As shown, the first encapsulation layer 400 corresponds to each perovskite solar device 200 one by one, and the first encapsulation layer 400 is used to bond the cover plate 300 to the corresponding perovskite solar device 200 .

[0035] The first encapsulation layer 400 can be obtained by first coating the encapsulation material on the surface of each perovskite solar device 200 and then curing the encapsulation material using a photocuring or thermal curing technology.

[0036] like Figure 4 As shown, the second encapsulation layer 500 corresponds to the perovskite solar device 200 one by one, and the second encapsulation layer 500 is used to wrap the corresponding perovskite solar device 200. The second encapsulation layer 500 is used to protect the side wall of each perovskite solar device 200.

[0037] Step S500: cutting the substrate and the cover plate to obtain a plurality of perovskite solar modules. The perovskite solar module includes a sub-substrate 110, a perovskite solar device 200 and a sub-cover plate 310 stacked in sequence. The sub-substrate 110 is obtained by cutting the substrate 100, and the sub-cover plate 310 is obtained by cutting the cover plate.

[0038] like Figure 5 As shown, by cutting the substrate 100 and the cover plate 300, multiple small-sized perovskite solar modules can be obtained from one substrate 100 at the same time. The first encapsulation layer 400 can be used to stick the cover plate 300, and the second encapsulation layer 500 can further protect the perovskite solar device 200 when cutting the substrate 100 and the cover plate.

[0039] In some embodiments, Figure 2As shown, in step S200, a first positioning target 210 corresponding to each perovskite solar device 200 can be constructed on the substrate 100, and the first positioning target 210 is used to accurately position each perovskite solar device 200, so as to facilitate accurate cutting of the substrate 100 in step S500.

[0040] The orthographic projection of the first positioning target 210 on the substrate 100 may be in a cross shape.

[0041] The first positioning target 210 may be constructed using the material for constructing the perovskite solar device 200 while each perovskite solar device 200 is being constructed.

[0042] In some embodiments, in step S200, a second positioning target corresponding to each perovskite solar device 200 may be constructed on the substrate 100, and the second positioning target is used to accurately position each perovskite solar device 200 to facilitate accurate cutting of the cover plate 300 in step S500.

[0043] In one embodiment, the preparation method further includes step S600.

[0044] Step S600 : constructing a third encapsulation layer 600 on the sidewalls of each perovskite solar module, wherein the third encapsulation layer 600 covers two surfaces of the sub-substrate 110 opposite to the sub-cover plate 310 and a surface of the second encapsulation layer 500 .

[0045] like Figure 6 As shown, in order to avoid damaging the perovskite solar device 200 when cutting the substrate 100 and the cover plate 300, there should be a certain gap between the position where the substrate 100 and the cover plate 300 are cut in step S500 and the second encapsulation layer 500. After the cutting is completed, the area of ​​the sub-substrate 110 and the sub-cover plate 310 will be larger than the total area of ​​the first encapsulation layer 400, the perovskite solar device 200 and the second encapsulation layer 500. It can be understood that by providing the third encapsulation layer 600, the sub-substrate 110 and the sub-cover plate 310 can be further fixed to prevent the obtained perovskite solar module from being separated from the sub-substrate 110 and / or the sub-cover plate 310 due to external force.

[0046] In one embodiment, the third encapsulation layer 600 further covers at least a portion of the sidewall of the sub-cover 310 .

[0047] By covering a portion of the side wall of the sub-cover plate 310 with the third encapsulation layer 600 , the fixation of the sub-cover plate 310 can be further strengthened.

[0048] At the same time, the isolation between the perovskite solar device 200 and the external environment can be further strengthened.

[0049] In one embodiment, the third encapsulation layer 600 further covers the sidewalls of the sub-cover plate 310 and the edge of a side surface of the sub-cover plate 310 away from the sub-substrate 110 .

[0050] like Figure 7 As shown, the third encapsulation layer 600 covers the sidewalls of the sub-cover plate 310 and a portion of the surface of the sub-cover plate 310 away from the sub-substrate 110 , and the third encapsulation layer 600 can wrap the sub-cover plate 310 to further strengthen the fixation of the sub-cover plate 310 .

[0051] At the same time, the isolation between the perovskite solar device 200 and the external environment can be further strengthened.

[0052] In one embodiment, the perovskite solar device 200 includes a first transmission layer, a light absorbing layer, a second transmission layer, and a first electrode layer sequentially stacked on the substrate 100 in a direction away from the substrate 100. Alternatively, the perovskite solar device 200 includes a second electrode layer, a first transmission layer, a light absorbing layer, a second transmission layer, and a first electrode layer sequentially stacked on the substrate 100 in a direction away from the substrate 100.

[0053] Wherein, the material of the light absorption layer is perovskite material.

[0054] Energy conversion can be achieved by cooperating with the light absorption layer and the transmission layer to convert solar energy into electrical energy, and finally the obtained electrical energy can be output to other electrical equipment and modules through the electrode layer.

[0055] Specifically, one of the first transport layer and the second transport layer is usually used to transport electrons, and the other is used to transport holes, so that the transport layers can cooperate to achieve energy conversion.

[0056] Exemplarily, in some embodiments, the first transport layer is used to transport electrons, and the second transport layer is used to transport holes.

[0057] The second electrode layer and the first electrode layer are used to connect to other circuits to output the electrical energy generated by the perovskite solar device 200 .

[0058] Each transmission layer and each electrode layer can be configured according to actual needs, and will not be described in detail in this embodiment.

[0059] In one embodiment, the orthographic projection of the sub-cover plate 310 on the sub-substrate 110 is located inside the sub-substrate 110 , that is, the area of ​​the sub-cover plate 310 is smaller than the area of ​​the sub-substrate 110 .

[0060] In one embodiment, the material of the first encapsulation layer 400 , the second encapsulation layer 500 , and the third encapsulation layer 600 includes at least one of acrylic resin, epoxy resin, and polyurethane.

[0061] The materials of the first encapsulation layer 400 , the second encapsulation layer 500 and the third encapsulation layer 600 may be the same or different.

[0062] In one embodiment, the material of the sub-cover plate 310 and the sub-substrate 110 includes at least one of glass and plastic. Similarly, the material of the substrate 100 and the cover plate 300 includes at least one of glass and plastic.

[0063] Preferably, the sub-cover plate 310 and the sub-substrate 110 are both made of glass.

[0064] In one embodiment, the surface of the perovskite solar device 200 is covered with a first encapsulation layer 400 .

[0065] like Figure 8 As shown, in step S300, the surfaces of the various perovskite solar devices 200 are completely covered by a plurality of first encapsulation layers 400 to isolate the perovskite solar device 200 from the external environment. The second encapsulation layer 500 can be further coated on the surface of the first encapsulation layer 400 on the side wall of the perovskite solar device 200 to increase the total contact area between the encapsulation layer and the cover plate 300, thereby strengthening the protection of the perovskite solar device 200 and making the cover plate 300 and the perovskite solar device 200 more firmly bonded.

[0066] like Figure 5 As shown, an embodiment of the present application provides a perovskite solar module, comprising a sub-substrate 110, a perovskite solar device 200, a first encapsulation layer 400 and a sub-cover plate 310 stacked in sequence. It also includes a second encapsulation layer 500 filled between the sub-substrate 110 and the sub-cover plate 310, and the second encapsulation layer 500 at least covers the side wall of the perovskite solar device 200.

[0067] By cutting the substrate 100 and the cover plate 300, multiple small-sized perovskite solar modules can be obtained from one substrate 100. The first encapsulation layer 400 can be used to stick the cover plate 300, and the second encapsulation layer 500 can further protect the perovskite solar device 200 when cutting the substrate 100 and the cover plate 300.

[0068] An embodiment of the present application provides a solar panel, comprising a perovskite solar module prepared by the above-mentioned preparation method.

[0069] Among them, Figure 5As shown, the perovskite solar module includes a sub-substrate 110, a perovskite solar device 200, a first encapsulation layer 400 and a sub-cover plate 310 which are stacked in sequence. It also includes a second encapsulation layer 500 filled between the sub-substrate 110 and the sub-cover plate 310, and the second encapsulation layer 500 at least covers the side wall of the perovskite solar device 200.

[0070] In some embodiments, the solar panel includes a plurality of perovskite solar modules, and the plurality of perovskite solar modules are arranged and spliced ​​in a certain order and matrix.

[0071] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0072] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0073] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0074] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for preparing a perovskite solar module, characterized in that: include: providing a substrate; constructing a plurality of perovskite solar devices on the substrate; Coating a first encapsulation layer on the surface of each perovskite solar device away from the substrate, and coating a second encapsulation layer on the sidewall of each perovskite solar device; The cover plate is attached to the surface of each of the perovskite solar devices through the first encapsulation layer; the orthographic projection of each of the perovskite solar devices on the substrate is located within the orthographic projection of the cover plate on the substrate; The substrate and the cover plate are cut to obtain a plurality of perovskite solar modules; the perovskite solar module comprises a sub-substrate, the perovskite solar device and a sub-cover plate which are stacked in sequence; the sub-substrate is obtained by cutting the substrate, and the sub-cover plate is obtained by cutting the cover plate.

2. The preparation method according to claim 1, characterized in that Also includes: A third encapsulation layer is constructed on the side wall of each of the perovskite solar modules, and the third encapsulation layer covers two surfaces of the sub-substrate opposite to the sub-cover plate and a surface of the second encapsulation layer.

3. The preparation method according to claim 2, characterized in that: The third encapsulation layer also covers at least a portion of the side wall of the sub-cover.

4. The preparation method according to claim 2, characterized in that: The third encapsulation layer also covers the sidewalls of the sub-cover plate and an edge of a side surface of the sub-cover plate away from the sub-substrate.

5. The preparation method according to any one of claims 1 to 4, characterized in that: The perovskite solar device comprises a first transmission layer, a light absorption layer, a second transmission layer and a first electrode layer sequentially stacked on the substrate in a direction away from the substrate; Alternatively, the perovskite solar device includes a second electrode layer, a first transmission layer, a light absorption layer, a second transmission layer and a first electrode layer sequentially stacked on the substrate in a direction away from the substrate.

6. The preparation method according to any one of claims 1 to 4, characterized in that: The orthographic projection of the sub-cover plate on the sub-substrate is located within the sub-substrate.

7. The preparation method according to claim 2, characterized in that: The material of the first encapsulation layer, the second encapsulation layer and the third encapsulation layer includes at least one of acrylic resin, epoxy resin and polyurethane; the material of the sub-cover plate and the sub-substrate includes at least one of glass and plastic.

8. The preparation method according to any one of claims 1 to 4, characterized in that: The surface of the perovskite solar device is covered with the first encapsulation layer.

9. A perovskite solar panel, characterized in that: It includes a sub-substrate, a perovskite solar device, a first encapsulation layer and a sub-cover plate which are stacked in sequence; It also includes a second encapsulation layer filled between the sub-substrate and the sub-cover plate, wherein the second encapsulation layer at least covers the side wall of the perovskite solar device.

10. A solar panel, characterized in that: It comprises a perovskite solar panel prepared by the preparation method according to any one of claims 1 to 8.

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