Chip bonding platform and method

Abstract

The invention relates to a chip bonding platform and method.The chip bonding platform comprises a base, a sliding table, a microscope, a light source, a transparent plate and at least three supporting pillars, the sliding table is arranged on the base and used for supporting a first chip to be bonded and enabling the first chip to move in the X direction, the Y direction and the Z direction and rotate around the Z direction; the supporting columns are arranged around the sliding table and detachably connected with the transparent plate so as to support the transparent plate. The transparent plate is positioned above the sliding table and is used for fixing a second chip to be bonded; the microscope is arranged on the base and used for observing the first chip and the second chip, and the light source is arranged on the microscope and used for enabling a view field to be bright. According to the chip bonding platform and the chip bonding method, accurate alignment between the micro-channels of the chips can be conveniently realized, and the yield and the yield of multi-layer chip preparation are improved.

Description

Technical Field

[0001] The present invention relates to the field of chip bonding equipment, and more specifically to a chip bonding platform and method. Background Art

[0002] In micro-nanotechnology and biomedical engineering, the preparation and application of multilayer chips have attracted more and more attention. Multilayer chips are an integrated and highly complex experimental platform that can be used in many fields such as drug screening, disease modeling, and tissue engineering. Polydimethylsiloxane (PDMS) has become a commonly used material for multilayer chips due to its transparency, elasticity, biocompatibility, and low cost.

[0003] The bonding of PDMS chips is one of the key steps in the preparation of multilayer chips. Bonding refers to firmly connecting the PDMS chip with microstructures to other substrates (such as PDMS, glass, and silicon) to form closed microchannels and chambers for fluid control and biological sample processing. The bonding methods of PDMS chips are mainly divided into reversible bonding and irreversible bonding. Reversible bonding means that the connection between the PDMS chip and the substrate can be released by external force or temperature change, which is suitable for situations where the substrate needs to be replaced multiple times or the chip position needs to be adjusted. This method includes natural bonding, mechanical clamping, magnetic adsorption, and thermoplastic bonding, but its bonding strength is low and it is prone to leakage or falling off. Irreversible bonding means that the connection between the PDMS chip and the substrate is permanent and cannot be separated, which is suitable for multilayer chips that require long-term stability. The main methods include oxygen plasma bonding, chemical bonding, and UV curing bonding. Among them, oxygen plasma bonding is the most commonly used irreversible bonding method. The surface of the PDMS chip and substrate is treated with oxygen plasma to produce hydrophilic hydroxyl groups (-OH), and then the two are closely attached to each other to cause condensation reaction between the hydroxyl groups to form stable silicon oxygen bonds (Si-O-Si) to achieve a strong bond. Oxygen plasma bonding is simple to operate, has high bonding strength, and has a wide range of applications.

[0004] For multi-layer PDMS chips, such as chips that simulate complex physiological processes, it is usually necessary to align and bond the flow channel structure on multiple levels. For example, a multi-layer chip used to simulate respiratory movements requires bonding PDMS chips with flow channel structures on both sides of the porous membrane to form an upper and lower flow channel system, and building vacuum chambers on both sides for the pulling and deformation of the film. The width of these flow channels used for cell inoculation and the wall thickness of the vacuum chambers on both sides are usually on the order of hundreds of microns. If alignment is done only by the naked eye, deviations may occur, resulting in the inability to align the upper and lower flow channels, affecting the function and performance of the chip. Summary of the invention

[0005] The object of the present invention is to provide a chip bonding platform and method, so as to conveniently realize the precise alignment between the microchannels of each chip during the chip bonding process, and improve the finished product rate and good product rate of multi-layer chip preparation.

[0006] Based on the above-mentioned purpose, on one hand, the present invention provides a chip bonding platform, including a base, a slide, a microscope, a light source, a transparent plate and at least three supporting columns, wherein the slide is arranged on the base, and is used to support a first chip to be bonded and enable the first chip to move along the X, Y, and Z directions and rotate around the Z direction, and each supporting column is arranged around the slide and is detachably connected to the transparent plate respectively to support the transparent plate; the transparent plate is located above the slide and is used to fix the second chip to be bonded; the microscope is arranged on the base, and is used to observe the first chip and the second chip, and the light source is arranged on the microscope, and is used to make the field of view bright.

[0007] Furthermore, the transparent plate is configured to be rotatable around the Z direction relative to the supporting column to which it is fixed when it is only fixed to one of the supporting columns.

[0008] Further, the slide table includes an X-axis translation table, a Y-axis translation table, a Z-axis translation table and a rotating table, the X-axis translation table is arranged on the base, the Y-axis translation table is arranged on the X-axis translation table, the Z-axis translation table is arranged on the Y-axis translation table, the rotating table is arranged on the Z-axis translation table, and the first chip is fixed on the rotating table; the X-axis translation table is used to move the first chip along the X-direction, the Y-axis translation table is used to move the first chip along the Y-direction, the Z-axis translation table is used to move the first chip along the Z-direction, and the rotating table is used to rotate the first chip around the Z-direction.

[0009] Furthermore, the microscope includes a folding bracket and a lens, the folding bracket is fixed on the base, the lens is fixed on the folding bracket, the light source is fixed on the lens, and the folding bracket is configured to be foldable and the position of the lens can be adjusted by folding.

[0010] Furthermore, the light source is ring-shaped and arranged around the lens.

[0011] Furthermore, the transparent plate is connected to the support column via screws.

[0012] Another aspect of the present invention provides a chip bonding method, comprising the following steps:

[0013] S810: providing a chip bonding platform as described above;

[0014] S820: Obtain the first chip and the second chip to be bonded that are prepared in advance, fix the first chip on the slide, and fix the second chip on the lower surface of the transparent plate;

[0015] S830: placing a microscope above the transparent plate, turning on a light source and adjusting the focal length of the microscope so that the microscope can clearly observe the microfluidic channel structure of the second chip;

[0016] S840: Using the slide, move the first chip closer to the second chip along the Z direction, so that the microscope can clearly observe the microfluidic structure of the second chip and the microfluidic structure of the first chip;

[0017] S850: Using the slide table, the first chip is moved along the X direction, along the Y direction, and rotated about the Z direction, so that the microfluidic channel structure of the first chip is aligned with the microfluidic channel structure of the second chip;

[0018] S860: Use the slide to move the first chip closer to the second chip along the Z direction, so that the first chip contacts the second chip and completes bonding.

[0019] Further, step S820 specifically includes:

[0020] S822: connecting the transparent plate to only one of the supporting columns, and rotating the transparent plate around the Z direction relative to the supporting column connected thereto, so that the transparent plate is away from the slide table;

[0021] S824: fixing the first chip on the slide, and fixing the second chip on the lower surface of the transparent plate;

[0022] S826: Rotate the transparent plate around the Z direction relative to the supporting columns connected thereto, so that the transparent plate is close to the slide and located above the slide, and then fix the transparent plate to the remaining supporting columns.

[0023] Further, step S850 specifically includes:

[0024] S852: rotating the first chip around the Z direction by using the slide table so that the first chip and the second chip are parallel;

[0025] S854: Move the first chip along the X direction by using the slide table, so that the first chip and the second chip are aligned along the Y direction;

[0026] S856: Move the first chip along the Y direction by using the slide table so as to align the first chip and the second chip along the Z direction.

[0027] Furthermore, the chip bonding method further comprises:

[0028] The first chip and the second chip after bonding are placed in an oven and baked for a preset time.

[0029] The chip bonding platform and method of the present invention can clearly observe the relative position relationship between the first chip and the second chip through a microscope during the process of the slide moving the first chip, so as to accurately align the first chip and the second chip. The operation is simple and the accuracy is high, thereby improving the finished product rate and good product rate of multi-layer chip preparation. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram of the structure of a chip bonding platform according to an embodiment of the present invention;

[0031] Figure 2 It is a structural schematic diagram of a transparent plate of a chip bonding platform according to an embodiment of the present invention when it rotates to a position away from the slide table;

[0032] Figure 3 is a flow chart of a chip bonding method according to an embodiment of the present invention;

[0033] Figure 4 is an exploded diagram of a multi-layer chip according to an embodiment of the present invention;

[0034] Figure 5 is a schematic structural diagram of a second chip having a porous membrane according to an embodiment of the present invention;

[0035] Figure 6 FIG. 4 is a top view of a first chip and a second chip during a bonding process according to an embodiment of the present invention. DETAILED DESCRIPTION

[0036] The preferred embodiments of the present invention are given below in conjunction with the accompanying drawings and described in detail.

[0037] like Figure 1 As shown, an embodiment of the present invention provides a chip bonding platform, including a base 100, a slide 200, a microscope 300, a light source 400, a transparent plate 500 and at least three support columns 600. The slide 200 is arranged on the base 100, and is used to support a first chip 710 to be bonded and to move the first chip 710 along the X, Y, and Z directions and rotate around the Z direction (i.e., rotate in the XY plane). Each support column 600 is arranged around the slide 200 and is detachably connected to the transparent plate 500 to support the transparent plate 500. The transparent plate 500 is located above the slide 200. The transparent plate 500 is used to fix the second chip to be bonded ( Figure 1The microscope 300 is disposed on the base 100 and is used to observe the first chip 710 and the second chip. The light source 400 is disposed on the microscope 300. The light source 400 is used to make the field of view brighter so as to facilitate the observation of the first chip 710 and the second chip. The second chip is fixed to the lower surface of the transparent plate 500. When the transparent plate 500 is respectively fixed to each supporting column 600, the transparent plate 500 is located directly above the slide 200, and the second chip is located directly above the first chip 710. The first chip 710 and the second chip are both provided with a microfluidic structure. During bonding, the microfluidic structures of the two chips need to be aligned; the microfluidic structures on the first chip 710 and the second chip can be observed through the microscope 300, and the first chip 710 can be moved along the X, Y, and Z directions and rotated around the Z direction through the slide 200, so as to adjust the positional relationship between the first chip 710 and the second chip so that the microfluidic structures of the first chip 710 and the second chip are aligned. After alignment, the slide 200 can move the first chip 710 close to the second chip along the Z direction to exert a pressing effect, so that the first chip 710 and the second chip are bonded together.

[0038] In some embodiments, when the transparent plate 500 is fixed to only one of the support pillars 600 and is separated from the other support pillars 600, the transparent plate 500 can be rotated around the Z direction relative to the support pillar 600 to which it is fixed. In this way, during the bonding process, the transparent plate 500 can be first placed on one of the support pillars 600 and then rotated to a position away from the slide table 200, such as Figure 2 As shown; then the first chip 710 is fixed on the slide 200, and the second chip is fixed on the lower surface of the transparent plate 500. Since the transparent plate 500 is away from the slide 200, the transparent plate 500 and the slide 200 will not interfere with each other, so that the first chip 710 and the second chip can be smoothly fixed on the slide 200 and the transparent plate 500; after the first chip 710 and the second chip are fixed on the slide 200 and the transparent plate 500 respectively, the transparent plate 500 can be rotated about the Z direction to directly above the slide 200, and then the transparent plate 500 is fixed to the remaining support columns 600, so that the second chip is located above the first chip 710 and remains fixed during the subsequent bonding process.

[0039] In some embodiments, the base 100 may be an optical flat plate having a flat surface and a certain weight, which can ensure that the slide table 200 does not deviate when being operated.

[0040] In some embodiments, the slide table 200 may include an X-axis translation table 210, a Y-axis translation table 220, a Z-axis translation table 230, and a rotating table 240. The X-axis translation table 210 is disposed on the base 100, the Y-axis translation table 220 is disposed on the X-axis translation table 210, the Z-axis translation table 230 is disposed on the Y-axis translation table 220, and the rotating table 240 is disposed on the Z-axis translation table 230. The first chip 710 is disposed on the rotating table 240. The X-axis translation table 210 is used to make the Y-axis translation table 220, the Z-axis translation table 230, and the rotating table 240 thereon The Y-axis translation stage 220 is used to move the Z-axis translation stage 230, the rotating stage 240 and the first chip 710 thereon along the X-axis, the Y-axis translation stage 220 is used to move the Z-axis translation stage 230, the rotating stage 240 and the first chip 710 thereon along the Y-axis, the Z-axis translation stage 230 is used to move the rotating stage 240 and the first chip 710 thereon along the Z-axis, and the rotating stage 240 is used to rotate the first chip 710 thereon around the Z-axis. Thus, the first chip 710 can be moved along the X, Y, and Z directions and rotated around the Z direction by means of the X-axis translation stage 210, the Y-axis translation stage 220, the Z-axis translation stage 230 and the rotating stage 240.

[0041] In some embodiments, the microscope 300 includes a folding bracket 310 and a lens 320. The folding bracket 310 is fixed on the base 100, and the lens 320 is fixed on the folding bracket 310. The folding bracket 310 is configured to be foldable. By folding it, the position of the lens 320 can be adjusted so that the lens 320 can observe the first chip 710 and the second chip at an optimal viewing angle.

[0042] The light source 400 is fixed on the lens 320, and can move with the lens 320 and provide lighting to make the observation area brighter so that the first chip 710 and the second chip can be observed more clearly. The light source 400 can be annular and arranged around the lens 320, so that the field of view of the lens 320 falls within the illumination area of ​​the light source 400.

[0043] During the bonding process, the lens 320 can be moved to the top of the transparent plate 500 by folding the folding bracket 310, so that the lens 320 can observe the structure of the first chip 710 and the second chip, and then according to the structure observed by the lens 320, the first chip 710 can be moved with different degrees of freedom through the slide 200 until the microfluidic structures of the first chip 710 and the second chip are aligned. After alignment, the slide 200 can make the first chip 710 move upward along the Z direction and contact with the second chip, thereby realizing the bonding of the first chip 710 and the second chip.

[0044] In some embodiments, the transparent plate 500 and the support column 600 can be fixedly connected by screws. Specifically, a plurality of screw holes can be provided on the transparent plate 500, each screw hole corresponds to each support column 600, and the screw passes through the screw hole and is threadedly connected with the corresponding support column 600, so that the transparent plate 500 and the support column 600 are fixed.

[0045] In some embodiments, the transparent plate 500 may be made of any suitable transparent material, such as acrylic, polycarbonate, etc.

[0046] In some embodiments, the materials of the first chip 710 and the second chip are both PDMS. PDMS is sticky and can be adhered to the transparent plate 500 and the slide table 200 to achieve reversible fixation.

[0047] The chip bonding platform of the embodiment of the present invention can clearly observe the relative position relationship between the first chip 710 and the second chip through the microscope 300 during the process of the slide 200 moving the first chip 710, so as to accurately align the first chip 710 and the second chip. The operation is simple and the accuracy is high, thereby improving the yield and good rate of multi-layer chip preparation.

[0048] The embodiment of the present invention further provides a chip bonding method, which comprises the following steps:

[0049] S810: providing a chip bonding platform as described in the above embodiment;

[0050] S820: Obtain the pre-prepared first chip 710 and second chip to be bonded, fix the first chip 710 on the slide table 200, and fix the second chip on the lower surface of the transparent plate 500;

[0051] S830: placing the microscope 300 above the transparent plate 500, turning on the light source 400 and adjusting the focal length of the microscope 300 so that the microscope 300 can clearly observe the microfluidic channel structure of the second chip;

[0052] S840: Move the first chip 710 close to the second chip along the Z direction by using the slide table 200, so that the microscope 300 can clearly observe the microfluidic structure of the second chip and the microfluidic structure of the first chip;

[0053] S850: The first chip 710 is moved along the X direction, along the Y direction, and rotated about the Z direction by the slide table 200, so that the microfluidic channel structure of the first chip 710 is aligned with the microfluidic channel structure of the second chip;

[0054] S860: The first chip 710 is moved close to the second chip along the Z direction by the slide table 200, so that the first chip 710 is in contact with the second chip and bonding is completed to obtain a multi-layer chip.

[0055] In some embodiments, step S820 specifically includes:

[0056] S822: connecting the transparent plate 500 of the chip bonding platform to only one of the supporting pillars 600, and rotating the transparent plate 500 about the Z direction relative to the supporting pillar 600 connected thereto, so that the transparent plate 500 is away from the slide table 200;

[0057] S824: Fix the first chip 710 on the slide 200 and fix the second chip on the lower surface of the transparent plate 500;

[0058] S826: Rotate the transparent plate 500 around the Z direction relative to the supporting column 600 connected thereto so that the transparent plate 500 is close to the slide 200 and is located above the slide 200, and then fix the transparent plate 500 to the remaining supporting columns 600; at this time, the distance between the transparent plate 500 and the slide 200 needs to be large enough so that the first chip 710 and the second chip can be accommodated therein.

[0059] like Figure 4 As shown, the upper surface of the first chip 710 is provided with a microfluidic structure 711, the lower surface of the second chip 720 is provided with a microfluidic structure 721, and a porous membrane 730 is sandwiched between the first chip 710 and the second chip 720. The porous membrane 730 can be pre-fixed on the second chip 720, as shown in FIG. Figure 5 As shown, in step S830, the second chip 720 fixed on the transparent plate 500 can be a second chip having a porous membrane 730. When fixed, the side of the second chip 720 away from the porous membrane 730 is fixed to the lower surface of the transparent plate 500, so that the side of the second chip 720 fixed with the porous membrane 730 faces downward, and the side of the first chip 710 having the microfluidic structure 711 faces upward, so that the microfluidic structure 711 of the first chip 710 and the microfluidic structure 721 of the second chip 720 are opposite to each other.

[0060] like Figure 6 As shown, after step 840, the first chip 710 may not be parallel to the second chip 720, so the first chip 710 needs to be moved by the slide 200 to make the two parallel and aligned. Specifically, step S850 includes the following steps:

[0061] S852: Rotate the first chip 710 about the Z direction by the slide table 200 so that the first chip 710 and the second chip 720 are parallel;

[0062] S854: Move the first chip 710 along the X direction by the slide 200 so that the first chip 710 and the second chip 720 are aligned along the Y direction;

[0063] S856: Move the first chip 710 along the Y direction through the slide 200 so that the first chip 710 and the second chip 720 are aligned along the Z direction, that is, the microfluidic structure 711 of the first chip 710 is located directly below the microfluidic structure 721 of the second chip 720, and the microfluidic structure 711 and the microfluidic structure 721 overlap in the Z direction; in this way, the alignment of the first chip 710 and the second chip 720 is achieved.

[0064] In some embodiments, the first chip 710 and the second chip 720 may be pre-bonded before being fixed to the slide 200 and the transparent plate 500. For example, the PDMS chip or the glass bottle chip may be treated with oxygen plasma first. In this way, in step S860, the first chip 710 and the second chip 720 may be bonded together after being contacted and squeezed. After step S860, the bonded multi-layer chip may be placed in a 60-degree oven for two hours to enhance the bonding effect.

[0065] According to the chip bonding method of the embodiment of the present invention, during the process of the slide 200 moving the first chip 710, the relative position relationship between the first chip 710 and the second chip can be clearly observed through the microscope 300, so as to accurately achieve the alignment between the first chip 710 and the second chip. The operation is simple and the accuracy is high, thereby improving the yield and good rate of multi-layer chip preparation.

[0066] The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. The above embodiment of the present invention can also be modified in various ways. That is, all simple, equivalent changes and modifications made according to the claims and the description of the present invention fall within the scope of protection of the claims of the present invention. The contents not described in detail in the present invention are all conventional technical contents.

Claims

1. A chip bonding platform, characterized in that: The invention comprises a base, a slide, a microscope, a light source, a transparent plate and at least three supporting columns. The slide is arranged on the base, and is used to support a first chip to be bonded and enable the first chip to move along the X, Y and Z directions and rotate around the Z direction. The supporting columns are arranged around the slide and are detachably connected to the transparent plate respectively to support the transparent plate. The transparent plate is located above the slide and is used to fix the second chip to be bonded. The microscope is arranged on the base, and is used to observe the first chip and the second chip. The light source is arranged on the microscope, and is used to make the field of view bright.

2. The chip bonding platform according to claim 1, characterized in that: The transparent plate is configured to be rotatable around the Z direction relative to the supporting column to which it is fixed when it is fixed to only one of the supporting columns.

3. The chip bonding platform according to claim 1, characterized in that: The slide table includes an X-axis translation table, a Y-axis translation table, a Z-axis translation table and a rotating table. The X-axis translation table is arranged on the base, the Y-axis translation table is arranged on the X-axis translation table, the Z-axis translation table is arranged on the Y-axis translation table, the rotating table is arranged on the Z-axis translation table, and the first chip is fixed on the rotating table; the X-axis translation table is used to move the first chip along the X-axis, the Y-axis translation table is used to move the first chip along the Y-axis, the Z-axis translation table is used to move the first chip along the Z-axis, and the rotating table is used to rotate the first chip around the Z-axis.

4. The chip bonding platform according to claim 1, characterized in that: The microscope comprises a folding bracket and a lens, wherein the folding bracket is fixed on the base, the lens is fixed on the folding bracket, the light source is fixed on the lens, and the folding bracket is configured to be foldable and the position of the lens can be adjusted by folding.

5. The chip bonding platform according to claim 4, characterized in that: The light source is annular and is arranged around the lens.

6. The chip bonding platform according to claim 1, characterized in that: The transparent plate is connected to the supporting column via screws.

7. A chip bonding method, characterized in that: The following steps are involved: S810: Provide a chip bonding platform according to any one of claims 1 to 6; S820: Obtain the first chip and the second chip to be bonded that are prepared in advance, fix the first chip on the slide, and fix the second chip on the lower surface of the transparent plate; S830: placing a microscope above the transparent plate, turning on a light source and adjusting the focal length of the microscope so that the microscope can clearly observe the microfluidic channel structure of the second chip; S840: Using the slide, move the first chip closer to the second chip along the Z direction, so that the microscope can clearly observe the microfluidic structure of the second chip and the microfluidic structure of the first chip; S850: Using the slide table, the first chip is moved along the X direction, along the Y direction, and rotated about the Z direction, so that the microfluidic channel structure of the first chip is aligned with the microfluidic channel structure of the second chip; S860: Use the slide to move the first chip closer to the second chip along the Z direction, so that the first chip contacts the second chip and completes bonding.

8. The chip bonding method according to claim 7, characterized in that: Step S820 specifically includes: S822: connecting the transparent plate to only one of the supporting columns, and rotating the transparent plate around the Z direction relative to the supporting column connected thereto, so that the transparent plate is away from the slide table; S824: fixing the first chip on the slide, and fixing the second chip on the lower surface of the transparent plate; S826: Rotate the transparent plate around the Z direction relative to the supporting columns connected thereto, so that the transparent plate is close to the slide and located above the slide, and then fix the transparent plate to the remaining supporting columns.

9. The chip bonding method according to claim 7, characterized in that: Step S850 specifically includes: S852: rotating the first chip around the Z direction by using the slide table so that the first chip and the second chip are parallel; S854: Move the first chip along the X direction by using the slide table, so that the first chip and the second chip are aligned along the Y direction; S856: Move the first chip along the Y direction by using the slide table so as to align the first chip and the second chip along the Z direction.

10. The chip bonding method according to claim 7, characterized in that: Also includes: The first chip and the second chip after bonding are placed in an oven and baked for a preset time.

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