Automatic forming device for metal pins of semiconductor device

Abstract

The invention relates to the technical field of semiconductor device production, and discloses a semiconductor device metal pin automatic forming device which comprises a main body assembly, a supporting table, a feeding mechanism, a supporting mechanism, a cutting mechanism, a bending mechanism, a moving part and a semiconductor resistor. The supporting mechanism is located at the top of the supporting table, the cutting mechanism is arranged at the top of the supporting table, the bending mechanism is arranged on one side of the cutting mechanism, the moving part is arranged at the top of the supporting table, and the semiconductor resistor is arranged in the supporting mechanism. The device has the beneficial effects that the main body assembly is arranged, so that the pins of the semiconductor resistor can be cut, bent and shaped; by arranging the protection mechanism, the shaped semiconductor resistor can be stored, and pins of the semiconductor resistor are prevented from being bent; and whether the storage box is full of the semiconductor resistors can be detected, so that the storage box can be automatically replaced.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor device production, in particular to an automatic molding device for metal pins of semiconductor devices. Background Art

[0002] In the semiconductor manufacturing industry, the metal pin forming of semiconductor devices is a crucial link in the production process, and the cutting of metal pins is the primary task of this link. Metal pins are an important bridge connecting semiconductor devices with external circuits. Their shape, size and position accuracy have a direct impact on the performance and reliability of the device.

[0003] How to efficiently and accurately complete the cutting process of metal pins has always been the focus and difficulty of technological improvement in the semiconductor manufacturing field. After completing the cutting of the metal pins, the existing automated molding device has obvious problems in the unloading link. After the pins are cut and shaped, the processed semiconductor devices are generally directly dropped into a large material box for collection. This unloading method causes multiple semiconductor devices to be stacked in a disorderly manner in the material box, which are very easy to be squeezed with each other. Especially for metal pins that have been precisely cut, this disordered stacking method can easily cause the pins to be squeezed and bent or offset. Summary of the invention

[0004] In view of the above problems existing in the existing automatic forming device for metal pins of semiconductor devices, the present invention is proposed.

[0005] Therefore, the problem to be solved by the present invention is how to prevent the cut metal pins from being bent or deflected.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: an automatic forming device for metal pins of semiconductor devices, comprising a main body component, including a support platform, a feeding mechanism, a support mechanism, a cutting mechanism, a bending mechanism, a moving part and a semiconductor resistor, wherein the feeding mechanism is arranged on one side of the support platform, the support mechanism is located on the top of the support platform, the cutting mechanism is arranged on the top of the support platform, the bending mechanism is arranged on one side of the cutting mechanism, the moving part is arranged on the top of the support platform, and the semiconductor resistor is arranged in the support mechanism; A protective mechanism is arranged on one side of the support platform, including a support plate arranged at the end of the support mechanism, a rib plate is fixed on one side of the support plate, the rib plate is fixed to the end of the support mechanism by bolts, a storage box is arranged on the top of the support plate, a limiting block is fixed on the surface of the storage box, a support block is fixed on the top of the support plate, a baffle is rotatably connected on the surface of the support block, a support shell is fixed on the top of the support plate, a movable sleeve is slidably provided in the support shell, a detection plate is fixed on one side of the movable sleeve, a first spring is provided in the movable sleeve, the other end of the first spring is fixed to the inner wall of the support shell, a limiting plate is fixed on one side of the movable sleeve, a limiting groove is provided on one side of the limiting plate, an extrusion surface is provided on one side of the limiting plate, and a positioning block is fixed on one side of the baffle.

[0007] As a preferred solution of the automatic forming device for metal pins of semiconductor devices described in the present invention, the movable part includes a mounting plate fixed to the top of the support platform, a support seat is fixed to the top of the mounting plate, a slide seat is fixed to the top of the support seat, and a movable seat slides on the surface of the slide seat.

[0008] As a preferred solution of the automatic forming device for metal pins of semiconductor devices described in the present invention, the movable part further includes a fixing frame fixed to one side of the supporting seat, a first cylinder is fixed on the fixing frame, and a push plate is fixed to one side of the movable seat.

[0009] As a preferred solution of the automatic forming device for metal pins of semiconductor devices described in the present invention, the moving part also includes a sliding rod fixed to the top of the moving seat, a moving plate slides on the top of the sliding rod, a clamp is fixed on the top of the moving plate, a second cylinder is fixed on one side of the moving seat, and the output end of the second cylinder is fixed on one side of the moving plate.

[0010] As a preferred solution of the automatic forming device for metal pins of semiconductor devices described in the present invention, the protective mechanism also includes a blanking piece, which is arranged on one side of the support platform, including a fixed platform fixed on one side of the support platform, a positioning frame is fixed on the top of the fixed platform, a storage box is arranged in the positioning frame, and a blanking chute is fixed on one side of the support plate.

[0011] As a preferred solution of the automatic forming device for metal pins of semiconductor devices described in the present invention, the protective mechanism also includes a loading piece, which is arranged on one side of the support platform, including a fixed seat fixed on one side of the support platform, a loading box is fixed on the top of the fixed seat, and the storage box is arranged in the loading box.

[0012] As a preferred solution of the automatic forming device for metal pins of semiconductor devices described in the present invention, wherein: the loading part also includes a stop plate fixed to the inner wall of the loading box, a baffle is fixed to one side of the loading box, a mounting frame is fixed to the other side of the loading box, a third cylinder is fixed to the top of the mounting frame, a top plate is fixed to the output end of the third cylinder, the top plate is embedded in the inner wall of the loading box, a support frame is fixed to the top of the support shell, and a sensor is fixed in the support frame.

[0013] As a preferred solution of the automatic forming device for metal pins of semiconductor devices described in the present invention, the loading part also includes a guide sleeve fixed to the bottom of the fixed platform, an extrusion rod slides inside the guide sleeve, a lifting plate is fixed on the top of the extrusion rod, and a second spring is arranged on the surface of the extrusion rod.

[0014] The beneficial effects of the present invention are as follows: by setting the main body component, the pins of the semiconductor resistor can be cut and bent into shape; by setting the protective mechanism, the shaped semiconductor resistor can be stored to prevent its pins from being bent; it can detect whether the storage box is full of semiconductor resistors, so as to automatically replace the storage box. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them: Figure 1 This is a structural diagram of an automated molding device for metal pins of semiconductor devices.

[0016] Figure 2 This is a structural diagram of the loading box of the automatic forming device for the metal pins of semiconductor devices.

[0017] Figure 3 This is a structural diagram of the moving parts of the automatic forming device for the metal pins of semiconductor devices.

[0018] Figure 4 This is a structural diagram from another perspective of the moving parts of the automatic forming device for metal pins of semiconductor devices.

[0019] Figure 5 This is a cross-sectional structural diagram of the loading box of the automatic forming device for the metal pins of semiconductor devices.

[0020] Figure 6 For automatic forming of metal pins of semiconductor devices Figure 5 A magnified view of the local structure at point A.

[0021] Figure 7For automatic forming of metal pins of semiconductor devices Figure 5 Enlarged view of the local structure at point B in the middle.

[0022] Figure 8 This is a structural diagram of a storage box for an automated molding device for metal pins of semiconductor devices.

[0023] Fig. 9 For automatic forming of metal pins of semiconductor devices Figure 8 Enlarged view of the local structure at point C in the middle.

[0024] Fig.10 This is a cross-sectional structural diagram of a storage box for an automated molding device for metal pins of semiconductor devices.

[0025] Fig.11 This is a structural diagram of the positioning block of the automatic forming device for the metal pins of semiconductor devices. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0027] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0029] Example 1, reference Figure 1 to Figure 11 , which is the first embodiment of the present invention, and this embodiment provides an automatic molding device for metal pins of semiconductor devices. The automatic molding device for metal pins of semiconductor devices includes a main component 100, including a support platform 101, a loading mechanism 102, a support mechanism 103, a cutting mechanism 104, a bending mechanism 105, a moving part 106 and a semiconductor resistor 107. The loading mechanism 102 is arranged on one side of the support platform 101, the support mechanism 103 is located at the top of the support platform 101, the cutting mechanism 104 is arranged on the top of the support platform 101, the bending mechanism 105 is arranged on one side of the cutting mechanism 104, the moving part 106 is arranged on the top of the support platform 101, and the semiconductor resistor 107 is arranged in the support mechanism 103.

[0030] The support table 101 is used to support each mechanism. The loading mechanism 102 loads the semiconductor resistor 107 through the vibration disk, so that the semiconductor resistor 107 is arranged in the supporting mechanism 103. The semiconductor resistor 107 is moved by the moving part 106, so that the semiconductor resistor 107 is moved to the bottom of the cutting mechanism 104, so that the pins of the semiconductor resistor 107 are cut, and then the moving part 106 moves the cut semiconductor resistor 107 to the bottom of the bending mechanism 105, so as to bend the pins of the semiconductor resistor 107, thereby completing the cutting and bending of the pins of the semiconductor resistor 107. The various mechanisms in the main component 100 are existing technologies and will not be described here.

[0031] The protection mechanism 200 is arranged on one side of the support platform 101, and includes a support plate 201a arranged at the end of the support mechanism 103, a rib plate 201b is fixed to one side of the support plate 201a, and the rib plate 201b is fixed to the end of the support mechanism 103 by bolts, a storage box 201c is arranged on the top of the support plate 201a, and a limited block 201d is fixed on the surface of the storage box 201c, a support block 201e is fixed on the top of the support plate 201a, and a baffle 201f is rotatably connected to the surface of the support block 201e, and the top of the support plate 201a is fixed A supporting shell 201g is fixed, a movable sleeve 201h slides inside the supporting shell 201g, a detection plate 201i is fixed on one side of the movable sleeve 201h, a first spring 201j is arranged in the movable sleeve 201h, the other end of the first spring 201j is fixed to the inner wall of the supporting shell 201g, a limiting plate 201k is fixed on one side of the movable sleeve 201h, a limiting groove 201k-1 is provided on one side of the limiting plate 201k, an extrusion surface 201k-2 is provided on one side of the limiting plate 201k, and a positioning block 201l is fixed on one side of the baffle 201f.

[0032] The support plate 201a is fixed to the end of the support mechanism 103 through the rib plate 201b, thereby providing stable support for the storage box 201c. The limit block 201d is used to limit the semiconductor resistor 107, so that after the semiconductor resistor 107 enters the storage box 201c, it will not be easily moved out of the storage box 201c due to the limiting effect of the limit block 201d. A torsion spring is arranged between the support block 201e and the baffle 201f. Through the elastic force of the torsion spring, the baffle 201f can be tightly attached to the surface of the storage box 201c, thereby blocking the storage box 201c and preventing the storage box 201c from shifting when storing the semiconductor resistor 107.

[0033] The first spring 201j is in a compressed state. When the storage box 201c is full of semiconductor resistors 107, the semiconductor resistor 107 at the innermost side of the storage box 201c will push the detection plate 201i, so that the detection plate 201i squeezes the movable sleeve 201h, so that the movable sleeve 201h drives the limiting plate 201k to move, so that the positioning block 201l moves out of the limiting groove 201k-1.

[0034] At this time, the full storage box 201c can squeeze the baffle 201f open, causing the baffle 201f to rotate, thereby allowing the empty storage box 201c on one side to move to this position. During the process of the storage box 201c squeezing and rotating the baffle 201f, since the positioning block 201l is always located on the side of the extrusion surface 201k-2, the movable sleeve 201h cannot drive the limit plate 201k to reset and move. When the new storage box 201c is in place, the baffle 201f is reset under the elastic force of the torsion spring, so that the movable sleeve 201h can move under the elastic force of the first spring 201j, so that the positioning block 201l is clamped into the limit groove 201k-1.

[0035] Specifically, the moving member 106 includes a mounting plate 106a fixed to the top of the support platform 101, a supporting seat 106b is fixed to the top of the mounting plate 106a, a sliding seat 106c is fixed to the top of the supporting seat 106b, and a moving seat 106d slides on the surface of the sliding seat 106c.

[0036] The mounting plate 106a is used to support the supporting seat 106b, and the supporting seat 106b is used to support the sliding seat 106c, so that the moving seat 106d can stably slide on the surface of the sliding seat 106c.

[0037] Specifically, the moving member 106 further includes a fixing frame 106e fixed to one side of the supporting seat 106b, a first cylinder 106f is fixed on the fixing frame 106e, and a push plate 106g is fixed to one side of the moving seat 106d.

[0038] The fixing frame 106e is used to fix and support the first cylinder 106f. The push of the output end of the first cylinder 106f can drive the push plate 106g to move, thereby driving the moving seat 106d to move.

[0039] Specifically, the moving member 106 also includes a slide rod 106h fixed to the top of the moving seat 106d, a moving plate 106i slides on the top of the slide rod 106h, a clamp 106j is fixed on the top of the moving plate 106i, a second cylinder 106k is fixed to one side of the moving seat 106d, and the output end of the second cylinder 106k is fixed to one side of the moving plate 106i.

[0040] The sliding rod 106h is used to support the movable plate 106i so that the movable plate 106i can be close to or away from the supporting mechanism 103. The clamp 106j can be clamped on the surface of the semiconductor resistor 107, so that the movement of the clamp 106j can drive the semiconductor resistor 107 to move, thereby moving the semiconductor resistor 107 on the supporting mechanism 103. The second cylinder 106k is used to drive the movable plate 106i to move. A controller is provided in the support table 101 for controlling multiple cylinders.

[0041] Specifically, the protection mechanism 200 also includes a material unloading part 202, which is arranged on one side of the support platform 101, including a fixed platform 202a fixed to one side of the support platform 101, a positioning frame 202b is fixed on the top of the fixed platform 202a, a storage box 202c is arranged in the positioning frame 202b, and a material unloading chute 202d is fixed on one side of the support plate 201a.

[0042] The fixed platform 202a is used to fix and support the positioning frame 202b, so that the positioning frame 202b can limit the storage box 202c, so that the storage box 202c can hold the full storage box 201c, and the bottom of the unloading chute 202d is inclined. When the storage box 201c moves into the unloading chute 202d, the storage box 201c can slide into the storage box 202c through the guidance of the unloading chute 202d.

[0043] Example 2, reference Figure 1 to Figure 11 , which is the second embodiment of the present invention, and this embodiment is based on the previous embodiment.

[0044] Specifically, the protection mechanism 200 also includes a loading member 203, which is arranged on one side of the support platform 101, including a fixing seat 203a fixed to one side of the support platform 101, a loading box 203b is fixed on the top of the fixing seat 203a, and a storage box 201c is arranged in the loading box 203b.

[0045] The fixing seat 203a is used to fix and support the loading box 203b, and the loading box 203b is used to support multiple storage boxes 201c.

[0046] Specifically, the loading part 203 also includes a stop plate 203c fixed to the inner wall of the loading box 203b, a baffle 203d is fixed to one side of the loading box 203b, a mounting frame 203e is fixed to the other side of the loading box 203b, a third cylinder 203f is fixed to the top of the mounting frame 203e, a top plate 203g is fixed to the output end of the third cylinder 203f, the top plate 203g is embedded in the inner wall of the loading box 203b, a support frame 203l is fixed to the top of the support shell 201g, and a sensor 203m is fixed in the support frame 203l.

[0047] The stop plate 203c and the baffle bar 203d are used to locate the position of the storage box 201c, and the mounting frame 203e is used to fix and support the third cylinder 203f. When the sensor 203m detects that the movable sleeve 201h in the support shell 201g is away from the storage box 201c and the movable sleeve 201h moves to the bottom of the sensor 203m, the sensor 203m can give a start signal to the third cylinder 203f, so that the output end of the third cylinder 203f pushes the top plate 203g, so that the top plate 203g pushes the empty storage box 201c, so that the full storage box 201c is squeezed into the storage box 202c, thereby completing the replacement of the storage box 201c.

[0048] Specifically, the loading member 203 further includes a guide sleeve 203h fixed to the bottom of the fixed platform 202a, an extrusion rod 203i slides in the guide sleeve 203h, a lifting plate 203j is fixed on the top of the extrusion rod 203i, and a second spring 203k is arranged on the surface of the extrusion rod 203i.

[0049] The guide sleeve 203h is used to guide the extrusion rod 203i so that the extrusion rod 203i can move up and down stably. The second spring 203k is in a compressed state and is used to push the lifting plate 203j, so that the lifting plate 203j pushes the storage box 201c in the loading box 203b.

[0050] During use, when the semiconductor resistor 107 is processed, the semiconductor resistor 107 is loaded through the loading mechanism 102, and the semiconductor resistor 107 is driven to move on the supporting mechanism 103 through the moving part 106, so that the cutting mechanism 104 cuts the pins of the semiconductor resistor 107, and then the bending mechanism 105 bends the pins of the semiconductor resistor 107.

[0051] The bent semiconductor resistor 107 moves toward the storage box 201c driven by the moving part 106. As the number of semiconductor resistors 107 stacked on the supporting mechanism 103 on one side of the storage box 201c increases, when the moving part 106 moves a new semiconductor resistor 107, the semiconductor resistor 107 at the end will be pressed into the storage box 201c.

[0052] As more and more semiconductor resistors 107 are pressed into the storage box 201c, the semiconductor resistors 107 will squeeze the detection plate 201i. At this time, the storage box 201c is full of semiconductor resistors 107, and the detection plate 201i will squeeze the movable sleeve 201h, so that the movable sleeve 201h drives the limiting plate 201k to move, thereby making the positioning block 201l move out of the limiting groove 201k-1.

[0053] Thereby, the limit on the positioning block 201l is released. At this time, since the movable sleeve 201h moves to the bottom of the sensor 203m, the sensor 203m can give a start signal to the third cylinder 203f, so that the output end of the third cylinder 203f pushes the top plate 203g, so that the top plate 203g pushes the empty storage box 201c, so that the full storage box 201c is squeezed into the storage box 202c, thereby completing the replacement of the storage box 201c.

[0054] When the new storage box 201c is in place, the baffle 201f is reset under the elastic force of the torsion spring, so that the movable sleeve 201h can move under the elastic force of the first spring 201j, so that the positioning block 201l is clamped into the limiting groove 201k-1, thereby limiting the baffle 201f, so that the baffle 201f can limit the storage box 201c.

[0055] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. An automatic forming device for metal pins of semiconductor devices, characterized in that: include, A main body component (100), comprising a support platform (101), a feeding mechanism (102), a support mechanism (103), a cutting mechanism (104), a bending mechanism (105), a moving part (106), and a semiconductor resistor (107), wherein the feeding mechanism (102) is arranged on one side of the support platform (101), the support mechanism (103) is located on the top of the support platform (101), the cutting mechanism (104) is arranged on the top of the support platform (101), the bending mechanism (105) is arranged on one side of the cutting mechanism (104), the moving part (106) is arranged on the top of the support platform (101), and the semiconductor resistor (107) is arranged in the support mechanism (103); The protection mechanism (200) is arranged on one side of the support platform (101), and comprises a support plate (201a) arranged at the end of the support mechanism (103); a rib plate (201b) is fixed to one side of the support plate (201a); the rib plate (201b) is fixed to the end of the support mechanism (103) by bolts; a storage box (201c) is arranged on the top of the support plate (201a); a limit block (201d) is fixed on the surface of the storage box (201c); a support block (201e) is fixed on the top of the support plate (201a); a baffle (201f) is rotatably connected to the surface of the support block (201e); and the top of the support plate (201a) is provided with a plurality of protective devices. A support shell (201g) is fixed thereto, a movable sleeve (201h) slides inside the support shell (201g), a detection plate (201i) is fixed to one side of the movable sleeve (201h), a first spring (201j) is arranged inside the movable sleeve (201h), the other end of the first spring (201j) is fixed to the inner wall of the support shell (201g), a limit plate (201k) is fixed to one side of the movable sleeve (201h), a limit groove (201k-1) is provided on one side of the limit plate (201k), an extrusion surface (201k-2) is provided on one side of the limit plate (201k), and a positioning block (201l) is fixed to one side of the baffle plate (201f).

2. The automatic forming device for metal pins of semiconductor devices according to claim 1, characterized in that: The movable member (106) comprises a mounting plate (106a) fixed to the top of the support platform (101), a supporting seat (106b) being fixed to the top of the mounting plate (106a), a sliding seat (106c) being fixed to the top of the supporting seat (106b), and a movable seat (106d) slidingly disposed on the surface of the sliding seat (106c).

3. The automatic forming device for metal pins of semiconductor devices as claimed in claim 2, characterized in that: The movable member (106) further comprises a fixed frame (106e) fixed to one side of the support seat (106b), a first cylinder (106f) being fixed on the fixed frame (106e), and a push plate (106g) being fixed to one side of the movable seat (106d).

4. The automatic forming device for metal pins of semiconductor devices as claimed in claim 3, characterized in that: The movable member (106) further comprises a sliding rod (106h) fixed to the top of the movable seat (106d), a movable plate (106i) sliding on the top of the sliding rod (106h), a clamping claw (106j) fixed to the top of the movable plate (106i), a second cylinder (106k) fixed to one side of the movable seat (106d), and an output end of the second cylinder (106k) fixed to one side of the movable plate (106i).

5. The automatic forming device for metal pins of semiconductor devices according to claim 3 or 4, characterized in that: The protection mechanism (200) further comprises a material discharge component (202) which is arranged on one side of the support platform (101), comprising a fixed platform (202a) fixed to one side of the support platform (101), a positioning frame (202b) being fixed on the top of the fixed platform (202a), a storage box (202c) being arranged in the positioning frame (202b), and a material discharge chute (202d) being fixed on one side of the support plate (201a).

6. The automatic forming device for metal pins of semiconductor devices as claimed in claim 5, characterized in that: The protection mechanism (200) further comprises a loading member (203) arranged on one side of the support platform (101), comprising a fixing seat (203a) fixed to one side of the support platform (101), a loading box (203b) being fixed on the top of the fixing seat (203a), and the storage box (201c) being arranged in the loading box (203b).

7. The automatic forming device for metal pins of semiconductor devices according to claim 6, characterized in that: The loading component (203) further comprises a stop plate (203c) fixed to the inner wall of the loading box (203b); a stop bar (203d) is fixed to one side of the loading box (203b); a mounting frame (203e) is fixed to the other side of the loading box (203b); a third cylinder (203f) is fixed to the top of the mounting frame (203e); a top plate (203g) is fixed to the output end of the third cylinder (203f); the top plate (203g) is embedded in the inner wall of the loading box (203b); a support frame (203l) is fixed to the top of the support shell (201g); and a sensor (203m) is fixed in the support frame (203l).

8. The automatic forming device for metal pins of semiconductor devices as claimed in claim 7, characterized in that: The loading member (203) further comprises a guide sleeve (203h) fixed to the bottom of the fixed platform (202a), an extrusion rod (203i) sliding in the guide sleeve (203h), a lifting plate (203j) fixed to the top of the extrusion rod (203i), and a second spring (203k) arranged on the surface of the extrusion rod (203i).

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