An automatic forming device for metal pins of a semiconductor device

Abstract

The present invention relates to the technical field of semiconductor device production, and discloses an automatic forming device for metal pins of semiconductor devices, including a main body assembly, which includes a support table, a feeding mechanism, a support mechanism, a cutting mechanism, a bending mechanism, a moving member, and a semiconductor resistor. The feeding mechanism is arranged on one side of the support table, the support mechanism is located on the top of the support table, the cutting mechanism is arranged on the top of the support table, the bending mechanism is arranged on one side of the cutting mechanism, the moving member is arranged on the top of the support table, and the semiconductor resistor is arranged in the support mechanism. The beneficial effects of the present invention are as follows: the pins of the semiconductor resistor can be cut and bent into shape by setting the main body assembly; the shaped semiconductor resistor can be stored by setting the protection mechanism to prevent its pins from being bent; it can detect whether the storage box is full of semiconductor resistors, and thus automatically replace the storage box.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device production, particularly to an automatic forming device for metal pins of semiconductor devices. Background Art

[0002] In the semiconductor manufacturing industry, the forming of metal pins of semiconductor devices is a crucial link in the production process, and the cutting of metal pins is the primary task in this link. As an important bridge for connecting semiconductor devices with external circuits, the shape, size, and position accuracy of metal pins directly affect the performance and reliability of the devices.

[0003] How to efficiently and accurately complete the cutting process of metal pins has always been the focus and difficulty of technological improvement in the semiconductor manufacturing field. Moreover, after the cutting of metal pins is completed, there are obvious problems in the blanking link of existing automatic forming devices. After the processed semiconductor devices complete pin cutting and shaping, they generally directly fall into a large material box for collection. This blanking method causes multiple semiconductor devices to be stacked randomly in the material box, and it is extremely easy for them to be squeezed against each other. Especially for the already precision-cut metal pins, this disordered stacking method is extremely likely to cause the pins to be squeezed and bent or displaced. Summary of the Invention

[0004] In view of the problems existing in the above-mentioned existing automatic forming device for metal pins of semiconductor devices, the present invention is proposed.

[0005] Therefore, the problem to be solved by the present invention is how to prevent the cut metal pins from being bent or displaced.

[0006] To solve the above technical problems, the present invention provides the following technical solution: an automatic forming device for metal pins of semiconductor devices, which includes a main body assembly, including a support table, a feeding mechanism, a support mechanism, a cutting mechanism, a bending mechanism, a moving member, and a semiconductor resistor. The feeding mechanism is arranged on one side of the support table, the support mechanism is located on the top of the support table, the cutting mechanism is arranged on the top of the support table, the bending mechanism is arranged on one side of the cutting mechanism, the moving member is arranged on the top of the support table, and the semiconductor resistor is arranged in the support mechanism;

[0007] The protection mechanism is arranged on one side of the support platform and includes a support plate arranged at the end of the support mechanism. A rib plate is fixed on one side of the support plate, and the rib plate is fixed to the end of the support mechanism by bolts. A storage box is arranged on the top of the support plate. A limiting block is fixed on the surface of the storage box. A support block is fixed on the top of the support plate. A baffle is rotatably connected to the surface of the support block. A support shell is fixed on the top of the support plate. A moving sleeve slides in the support shell. A detection plate is fixed on one side of the moving sleeve. A first spring is arranged in the moving sleeve, and the other end of the first spring is fixed to the inner wall of the support shell. A limiting plate is fixed on one side of the moving sleeve. A limiting groove is formed on one side of the limiting plate. An extrusion surface is arranged on one side of the limiting plate. A positioning block is fixed on one side of the baffle.

[0008] As a preferred solution of the automatic forming device for metal pins of the semiconductor device according to the present invention, wherein: the moving member includes a mounting plate fixed on the top of the support platform. A support seat is fixed on the top of the mounting plate. A sliding seat is fixed on the top of the support seat. A moving seat slides on the surface of the sliding seat.

[0009] As a preferred solution of the automatic forming device for metal pins of the semiconductor device according to the present invention, wherein: the moving member further includes a fixing frame fixed on one side of the support seat. A first cylinder is fixed on the fixing frame. A push plate is fixed on one side of the moving seat.

[0010] As a preferred solution of the automatic forming device for metal pins of the semiconductor device according to the present invention, wherein: the moving member further includes a sliding rod fixed on the top of the moving seat. A moving plate slides on the top of the sliding rod. A clamping jaw is fixed on the top of the moving plate. A second cylinder is fixed on one side of the moving seat, and the output end of the second cylinder is fixed to one side of the moving plate.

[0011] As a preferred solution of the automatic forming device for metal pins of the semiconductor device according to the present invention, wherein: the protection mechanism further includes a blanking member arranged on one side of the support platform and includes a fixed platform fixed on one side of the support platform. A positioning frame is fixed on the top of the fixed platform. A storage box is arranged in the positioning frame. A blanking chute is fixed on one side of the support plate.

[0012] As a preferred solution of the automatic forming device for metal pins of the semiconductor device according to the present invention, wherein: the protection mechanism further includes a feeding member arranged on one side of the support platform and includes a fixed seat fixed on one side of the support platform. A feeding box is fixed on the top of the fixed seat. The storage box is arranged in the feeding box.

[0013] As a preferred embodiment of the automatic forming device for metal pins of the semiconductor device described in the present invention, the following is provided: The feeding member further includes a stop plate fixed to the inner wall of the feeding box, a stop bar fixed to one side of the feeding box, a mounting bracket fixed to the other side of the feeding box, a third cylinder fixed to the top of the mounting bracket, a top plate fixed to the output end of the third cylinder, the top plate being embedded in the inner wall of the feeding box, a support frame fixed to the top of the support shell, and a sensor fixed inside the support frame.

[0014] As a preferred embodiment of the automatic forming device for metal pins of the semiconductor device described in the present invention, the following is provided: The feeding member further includes a guide sleeve fixed to the bottom of the fixed table, a pressing rod sliding inside the guide sleeve, a lifting plate fixed to the top of the pressing rod, and a second spring disposed on the surface of the pressing rod.

[0015] The beneficial effects of the present invention are as follows: The main body assembly can cut and bend the pins of the semiconductor resistor into shape; the protection mechanism can store the shaped semiconductor resistor to prevent its pins from being bent; it can detect whether the storage box is full of semiconductor resistors, and thus automatically replace the storage box. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings. Among them:

[0017] Figure 1 It is a structural diagram of the automatic forming device for metal pins of the semiconductor device.

[0018] Figure 2 It is a structural diagram of the feeding box of the automatic forming device for metal pins of the semiconductor device.

[0019] Figure 3 It is a structural diagram of the moving member of the automatic forming device for metal pins of the semiconductor device.

[0020] Figure 4 It is another perspective structural diagram of the moving member of the automatic forming device for metal pins of the semiconductor device.

[0021] Figure 5 It is a sectional structural diagram of the feeding box of the automatic forming device for metal pins of the semiconductor device.

[0022] Figure 6 It is for the automatic forming device for metal pins of the semiconductor device Figure 5 Partial enlarged structural view at A in the figure.

[0023] Figure 7 For the Figure 5 enlarged partial structure diagram at position B in

[0024] Figure 8 Storage box structure diagram of the automatic forming device for metal pins of semiconductor devices.

[0025] Figure 9 For the Figure 8 enlarged partial structure diagram at position C in

[0026] Figure 10 Cross-sectional structure diagram of the storage box of the automatic forming device for metal pins of semiconductor devices.

[0027] Figure 11 Positioning block structure diagram of the automatic forming device for metal pins of semiconductor devices. Specific embodiments

[0028] To make the above objects, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings of the specification.

[0029] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described herein. Those skilled in the art can make similar generalizations without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0030] Secondly, the so-called "one embodiment" or "embodiment" herein refers to a specific feature, structure or characteristic that can be included in at least one implementation manner of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that excludes other embodiments.

[0031] Embodiment 1, referring to Figures 1 to 11 , which is the first embodiment of the present invention. This embodiment provides an automatic forming device for metal pins of semiconductor devices. The automatic forming device for metal pins of semiconductor devices includes a main body assembly 100, which includes a support table 101, a feeding mechanism 102, a support mechanism 103, a cutting mechanism 104, a bending mechanism 105, a moving member 106, and a semiconductor resistor 107. The feeding mechanism 102 is arranged on one side of the support table 101, the support mechanism 103 is located on the top of the support table 101, the cutting mechanism 104 is arranged on the top of the support table 101, the bending mechanism 105 is arranged on one side of the cutting mechanism 104, the moving member 106 is arranged on the top of the support table 101, and the semiconductor resistor 107 is arranged in the support mechanism 103.

[0032] The support platform 101 is used to support each mechanism. The feeding mechanism 102 feeds the semiconductor resistors 107 through a vibrating disk, so that the semiconductor resistors 107 are arranged in the support mechanism 103. The moving member 106 moves the semiconductor resistors 107, so that the semiconductor resistors 107 are moved below the cutting mechanism 104, and then the pins of the semiconductor resistors 107 are cut. Then, the moving member 106 moves the cut semiconductor resistors 107 below the bending mechanism 105, so that the pins of the semiconductor resistors 107 are bent. In this way, the cutting and bending of the pins of the semiconductor resistors 107 are completed. The mechanisms in the main body assembly 100 are prior art and will not be described in detail here.

[0033] The protection mechanism 200 is arranged on one side of the support platform 101 and includes a support plate 201a arranged at the end of the support mechanism 103. A rib plate 201b is fixed on one side of the support plate 201a. The rib plate 201b is fixed to the end of the support mechanism 103 by bolts. A storage box 201c is arranged on the top of the support plate 201a. A limit block 201d is fixed on the surface of the storage box 201c. A support block 201e is fixed on the top of the support plate 201a. A baffle 201f is rotatably connected to the surface of the support block 201e. A support shell 201g is fixed on the top of the support plate 201a. A moving sleeve 201h slides in the support shell 201g. A detection plate 201i is fixed on one side of the moving sleeve 201h. A first spring 201j is arranged in the moving sleeve 201h. The other end of the first spring 201j is fixed to the inner wall of the support shell 201g. A limit plate 201k is fixed on one side of the moving sleeve 201h. A limit groove 201k-1 is opened on one side of the limit plate 201k. An extrusion surface 201k-2 is arranged on one side of the limit plate 201k. A positioning block 201l is fixed on one side of the baffle 201f.

[0034] The support plate 201a is fixed to the end of the support mechanism 103 through the rib plate 201b, so as to provide stable support for the storage box 201c. The limit block 201d is used to limit the semiconductor resistors 107. After the semiconductor resistors 107 enter the storage box 201c, due to the limiting effect of the limit block 201d, they will not easily move out of the storage box 201c. A torsion spring is arranged between the support block 201e and the baffle 201f. Due to the elastic force of the torsion spring, the baffle 201f can be made to closely adhere to the surface of the storage box 201c, so as to block the storage box 201c and prevent the storage box 201c from shifting when storing the semiconductor resistors 107.

[0035] The first spring 201j is in a compressed state. When the storage box 201c is full of semiconductor resistors 107, the innermost semiconductor resistor 107 in the storage box 201c will push the detection board 201i, causing the detection board 201i to squeeze the moving sleeve 201h, so that the moving sleeve 201h drives the limit plate 201k to move, and thus the positioning block 201l moves out of the limit groove 201k-1.

[0036] At this time, the full storage box 201c can squeeze open the baffle 201f, causing the baffle 201f to rotate, so that an empty storage box 201c on one side moves to this position. During the process of the storage box 201c squeezing and rotating the baffle 201f, since the positioning block 201l has always been on the side of the extrusion surface 201k-2, the moving sleeve 201h cannot drive the limit plate 201k to move back. When the new storage box 201c is in place, the baffle 201f resets under the elastic force of the torsion spring, so that the moving sleeve 201h can move under the elastic force of the first spring 201j, and the positioning block 201l is snapped into the limit groove 201k-1.

[0037] Specifically, the moving member 106 includes a mounting plate 106a fixed to the top of the support table 101. A support seat 106b is fixed to the top of the mounting plate 106a. A sliding seat 106c is fixed to the top of the support seat 106b. A moving seat 106d slides on the surface of the sliding seat 106c.

[0038] The mounting plate 106a is used to support the support seat 106b, and the support seat 106b is used to support the sliding seat 106c, so that the moving seat 106d can stably slide on the surface of the sliding seat 106c.

[0039] Specifically, the moving member 106 further includes a fixing frame 106e fixed to one side of the support seat 106b. A first cylinder 106f is fixed to the fixing frame 106e. A push plate 106g is fixed to one side of the moving seat 106d.

[0040] The fixing frame 106e is used to fixedly support the first cylinder 106f. By the push of the output end of the first cylinder 106f, the push plate 106g can be driven to move, thereby driving the moving seat 106d to move.

[0041] Specifically, the moving member 106 further includes a sliding rod 106h fixed to the top of the moving seat 106d. A moving plate 106i slides on the top of the sliding rod 106h. A clamping jaw 106j is fixed to the top of the moving plate 106i. A second cylinder 106k is fixed to one side of the moving seat 106d. The output end of the second cylinder 106k is fixed to one side of the moving plate 106i.

[0042] The sliding rod 106h is used to support the moving plate 106i, enabling the moving plate 106i to approach or move away from the support mechanism 103. The clamping jaws 106j can be stuck on the surface of the semiconductor resistor 107, so that the movement of the clamping jaws 106j can drive the semiconductor resistor 107 to move, thereby enabling the semiconductor resistor 107 to move on the support mechanism 103. The second cylinder 106k is used to drive the moving plate 106i to move. A controller is arranged in the support table 101 for controlling multiple cylinders.

[0043] Specifically, the protection mechanism 200 further includes a blanking member 202, which is arranged on one side of the support table 101 and includes a fixed table 202a fixed to one side of the support table 101. A positioning frame 202b is fixed on the top of the fixed table 202a. A storage box 202c is arranged in the positioning frame 202b. A blanking chute 202d is fixed to one side of the support plate 201a.

[0044] The fixed table 202a is used to fixedly support the positioning frame 202b, so that the positioning frame 202b limits the storage box 202c, enabling the storage box 202c to hold the full storage box 201c. The bottom of the blanking chute 202d is inclined. When the storage box 201c moves into the blanking chute 202d, the storage box 201c can slide into the storage box 202c under the guidance of the blanking chute 202d.

[0045] Embodiment 2, refer to Figures 1 to 11 , which is the second embodiment of the present invention, and this embodiment is based on the previous embodiment.

[0046] Specifically, the protection mechanism 200 further includes a feeding member 203, which is arranged on one side of the support table 101 and includes a fixed seat 203a fixed to one side of the support table 101. A feeding box 203b is fixed on the top of the fixed seat 203a. The storage box 201c is arranged in the feeding box 203b.

[0047] The fixed seat 203a is used to fixedly support the feeding box 203b, and the feeding box 203b is used to support multiple storage boxes 201c.

[0048] Specifically, the feeding member 203 further includes a stop plate 203c fixed to the inner wall of the feeding box 203b. A stop bar 203d is fixed to one side of the feeding box 203b. An installation frame 203e is fixed to the other side of the feeding box 203b. A third cylinder 203f is fixed to the top of the installation frame 203e. The output end of the third cylinder 203f is fixed with a top plate 203g, and the top plate 203g is embedded in the inner wall of the feeding box 203b. A support frame 203l is fixed to the top of the support shell 201g, and a sensor 203m is fixed in the support frame 203l.

[0049] The stop plate 203c and the stop bar 203d are used to position the storage box 201c, and the mounting bracket 203e is used to fixedly support the third cylinder 203f. When the sensor 203m detects that the moving sleeve 201h in the support shell 201g moves away from the storage box 201c and the moving sleeve 201h moves below the sensor 203m, the sensor 203m can give a start signal to the third cylinder 203f, so that the output end of the third cylinder 203f pushes the top plate 203g, and the top plate 203g pushes the empty storage box 201c, so that the full storage box 201c is squeezed into the storage box 202c, thereby completing the replacement of the storage box 201c.

[0050] Specifically, the feeding member 203 further includes a guide sleeve 203h fixed to the bottom of the fixed table 202a. A pressing rod 203i slides in the guide sleeve 203h. A lifting plate 203j is fixed to the top of the pressing rod 203i, and a second spring 203k is arranged on the surface of the pressing rod 203i.

[0051] The guide sleeve 203h is used to guide the pressing rod 203i, so that the pressing rod 203i can move up and down stably. The second spring 203k is in a compressed state and is used to push the lifting plate 203j, so that the lifting plate 203j pushes the storage box 201c in the feeding box 203b.

[0052] During use, when processing the semiconductor resistor 107, the semiconductor resistor 107 is fed by the feeding mechanism 102, and the semiconductor resistor 107 is driven by the moving member 106 to move on the support mechanism 103, so that the cutting mechanism 104 cuts the pins of the semiconductor resistor 107, and then the bending mechanism 105 bends the pins of the semiconductor resistor 107.

[0053] The bent semiconductor resistor 107 moves towards the storage box 201c under the drive of the moving member 106. As the number of semiconductor resistors 107 stacked on the support mechanism 103 on one side of the storage box 201c increases, when the moving member 106 moves to a new semiconductor resistor 107, the semiconductor resistor 107 at the outermost end will be pressed into the storage box 201c.

[0054] As more and more semiconductor resistors 107 are pressed into the storage box 201c, the semiconductor resistor 107 will squeeze the detection plate 201i. At this time, the storage box 201c is full of semiconductor resistors 107, and the detection plate 201i will squeeze the moving sleeve 201h, so that the moving sleeve 201h drives the limit plate 201k to move, so that the positioning block 201l moves out of the limit groove 201k-1.

[0055] Thus, the limit on the positioning block 201l is released. At this time, since the moving sleeve 201h moves below the sensor 203m, the sensor 203m can give a start signal to the third cylinder 203f, so that the output end of the third cylinder 203f pushes the top plate 203g, and the top plate 203g pushes the empty storage box 201c, so that the full storage box 201c is squeezed into the storage box 202c, thereby completing the replacement of the storage box 201c.

[0056] When the new storage box 201c is in place, the baffle 201f resets under the elastic force of the torsion spring, so that the moving sleeve 201h can move under the elastic force of the first spring 201j, and the positioning block 201l is clamped into the limiting groove 201k-1 to limit the baffle 201f, so that the baffle 201f can limit the storage box 201c.

[0057] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered by the scope of the claims of the present invention.

Claims

1. An automatic forming device for metal pins of a semiconductor device, characterized in that: including, a main body component (100), comprising a support table (101), a feeding mechanism (102), a support mechanism (103), a cutting mechanism (104), a bending mechanism (105), a moving member (106) and a semiconductor resistor (107). The feeding mechanism (102) is arranged on one side of the support table (101), the support mechanism (103) is located on the top of the support table (101), the cutting mechanism (104) is arranged on the top of the support table (101), the bending mechanism (105) is arranged on one side of the cutting mechanism (104), the moving member (106) is arranged on the top of the support table (101), and the semiconductor resistor (107) is arranged inside the support mechanism (103); a protection mechanism (200), arranged on one side of the support table (101), comprising a support plate (201a) arranged at the end of the support mechanism (103). A rib plate (201b) is fixed on one side of the support plate (201a), and the rib plate (201b) is fixed to the end of the support mechanism (103) by bolts. A storage box (201c) is arranged on the top of the support plate (201a), a limit block (201d) is fixed on the surface of the storage box (201c), a support block (201e) is fixed on the top of the support plate (201a), a baffle (201f) is rotatably connected to the surface of the support block (201e), a support shell (201g) is fixed on the top of the support plate (201a), a moving sleeve (201h) slides inside the support shell (201g), a detection plate (201i) is fixed on one side of the moving sleeve (201h), a first spring (201j) is arranged inside the moving sleeve (201h), the other end of the first spring (201j) is fixed to the inner wall of the support shell (201g), a limit plate (201k) is fixed on one side of the moving sleeve (201h), a limit groove (201k-1) is opened on one side of the limit plate (201k), an extrusion surface (201k-2) is arranged on one side of the limit plate (201k), and a positioning block (201l) is fixed on one side of the baffle (201f).

2. The semiconductor device metal pin automatic forming device according to claim 1, characterized in that: The moving member (106) comprises a mounting plate (106a) fixed on the top of the support table (101), a support seat (106b) fixed on the top of the mounting plate (106a), a sliding seat (106c) fixed on the top of the support seat (106b), and a moving seat (106d) sliding on the surface of the sliding seat (106c).

3. The semiconductor device metal pin automatic forming device according to claim 2, wherein: The moving member (106) further comprises a fixing frame (106e) fixed on one side of the support seat (106b), a first cylinder (106f) fixed on the fixing frame (106e), and a push plate (106g) fixed on one side of the moving seat (106d).

4. The semiconductor device metal pin automatic forming device according to claim 3, characterized in that: The moving member (106) further includes a slide bar (106h) fixed to the top of the moving seat (106d). A moving plate (106i) slides on the top of the slide bar (106h). A jaw (106j) is fixed to the top of the moving plate (106i). A second cylinder (106k) is fixed to one side of the moving seat (106d), and the output end of the second cylinder (106k) is fixed to one side of the moving plate (106i).

5. The semiconductor device metal pin automatic forming device according to claim 3 or 4, characterized in that: The protection mechanism (200) further includes a blanking member (202) disposed on one side of the support table (101), including a fixed table (202a) fixed to one side of the support table (101). A positioning frame (202b) is fixed to the top of the fixed table (202a). A storage box (202c) is disposed within the positioning frame (202b). A blanking chute (202d) is fixed to one side of the support plate (201a).

6. The semiconductor device metal pin automatic forming device according to claim 5, characterized in that: The protection mechanism (200) further includes a feeding member (203) disposed on one side of the support table (101), including a fixed seat (203a) fixed to one side of the support table (101). A feeding box (203b) is fixed to the top of the fixed seat (203a). The storage box (201c) is disposed within the feeding box (203b).

7. The semiconductor device metal pin automatic forming device according to claim 6, wherein: The feeding member (203) further includes a stop plate (203c) fixed to the inner wall of the feeding box (203b). A bar (203d) is fixed to one side of the feeding box (203b). A mounting frame (203e) is fixed to the other side of the feeding box (203b). A third cylinder (203f) is fixed to the top of the mounting frame (203e). The output end of the third cylinder (203f) is fixed to a top plate (203g). The top plate (203g) is embedded in the inner wall of the feeding box (203b). A support frame (203l) is fixed to the top of the support shell (201g). A sensor (203m) is fixed within the support frame (203l).

8. The semiconductor device metal pin automatic forming device according to claim 7, characterized in that: The feeding member (203) further includes a guide sleeve (203h) fixed to the bottom of the fixed table (202a). A pressing rod (203i) slides within the guide sleeve (203h). A lifting plate (203j) is fixed to the top of the pressing rod (203i). A second spring (203k) is disposed on the surface of the pressing rod (203i).

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