Grinding bearing table, grinding thinning device and grinding bearing table adjusting method

Abstract

The embodiment of the invention provides a grinding bearing table, a grinding thinning device and a grinding bearing table adjusting method. The grinding bearing table comprises an installation mechanism used for being rotationally connected with a rotary disc of the grinding and thinning device, and the installation mechanism is provided with an installation space; the suction cup is connected with the mounting mechanism and covers the mounting space, and a bearing surface for bearing a wafer is formed on one surface, back to the mounting mechanism, of the suction cup; and the piezoelectric ceramic body is arranged in the mounting space, is in contact connection with one surface, facing the mounting mechanism, of the suction cup, and is used for deforming when being electrified to apply an acting force to the suction cup so as to adjust the planeness of the bearing surface of the suction cup. In the embodiment of the invention, the active fine adjustment of the planeness of the bearing surface is realized by adjusting the deformation of the piezoelectric ceramic body, and the planeness and the consistency of the wafer in the grinding process are effectively improved. And the fine adjustment can reach the micron level, so that the wafer is ensured to have higher grinding precision, and the self-grinding frequency of the suction cup in the grinding process is reduced.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of semiconductor processing, and in particular to a grinding support platform, a grinding and thinning device, and a grinding support platform adjustment method. Background Art

[0002] At present, IC (Integrated Circuit) products are constantly developing towards high performance, multi-function, low power consumption and miniaturization, which leads to the minimum wire width or feature size of IC chips becoming smaller and smaller, and the manufacturing difficulty is increasing rapidly. In order to increase the number of chip packaging layers, the bottom of the wafer (the opposite side of the device surface on the wafer where the electronic circuit is formed) needs to be ground with high precision by a grinding and thinning device, so that the wafer can reach an ultra-thin form and have a small flatness (Total Thickness Variation, referred to as TTV).

[0003] The grinding platform is a main component of the grinding and thinning device, and the flatness of the bearing surface of the grinding platform is one of the main factors affecting the flatness of the wafer.

[0004] In the related art, the wafer grinding platform mainly includes a ceramic suction cup and a mounting flange, and the ceramic suction cup is mounted on the mounting flange. The contact surfaces between the ceramic suction cup and the mounting flange have high-precision flatness and match each other, so as to improve the flatness of the bearing surface of the wafer grinding platform. However, as the grinding process lasts for a period of time, the flatness of the bearing surface will gradually decrease, resulting in a larger flatness of the wafer after grinding. Summary of the invention

[0005] In view of this, the embodiments of the present application provide a grinding support platform, a grinding thinning device and a grinding support platform adjustment method to at least partially solve the above problems.

[0006] According to a first aspect of an embodiment of the present application, a grinding support platform is provided, comprising: a mounting mechanism for being rotatably connected to a turntable of a grinding and thinning device, the mounting mechanism being provided with a mounting space; a suction cup connected to the mounting mechanism and covering the mounting space, a side of the suction cup facing away from the mounting mechanism being provided with a bearing surface for bearing a wafer; a piezoelectric ceramic body, arranged in the mounting space and in contact with a side of the suction cup facing the mounting mechanism, for deforming when power is supplied to apply a force to the suction cup, thereby adjusting the flatness of the bearing surface of the suction cup.

[0007] Furthermore, in the above-mentioned grinding support platform, there are one or more piezoelectric ceramic bodies.

[0008] Furthermore, in the above-mentioned grinding support platform, the piezoelectric ceramic body is a piezoelectric ceramic stack, a first end of the piezoelectric ceramic stack is connected to the inner bottom surface of the mounting mechanism facing the mounting space, and a second end is in contact with a surface of the suction cup facing the mounting mechanism.

[0009] Furthermore, in the above-mentioned grinding support platform, an embedding hole is formed on the inner bottom surface of the mounting mechanism facing the mounting space, and the first end of the piezoelectric ceramic stack is embedded in the embedding hole.

[0010] Furthermore, the above-mentioned grinding support platform also includes: an adjustment mechanism; wherein the adjustment mechanism is arranged on the mounting mechanism, and the first end of the piezoelectric ceramic stack is connected to the inner bottom surface of the mounting mechanism toward the mounting space through the adjustment mechanism, and the adjustment mechanism is used to adjust the prestress applied by the piezoelectric ceramic stack to the suction cup.

[0011] Furthermore, in the above-mentioned grinding support platform, the support member, the mounting mechanism is rotatably connected to the turntable of the grinding and thinning device through the support member; the adjustment mechanism includes: an adjusting push rod, the mounting mechanism is provided with a mounting through hole on the inner bottom surface facing the mounting space, the support member is provided with a accommodating space on a side facing the mounting mechanism, the adjusting push rod is passed through the mounting through hole and the first end of the adjusting push rod is placed in the accommodating space, the first end of the piezoelectric ceramic stack is connected to the second end of the adjusting push rod; a locking nut, the locking nut is placed in the accommodating space and is threadedly connected to the first end of the adjusting push rod.

[0012] Furthermore, in the above-mentioned grinding support platform, the piezoelectric ceramic body is a stacked piezoelectric ceramic ring; the first end surface of the stacked piezoelectric ceramic ring is connected to the inner bottom surface of the mounting mechanism facing the mounting space, and the second end surface is in contact with a surface of the suction cup facing the mounting mechanism.

[0013] Furthermore, in the above-mentioned grinding support platform, an annular groove is formed on the inner bottom surface of the mounting mechanism facing the mounting space, and the first end surface of the stacked piezoelectric ceramic ring is embedded in the annular groove.

[0014] Furthermore, in the above-mentioned grinding carrier, the stacked piezoelectric ceramic rings are one or more; when the stacked piezoelectric ceramic rings are multiple, the diameter of each stacked piezoelectric ceramic ring gradually decreases and they are concentrically arranged.

[0015] Furthermore, the grinding support platform further includes: an electric drive mechanism, which is arranged on the mounting mechanism or the support member and is electrically connected to the piezoelectric ceramic body, and is used to drive the piezoelectric ceramic body to deform.

[0016] Furthermore, the above-mentioned grinding support platform also includes: a detection mechanism, which is used to detect the flatness of the support surface and send the detected flatness; a control mechanism, which is electrically connected to the detection mechanism and the electric drive mechanism, and is used to receive the flatness and adjust the size of the driving current provided by the electric drive mechanism according to the received flatness, thereby adjusting the flatness of the support surface.

[0017] Furthermore, in the above-mentioned grinding support platform, there are one or more piezoelectric ceramic bodies; when there are multiple piezoelectric ceramic bodies, the electric drive mechanism is electrically connected to each of the piezoelectric ceramic bodies, and can provide the same or different driving currents to each of the piezoelectric ceramic bodies at the same time; the control mechanism is used to adjust the size of the driving current provided by the electric drive mechanism to each of the piezoelectric ceramic bodies according to the received flatness.

[0018] According to a second aspect of an embodiment of the present application, a grinding and thinning device is provided for wafer processing, comprising: a base, a turntable arranged on the base, and at least one grinding support platform as described above; wherein a mounting mechanism in the grinding support platform is rotatably connected to the turntable.

[0019] According to the third aspect of the embodiment of the present application, a method for adjusting a grinding platform is provided, wherein the grinding platform is any one of the above-mentioned grinding platforms, and the method comprises the following steps: detecting the flatness of the bearing surface of the grinding platform; determining the deformation amount of each piezoelectric ceramic body according to the detected flatness; determining the driving current of each piezoelectric ceramic body according to each deformation amount; and providing a corresponding driving current to each piezoelectric ceramic body according to each determined driving current.

[0020] According to the fourth aspect of the embodiment of the present application, there is provided an electronic device, comprising: a processor, a memory, a communication interface and a communication bus, wherein the processor, the memory and the communication interface communicate with each other through the communication bus; the memory is used to store at least one executable instruction, and the executable instruction enables the processor to perform operations corresponding to the above-mentioned grinding support platform adjustment method.

[0021] According to a fifth aspect of the embodiments of the present application, a computer storage medium is provided, on which a computer program is stored, and when the program is executed by a processor, the above-mentioned grinding support platform adjustment method is implemented.

[0022] According to a sixth aspect of an embodiment of the present application, a computer program product is provided, comprising computer instructions, wherein the computer instructions instruct a computing device to perform operations corresponding to any one of the above-mentioned grinding carrier adjustment methods.

[0023] In this embodiment, by adjusting the deformation of the piezoelectric ceramic body, the active fine-tuning of the flatness of the bearing surface is achieved, which effectively improves the flatness and consistency of the wafer during the grinding process. And the fine-tuning can reach the micron level, ensuring that the wafer has a high grinding accuracy. In addition, since the flatness of the bearing surface during the grinding process is guaranteed, the frequency of self-grinding of the suction cup during the grinding process is also reduced, thereby extending the service life of the suction cup and reducing maintenance costs and replacement frequency.

[0024] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and other objects, features and advantages of the present application will become more apparent by describing in more detail exemplary embodiments of the present application in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments of the present application.

[0026] Figure 1 1 is a schematic diagram showing the structure of a wafer grinding support platform;

[0027] Figure 2 A schematic diagram of the three-dimensional structure of a grinding support platform shown in an embodiment of the present application;

[0028] Figure 3 An axial cross-sectional view of a grinding support platform shown in an embodiment of the present application;

[0029] Figure 4 is a schematic diagram of the arrangement of a piezoelectric ceramic stack in an embodiment of the present application;

[0030] Figure 5 Another axial cross-sectional view of a grinding support platform shown in an embodiment of the present application;

[0031] Figure 6 A schematic diagram of the arrangement of stacked piezoelectric ceramic rings shown in an embodiment of the present application;

[0032] Figure 7 A schematic diagram of the three-dimensional structure of a grinding and thinning device shown in an embodiment of the present application;

[0033] Figure 8 A schematic diagram of a process flow of a grinding support table adjustment method shown in an embodiment of the present application;

[0034] Fig. 9 A schematic diagram of the structure of an electronic device shown in an embodiment of the present application;

[0035] In the figure:

[0036] Grinding bearing platform 100; support member 110; accommodating space 111; mounting mechanism 120; mounting space 121; suction cup 130; bearing surface 131; suction cup seat 132; porous ceramic adsorbent 133; piezoelectric ceramic body 140; adjustment mechanism 150; adjustment push rod 151; locking nut 152; adjustment flange 160; air bearing 170; vacuum pipeline 180;

[0037] Grinding and thinning device 200; base 210; turntable 220; grinding wheel 240;

[0038] Processor 902 ; communication interface 904 ; memory 906 ; communication bus 908 ; program 910 . DETAILED DESCRIPTION

[0039] The preferred embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0040] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0041] It should be understood that although the terms "first", "second", "third", etc. may be used in the present application to describe various components, these components should not be limited to these terms. These terms are only used to distinguish components of the same type from each other. For example, without departing from the scope of the present application, the first component may also be referred to as the second component, and similarly, the second component may also be referred to as the first component. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0042] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0043] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0044] In the related art, the wafer grinding platform mainly includes a ceramic suction cup and a mounting flange, and the ceramic suction cup is mounted on the mounting flange. The contact surfaces between the ceramic suction cup and the mounting flange have high-precision flatness and match each other, so as to improve the flatness of the wafer grinding platform. However, as the grinding process lasts for a period of time, the flatness of the wafer bearing surface 310' will gradually deteriorate, resulting in large fluctuations on the surface of the wafer 320' after grinding, and poor flatness, such as Figure 1 shown.

[0045] In view of the above problems, an embodiment of the present application provides a grinding support platform to at least partially solve the above technical problems.

[0046] The technical solution of the embodiments of the present application is described in detail below with reference to the accompanying drawings.

[0047] See also Figures 2 to 6 According to one embodiment of the present application, a grinding support platform 100 includes a mounting mechanism 120 , a suction cup 130 and a piezoelectric ceramic body 140 .

[0048] The mounting mechanism 120 is used to be connected to the rotating disk 220 (see Figure 7 ) rotatably connected. For example, the mounting mechanism 120 can be relatively rotatably connected via an air bearing 170. In a specific implementation, the mounting mechanism 120 can be a columnar body or the like.

[0049] The mounting mechanism 120 is provided with a mounting space 121 which is open toward the suction cup 130. The suction cup 130 is connected to the mounting mechanism 120 and covers the mounting space 121. For example, the outer diameter of the suction cup 130 may be matched with (e.g., equal to) the outer diameter of the mounting mechanism 120 and covers the opening of the mounting space 121. The suction cup 130 has a carrying surface 131 formed on one side facing away from the mounting mechanism 120, and the carrying surface 131 is used to place a wafer.

[0050] In a specific implementation, the suction cup 130 may be a ceramic suction cup, and the connection between the suction cup 130 and the mounting mechanism 120 may be a detachable connection, such as a bolt connection. More specifically, the suction cup 130 may include, for example, a suction cup seat 132 made of ceramic and a porous ceramic adsorbent 133 (such as a porous ceramic adsorbent body 133) in fluid communication with the suction cup seat. Figure 3 The middle section is a dotted part). The suction cup seat 132 is configured with a mounting recess on the side facing away from the mounting mechanism 120, and the porous ceramic adsorbent 133 is arranged in the mounting recess. The side of the porous ceramic adsorbent 133 facing away from the mounting mechanism 120 is formed as a bearing surface 131.

[0051] The piezoelectric ceramic body 140 is disposed in the installation space 121 and is in contact with a surface of the suction cup 130 facing the installation mechanism 120 , and is used to deform when powered to apply force to the suction cup 130 , thereby adjusting the flatness of the bearing surface 131 of the suction cup 130 .

[0052] It can be understood that the deformation of the piezoelectric ceramic body 140 when powered on increases with the increase of the driving current. Therefore, this embodiment can adjust the driving current of the piezoelectric ceramic body 140 and then adjust the force of the piezoelectric ceramic body 140 on the suction cup 130 to change the flatness of the bearing surface 131.

[0053] In specific implementation, one piezoelectric ceramic body 140 may be provided, or multiple piezoelectric ceramic bodies 140 may be provided, that is, more than one. When multiple piezoelectric ceramic bodies 140 are provided, each piezoelectric ceramic body 140 may be evenly distributed in the installation space, or unevenly distributed, and the specific distribution form may be arranged according to the need to adjust the flatness of the bearing surface 131.

[0054] In this embodiment, by adjusting the deformation of the piezoelectric ceramic body 140, the active fine-tuning of the flatness of the bearing surface 131 is achieved, which effectively improves the flatness and consistency of the wafer during the grinding process. And the fine-tuning can reach the micron level, ensuring that the wafer has a high grinding accuracy. In addition, since the flatness of the bearing surface 131 during the grinding process is guaranteed, the frequency of self-grinding of the suction cup 130 during the grinding process is also reduced, thereby extending the service life of the suction cup 130 and reducing maintenance costs and replacement frequency.

[0055] In some embodiments, see Figure 3, the piezoelectric ceramic body 140 is a piezoelectric ceramic stack. The first end ( Figure 3 The lower end shown in FIG. 1 is connected to the inner bottom surface of the mounting mechanism 120 facing the mounting space 121, and the second end ( Figure 3 The upper end shown in the figure is in contact and connected with a side of the suction cup 130 facing the mounting mechanism 120.

[0056] In specific implementation, the piezoelectric ceramic stack can be a columnar body, a cylindrical body, a truncated cone body, etc. The first end of the piezoelectric ceramic stack and the inner bottom surface of the mounting mechanism 120 facing the mounting space can be fixedly connected, such as bonding, or can be contact-connected. When it is a contact connection, the piezoelectric ceramic body 140 is clamped between the mounting mechanism 120 and the suction cup 130.

[0057] Furthermore, an embedding hole is formed on the inner bottom surface of the mounting mechanism 120 facing the mounting space 121 , and the first end of the piezoelectric ceramic stack is embedded in the embedding hole to more stably fix the piezoelectric ceramic stack.

[0058] In some embodiments, see Figure 3 , and may further include: an adjustment mechanism 150. The adjustment mechanism 150 is disposed in the installation space 121, and the first end of the piezoelectric ceramic stack is connected to the inner bottom surface of the installation mechanism 120 toward the installation space through the adjustment mechanism 150, and the adjustment mechanism 150 is used to adjust the prestress applied by the piezoelectric ceramic stack to the suction cup 130.

[0059] Specifically, a first end of the piezoelectric ceramic stack is connected to the adjustment mechanism 150 , and a second end of the piezoelectric ceramic stack is in contact with and connected to a surface of the suction cup 130 that faces the mounting mechanism 120 .

[0060] In specific implementation, appropriate pre-pressure can be applied to the piezoelectric ceramic stack according to actual conditions.

[0061] In this embodiment, due to the setting of the prestress, the response characteristics and service life of the piezoelectric ceramic stack can be affected to a certain extent, thereby optimizing the performance of the entire system.

[0062] Further, in some embodiments, see Figure 3 , further comprising: a support member 110. The mounting mechanism 120 is rotatably connected to the turntable 220 of the grinding and thinning device through the support member 110.

[0063] Specifically, the mounting mechanism 120 is placed above the support member 110 (relative to Figure 1 and Figure 2The mounting mechanism 120 and the support member 110 may be detachably connected, such as by bolts, magnetic connection, etc., or may be fixedly connected, such as by welding, riveting, bonding, etc. The support member 110 is rotatably connected to the turntable 220, for example, the support member 110 may be connected to the turntable 220 via an air bearing.

[0064] Accordingly, the adjustment mechanism 150 may include: an adjustment push rod 151 and a locking nut 152. The mounting mechanism 120 is provided with a mounting through hole (not shown in the figure) on the inner bottom surface facing the mounting space 121, and the support member 110 is provided with a receiving space 111 on one side facing the mounting mechanism 120. The adjustment push rod 151 is passed through the mounting through hole and the first end ( Figure 3 The lower end shown in the figure) is placed in the accommodation space 111, and the first end of the piezoelectric ceramic stack and the second end of the adjusting top rod ( Figure 3 The locking nut 152 is placed in the accommodating space 111 and is threadedly connected to the first end of the adjusting push rod 151.

[0065] In specific implementation, the second end of the adjusting top rod 151 can be in contact with the piezoelectric ceramic stack, bonded, etc. A groove can also be provided at the second end of the adjusting top rod 151, and the first end of the piezoelectric ceramic stack is embedded in the groove to fix the piezoelectric ceramic stack more stably.

[0066] In this embodiment, the piezoelectric ceramic stack is placed between the adjusting top rod 151 and the suction cup 130, and the adjusting top rod 151 and the locking nut 152 are matched and installed on the mounting mechanism 120. The adjusting top rod 151 can adjust the pre-pressure of the piezoelectric ceramic stack, and the locking nut 152 locks the adjusting top rod 151 after the position is adjusted.

[0067] In specific implementation, there may be one or more piezoelectric ceramic stacks and adjustment mechanisms 150. When there are more than one piezoelectric ceramic stacks and adjustment mechanisms 150, they may be evenly distributed along the circumferential direction with the rotation axis of the support 110 as the center. They may be distributed in the same circumference, or in multiple concentric circumferences of different diameters. The specific distribution form may be determined according to actual conditions, and this embodiment does not make any limitation here.

[0068] In some embodiments, see Figure 5 and Figure 6 The piezoelectric ceramic body may be a stacked piezoelectric ceramic ring. The first end surface ( Figure 5 The upper end surface shown in FIG. 1 is connected to the inner bottom surface of the mounting mechanism 120 facing the mounting space 121, and the second end surface ( Figure 5The lower end surface shown in FIG. 1 is in contact with a side of the suction cup 130 facing the mounting mechanism 120. When the stacked piezoelectric ceramic rings are powered, they can deform along the height direction, thereby adjusting the flatness of the bearing surface 131 of the suction cup 130.

[0069] In a specific implementation, the first end surface of the stacked piezoelectric ceramic rings and the bottom surface of the installation space 121 may be in contact connection or in a fixed connection, such as bonding.

[0070] See also Figure 7 During the grinding process, the wafer is adsorbed on the grinding carrier 100, and the bearing surface rotates with the wafer. The rotation axis of the grinding wheel 240 is sometimes not parallel to the rotation axis of the grinding carrier 100 (or the axis of the wafer), that is, the grinding surface of the grinding wheel 240 and the upper surface of the grinding carrier 100 are sometimes not parallel, but there is a certain grinding angle, so that after the grinding process, the upper surface of the grinding carrier 100, more specifically the bearing surface of the suction cup, may be uneven in the local annular area. In view of this feature, the piezoelectric ceramic body in the embodiment of the present application is designed to be annular so that the stacked piezoelectric ceramic ring can actively fine-tune the corresponding annular uneven area. By adjusting the stacked piezoelectric ceramic ring, the actual relative motion process of the grinding wheel 240 and the grinding carrier 100 during the grinding process is effectively combined, and the flatness of the carrier can be adjusted more conveniently and modularly, which not only improves the grinding efficiency, but also ensures the uniformity and consistency of the wafer during the grinding process, thereby improving the product quality.

[0071] Further, in some embodiments, see Figure 5 An annular groove is formed on the inner bottom surface of the mounting mechanism 120 facing the mounting space 121, and the first end surface of the stacked piezoelectric ceramic ring is embedded in the annular groove to better fix the stacked piezoelectric ceramic ring.

[0072] In some embodiments, the number of stacked piezoelectric ceramic rings is one.

[0073] In some other embodiments, there are multiple stacked piezoelectric ceramic rings, and the diameter of each stacked piezoelectric ceramic ring can be gradually reduced and arranged concentrically. In a specific implementation, each stacked piezoelectric ceramic ring can be evenly or unevenly distributed with the rotation axis of the support body 110 as the center.

[0074] In some embodiments, it may also include: an electric drive mechanism (not shown in the figure). The electric drive mechanism may be arranged on the mounting mechanism 120 or the support member 110, and electrically connected to the piezoelectric ceramic body 140, and is used to provide a driving current to the piezoelectric ceramic body 140 to drive the piezoelectric ceramic body 140 to deform. Specifically, the electric drive mechanism may be placed in the mounting space 121 or the accommodating space 111; or the electric drive mechanism may be arranged outside the mounting mechanism 120 or the support member 110 and electrically connected to the outer side wall of the mounting mechanism 120 or the support member 110 rotatably, for example, through a conductive slide, and the outer side wall of the mounting mechanism 120 or the support member 110 may be further electrically connected to the piezoelectric ceramic body 140 through a conductive member such as a conductive plate disposed therein.

[0075] In a specific implementation, the interior of the adjusting top rod 151 can be a hollow structure, and a through hole 151A is provided on the side wall of the adjusting top rod 151. The hollow structure provides a passage for the power wire of the piezoelectric ceramic body 140, and the power wire is led out from the through hole 151A and connected to the electric drive mechanism. The electric drive mechanism and the external power supply can be connected electrically in the accommodating space 111 by means of a slide connection, so that the circuit can be kept smoothly connected when the support member 110 drives the entire grinding carrier 100 to rotate.

[0076] In some embodiments, the device may further include: a detection mechanism and a control mechanism. The detection mechanism is used to detect the flatness of the bearing surface 131 and send the detected flatness to the control mechanism. The control mechanism is electrically connected to the detection mechanism and the electric drive mechanism, and is used to receive the flatness and adjust the magnitude of the driving current provided by the electric drive mechanism to the piezoelectric ceramic body according to the received flatness, thereby adjusting the flatness of the bearing surface 131.

[0077] When there are multiple piezoelectric ceramic bodies 140, the electric drive mechanism can be electrically connected to each piezoelectric ceramic body 140, and can provide the same or different driving currents to each piezoelectric ceramic body 140 at the same time; the control mechanism can adjust the size of the driving current provided by the electric drive mechanism to each piezoelectric ceramic body 140 according to the received flatness.

[0078] It is understood that in some embodiments, see Figure 2 and Figure 3 , and may further include an adjustment flange 160 . The adjustment flange 160 is connected to the turntable, and the adjustment flange 160 is used to adjust the inclination angle of the carrying surface 131 , and further adjust the grinding angle of the wafer placed on the carrying surface 131 .

[0079] In a specific implementation, the adjusting flange 160 can be connected to the outer ring of the air bearing 170, and the supporting member 110 can be connected to the inner ring of the air bearing 170. The air bearing 170 is installed on the turntable and placed below the adjusting flange 20 to play a role of rotation support. The adjusting flange 160 and the supporting member 110 are connected to each other in relative rotation through the air bearing 170.

[0080] It is understood that in some embodiments, a vacuum line 180 may be further provided. The vacuum line 180 may provide a vacuum environment for the suction cup 130 .

[0081] See also Figure 7 The embodiment of the present application also provides a grinding and thinning device 200 for wafer processing. The device includes: a base 210, a turntable 220 disposed on the base 210, and at least one of the above-mentioned grinding platforms 100. The mounting mechanism 120 in the grinding platform 100 is rotatably connected to the turntable 220.

[0082] In this embodiment, the grinding platform 100 plays a role in adsorbing and supporting the wafer during the thinning process.

[0083] The specific implementation process of the grinding support platform 100 can be found in the above description, and this application will not go into details here.

[0084] In a specific implementation, one or more grinding platforms 100 may be provided. When more than one is provided, they may be evenly or unevenly distributed along the circumferential direction. Figure 7 There are three evenly distributed at intervals of 120°.

[0085] Since the grinding platform 100 has the above-mentioned effects, the grinding and thinning device 200 having the grinding platform 100 also has corresponding technical effects.

[0086] See also Figure 8 The present application also provides a method for adjusting a grinding support platform, wherein the grinding support platform is any of the above-mentioned grinding support platforms. The method comprises the following steps:

[0087] Step S801 , detecting the flatness of the bearing surface 131 of the grinding bearing platform.

[0088] Specifically, the flatness of the carrying surface 131 may be detected by an optical device such as a laser interferometer, an optical scanner, or a pneumatic flatness measuring instrument.

[0089] Step S802: determining the deformation amount of each piezoelectric ceramic body according to the detected flatness.

[0090] Specifically, the amount of deformation of each piezoelectric ceramic body 140 required to correct the flatness of the bearing surface 131 is calculated.

[0091] Step S803, determining the driving current of each piezoelectric ceramic body according to each deformation amount.

[0092] Since there is a corresponding relationship between the deformation amount of the piezoelectric ceramic body 140 and the driving current, the driving current of each piezoelectric ceramic body 140 can be determined according to the deformation amount.

[0093] Step S804: providing corresponding driving currents to the piezoelectric ceramic bodies according to the determined driving currents.

[0094] In this embodiment, the flatness of the bearing surface 131 can be detected in real time during the grinding process, and the driving current of the piezoelectric ceramic body 140 can be adjusted according to the detected flatness, so that the piezoelectric ceramic body is deformed to adjust the flatness of the bearing surface 131 in real time. Of course, according to the flatness feedback result after the wafer grinding is completed, the piezoelectric ceramic body 140 at the corresponding point can be powered to deform, and a force can be generated on the bottom surface of the suction cup 130, thereby improving the flatness of the bearing surface 131 of the suction cup 130.

[0095] In this embodiment, by adjusting the deformation of the piezoelectric ceramic body 140, the active fine-tuning of the flatness of the bearing surface 131 is achieved, which effectively improves the flatness of the wafer during the grinding process. And the fine-tuning can reach the micron level, ensuring that the wafer has a high processing accuracy. In addition, since the flatness of the bearing surface 131 during the grinding process is guaranteed, the frequency of self-grinding of the suction cup 130 during the grinding process is also reduced, thereby extending the service life of the suction cup 130 and reducing maintenance costs and replacement frequency.

[0096] The grinding support platform, the grinding thinning device, and the grinding support platform adjustment method in this embodiment have the same principles, and the relevant parts can be referenced to each other.

[0097] The embodiment of the present application also provides an electronic device, Fig. 9 A schematic diagram of the structure of an electronic device proposed according to an embodiment of the present application is shown. The specific embodiment of the present application does not limit the specific implementation of the electronic device.

[0098] like Fig. 9 As shown, the electronic device may include: a processor 902, a communication interface 904, a memory 906, and a communication bus 908. The processor 902, the communication interface 904, and the memory 906 communicate with each other through the communication bus 908. The communication interface 904 is used to communicate with other electronic devices or servers. The processor 902 is used to execute a program 910, which can specifically execute the relevant steps in the above-mentioned grinding support adjustment method embodiment.

[0099] Specifically, the program 910 may include program codes, which include computer operation instructions.

[0100] The processor 902 may be a central processing unit (CPU), or an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present application. The one or more processors included in the smart device may be processors of the same type, such as one or more CPUs; or may be processors of different types, such as one or more CPUs and one or more ASICs.

[0101] The memory 906 is used to store the program 910. The memory 906 may include a high-speed RAM memory, and may also include a non-volatile memory, such as at least one disk memory.

[0102] The program 910 may be specifically configured to enable the processor 902 to perform the following operations:

[0103] The specific implementation of each step in program 910 can refer to the corresponding description of the corresponding steps and units in the above-mentioned grinding support adjustment method embodiment, which will not be repeated here. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working process of the above-described equipment and modules can refer to the corresponding process description in the above-mentioned method embodiment, which will not be repeated here.

[0104] The grinding platform adjustment method of this embodiment can be executed by any appropriate electronic device with data processing capabilities, including but not limited to: a server, a mobile terminal (such as a mobile phone, a PAD, etc.) and a PC, etc.

[0105] An embodiment of the present application further provides a computer storage medium on which a computer program is stored. When the program is executed by a processor, the grinding support platform adjustment method as described above is implemented.

[0106] An embodiment of the present application also provides a computer program product, including computer instructions, which instruct a computing device to perform operations corresponding to any of the above-mentioned grinding support platform adjustment methods.

[0107] It should be pointed out that, according to the needs of implementation, the various components / steps described in the embodiments of the present application can be split into more components / steps, or two or more components / steps or partial operations of components / steps can be combined into new components / steps to achieve the purpose of the embodiments of the present application.

[0108] The above-mentioned method according to the embodiment of the present application can be implemented in hardware, firmware, or implemented as software or computer code that can be stored in a recording medium (such as a CD ROM, RAM, floppy disk, hard disk or magneto-optical disk), or implemented as a computer code originally stored in a remote recording medium or a non-temporary machine-readable medium downloaded through a network and to be stored in a local recording medium, so that the method described herein can be stored in such software processing on a recording medium using a general-purpose computer, a dedicated processor or programmable or dedicated hardware (such as an AS IC or FPGA). It can be understood that a computer, a processor, a microprocessor controller or programmable hardware includes a storage component (e.g., RAM, ROM, flash memory, etc.) that can store or receive software or computer code, and when the software or computer code is accessed and executed by a computer, a processor or hardware, the grinding carrier adjustment method described herein is implemented. In addition, when a general-purpose computer accesses the code for implementing the grinding carrier adjustment method shown herein, the execution of the code converts the general-purpose computer into a dedicated computer for executing the grinding carrier adjustment method shown herein.

[0109] Those of ordinary skill in the art will appreciate that the units and method steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the embodiments of the present application.

[0110] The above implementation methods are only used to illustrate the embodiments of the present application, and are not limitations on the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The scope of patent protection of the embodiments of the present application should be limited by the claims.

Claims

1. A grinding support platform, characterized in that: include: A mounting mechanism, used for being rotatably connected to the turntable of the grinding and thinning device, wherein the mounting mechanism is provided with a mounting space; A suction cup connected to the mounting mechanism and covering the mounting space, wherein a side of the suction cup facing away from the mounting mechanism is formed with a bearing surface for bearing a wafer; The piezoelectric ceramic body is arranged in the installation space and is in contact with a side of the suction cup facing the installation mechanism, and is used to deform when powered on to apply a force to the suction cup, thereby adjusting the flatness of the bearing surface of the suction cup.

2. The grinding support platform according to claim 1, characterized in that: The number of the piezoelectric ceramic bodies is one or more.

3. The grinding support platform according to claim 1, characterized in that: The piezoelectric ceramic body is a piezoelectric ceramic stack, a first end of the piezoelectric ceramic stack is connected to the inner bottom surface of the mounting mechanism facing the mounting space, and a second end is in contact with and connected to a surface of the suction cup facing the mounting mechanism.

4. The grinding support platform according to claim 3, characterized in that: The mounting mechanism is provided with an embedding hole on the inner bottom surface facing the mounting space, and the first end of the piezoelectric ceramic stack is embedded in the embedding hole.

5. The grinding support platform according to claim 3, characterized in that: Also includes: regulating mechanism; wherein, The adjustment mechanism is arranged on the mounting mechanism, and the first end of the piezoelectric ceramic stack is connected to the inner bottom surface of the mounting mechanism facing the mounting space through the adjustment mechanism. The adjustment mechanism is used to adjust the prestress applied by the piezoelectric ceramic stack to the suction cup.

6. The grinding support platform according to claim 5, characterized in that: Also includes: A support member, through which the mounting mechanism is rotatably connected to the turntable of the grinding and thinning device; The regulating mechanism comprises: An adjusting push rod, wherein the inner bottom surface of the mounting mechanism facing the mounting space is provided with a mounting through hole, the support member is provided with a receiving space on one side facing the mounting mechanism, the adjusting push rod is passed through the mounting through hole and the first end of the adjusting push rod is placed in the receiving space, and the first end of the piezoelectric ceramic stack is connected to the second end of the adjusting push rod; A locking nut is placed in the accommodating space and is threadedly connected to the first end of the adjusting push rod.

7. The grinding support platform according to claim 1, characterized in that: The piezoelectric ceramic body is a stacked piezoelectric ceramic ring; The first end surface of the stacked piezoelectric ceramic ring is connected to the inner bottom surface of the mounting mechanism facing the mounting space, and the second end surface is in contact with and connected to a surface of the suction cup facing the mounting mechanism.

8. The grinding support platform according to claim 7, characterized in that: The mounting mechanism is provided with an annular groove on the inner bottom surface facing the mounting space, and the first end surface of the stacked piezoelectric ceramic rings is embedded in the annular groove.

9. The grinding support platform according to claim 7 or 8, characterized in that: The stacked piezoelectric ceramic rings are one or more; When there are a plurality of stacked piezoelectric ceramic rings, the diameters of the stacked piezoelectric ceramic rings gradually decrease and the rings are arranged concentrically.

10. The grinding support platform according to any one of claims 1 to 8, characterized in that: Also includes: The electric drive mechanism is electrically connected to the piezoelectric ceramic body and is used to drive the piezoelectric ceramic body to deform.

11. The grinding support platform according to claim 10, characterized in that: Also includes: A detection mechanism, used for detecting the flatness of the bearing surface and sending the detected flatness; The control mechanism is electrically connected to the detection mechanism and the electric drive mechanism, and is used to receive the flatness and adjust the magnitude of the driving current provided by the electric drive mechanism according to the received flatness, thereby adjusting the flatness of the bearing surface.

12. The grinding support platform according to claim 11, characterized in that: The piezoelectric ceramic body is one or more; When there are multiple piezoelectric ceramic bodies, the electric drive mechanism is electrically connected to each of the piezoelectric ceramic bodies, and can provide the same or different drive currents to each of the piezoelectric ceramic bodies at the same time; The control mechanism is used to adjust the magnitude of the driving current provided by the electric driving mechanism to each of the piezoelectric ceramic bodies according to the received flatness.

13. A grinding and thinning device for wafer processing, characterized in that: include: A base, a turntable arranged on the base, and at least one grinding support platform according to any one of claims 1 to 12; wherein a mounting mechanism in the grinding support platform is rotatably connected to the turntable.

14. A method for adjusting a grinding carrier, wherein the grinding carrier is the grinding carrier as claimed in any one of claims 1 to 12, characterized in that: The steps include: Detect the flatness of the bearing surface of the grinding bearing table; Determining the deformation amount of each piezoelectric ceramic body according to the detected flatness; Determining the driving current of each of the piezoelectric ceramic bodies according to each of the deformation amounts; A corresponding driving current is provided to each of the piezoelectric ceramic bodies according to the determined driving currents.

15. An electronic device, characterized in that: include: A processor, a memory, a communication interface and a communication bus, wherein the processor, the memory and the communication interface communicate with each other via the communication bus; The memory is used to store at least one executable instruction, and the executable instruction enables the processor to execute operations corresponding to the grinding support platform adjustment method as described in claim 14.

16. A computer storage medium, characterized in that: A computer program is stored thereon, and when the program is executed by a processor, the grinding support platform adjustment method as claimed in claim 14 is implemented.

17. A computer program product, characterized in that It includes computer instructions, which instruct the computing device to perform operations corresponding to the grinding carrier adjustment method as claimed in claim 14.

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