Semiconductor and evaporation core linkage refrigerating / heating device
By combining the semiconductor module with the evaporative core assembly, the use of electrical energy to generate cold or hot air, the poor refrigeration effect and consistency of traditional air conditioners is solved, the amount of refrigerant is reduced, and environmental and health protection is achieved.
Patent Information
- Application Number
- CN202411843492.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-14
- Publication Date
- 2025-04-11
AI Technical Summary
Traditional air conditioners have problems such as poor product consistency and poor refrigeration effect, and use of toxic refrigerants, which affects the environment and health.
The semiconductor and evaporating core are linked to the refrigeration/heating device. By combining the semiconductor module and the evaporating core assembly, the cooling or hot air is generated by using electrical energy, and combined with the independent refrigeration/heating module, double rapid refrigeration/heating is achieved.
It has achieved improvement in refrigeration effect and improved consistency, reduced the use of refrigerant, reduced the impact on the environment and health, and adapted to the needs of different models.
Smart Images
Figure CN119795835A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the field of new energy vehicle battery management, and in particular relates to a semiconductor and evaporation core linked refrigeration / heating device. Background Art
[0002] Refrigerant is the core medium of air conditioning system. The fluorinated and chlorofluoro compounds in it will destroy ozone molecules when released into the atmosphere, causing ultraviolet rays to pass through the atmosphere and have a negative impact on people and other organisms. In addition, the energy consumption and emissions of air conditioners will also produce a large amount of greenhouse gases, forming a greenhouse effect and causing global warming. Therefore, it is one of the main problems that need to be solved urgently to upgrade the technology of traditional air conditioning systems, reduce the use of air conditioners with harmful refrigerants, reduce greenhouse gas emissions, reduce the degree of damage to the ozone layer, improve the current global environment, and create a good living environment.
[0003] For car air conditioners, their refrigeration completely relies on refrigerants as a medium to achieve temperature regulation. On the one hand, the cost is high and the processing and manufacturing are difficult. On the other hand, refrigerants are toxic and harmful substances, and when leaked, they will cause varying degrees of damage to the ozone layer. In addition, at this stage, important components of air conditioners, such as evaporators, are mostly assembled manually and processed with the help of machine equipment, and the product consistency is poor. The consistency of air conditioning refrigeration effect varies greatly, leading to many market problems and affecting product reputation. At the same time, after-sales maintenance is required for enterprises, which increases costs, is time-consuming and labor-intensive for enterprises. To this end, technical upgrades are carried out on the basis of traditional air conditioners, combining semiconductor refrigeration (heat) technology with air conditioner evaporators to achieve dual and auxiliary refrigeration (heat), making up for the poor refrigeration effect and poor product consistency of traditional air conditioners. At the same time, the use of refrigerants can also be reduced.
[0004] Traditional air conditioners mainly rely on evaporators for cooling, but due to factors such as complex product processing procedures and inability to ensure consistency, the air conditioner products have poor cooling effects. When the air conditioner is heating, the water heating core is required to work, which has the same problems as the evaporative core, such as poor product consistency and poor cooling effect. In addition, different lengths of car models match different lengths of air conditioners. The larger the length of the car model, the larger the air conditioner, and the more refrigerant is required, which leads to increased pressure in the air conditioning system, increased probability of refrigerant leakage and air conditioner damage, and greater impact on the environment. Summary of the invention
[0005] The technical problem to be solved by the present invention is: to provide a semiconductor and evaporation core linked refrigeration / heating device in view of the problems of poor product consistency and poor refrigeration effect existing in traditional air conditioners.
[0006] To achieve the above object, the present invention is achieved through the following technical solutions: A semiconductor and evaporation core linkage refrigeration / heating device, comprising a condenser assembly, a condensation fan, an evaporator assembly, a semiconductor evaporation core assembly, an independent refrigeration / heating module and an evaporation fan; The semiconductor evaporation core assembly includes an evaporation core assembly and a water-heating core assembly, wherein an evaporation core front side plate is arranged on the front side of the evaporation core assembly, and an evaporation core rear side plate is arranged on the rear side of the evaporation core assembly; a water-heating core front side plate is arranged on the front side of the water-heating core assembly, and a water-heating core rear side plate is arranged on the rear side of the water-heating core assembly; the evaporation core front side plate and the water-heating core front side plate are connected to a front connecting plate together; a semiconductor module is arranged on the water-heating core assembly, and the semiconductor module is driven by a control system to generate heat, and the heat generated by the semiconductor module and the water-heating core assembly is blown into the vehicle through the operation of the evaporation fan.
[0007] The semiconductor module is an interpenetrating semiconductor module, which includes first semiconductor modules and first evaporation fins that are arranged at intervals. A first heat transfer tube is used to penetrate multiple first semiconductor modules and the first evaporation fins, and the front and rear sides of the first heat transfer tube are respectively provided with a first core front side plate and a first core rear side plate.
[0008] The interpenetrating semiconductor module is in a rectangular shape as a whole and a circular through hole is added thereon, and the first heat transfer tube penetrates through the circular through hole.
[0009] The semiconductor module is a parallel semiconductor module, which includes a second semiconductor module and a second evaporation fin arranged at intervals. A second heat transfer tube is used to penetrate multiple second semiconductor modules and the second evaporation fin, and a second core front side plate is arranged on the front side of the second heat transfer tube. The rear side of the second heat transfer tube is connected to the second core rear side plate through a semiconductor fixing device. During assembly, the parallel semiconductor module is installed on both sides of the water heating core assembly, and the L-shaped mounting frame of the semiconductor module is fixed to the front and rear side plates of the core by bolts and rivet nuts.
[0010] The independent cooling / heating module comprises a plurality of single cooling plates arranged in parallel, and the plurality of single cooling plates are connected by at least one fixed shaft.
[0011] A protective pad is arranged between each single refrigeration fin and the fixed shaft.
[0012] A plurality of single refrigeration fins are vertically mounted on a shell, a plurality of ventilation holes are opened on a single refrigeration fin, mounting plates and mounting holes are added on both sides of the first and last refrigeration fins, and the whole is fixed on the shell by bolt connection.
[0013] The evaporator assembly and the evaporation fan are installed on the air conditioner evaporation bin shell. There is a plurality of evaporation fans installed on the air conditioner evaporation bin shell. There is extra space between two adjacent evaporation fans. An independent cooling / heating module is installed in the space.
[0014] The independent cooling / heating module is installed between the evaporator fan and the evaporator core.
[0015] Compared with the prior art, the present invention has the following beneficial effects: the present invention proposes an auxiliary cooling / heating device based on semiconductor technology, which can be used in conjunction with a traditional air-conditioning evaporator. Electric energy is used to provide cold and hot air for the entire vehicle, which plays a role in cooling compensation. The number and size of semiconductors can also be adjusted according to the size of the vehicle model, so that the same cooling capacity (heat) can be achieved under the same refrigerant or a small amount of refrigerant, reducing the amount of refrigerant used and meeting the needs of different vehicle models. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is the overall layout diagram of the semiconductor core of the present invention; Figure 2 It is a structural diagram of a semiconductor evaporation core assembly; Figure 3 This is the appearance diagram of the interleaved semiconductor module; Figure 4 It is a structural diagram of an interleaved semiconductor module; Figure 5 The figure is an outline diagram of a parallel semiconductor module; Figure 6 It is a structural diagram of a parallel semiconductor module; Figure 7 It is the structural diagram of the independent cooling / heating module; Figure 8 This is the assembly structure diagram of the independent cooling / heating module; Fig. 9 Installation layout diagram for independent cooling / heating modules; Fig.10 It is an operation flow chart of the present invention. DETAILED DESCRIPTION
[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0018] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0019] like Figure 1 As shown, a semiconductor and evaporation core linkage refrigeration / heating device is mainly composed of core components such as a condenser assembly 1, a condensation fan 2, an evaporator assembly 3, a semiconductor evaporation core component 4, an independent refrigeration / heating module 5 and an evaporation fan 6.
[0020] In the present invention, the semiconductor evaporation core assembly 4 assembles the semiconductor module and the traditional evaporation core into a whole and is installed in the air conditioner evaporator assembly 3. The semiconductor module is provided with electrical energy to generate cold air, and both the semiconductor module and the evaporation core can generate cold air, which is blown into the vehicle through the evaporation fan 6 to achieve the function of cooling the vehicle. On the other hand, the excess space on the evaporation bin shell is used to fix multiple independent cooling / heating modules 5, which can assist the evaporation core in generating cold air and achieve the function of rapid cooling.
[0021] like Figure 2 As shown, the semiconductor evaporation core assembly 4 includes an evaporation core assembly 44 and a water-heating core assembly 45, wherein an evaporation core front side plate 42 is arranged on the front side of the evaporation core assembly 44, and an evaporation core rear side plate 46 is arranged on the rear side of the evaporation core assembly 44; a water-heating core front side plate 43 is arranged on the front side of the water-heating core assembly 45, and a water-heating core rear side plate 47 is arranged on the rear side of the water-heating core assembly 45; the evaporation core front side plate 42 and the water-heating core front side plate 43 are connected to the front connecting plate 41. During assembly, the evaporation core assembly 44 and the water-heating core assembly 45 can be fixed together by bolts, rivets and nuts and assembled into a whole, which is convenient for overall assembly production.
[0022] The water-heating core assembly 45 is a traditional water-heating core. The difference is that a semiconductor module is provided on the water-heating core assembly 45 in the present invention. The semiconductor module is driven by a control system to generate heat. The heat generated by the semiconductor module and the water-heating core assembly 45 is blown into the vehicle through the operation of the evaporating fan 6, thereby achieving the function of heating the vehicle interior.
[0023] The semiconductor module may be an interleaved semiconductor module 48 or a parallel semiconductor module 49 .
[0024] like Figure 3 , Figure 4As shown, the interleaved semiconductor module 48 is designed as a rectangular semiconductor module and a circular through hole 486 is added thereon, so that its structure is consistent with the evaporation fins, which facilitates the penetration of the first heat transfer tube 484 and facilitates installation and fixing. The internal circuit of the semiconductor module with the modified structure needs to be reasonably laid out and designed according to the position and number of the openings to maximize its working efficiency.
[0025] The interlaced semiconductor module 48 includes a first semiconductor module 483 and a first evaporation fin 482 arranged at intervals. The first heat transfer tube 484 is used to penetrate multiple first semiconductor modules 483 and the first evaporation fin 482, and the front and rear sides of the first heat transfer tube 484 are respectively provided with a first core front side plate 481 and a first core rear side plate 485, so that the first evaporation fin 482 and the first semiconductor module 483 can be better installed and fixed. For the line, it can be arranged on the top or side filter net. For different product series, the number and position of the openings of the semiconductor module can be changed according to product requirements. At the same time, the number of semiconductor modules can also be adjusted according to actual conditions, and the layout can be alternately interlaced, or the semiconductor modules can be installed with multiple evaporation fins spaced apart.
[0026] like Figure 5 , Figure 6 The parallel semiconductor module 49 shown is rectangular in shape and has multiple holes 497 added on the surface for ventilation. Mounting holes are added on both sides of the semiconductor module to facilitate assembly and fixation with the front and rear side plates of the core.
[0027] Figure 6The layout diagram of the parallel semiconductor evaporation core assembly includes a second semiconductor module 493 and a second evaporation fin 492 arranged at intervals. The second heat transfer tube 494 is used to penetrate multiple second semiconductor modules 493 and the second evaporation fin 492, and the front side of the second heat transfer tube 494 is provided with a second core front side plate 491, and the rear side of the second heat transfer tube 494 is connected to the second core rear side plate 496 through a semiconductor fixing device 495. During assembly, the parallel semiconductor module 49 is installed on both sides of the water heating core assembly 45, and the L-shaped mounting frame 498 of the semiconductor module is fixed to the front and rear side plates of the core by bolts and rivet nuts. At the same time, in order to ensure strength and surface quality, a filter screen and other devices are added between the semiconductor module and the water heating core assembly 45. According to the different lengths of the water heating core assembly 45, the parallel semiconductor module can be structurally optimized, and multiple semiconductor fixing devices 495 can be added to connect it with the shell or the middle partition, etc., to increase the strength of the semiconductor module. In addition, the long strip semiconductor module can be designed as a plurality of short-sized independent semiconductor modules and a mounting bracket can be added thereto so that it can be fixed to the water heating core assembly 45 or the housing. The operation of the semiconductor modules in the corresponding area can be flexibly adjusted according to the demand for cooling capacity in different areas, so as to achieve the purpose of energy saving and independent temperature control in different areas. This layout structure installs the semiconductor modules on both sides of the core, which is convenient for loading and unloading and avoids direct contact with the fins, which is more advantageous.
[0028] Combination Figure 7 Analysis: The independent cooling / heating module 5 includes a plurality of parallel single cooling fins 51, and the plurality of single cooling fins 51 are connected by at least one fixed shaft 52. In the figure, two fixed shafts 52 are provided. In order to reasonably utilize the space of the air conditioner evaporation bin and realize temperature compensation, the design is as follows: Figure 7 The independent refrigeration module shown is composed of a plurality of single refrigeration fins 51 and a fixed shaft 52. The fixed shaft 52 is used to penetrate the plurality of single refrigeration fins 51, and a protective pad (not marked in the figure) can be added between each single refrigeration fin 51 and the fixed shaft 52 to separate the plurality of single refrigeration fins 51 for ventilation. The fixed shaft 52 is designed to be hollow and an internal thread is added inside. Long bolts can be used to thread the plurality of fixed shafts 52 and fix the rectified independent refrigeration module on the shell (the single refrigeration fins are stacked and placed on the shell). The refrigeration module is driven by the control system to generate cold (heat) and realize dual rapid refrigeration, thereby achieving the purpose of rapid cooling and temperature supplementation. The number, thickness, structure and fixed shaft of the single refrigeration fins are not unique.
[0029] Combination Figure 8 Analysis: For an independent refrigeration module, multiple single refrigeration fins 51 can be vertically mounted on a housing, and the structure is as follows: Figure 8As shown. A plurality of vents 54 are provided on a single refrigeration plate, and their shapes, sizes, and position layouts are not unique. A plurality of single refrigeration plates can be connected in series by using a fixed shaft 52, and a protective pad (not marked in the figure) is added at the connection between each single refrigeration plate 51 and the fixed shaft, and the distance between each single refrigeration plate can be adjusted. In order to facilitate the rectification, the independent refrigeration module is installed on the shell, and mounting plates and mounting holes 53 are added on both sides of the first and last refrigeration plates, which can be fixed to the shell as a whole by bolt connection. The refrigeration module is driven by the control system to generate cold (heat) and realize dual rapid refrigeration, thereby achieving the purpose of rapid cooling and temperature supplementation.
[0030] Combination Fig. 9 Analysis: The evaporator assembly 3 and the evaporation fan 6 are installed on the air conditioner evaporation chamber housing 7. There is extra space between two adjacent evaporation fans 6 installed on the air conditioner evaporation chamber housing 7. Therefore, the space is used to install the independent cooling / heating module 5. That is, the space utilization rate of the whole machine housing is improved, and the purposes of dual rapid cooling (heating), rapid temperature reduction, temperature compensation, etc. are achieved.
[0031] When there are a large number of evaporation fans 6 installed on the evaporation bin housing, the independent cooling / heating module 5 can be installed at other locations of the housing, such as between the evaporation fan and the evaporation core. This design layout can achieve multiple functions such as rapid cooling and stable replenishment without changing the existing product structure.
[0032] Combination Fig.10 Analysis: Multiple temperature sensors are placed on the left and right cores of the air conditioner, such as areas 1, 2, and 3. The temperature of the left and right cores and different areas of the core can be monitored in real time to determine whether the temperature of the corresponding area is less than or equal to the preset value. If so, the semiconductor modules in the corresponding area and the vicinity are powered on to quickly cool them to meet the cooling capacity requirements. If not, the sensors are monitored in real time.
[0033] When the product is used in longer vehicles and the demand for cooling capacity increases, the working quantity of the semiconductor modules can be flexibly adjusted according to the required cooling capacity so that the cooling demand can be met without changing the length and width of the core.
[0034] The beneficial effects of the present invention are: 1. Combine semiconductor technology with evaporation core and water heating core to achieve dual rapid cooling (heating); 2. Through the information feedback from the temperature detector, the power is adjusted to reach the cooling (heating) amount generated by the semiconductor, so as to realize flexible temperature adjustment and achieve functions such as temperature compensation; 3. Design two semiconductor structures, interleaved and parallel, to reasonably assemble the cores, realize dual rapid cooling (heating) and compensate temperature; 4. Design a separate cooling module and two installation layouts, which can be installed as a whole on the evaporator shell and close to the air outlet and evaporator fan to achieve separate cooling (heating) or combined evaporator cooling (heating) to achieve the purpose of rapid compensation of cold (heating) capacity; 5. By adjusting the cooling (heating) capacity of the semiconductor, the requirements of different vehicle models and different cooling capacities can be met without changing the structure of the evaporation core, with high flexibility, adaptability and flexibility. At the same time, the use of refrigerant can be reduced to achieve the purpose of protecting the environment; 6. Reasonable arrangement of semiconductor modules and evaporation fins can achieve dual rapid cooling (heating), solving the problems of poor cooling (heating) effects of traditional air conditioners or electric air conditioners; 7. The evaporation chamber temperature and the air outlet temperature can be monitored in real time, so as to flexibly adjust the semiconductor cooling (heat) capacity, realize flexible temperature compensation, and avoid waste of resources; 8. The size and structural characteristics of the semiconductor refrigeration (heating) module can be flexibly adjusted according to the structural characteristics of the evaporation core, which is convenient for the installation of the semiconductor module.
[0035] The above-described embodiments are only preferred embodiments of the present invention. It should be noted that, for those skilled in the art, several changes and improvements may be made without departing from the overall concept of the present invention, and these should also be regarded as the protection scope of the present invention.
Claims
1. A semiconductor and evaporation core linked cooling / heating device, characterized in that: It comprises a condenser assembly (1), a condensing fan (2), an evaporator assembly (3), a semiconductor evaporation core component (4), an independent cooling / heating module (5) and an evaporation fan (6); The semiconductor evaporation core assembly (4) comprises an evaporation core assembly (44) and a water-heating core assembly (45), wherein an evaporation core front side plate (42) is arranged on the front side of the evaporation core assembly (44), and an evaporation core rear side plate (46) is arranged on the rear side of the evaporation core assembly (44); a water-heating core front side plate (43) is arranged on the front side of the water-heating core assembly (45), and a water-heating core rear side plate (47) is arranged on the rear side of the water-heating core assembly (45); the evaporation core front side plate (42) and the water-heating core front side plate (43) are connected to a front connecting plate (41); a semiconductor module is arranged on the water-heating core assembly (45), and the semiconductor module is driven by a control system to generate heat, and the heat generated by the semiconductor module and the water-heating core assembly (45) is blown into the vehicle through the operation of the evaporation fan (6).
2. A semiconductor and evaporation core linked cooling / heating device according to claim 1, characterized in that: The semiconductor module is an interpenetrating semiconductor module (48), which comprises first semiconductor modules (483) and first evaporation fins (482) arranged at intervals, wherein a plurality of first semiconductor modules (483) and the first evaporation fins (482) are penetrated by a first heat transfer tube (484), and a first core front side plate (481) and a first core rear side plate (485) are respectively arranged on the front side and the rear side of the first heat transfer tube (484).
3. A semiconductor and evaporation core linked cooling / heating device according to claim 2, characterized in that: The interpenetrating semiconductor module (48) is rectangular in shape as a whole and has a circular through hole (486) added thereon, and the first heat transfer tube (484) penetrates through the circular through hole (486).
4. The semiconductor and evaporation core linked refrigeration / heating device according to claim 1, characterized in that: The semiconductor module is a parallel semiconductor module (49), which includes a second semiconductor module (493) and a second evaporation fin (492) arranged at intervals. A second heat transfer tube (494) is used to penetrate the plurality of second semiconductor modules (493) and the second evaporation fin (492), and a second core front side plate (491) is provided on the front side of the second heat transfer tube (494). The rear side of the second heat transfer tube (494) is connected to the second core rear side plate (496) via a semiconductor fixing device (495). During assembly, the parallel semiconductor module (49) is installed on both sides of the water heating core assembly (45), and the L-shaped mounting frame (498) of the semiconductor module is fixed to the front and rear side plates of the core by bolts and rivet nuts.
5. The semiconductor and evaporation core linked refrigeration / heating device according to claim 1, characterized in that: The independent cooling / heating module (5) comprises a plurality of single cooling fins (51) arranged in parallel, and the plurality of single cooling fins (51) are connected via at least one fixed shaft (52).
6. A semiconductor and evaporation core linked cooling / heating device according to claim 5, characterized in that: A protective pad is provided between each single refrigeration plate (51) and the fixed shaft (52).
7. A semiconductor and evaporation core linked cooling / heating device according to claim 5, characterized in that: A plurality of single refrigeration fins (51) are vertically mounted on a housing, a plurality of ventilation holes (54) are provided on the single refrigeration fins, mounting plates and mounting holes (53) are added on both sides of the first and last refrigeration fins, and the whole is fixed to the housing by bolt connection.
8. The semiconductor and evaporation core linked cooling / heating device according to claim 1, characterized in that: The evaporator assembly (3) and the evaporation fan (6) are mounted on an air conditioner evaporation chamber housing (7). A plurality of evaporation fans (6) are mounted on the air conditioner evaporation chamber housing (7), and there is a redundant space between two adjacent evaporation fans (6). An independent cooling / heating module (5) is installed in the redundant space.
9. The semiconductor and evaporation core linked cooling / heating device according to claim 1, characterized in that: The independent cooling / heating module (5) is installed between the evaporating fan and the evaporating core.