Heat insulation structure and tray

By forming a gas insulation chamber in the insulation structure and using gas to insulate heat, the problem of large weight of the existing insulation structure is solved, the heat insulation effect is improved and the weight is reduced, and the production efficiency is improved.

CN119796712APending Publication Date: 2025-04-11ZTE CORP
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Patent Information

Application Number
CN202311315279.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-10-11
Publication Date
2025-04-11

AI Technical Summary

Technical Problem

The existing three-layer aluminum alloy thermal insulation structure has a large weight, is inconvenient to use, and affects production efficiency.

Method used

Two solid insulation layers are formed using the first and second insulation members, and spaced apart by the support members to form an open gas insulation chamber and insulated with gas.

Benefits of technology

Effectively realize the thermal insulation effect, while reducing the weight of the thermal insulation structure, improving production efficiency, and simplifying operation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a heat insulation structure and a tray. The heat insulation structure comprises a first heat insulation part and a second heat insulation part, the first heat insulation part and the second heat insulation part are arranged in a spaced mode and arranged in a layered mode, so that an open gas heat insulation cavity allowing gas to flow is formed between the first heat insulation part and the second heat insulation part; and the supporting piece is arranged in the gas heat insulation cavity, and the first heat insulation piece and the second heat insulation piece are connected through the supporting piece. The invention provides a heat insulation structure and a tray. The technical problem that an existing heat insulation structure is large in weight is solved.
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Description

Technical Field

[0001] The present application relates to the technical field of single board reflow soldering, and in particular to a heat insulation structure and a tray. Background Art

[0002] Reflow soldering is a production process commonly used in the field of electronic manufacturing, which can solder components on various boards to circuit boards. Temperature-sensitive electronic components are usually protected by heat-insulating structures to prevent them from being damaged by high temperatures in the reflow oven. However, the integrated tray currently used uses three layers of aluminum alloy as the heat-insulating structure. Although it can meet the heat-insulating requirements to a certain extent, the overall structure is heavy and inconvenient to use, which has an adverse effect on production efficiency. Summary of the invention

[0003] The main purpose of the present application is to provide a heat insulation structure and a pallet, aiming to solve the technical problem of heavy weight of the existing heat insulation structure.

[0004] To achieve the above objectives, the present application provides a heat insulation structure, which includes:

[0005] a first thermal insulation member;

[0006] a second thermal insulation member, wherein the first thermal insulation member and the second thermal insulation member are spaced apart and arranged in layers to form an open gas thermal insulation cavity for gas flow between the first thermal insulation member and the second thermal insulation member; and

[0007] A support member is disposed in the gas insulation cavity, and the first insulation member and the second insulation member are connected via the support member.

[0008] The embodiment of the present application further provides a pallet, which includes the thermal insulation structure described above.

[0009] Compared with the prior art, in a technical solution proposed in the present application, the thermal insulation structure forms two solid thermal insulation layers through the first thermal insulation member and the second thermal insulation member, and the first thermal insulation member and the second thermal insulation member are spaced apart by a support member, thereby forming a gas thermal insulation cavity between the first thermal insulation member and the second thermal insulation member, and thermal insulation is performed by using the gas in the gas thermal insulation cavity, which can effectively achieve the thermal insulation effect. Moreover, the solid metal thermal insulation structure between the first thermal insulation member and the second thermal insulation member is replaced by gas, and the weight of the gas is lighter, which can reduce the weight of the entire thermal insulation structure and realize the lightweight thermal insulation structure. At the same time, it can also facilitate the use of operators and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0011] Figure 1 This is a schematic diagram of the exploded structure of a pallet embodiment of the present application;

[0012] Figure 2 for Figure 1 Schematic diagram of the local enlarged structure of part A.

[0013] Description of Figure Numbers:

[0014] Label name Label name 110 First thermal insulation 120 Second thermal insulation 130 Support 131 First daughter board 132 Second daughter board 140 Locking parts 150 First grip 200 Support frame 210 Avoidance slot 220 Second grip

[0015] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the embodiments of the present application.

[0017] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0018] In addition, in the embodiments of the present application, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the embodiments of the present application, the meaning of "multiple" is at least two, for example, two, three, etc., unless otherwise clearly and specifically defined.

[0019] In the embodiments of the present application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0020] In addition, the technical solutions between the various embodiments of the present application can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the embodiments of the present application.

[0021] Reflow soldering is a production process commonly used in the field of electronic manufacturing, which can solder components on various boards to circuit boards. Temperature-sensitive electronic components are usually protected by thermal insulation structures to prevent temperature-sensitive electronic components from being damaged by high temperatures in the reflow oven.

[0022] At present, integrated trays are usually used to protect temperature-sensitive electronic components from being damaged by high temperatures in reflow ovens. Integrated trays are generally made of three-layer aluminum alloy, which can better meet the insulation requirements. However, since the insulation layer is solid aluminum and heavy, it is time-consuming and laborious for production line workers to use, affecting production efficiency. Therefore, it is necessary to redesign the insulation layer.

[0023] In addition, when the PCB motherboard is manufactured, it is usually loaded on an integrated tray before reflow. After the daughter card is placed on the motherboard, it will be adversely affected when it is manually moved and placed on the integrated tray. Therefore, loading the integrated tray before the patch process can reduce the impact of subsequent loading of the tray on the daughter card. However, the placement machine has weight requirements for incoming materials, and after the existing motherboard is placed on the tray, the overall weight exceeds the upper limit of the feed weight of the placement machine. Moreover, after the reflow process, the integrated tray needs to be unloaded from the production line by the production line workers, and manual picking and placing is very labor-intensive. Therefore, it is necessary to design the integrated tray to be lightweight.

[0024] In view of this, the embodiment of the present application provides an insulation structure and a pallet, wherein two solid insulation layers are formed by a first insulation member and a second insulation member, and the first insulation member and the second insulation member are spaced apart by a support member, thereby forming a gas insulation cavity between the first insulation member and the second insulation member, and utilizing the gas in the gas insulation cavity for insulation, which can effectively achieve the insulation effect. Moreover, the solid metal insulation structure between the first insulation member and the second insulation member is replaced by gas, and the weight of the gas is relatively light, which can reduce the weight of the entire insulation structure and achieve lightweight insulation. At the same time, it can also facilitate the use of operators and improve production efficiency.

[0025] In order to better understand the above technical solution, the above technical solution is described in detail below with reference to the accompanying drawings.

[0026] like Figure 1 and Figure 2 As shown, the embodiment of the present application provides a heat insulation structure, and the heat insulation structure includes:

[0027] A first thermal insulation member 110;

[0028] A second thermal insulation member 120, wherein the first thermal insulation member 110 and the second thermal insulation member 120 are spaced apart and arranged in layers, so as to form an open gas thermal insulation cavity for gas flow between the first thermal insulation member 110 and the second thermal insulation member 120; and

[0029] The support member 130 is disposed in the gas insulation cavity, and the first insulation member 110 and the second insulation member are connected via the support member 130 .

[0030] In the technical solution adopted in this embodiment, the thermal insulation structure forms two solid thermal insulation layers through the first thermal insulation member 110 and the second thermal insulation member 120, and the first thermal insulation member 110 and the second thermal insulation member 120 are spaced apart by the support member 130, so as to form a gas thermal insulation cavity between the first thermal insulation member 110 and the second thermal insulation member 120, and the gas in the gas thermal insulation cavity is used for thermal insulation, which can effectively achieve the thermal insulation effect. Moreover, the solid metal thermal insulation structure between the first thermal insulation member 110 and the second thermal insulation member 120 is replaced by gas, and the weight of the gas is lighter, which can reduce the weight of the entire thermal insulation structure and realize the lightweight thermal insulation structure. At the same time, it can also facilitate the use of operators and improve production efficiency.

[0031] In one embodiment, the thermal insulation structure includes a first thermal insulation member 110, a second thermal insulation member 120 and a support member 130. Among them, the first thermal insulation member 110 and the second thermal insulation member 120 are stacked and can play a major role in thermal insulation. The support member 130 is arranged between the first thermal insulation member 110 and the second thermal insulation member 120. On the one hand, the first thermal insulation member 110 and the second thermal insulation member 120 can be connected to form a whole; on the other hand, the first thermal insulation member 110 and the second thermal insulation member 120 can be spaced apart so that a gas insulation cavity is formed between the first thermal insulation member 110 and the second thermal insulation member 120. In other words, the thermal insulation structure proposed in this embodiment includes two layers of solid thermal insulation layers and a layer of gas thermal insulation layer arranged between the two layers of solid thermal insulation layers, which can achieve a good thermal insulation effect. Moreover, by using the gas in the gas thermal insulation cavity as a thermal insulation layer, the weight of the thermal insulation structure can be reduced, thereby realizing a lightweight design of the thermal insulation structure. As an optional manner, the first thermal insulation member 110 and the second thermal insulation member 120 are both plate-like structures; the gas insulation cavity is a non-enclosed structure, having at least two openings arranged opposite to each other to facilitate the flow of gas. The support member 130 is used to connect the first thermal insulation member 110 and the second thermal insulation member 120, connecting the first thermal insulation member 110 and the second thermal insulation member 120 to form a stable insulation structure. As an optional manner, the first thermal insulation member 110, the second thermal insulation member 120 and the support member 130 can be completed as one piece. However, the technical solution of the present application is not limited to this. In other embodiments, a split assembly method can also be adopted, which is not limited here.

[0032] In order to prevent a major adverse effect on the lightweight of the thermal insulation structure, the support member 130 is any one of a strip, mesh or columnar structure. It is understandable that the support member 130 is relatively small in size, which can reduce its own weight and reduce the adverse effect on the weight of the overall thermal insulation structure. Moreover, it can also reduce the obstruction to the flow of gas in the gas insulation cavity, which is beneficial to the flow of gas, prevents the gas temperature in the gas insulation cavity from being too high, and improves the thermal insulation effect. As an optional method, a plurality of support members 130 are provided, and the plurality of support members 130 are intermittently distributed in the gas insulation cavity.

[0033] Exemplarily, the first thermal insulation member 110, the second thermal insulation member 120 and the support member 130 are all any one of aluminum alloy, titanium alloy and synthetic stone. The thermal insulation performance of the above materials is good and can meet the thermal insulation requirements of the thermal insulation structure. In other words, the first thermal insulation member 110 can be any one of aluminum alloy, titanium alloy and synthetic stone, the second thermal insulation member 120 can also be any one of aluminum alloy, titanium alloy and synthetic stone, and the third thermal insulation member 130 can also be any one of aluminum alloy, titanium alloy and synthetic stone. The first thermal insulation member 110, the second thermal insulation member 120 and the support member 130 are made of the same material. In this way, the material uniformity of the thermal insulation structure during production can be achieved, reducing the production and use costs.

[0034] Of course, in other embodiments, the materials of the first thermal insulation member 110, the second thermal insulation member 120 and the support member 130 may also be different. For example, the material of the first thermal insulation member 110 is aluminum alloy, the material of the second thermal insulation member 120 is titanium alloy, and the material of the support member 130 is synthetic stone; or, the material of the first thermal insulation member 110 and the second thermal insulation member 120 is aluminum alloy, and the material of the support member 130 is synthetic stone; or, the material of the first thermal insulation member 110 and the support member 130 is aluminum alloy, and the material of the second thermal insulation member 120 is titanium alloy... In other words, the material of the first thermal insulation member 110, the second thermal insulation member 120 and the support member 130 can be determined according to the specific usage, and this embodiment does not limit this.

[0035] For example, refer to Figure 1 , the thermal insulation structure also includes a locking member 140, which connects the first thermal insulation member 110, the support member 130 and the second thermal insulation member 120. In order to improve the reliability of the support member 130 connecting the first thermal insulation member 110 and the second thermal insulation member 120, a locking member 140 is provided, and the first thermal insulation member 110, the support member 130 and the second thermal insulation member 120 are locked and fixed by the locking member 140, which can effectively improve the structural strength and firmness of the thermal insulation structure, ensure the normal use of the thermal insulation structure, increase the service life, and reduce the maintenance cost. As an optional method, the locking member 140 is a locking bolt. It can be understood that the rod of the locking bolt passes through the first thermal insulation member 110, the support member 130 and the second thermal insulation member 120, and is locked and fixed by a nut, and the operation process is simple and convenient. Moreover, the locking bolt will not fail under high temperature conditions, which effectively improves the reliability of locking and fixing.

[0036] For example, refer to Figure 1 The thermal insulation structure also includes a first gripping opening 150 that passes through the first thermal insulation member 110 and the second thermal insulation member 120, so that the user can grasp the first thermal insulation member 110 and the second thermal insulation member 120 through the first gripping opening 150, thereby improving the convenience of taking and placing. The shape of the first gripping opening 150 can be circular, rectangular or other irregular shapes, which are not limited here. As an optional method, two first gripping openings 150 are provided, and the two first gripping openings 150 are arranged at opposite ends of the thermal insulation structure, that is, a first gripping opening 150 is respectively provided at opposite ends of the thermal insulation structure, so that the left hand and the right hand can grasp respectively, further improving the convenience of taking and placing.

[0037] For example, refer to Figure 2, the first gripping opening 150 has a first side surface and a second side surface that are adjacently arranged, and the support member 130 includes a first sub-plate 131 and a second sub-plate 132 that are connected by bending, and the first sub-plate 131 is arranged corresponding to the first side surface, and the second sub-plate 132 is arranged corresponding to the second side surface. After the first thermal insulation member 110 and the second thermal insulation member 120 are provided with the first gripping opening 150, the structural strength will be weakened, for this reason, the support member 130 is arranged corresponding to the first gripping opening 150. It can be understood that the support member 130 includes a first sub-plate 131 and a second sub-plate 132 that are connected by bending, and the first sub-plate 131 corresponds to the first side surface of the first gripping opening 150, and the second sub-plate 132 corresponds to the second side surface of the first gripping opening 150, so that support can be provided on the adjacent two sides of the first gripping opening 150, thereby improving the structural strength of the first thermal insulation member 110 and the second thermal insulation member 120.

[0038] In one embodiment, the first gripping opening 150 may include a left gripping opening for a left hand to grip and a right gripping opening for a right hand to grip, and the left gripping opening and the right gripping opening are arranged at opposite ends of the thermal structure. As an optional method, the opening area of ​​the left gripping opening is larger than the opening area of ​​the right gripping opening, and the support member 130 is arranged corresponding to the left gripping opening, so that on the basis of improving the strength of the left gripping opening, the first thermal insulation member 110 and the second thermal insulation member 120 are separated to form a gas insulation chamber.

[0039] The present application also provides a tray, which includes the heat insulation structure described above. Specifically, the specific embodiment of the heat insulation structure refers to the above embodiment. Since the tray adopts all the technical solutions of the above embodiment, it at least has all the beneficial effects brought by the technical solutions of the above embodiment, which will not be described one by one here.

[0040] The tray in this embodiment is used in the reflow soldering process. The overall structure of the tray is lightweight, which allows for early feeding of the placement machine and reduces the risk of displacement of the daughter card. It can also effectively provide heat insulation to prevent some components in the PCB board from being damaged by high temperature in the reflow oven.

[0041] In order to verify the thermal insulation effect of the thermal insulation structure of the three-layer aluminum plate and the thermal insulation structure of the embodiment of the present application, a reflow oven test was carried out to measure the peak temperature of the main electrical components and the time they lasted above 217°C and 230°C. The measurement results are shown in Tables 1 and 2.

[0042] Table 1. Experimental results of components of three-layer aluminum plate structure

[0043]

[0044] Table 2. Experimental results of gas insulation cavity structure components

[0045]

[0046]

[0047] From the comparison between Table 1 and Table 2, it can be seen that under the two insulation structures, the duration of the main components of the PCB board above 217℃ and 230℃ is very close, and the peak temperature is basically within 230-250℃, which meets the reflow oven temperature requirements. For components exceeding 250℃, the peak temperature can be controlled within 250℃ by adjusting the reflow oven heating module. However, for temperature control, the maximum difference in peak temperature of each component under the three-layer aluminum plate structure is 19.7℃, and the maximum difference in peak temperature of each component under the gas insulation cavity structure is only 16.3℃. The smaller the peak temperature difference, the greater the margin for temperature control during the heating process, and the safer the components during the reflow process. Therefore, the insulation structure with a gas insulation cavity has a better effect on temperature control and better insulation performance.

[0048] For example, refer to Figure 1 The tray further includes a support frame 200, which is disposed on the surface of the first heat insulating member 110 away from the second heat insulating member 120, and a avoidance groove 210 is disposed on the support frame 200. By providing the avoidance groove 210 on the support frame 200, components can be avoided, thereby better protecting the components from damage.

[0049] For example, refer to Figure 1 The tray also includes a second gripping opening 220 that penetrates the support frame 200. The second gripping opening 220 is arranged corresponding to the first gripping opening 150, so that the user can grasp the entire tray through the first gripping opening 150 and the second gripping opening 220, thereby improving the convenience of taking and placing the tray. The shape and arrangement of the second gripping opening 220 are consistent with those of the first gripping opening 150, and are not limited here.

[0050] The above description is only a preferred embodiment of the present application, and does not limit the patent scope of the embodiments of the present application. All equivalent structural transformations made by using the contents of the description and drawings of the embodiments of the present application under the inventive concept of the embodiments of the present application, or direct / indirect application in other related technical fields are included in the patent protection scope of the embodiments of the present application.

Claims

1. A heat insulation structure, characterized in that: The thermal insulation structure comprises: a first thermal insulation member; a second thermal insulation member, wherein the first thermal insulation member and the second thermal insulation member are spaced apart and arranged in layers to form an open gas thermal insulation cavity for gas flow between the first thermal insulation member and the second thermal insulation member; and A support member is disposed in the gas insulation cavity, and the first insulation member and the second insulation member are connected via the support member.

2. The thermal insulation structure according to claim 1, characterized in that: The support member is a strip, mesh or column structure.

3. The thermal insulation structure according to claim 1, characterized in that: The first heat insulating member, the second heat insulating member and the supporting member are all made of any one of aluminum alloy, titanium alloy and synthetic stone.

4. The thermal insulation structure according to claim 3, characterized in that: The first heat insulating member, the second heat insulating member and the supporting member are made of the same material.

5. The thermal insulation structure according to claim 1, characterized in that: The thermal insulation structure further includes a locking member, which connects the first thermal insulation member, the supporting member and the second thermal insulation member.

6. The thermal insulation structure according to claim 5, characterized in that: The locking piece is a locking bolt.

7. The thermal insulation structure according to claim 5, characterized in that: The thermal insulation structure also includes a first gripping opening that passes through the first thermal insulation component and the second thermal insulation component.

8. The thermal insulation structure according to claim 7, characterized in that: The first holding opening has a first side surface and a second side surface that are adjacently arranged. The supporting member includes a first sub-plate and a second sub-plate that are bent and connected. The first sub-plate is arranged corresponding to the first side surface, and the second sub-plate is arranged corresponding to the second side surface.

9. A pallet, characterized in that: The tray comprises the thermal insulation structure according to any one of claims 1-8.

10. The pallet according to claim 9, characterized in that The tray further comprises a support frame, wherein the support frame is arranged on a surface of the first heat insulating member facing away from the second heat insulating member, and an avoidance groove is arranged on the support frame.

11. The pallet according to claim 10, characterized in that The tray also includes a second gripping opening that passes through the support frame.