Radio frequency chip encapsulation adhesive, adhesive film containing same, and preparation method and application thereof

Abstract

The present application relates to a radio frequency chip packaging adhesive, an adhesive film containing the same, and a preparation method and application thereof. The preparation method of the radio frequency chip packaging adhesive film comprises the following steps: sequentially adding the materials in component A into a reaction kettle, heating and stirring, and then discharging after vacuum degassing; sequentially adding the materials in component B into the reaction kettle, stirring, and then discharging; uniformly mixing component A and component B at a certain proportion, filtering, and then vacuum degassing to obtain an adhesive solution; transferring the adhesive solution to a coating machine, coating the adhesive solution between a PET base film and a PET release film to obtain an adhesive film; and winding and slitting to obtain a sheet-shaped or roll-shaped adhesive film. Based on the special requirements of the radio frequency chip adhesive film, the present application optimally matches the epoxy resin and the curing system, and through scientific formula matching and optimization of the processing technology, a high-performance adhesive film for chip packaging with good temperature resistance, high glass transition temperature, low linear expansion coefficient, low moisture absorption rate, small warpage deformation, and strong adhesion is prepared.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip packaging adhesive film, in particular to a radio frequency chip packaging adhesive, an adhesive film containing the same, a preparation method and application thereof. BACKGROUND

[0002] Epoxy resin has good adhesion, strong mechanical properties, good insulation, good solvent resistance and other advantages, and has always occupied a place in the field of chip packaging.

[0003] Although epoxy resin shows unique characteristics in chip packaging, epoxy resin also has inherent drawbacks, which makes it difficult to achieve application in some special chip packaging fields. These drawbacks mainly manifest in brittleness, high shrinkage warpage, and cannot meet the actual requirements of low linear expansion coefficient and high glass transition temperature, high temperature resistance and low moisture absorption of high-performance chips, and epoxy resin is inferior to other packaging materials in these aspects. This largely restricts the application of epoxy resin materials in the field of chip packaging, especially in the field of radio frequency chip packaging.

[0004] Therefore, how to retain the original performance of epoxy resin while making up for the above shortcomings to meet the application in radio frequency chip packaging is an urgent industry problem to be solved.

[0005] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present disclosure, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. SUMMARY

[0006] In view of the deficiencies of the prior art, the embodiments of the present application disclose a radio frequency chip packaging adhesive, an adhesive film containing the same, a preparation method and application thereof, so as to retain the original performance of epoxy resin while making up for the shortcomings of epoxy resin to meet the application in radio frequency chip packaging.

[0007] The technical solutions adopted by the present application are as follows:

[0008] The radio frequency chip encapsulation glue comprises an A component and a B component; the A component mainly comprises an epoxy resin, a toughening agent, a black paste, a defoaming agent, a coupling agent, a dispersing agent and a powder filler, wherein the epoxy resin accounts for 6-20.6% of the A component, the toughening agent accounts for 3-6% of the A component, the black paste accounts for 1-2% of the A component, the defoaming agent accounts for 0.1-0.3% of the A component, the coupling agent accounts for 0.2-0.5% of the A component, the dispersing agent accounts for 0.1-0.2% of the A component, and the powder filler accounts for 75-85% of the A component; the B component mainly comprises an aromatic amine curing agent, an alicyclic curing agent and a curing agent accelerator, wherein the aromatic amine curing agent accounts for 52-78% of the B component, the alicyclic curing agent accounts for 20-42% of the B component, and the curing agent accelerator accounts for 2-6% of the B component; and the mass ratio of the A component to the B component is 100:(5-9).

[0009] Further, the epoxy resin is a trifunctional epoxy resin or a tetrafunctional epoxy resin.

[0010] Further, the toughening agent is a core-shell toughening agent or a rubber-based toughening agent.

[0011] Further, the defoaming agent is any one or two of BYK-A530, KS-603, BYK-141, BYK-066N and Dow Corning 163; the coupling agent is any one of KH-560, KH-550, A-187, KBM-303 and KBM-803; and the dispersing agent is any one of BYK-9011, BYK-110, BYK-163 and SDJ-8110.

[0012] Further, the powder filler is spherical silica or spherical alumina with a particle size of 0.5-30 μm.

[0013] Further, the aromatic amine curing agent is any one of diethyl toluene diamine and 3,3'-diethyl-4,4'-diamino diphenyl methane; the alicyclic curing agent is any one of 3,3-dimethyl-4,4-diamino dicyclohexyl methane, isophorone diamine and 4,4'-diamino dicyclohexyl methane; and the curing agent accelerator is any one of Accelerator 399 and AEP.

[0014] The application further discloses a glue film for radio frequency chip packaging, which comprises a PET base film, a glue layer and a PET release film which are stacked in sequence, and the glue layer comprises the radio frequency chip packaging glue according to any one of claims 1-6.

[0015] The application further discloses a preparation method of the glue film for radio frequency chip packaging, which comprises the following steps: sequentially adding materials in component A into a reaction kettle, heating and stirring, discharging after vacuum degassing; sequentially adding materials in component B into the reaction kettle, stirring and discharging; uniformly mixing the components A and B according to a proportion, filtering and vacuum degassing to obtain glue liquid; transferring the glue liquid to a coating machine, coating the glue liquid between the PET base film and the PET release film to obtain a glue film; winding, slitting and obtaining a sheet-shaped or roll-shaped glue film.

[0016] Further, when sequentially adding the materials in component A into the reaction kettle, the heating temperature is 50-70 DEG C, the stirring speed is 60-80 r / min and the stirring time is 1-2 h; when sequentially adding the materials in component B into the reaction kettle, the heating temperature is 30-50 DEG C, the stirring speed is 60-90 r / min and the stirring time is 1-2 h; the oven temperature of the coating machine is 50-80 DEG C, the coating gap is 260-450 mu m and the running speed is 1-2 m / min, so that the glue film with a thickness of 100-350 mu m is prepared.

[0017] The application further discloses application of the glue film for radio frequency chip packaging in chip packaging, wherein when in use, the PET release film is torn off, the glue film is pasted and compressed on the chip, and the chip is bonded after heating and curing at 130-175 DEG C.

[0018] The application embodiment has the following beneficial effects:

[0019] The radio frequency chip packaging glue film and the preparation method thereof have the following advantages: based on the special requirements of the glue film for radio frequency chip, the matched epoxy resin and curing system are selected, a series of high-performance glue films with high performance and wide adaptability are prepared through scientific formula matching and optimization of the processing technology, and the actual requirements of the radio frequency chip packaging are met.

[0020] The performance advantages mainly include the following points:

[0021] 1) High glass transition temperature

[0022] The embodiment of the present application selects high functionality epoxy resin, such as trifunctional and tetrafunctional epoxy resin, and after chemical reaction, a high crosslinking degree of three-dimensional network structure appears in the molecular structure of the epoxy resin, which further improves the glass transition temperature of the polymer, so that the product has more excellent physical properties. In addition, aromatic curing agent is used in the present application, which contains a large number of benzene ring structures in the molecular structure and has high reactivity, which is more helpful to improve the glass transition temperature of the polymer and the overall performance of the polymer.

[0023] At the same time, the combination of high functionality epoxy resin and aromatic amine curing agent has very good temperature resistance, because there are many benzene ring structures with good temperature resistance in the molecular structure, and the space network structure with high crosslinking density, which helps to improve the high temperature resistance of the product and prolong the service life of the finished product.

[0024] 2) Low linear expansion coefficient

[0025] The chip packaging field has high requirements for the linear expansion coefficient, and the linear expansion coefficient of the packaging material is usually less than 30-40 ppm / ℃, and in special cases, it is less than 15 ppm / ℃, and the radio frequency chip packaging belongs to the latter. In order to reduce the linear expansion coefficient of the packaging film material, the embodiment of the present application focuses on adjusting the resin system and the powder filler from two aspects.

[0026] The greater the crosslinking density of the epoxy resin, the lower the linear expansion coefficient of the product, and the more dense the molecular structure of the product, the lower the linear expansion coefficient. As described in the first item, the embodiment of the present application selects high functionality epoxy resin and aromatic amine curing agent, which is very beneficial to reducing the linear expansion coefficient of the product.

[0027] In addition, the powder filler plays a more important role in reducing the linear expansion coefficient. Silica, especially spherical silica, has a low linear expansion coefficient of 3 ppm / ℃, and the introduction of spherical silica in the formula system can greatly reduce the linear expansion coefficient of the product. More importantly, the use of spherical silica with different particle sizes can not only effectively adjust the viscosity of the mixture, but also greatly reduce the linear expansion coefficient value.

[0028] 3) Low hygroscopicity

[0029] Due to the limitation of application scenarios, the chip packaging film material must have high low hygroscopicity to meet the sensitive environment requirements of temperature and humidity when the chip is used, and the present application achieves this goal from three aspects.

[0030] Firstly, the gap of the molecular structure of the conventional polymer is about 70-100 nm, and under normal circumstances, it is difficult for water vapor to penetrate, but under high temperature and high pressure conditions, the conventional polymer is difficult to resist the erosion of water vapor, and increasing the density of the molecular structure and the crosslinking density of the polymer can effectively enhance the moisture absorption of the polymer. The high-functionality epoxy resin and the aromatic amine curing agent used in the embodiment of the present application play a good role in this regard.

[0031] Secondly, the powder filler can greatly improve the moisture absorption of the product. The embodiment of the present application selects spherical silica and spherical alumina with regular structure, which are uniformly distributed in the film, can prevent the penetration of water vapor, and effectively prevent water vapor from entering the product. More importantly, by combining different particle size powder fillers, the gap of the resin is almost filled with powder fillers, which greatly improves the moisture absorption effect of the product.

[0032] Thirdly, the embodiment of the present application selects special structure of auxiliary agents, such as dispersants and coupling agents, which can form connecting points between epoxy resin and powder filler, enhance the compatibility and dispersion effect of epoxy resin and powder filler, and greatly improve the overall moisture absorption of the product. In addition, the coupling agent and the dispersant are hydrophobic substances, which also have good effect of preventing water vapor erosion.

[0033] 4) Thermal conductivity

[0034] Chip packaging materials need to have good thermal conductivity to effectively conduct the heat generated during the operation of the chip and protect the integrated circuit, thereby prolonging the service life of the IC component.

[0035] The embodiment of the present application provides two types of packaging film materials, one of which uses spherical silica as a thermal conductive medium, and the other uses spherical alumina as a thermal conductive medium, and the thermal conductivity of the film material is excellent. This distinction can meet the actual needs of packaging plants and provide more choices for packaging enterprises. BRIEF DESCRIPTION OF DRAWINGS

[0036] Figure 1 The present application relates to a radio frequency chip packaging adhesive film and a preparation method thereof. DETAILED DESCRIPTION

[0037] The specific embodiments of the present application will be described below with reference to the accompanying drawings.

[0038] First embodiment:

[0039] The radio frequency chip packaging adhesive film comprises component A and component B.

[0040] The A component includes 12.85% of epoxy resin EP8403, 5% of toughening agent MX-254, 1.5% of black paste, 0.1% of defoaming agent BYK-A530 and 0.1% of defoaming agent BYK-066N, 0.35% of coupling agent KBM-303, 0.1% of dispersing agent BYK-9011, and 11.5% of powder filler SC-2500SXJ, 5.6% of powder filler NQ1160F, 52.3% of powder filler SHA0200 and 10.6% of powder filler Q099.

[0041] The B component includes 53.6% of aromatic amine curing agent 3,3'-diethyl-4,4'-diamino diphenyl methane, 41.3% of alicyclic curing agent 3,3-dimethyl-4,4-diamino dicyclohexyl methane and 5.1% of curing agent accelerator AEP.

[0042] The mass ratio of the A component to the B component is 100:6.55.

[0043] The adhesive film for radio frequency chip packaging includes PET base film, adhesive layer and PET release film which are stacked in sequence, and the adhesive layer includes the aforementioned adhesive for radio frequency chip packaging.

[0044] The preparation method of the adhesive film for radio frequency chip packaging includes the following steps:

[0045] In step S1, the materials in the A component are sequentially put into a reaction kettle, heated and stirred, and then discharged after vacuum degassing; and the materials in the B component are sequentially put into the reaction kettle, stirred and then discharged.

[0046] Specifically, when the materials in the A component are sequentially put into the reaction kettle, the heating temperature is 60°C, the stirring speed is 60r / min, the stirring time is 1.5h and vacuum degassing is performed. When the materials in the B component are sequentially put into the reaction kettle, the heating temperature is 40°C, the stirring speed is 60r / min, the stirring time is 2h.

[0047] In step S2, the A component and the B component are uniformly mixed in proportion, filtered and vacuum degassed to obtain an adhesive solution.

[0048] In step S3, the adhesive solution is transferred to a coating machine, and the adhesive solution is coated between the PET base film and the PET release film to obtain an adhesive film.

[0049] Specifically, the oven temperature of the coating machine is 50°C, the coating gap is 260μm, the running speed is 1m / min, and the adhesive film with a thickness of 105μm is prepared.

[0050] In step S4, the adhesive film is wound and slitted to obtain a sheet-shaped or roll-shaped adhesive film.

[0051] Second embodiment:

[0052] The radio frequency chip packaging adhesive comprises an A component and a B component.

[0053] The A component comprises 8.5% of epoxy resin S-720, 4% of toughening agent F-202, 1.7% of black paste, 0.3% of defoaming agent Dow Corning 163, 0.3% of coupling agent A-187, 0.2% of dispersant BYK-110, 9.5% of powder filler Q099, 12.3% of powder filler Q600, 50.7% of powder filler SHA0200, and 12.5% of powder filler NQ005.

[0054] The B component comprises 61.1% of aromatic amine curing agent diethyl toluene diamine, 33.0% of alicyclic curing agent isophorone diamine, and 5.9% of curing agent accelerator Accelerator 399.

[0055] The mass ratio of the A component to the B component is 100:7.39.

[0056] The radio frequency chip packaging adhesive film comprises a PET base film, an adhesive layer, and a PET release film which are stacked in sequence, and the adhesive layer comprises the radio frequency chip packaging adhesive.

[0057] The preparation method of the radio frequency chip packaging adhesive film comprises the following steps:

[0058] In step S1, the materials in the A component are sequentially put into a reaction kettle, heated and stirred, and then discharged after vacuum defoaming; and the materials in the B component are sequentially put into the reaction kettle, stirred, and then discharged.

[0059] Specifically, when the materials in the A component are sequentially put into the reaction kettle, the heating temperature is 70°C, the stirring speed is 80 r / min, and the stirring time is 1 h; and when the materials in the B component are sequentially put into the reaction kettle, the heating temperature is 50°C, the stirring speed is 80 r / min, and the stirring time is 1 h.

[0060] In step S2, the A component and the B component are uniformly mixed in proportion, filtered, and then vacuum defoamed to obtain an adhesive liquid.

[0061] In step S3, the adhesive liquid is transferred to a coating machine, and the adhesive liquid is coated between the PET base film and the PET release film to obtain an adhesive film.

[0062] Specifically, the oven temperature of the coating machine is 80°C, the coating gap is 400 μm, and the running speed is 1.5 m / min, and an adhesive film with a thickness of 260 μm is prepared.

[0063] In step S4, the adhesive film is wound and cut to obtain a sheet-shaped or roll-shaped adhesive film.

[0064] The third embodiment is as follows:

[0065] The radio frequency chip packaging adhesive comprises an A component and a B component.

[0066] The A component includes 19.9% of epoxy resin SQSN-4132A70, 3% of toughening agent RA1340, 1.2% of black paste, 0.1% of defoaming agent KS-603 and 0.2% of defoaming agent BYK-A530, 0.5% of coupling agent KBM-803, 0.1% of dispersant BYK-163, and 11.2% of powder filler SC-2500SXJ, 30.9% of powder filler SHA0200, 25.7% of powder filler NA1020W, and 7.2% of powder filler QY10.

[0067] The B component includes 59.2% of aromatic amine curing agent diethyl toluene diamine, 38.3% of alicyclic curing agent 4,4'-diamino dicyclohexyl methane, and 2.5% of curing agent accelerator AEP.

[0068] The mass ratio of the A component to the B component is 100:5.25.

[0069] The adhesive film for radio frequency chip packaging includes a PET base film, an adhesive layer and a PET release film which are stacked in sequence, and the adhesive layer includes the aforementioned adhesive for radio frequency chip packaging.

[0070] The preparation method of the adhesive film for radio frequency chip packaging includes the following steps:

[0071] In step S1, the materials in the A component are sequentially put into a reaction kettle, heated and stirred, and then discharged after vacuum degassing; and the materials in the B component are sequentially put into the reaction kettle, stirred, and then discharged.

[0072] Specifically, when the materials in the A component are sequentially put into the reaction kettle, the heating temperature is 50 DEG C, the stirring speed is 70 r / min, and the stirring time is 2 h; and when the materials in the B component are sequentially put into the reaction kettle, the heating temperature is 30 DEG C, the stirring speed is 70 r / min, and the stirring time is 1.5 h.

[0073] In step S2, the A component and the B component are mixed uniformly according to the proportion, filtered, and then vacuum degassed to obtain an adhesive solution.

[0074] In step S3, the adhesive solution is transferred to a coating machine, and the adhesive solution is coated between the PET base film and the PET release film to obtain an adhesive film.

[0075] Specifically, the oven temperature of the coating machine is 70 DEG C, the coating gap is 350 mu m, and the running speed is 2 m / min, and an adhesive film with a thickness of 220 mu m is prepared.

[0076] In step S4, the adhesive film is wound and slitted to obtain a sheet-shaped or roll-shaped adhesive film.

[0077] The fourth embodiment is as follows:

[0078] The radio frequency chip packaging adhesive comprises a component A and a component B.

[0079] The component A comprises 8.4% of epoxy resin EP 8404, 6% of toughening agent MX-154, 1.9% of black paste, 0.1% of defoaming agent BYK-141 and 0.1% of defoaming agent BYK-066N, 0.3% of coupling agent KH-550, 0.2% of dispersant BYK-9011, and 26.5% of powder filler NA1020W, 13.3% of powder filler QY10, and 43.2% of powder filler NA1050W.

[0080] The component B comprises 70.1% of aromatic amine curing agent 3,3'-diethyl-4,4'-diamino diphenyl methane, 26.7% of alicyclic curing agent 3,3-dimethyl-4,4-diamino dicyclohexyl methane, and 3.2% of curing agent accelerator Accelerator 399.

[0081] The mass ratio of the component A to the component B is 100:8.76.

[0082] The radio frequency chip packaging adhesive film comprises a PET base film, an adhesive layer and a PET release film which are stacked in sequence, and the adhesive layer comprises the radio frequency chip packaging adhesive.

[0083] The preparation method of the radio frequency chip packaging adhesive film comprises the following steps:

[0084] In step S1, the materials in the component A are sequentially put into a reaction kettle, heated and stirred, and then discharged after vacuum defoaming; and the materials in the component B are sequentially put into the reaction kettle, stirred, and then discharged.

[0085] Specifically, when the materials in the component A are sequentially put into the reaction kettle, the heating temperature is 50℃, the stirring speed is 60r / min, and the stirring time is 1.5h; and when the materials in the component B are sequentially put into the reaction kettle, the heating temperature is 45℃, the stirring speed is 90r / min, and the stirring time is 2h.

[0086] In step S2, the component A and the component B are uniformly mixed in proportion, filtered, and then vacuum defoamed to obtain an adhesive liquid.

[0087] In step S3, the adhesive liquid is transferred to a coating machine, and the adhesive liquid is coated between the PET base film and the PET release film to obtain an adhesive film.

[0088] Specifically, the oven temperature of the coating machine is 60℃, the coating gap is 300μm, and the running speed is 1.5m / min, and an adhesive film with a thickness of 200μm is prepared.

[0089] In step S4, the adhesive film is wound and cut to obtain a sheet-shaped or roll-shaped adhesive film.

[0090] Fifth embodiment:

[0091] The application also discloses application of the adhesive film for the radio frequency chip package to chip packaging. When used, the PET release film is torn off, the adhesive film is attached to the chip through film attachment and compression, and is bonded to the chip after heating and curing at 130-175 DEG C. Specifically, the adhesive film has flowability and reactivity at room temperature, and after being placed at room temperature for a period of time, the adhesive film reacts at a certain proportion, loses flowability, and improves processability, so that the adhesive film can be attached to the chip and meet the unique processing procedure of the radio frequency chip.

[0092] Performance comparison test:

[0093] The epoxy adhesive films prepared in the first embodiment to the fourth embodiment and foreign competitive epoxy adhesive films are subjected to performance test, and the results are shown in Table 1.

[0094] Table 1

[0095]

[0096]

[0097] Detection method:

[0098] Shear strength: according to ASTM D3165, 25 DEG C.

[0099] Hot air test: 350-400 DEG C / 20S hot air test.

[0100] Glass transition temperature: according to ASTM E6604, measured by using a differential scanning calorimeter, and the heating rate is 10 DEG C / min.

[0101] Linear expansion coefficient: according to ASTM E1545, 25 DEG C. Wherein, ɑ1 is the linear expansion coefficient of the low temperature section (30-80 DEG C), and ɑ2 is the linear expansion coefficient of the high temperature section (120-180 DEG C).

[0102] Curing shrinkage: according to DIN 16945, 25 DEG C.

[0103] PCT water absorption: according to GB / T1034-1998, 121 DEG C, RH100 / 72h.

[0104] Warpage deformation: 25 DEG C, diagonal line method.

[0105] Thermal conductivity: according to ASTM C518, 25 DEG C.

[0106] Cold and hot impact test: according to GB / T 2423.5-2019, -50 DEG C-150 DEG C cracking.

[0107] As can be seen from the data in Table 1, the radio frequency chip packaging adhesive film provided by the present application has good temperature resistance, high glass transition temperature, low linear expansion coefficient, low moisture absorption rate, small warpage deformation amount and strong adhesion, and can meet the special requirements of radio frequency chip packaging.

[0108] Specifically, the first to fourth embodiments can pass the hot air test of 350-400 DEG C / 20S, the surface of the adhesive film has no cracks, the section is fine and smooth without defects. The glass transition temperature is higher than 170 DEG C, and can withstand severe reliability tests. The linear expansion coefficient a1 is less than 17 ppm / DEG C, meeting the requirements of advanced packaging for epoxy resin materials. The PCT water absorption is less than 0.4%, which is better than the test threshold of 0.6-0.7%, and the cold and hot impact test shows that the embodiments provided by the present application have good performance in resisting high and low temperature cycles. The first to fourth embodiments are also excellent in warpage deformation amount. The cured adhesive film is tested by diagonal line method, and the warpage deformation amount is not higher than 5%. In addition, the embodiments provided by the present application have good adhesion, the shear strength of the adhesive film is higher than 12 MPa, and the substrate can be effectively bonded, so as to improve the density and tightness of the bonding surface.

[0109] In order to reflect the difference, the characteristics of the first to fourth embodiments are distinguished. The first embodiment is a general product, which has good comprehensive performance and high cost performance, and can meet the conventional requirements of radio frequency chips. The second embodiment has the characteristics of high glass transition temperature, low linear expansion coefficient and small PCT water absorption, and is suitable for higher requirement application scenarios. The third embodiment has better adhesion strength and cold and hot impact resistance, and can be used in application scenarios with strict requirements on the adhesion performance and temperature difference of the product. The thermal conductivity of the fourth embodiment is as high as 1.725 W / (m·K), which is a product with good thermal conductivity, especially suitable for special applications with high chip wiring density, high degree of functionalization, small chip size and high requirements on the thermal conductivity of the chip.

[0110] In addition, the present application selects a foreign competitor as a comparative example. As can be seen from the data in Table 1, compared with the competitor, the embodiments provided by the present application have advantages in temperature resistance, linear expansion coefficient, glass transition temperature, curing shrinkage, PCT water absorption, warpage deformation amount and the like, and can completely replace the foreign competitor in the field of chip packaging, so the embodiments provided by the present application have outstanding superiority.

[0111] To sum up, the embodiment of the present application is to match the curing agent and the accelerator by using the epoxy resin, the toughening agent, the powder filler and the special auxiliary agent, to obtain the high-performance adhesive film for chip packaging with good temperature resistance, high glass transition temperature, low linear expansion coefficient, low moisture absorption rate, small warpage deformation and strong adhesion by optimizing each component and the scientific compounding of raw materials and the reasonable processing mode.

[0112] The technical features of the above-mentioned embodiments can be combined arbitrarily, and to make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described, however, as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.

[0113] The above-mentioned embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as the limitation of the patent scope of the present application. It should be pointed out that for ordinary skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A radio frequency chip encapsulation glue, characterized in that, Includes component A and component B; Component A mainly includes epoxy resin, toughening agent, black paste, defoamer, coupling agent, dispersant, and powder filler. By weight percentage, epoxy resin accounts for 6-20.6% of component A, toughening agent accounts for 3-6% of component A, black paste accounts for 1-2% of component A, defoamer accounts for 0.1-0.3% of component A, coupling agent accounts for 0.2-0.5% of component A, dispersant accounts for 0.1-0.2% of component A, and powder filler accounts for 75-85% of component A. Component B mainly includes aromatic amine curing agents, alicyclic curing agents, and curing accelerators. By weight percentage, aromatic amine curing agents account for 52-78% of component B, alicyclic curing agents account for 20-42% of component B, and curing accelerators account for 2-6% of component B. The mass ratio of component A to component B is 100:(5~9). The epoxy resin is a trifunctional epoxy resin or a tetrafunctional epoxy resin; the toughening agent is a core-shell toughening agent or a rubber-based toughening agent; the powder filler is spherical silica or spherical alumina with a particle size between 0.5 and 30 μm; the coupling agent is any one of KH-560, KH-550, A-187, KBM-303, and KBM-803; the dispersant is any one of BYK-9011, BYK-110, BYK-163, and SDJ-8110; the aromatic amine curing agent is any one of diethyltoluene diamine and 3,3'-diethyl-4,4'-diaminodiphenylmethane; the alicyclic curing agent is any one of 3,3-dimethyl-4,4-diaminodicyclohexylmethane, isophorone diamine, and 4,4'-diaminodicyclohexylmethane.

2. The RF chip package adhesive of claim 1, wherein: The defoamer is any one or two of BYK-A530, KS-603, BYK-141, BYK-066N and Dow Corning 163.

3. The RF chip package adhesive of claim 1, wherein: The curing accelerator is either Accelerator 399 or AEP.

4. An adhesive film for radio frequency chip packaging, characterized by, The radio frequency chip encapsulation film comprises a PET base film, an adhesive layer, and a PET release film stacked sequentially, wherein the adhesive layer comprises the radio frequency chip encapsulation adhesive according to any one of claims 1 to 3.

5. The method for preparing the adhesive film for radio frequency chip packaging according to claim 4, characterized in that, Includes the following steps: The materials in component A are sequentially added to the reactor, heated and stirred, and then discharged after vacuum degassing; the materials in component B are sequentially added to the reactor, stirred, and then discharged. Mix components A and B in a specific ratio until homogeneous, filter, and then degas under vacuum to obtain the adhesive solution. The adhesive is transferred to a coating machine and coated between the PET base film and the PET release film to obtain an adhesive film. The film is rolled up and cut to obtain sheet or roll form.

6. The preparation method according to claim 5, characterized in that, When the materials in A group are put into the reactor successively, the heating temperature is 50-70℃, the stirring speed is 60-80r / min, and the stirring time is 1-2h; when the materials in B group are put into the reactor successively, the heating temperature is 30-50℃, the stirring speed is 60-90r / min, and the stirring time is 1-2h; the oven temperature of the coating machine is 50-80℃, the coating gap is 260-450μm, the running speed is 1-2m / min, and the thickness of the adhesive film is 100-350μm.

7. The use of the adhesive film for radio frequency chip package according to claim 4 in chip package, characterized in that, When used, the PET release film is torn off, the adhesive film is pasted and compressed on the chip, and after heating and curing at 130-175℃, the chip is bonded.

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