Driving pump chip

Abstract

The embodiment of the invention discloses a driving pump chip. The driving pump chip comprises a cover plate, a substrate and a piezoelectric chip, a groove is formed in the base plate; the piezoelectric chip is embedded into the groove; the cover plate is located on the side, away from the substrate, of the piezoelectric chip and covers the piezoelectric chip. The piezoelectric chip comprises a piezoelectric unit and a fluid flow channel structure; the piezoelectric unit is located in the fluid flow channel structure; and the piezoelectric chip is used for pushing fluid in the fluid flow channel structure to flow by taking deformation of the piezoelectric unit as power after being connected with an external power supply. According to the technical scheme of the embodiment of the invention, the piezoelectric chip is arranged and packaged, the groove is formed in the substrate, the piezoelectric chip is embedded in the groove, the cover plate covers the piezoelectric chip, the wiring end of the piezoelectric chip is connected with the external power supply, and the piezoelectric deformation of the piezoelectric chip after electrification is used as power to push the fluid to flow. The fluid type compatibility is improved, and the integration degree is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of drive pumps, and in particular to a drive pump chip. Background Art

[0002] As a main power source for fluid, the drive pump is a key component of various fluid systems. However, the drive pump is relatively large in size and has a low degree of integration compared to the fluid system. The designs of the drive pump in the prior art include drive pumps based on motors, drive pumps based on stainless steel piezoelectric sheets, micro peristaltic pumps based on polydimethylsiloxane (PDMS) materials, and thermal foaming micro pumps.

[0003] However, the drive pumps that rely on motors are large in size and have poor integration. The drive pumps based on stainless steel piezoelectric sheets are suitable for devices with liquid volumes of more than ten milliliters, such as electric irons or fish tank water purifiers, but are not suitable for applications with sample volumes in the microliter range, such as biological monitoring. The power source of the micro peristaltic pump based on PDMS material is generally a larger compressed air source. The power source of the thermal bubble micropump is to heat to form bubbles and then push the droplets, but after heating to a high temperature, it is incompatible with most liquids and cannot push gases. Summary of the invention

[0004] The present invention provides a driving pump chip to solve the problems of incompatibility with multiple fluid types and low integration.

[0005] According to one aspect of the present invention, a driving pump chip is provided, the driving pump chip comprising: a cover plate, a substrate and a piezoelectric chip; a groove is provided in the substrate; the piezoelectric chip is embedded in the groove;

[0006] The cover plate is located on a side of the piezoelectric chip away from the substrate and covers the piezoelectric chip;

[0007] The piezoelectric chip includes a piezoelectric unit and a fluid flow channel structure; the piezoelectric unit is located in the fluid flow channel structure; the piezoelectric chip is used to drive the flow of fluid in the fluid flow channel structure by using the deformation of the piezoelectric unit as power after connecting to an external power source.

[0008] Optionally, the fluid flow channel structure includes a protruding portion and a first recessed portion; the protruding portion and the first recessed portion are arranged at intervals;

[0009] The piezoelectric unit array is arranged in the first recessed portion;

[0010] The protruding part is connected to the cover plate through insulating glue.

[0011] Optionally, the piezoelectric unit includes multiple piezoelectric layers and multiple piezoelectric cavities; the piezoelectric layer is located on the side of the piezoelectric chip close to the cover plate; the piezoelectric cavity is located on the side of the piezoelectric chip away from the cover plate; the piezoelectric cavity and the piezoelectric layer are arranged correspondingly; the shapes of the piezoelectric layer and the piezoelectric cavity both include rectangles.

[0012] Optionally, a first flow channel and a second flow channel are further provided on the substrate; the first flow channel and the second flow channel are located at two ends of the groove and are arranged opposite to each other;

[0013] The first flow channel and the second flow channel are both in communication with the fluid flow channel structure;

[0014] The first flow channel serves as a channel for fluid to enter; the second flow channel serves as a channel for fluid to flow out.

[0015] Optionally, the driving pump chip also includes: a plurality of connecting pads; the piezoelectric chip also includes a second recessed portion, the second recessed portion is spaced apart from the fluid flow channel structure; the connecting pad is arranged in the second recessed portion and is located on the side of the piezoelectric layer close to the cover plate.

[0016] Optionally, the driving pump chip further includes: a wiring harness; the wiring harness extends from one side of the substrate to the other side of the substrate; one end of the wiring harness is connected to the controller;

[0017] The other end of the cable is connected to the connection pad.

[0018] Optionally, the driving pump chip further includes: a cable receiving unit; the cable receiving unit and the cable are located at the same end of the substrate and extend from one side of the substrate to the other side of the substrate;

[0019] The cable receiving unit is used for carrying the cables.

[0020] Optionally, the cable receiving unit is clamped at one end of the substrate, and one side of the cable receiving unit is complementary to the cover plate, and the other side of the cable receiving unit covers a part of the substrate away from the cover plate.

[0021] The shape of the cable receiving unit includes a U shape.

[0022] Optionally, the process for forming the fluid channel structure includes photolithography, etching or bonding.

[0023] Optionally, the process for forming the piezoelectric layer includes sputtering deposition or spin coating.

[0024] The technical solution of the embodiment of the present invention is to set a piezoelectric chip and package it, set a groove in the substrate, embed the piezoelectric chip into the groove, and cover the piezoelectric chip with a cover plate to prevent impurities such as dust or moisture in the external environment from damaging the piezoelectric chip. The wiring terminals of the piezoelectric chip are connected to an external power supply, so that the piezoelectric deformation of the piezoelectric chip after power is turned on is used as power to drive the flow of fluid, thereby improving the compatibility of fluid types and being able to drive substances such as air. At the same time, it has the advantages of extremely low heat generation and will not damage biological materials, and has a high degree of integration, and is suitable for applications with sample quantities in microliters such as biological monitoring.

[0025] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 is a schematic diagram of a disassembled structure of a driving pump chip provided according to an embodiment of the present invention;

[0028] Figure 2 is a schematic diagram of the front structure of a piezoelectric chip in a driving pump chip provided according to an embodiment of the present invention;

[0029] Figure 3 is a schematic diagram of the back structure of a piezoelectric chip in a driving pump chip provided according to an embodiment of the present invention;

[0030] Figure 4 is a schematic diagram of the front structure of a substrate in a driving pump chip provided according to an embodiment of the present invention;

[0031] Figure 5 is a schematic diagram of the back structure of a substrate in a driving pump chip provided according to an embodiment of the present invention;

[0032] Figure 6 is a schematic diagram of the front structure of a driving pump chip provided according to an embodiment of the present invention;

[0033] Figure 7 It is a schematic diagram of the back structure of a driving pump chip provided according to an embodiment of the present invention. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0035] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0036] Figure 1 is a schematic diagram of the disassembled structure of a driving pump chip provided according to an embodiment of the present invention, such as Figure 1 As shown, the driving pump chip includes: a cover plate 10, a substrate 20 and a piezoelectric chip 30; a groove 201 is provided in the substrate 20; the piezoelectric chip 30 is embedded in the groove 201; the cover plate 10 is located on the side of the piezoelectric chip 30 away from the substrate 20, and covers the piezoelectric chip 30; the piezoelectric chip 30 includes a piezoelectric unit 301 and a fluid flow channel structure 302; the piezoelectric unit 301 is located in the fluid flow channel structure 302; the piezoelectric chip 30 is used to drive the fluid flow in the fluid flow channel structure 302 with the deformation of the piezoelectric unit 301 as power after connecting to an external power supply.

[0037] In the embodiment of the present invention, the cover plate 10 is used to protect the piezoelectric chip 30, preventing dust or moisture and other impurities in the external environment from damaging the piezoelectric chip 30, thereby affecting the performance and service life of the piezoelectric chip 30. At the same time, the cover plate 10 and the piezoelectric chip 30 need to be sealed to ensure that a fluid flow channel is formed in the piezoelectric chip 30 and to prevent impurities in the external environment from entering. A good seal is formed between the cover plate 10 and the substrate 20, which can ensure that when the piezoelectric chip 30 drives the fluid to flow, the fluid flows in a predetermined path and manner, avoiding leakage and other problems, and improving the fluid driving efficiency and reliability of the driving pump chip. Exemplarily, the piezoelectric chip 30 is embedded in the groove 201 of the substrate 20, and a fluid inlet channel and a fluid outlet channel are provided on the substrate 20. The fluid inlet channel is connected to one end of the fluid flow channel structure 302 in the piezoelectric chip 30, and the fluid outlet channel is connected to the other end of the fluid flow channel structure 302 in the piezoelectric chip 30. The cover plate 10 is sealed to the substrate 20 to form a fluid flow path. When the piezoelectric chip 30 is connected to an external power supply, due to the special piezoelectric effect of the piezoelectric material, the piezoelectric unit 301 will undergo piezoelectric deformation to promote the fluid to flow along the formed flow path.

[0038] The material of the cover plate 10 needs to have certain sealing properties, corrosion resistance, and good compatibility with the substrate 20 and the piezoelectric chip 30, which is more conducive to achieving sealing cooperation between the cover plate 10 and the substrate 20 and the piezoelectric chip 30. Exemplarily, the cover plate 10 can be a plastic film with glue, a plastic sheet with glue, or a glass sheet with glue.

[0039] A groove 201 is provided in the substrate 20, and the shape and size of the groove 201 match the shape of the piezoelectric chip 30. The groove 201 provides a fixed installation position for the piezoelectric chip 30, so that the piezoelectric chip 30 can be stably embedded therein. The substrate 20 can also play a role in connecting other components. Exemplarily, the substrate 20 is connected to the cover plate 10 to seal the piezoelectric chip 30 in the groove 201 to avoid liquid leakage and prevent impurities such as dust from entering the piezoelectric chip 30. The substrate 20 can also play a role in providing a certain flow channel or constrained space for the fluid. Exemplarily, a channel is formed on the substrate 20 by a photolithography or etching process to provide a flow path for the liquid entering and exiting the piezoelectric chip 30.

[0040] The piezoelectric chip 30 is a core component of the driving pump chip formed in the embodiment of the present invention to realize the fluid driving function. The piezoelectric chip 30 can be manufactured by semiconductor technology. When the piezoelectric chip 30 is connected to an external power supply, piezoelectric deformation will occur due to the special piezoelectric effect of the piezoelectric material. The piezoelectric effect refers to the phenomenon that when certain dielectrics are deformed by external forces in a certain direction, polarization will occur inside them, and positive and negative charges will appear on two relative surfaces at the same time. When an electric field is applied in the polarization direction of the dielectric, these dielectrics will be deformed, and after the electric field is removed, the deformation of the dielectric disappears. In an embodiment of the present invention, by using piezoelectric deformation, the piezoelectric chip 30 can convert electrical energy into mechanical energy, using the force generated by its own deformation as a power source, thereby promoting the flow of the surrounding fluid. The amplitude, frequency and other characteristics of the deformation of the piezoelectric chip 30 will be affected by the parameters such as the voltage, current or frequency of the applied external power supply, and need to be controlled according to the specific fluid driving requirements.

[0041] In an embodiment of the present invention, a semiconductor piezoelectric film process is used to form a driving pump chip. Among them, a semiconductor piezoelectric film, that is, a piezoelectric unit in a piezoelectric chip, is formed by a semiconductor sputtering method or a spin coating method. When an electric field is applied to the semiconductor piezoelectric film, the film produces a piezoelectric effect and deforms. The fluid flow channel structure in the piezoelectric chip can be formed by etching silicon dioxide or silicon nitride to provide a flow path for the fluid. The formed driving pump chip utilizes the characteristics of piezoelectric material when it is electrically deformed to directly convert electrical energy into mechanical energy to drive the fluid. The driving pump chip formed in the embodiment of the present invention is highly compatible with the type of fluid, and can not only drive the flow of liquid, but also drive substances such as air. At the same time, the heat generated by the piezoelectric chip is extremely small and will not damage the biological material. In addition, the closed packaging of the cover plate, substrate and piezoelectric chip improves the integration of the driving pump chip.

[0042] The technical solution of the embodiment of the present invention is to set a piezoelectric chip and package it, set a groove in the substrate, embed the piezoelectric chip into the groove, and cover the piezoelectric chip with a cover plate to prevent impurities such as dust or moisture in the external environment from damaging the piezoelectric chip. The wiring terminals of the piezoelectric chip are connected to an external power supply, so that the piezoelectric deformation of the piezoelectric chip after power is turned on is used as power to drive the flow of fluid, thereby improving the compatibility of fluid types and being able to drive substances such as air. At the same time, it has the advantages of extremely low heat generation and will not damage biological materials, and has a high degree of integration, and is suitable for applications with sample quantities in microliters such as biological monitoring.

[0043] Figure 2 Schematic diagram of the front structure of a piezoelectric chip in a driving pump chip provided according to an embodiment of the present invention. Figure 1 and Figure 2 Optionally, the fluid channel structure 302 includes a protrusion 3021 and a first recess 3022; the protrusion 3021 and the first recess 3022 are arranged at intervals; the piezoelectric units 301 are arranged in an array in the first recess 3022; the protrusion 3021 is connected to the cover plate 10 by an insulating glue.

[0044] In the embodiment of the present invention, the piezoelectric unit 301 is the basic functional unit of the piezoelectric chip 30, which is generally composed of a thin sheet or film made of piezoelectric material, with electrodes covered on the upper and lower surfaces. The electrodes are used to connect to an external power supply. When voltage is applied, under the action of the electric field, the electric dipole moment inside the piezoelectric material changes its orientation, causing the material to deform.

[0045] The fluid flow channel structure 302 includes a protrusion 3021 and a first recessed portion 3022. The protrusion 3021 plays a role in structural connection and sealing, and is connected to the cover plate 10 by an insulating glue, which can ensure the stable connection between the cover plate 10 and the piezoelectric chip 30, so that the structure of the formed driving pump chip is more compact, and the cover plate 10 is used to close the flow channel of the piezoelectric chip 30 to ensure the formation of a closed environment and no fluid leakage. The first recessed portion 3022 is used to accommodate the piezoelectric unit 301. The piezoelectric unit 301 is arranged in an array in the first recessed portion 3022, which helps to achieve more uniform, stable and efficient energy conversion and the effect on the fluid. Exemplarily, when the piezoelectric chip 30 is connected to an external power supply, the piezoelectric unit 301 will undergo piezoelectric deformation. Due to the array arrangement, the force generated to promote the flow of the fluid can be more evenly distributed in the fluid flow channel structure 302, so that the fluid can flow smoothly and orderly as expected, avoiding the occurrence of fluid flow turbulence caused by uneven force.

[0046] Based on the technical solution of the above invention embodiment, Figure 1 and Figure 2 Optionally, the formation process of the fluid channel structure 302 includes photolithography, etching or bonding.

[0047] In the embodiment of the present invention, photolithography is a technology that uses photochemical reactions to transfer designed patterns to substrate materials. The process of applying photolithography to form fluid flow channel structure 302 includes: first, a layer of photoresist is coated on the surface of the substrate, and the chemical properties of the photoresist will change after being exposed to light of a specific wavelength and intensity. The designed flow channel pattern is projected onto the photoresist through a mask, and the photoresist in the exposed area undergoes a chemical reaction and becomes soluble or insoluble. Then, the unnecessary photoresist is removed through a developing process to form a photoresist pattern corresponding to the pattern of the fluid flow channel structure 302. Photolithography technology has the characteristics of high resolution and high precision, and can realize the production of very fine flow channel patterns, and can produce fluid flow channel structures 302 at the micron or even nanometer level. The fluid flow channel structure 302 can also be formed by etching silicon dioxide or silicon nitride. The etching method can be selected from dry etching or wet etching. The fluid flow channel structure 302 can also be formed by a bonding process, connecting different materials or structures together by chemical bonding or physical bonding to form the fluid flow channel structure 302. The fluid flow channel structure 302 formed by the bonding process can effectively avoid fluid leakage and improve the sealing and reliability of the channel.

[0048] Figure 3 Schematic diagram of the back structure of a piezoelectric chip in a driving pump chip provided according to an embodiment of the present invention. Figure 1 , Figure 2 and Figure 3Optionally, the piezoelectric unit 301 includes multiple piezoelectric layers 3011 and multiple piezoelectric cavities 3012; the piezoelectric layer 3011 is located on the side of the piezoelectric chip 30 close to the cover plate 10; the piezoelectric cavity 3012 is located on the side of the piezoelectric chip 30 away from the cover plate 10; the piezoelectric cavity 3012 is arranged corresponding to the piezoelectric layer 3011; the shapes of the piezoelectric layer 3011 and the piezoelectric cavity 3012 can both include a rectangle.

[0049] In an embodiment of the present invention, the piezoelectric layer 3011 is made of a material having a piezoelectric effect. Exemplarily, the material of the piezoelectric layer 3011 may include quartz crystal, piezoelectric ceramics or piezoelectric polymers. When an external electric field is applied, the electric dipole moment inside the piezoelectric layer 3011 will be reoriented, thereby causing the material to deform, and the resulting deformation can be transmitted to the surroundings, thereby promoting the flow of fluid. The piezoelectric cavity 3012 can play a certain buffering and synergistic role when the piezoelectric layer 3011 is deformed. Exemplarily, when the piezoelectric layer 3011 is deformed due to the action of the electric field, it will cause the volume of the piezoelectric cavity 3012 to change, which will help the deformation process of the piezoelectric unit 301 to be more stable and orderly, and ensure that the piezoelectric unit 301 can play an efficient and stable role when promoting the flow of fluid. The piezoelectric chip 30 is sealed around by glue to ensure that there is no fluid leakage, and the glue cannot enter the piezoelectric cavity 3012 to avoid affecting the working process of the piezoelectric unit 301.

[0050] Based on the technical solution of the above invention embodiment, Figure 2 Optionally, the formation process of the piezoelectric layer 3011 includes sputtering deposition or spin coating.

[0051] In the embodiment of the present invention, sputtering deposition is a physical vapor deposition technology. In a vacuum environment, a high-energy ion beam generated by an ion source is used to bombard a piezoelectric material target material, so that atoms or molecules on the surface of the target material obtain sufficient energy and escape, and the escaped atoms or molecules are deposited on the surface of the substrate at a certain speed to form a piezoelectric layer 3011. By controlling parameters such as the energy of the ion beam, the bombardment time, and the distance between the target material and the substrate, the thickness, uniformity, and crystal quality of the piezoelectric layer 3011 can be adjusted. The piezoelectric layer 3011 formed by sputtering deposition has the advantages of high film quality, strong adhesion, and precise control.

[0052] Spin coating is to drop a solution or sol-gel system containing piezoelectric material onto the surface of the substrate, and then when the substrate is rotated at high speed, the solution is evenly spread on the surface of the substrate under the action of centrifugal force, and the solvent evaporates rapidly, and the remaining piezoelectric material forms the piezoelectric layer 3011. By controlling parameters such as the concentration, viscosity, spin coating speed and time of the solution, the thickness and uniformity of the piezoelectric layer 3011 can be adjusted. Forming the piezoelectric layer 3011 by spin coating has the advantages of simple operation and high material utilization.

[0053] Figure 4 It is a schematic diagram of the front structure of a substrate in a driving pump chip provided according to an embodiment of the present invention. Figure 5 Schematic diagram of the back structure of a substrate in a driving pump chip provided according to an embodiment of the present invention. Figure 1 , Figure 4 and Figure 5 Optionally, a first flow channel 202 and a second flow channel 203 are further provided on the substrate 20; the first flow channel 202 and the second flow channel 203 are located at both ends of the groove 201 and are arranged opposite to each other; the first flow channel 202 and the second flow channel 203 are both connected to the fluid flow channel structure 302; the first flow channel 202 serves as a channel for the fluid to enter; the second flow channel 203 serves as a channel for the fluid to flow out.

[0054] In an embodiment of the present invention, the first flow channel 202 and the second flow channel 203 are both connected to the fluid flow channel structure 302, so that the driving pump chip works normally and promotes the flow of fluid. When the driving pump chip starts to work, the fluid enters the fluid flow channel structure 302 from the first flow channel 202, and is pushed by the piezoelectric deformation caused by the deformation of the piezoelectric chip 30 after connecting to an external power supply in the fluid flow channel structure 302, and then the fluid is transported, flows out from the second flow channel 203, and finally flows out of the driving pump chip, completing a complete fluid transport. The first flow channel 202, the second flow channel 203 and the fluid flow channel structure 302 cooperate with each other to form a continuous and complete fluid channel. In an embodiment of the present invention, the cover plate 10 is also used to close the first flow channel 202, the second flow channel 203 and the fluid flow channel structure 302 to ensure that a closed environment is formed and there is no fluid leakage.

[0055] Figure 6 is a schematic diagram of the front structure of a driving pump chip provided according to an embodiment of the present invention. Figure 2 and Figure 6 Optionally, the driving pump chip also includes: a plurality of connecting pads 303; the piezoelectric chip 30 also includes a second recessed portion 3023, and the second recessed portion 3023 is spaced apart from the fluid flow channel structure 302; the connecting pad 303 is arranged in the second recessed portion 3023, and is located on the side of the piezoelectric layer 3011 close to the cover plate 10.

[0056] In an embodiment of the present invention, the connection pad 303 is used to realize the electrical connection between the piezoelectric chip 30 and the external circuit. The piezoelectric chip 30 is connected to an external circuit such as a power supply and a signal processing circuit by welding a wire or the like, so as to provide a driving voltage to the piezoelectric chip 30 or receive an electrical signal generated by the piezoelectric chip 30. Exemplarily, the external power supply provides a voltage to the piezoelectric chip 30 through the connection pad 303, so that the piezoelectric chip 30 is deformed to realize the function of driving the fluid to flow. Multiple connection pads 303 are arranged at intervals, so that the signal transmission path can be clearer and the interference of the signal can be reduced.

[0057] Based on the technical solution of the above invention embodiment, Figure 1 and Figure 6 Optionally, the driving pump chip further includes: a flat cable 204 ; the flat cable 204 extends from one side of the substrate 20 to the other side of the substrate 20 ; one end of the flat cable 204 is connected to the controller; and the other end of the flat cable 204 is connected to the connecting pad 303 .

[0058] In an embodiment of the present invention, the controller is used to generate an electrical signal and transmit it to the piezoelectric chip 30 through the flat cable 204. The controller can be an integrated circuit board or a microprocessor or other device. The controller can generate a control signal according to a preset program and algorithm and transmit it to the piezoelectric chip 30 through the flat cable 204. Exemplarily, the controller can accurately adjust the working parameters of the piezoelectric chip 30 according to the driving requirements, such as controlling the voltage and power-on time of the piezoelectric chip 30, so as to accurately control the amount of the driven fluid and the driving speed. The other end of the flat cable 204 is connected to the piezoelectric chip 30 through the connecting pad 303. Through the connecting pad 303, the flat cable 204 can stably transmit the electrical signal sent by the controller to the piezoelectric chip 30.

[0059] Based on the technical solution of the above invention embodiment, Figure 1 and Figure 6 Optionally, the drive pump chip further includes: a cable receiving unit 205; the cable receiving unit 205 and the cable 204 are located at the same end of the substrate 20, and extend from one side of the substrate 20 to the other side of the substrate 20; the cable receiving unit 205 is used to carry the cable.

[0060] In an embodiment of the present invention, the cable receiving unit 205 can be a raised platform or a bracket structure, which provides a stable placement basis for the cable 204, ensures that the direction of the cable 204 inside the driving pump chip meets the requirements of signal transmission, and prevents the cable 204 from shaking randomly and affecting the reliability of the circuit connection.

[0061] Figure 7 is a schematic diagram of the back structure of a driving pump chip provided according to an embodiment of the present invention. Figure 1 , Figure 6 and Figure 7 Optionally, the cable receiving unit 205 is clamped at one end of the substrate 20, and one side of the cable receiving unit 205 is complementary to the cover 10, and the other side of the cable receiving unit 205 covers a part of the substrate 20 away from the cover 10; the shape of the cable receiving unit 205 includes a U-shape.

[0062] In the embodiment of the present invention, the cable receiving unit 205 is configured to be U-shaped, which can improve the integration of the driving pump chip, reduce the volume of the driving pump chip, and achieve better line connection.

[0063] The cable receiving unit 205 is clamped on one end of the substrate 20, and one side is complementary to the cover plate 10, and the other side covers a part of the side of the substrate 20 away from the cover plate 10, which can maintain the stability of the substrate 20 and the cover plate 10, and prevent the cable receiving unit 205 from shaking or falling off when vibration occurs or internal fluid flows during the operation of the driving pump chip, thereby ensuring the safety and stability of the cable 204 carried by the cable receiving unit 205. Figure 7 The back structural diagram of the driving pump chip shown also includes a piezoelectric chip 30 and piezoelectric cavities 3012 arranged in an array in the piezoelectric chip 30 .

[0064] In the embodiment of the present invention, the fluid channel structure 302 can be formed by etching silicon dioxide or silicon nitride, and a semiconductor piezoelectric film, i.e., a piezoelectric unit 301, can be formed in the fluid channel structure 302 by semiconductor sputtering or spin coating. The piezoelectric unit 301 and the fluid channel structure 302 together constitute the piezoelectric chip 30. A plurality of connection pads 303 are formed by welding on one side of the piezoelectric unit 301, which are used to connect an external power supply to provide a driving voltage for the piezoelectric chip 30, and use the deformation of the piezoelectric unit 301 as a driving force to drive the fluid flow in the fluid channel structure 302. Compared with the application of heating in the prior art to form bubbles to drive droplets, which is incompatible with most liquids after being heated to a high temperature, the technical solution of the embodiment of the present invention can achieve compatibility with a variety of fluids, can drive substances such as air, and has the advantages of extremely low heat generation and no damage to biological materials.

[0065] A substrate 20 is provided, and a groove 201 is formed on the substrate 20 by etching or other processes. The piezoelectric chip 30 is embedded in the groove 201, and a first flow channel 202 and a second flow channel 203 are also provided on the substrate 20. The first flow channel 202 and the second flow channel 203 are located at both ends of the groove 201 and are arranged opposite to each other. The first flow channel 202 and the second flow channel 203 are both connected to the fluid flow channel structure 302. The first flow channel 202 serves as a channel for the fluid to enter; the second flow channel 203 serves as a channel for the fluid to flow out. A plastic film, plastic sheet or glass sheet with glue is used as a cover plate 10, which is sealed with the substrate 20 and the piezoelectric chip 30 to prevent dust or moisture in the external environment from damaging the piezoelectric chip 30 and prevent fluid leakage in the fluid flow channel structure 302. A cable receiving unit 205 is provided to carry the cable 204 and provide a stable placement basis for the cable 204, ensuring that the direction of the cable 204 inside the driving pump chip meets the requirements of signal transmission and preventing the cable 204 from shaking randomly and affecting the reliability of circuit connection. The cable receiving unit 205 is clamped on one end of the substrate 20, and one side of the cable receiving unit 205 is complementary to the cover plate 10, and the other side covers a part of the substrate 20 away from the cover plate 10, thereby improving the integration of the driving pump chip and reducing the volume of the driving pump chip. One end of the flat cable 204 is connected to the controller. The controller can accurately adjust the working parameters of the piezoelectric chip 30 according to the driving requirements, such as controlling the voltage and power-on time of the piezoelectric chip 30, so as to accurately control the amount of driven fluid and the driving speed. The other end of the flat cable 204 is connected to the connecting pad 303. The flat cable 204 can stably transmit the electrical signal sent by the controller to the piezoelectric chip 30 through the connecting pad 303, so that the piezoelectric unit 301 in the piezoelectric chip 30 is deformed, and then the deformation is used as power to promote the flow of fluid in the fluid channel structure 302.

[0066] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0067] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A driving pump chip, characterized in that: include: A cover plate, a substrate and a piezoelectric chip; a groove is provided in the substrate; and the piezoelectric chip is embedded in the groove; The cover plate is located at a side of the piezoelectric chip away from the substrate and covers the piezoelectric chip; The piezoelectric chip includes a piezoelectric unit and a fluid flow channel structure; The piezoelectric unit is located in the fluid flow channel structure; the piezoelectric chip is used to drive the flow of fluid in the fluid flow channel structure by using the deformation of the piezoelectric unit as power after being connected to an external power source.

2. The driving pump chip according to claim 1, characterized in that: The fluid channel structure comprises a protruding portion and a first concave portion; the protruding portion and the first concave portion are arranged at intervals; The piezoelectric unit array is arranged in the first recessed portion; The protrusion is connected to the cover plate through insulating glue.

3. The driving pump chip according to claim 2, characterized in that: The piezoelectric unit includes a plurality of piezoelectric layers and a plurality of piezoelectric cavities; the piezoelectric layers are located on a side of the piezoelectric chip close to the cover plate; the piezoelectric cavities are located on a side of the piezoelectric chip away from the cover plate; The piezoelectric cavity is arranged corresponding to the piezoelectric layer; the shapes of the piezoelectric layer and the piezoelectric cavity both include rectangles.

4. The driving pump chip according to claim 2, characterized in that: The substrate is also provided with a first flow channel and a second flow channel; the first flow channel and the second flow channel are located at two ends of the groove and are arranged opposite to each other; The first flow channel and the second flow channel are both in communication with the fluid flow channel structure; The first flow channel serves as a channel for fluid to enter; the second flow channel serves as a channel for fluid to flow out.

5. The driving pump chip according to claim 3, characterized in that: Also includes: The piezoelectric chip further comprises a second recessed portion, wherein the second recessed portion is spaced apart from the fluid channel structure; the connecting pad is disposed in the second recessed portion and is located on a side of the piezoelectric layer close to the cover plate.

6. The driving pump chip according to claim 5, characterized in that: Also includes: Cable arrangement; The flat cable extends from one side of the substrate to the other side of the substrate; one end of the flat cable is connected to the controller; The other end of the cable is connected to the connecting pad.

7. The driving pump chip according to claim 6, characterized in that: Also includes: A cable receiving unit; the cable receiving unit and the cable are located at the same end of the substrate and extend from one side of the substrate to the other side of the substrate; The cable receiving unit is used for carrying the cable.

8. The driving pump chip according to claim 7, characterized in that: The cable receiving unit is clamped at one end of the substrate, and one side of the cable receiving unit is complementary to the cover plate, and the other side of the cable receiving unit covers a part of the side of the substrate away from the cover plate; The shape of the cable receiving unit includes a U shape.

9. The driving pump chip according to claim 2, characterized in that: The forming process of the fluid channel structure includes photolithography, etching or bonding.

10. The driving pump chip according to claim 3, characterized in that: The formation process of the piezoelectric layer includes sputtering deposition or spin coating.

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