Temperature control assembly, air conditioner and control method of air conditioner

Abstract

The invention provides a temperature control assembly, an air conditioner and a control method of the air conditioner. The temperature control assembly comprises a first liquid cooling plate, a heat insulation plate, a second liquid cooling plate and a semiconductor chilling plate which are sequentially arranged in an overlapped mode. The first liquid cooling plate is used for exchanging heat with a control element, a first flow channel is arranged in the first liquid cooling plate, and the first flow channel is arranged from one end of the first liquid cooling plate to the other end of the first liquid cooling plate in a reciprocating communication mode. A liquid inlet of a second flow channel in the second liquid cooling plate is connected with a liquid outlet of the first flow channel; and the first flow channel and the second flow channel are used for circulating a secondary refrigerant. And the cold end of the semiconductor chilling plate is arranged close to the second liquid cooling plate. According to the temperature control assembly, the air conditioner and the control method of the air conditioner, the heat exchange efficiency of the temperature control assembly can be effectively improved, and energy consumption can be reduced through different temperature control modes according to the heating working conditions.

Description

Technical Field

[0001] The present application relates to the technical field of temperature control equipment, and in particular to a temperature control component, an air conditioner and a control method thereof. Background Art

[0002] With the vigorous development of electronic technology, power electronic devices are constantly developing in the direction of high power, high density and miniaturization. The heat dissipation effect of electronic devices has become a bottleneck restricting its development.

[0003] Common cooling methods for electronic power devices include air cooling, liquid cooling, semiconductor cooling, heat pipe cooling, etc. Traditional single air cooling and liquid cooling can no longer meet the cooling needs of existing equipment. Multi-mode combined cooling systems have begun to be used in various cooling scenarios.

[0004] In the process of implementing this application, the inventors found that there are at least the following problems in the prior art: the heat exchange efficiency of the heat dissipation method of the existing cooling system is low, resulting in poor heat dissipation effect, and even unable to fully meet the heat dissipation requirements of high-heat-generating power devices. At the same time, its heat dissipation method is single, and there is no targeted heat dissipation control based on the different heat dissipation requirements of the devices, resulting in high energy consumption of the cooling system, which is not conducive to cost reduction and efficiency improvement. Summary of the invention

[0005] Based on this, the present application provides a temperature control component, an air conditioner and a control method thereof to improve the problems of low heat exchange efficiency and high energy consumption caused by a single temperature control method in the prior art.

[0006] To achieve the above purpose, the technical solution of the embodiment of the present application is implemented as follows:

[0007] In a first aspect, an embodiment of the present application provides a temperature control assembly, comprising a first liquid cooling plate, a heat insulation plate, a second liquid cooling plate and a semiconductor cooling sheet which are stacked in sequence;

[0008] The first liquid cooling plate is used for heat exchange with the control element. A first flow channel is provided inside the first liquid cooling plate. The first flow channel is arranged to be reciprocated and connected from one end to the other end of the first liquid cooling plate.

[0009] The liquid inlet of the second flow channel in the second liquid cooling plate is connected to the liquid outlet of the first flow channel; the first flow channel and the second flow channel are used for circulating the coolant;

[0010] The cold end of the semiconductor refrigeration plate is arranged close to the second liquid cooling plate.

[0011] In one embodiment, the second flow channel is arranged to be reciprocatingly connected from one end to the other end of the second liquid cooling plate.

[0012] In one embodiment, the first flow channel is arranged in a spiral from the edge to the center of the first liquid cooling plate, and the liquid inlet of the first flow channel is located at the edge of the first liquid cooling plate;

[0013] The second flow channel is arranged in a spiral from the center to the edge of the second liquid cooling plate, and the liquid outlet of the second flow channel is located at the edge of the second liquid cooling plate.

[0014] In one embodiment, the temperature control component also includes an outdoor heat exchanger, an outdoor fan and a circulating water pump. The first liquid cooling plate, the second liquid cooling plate, the circulating water pump, and the outdoor heat exchanger are circulated and connected in sequence; the outdoor fan is used to increase the air circulation speed at the outdoor heat exchanger.

[0015] In one embodiment, the outdoor heat exchanger includes a first heat exchange coil assembly and a second heat exchange coil assembly, one end of the first heat exchange coil assembly and the second heat exchange coil assembly are fixedly connected, and the other ends are far away from each other to form a V-shaped structure, and the outdoor fan is arranged near the end of the first heat exchange coil assembly and the second heat exchange coil assembly far away from each other.

[0016] In one embodiment, the temperature control component further includes a radiator and a radiator fan, the radiator is connected to the hot end of the semiconductor refrigeration plate, and the radiator fan is used to increase the air circulation speed at the radiator.

[0017] In one embodiment, a heat-conducting structure is provided on the semiconductor refrigeration plate, and two ends of the heat-conducting structure are respectively connected to the second liquid cooling plate and the radiator.

[0018] In one embodiment, the temperature control component further includes a controller, and the controller is used to control the start and stop of the semiconductor refrigeration plate.

[0019] In a second aspect, an embodiment of the present application provides an air conditioner, comprising the temperature control component as described above, and also comprising the control element and a housing, wherein the control element is arranged on a side of the first liquid cooling plate away from the insulation plate, and ventilation holes are provided at positions of the housing corresponding to the semiconductor refrigeration plate.

[0020] In a third aspect, an embodiment of the present application provides a control method for the air conditioner as described above, wherein the air conditioner further comprises an outdoor heat exchanger and an outdoor fan provided at the outdoor heat exchanger, and the control method comprises the following steps:

[0021] Real-time detection of the heating power and surface temperature of the control element;

[0022] When the heating power of the control element is not higher than a first preset value, the cooling medium is controlled to circulate, the outdoor fan is controlled to be turned on, and the semiconductor refrigeration plate is controlled to be turned off;

[0023] When the heating power of the control element is higher than a first preset value but not higher than a second preset value, the cooling medium is controlled to circulate, the outdoor fan is controlled to be turned off, and the semiconductor refrigeration plate is controlled to be turned on;

[0024] When the heating power of the control element is higher than a second preset value or the temperature of the surface of the control element is higher than a preset temperature, the circulation of the coolant is controlled, and at the same time, the semiconductor refrigeration plate and the outdoor fan are controlled to be turned on.

[0025] The present application has at least the following beneficial effects: the temperature control assembly provided by the present application includes a first liquid cooling plate, the first liquid cooling plate is used for direct contact heat exchange with the control element to be temperature controlled, and the first liquid cooling plate is provided with a first flow channel that is reciprocatedly connected from one end of the first liquid cooling plate to the other end. This design can effectively improve the unevenness of the temperature rise of the coolant. The coolant flows back and forth in the first flow channel, which can effectively reduce the temperature difference between the inlet and outlet of the coolant, making the overall temperature of the coolant more uniform, thereby improving the heat exchange efficiency of the coolant. After the coolant is evenly heated in the first flow channel, it enters the second liquid cooling plate for further mixing and equalizing the temperature, and the second liquid cooling plate and the first liquid cooling plate are isolated from heat exchange by the heat insulation plate. When the mixed coolant exchanges heat with the semiconductor refrigeration plate, the heat exchange efficiency of the semiconductor refrigeration plate can be effectively improved, and the problem of low heat exchange efficiency and poor heat exchange effect caused by excessive temperature difference of the coolant can be reduced. The temperature control component provided in the present application can also realize various temperature control modes such as air cooling, liquid cooling, and mixed cooling of air cooling and liquid cooling by controlling the coolant and the semiconductor refrigeration sheet according to the different heat dissipation requirements of the control element, so that the temperature control component can reduce energy consumption as much as possible while meeting the heat dissipation requirements of the control element. The air conditioner and its control method provided in the present application include the above-mentioned temperature control component, and therefore, also have the above-mentioned beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the structure of the temperature control component of an embodiment of the present application.

[0027] Figure 2 A schematic diagram of the trajectory of the first flow channel or the second flow channel according to an embodiment of the present application.

[0028] Figure 3 This is a schematic diagram of the trajectory of the first flow channel or the second flow channel according to another embodiment of the present application.

[0029] Figure 4 This is a simplified schematic diagram of the structure of the temperature control component of an embodiment of the present application (the direction of the arrow is the direction of the refrigerant circulation).

[0030] Figure 5 This is a schematic diagram of the assembly structure of components such as the outdoor heat exchanger, circulating water pump and outdoor fan according to an embodiment of the present application.

[0031] The meanings of the symbols in the accompanying drawings are as follows:

[0032] 1. Control element; 2. First liquid cooling plate; 21. First flow channel; 3. Heat insulation plate; 4. Second liquid cooling plate; 41. Second flow channel; 5. Semiconductor refrigeration plate; 6. Radiator; 61. Radiator fan; 7. Outdoor heat exchanger; 71. Outdoor fan; 72. First heat exchange coil assembly; 73. Second heat exchange coil assembly; 74. Air outlet chamber; 75. Air inlet chamber; 8. Circulating water pump. DETAILED DESCRIPTION

[0033] The technical solution of the present application is further elaborated in detail below in conjunction with the accompanying drawings and specific embodiments of the specification.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit the implementation of this application. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0035] In the description of the present application, it should be understood that the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating positions or positional relationships, are based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In the description of the present application, unless otherwise specified, "multiple" means two or more.

[0036] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0037] See also Figure 1 The temperature control component of the embodiment of the present application includes a first liquid cooling plate 2, a heat insulation plate 3, a second liquid cooling plate 4 and a semiconductor cooling plate 5 which are stacked in sequence.

[0038] The first liquid cooling plate 2 is used for exchanging heat with the control element 1 . A first flow channel 21 is provided inside the first liquid cooling plate 2 . The first flow channel 21 is arranged to be reciprocally connected from one end to the other end of the first liquid cooling plate 2 .

[0039] The liquid inlet of the second flow channel 41 in the second liquid cooling plate 4 is connected to the liquid outlet of the first flow channel 21; the first flow channel 21 and the second flow channel 41 are used for circulating the coolant, specifically, the coolant can be, for example, a 50% concentration ethylene glycol solution.

[0040] The cold end of the semiconductor cooling plate 5 is arranged close to the second liquid cooling plate 4 .

[0041] Specifically, in this embodiment, the control element 1 may be, for example, an IGBT (insulated gate bipolar transistor) of a frequency converter. Of course, in other embodiments, the control element 1 may also be other high-heat-generating power elements with heat dissipation requirements.

[0042] Because the heat generation power of IGBT in some application scenarios is very high, the maximum power can exceed 1000W. When the ambient temperature is 65℃, in order for the IGBT to work normally, its maximum temperature needs to be controlled below 95℃, that is, the temperature rise is less than 30℃. For the single liquid cooling system, due to the limited internal space of the inverter, the size of the designed radiator fins is limited. In order to increase convection and improve heat exchange efficiency, the air volume needs to be increased. Under this size limitation, the fan air volume is also limited. Through CFD (computational fluid dynamics) simulation method, it is calculated that under the heat dissipation conditions of the single liquid cooling system, the minimum temperature of the IGBT also reaches a high temperature of 120℃. Therefore, for the single liquid cooling system, the heat dissipation requirements of the IGBT under all working conditions cannot be met.

[0043] Thermo Electric Cooler (TEC) is a device that uses the thermal-electric effect of semiconductors to generate cooling. It uses a conductor to connect two different metals, one side of which is lowered in temperature and the other side is raised in temperature. The semiconductor refrigeration sheet 5 can achieve active cooling. When the external ambient temperature is high, it is difficult for the liquid cooling plate to cool the temperature of the control element 1 below the ambient temperature, which will not meet the heat dissipation requirements of the IGBT under this working condition. The active cooling effect of TEC can make up for the shortcomings of the liquid cooling plate and improve the cooling effect in high temperature environments.

[0044] In this embodiment, the second flow channel 41 of the second liquid cooling plate 4 is not provided with a specific flow trajectory. In some embodiments, the second flow channel 41 may also be provided with a flow trajectory similar to the first flow channel 21 to further enhance the temperature uniformity effect of the coolant.

[0045] In this embodiment, the first flow channel 21 of the first liquid cooling plate 2 is arranged in a spiral from the edge to the center of the first liquid cooling plate 2, and the liquid inlet of the first flow channel 21 is located at the edge of the first liquid cooling plate 2. The second flow channel 41 is arranged in a spiral from the center to the edge of the second liquid cooling plate 4, and the liquid outlet of the second flow channel 41 is located at the edge of the second liquid cooling plate 4. The spiral of the flow trajectory here can be a non-standard spiral or a standard spiral. For example, it can be a square spiral (such as Figure 2 In other embodiments, the flow trajectory may also be a serpentine line (such as Figure 3 As shown in the figure, as long as the coolant can flow back and forth from one end of the liquid cooling plate to the other end, the shape of the specific flow trajectory is not limited.

[0046] The reciprocating flow channel design makes the temperature of the refrigerant after heat exchange more uniform. First, the refrigerant enters the first flow channel 21 and exchanges heat with the control element 1, and its temperature rises. It circulates back and forth through the first flow channel 21 and becomes a refrigerant with a relatively uniform temperature, and flows into the second flow channel 41. Since an insulation plate 3 is provided between the first liquid cooling plate 2 and the second liquid cooling plate 4, the refrigerant in the second flow channel 41 does not exchange heat with the refrigerant in the first flow channel 21, thereby avoiding the occurrence of uneven temperature. The reciprocating circulation of the refrigerant through the second flow channel 41 becomes a refrigerant with a more uniform temperature, thereby improving the heat exchange efficiency of the refrigerant. At the same time, if the refrigerant exchanges heat with the semiconductor refrigeration plate 5 at this time, the heat exchange efficiency of the semiconductor refrigeration plate 5 can also be improved.

[0047] In order to reduce the flow resistance of the flow channel, a smooth transition may be made at the corners of the first flow channel 21 and the second flow channel 41, for example, a rounded corner treatment may be performed.

[0048] like Figure 4 and Figure 5 As shown, specifically, the entire refrigerant circulation system also includes an outdoor heat exchanger 7, an outdoor fan 71 and a circulating water pump 8. The first liquid cooling plate 2, the second liquid cooling plate 4, the circulating water pump 8 and the outdoor heat exchanger 7 are circulated and connected in sequence; the outdoor fan 71 is used to increase the air circulation speed at the outdoor heat exchanger 7. The liquid outlet of the circulating water pump 8 is connected to the liquid inlet of the outdoor heat exchanger 7, and the liquid inlet of the circulating water pump 8 is connected to the liquid outlet of the second flow channel 41. The outdoor fan 71 of this embodiment is an axial flow fan. After the refrigerant exchanges heat with the control element 1 and heats up, it flows into the outdoor heat exchanger 7, and heat exchange with the outdoor air is achieved through forced convection of the outdoor fan 71, and the temperature is reduced.

[0049] like Figure 5As shown, the outdoor heat exchanger 7 of this embodiment includes a first heat exchange coil assembly 72 and a second heat exchange coil assembly 73, one end of the first heat exchange coil assembly 72 and the second heat exchange coil assembly 73 are fixedly connected, and the other ends are far away from each other to form a V-shaped structure, and the outdoor fan 71 is arranged near the end of the first heat exchange coil assembly 72 and the second heat exchange coil assembly 73 that are far away from each other. Specifically, in this embodiment, the bottom ends of the first heat exchange coil assembly 72 and the second heat exchange coil assembly 73 are fixedly connected, and the top ends are far away from each other by a certain distance to form a positive V-shaped structure. The space between the two heat exchange coil assemblies (the first heat exchange coil assembly 72 and the second heat exchange coil assembly 73) forms an air outlet cavity 74, and the space on both sides of the two heat exchange coil assemblies forms an air inlet cavity 75. The outdoor fan 71 is arranged at the top of the air outlet cavity 74, and the circulating water pump 8 is arranged below the two heat exchange coil assemblies. The two heat exchange coil assemblies are arranged in a V-shape, which can effectively increase the heat exchange area of ​​the heat exchange coil and improve the heat exchange efficiency. During heat exchange, the gas enters the middle air outlet chamber 74 from the air inlet chamber 75 on both sides of the two heat exchange coil assemblies, and is drawn to the outdoors through the outdoor fan 71.

[0050] like Figure 1 and Figure 4 As shown, the temperature control assembly of this embodiment also includes a radiator 6 and a radiator fan 61. The radiator 6 is connected to the hot end of the semiconductor cooling plate 5. The radiator fan 61 is used to increase the air circulation speed at the radiator 6. The radiator fan 61 can also be an axial flow fan. The radiator 6 is provided with a plurality of heat dissipation fins, and the heat dissipation fins are arranged at one end of the radiator 6 away from the semiconductor cooling plate 5. The heat at the hot end of the semiconductor cooling plate 5 is dissipated through heat exchange between the radiator 6 and the air after forced convection of the radiator fan 61.

[0051] In some embodiments, a heat-conducting structure (not shown) can also be provided on the semiconductor cooling sheet 5, and the two ends of the heat-conducting structure are respectively connected to the second liquid cooling plate 4 and the radiator 6. The heat-conducting structure can be made of aluminum alloy material, for example, aluminum plates can be respectively inlaid at the edges of the semiconductor cooling sheet 5, the cross section of the aluminum plate is C-shaped, the thickness of the aluminum plate is about 10 mm, and the upper and lower surfaces of the aluminum plate are respectively in contact with the second liquid cooling plate 4 and the radiator 6, and at the same time, a layer of heat-conducting silicone grease with a thickness of about 1 mm is respectively provided at the cold end and the hot end of the semiconductor cooling sheet 5 and the two sides of the aluminum plate, so that the semiconductor cooling sheet 5 and the heat-conducting structure are closely attached to the second liquid cooling plate 4 and the radiator 6 to enhance the heat dissipation effect. When the heating power of the control element 1 is low, the semiconductor cooling sheet 5 does not need to work, and at this time, part of the heat of the second liquid cooling plate 4 can be conducted to the radiator 6 through the heat-conducting structure and dissipated through the radiator 6, thereby improving the heat exchange efficiency of the coolant circulation system.

[0052] The temperature control component of this embodiment may also include a controller (not shown), which is used to control the start and stop of the semiconductor refrigeration plate 5, the start and stop of the outdoor fan 71 and the radiator 6, so as to realize a variety of temperature control modes for the control element 1 and reduce energy consumption while meeting its heat dissipation requirements.

[0053] The embodiment of the present application also provides an air conditioner, which includes the temperature control assembly of the above embodiment, a control element 1 and a housing (not shown), the control element 1 is arranged on a side of the first liquid cooling plate 2 away from the heat insulation plate 3, and ventilation holes are arranged at the housing corresponding to the semiconductor cooling plate 5. The heat emitted by the radiator 6 can be discharged to the outside through the ventilation holes.

[0054] The control element 1 of this embodiment is arranged at the top of the temperature control assembly. The four corners of the control element 1 are detachably connected to the first liquid cooling plate 2 by bolts and other connectors. A detection device such as a temperature sensor can also be arranged above the control element 1 to detect the surface temperature of the control element 1. The temperature sensor is electrically connected to the controller. The second liquid cooling plate 4 and the semiconductor cooling plate 5 are fixed by bolts and other connectors. At the same time, thermal conductive silicone grease is filled between the two to enhance the thermal conductivity and improve the thermal conductivity efficiency.

[0055] The temperature control component of this embodiment is designed with a flow channel structure of a reciprocating flow trajectory in the two liquid cooling plates, and connected by a pipe in the middle position of the liquid cooling plate. The double-layer structure of the liquid cooling plate effectively solves the problem of uneven temperature distribution on the contact surface of the liquid cooling plate. For the liquid cooling plate with a single-layer flow channel, the temperature is usually lower at the inlet of the coolant (coolant) and higher at the outlet of the coolant. The overall surface temperature gradually increases with the extension of the flow trajectory. Therefore, the liquid at the outlet of the coolant is discharged into the second liquid cooling plate 4, so that the liquid temperature in the second liquid cooling plate 4 is relatively uniform. At this time, the temperature on the surface of the second liquid cooling plate 4 is also relatively uniform. In order to isolate the heat conduction between the second liquid cooling plate 4 and the first liquid cooling plate 2, an insulation plate 3 is used between the two layers of plates to prevent the heat of the second liquid cooling plate 4 from being conducted to the first liquid cooling plate 2. In this case, the temperature of the surface of the second liquid cooling plate 4 is reduced to below the ambient temperature by TEC (semiconductor cooling plate 5), thereby achieving the purpose of cooling the coolant. The other side of the TEC is attached to the heat sink 6, and ventilation holes are provided on the inverter housing to dissipate heat from the TEC through the heat dissipation fins.

[0056] The embodiment of the present application also provides a control method for the above-mentioned air conditioner.

[0057] Specifically, the control method of this embodiment includes the following steps:

[0058] Real-time detection of the heating power and surface temperature of the control element 1; and setting a first preset value and a second preset value according to the heating power requirement, wherein the second preset value is greater than the first preset value, the first preset value may be, for example, 500W, and the second preset value may be, for example, 1000W;

[0059] When the heating power of the control element 1 is not higher than the first preset value, the cooling medium is controlled to circulate, the outdoor fan 71 is controlled to be turned on, and the semiconductor refrigeration sheet 5 is controlled to be turned off;

[0060] When the heating power of the control element 1 is higher than the first preset value but not higher than the second preset value, the cooling medium is controlled to circulate, the outdoor fan 71 is controlled to be turned off, and the semiconductor refrigeration plate 5 is controlled to be turned on;

[0061] When the heating power of the control element 1 is higher than the second preset value or the temperature of the surface of the control element 1 is higher than the preset temperature, the circulation of the refrigerant is controlled, and the preset temperature may be, for example, 90°C; at the same time, the semiconductor refrigeration plate 5 and the outdoor fan 71 are controlled to turn on.

[0062] Specifically, when the control element 1 is working, the heating power and the surface temperature of the control element 1 are detected in real time by the detection device.

[0063] When the detected heating power of the control element 1 is not higher than the first preset value, it means that the heat dissipation demand of the control element 1 is low. At this time, the controller can be used to control the circulating water pump 8 and the outdoor fan 71 to turn on, control the semiconductor refrigeration plate 5 and the radiator fan 61 to turn off, provide the circulation power of the coolant through the circulating water pump 8, and dissipate the heat of the coolant through the outdoor heat exchanger 7 and the outdoor fan 71. At this time, the coolant enters the first liquid cold plate 2 from the liquid inlet of the first flow channel 21, flows back and forth in the first liquid cold plate 2, and the temperature rises after absorbing the heat of the control element 1. The coolant flows out from the liquid outlet of the first flow channel 21, and a coolant with a relatively uniform temperature is obtained. The coolant with a relatively uniform temperature enters the second liquid cold plate 4 through the liquid inlet of the second flow channel 41, and after flowing back and forth in the second flow channel 41, a coolant with a more uniform temperature is formed and flows out of the second liquid cold plate 4. The refrigerant enters the outdoor heat exchanger 7, and after forced convection of the outdoor fan 71 to exchange heat with the outdoor air, the temperature is reduced, and it flows back to the first liquid cooling plate 2 again, completing a cycle. When the refrigerant flows in the second liquid cooling plate 4, a small part of the heat is conducted to the radiator 6 through the heat conduction structure and then dissipated.

[0064] When the heating power of the control element 1 is higher than the first preset value, but not higher than the second preset value, it means that the heat dissipation demand of the control element 1 is relatively high, and the heat dissipation by the outdoor fan 71 alone can no longer meet its heat dissipation demand. At this time, the controller controls the outdoor fan 71 to turn off, and controls the circulating water pump 8, the semiconductor refrigeration plate 5 and the radiator fan 61 to turn on. At this time, the circulation mode of the coolant is the same as that when the heating power of the control element 1 is not higher than the first preset value, and will not be repeated. However, at this time, since the outdoor fan 71 is turned off, the heat dissipated by the coolant through the outdoor heat exchanger 7 is relatively limited. The coolant in the second liquid cold plate 4 is mainly cooled by heat exchange with the semiconductor refrigeration plate 5, and the heat of the semiconductor refrigeration plate 5 is dissipated through the radiator 6.

[0065] When the heating power of the control element 1 is higher than the second preset value or the temperature on the surface of the control element 1 is higher than the preset temperature, it means that the heat dissipation demand of the control element 1 is very high at this time. At this time, it is necessary to further improve the heat exchange efficiency of the temperature control component. The controller controls the outdoor fan 71, the circulating water pump 8, the semiconductor refrigeration plate 5 and the radiator fan 61 to all be turned on, and cooling is achieved through the outdoor heat exchanger 7 and the radiator 6.

[0066] The temperature control component, air conditioner and control method thereof of the embodiment of the present application can make the temperature of the coolant more uniform by respectively setting reciprocating flow channels in the first liquid cooling plate and the second liquid cooling plate, thereby improving the heat exchange efficiency of the temperature control component. The heat exchange efficiency is improved by combining the air cooling of the coolant circulation system and the active cooling of the semiconductor refrigeration plate. At the same time, the temperature of the control element can be controlled by different heat dissipation modes according to the different temperature conditions of the control element, which effectively utilizes natural resources and reduces energy consumption while meeting the heat dissipation requirements of the control element.

[0067] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0068] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A temperature control component, characterized in that: It includes a first liquid cooling plate, a heat insulation plate, a second liquid cooling plate and a semiconductor cooling sheet which are stacked in sequence; The first liquid cooling plate is used for heat exchange with the control element. A first flow channel is provided inside the first liquid cooling plate. The first flow channel is arranged to be reciprocated and connected from one end to the other end of the first liquid cooling plate. The liquid inlet of the second flow channel in the second liquid cooling plate is connected to the liquid outlet of the first flow channel; the first flow channel and the second flow channel are used for circulating the coolant; The cold end of the semiconductor refrigeration plate is arranged close to the second liquid cooling plate.

2. The temperature control assembly according to claim 1, characterized in that: The second flow channel is arranged to be reciprocatingly connected from one end to the other end of the second liquid cooling plate.

3. The temperature control assembly according to claim 2, characterized in that: The first flow channel is arranged in a spiral from the edge to the center of the first liquid cooling plate, and the liquid inlet of the first flow channel is located at the edge of the first liquid cooling plate; The second flow channel is arranged in a spiral from the center to the edge of the second liquid cooling plate, and the liquid outlet of the second flow channel is located at the edge of the second liquid cooling plate.

4. The temperature control assembly according to claim 1, characterized in that: It also includes an outdoor heat exchanger, an outdoor fan and a circulating water pump. The first liquid cooling plate, the second liquid cooling plate, the circulating water pump and the outdoor heat exchanger are cyclically connected in sequence; the outdoor fan is used to increase the air circulation speed at the outdoor heat exchanger.

5. The temperature control assembly according to claim 4, characterized in that: The outdoor heat exchanger includes a first heat exchange coil assembly and a second heat exchange coil assembly. One end of the first heat exchange coil assembly and the second heat exchange coil assembly are fixedly connected, and the other ends are far away from each other to form a V-shaped structure. The outdoor fan is arranged near one end of the first heat exchange coil assembly and the second heat exchange coil assembly far away from each other.

6. The temperature control assembly according to claim 1, characterized in that: It also includes a radiator and a radiator fan. The radiator is connected to the hot end of the semiconductor refrigeration plate, and the radiator fan is used to increase the air circulation speed at the radiator.

7. The temperature control assembly according to claim 6, characterized in that: The semiconductor refrigeration plate is provided with a heat-conducting structure, and two ends of the heat-conducting structure are respectively connected to the second liquid cooling plate and the radiator.

8. The temperature control assembly according to claim 7, characterized in that: It also includes a controller, which is used to control the start and stop of the semiconductor refrigeration plate.

9. An air conditioner, characterized in that: It comprises the temperature control component as described in any one of claims 1 to 8, and also comprises the control element and the shell, the control element is arranged on the side of the first liquid cooling plate away from the insulation plate, and the shell is provided with ventilation holes at the corresponding positions of the semiconductor refrigeration plate.

10. A control method, characterized in that: For the air conditioner according to claim 9, the air conditioner further comprises an outdoor heat exchanger and an outdoor fan provided at the outdoor heat exchanger, the control method comprises the following steps: Real-time detection of the heating power and surface temperature of the control element; When the heating power of the control element is not higher than a first preset value, the cooling medium is controlled to circulate, the outdoor fan is controlled to be turned on, and the semiconductor refrigeration plate is controlled to be turned off; When the heating power of the control element is higher than a first preset value but not higher than a second preset value, the cooling medium is controlled to circulate, the outdoor fan is controlled to be turned off, and the semiconductor refrigeration plate is controlled to be turned on; When the heating power of the control element is higher than a second preset value or the temperature of the surface of the control element is higher than a preset temperature, the circulation of the coolant is controlled, and at the same time, the semiconductor refrigeration plate and the outdoor fan are controlled to be turned on.

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