Temperature control assembly, air conditioner and control method thereof

Abstract

The application provides a temperature control assembly, an air conditioner and a control method thereof. The temperature control assembly comprises a first liquid cooling plate, a heat insulation plate, a second liquid cooling plate and a semiconductor refrigeration sheet arranged in sequence. The first liquid cooling plate is used for heat exchange with a control element. A first flow channel is arranged inside the first liquid cooling plate and reciprocally and communicatively arranged from one end of the first liquid cooling plate to the other end. A liquid inlet of a second flow channel in the second liquid cooling plate is connected with a liquid outlet of the first flow channel. The first flow channel and the second flow channel are used for circulating a coolant. A cold end of the semiconductor refrigeration sheet is arranged close to the second liquid cooling plate. The temperature control assembly, the air conditioner and the control method thereof provided by the application can effectively improve the heat exchange efficiency of the temperature control assembly and reduce the energy consumption through different temperature control modes according to the heating working condition.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of temperature control equipment, in particular to a temperature control assembly, an air conditioner and a control method thereof. BACKGROUND

[0002] With the vigorous development of electronic technology, power electronic devices are developing towards high power, high density and miniaturization. The heat dissipation effect of electronic devices has become a bottleneck restricting their development.

[0003] Common electronic power device cooling methods include air cooling, liquid cooling, semiconductor cooling and heat pipe cooling. Traditional single air cooling and liquid cooling have been difficult to meet the heat dissipation needs of existing equipment. Multi-mode combined cooling systems have been applied in various heat dissipation scenarios.

[0004] In the process of implementing the present application, the inventors found that the existing cooling system has at least the following problems: the heat exchange efficiency of the existing cooling system is low, which leads to poor heat dissipation effect, and even cannot completely meet the heat dissipation needs of high heat power devices. At the same time, the heat dissipation method is single, and there is no targeted heat dissipation control according to different heat dissipation needs of devices, which leads to high energy consumption of the cooling system, and is not conducive to cost reduction and efficiency improvement. SUMMARY

[0005] Therefore, the present application provides a temperature control assembly, an air conditioner and a control method thereof to improve the low heat exchange efficiency and high energy consumption caused by the single temperature control method in the prior art.

[0006] To achieve the above-mentioned purpose, the technical scheme of the embodiments of the present application is as follows:

[0007] In a first aspect, the present application provides a temperature control assembly, comprising a first liquid cooling plate, a heat insulation plate, a second liquid cooling plate and a semiconductor refrigeration sheet arranged in sequence.

[0008] The first liquid cooling plate is used for heat exchange with a control element. The first liquid cooling plate is internally provided with a first flow channel, which is arranged in a reciprocating communication from one end to the other end of the first liquid cooling plate.

[0009] The inlet of the second flow channel in the second liquid cooling plate is connected with the outlet of the first flow channel. The first flow channel and the second flow channel are used for circulating coolant.

[0010] The cold end of the semiconductor refrigeration sheet is arranged close to the second liquid cooling plate.

[0011] In one of the embodiments, the second flow channel is arranged in a reciprocating communication from one end to the other end of the second liquid cooling plate.

[0012] In one of the embodiments, the first flow channel is arranged spirally from the edge to the center of the first liquid cooling plate, and the liquid inlet of the first flow channel is located at the edge of the first liquid cooling plate.

[0013] The second flow channel is arranged spirally from the center to the edge of the second liquid cooling plate, and the liquid outlet of the second flow channel is located at the edge of the second liquid cooling plate.

[0014] In one of the embodiments, the temperature control assembly further comprises an outdoor heat exchanger, an outdoor fan and a circulating water pump, the first liquid cooling plate, the second liquid cooling plate, the circulating water pump and the outdoor heat exchanger are sequentially and circularly communicated; the outdoor fan is used to increase the air flow speed at the outdoor heat exchanger.

[0015] In one of the embodiments, the outdoor heat exchanger comprises a first heat exchange coil assembly and a second heat exchange coil assembly, one end of the first heat exchange coil assembly and the second heat exchange coil assembly is fixedly connected, and the other end thereof is away from each other to form a V-shaped structure, and the outdoor fan is arranged near the end of the first heat exchange coil and the second heat exchange coil away from each other.

[0016] In one of the embodiments, the temperature control assembly further comprises a radiator and a radiator fan, the radiator is connected to the hot end of the semiconductor refrigeration sheet, and the radiator fan is used to increase the air flow speed at the radiator.

[0017] In one of the embodiments, a heat conduction structure is arranged on the semiconductor refrigeration sheet, and two ends of the heat conduction structure are connected with the second liquid cooling plate and the radiator respectively.

[0018] In one of the embodiments, the temperature control assembly further comprises a controller, and the controller is used to control the start and stop of the semiconductor refrigeration sheet.

[0019] In the second aspect, the embodiments of the present application provide an air conditioner, which comprises the temperature control assembly as described above, and further comprises a control element and a shell, the control element is arranged on the side of the first liquid cooling plate away from the heat insulation plate, and the shell is provided with a ventilation hole corresponding to the semiconductor refrigeration sheet.

[0020] In the third aspect, the embodiments of the present application provide a control method, which is used for the air conditioner as described above, and the air conditioner further comprises an outdoor heat exchanger and an outdoor fan arranged at the outdoor heat exchanger, and the control method comprises the following steps:

[0021] Real-time detection of the heating power and the surface temperature of the control element;

[0022] When the heating power of the control element is not higher than a first preset value, the circulation of the carrier refrigerant is controlled, the outdoor fan is controlled to be turned on, and the semiconductor refrigeration sheet is controlled to be turned off.

[0023] when the heat generation power of the control element is higher than the first preset value but not higher than the second preset value, controlling the circulation of the secondary refrigerant, controlling the outdoor fan to be turned off, and controlling the semiconductor refrigeration sheet to be turned on;

[0024] when the heat generation power of the control element is higher than the second preset value or the temperature of the surface of the control element is higher than the preset temperature, controlling the circulation of the secondary refrigerant, and controlling the semiconductor refrigeration sheet and the outdoor fan to be turned on.

[0025] The temperature control assembly provided by the application has at least the following beneficial effects: the temperature control assembly provided by the application comprises a first liquid cooling plate, which is used for directly contacting and exchanging heat with a control element to be controlled in temperature. The first liquid cooling plate is provided with a first flow channel that reciprocally communicates from one end of the first liquid cooling plate to the other end. This design can effectively improve the non-uniformity of the temperature rise of the secondary refrigerant. The secondary refrigerant reciprocally flows in the first flow channel, which can effectively reduce the temperature difference between the inlet and the outlet of the secondary refrigerant, so that the overall temperature of the secondary refrigerant is more uniform, thereby improving the heat exchange efficiency of the secondary refrigerant. After the secondary refrigerant is uniformly heated in the first flow channel, the secondary refrigerant enters a second liquid cooling plate for further mixing and uniform heating. The second liquid cooling plate is insulated from the first liquid cooling plate by a heat insulation plate. When the uniformly mixed secondary refrigerant exchanges heat with the semiconductor refrigeration sheet, the heat exchange efficiency of the semiconductor refrigeration sheet can be effectively improved, and the problems of low heat exchange efficiency and poor heat exchange effect caused by excessively large temperature difference of the secondary refrigerant can be reduced. The temperature control assembly provided by the application can also control the secondary refrigerant and the semiconductor refrigeration sheet according to different heat dissipation requirements of the control element, so as to realize various different temperature control modes such as air cooling, liquid cooling, mixed air cooling and liquid cooling, and the like. In the case of meeting the heat dissipation requirements of the control element, the temperature control assembly can reduce the consumption of energy as much as possible. The air conditioner and the control method thereof provided by the application comprise the above-mentioned temperature control assembly, and therefore, also have the above-mentioned beneficial effects. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 FIG. 1 is a structural schematic diagram of a temperature control assembly according to an embodiment of the application.

[0027] Figure 2 FIG. 2 is a trajectory schematic diagram of a first flow channel or a second flow channel according to an embodiment of the application.

[0028] Figure 3 FIG. 3 is a trajectory schematic diagram of a first flow channel or a second flow channel according to another embodiment of the application.

[0029] Figure 4 FIG. 4 is a structural schematic diagram of a temperature control assembly according to an embodiment of the application (the arrow direction is the circulation direction of the secondary refrigerant).

[0030] Figure 5 FIG. 5 is an assembly structural schematic diagram of components such as an outdoor heat exchanger, a circulating water pump and an outdoor fan according to an embodiment of the application.

[0031] The meanings of the various reference signs in the drawings are as follows:

[0032] 1, control element; 2, first liquid cooling plate; 21, first flow channel; 3, heat insulation plate; 4, second liquid cooling plate; 41, second flow channel; 5, semiconductor refrigeration sheet; 6, radiator; 61, radiator fan; 7, outdoor heat exchanger; 71, outdoor fan; 72, first heat exchange coil assembly; 73, second heat exchange coil assembly; 74, air outlet cavity; 75, air inlet cavity; 8, circulating water pump. DETAILED DESCRIPTION

[0033] The technical solutions of the present application are further described in detail below in combination with the drawings and specific embodiments.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the implementations of the application. As used in this description, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0035] In the description of the present application, it should be understood that the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In the description of the present application, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0036] In the description of the present application, it should be noted that unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium; it can be the communication between the two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0037] Please refer to Figure 1 The temperature control assembly of the embodiment of the present application comprises a first liquid cooling plate 2, a heat insulation plate 3, a second liquid cooling plate 4 and a semiconductor refrigeration sheet 5 arranged in sequence.

[0038] The first liquid cooling plate 2 is used for heat exchange with the control element 1, and the first liquid cooling plate 2 is internally provided with a first flow channel 21 which is arranged in a reciprocating communication from one end to the other end of the first liquid cooling plate 2.

[0039] The liquid inlet of the second flow channel 41 in the second liquid cooling plate 4 is connected with the liquid outlet of the first flow channel 21, and the first flow channel 21 and the second flow channel 41 are used for circulating the coolant, and specifically, the coolant can be a 50% concentration ethylene glycol solution.

[0040] The cold end of the semiconductor refrigeration sheet 5 is arranged close to the second liquid cooling plate 4.

[0041] Specifically, in the embodiment, the control element 1 can be an IGBT (Insulated Gate Bipolar Transistor) of a frequency converter, and of course, in other embodiments, the control element 1 can also be other high-power elements with heat dissipation requirements.

[0042] Since the IGBT has very high heat dissipation power in some application scenarios, the highest heat dissipation power can exceed 1000W. In the case of an ambient temperature of 65℃, in order to enable the IGBT to work normally, the maximum temperature of the IGBT needs to be controlled to be lower than 95℃, that is, the temperature rise is less than 30℃. For a single liquid cooling system, due to the limited internal space of the frequency converter, the size of the designed radiator fins is limited, and in order to increase the convection and improve the heat exchange efficiency, the air volume needs to be increased, and under the size limitation, the air volume of the fan is also limited. Through the CFD (Computational Fluid Dynamics) simulation method, it is calculated that under the cooling condition of the single liquid cooling system, the minimum temperature of the IGBT also reaches a high temperature of 120℃. Therefore, for the single liquid cooling system, it is impossible to meet the heat dissipation requirements of the IGBT in all operating conditions.

[0043] The semiconductor refrigeration sheet (TEC, Thermo Electric Cooler) refers to a device for obtaining cold energy by using the thermoelectric effect of a semiconductor. A conductor is used to connect two different metals, one side of which is lowered in temperature, and the other side of which is raised in temperature. The semiconductor refrigeration sheet 5 can realize the effect of active refrigeration. In the case of high external ambient temperature, it is difficult for the liquid cooling plate to cool the temperature of the control element 1 to below the ambient temperature, which will not meet the heat dissipation requirements of the IGBT in this operating condition, and the active refrigeration effect of the TEC can make up for the deficiency of the liquid cooling plate and improve the refrigeration effect in high-temperature environments.

[0044] In the embodiment, the second flow channel 41 of the second liquid cooling plate 4 is not provided with a specific flow path, and in some embodiments, the second flow channel 41 can also be arranged in a similar flow path as the first flow channel 21 to further enhance the temperature equalization effect of the coolant.

[0045] In this embodiment, the first flow channel 21 of the first liquid cooling plate 2 is arranged in a spiral from the edge to the center of the first liquid cooling plate 2, and the liquid inlet of the first flow channel 21 is located at the edge of the first liquid cooling plate 2. The second flow channel 41 is arranged in a spiral from the center to the edge of the second liquid cooling plate 4, and the liquid outlet of the second flow channel 41 is located at the edge of the second liquid cooling plate 4. The spiral of the flow trajectory here can be a non-standard spiral or a standard spiral. For example, it can be a square spiral (as shown in Figure 2 ), a snail line, etc. In other embodiments, the flow trajectory can also be a snake line (as shown in Figure 3 ), as long as the secondary refrigerant can flow back and forth between one end and the other end of the liquid cooling plate, and the shape of the specific flow trajectory is not limited.

[0046] The flow channel design of back-and-forth flow makes the temperature of the secondary refrigerant after heat exchange more uniform. First, the secondary refrigerant enters the first flow channel 21, exchanges heat with the control element 1, and the temperature rises. After back-and-forth flow in the first flow channel 21, the secondary refrigerant becomes secondary refrigerant with more uniform temperature, and flows into the second flow channel 41. Since the heat insulation plate 3 is arranged between the first liquid cooling plate 2 and the second liquid cooling plate 4, the secondary refrigerant in the second flow channel 41 does not exchange heat with the secondary refrigerant in the first flow channel 21, and the temperature non-uniformity phenomenon caused thereby can be avoided. After back-and-forth flow in the second flow channel 41, the secondary refrigerant becomes secondary refrigerant with more uniform temperature, and the heat exchange efficiency of the secondary refrigerant is improved. At the same time, when the secondary refrigerant exchanges heat with the semiconductor refrigeration sheet 5, the heat exchange efficiency of the semiconductor refrigeration sheet 5 can also be improved.

[0047] In order to reduce the flow resistance of the flow channel, a smooth transition can be adopted at the corners of the first flow channel 21 and the second flow channel 41, such as rounding the corners.

[0048] As shown in Figure 4 and Figure 5 , specifically, the entire secondary refrigerant circulation system further includes an outdoor heat exchanger 7, an outdoor fan 71, and a circulating water pump 8. The first liquid cooling plate 2, the second liquid cooling plate 4, the circulating water pump 8, and the outdoor heat exchanger 7 are sequentially and circularly communicated. The outdoor fan 71 is used to increase the air circulation speed at the outdoor heat exchanger 7. The liquid outlet of the circulating water pump 8 is connected with the liquid inlet of the outdoor heat exchanger 7, and the liquid inlet of the circulating water pump 8 is communicated with the liquid outlet of the second flow channel 41. The outdoor fan 71 of this embodiment is an axial fan. After the secondary refrigerant exchanges heat with the control element 1 and the temperature rises, the secondary refrigerant flows into the outdoor heat exchanger 7, exchanges heat with outdoor air through forced convection of the outdoor fan 71, and the temperature decreases.

[0049] As shown in Figure 5As shown, the outdoor heat exchanger 7 of the present embodiment comprises a first heat exchange coil assembly 72 and a second heat exchange coil assembly 73, one end of the first heat exchange coil assembly 72 and the second heat exchange coil assembly 73 are fixedly connected, and the other end is away from each other, forming a V-shaped structure, and the outdoor fan 71 is arranged near the end away from each other of the first heat exchange coil assembly 72 and the second heat exchange coil assembly 73. Specifically, in the present embodiment, the bottom end of the first heat exchange coil assembly 72 and the second heat exchange coil assembly 73 is fixedly connected, and the top end is away from each other by a certain distance, forming a positive V-shaped structure. The space between the two heat exchange coil assemblies (the first heat exchange coil assembly 72 and the second heat exchange coil assembly 73) forms an air outlet cavity 74, and the space on both sides of the two heat exchange coil assemblies forms an air inlet cavity 75, and the outdoor fan 71 is arranged at the top of the air outlet cavity 74, and the circulating water pump 8 is arranged below the two heat exchange coil assemblies. The V-shaped inclined arrangement of the two heat exchange coil assemblies can effectively increase the heat exchange area of the heat exchange coil and improve the heat exchange efficiency. During heat exchange, the gas enters the air outlet cavity 74 in the middle from the air inlet cavity 75 on both sides of the two heat exchange coil assemblies, and is extracted to the outside by the outdoor fan 71.

[0050] As shown in Figure 1 and Figure 4 The temperature control assembly of the present embodiment also comprises a radiator 6 and a radiator fan 61, the radiator 6 is connected to the hot end of the semiconductor refrigeration piece 5, and the radiator fan 61 is used to increase the air flow speed at the radiator 6. The radiator fan 61 can also be an axial flow fan. The radiator 6 is provided with a plurality of heat dissipation fins, which are arranged at the end of the radiator 6 away from the semiconductor refrigeration piece 5. The heat at the hot end of the semiconductor refrigeration piece 5 is dissipated by heat exchange between the radiator 6 and the air after forced convection by the radiator fan 61.

[0051] In some embodiments, a heat conduction structure (not shown) can also be provided on the semiconductor refrigeration piece 5, and the two ends of the heat conduction structure are respectively connected with the second liquid cooling plate 4 and the radiator 6. The heat conduction structure can be made of aluminum alloy material, for example, an aluminum plate can be inlaid at the four peripheral edges of the semiconductor refrigeration piece 5, the cross section of the aluminum plate is C-shaped, the thickness of the aluminum plate is about 10mm, and the upper and lower surfaces of the aluminum plate are respectively in contact with the second liquid cooling plate 4 and the radiator 6. At the same time, a layer of heat-conducting silicone grease with a thickness of about 1mm is arranged on the cold end and the hot end of the semiconductor refrigeration piece 5 and on both sides of the aluminum plate, so that the semiconductor refrigeration piece 5 and the heat conduction structure are closely attached to the second liquid cooling plate 4 and the radiator 6, thereby enhancing the heat dissipation effect. When the heat dissipation power of the control element 1 is low, the semiconductor refrigeration piece 5 does not need to work, at this time part of the heat of the second liquid cooling plate 4 can be conducted to the radiator 6 through the heat conduction structure, and then dissipated through the radiator 6, thereby improving the heat exchange efficiency of the coolant circulation system.

[0052] The temperature control assembly of the embodiment can also include a controller (not shown) for controlling the start and stop of the semiconductor refrigeration sheet 5, the outdoor fan 71 and the radiator 6, so as to realize various temperature control modes of the control element 1 and reduce energy consumption under the condition of meeting the heat dissipation demand of the control element 1.

[0053] The embodiment of the application also provides an air conditioner, which comprises the temperature control assembly of the above embodiment, a control element 1 and a shell (not shown). The control element 1 is arranged on the side of the first liquid cooling plate 2 away from the heat insulation plate 3, and the shell is provided with a ventilation hole corresponding to the semiconductor refrigeration sheet 5. The heat dissipated by the radiator 6 can be discharged to the outside through the ventilation hole.

[0054] The control element 1 of the embodiment is arranged at the top end of the temperature control assembly, and is detachably connected to the first liquid cooling plate 2 through bolts or other connecting elements at the four corners of the control element 1. A temperature sensor or other detection device can also be arranged above the control element 1 to detect the surface temperature of the control element 1. The temperature sensor is electrically connected to the controller. The second liquid cooling plate 4 and the semiconductor refrigeration sheet 5 are fixed by bolts or other connecting elements, and at the same time, heat-conducting silicone grease is filled between the two to enhance the heat conduction effect and improve the heat conduction efficiency.

[0055] The temperature control assembly of the embodiment is designed with reciprocating flow tracks in the two liquid cooling plates, and the two liquid cooling plates are connected by a pipeline at the middle position. The double-layer structure of the liquid cooling plates effectively solves the problem of uneven temperature distribution on the contact surface of the liquid cooling plates. For the liquid cooling plate with a single-layer flow channel, the temperature at the inlet of the cooling liquid (refrigerant) is relatively low, the temperature at the outlet of the cooling liquid is relatively high, and the overall surface temperature gradually increases along the flow track. Therefore, the liquid at the outlet of the cooling liquid is discharged into the second liquid cooling plate 4, so that the temperature of the liquid in the second liquid cooling plate 4 is relatively uniform, and the temperature of the surface of the second liquid cooling plate 4 is also relatively uniform. In order to prevent heat conduction from the second liquid cooling plate 4 to the first liquid cooling plate 2, a heat insulation plate 3 is arranged between the two layers of plates to prevent heat conduction from the second liquid cooling plate 4 to the first liquid cooling plate 2. In this case, the temperature of the surface of the second liquid cooling plate 4 is reduced to below the ambient temperature by the TEC (semiconductor refrigeration sheet 5), so as to achieve the purpose of cooling the cooling liquid. The other side of the TEC is attached to the radiator 6, and a ventilation hole is arranged on the shell of the frequency converter, so as to dissipate heat from the TEC through the heat dissipation fins.

[0056] The embodiment of the application also provides a control method for the air conditioner.

[0057] Specifically, the control method of the embodiment comprises the following steps:

[0058] Real-time detect the heat power and surface temperature of the control element 1; and set the first preset value and the second preset value according to the heat power, the second preset value is greater than the first preset value, for example, the first preset value can be 500W, and the second preset value can be 1000W;

[0059] When the heat power of the control element 1 is not higher than the first preset value, control the circulation of the carrier refrigerant, control the outdoor fan 71 to open, and control the semiconductor refrigeration piece 5 to close;

[0060] When the heat power of the control element 1 is higher than the first preset value but not higher than the second preset value, control the circulation of the carrier refrigerant, control the outdoor fan 71 to close, and control the semiconductor refrigeration piece 5 to open;

[0061] When the heat power of the control element 1 is higher than the second preset value or the surface temperature of the control element 1 is higher than the preset temperature, control the circulation of the carrier refrigerant, for example, the preset temperature can be 90℃; at the same time, control the semiconductor refrigeration piece 5 and the outdoor fan 71 to open.

[0062] Specifically, when the control element 1 works, the heat power and the surface temperature of the control element 1 are detected in real time by the detection device.

[0063] When the detected heat power of the control element 1 is not higher than the first preset value, at this time, it indicates that the heat dissipation demand of the control element 1 is low, at this time, the circulating water pump 8 and the outdoor fan 71 are opened, and the semiconductor refrigeration piece 5 and the radiator fan 61 are closed by the controller, the circulating power of the carrier refrigerant is provided by the circulating water pump 8, and the carrier refrigerant is cooled by the outdoor heat exchanger 7 and the outdoor fan 71. At this time, the carrier refrigerant enters the first liquid cooling plate 2 from the liquid inlet of the first flow channel 21, flows back in the first liquid cooling plate 2, the temperature of the carrier refrigerant rises after absorbing the heat of the control element 1, and the carrier refrigerant flows out from the liquid outlet of the first flow channel 21, and the carrier refrigerant with more uniform temperature is obtained. The carrier refrigerant with more uniform temperature enters the second liquid cooling plate 4 from the liquid inlet of the second flow channel 41, flows back in the second flow channel 41, and then flows out of the second liquid cooling plate 4 after forming the carrier refrigerant with more uniform temperature. The carrier refrigerant enters the outdoor heat exchanger 7, exchanges heat with outdoor air by forced convection of the outdoor fan 71, and then flows back to the first liquid cooling plate 2 to complete a cycle. When the carrier refrigerant flows in the second liquid cooling plate 4, a small part of heat is conducted to the radiator 6 through the heat conduction structure and then dissipated.

[0064] When the heat generation power of the control element 1 is higher than the first preset value but not higher than the second preset value, it indicates that the heat dissipation requirement of the control element 1 is relatively high at this time, and the heat dissipation through the outdoor fan 71 alone cannot meet the heat dissipation requirement. At this time, the controller controls the outdoor fan 71 to be closed, and controls the circulating water pump 8, the semiconductor refrigeration fin 5 and the radiator fan 61 to be opened. At this time, the circulating mode of the cooling medium is the same as the mode when the heat generation power of the control element 1 is not higher than the first preset value, which will not be repeated here. However, at this time, since the outdoor fan 71 is closed, the heat dissipation of the cooling medium through the outdoor heat exchanger 7 is relatively limited. The cooling medium in the second liquid cooling plate 4 is mainly cooled by heat exchange with the semiconductor refrigeration fin 5, and the heat of the semiconductor refrigeration fin 5 is dissipated through the radiator 6.

[0065] When the heat generation power of the control element 1 is higher than the second preset value or the temperature of the surface of the control element 1 is higher than the preset temperature, it indicates that the heat dissipation requirement of the control element 1 is very high at this time, and the heat exchange efficiency of the temperature control assembly needs to be further improved. The controller controls the outdoor fan 71, the circulating water pump 8, the semiconductor refrigeration fin 5 and the radiator fan 61 to be all opened, and the cooling is realized through the outdoor heat exchanger 7 and the radiator 6.

[0066] The temperature control assembly, the air conditioner and the control method thereof according to the embodiments of the present application can make the temperature of the cooling medium more uniform by respectively arranging the reciprocating flow channels in the first liquid cooling plate and the second liquid cooling plate, thereby improving the heat exchange efficiency of the temperature control assembly. The heat exchange efficiency is improved by the combination of the air cooling heat dissipation of the cooling medium circulating system and the active refrigeration of the semiconductor refrigeration fin. At the same time, the control element can be controlled by different heat dissipation modes according to different temperature conditions, which effectively utilizes natural resources, meets the heat dissipation requirement of the control element, and reduces the consumption of energy.

[0067] It should be noted that in this document, the terms "comprising", "including", or any other variant thereof are intended to cover non-exclusive inclusions, so that processes, methods, articles or devices including a series of elements not only include those elements, but also include other elements not explicitly listed, or inherent to such processes, methods, articles or devices. Without more limitations, the element defined by the statement "comprising a" does not exclude the presence of another identical element in the process, method, article or device including the element.

[0068] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A control method characterized by, The application relates to a control method for controlling an air conditioner, wherein the air conditioner comprises a temperature control assembly, a control element, a shell, an outdoor heat exchanger and an outdoor fan arranged at the outdoor heat exchanger. The temperature control assembly comprises a first liquid cooling plate, a heat insulation plate, a second liquid cooling plate and a semiconductor refrigeration sheet arranged in sequence. The first liquid cooling plate is used for heat exchange with the control element, and a first flow channel is arranged inside the first liquid cooling plate and reciprocally communicated from one end to the other end of the first liquid cooling plate. A liquid inlet of a second flow channel in the second liquid cooling plate is connected with a liquid outlet of the first flow channel, and the first flow channel and the second flow channel are used for circulating a cooling medium. A cold end of the semiconductor refrigeration sheet is arranged close to the second liquid cooling plate. The control element is arranged on a side of the first liquid cooling plate away from the heat insulation plate, and a ventilation hole is arranged at a position corresponding to the semiconductor refrigeration sheet of the shell. The control method comprises the following steps: Real-time detection of the heating power and surface temperature of the control element; When the heating power of the control element is not higher than a first preset value, the cooling medium is controlled to circulate, the outdoor fan is controlled to be turned on, and the semiconductor refrigeration sheet is controlled to be turned off; When the heating power of the control element is higher than the first preset value but not higher than a second preset value, the cooling medium is controlled to circulate, the outdoor fan is controlled to be turned off, and the semiconductor refrigeration sheet is controlled to be turned on; When the heating power of the control element is higher than the second preset value or the surface temperature of the control element is higher than a preset temperature, the cooling medium is controlled to circulate, and the semiconductor refrigeration sheet and the outdoor fan are controlled to be turned on.

2. An air conditioner characterized by comprising: The control method is used for controlling the air conditioner.

3. The air conditioner of claim 2, wherein The second flow channel is reciprocally communicated from one end to the other end of the second liquid cooling plate.

4. The air conditioner of claim 3, wherein The first flow channel is arranged in a spiral mode from the edge to the center of the first liquid cooling plate, and a liquid inlet of the first flow channel is located at the edge of the first liquid cooling plate. The second flow channel is arranged in a spiral mode from the center to the edge of the second liquid cooling plate, and a liquid outlet of the second flow channel is located at the edge of the second liquid cooling plate.

5. The air conditioner according to claim 2, wherein Further comprising an outdoor heat exchanger, an outdoor fan and a circulating water pump, the first liquid cooling plate, the second liquid cooling plate, the circulating water pump, the outdoor heat exchanger are sequentially and circularly communicated, and the outdoor fan is used for increasing the air circulation speed at the outdoor heat exchanger.

6. The air conditioner of claim 5, wherein The outdoor heat exchanger comprises a first heat exchange coil assembly and a second heat exchange coil assembly, one end of the first heat exchange coil assembly and the second heat exchange coil assembly is fixedly connected, and the other end is away from each other to form a V-shaped structure, and the outdoor fan is arranged near one end of the first heat exchange coil and the second heat exchange coil away from each other.

7. The air conditioner according to claim 2, wherein Further comprising a radiator and a radiator fan, the radiator is connected to the hot end of the semiconductor refrigeration sheet, and the radiator fan is used for increasing the air circulation speed at the radiator.

8. The air conditioner of claim 7, wherein A heat conduction structure is arranged on the semiconductor refrigeration sheet, and two ends of the heat conduction structure are connected with the second liquid cooling plate and the radiator respectively.

9. The air conditioner of claim 8, wherein Further comprising a controller, the controller is used for controlling the start and stop of the semiconductor refrigeration sheet.

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