Thermal management device with totally-closed structure

Abstract

The invention discloses a heat management device with a fully-closed structure, which comprises a sealed box body, a semiconductor chilling plate is assembled on the outer wall of the sealed box body, and heat dissipation fins are assembled on the outer wall of the semiconductor chilling plate; a heat collection plate is assembled on the inner wall of the sealed box body; a module converter, an image processing module, a temperature control module, a power supply module a and a power supply module b are assembled on the side wall of the heat collection plate; five rotary tables are uniformly and equidistantly assembled at the bottom end in the sealed box body, and an optical camera is assembled at the top end of each rotary table; a U-shaped seat is assembled at the upper end of the rotary table, a mounting shaft is assembled in the U-shaped seat, a bearing column is assembled at the bottom end of the optical camera, and the bearing column is mounted on the mounting shaft through a connecting structure; the heat management device with the totally-closed structure is simple in structure, easy to operate and convenient to operate, and can be used under the low-temperature condition and the high-temperature condition at the same time due to the fact that the heat management device can heat and refrigerate.

Description

Technical Field

[0001] The invention relates to the technical field of temperature control of small-size, high-power closed boxes, and in particular to a thermal management device with a fully closed structure. Background Art

[0002] The characteristics and defects of similar products in the current market (the deficiencies in other people’s prior patents can be cited) There are three ways to dissipate heat: conduction, convection and radiation. Heat conduction occurs between objects in direct contact, and heat is transferred from a high-temperature object to a low-temperature object. Convection occurs in gases and liquids, and the transfer efficiency is mainly affected by the movement speed of the fluid. Radiation does not rely on a medium and is the main way of heat transfer in a vacuum.

[0003] At present, the main heat dissipation methods for high-power closed boxes are water (including other liquids) cooling and compressor refrigeration. The water cooling method requires an external water tank and a circulation pump, which is large in size, complex in structure, high in cost and has a high failure rate. Once water (liquid) leaks, it will cause damage to other equipment and there is a certain risk.

[0004] Although compressor refrigeration has high refrigeration efficiency, the utilization rate of the cold source of compressor refrigeration is low, and there will be noise and vibration during operation, which will also cause pollution to the environment. Therefore, a fully enclosed thermal management device is needed to solve the above problems. Summary of the invention

[0005] The object of the present invention is to provide a thermal management device with a fully enclosed structure to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solution: a fully enclosed thermal management device, comprising a sealed box, the outer wall of which is equipped with a semiconductor cooling sheet, and the outer wall of which is equipped with a heat dissipation fin; The inner wall of the sealed box is equipped with a heat collecting plate, and the side wall of the heat collecting plate is equipped with a module converter, an image processing module, a temperature control module, a power module a and a power module b; Five turntables are evenly and equidistantly mounted at the inner bottom of the sealed box, and an optical camera is mounted on the top of each turntable; The upper end of the turntable is equipped with a U-shaped seat, and a mounting shaft is installed in the U-shaped seat. The bottom end of the optical camera is equipped with a bearing column, and the bearing column is installed on the mounting shaft through a connecting structure; The connection structure includes a connection part, an L-shaped groove, a groove, a limit block and a spring; The connecting part is installed on the bearing column, the L-shaped groove is opened on the connecting part, the mounting shaft is placed in the L-shaped groove, the groove is opened on the L-shaped groove, the limit block is placed in the groove, the spring is installed between the groove and the limit block, and the limit block is tightly pressed in the L-shaped groove.

[0007] Preferably, a cylinder is installed in the spring, a clamping block is installed on the cylinder, a clamping slot is provided on the groove, and the clamping block is clamped in the clamping slot.

[0008] Preferably, an annular groove is provided on the card block, and an elastic member is installed in the card groove. The number of the elastic members is not less than six, and the elastic members are distributed in the card groove in an annular shape and at equal intervals. The elastic members are clamped in the annular groove.

[0009] Preferably, a slot is provided on the L-shaped groove, and the limit block is inserted into the slot.

[0010] Preferably, the temperature control module includes a control logic interface, a control device, an actuator and a controlled object.

[0011] Preferably, both side walls of the top end of the turntable are installed with mounting structures, and the turntable is installed on the sealed box body through the mounting structures.

[0012] Preferably, the mounting structure includes a bolt body, threaded holes are provided on both sides of the top of the turntable, a threaded groove is provided on the inner wall of the sealing box body in the threaded hole, a circular groove is provided at the bottom end of the bolt body, a bolt rod is installed at the bottom end of the circular groove, and the bolt rod is screwed in the threaded hole and the threaded groove.

[0013] Preferably, a fixing ring is installed at the outer upper end of the bolt rod, the circumferential surface of the bolt rod is covered with an annular pressure plate, a spring and an annular rubber sheet, an extrusion block is installed at the upper end edge of the annular rubber sheet, and the outer wall of the prestressed bolt body is provided with an arc surface.

[0014] Preferably, the mounting structure comprises a clamping block mounted on the side wall of the turntable and a clamping groove provided on the inner wall of the sealing box, and the clamping block is clamped in the clamping groove.

[0015] Preferably, a filling layer is installed inside the card block.

[0016] Compared with the prior art, this solution designs a thermal management device with a fully enclosed structure, which has the following beneficial effects: After comprehensive consideration, this product uses semiconductor refrigeration for temperature control. Semiconductor refrigeration is also called thermoelectric refrigeration. It uses PN junctions composed of semiconductor materials to form thermocouple pairs. When working, direct current is passed through, which can be used for both heating and cooling. It has no moving parts and can be well applied in confined spaces. It has the characteristics of high reliability and no pollution.

[0017] This product has a simple structure and is easy to operate. Because it can heat and cool itself, it can be used under both low and high temperature conditions. This product is completely sealed and has a high level of protection. It can be used in severe weather such as dust, rain or snow. Because of its small size and light weight, it is easy to carry and use, and can be used in a variety of scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a schematic diagram of a turntable and an optical camera of the present invention; Figure 3 A schematic diagram of a U-shaped seat of the present invention; Figure 4 A cross-sectional view of a U-shaped seat of the present invention; Figure 5 It is a schematic structural diagram of part A of the present invention; Figure 6 This is a temperature control principle diagram of the temperature control module of the present invention; Figure 7 This is a schematic diagram of the installation structure of the first embodiment of the present invention; Figure 8 This is a schematic diagram of the installation structure of the second embodiment of the present invention.

[0019] In the figure: 1 heat sink, 2 semiconductor cooling plate, 3 heat collecting plate, 4 sealed box, 5 optical camera, 6 turntable, 7 module converter, 8 power module a, 9 power module b, 10 image processing module, 11 temperature control module, 12 U-shaped seat, 13 bolt body, 14 bearing column, 17 connection structure, 18 card block, 19 card slot, 20 annular groove, 21 elastic member, 22 cylinder, 23 mounting shaft, 24 mounting structure. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] See also Figures 1 to 7, which is the first technical solution provided by the present invention: a thermal management device with a fully enclosed structure, comprising a sealed box body 4, the outer wall of the sealed box body 4 is equipped with a semiconductor cooling plate 2, and the outer wall of the semiconductor cooling plate 2 is equipped with a heat dissipation fin 1; the inner wall of the sealed box body 4 is equipped with a heat collecting plate 3, and the side wall of the heat collecting plate 3 is equipped with a module converter 7, an image processing module 10, a temperature control module 11, a power module a8 and a power module b9; five turntables 6 are evenly and equidistantly installed at the bottom end of the inner part of the sealed box body 4, and the top of each turntable 6 is equipped with an optical camera 5; the upper end of the turntable 6 is equipped with a U-shaped seat 12, and the U-shaped seat 12 is equipped with a mounting shaft 23; 1 The heat sink fin is used to dissipate heat from the hot end of the semiconductor refrigeration chip. The heat dissipation performance of the semiconductor refrigeration chip is directly affected by the heat dissipation performance of the hot end. A fan can be installed at one end of the heat sink fin as needed.

[0022] 2 Semiconductor refrigeration chip is a new type of refrigeration technology, which has many advantages such as small size, light weight, and no pollution. Its structure is shown in the figure above. It is composed of P-type semiconductor and N-type semiconductor arranged in parallel. NP-type semiconductor is connected by conductor 2-2 (generally copper, aluminum and other materials with good conductivity) to form a complete circuit, which is packaged by 2-1 cold end and 2-2 hot end. The hot and cold end packages are generally made of insulating ceramics. Another notable feature of semiconductor refrigeration chip is that the direction of cold and hot ends can be changed by changing the direction of current, that is, after changing the direction of current, the original cold end is transformed into hot end, and the original hot end is transformed into cold end. Through this feature of semiconductor refrigeration chip, the sealed box can be heated or cooled according to the external environment.

[0023] 3 The heat collector is an aluminum plate (or other materials with good thermal conductivity). Because the heat source in the sealed box is dispersed and there are moving parts, it is difficult to dissipate heat. Therefore, high-power electronic devices are installed on the heat collector. The heat generated by the moving devices (camera and turntable) is transferred to the heat collector through a flexible heat-conducting cable, and the heat is concentrated and dissipated outward through the heat collector. In addition, a temperature sensor is arranged on the heat collector. The temperature sensor collects the temperature information of the heat collector and feeds the information back to the temperature control module. The temperature control module controls the heating or cooling of the semiconductor refrigeration plate according to the information collected by the temperature sensor.

[0024] 4 The sealed box is the outer contour of the equipment, which is sealed by sealing strips and sealants to ensure dust, rain and moisture inside the box. There is a layer of insulation material inside the sealed box, which can be polystyrene, polystyrene board foam board and other materials.

[0025] 5 optical camera, 6 turntable, 7 module converter, 8, 9 power modules, 10 image processing module are function realization modules and are main heat dissipation components required in the sealed box.

[0026] The bottom end of the optical camera 5 is equipped with a bearing column 14, and the bearing column 14 is installed on the mounting shaft 23 through a connecting structure 17; the connecting structure 17 includes a connecting portion 171, an L-shaped groove 172, a groove 173, a limit block 174 and a spring 175; the connecting portion 171 is installed on the bearing column 14, the L-shaped groove 172 is opened on the connecting portion 171, the mounting shaft 23 is placed in the L-shaped groove 172, the groove 173 is opened on the L-shaped groove 172, the limit block 174 is placed in the groove 173, the spring 175 is installed between the groove 173 and the limit block 174, the limit block 174 is tightly pressed in the L-shaped groove 172, and the L-shaped groove 402 on the connecting portion 401 on the bearing body 14 rotates along the mounting shaft 23 on the U-shaped seat 2, so that the bearing column 14 can adjust the angle at will, and the other end of the bearing column 14 is connected to fix the bearing column 14.

[0027] The spring 175 is provided with a cylinder 22, a block 18 is provided on the cylinder 22, a slot 19 is provided on the groove 173, and the block 18 is engaged in the slot 19; an annular groove 20 is provided on the block 18, an elastic member 20 is provided in the slot 19, and the number of the elastic members 20 is not less than six, and the elastic members 20 are distributed in the slot 19 in an annular shape and at equal intervals, and the elastic members 20 are engaged in the annular groove 20; a slot 18 is provided on the L-shaped groove 172, and a limit block 174 is inserted in the slot 18; Move the limit block 174 upward in the groove 173 to tilt the limit block 174 so that the lower limit block 174 can be removed, and the spring 175 can be removed for replacement; insert the cylinder 22 into the spring 175, so that the block 11 on the cylinder 22 is inserted into the slot 19, and the elastic member 21 is inserted into the annular groove 20, so that the limit block 174 is tilted and extends into the groove 173 and is installed on the spring 175, and the limit block 174 is moved upward. The limit block 174 is pressed tightly into the groove 173, and the spring 175 is compressed, so that the L-shaped groove 172 is inserted into the mounting shaft 23 on the U-shaped seat 2. Conversely, the bearing column 14 can be disassembled, and the L-shaped groove 172 on the connecting portion 171 of the bearing column 14 is rotated along the mounting shaft 23 on the U-shaped seat 2, so that the bearing column 14 can adjust the angle at will, and the other end of the bearing column 14 is connected to fix the bearing column 14.

[0028] The temperature control module includes a control logic interface, a control device, an actuator and a controlled object; the function of the temperature control module is to realize closed-loop control of the temperature in the sealed box. Each component in the sealed box has a suitable working temperature range. To ensure that each component works within the suitable temperature range, the heat collecting plate needs to be temperature controlled, that is, the upper and lower limits of the temperature are set. The temperature sensor collects the temperature of the heat collecting plate and feeds it back to the temperature control unit. The temperature control unit compares the collected temperature with the set temperature value. If the collected temperature is lower than the lower limit of the set temperature, the temperature control module controls the semiconductor refrigeration plate to heat. If the collected temperature value is higher than the upper limit of the set temperature, the temperature control module controls the semiconductor refrigeration plate to cool. The cooling and heating of the semiconductor refrigeration plate are achieved by changing the direction of the current to change the cold and hot ends.

[0029] The top and side walls of the turntable 6 are both installed with mounting structures 24, and the turntable 6 is installed on the sealed box 4 through the mounting structure 13; The mounting structure 24 includes a bolt body 13, threaded holes are provided on both sides of the top of the turntable 6, a threaded groove is provided in the threaded hole on the inner wall of the sealing box 4, a circular groove 131 is provided at the bottom end of the bolt body 13, a bolt rod 133 is installed at the bottom end of the circular groove 131, and the bolt rod 133 is screwed into the threaded hole and the threaded groove; A fixing ring 136 is installed at the outer upper end of the bolt rod 133, and the circumferential surface of the bolt rod 133 is covered with an annular pressure plate 135, a spring 137 and an annular rubber sheet 132. An extrusion block 134 is installed at the upper end edge of the annular rubber sheet 132. The outer wall of the prestressed bolt body 13 is provided with an arc surface 138, and the surface of the arc surface 138 is provided with anti-slip grooves.

[0030] See also Figures 1 to 8 , which is the second technical solution provided by the present invention: a thermal management device with a fully enclosed structure, comprising a sealed box body 4, the outer wall of the sealed box body 4 is equipped with a semiconductor cooling plate 2, and the outer wall of the semiconductor cooling plate 2 is equipped with a heat dissipation fin 1; the inner wall of the sealed box body 4 is equipped with a heat collecting plate 3, and the side wall of the heat collecting plate 3 is equipped with a module converter 7, an image processing module 10, a temperature control module 11, a power module a8 and a power module b9; five turntables 6 are evenly and equidistantly installed at the bottom end of the inner part of the sealed box body 4, and the top of each turntable 6 is equipped with an optical camera 5; the upper end of the turntable 6 is equipped with a U-shaped seat 12, and the U-shaped seat 12 is equipped with a mounting shaft 23; 1 The heat sink fin is used to dissipate heat from the hot end of the semiconductor refrigeration chip. The heat dissipation performance of the semiconductor refrigeration chip is directly affected by the heat dissipation performance of the hot end. A fan can be installed at one end of the heat sink fin as needed.

[0031] 2 Semiconductor refrigeration chip is a new type of refrigeration technology, which has many advantages such as small size, light weight, and no pollution. Its structure is shown in the figure above. It is composed of P-type semiconductor and N-type semiconductor arranged in parallel. NP-type semiconductor is connected by conductor 2-2 (generally copper, aluminum and other materials with good conductivity) to form a complete circuit, which is packaged by 2-1 cold end and 2-2 hot end. The hot and cold end packages are generally made of insulating ceramics. Another notable feature of semiconductor refrigeration chip is that the direction of cold and hot ends can be changed by changing the direction of current, that is, after changing the direction of current, the original cold end is transformed into hot end, and the original hot end is transformed into cold end. Through this feature of semiconductor refrigeration chip, the sealed box can be heated or cooled according to the external environment.

[0032] 3 The heat collector is an aluminum plate (or other materials with good thermal conductivity). Because the heat source in the sealed box is dispersed and there are moving parts, it is difficult to dissipate heat. Therefore, high-power electronic devices are installed on the heat collector. The heat generated by the moving devices (camera and turntable) is transferred to the heat collector through a flexible heat-conducting cable, and the heat is concentrated and dissipated outward through the heat collector. In addition, a temperature sensor is arranged on the heat collector. The temperature sensor collects the temperature information of the heat collector and feeds the information back to the temperature control module. The temperature control module controls the heating or cooling of the semiconductor refrigeration plate according to the information collected by the temperature sensor.

[0033] 4 The sealed box is the outer contour of the equipment, which is sealed by sealing strips and sealants to ensure dust, rain and moisture inside the box. There is a layer of insulation material inside the sealed box, which can be polystyrene, polystyrene board foam board and other materials.

[0034] 5 optical camera, 6 turntable, 7 module converter, 8, 9 power modules, 10 image processing module are function realization modules and are main heat dissipation components required in the sealed box.

[0035] The bottom end of the optical camera 5 is equipped with a bearing column 14, and the bearing column 14 is installed on the mounting shaft 23 through a connecting structure 17; the connecting structure 17 includes a connecting portion 171, an L-shaped groove 172, a groove 173, a limit block 174 and a spring 175; the connecting portion 171 is installed on the bearing column 14, the L-shaped groove 172 is opened on the connecting portion 171, the mounting shaft 23 is placed in the L-shaped groove 172, the groove 173 is opened on the L-shaped groove 172, the limit block 174 is placed in the groove 173, the spring 175 is installed between the groove 173 and the limit block 174, the limit block 174 is tightly pressed in the L-shaped groove 172, and the L-shaped groove 402 on the connecting portion 401 on the bearing body 14 rotates along the mounting shaft 23 on the U-shaped seat 2, so that the bearing column 14 can adjust the angle at will, and the other end of the bearing column 14 is connected to fix the bearing column 14.

[0036] The spring 175 is provided with a cylinder 22, a block 18 is provided on the cylinder 22, a slot 19 is provided on the groove 173, and the block 18 is engaged in the slot 19; an annular groove 20 is provided on the block 18, an elastic member 20 is provided in the slot 19, and the number of the elastic members 20 is not less than six, and the elastic members 20 are distributed in the slot 19 in an annular shape and at equal intervals, and the elastic members 20 are engaged in the annular groove 20; a slot 18 is provided on the L-shaped groove 172, and a limit block 174 is inserted in the slot 18; Move the limit block 174 upward in the groove 173 to tilt the limit block 174 so that the lower limit block 174 can be removed, and the spring 175 can be removed for replacement; insert the cylinder 22 into the spring 175, so that the block 11 on the cylinder 22 is inserted into the slot 19, and the elastic member 21 is inserted into the annular groove 20, so that the limit block 174 is tilted and extends into the groove 173 and is installed on the spring 175, and the limit block 174 is moved upward. The limit block 174 is pressed tightly into the groove 173, and the spring 175 is compressed, so that the L-shaped groove 172 is inserted into the mounting shaft 23 on the U-shaped seat 2. Conversely, the bearing column 14 can be disassembled, and the L-shaped groove 172 on the connecting portion 171 of the bearing column 14 is rotated along the mounting shaft 23 on the U-shaped seat 2, so that the bearing column 14 can adjust the angle at will, and the other end of the bearing column 14 is connected to fix the bearing column 14.

[0037] The temperature control module includes a control logic interface, a control device, an actuator and a controlled object; the function of the temperature control module is to realize closed-loop control of the temperature in the sealed box. Each component in the sealed box has a suitable working temperature range. To ensure that each component works within the suitable temperature range, the heat collecting plate needs to be temperature controlled, that is, the upper and lower limits of the temperature are set. The temperature sensor collects the temperature of the heat collecting plate and feeds it back to the temperature control unit. The temperature control unit compares the collected temperature with the set temperature value. If the collected temperature is lower than the lower limit of the set temperature, the temperature control module controls the semiconductor refrigeration plate to heat. If the collected temperature value is higher than the upper limit of the set temperature, the temperature control module controls the semiconductor refrigeration plate to cool. The cooling and heating of the semiconductor refrigeration plate are achieved by changing the direction of the current to change the cold and hot ends.

[0038] The top and side walls of the turntable 6 are both installed with mounting structures 24, and the turntable 6 is installed on the sealed box 4 through the mounting structure 13; The mounting structure 23 includes a limiting block 138 mounted on the side wall of the turntable 6 and a limiting groove 139 opened on the inner wall of the sealing box 4 , and the limiting block 138 is clamped in the limiting groove 139 .

[0039] A filling layer 140 is installed inside the block 138 .

[0040] The difference from the first technical solution is that the first embodiment fixes the turntable 6 by threaded connection of the bolt body, while the second embodiment fixes it by cooperation of the limit block and the limit groove.

[0041] The other components in the second technical solution are the same as those in the first technical solution.

[0042] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A thermal management device with a fully enclosed structure, comprising a sealed box (4), characterized in that: The outer wall of the sealed box (4) is equipped with a semiconductor cooling sheet (2), and the outer wall of the semiconductor cooling sheet (2) is equipped with a heat dissipation fin (1); The inner wall of the sealed box (4) is equipped with a heat collecting plate (3), and the side wall of the heat collecting plate (3) is equipped with a module converter (7), an image processing module (10), a temperature control module (11), a power module a (8), and a power module b (9); The inner bottom end of the sealed box (4) is evenly and equidistantly equipped with five turntables (6), and the top end of each turntable (6) is equipped with an optical camera (5); The upper end of the turntable (6) is equipped with a U-shaped seat (12), a mounting shaft (23) is mounted inside the U-shaped seat (12), and the bottom end of the optical camera (5) is equipped with a bearing column (14), and the bearing column (14) is mounted on the mounting shaft (23) via a connecting structure (17); The connection structure (17) comprises a connection portion (171), an L-shaped groove (172), a groove (173), a limit block (174) and a spring (175); The connecting portion (171) is mounted on the bearing column (14); the L-shaped groove (172) is formed on the connecting portion (171); the mounting shaft (23) is disposed in the L-shaped groove (172); the groove (173) is formed on the L-shaped groove (172); the limit block (174) is disposed in the groove (173); the spring (175) is mounted between the groove (173) and the limit block (174); and the limit block (174) is tightly pressed against the L-shaped groove (172).

2. A fully enclosed thermal management device according to claim 1, characterized in that: A cylinder (22) is installed in the spring (175), a clamping block (18) is installed on the cylinder (22), a clamping slot (19) is provided on the groove (173), and the clamping block (18) is clamped in the clamping slot (19).

3. A fully enclosed thermal management device according to claim 2, characterized in that: The clamping block (18) is provided with an annular groove (20), and an elastic member (21) is installed in the clamping groove (19). The number of the elastic members (21) is not less than six, and the elastic members (21) are distributed in the clamping groove (19) in an annular shape and at equal intervals. The elastic members (21) are clamped in the annular groove (20).

4. A fully enclosed thermal management device according to claim 1, characterized in that: The L-shaped groove (172) is provided with a slot (18), and the limit block (174) is inserted into the slot (18).

5. The fully enclosed thermal management device according to claim 1, characterized in that: The temperature control module includes a control logic interface, a control device, an actuator and a controlled object.

6. A fully enclosed thermal management device according to claim 1, characterized in that: Both side walls at the top of the turntable (6) are installed with mounting structures (24), and the turntable (6) is installed on the sealed box body (4) via the mounting structure (13).

7. A fully enclosed thermal management device according to claim 6, characterized in that: The mounting structure (24) comprises a bolt body (13), threaded holes are provided on both sides of the top of the turntable (6), a threaded groove is provided on the inner wall of the sealing box (4) in the threaded hole, a circular groove (131) is provided at the bottom end of the bolt body (13), a bolt rod (133) is installed at the bottom end of the circular groove (131), and the bolt rod (133) is screwed into the threaded hole and the threaded groove.

8. A fully enclosed thermal management device according to claim 7, characterized in that: A fixing ring (136) is installed at the outer upper end of the bolt rod (133); an annular pressing sheet (135), a spring (137) and an annular rubber sheet (132) are sleeved on the circumferential surface of the bolt rod (133); an extrusion block (134) is installed at the upper edge of the annular rubber sheet (132); and an outer wall of the prestressed bolt body (13) is provided with an arc surface.

9. The fully enclosed thermal management device according to claim 7, characterized in that: The mounting structure (23) comprises a limit block 138 mounted on the side wall of the turntable (6) and a limit groove (139) provided on the inner wall of the sealing box (4), wherein the limit block (138) is snap-fitted into the limit groove (139).

10. A fully enclosed thermal management device according to claim 9, characterized in that: A filling layer (140) is installed inside the limiting block (138).

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