Vapor chamber and manufacturing method thereof

Abstract

The invention discloses a vapor chamber and a manufacturing method thereof. The manufacturing method comprises the steps that at least one connecting opening is formed in a bottom plate, the first end of the heat pipe is welded to the connecting opening, and the second end of the heat pipe is sealed; a first capillary structure is sintered on the inner surface of the heat pipe, a second capillary structure is sintered on the upper surface of the bottom plate, and the first capillary structure and the second capillary structure are connected with each other; sintering the third capillary structure on the top plate; connecting one surface of a supporting column with the second capillary structure, and connecting the other surface of the supporting column with the third capillary structure; the peripheries of the top plate and the bottom plate are welded, and a vacuum cavity is formed by the top plate, the bottom plate and the heat pipes; and the heat dissipation structure is welded on the heat pipe. According to the manufacturing method, the uniform temperature plate with higher heat dissipation performance can be obtained.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature averaging plates, and in particular to a temperature averaging plate and a manufacturing method thereof. Background Art

[0002] With the continuous advancement of modern electronic technology, the operating power and integration of high-performance electronic devices continue to rise, which puts more stringent requirements on heat dissipation technology. Although traditional heat dissipation solutions, such as the design of a flat vapor chamber (VC) combined with heat sink fins, meet basic heat dissipation requirements to a certain extent, their limitations are becoming increasingly apparent.

[0003] The traditional flat temperature plate is mainly made of materials such as copper with excellent thermal conductivity, and a vacuum cavity containing a microstructure is constructed inside. The working principle of this design is: when heat is transferred from the heat source (such as high-performance chips such as CPU and GPU) to the VC cavity, the coolant in the cavity will be heated and vaporized, rapidly expand and fill the entire cavity, thereby achieving uniform distribution of heat. When the gas phase coolant contacts the cooling fin area with lower temperature, condensation will occur, releasing heat to the cooling fins, and then the heat will be taken away by air flow (such as airflow generated by a fan). The advantage of this heat dissipation solution is that the cost is relatively low and the manufacturing process is relatively mature. However, its main drawback is that the flat temperature plate mainly relies on a two-dimensional plane for heat conduction, which results in limited heat transfer efficiency in the vertical direction (Z direction), which in turn limits the height of the cooling fins and the heat dissipation surface area, thereby affecting the overall heat dissipation effect.

[0004] In order to break through this bottleneck, the industry began to actively explore new heat dissipation technologies, among which 3D temperature-averaging board VC technology stood out for its innovation. 3D temperature-averaging board VC has achieved a revolutionary breakthrough in structural design. Its internal cavity remains conductive in all directions, and the capillary structures in all directions are interconnected to form an internally connected solid unit. This unique structure enables the 3D temperature-averaging board VC to not only efficiently conduct heat in the two-dimensional direction, but also significantly enhance the thermal conductivity in the Z direction. By cleverly applying the principle of phase change heat transfer, the 3D temperature-averaging board VC can directly transfer the heat generated by the chip to the remote heat sink fins efficiently and quickly, thereby achieving significant heat dissipation effects such as "efficient heat dissipation, uniform temperature distribution, and reduced hot spots". This technology is particularly suitable for the heat dissipation of high-power devices and the temperature uniformity requirements in areas with high heat flux density.

[0005] Compared with traditional flat temperature spreaders, 3D temperature spreader VC technology has the following significant advantages: Due to the increased thermal conductivity in the Z direction, the height of the heat sink fins can be designed to be higher, thereby greatly increasing the heat dissipation surface area and significantly improving the heat dissipation effect. According to experimental data, the heat dissipation performance of 3D temperature spreader VC can be improved by more than 3 times compared with traditional VC. However, its manufacturing process faces challenges such as high complexity and high cost, especially the difficulty of the internal microstructure and capillary pipeline process, and the thermal performance of the obtained 3D temperature spreader VC is poor.

[0006] Therefore, the present application proposes a temperature homogenizing plate and a manufacturing method thereof. Summary of the invention

[0007] The object of the present invention is to provide a temperature averaging plate and a manufacturing method thereof, so as to obtain a temperature averaging plate with higher heat dissipation performance, and the heat of the temperature averaging plate can be efficiently conducted and dispersed.

[0008] The purpose of the present invention is achieved by the following technical solutions:

[0009] In a first aspect, the present invention provides a method for manufacturing a temperature homogenizing plate, comprising the following steps:

[0010] At least one connection port is opened on the bottom plate, a first end of the heat pipe is welded to the connection port, and a second end of the heat pipe is sealed;

[0011] Sintering a first capillary structure on the inner surface of the heat pipe, sintering a second capillary structure on the upper surface of the bottom plate, and connecting the first capillary structure and the second capillary structure to each other;

[0012] sintering the third capillary structure on the top plate;

[0013] Connecting one side of the support column to the second capillary structure, and connecting the other side of the support column to the third capillary structure;

[0014] Welding the periphery of the top plate and the bottom plate to form a vacuum cavity with the heat pipe;

[0015] The heat dissipation structure is welded on the heat pipe.

[0016] Furthermore, the welding is a laser welding process.

[0017] Furthermore, sintering the first capillary structure on the inner surface of the heat pipe, sintering the second capillary structure on the upper surface of the bottom plate, and connecting the first capillary structure and the second capillary structure to each other comprises the following steps:

[0018] Putting the welded bottom plate and heat pipe into a jig, and filling the jig with copper powder so that the copper powder is laid on the upper surface of the bottom plate and the inner surface of the heat pipe;

[0019] The fixture system is placed in a high-temperature sintering furnace to obtain a first capillary structure and a second capillary structure connected to each other, wherein the second capillary structure is sintered on the upper surface of the base plate, and the first capillary structure is sintered on the inner surface of the heat pipe.

[0020] Furthermore, sintering the first capillary structure on the inner surface of the heat pipe, sintering the second capillary structure on the upper surface of the bottom plate, and connecting the first capillary structure and the second capillary structure to each other comprises the following steps:

[0021] Put the welded bottom plate and heat pipe into a jig, and place the second capillary structure portion on the upper surface of the bottom plate;

[0022] The second capillary structure is partially bent so that the bent portion is disposed opposite to the inner surface of the heat pipe, and the distance between the bent portion and the inner surface of the heat pipe is equal to the thickness of the first capillary structure;

[0023] Filling the jig with copper powder so that the copper powder is laid on the inner surface of the heat pipe;

[0024] The fixture system is placed in a high-temperature sintering furnace to obtain a first capillary structure, which is sintered on the inner surface of the heat pipe, a portion of the second capillary structure is sintered on the upper surface of the base plate, and a portion of the second capillary structure is sintered on the first capillary structure.

[0025] Furthermore, sintering the first capillary structure on the inner surface of the heat pipe, sintering the second capillary structure on the upper surface of the bottom plate, and connecting the first capillary structure and the second capillary structure to each other comprises the following steps:

[0026] Putting the heat pipe into a jig and filling the jig with copper powder so that the copper powder is laid on the inner surface of the heat pipe, then putting the jig system into a high-temperature sintering furnace to obtain a first capillary structure, and the first capillary structure is sintered on the inner surface of the heat pipe;

[0027] The second capillary structure is partially placed on the upper surface of the base plate, and the second capillary structure is partially bent so that the bent portion abuts against the first capillary structure, and the fixture system is placed in a high-temperature sintering furnace so that part of the second capillary structure is sintered on the upper surface of the base plate and part of the second capillary structure is sintered on the first capillary structure.

[0028] Furthermore, the relationship between the copper powder diameter and the product parameters of the capillary structure made of copper powder includes:

[0029] As the copper powder diameter decreases, the porosity of the capillary structure generally shows a decreasing trend;

[0030] As the diameter of copper powder decreases, the capillary climbing time of the capillary structure increases;

[0031] The porosity of the capillary structure is positively correlated with the permeability of the capillary structure.

[0032] Furthermore, the production method further comprises the following steps:

[0033] The fourth capillary structure is sintered on the second capillary structure.

[0034] Furthermore, the step of connecting one side of the support column to the second capillary structure and the other side of the support column to the third capillary structure comprises the following steps:

[0035] Sintering a first surface of a first support column on the second capillary structure, and sintering a second surface of the first support column opposite to the first surface on the third capillary structure;

[0036] Sintering the top surface of the second support column on the second capillary structure, and sintering the bottom surface of the second support column opposite to the top surface on the third capillary structure;

[0037] Among them, the first support column is a copper powder column, and the second support column is a copper column.

[0038] Furthermore, the step of welding the heat dissipation structure onto the heat pipe includes:

[0039] Welding holes are opened on the plurality of heat dissipation fins, and the plurality of heat dissipation fins are welded to the heat pipe at equal intervals through the welding holes to form a heat dissipation structure;

[0040] Among them, the heat sink fins are made of metal or non-metallic thermal conductive materials.

[0041] In a second aspect, the present invention provides a temperature averaging plate, which is manufactured using the above-mentioned manufacturing method.

[0042] Compared with the prior art, the beneficial effects of the present invention include at least:

[0043] The present invention realizes the construction of the internal structure of the temperature homogenizing plate, including the reasonable layout of the heat pipe, the capillary structure and the support column, thereby ensuring the efficient conduction and dispersion of heat and improving the heat dissipation performance of the temperature homogenizing plate.

[0044] Furthermore, by opening a connection port on the bottom plate and welding the heat pipe, and then sealing the second end of the heat pipe, an efficient heat conduction path is formed.

[0045] Furthermore, the heat pipe can quickly transfer the heat generated by the heat source to an area far away from the heat source, thereby achieving rapid heat transfer.

[0046] Furthermore, the interconnection of the third capillary structure, the first capillary structure and the second capillary structure, as well as their sintering on the top plate, the heat pipe and the bottom plate, constructs a continuous capillary network. The capillary network uses capillary force to drive the coolant to circulate inside the temperature homogenizing plate, thereby enhancing the heat transfer efficiency.

[0047] Furthermore, the support column connects the second capillary structure and the third capillary structure, further expanding the heat conduction path, so that the heat can be more evenly distributed and conducted in three-dimensional space. In addition, the setting of the support column not only enhances the support force of the internal structure of the temperature plate, but also ensures the stable connection between the top plate, the bottom plate and the heat pipe after the vacuum cavity is formed, preventing structural deformation or damage caused by external forces.

[0048] Furthermore, when the heat dissipation structure is welded to the heat pipe, the appropriate number, spacing and material of the heat dissipation fins can be selected according to actual needs to meet the heat dissipation requirements in different application scenarios. For example, if a higher scene is required in the Z-axis direction, it can be achieved by increasing the number of heat dissipation fins and the length of the heat pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 It is a structural schematic diagram of a temperature equalizing plate in the prior art.

[0050] Figure 2 It is a structural schematic diagram of a vacuum chamber of a temperature homogenizing plate according to an embodiment of the present invention.

[0051] Figure 3 Schematic diagram of a temperature homogenizing plate according to an embodiment of the present invention.

[0052] Figure 4 It is an exploded view of the cover body of the embodiment of the present invention.

[0053] Figure 5 It is a structural schematic diagram of a support structure of an embodiment of the present invention.

[0054] Figure 6 It is a structural schematic diagram of a fixture according to an embodiment of the present invention.

[0055] Figure 7 yes Figure 6 A is an enlarged view of the middle image.

[0056] Figure 8 2 is another structural schematic diagram of a fixture according to an embodiment of the present invention.

[0057] Fig. 9 yes Figure 8 Enlarged view of B.

[0058] Fig.10 It is a schematic diagram of a method for manufacturing a temperature homogenizing plate according to an embodiment of the present invention.

[0059] In the figure: 11, cover; 111, top plate; 112, third capillary structure; 113, supporting structure; 1131, second supporting column; 1132, first supporting column; 114, fourth capillary structure; 115, second capillary structure; 116, bottom plate; 12, heat dissipation structure; 121, heat dissipation fins; 122, spacing; 13, heat conduction structure; 131, heat pipe; 132, first capillary structure; 14, vacuum chamber; 21, first upper fixture; 203, receiving groove; 204, limiting groove; 211, powder blowing hole; 212, mounting hole; 22, second upper fixture; 221, protruding structure; 23, lower fixture; 231, mounting groove; 232, powder injection chamber; 24, core; 241, limiting block; 242, core rod. DETAILED DESCRIPTION

[0060] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete and to fully convey the concepts of example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted.

[0061] The words expressing positions and directions described in the present invention are all explained with reference to the accompanying drawings as examples, but they can be changed as needed, and all such changes are included in the protection scope of the present invention.

[0062] refer to Fig.10 The method for manufacturing a temperature vapor chamber of the present invention comprises steps SS11 to SS16. Further, the method for manufacturing a temperature vapor chamber of the present invention comprises steps SS11 to SS17.

[0063] Step SS11: at least one connection port is opened on the bottom plate 116 , the first end of the heat pipe 131 is welded to the connection port, and the second end of the heat pipe 131 is sealed.

[0064] The welding is a laser welding process, which can avoid the use of welding materials and prevent the capillary structure or phase-changing material from being contaminated by the welding materials. It can also be achieved through program control, thereby improving the production efficiency and flexibility and reducing the difficulty of production.

[0065] Step SS12: sintering the first capillary structure 132 on the inner surface of the heat pipe 131 , sintering the second capillary structure 115 on the upper surface of the bottom plate 116 , and connecting the first capillary structure 132 and the second capillary structure 115 to each other.

[0066] When applicable, step SS12 includes step SS121 - step SS122, or step SS123 - step SS126, or step SS127 - step SS128.

[0067] Step SS121: Place the bottom plate 116 and the heat pipe 131 welded together into a jig, and fill the jig with copper powder so that the copper powder is laid on the upper surface of the bottom plate 116 and the inner surface of the heat pipe 131 .

[0068] Step SS122 : placing the fixture system into a high-temperature sintering furnace to obtain the first capillary structure 132 and the second capillary structure 115 connected to each other, wherein the second capillary structure 115 is sintered on the upper surface of the bottom plate 116 , and the first capillary structure 132 is sintered on the inner surface of the heat pipe 131 .

[0069] In some preferred embodiments, the fixture system filled with copper powder is placed in a high-temperature sintering furnace, and high-temperature sintering is performed according to a preset sintering temperature (e.g., between 800°C and 1000°C), a sintering time (e.g., 2 hours to 4 hours), and protection using an inert gas (e.g., nitrogen or a nitrogen-hydrogen mixture). After high-temperature sintering, the copper powder will melt and sinter tightly on the bottom plate 116 and the heat pipe 131 to form a first capillary structure 132 and a second capillary structure 115 that are connected to each other.

[0070] Step SS123 : Place the bottom plate 116 and the heat pipe 131 welded together into a fixture, and partially place the second capillary structure 115 on the upper surface of the bottom plate 116 .

[0071] Step SS124: partially bend the second capillary structure 115 so that the bent portion is disposed opposite to the inner surface of the heat pipe 131 and the distance between the bent portion and the inner surface of the heat pipe 131 is the thickness of the first capillary structure 132. The thickness of the first capillary structure 132 is a preset thickness of the first capillary structure 132.

[0072] Step SS125: Fill the jig with copper powder so that the copper powder is laid on the inner surface of the heat pipe 131 .

[0073] Step SS126 : placing the fixture system into a high-temperature sintering furnace to obtain a first capillary structure 132 , the first capillary structure 132 is sintered on the inner surface of the heat pipe 131 , part of the second capillary structure 115 is sintered on the upper surface of the bottom plate 116 , and part of the second capillary structure 115 is sintered on the first capillary structure 132 .

[0074] Step SS127: Place the heat pipe 131 into a jig and fill the jig with copper powder so that the copper powder is laid on the inner surface of the heat pipe 131 , then place the jig system into a high-temperature sintering furnace to obtain a first capillary structure 132 sintered on the inner surface of the heat pipe 131 .

[0075] Step SS128: Part of the second capillary structure 115 is placed on the upper surface of the bottom plate 116, and the second capillary structure 115 is partially bent so that the bent portion abuts against the first capillary structure 132, and the fixture system is placed in a high-temperature sintering furnace so that part of the second capillary structure 115 is sintered on the upper surface of the bottom plate 116, and part of the second capillary structure 115 is sintered on the first capillary structure 132.

[0076] In some preferred embodiments, the relationship between the diameter of the copper powder and the product parameters of the capillary structure made of the copper powder includes:

[0077] (1) As the diameter of copper powder decreases, the porosity of the capillary structure generally shows a downward trend.

[0078] Since smaller copper powder particles are able to pack more tightly, they fill more space and reduce void space.

[0079] (2) As the diameter of copper powder decreases, the capillary climbing time of the capillary structure increases.

[0080] Since smaller copper powder particles can be packed more tightly, the resistance to fluid flow is increased, and stronger capillary forces are required to overcome this resistance. Therefore, a decrease in copper powder diameter leads to an increase in capillary climb time. When applied, the capillary climb time is also affected by other factors, such as the shape, size and distribution of pores.

[0081] (3) The porosity of the capillary structure is positively correlated with the permeability of the capillary structure.

[0082] Capillary structures with higher porosity have more pores, providing more fluid channels, so samples with higher porosity tend to have higher permeability.

[0083] In actual application, the capillary structure made of 60-100 mesh copper powder has a particle size range of 0.15-0.25mm, a porosity of 61%, a permeability of 58μ㎡, and a capillary climbing time of 100mm / 12s. When the copper powder mesh number increases to 100-150 mesh, the particle size range is 0.1-0.15mm, the porosity decreases to 52%, the permeability also decreases to 33μ㎡, and the capillary climbing time is extended to 100mm / 16s. Increasing the copper powder mesh number to 150-200 mesh, the particle size range is 0.07-50.10mm, the porosity significantly decreases to 38%, the permeability drops sharply to 8μ㎡, and the capillary climbing time increases to 100mm / 26s. The mesh size of copper powder is further increased to 200-325 mesh, the particle size range is 0.046-0.075 mm, the porosity is as low as 32%, the permeability is only 5 μm2, and the capillary climbing time is increased to 100 mm / 28 s.

[0084] Step SS13 : sintering the third capillary structure 112 on the top plate 111 .

[0085] Step SS14: Connect one side of the support column to the second capillary structure 115 , and connect the other side of the support column to the third capillary structure 112 .

[0086] When applicable, step SS14 includes step SS141 and / or step SS142.

[0087] SS141: Sinter the first surface of the first support column 1132 on the second capillary structure 115, and sinter the second surface of the first support column 1132 opposite to the first surface on the third capillary structure 112. The first support column 1132 is a copper powder column.

[0088] SS142: Sinter the top surface of the second support column 1131 on the second capillary structure 115, and sinter the bottom surface of the second support column 1131 opposite to the top surface on the third capillary structure 112. The second support column 1131 is a copper column.

[0089] In some preferred embodiments, a first support column 1132 (copper powder column) and a second support column 1131 (copper column) are respectively manufactured, and one side of the first support column 1132 and the second support column 1131 are sintered on the second capillary structure 115, and the other side is sintered on the third capillary structure 112. The support columns play a role in connecting and supporting the second capillary structure 115 and the third capillary structure 112.

[0090] Step SS15: Weld the periphery of the top plate 111 and the bottom plate 116 to form a vacuum cavity with the heat pipe 131 .

[0091] Step SS16: Weld the heat dissipation structure 12 onto the heat pipe 131 .

[0092] When applied, step SS16 includes step SS161: opening welding holes on a plurality of heat sink fins 121, and welding a plurality of heat sink fins 121 at equal intervals 122 to the heat pipe 131 through the welding holes to form a heat dissipation structure 12. The heat sink fins 121 are made of metal or non-metallic heat conductive materials, such as aluminum sheets, copper sheets, or copper-aluminum composite materials. Preferably, the heat sink fins 121 are aluminum sheets, which have good thermal conductivity and light weight.

[0093] Step SS17: sintering the fourth capillary structure 114 on the second capillary structure 115 to further enhance the heat dissipation performance of the temperature vapor chamber.

[0094] The present invention realizes the construction of the internal structure of the temperature equalizing plate, including the reasonable layout of the heat pipe 131, the capillary structure and the support column, ensures the efficient conduction and dispersion of heat, and improves the heat dissipation performance of the temperature equalizing plate. Further, by opening a connection port on the bottom plate 116 and welding the heat pipe 131, and then sealing the second end of the heat pipe 131, an efficient heat conduction path is formed. Further, the heat pipe 131 can quickly conduct the heat generated by the heat source to the area away from the heat source, thereby realizing the rapid transfer of heat. Further, the interconnection of the third capillary structure 112, the first capillary structure 132 and the second capillary structure 115, and their sintering on the top plate 111, the heat pipe 131 and the bottom plate 116, constructs a continuous capillary network, and the capillary network uses capillary force to drive the coolant to circulate inside the temperature equalizing plate, thereby enhancing the heat transfer efficiency. Further, the support column connects the second capillary structure 115 and the third capillary structure 112, further expanding the heat conduction path, so that the heat can be more evenly distributed and conducted in three-dimensional space. In addition, the setting of the support column not only enhances the support force of the internal structure of the temperature equalizer, but also ensures the stable connection between the top plate 111, the bottom plate 116 and the heat pipe 131 after the vacuum cavity is formed, thereby preventing the structural deformation or damage caused by external forces. Furthermore, when the heat dissipation structure 12 is welded to the heat pipe 131, the number, spacing 122 and material of the appropriate heat dissipation fins 121 can be selected according to actual needs to meet the heat dissipation requirements in different application scenarios. For example, in the scenario where the Z-axis direction is required to be higher, it can be achieved by increasing the number of heat dissipation fins 121 and the length of the heat pipe 131.

[0095] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail with reference to Examples 1-3 and Comparative Example 1. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0096] Example 1

[0097] This embodiment adopts the above-mentioned steps SS11 to SS17 to make a temperature equalizing plate, wherein step SS12 includes steps SS121 and SS122. When used, the mesh size of the copper powder is 60 to 100 meshes (particle size is 0.15 to 0.25 mm); the sintering temperature is: 900 to 980°C; the sintering time is about 4 hours, and the sintering is carried out in a nitrogen-hydrogen mixed gas protective atmosphere. In actual application, copper is easily oxidized at high temperatures, and hydrogen can reduce copper oxide.

[0098] The temperature homogenizing plate obtained in this embodiment includes: a cover body 11 , a support structure 113 , a capillary component, a heat conducting structure 13 and a heat dissipation structure 12 .

[0099] refer to Figure 2The cover 11 is welded and connected to the heat-conducting structure 13 to form a vacuum chamber 14. Specifically, the heat-conducting structure 13 includes at least one heat pipe 131, and each heat-conducting structure 13 includes at least one heat pipe 131. Each heat pipe 131 has a first end and a second end that are arranged opposite to each other. The first end is open and the second end is sealed. Figure 3 The cover body 11 includes a top plate 111 and a bottom plate 116, which are connected by a sealing process. The bottom plate 116 is provided with a connection port, which is connected to the first end of the heat pipe 131. In actual application, the size of the cover body 11 is 100*100mm, the number of the heat pipes 131 is 8, and the size of the heat pipe 131 is 6mm. Those skilled in the art can adjust the size of the cover body, the number of heat pipes, and the diameter and length of the heat pipes according to actual needs.

[0100] refer to Figure 4 The capillary component includes a first capillary structure 132, a second capillary structure 115, a third capillary structure 112 and a fourth capillary structure 114. The first capillary structure 132 is arranged on the inner wall of the heat pipe 131, the second capillary structure 115 is arranged on the bottom plate 116, and the first capillary structure 132 and the second capillary structure 115 are connected to each other. The fourth capillary structure 114 is arranged on the second capillary structure 115, and the third capillary structure 112 is arranged on the top plate 111. When applied, the first capillary structure 132 and the second capillary structure 115 are both made of copper powder; the third capillary structure 112 and the fourth capillary structure 114 are both made of copper mesh. In actual application, the size of the first capillary structure 132 is 6*6*100mm. 3 The porosity is 61%, the permeability is 58μ㎡, and the capillary climbing time is 100mm / 12s. The size of the second capillary structure 115 is 93*93*0.3mm 3 The porosity is 52%, the permeability is 45μ㎡, and the capillary climbing time is 100mm / 15s. The third capillary structure 112 includes two superimposed copper meshes, specifically, one with a size of 93*93*0.1mm 3 200 mesh copper mesh and a size of 93*93*0.2mm 3 The third capillary structure 112 has a porosity of 58%, a permeability of 47 μ㎡, and a capillary climbing time of 100 mm / 12 s. The fourth capillary structure 114 has a size of 93*93*0.1 mm. 3 The fourth capillary structure has a porosity of 60%, a permeability of 48μ㎡, and a capillary climbing time of 100mm / 15s. Among them, the porosity indicates the proportion of the voids formed after the copper powder is accumulated to the total volume. The permeability indicates the ability of the fluid to pass through the copper powder accumulation. The capillary climbing time indicates the time required for the fluid to climb 100mm under the capillary action.

[0101] refer to Figure 5 , the support structure 113 includes: at least one first support column 1132 and at least one second support column 1131. Specifically, the first surface of the first support column 1132 is connected to the second capillary structure 115, and the second surface of the first support column 1132 opposite to the first surface is connected to the third capillary structure 112. The top surface of the second support column 1131 is connected to the second capillary structure 115, and the bottom surface of the second support column 1131 opposite to the top surface is connected to the third capillary structure 112. When applied, the first support column 1132 is a copper powder column; the second support column 1131 is a copper column. It ensures that heat can be smoothly transferred between the second capillary structure 115 and the third capillary structure 112, while enhancing the structural stability between the two. In actual application, the number of the first support column 1132 is 30, and the number of the second support column 1131 is 120.

[0102] refer to Figure 3 The heat dissipation structure 12 includes a plurality of heat dissipation fins 121, each of which is arranged on the second end of the heat pipe 131. When used, the heat dissipation fins 121 are metal or non-metallic thermal conductive materials, such as aluminum sheets, copper sheets or copper-aluminum composite materials. Preferably, the heat dissipation fins 121 are aluminum sheets, which are arranged parallel to the cover body 11, and the plurality of heat dissipation fins 121 are arranged at equal intervals 122. In actual application, the size of the heat dissipation fins 121 is 95*95mm. The spacing 122 between two adjacent heat dissipation fins 121 is 2mm. The number of heat dissipation fins 121 is 40 layers.

[0103] The jig used to make the first capillary structure 132 and the second capillary structure 115 in this embodiment includes: a mold core 24 and a lower jig 23 and a first upper jig 21 that are arranged opposite to each other. Figure 6 and Figure 7 .

[0104] The lower fixture 23 is provided with at least one mounting groove 231 that matches the shape and size of the heat pipe 131, and the mounting groove 231 is used to accommodate the heat pipe 131. When the heat pipe 131 is placed in the mounting groove 231, the position of the heat pipe 131 in the lower fixture 23 can be ensured to be stable and accurate.

[0105] The first upper fixture 21 is provided with at least one mounting hole 212, at least one powder blowing hole 211, and a communicating receiving groove 203 and a limiting groove 204, and the powder blowing hole 211 is communicated with the receiving groove 203. The limiting groove 204 includes a first side and a second side arranged opposite to each other. The first side faces the receiving groove 203, and the second side is communicated with the mounting groove 231 on the lower fixture 23.

[0106] The mold core 24 includes: a core rod 242 and a stopper 241. The core rod 242 passes through the mounting hole 212, the receiving groove 203 and the stopper 204, and the free end of the core rod 242 is suspended in the mounting groove 231. The gap between the outer surface of the free end of the core rod 242 and the inner wall of the heat pipe 131 forms a powder injection chamber 232. The stopper 241 is connected to the fixed end of the core rod 242 opposite to the free end, and plays the role of fixing and supporting the core rod 242.

[0107] During the manufacturing process, the limiting groove 204 is used to accommodate the bottom plate 116, and the copper powder can be injected into the receiving groove 203 through the powder blowing hole 211 to fill the space between the first upper fixture 21 and the bottom plate 116; and then the copper powder will also enter the powder injection chamber 232 along the receiving groove 203 and the mounting hole 212 to fill the gap between the inside of the heat pipe 131 and the core rod 242. In actual application, after the copper powder is injected, the first capillary structure 132 is formed on the inner wall of the heat pipe 131 through sintering, and the second capillary structure 115 is formed on the bottom plate 116, and the first capillary structure 132 and the second capillary structure 115 are connected to each other to increase the thermal conductivity of the heat spreader.

[0108] The thermal performance of the temperature vapor chamber obtained in this embodiment is shown in Table 1.

[0109] Example 2

[0110] This embodiment adopts the above-mentioned steps SS11 to SS17 to manufacture the temperature equalizing plate, wherein step SS12 includes steps SS127 and SS128. When used, the mesh number of the copper powder is 60 to 100 meshes (particle size is 0.15 to 0.25 mm); the sintering temperature is: 900 to 980°C; the sintering time is about 4 hours, and the sintering is carried out in a nitrogen-hydrogen mixed gas protective atmosphere.

[0111] The difference between the temperature averaging plate obtained in this embodiment and the temperature averaging plate in Embodiment 1 mainly lies in the capillary component.

[0112] The capillary assembly of this embodiment includes a first capillary structure 132, a second capillary structure 115, a third capillary structure 112 and a fourth capillary structure 114. The first capillary structure 132 is arranged on the inner wall of the heat pipe 131, and the second capillary structure 115 is partially arranged on the bottom plate 116. The second capillary structure 115 is bent, and the bent part is connected to the first capillary structure 132. The fourth capillary structure 114 is arranged on the second capillary structure 115, and the third capillary structure 112 is arranged on the top plate 111. When applied, the first capillary structure 132 is made of copper powder; the second capillary structure 115, the third capillary structure 112 and the fourth capillary structure 114 are all made of copper mesh. In actual application, the size of the first capillary structure 132 is 6*6*100mm. 3The porosity is 61%, the permeability is 58μ㎡, and the capillary climbing time is 100mm / 12s. The second capillary structure 115 has a size of 93*93*0.1mm 3 The second capillary structure 115 has a porosity of 60%, a permeability of 48 μ㎡, and a capillary climbing time of 100 mm / 15 s. The third capillary structure 112 includes two superimposed copper meshes, specifically, a copper mesh with a size of 93*93*0.1 mm. 3 200 mesh copper mesh and a size of 93*93*0.2mm 3 The third capillary structure 112 has a porosity of 58%, a permeability of 47 μ㎡, and a capillary climbing time of 100 mm / 12 s. The fourth capillary structure 114 has a size of 93*93*0.1 mm. 3 The fourth capillary structure has a porosity of 60%, a permeability of 48μ㎡, and a capillary climbing time of 100mm / 15s. Among them, the porosity indicates the proportion of the voids formed after the copper powder is accumulated to the total volume. The permeability indicates the ability of the fluid to pass through the copper powder accumulation. The capillary climbing time indicates the time required for the fluid to climb 100mm under the capillary action.

[0113] In this embodiment, the jig used to sinter the first capillary structure 132 and the second capillary structure 115 comprises: a lower jig 23 and a second upper jig 22 arranged opposite to each other, Figure 8 and Fig. 9 .

[0114] At least one protruding structure 221 is provided on the second upper fixture 22, and the protruding structure 221 is inserted into the mounting groove 231. Specifically, in order to ensure that the protruding structure 221 can be inserted into the mounting groove 231 exactly and will not press or damage the heat pipe 131 and the capillary structure thereon, the outer diameter of the protruding structure 221 = the diameter of the mounting groove 231 - 2 × the thickness of the heat pipe 131 - 2 × the thickness of the first capillary structure 132 - 2 × the thickness of the second capillary structure 115.

[0115] During the manufacturing process, the first capillary structure 132 is sintered on the inner wall of the heat pipe 131; then, the second capillary structure 115 is partially sintered on the bottom plate 116, and the remaining second capillary structure 115 is bent so that the bent second capillary structure 115 abuts against the first capillary structure 132; then, the heat pipe 131 is inserted into the mounting groove 231, the bottom plate 116 is placed in the limiting groove 204, and the protruding structure 221 of the upper fixture is inserted into the heat pipe 131, and the outer surface of the protruding structure 221 abuts against the bent second capillary structure 115, so as to squeeze the bent second capillary structure 115 and the first capillary structure 132 abutting against the second capillary structure 115. Through sintering, the first capillary structure 132 and the second capillary structure 115 are connected to each other.

[0116] The thermal performance of the temperature vapor chamber obtained in this embodiment is shown in Table 1.

[0117] Example 3

[0118] This embodiment adopts the above-mentioned steps SS11 to SS17 to manufacture the temperature equalizing plate, wherein step SS12 includes steps SS123 to SS126. When used, the mesh number of the copper powder is 60 to 100 meshes (particle size is 0.15 to 0.25 mm); the sintering temperature is: 900 to 980°C; the sintering time is about 4 hours, and the sintering is carried out in a nitrogen-hydrogen mixed gas protective atmosphere.

[0119] The structure of the temperature equalizing plate obtained in this embodiment is the same as that in embodiment 2.

[0120] The jig used in this embodiment is the same as the jig used in Embodiment 1.

[0121] The thermal performance of the temperature vapor chamber obtained in this embodiment is shown in Table 1.

[0122] Comparative Example 1

[0123] refer to Figure 1 The temperature equalizing plate of this comparative example includes: a cover body 11 , a support structure 113 , a capillary component and a heat dissipation structure 12 .

[0124] The cover body 11 includes a top plate 111 and a bottom plate 116, which are connected by a sealing process to form a vacuum chamber 14. In practical application, the size of the cover body 11 is 100*100 mm.

[0125] refer to Figure 4 The capillary assembly includes a second capillary structure 115 and a third capillary structure 112. The second capillary structure 115 is arranged on the bottom plate 116, and the third capillary structure 112 is arranged on the top plate 111. When used, the second capillary structure 115 and the third capillary structure 112 are both made of copper mesh. When used, the size of the second capillary structure 115 is 93*93*0.3mm 3 The porosity is 52%, the permeability is 45μ㎡, and the capillary climbing time is 100mm / 15s. The third capillary structure 112 includes two superimposed copper meshes, specifically, one with a size of 93*93*0.1mm 3 200 mesh copper mesh and a size of 93*93*0.2mm 3The third capillary structure 112 has a porosity of 58%, a permeability of 47 μ㎡, and a capillary climbing time of 100 mm / 12 s. The porosity indicates the proportion of the voids formed after the copper powder is accumulated to the total volume. The permeability indicates the ability of the fluid to pass through the copper powder accumulation. The capillary climbing time indicates the time required for the fluid to climb 100 mm under the capillary action.

[0126] The support structure 113 includes: at least one first support column 1132 and at least one second support column 1131. Specifically, the first surface of the first support column 1132 is connected to the second capillary structure 115, and the second surface of the first support column 1132 opposite to the first surface is connected to the third capillary structure 112. The top surface of the second support column 1131 is connected to the second capillary structure 115, and the bottom surface of the second support column 1131 opposite to the top surface is connected to the third capillary structure 112. When applied, the first support column 1132 is a copper powder column; the second support column 1131 is a copper column. It ensures that heat can be smoothly transferred between the second capillary structure 115 and the third capillary structure 112, while enhancing the structural stability between the two. In actual application, the number of the first support columns 1132 is 30, and the number of the second support columns 1131 is 120.

[0127] refer to Figure 3 The heat dissipation structure 12 includes a plurality of heat dissipation fins 121, each heat dissipation fin 121 is arranged at equal intervals and connected to the bottom plate. When used, the heat dissipation fin 121 is an aluminum sheet and is arranged vertically with the cover body 11. In actual application, the size of the heat dissipation fin 121 is 95*95mm. The spacing 122 between two adjacent heat dissipation fins 121 is 2mm. The number of heat dissipation fins 121 is 40 layers.

[0128] The thermal performance of the temperature vapor chamber of this comparative example is shown in Table 1.

[0129] Table 1 Thermal properties of the temperature evaporating plates of Examples 1-3 and Comparative Example 1

[0130]

[0131] Wherein, thermal resistance = (heat source temperature - ambient temperature) / test power.

[0132] The parameters in Table 1 were tested using the wind tunnel LW9015-500+LW3122TTP. During the test: the heat source was made of C1100 copper material with a size of 35*35mm; the test was conducted in the horizontal direction to help understand the heat dissipation performance of the vapor chamber when placed horizontally; a T-type thermocouple was used for temperature measurement, which is a commonly used high-precision temperature sensor; good contact between the heat source and the vapor chamber was ensured by pressing to reduce contact thermal resistance; the interface material was TMG60 with a thermal conductivity of 6W / m·K, which was used to fill the tiny gap between the heat source and the vapor chamber to improve heat transfer efficiency; the test lasted for 300 seconds to evaluate the thermal stability of the vapor chamber under long-term operation; the air volume during the test was 40cfm (cubic feet per minute) to simulate the air flow conditions in actual applications; the target thermal resistance R did not exceed 0.12℃ / W.

[0133] Although the embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and cannot be construed as limiting the present invention.

[0134] Without departing from the principles and purpose of the present invention, the above embodiments may be changed, modified, replaced and modified within the scope of the invention, and all such changes should fall within the scope of protection of the claims of the present invention.

Claims

1. A method for manufacturing a temperature equalizing plate, characterized in that: The following steps are involved: At least one connection port is opened on the bottom plate, a first end of the heat pipe is welded to the connection port, and a second end of the heat pipe is sealed; Sintering a first capillary structure on the inner surface of the heat pipe, sintering a second capillary structure on the upper surface of the bottom plate, and connecting the first capillary structure and the second capillary structure to each other; sintering the third capillary structure on the top plate; Connecting one side of the support column to the second capillary structure, and connecting the other side of the support column to the third capillary structure; Welding the periphery of the top plate and the bottom plate to form a vacuum cavity with the heat pipe; The heat dissipation structure is welded on the heat pipe.

2. The method for manufacturing a temperature homogenizing plate according to claim 1, characterized in that: The welding is a laser welding process.

3. The method for manufacturing a temperature homogenizing plate according to claim 1, characterized in that: The first capillary structure is sintered on the inner surface of the heat pipe, the second capillary structure is sintered on the upper surface of the bottom plate, and the first capillary structure and the second capillary structure are connected to each other, comprising the following steps: Putting the welded bottom plate and heat pipe into a jig, and filling the jig with copper powder so that the copper powder is laid on the upper surface of the bottom plate and the inner surface of the heat pipe; The fixture system is placed in a high-temperature sintering furnace to obtain a first capillary structure and a second capillary structure connected to each other, wherein the second capillary structure is sintered on the upper surface of the base plate, and the first capillary structure is sintered on the inner surface of the heat pipe.

4. The method for manufacturing a temperature homogenizing plate according to claim 1, characterized in that: The first capillary structure is sintered on the inner surface of the heat pipe, the second capillary structure is sintered on the upper surface of the bottom plate, and the first capillary structure and the second capillary structure are connected to each other, comprising the following steps: Put the welded bottom plate and heat pipe into a jig, and place the second capillary structure portion on the upper surface of the bottom plate; The second capillary structure is partially bent so that the bent portion is disposed opposite to the inner surface of the heat pipe, and the distance between the bent portion and the inner surface of the heat pipe is equal to the thickness of the first capillary structure; Filling the jig with copper powder so that the copper powder is laid on the inner surface of the heat pipe; The fixture system is placed in a high-temperature sintering furnace to obtain a first capillary structure, which is sintered on the inner surface of the heat pipe, a portion of the second capillary structure is sintered on the upper surface of the base plate, and a portion of the second capillary structure is sintered on the first capillary structure.

5. The method for manufacturing a temperature homogenizing plate according to claim 1, characterized in that: The first capillary structure is sintered on the inner surface of the heat pipe, the second capillary structure is sintered on the upper surface of the bottom plate, and the first capillary structure and the second capillary structure are connected to each other, comprising the following steps: Putting the heat pipe into a jig and filling the jig with copper powder so that the copper powder is laid on the inner surface of the heat pipe, then putting the jig system into a high-temperature sintering furnace to obtain a first capillary structure, and the first capillary structure is sintered on the inner surface of the heat pipe; The second capillary structure is partially placed on the upper surface of the base plate, and the second capillary structure is partially bent so that the bent portion abuts against the first capillary structure, and the fixture system is placed in a high-temperature sintering furnace so that part of the second capillary structure is sintered on the upper surface of the base plate and part of the second capillary structure is sintered on the first capillary structure.

6. The method for manufacturing a temperature homogenizing plate according to claim 3, characterized in that: The relationship between copper powder diameter and product parameters of capillary structures made of copper powder includes: As the copper powder diameter decreases, the porosity of the capillary structure generally shows a decreasing trend; As the diameter of copper powder decreases, the capillary climbing time of the capillary structure increases; The porosity of the capillary structure is positively correlated with the permeability of the capillary structure.

7. The method for manufacturing a temperature homogenizing plate according to claim 1, characterized in that: The production method further comprises the following steps: The fourth capillary structure is sintered on the second capillary structure.

8. The method for manufacturing a temperature homogenizing plate according to claim 1, characterized in that: The step of connecting one side of the support column to the second capillary structure and the other side of the support column to the third capillary structure comprises the following steps: Sintering a first surface of a first support column on the second capillary structure, and sintering a second surface of the first support column opposite to the first surface on the third capillary structure; Sintering the top surface of the second support column on the second capillary structure, and sintering the bottom surface of the second support column opposite to the top surface on the third capillary structure; Among them, the first support column is a copper powder column, and the second support column is a copper column.

9. The method for manufacturing a temperature homogenizing plate according to claim 1, characterized in that: The step of welding the heat dissipation structure onto the heat pipe comprises: Welding holes are opened on the plurality of heat dissipation fins, and the plurality of heat dissipation fins are welded to the heat pipe at equal intervals through the welding holes to form a heat dissipation structure; Wherein, the heat sink fins are made of metal or non-metallic thermal conductive material.

10. A temperature equalizing plate, characterized in that: The temperature equalizing plate is manufactured by the manufacturing method according to any one of claims 1 to 9.

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