Etching factor measuring device

Abstract

The invention discloses an etching factor measuring device, and relates to the technical field of circuit board detection, and the etching factor measuring device comprises a machine table; the measuring table is movably arranged on the machine table; the displacement mechanism comprises a frame body, a first driving module and a second driving module, the frame body is arranged on the machine table, the first driving module is arranged on the frame body, and the second driving module is arranged on the first driving module; the camera shooting mechanism is arranged on the second driving module, and the camera shooting mechanism comprises a first camera, a point spectrum and a second camera; the technical scheme provided by the invention has the technical effects that the first camera and the point spectrum can be driven by the first driving module and the second driving module to detect the etching factor on the circuit board, so that the existing slicing method for detection is avoided, and the camera mechanism can conveniently detect the circuit board; and the detection efficiency of the detection device is improved.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board detection, and in particular to an etching factor measuring device. Background Art

[0002] During the etching process of the circuit board, side etching will occur on the circuit board. The ratio of the 2 times etching line thickness to the difference between the upper and lower line widths is called the etching factor. The formation of the etching factor is related to many factors such as the composition of the etching solution, temperature, stirring speed, time, and copper foil thickness. When the etching depth or etching width is too large, it will affect the application of the circuit board. Therefore, it is necessary to detect and monitor in time during the production process to ensure the product quality of the circuit board.

[0003] Since the etching depth / etching width are small, it is necessary to measure the size parameters and height parameters of the circuit board separately. The current method of measurement is generally slicing. Slicing measurement is a destructive test that requires workers to manually cut the circuit board vertically and measure it under a microscope. However, the slicing measurement method is too inefficient, which reduces the production efficiency of the circuit board. Summary of the invention

[0004] The main purpose of the invention is to provide an etching factor measuring device, aiming to improve the detection efficiency of the etching factor of a circuit board.

[0005] To achieve the above-mentioned purpose, the etching factor measuring device proposed in the present invention includes a machine platform; a measuring platform, which is movably arranged on the machine platform, and the measuring platform has a placement area for placing a circuit board; a displacement mechanism, including a frame, a first driving module and a second driving module, the frame is arranged on the machine platform, the first driving module is arranged on the frame, and the second driving module is arranged on the first driving module; and a camera mechanism, the camera mechanism is arranged on the second driving module, the camera mechanism is located above the placement area, so as to detect the etching factor of the circuit board, the camera mechanism includes a first camera, a point spectrum and a second camera, the first camera is respectively arranged with an interval along the first direction with the point spectrum and the second camera, and the point spectrum is located on the side of the second camera away from the measuring platform; the first driving module is used to drive the second driving module to move along the first direction, and the second driving module is used to drive the camera mechanism to move along the second direction; wherein, the first direction and the second direction intersect.

[0006] In one embodiment, the first camera includes a first microscope lens of a first magnification, the second camera includes a second microscope lens of a second magnification and a laser emitting unit, the first magnification is greater than the second magnification, the laser emitting unit is located on a side of the second microscope lens close to the measuring platform, and the laser emitting unit is tilted relative to the second microscope lens.

[0007] In one embodiment, the etching factor measuring device also includes a controller, the camera mechanism is used to detect the etching factor on the circuit board, the controller is electrically connected to the first microscope lens, the second microscope lens and the point spectrum, respectively, the first microscope lens is used to obtain images of the upper line width and the lower line width of the etching factor and feed back a first signal to the controller, the second microscope lens is used to photograph the QR code and Mark points of the circuit board for positioning and feed back a second signal to the controller, the point spectrum is used to obtain the point cloud line and feed back a third signal to the controller, and the controller is used to obtain the line height of the etching factor according to the third signal.

[0008] In one embodiment, the optical magnification of the first microscope lens is 10X to 20X, the focal length of the first microscope lens is 10 mm to 20 mm, and the numerical aperture of the first microscope lens is 0.28 to 0.29;

[0009] And / or, the depth of field of the first microscope lens is 1.7 to 3.5 μm, and the working distance of the first microscope lens is 30.8 to 34 mm.

[0010] In one embodiment, the imaging mechanism further includes an annular light source, which is located at the bottom end of the first micro lens, and is arranged around the outer circumference of the first micro lens, and the central axis of the annular light source and the central axis of the first micro lens are coaxially arranged along the second direction.

[0011] In one embodiment, the etching factor measuring device also includes a third driving module, which is arranged on a side of the second driving module close to the bottom end of the first microscope lens, and the third driving module is driven and connected to the annular light source. The third driving module is used to drive the annular light source to move along the second direction to adjust the distance between the annular light source and the first microscope lens.

[0012] In one embodiment, the third driving module includes a first driver and a first mounting seat, the first driver drivingly connects to the first mounting seat, the first mounting seat is movably disposed on the second driving module along the second direction, the annular light source is disposed on the first mounting seat, and the first driver is used to drive the first mounting seat to drive the annular light source to move along the second direction.

[0013] In one embodiment, the imaging mechanism further includes a point light source and a second mounting seat connected to each other, the first camera further includes a connecting seat, the first microscope lens is arranged on the connecting seat, the point light source and the second mounting seat are both located above the annular light source, and the second mounting seat is arranged on the connecting seat.

[0014] In one embodiment, a connecting portion is provided on a side of the connecting seat close to the second mounting seat, the second mounting seat is connected to the connecting portion, and the second mounting seat has an inclined portion on a side facing away from the first camera, the inclined portion is inclined from the point light source toward the side of the ring light source, and the inclined portion is used to refract the light generated by the point light source into the first camera.

[0015] In one embodiment, the etching factor measuring device also includes a vacuum device, the measuring platform has a plurality of through holes, the plurality of through holes are arranged in the placement area, the plurality of through holes are connected to the vacuum device, and the vacuum device is used to evacuate the plurality of through holes to a vacuum state.

[0016] The technical solution of the present invention can detect the etching factor on the circuit board under the drive of the first driving module and the second driving module by adopting the first camera and the point spectrum. The second camera can position the circuit board under the drive of the first driving module and the second driving module, thereby avoiding the existing slicing method for detection, thereby facilitating the camera mechanism to detect the circuit board, and further improving the detection efficiency of the detection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0018] Figure 1 A schematic structural diagram of an embodiment of an etching factor measuring device provided by the present invention;

[0019] Figure 2 A schematic structural diagram of a camera mechanism and a displacement mechanism in an embodiment of an etching factor measuring device provided by the present invention;

[0020] Figure 3 A schematic structural diagram of a second driving module and a camera mechanism in an embodiment of an etching factor measuring device provided by the present invention;

[0021] Figure 4This is a schematic structural diagram of a first camera and a point light source in an embodiment of an etching factor measurement device provided by the present invention.

[0022] Description of Figure Numbers:

[0023] 1. Machine; 2. Measuring table; 21. Placement area; 211. Through hole; 3. Displacement mechanism; 31. Frame; 32. First drive module; 33. Second drive module; 331. First sliding seat; 332. Second sliding seat; 333. Second drive; 4. Camera mechanism; 41. First camera; 411. First microscope lens; 412. Connecting seat; 4121. Connecting part; 42. Point spectrum; 43. Second camera; 431. Second microscope lens; 432. Laser emitting part; 44. Ring light source; 45. Point light source; 46. Second mounting seat; 461. Inclined part; 47. Mounting bracket; 471. First mounting position; 472. Second mounting position; 473. Third mounting position; 5. Third drive module; 51. First drive; 52. First mounting seat.

[0024] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0027] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0028] The invention provides an etching factor measuring device.

[0029] See also Figure 1 In one embodiment of the present invention, the etching factor measuring device includes a machine table 1, a measuring table 2, a displacement mechanism 3 and a camera mechanism 4; the measuring table 2 is movably arranged on the machine table 1, and the measuring table 2 has a placement area 21 for placing a circuit board; the displacement mechanism 3 includes a frame 31, a first driving module 32 and a second driving module 33, the frame 31 is arranged on the machine table 1, the first driving module 32 is arranged on the frame 31, and the second driving module 33 is arranged on the first driving module 32; and the camera mechanism 4 is arranged on the second driving module 33, and the camera mechanism 4 is located at the Above the placement area 21, for detecting the etching factor of the circuit board, the camera mechanism 4 includes a first camera 41, a point spectrum 42 and a second camera 43, the first camera 41 is spaced apart from the point spectrum 42 and the second camera 43 along the first direction, respectively, the point spectrum 42 is located on the side of the second camera 43 away from the measuring platform 2; the first driving module 32 is used to drive the second driving module 33 to move along the first direction, and the second driving module 33 is used to drive the camera mechanism 4 to move along the second direction; wherein the first direction and the second direction intersect.

[0030] The technical solution of the present invention can detect the etching factor on the circuit board driven by the first driving module 32 and the second driving module 33 by adopting the first camera 41 and the point spectrum 42. The second camera 43 can position the circuit board driven by the first driving module 32 and the second driving module 33, thereby avoiding the existing slicing method for detection, thereby facilitating the camera mechanism 4 to detect the circuit board, thereby improving the detection efficiency of the detection device.

[0031] In this embodiment, a first slider (not shown) is provided on the side of the measuring platform 2 away from the camera mechanism 4, and the machine 1 is provided with a first slide rail (not shown) that cooperates with the first slider. The first slider is movably provided on the first slide rail, so that the measuring platform 2 can be movably provided on the machine 1, so that it is more convenient for the measuring platform 2 to move to the right below the camera mechanism 4, so that it is more convenient for the camera mechanism 4 to detect the circuit board. By setting the measuring platform 2 movably provided on the machine 1, it is more convenient for the user to take out and put in the circuit board on the measuring platform 2, thereby improving the measurement efficiency of the detection device. The frame 31 can be set to be in the shape of a gantry, and the two ends of the bottom of the frame 31 are respectively provided on the machine 1, so as to improve the stability of the assembly of the first drive module 32 and the second drive module 33. By setting the camera mechanism 4 to be provided on the second drive module 33, the user can drive the second drive module 33 to move along the first direction by controlling the first drive module 32, thereby driving the camera mechanism 4 to move along the first direction. The detection device also includes a controller electrically connected to the displacement mechanism 3. The user can control the second drive module 33 to drive the camera mechanism 4 to move along the second direction, thereby adjusting the distance of the camera mechanism 4 relative to the circuit board, thereby improving the accuracy of the camera mechanism 4 in detecting the circuit board. The present application can efficiently obtain the data of the etching factor on the circuit board through the cooperation between the first camera 41, the second camera 43 and the point spectrum 42, thereby improving the detection efficiency of the etching factor of the circuit board. By using the point spectrum 42 to detect the data of the etching factor on the circuit board, the accuracy is higher and the cost is lower than that of using the line spectrum.

[0032] In this embodiment, the second driving module 33 further includes a first sliding seat 331, a second sliding seat 332 and a second driver 333. The first sliding seat 331 is movably disposed on the first driving module 32 along the first direction, and the second sliding seat 332 is movably disposed on the first sliding seat 331 along the second direction. The camera mechanism 4 is disposed on the second sliding seat 332, and the second driver 333 is drivingly connected to the second sliding seat 332. The second driver 333 is used to drive the second sliding seat 332 to move along the second direction, thereby making it easier for the camera mechanism 4 to move along the second direction.

[0033] In this embodiment, the camera mechanism 4 further includes a mounting bracket 47, which is disposed on the second driving module 33, and the mounting bracket 47 is provided with a first mounting position 471, a second mounting position 472, and a third mounting position 473. The first mounting position 471 and the second mounting position 472 are arranged along the first direction, and the third mounting position 473 and the second mounting position 472 are arranged along the moving direction of the measuring platform 2. The first mounting position 471 is used for the installation of the first camera 41, the second mounting position 472 is used for the installation of the second camera 43, and the third mounting position 473 is used for the installation of the point spectrum 42, so as to facilitate the position arrangement of the first camera 41, the second camera 43, and the point spectrum 42.

[0034] like Figure 3 As shown, the first camera 41 includes a first microscope lens 411 of a first magnification, the second camera 43 includes a second microscope lens 431 of a second magnification and a laser emitting unit 432, the first magnification is greater than the second magnification, the laser emitting unit 432 is located on a side of the second microscope lens 431 close to the measuring platform 2, and the laser emitting unit 432 is tilted relative to the second microscope lens 431.

[0035] In this embodiment, the first camera 41 adopts a first microscope lens 411 of a first magnification, and the first magnification is greater than the second magnification, so that the first camera 41 can clearly capture the etching factor of the circuit board, thereby improving the accuracy of the present application in detecting the etching factor of the circuit board. The second camera 43 adopts a second microscope lens 431 of a second magnification and a laser emitting unit 432, and the laser emitting unit 432 is used to illuminate the Mark points and the QR code on the circuit board, so that it is more convenient for the second microscope lens 431 to capture the Mark points and the QR code, thereby completing the positioning of the circuit board by the camera mechanism 4, thereby further improving the accuracy of the etching factor on the circuit board captured by the first camera 41. By setting the laser emitting unit 432 to be tilted relative to the second microscope lens 431, it is more convenient for the laser emitting unit 432 to illuminate the Mark points and the QR code on the circuit board.

[0036] In this embodiment, the etching factor measuring device also includes a controller, the camera mechanism 4 is used to detect the etching factor on the circuit board, the controller is electrically connected to the first microscope lens 411, the second microscope lens 431 and the point spectrum 42, respectively, the first microscope lens 411 is used to obtain images of the upper line width and the lower line width of the etching factor and feed back a first signal to the controller, the second microscope lens 431 is used to photograph the QR code and Mark point of the circuit board for positioning and feed back a second signal to the controller, the point spectrum 42 is used to obtain the point cloud line and feed back a third signal to the controller, and the controller is used to obtain the line height of the etching factor according to the third signal.

[0037] In this embodiment, the controller is used to detect whether the upper line width, lower line width and line height of the etching factor on the circuit board meet the production requirements, so that the user can promptly remove the circuit board that does not meet the production requirements, thereby ensuring the production quality of the circuit board. The upper line width and lower line width of the etching factor are photographed by the first microscope lens 411 and a first signal is formed to be fed back to the controller, thereby improving the accuracy of detecting the upper line width and lower line width of the etching factor. The second microscope lens 431 is used to photograph the QR code and the Mark point of the circuit board and a second signal is formed to be fed back to the controller, thereby improving the accuracy of the camera mechanism 4 in positioning the circuit board. Driven by the first driving module 32 and the second driving module 33, the point spectrum 42 moves while scanning and detecting the etching factor on the circuit board to form a point cloud line, and forms a third signal to be fed back to the controller, so as to facilitate the controller to measure the line height according to the point cloud line pairing point cloud map. The present application can efficiently measure the upper line width, lower line width and line height of the circuit board etching factor through the cooperation of the camera mechanism 4, the first drive module 32, the second drive module 33 and the controller, and calculate whether the etching factor of the circuit board meets the production requirements, thereby ensuring the product quality of the circuit board.

[0038] In this embodiment, the optical magnification of the first microscope lens 411 is 10X to 20X, the focal length of the first microscope lens 411 is 10 mm to 20 mm, the numerical aperture of the first microscope lens 411 is 0.28 to 0.29; and / or, the depth of field of the first microscope lens 411 is 1.7 to 3.5 microns, and the working distance of the first microscope lens 411 is 30.8 mm to 34 mm. By limiting the parameters of the first microscope lens 411, the upper and lower line width images taken by the first microscope lens 411 are clear and within a deviation of 0.5um from the true value, thereby improving the accuracy of the circuit board etching factor detection of the present application.

[0039] In this embodiment, the optical magnification of the first microscope lens 411 is 20X, the focal length of the first microscope lens 411 is 10 mm, the numerical aperture of the first microscope lens 411 is 0.29, the depth of field of the first microscope lens 411 is 1.7 μm, and the working distance of the first microscope lens 411 is 30.8 mm. By further limiting the parameters of the first microscope lens 411, the first microscope lens 411 can detect the size of the object to be measured at the level of 0.05 to 0.1 mm, thereby improving the image quality of the etching factor on the circuit board taken by the first microscope lens 411, thereby improving the accuracy of the present application in detecting the etching factor of the circuit board.

[0040] like Figure 2 and Figure 3As shown, the video recording mechanism 4 further includes a ring light source 44, which is located at the bottom end of the first micro lens 411, and is arranged around the outer circumference of the first micro lens 411, and the central axis of the ring light source 44 and the central axis of the first micro lens 411 are coaxially arranged along the second direction.

[0041] In this embodiment, the annular light source 44 is used to provide uniform ring light illumination for the first microscope lens 411, so that the surface features of the etching factor on the circuit board are displayed more clearly, and the annular light source 44 can also reduce reflections and shadows on the surface of the circuit board, thereby improving the clarity of the etching factor image taken by the first microscope lens 411.

[0042] In this embodiment, the annular light source 44 may include an annular light portion, and the end surface of the light portion that emits light may be an arc surface, so as to better focus the light source on the circuit board. The central axis of the light portion and the central axis of the first microlens 411 are located on the same straight line along the second direction, so that it is more convenient for the light portion to provide lighting for the first microlens 411.

[0043] like Figure 3 As shown, the etching factor measuring device also includes a third driving module 5, which is arranged on one side of the second driving module 33 close to the bottom end of the first micro lens 411, and the third driving module 5 drives the annular light source 44. The third driving module 5 is used to drive the annular light source 44 to move along the second direction to adjust the distance between the annular light source 44 and the first micro lens 411.

[0044] In this embodiment, the third driving module 5 is used to drive the annular light source 44 to move along the second direction, thereby adjusting the distance between the annular light source 44 and the circuit board, so that the annular light source 44 can use low-angle ring light for the first microscope lens 411 to photograph the lower line width of the etching factor, thereby improving the clarity of the lower line width characteristic image of the etching factor photographed by the first microscope lens 411.

[0045] like Figure 3 As shown, the third driving module 5 includes a first driver 51 and a first mounting seat 52, the first driver 51 is driven to connect the first mounting seat 52, the first mounting seat 52 is movably arranged on the second driving module 33 along the second direction, the annular light source 44 is arranged on the first mounting seat 52, and the first driver 51 is used to drive the first mounting seat 52 to drive the annular light source 44 to move along the second direction.

[0046] In this embodiment, in order to improve the stability of the connection between the annular light source 44 and the third driving module 5, the annular light source 44 is arranged on the first mounting seat 52, so that the annular light source 44 can move synchronously with the first mounting seat 52. The first driver 51 is used to drive the first mounting seat 52 to reciprocate along the second direction. The side of the first mounting seat 52 away from the annular light source 44 may be provided with a second slider (not shown in the figure), and the second driving module 33 may be provided with a second slide rail (not shown in the figure) matched with the second slider. The second slide rail is extended along the second direction, and the second slider is movably arranged on the second slide rail, so that the first mounting seat 52 is slidably arranged on the second driving module 33 along the second direction, thereby driving the annular light source 44 to move along the second direction.

[0047] like Figure 4 As shown, the camera mechanism 4 also includes a point light source 45 and a second mounting seat 46 that are connected to each other, the first camera 41 also includes a connecting seat 412, the first microscope lens 411 is arranged on the connecting seat 412, the point light source 45 and the second mounting seat 46 are both located above the ring light source 44, and the second mounting seat 46 is arranged on the connecting seat 412.

[0048] In this embodiment, the present application uses different light sources for the first microlens 411 to illuminate, thereby improving the clarity of the first microlens 411 photographing the characteristic image of the etching factor. The first microlens 411 is used to photograph the upper line width of the etching factor under the illumination light source provided by the point light source 45, thereby improving the clarity of the first microlens 411 photographing the upper line width characteristic image of the etching factor. The first microlens 411 is assembled on the connecting seat 412, and the second mounting seat 46 is arranged on the connecting seat 412, so that the point light source 45 and the first microlens 411 can stably illuminate and photograph.

[0049] like Figure 4 As shown, a connecting portion 4121 is provided on a side of the connecting seat 412 close to the second mounting seat 46, and the second mounting seat 46 is connected to the connecting portion 4121. The second mounting seat 46 has an inclined portion 461 on a side facing away from the first camera 41, and the inclined portion 461 is inclined from the point light source 45 toward the side of the ring light source 44, and the inclined portion 461 is used to refract the light generated by the point light source 45 into the first camera 41.

[0050] In this embodiment, in order to improve the stability of the connection between the connecting seat 412 and the second mounting seat 46, a connecting portion 4121 is provided on one side of the connecting seat 412 close to the second mounting seat 46, and the second mounting seat 46 is connected to the connecting portion 4121. The second mounting seat 46 is provided with an inclined portion 461, so that the light of the point light source 45 is more conveniently refracted into the first camera 41.

[0051] like Figure 1 As shown, the etching factor measuring device also includes a vacuum device, the measuring platform 2 has a plurality of through holes 211, the plurality of through holes 211 are arranged in the placement area 21, the plurality of through holes 211 are connected to the vacuum device, and the vacuum device is used to evacuate the plurality of through holes 211 to a vacuum state.

[0052] In this embodiment, the measuring table 2 for placing the circuit board is a vacuum adsorption measuring table 2, and a placement area 21 capable of adsorbing the circuit board is provided on the measuring table 2. The user places the circuit board on the placement area 21, and uses a vacuum device to draw a plurality of through holes 211 on the placement area 21 into a vacuum state, so that the circuit board is firmly attached to the measuring table 2, and the circuit board is more stably transported to the bottom of the camera mechanism 4, so as to avoid the vibration of the measuring table 2 affecting the focus and detection accuracy.

[0053] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An etching factor measuring device, characterized in that: include: Machine; A measuring table, movably arranged on the machine table, wherein the measuring table has a placement area for placing a circuit board; The displacement mechanism comprises a frame, a first driving module and a second driving module, wherein the frame is arranged on the machine platform, the first driving module is arranged on the frame, and the second driving module is arranged on the first driving module; as well as A camera mechanism, the camera mechanism is arranged on the second driving module, the camera mechanism is located above the placement area, and is used to detect the etching factor of the circuit board, the camera mechanism includes a first camera, a point spectrum, and a second camera, the first camera is respectively arranged with the point spectrum and the second camera in a first direction, and the point spectrum is located on a side of the second camera away from the measuring platform; The first driving module is used to drive the second driving module to move along the first direction, and the second driving module is used to drive the camera mechanism to move along the second direction; The first direction and the second direction intersect.

2. The etching factor measuring device according to claim 1, characterized in that: The first camera includes a first microscope lens with a first magnification, and the second camera includes a second microscope lens with a second magnification and a laser emitting unit. The first magnification is greater than the second magnification. The laser emitting unit is located on a side of the second microscope lens close to the measuring platform, and the laser emitting unit is tilted relative to the second microscope lens.

3. The etching factor measuring device according to claim 2, characterized in that: The etching factor measuring device also includes a controller. The camera mechanism is used to detect the etching factor on the circuit board. The controller is electrically connected to the first microscope lens, the second microscope lens and the point spectrum, respectively. The first microscope lens is used to obtain images of the upper line width and the lower line width of the etching factor and feed back a first signal to the controller. The second microscope lens is used to photograph the QR code and Mark points of the circuit board for positioning and feed back a second signal to the controller. The point spectrum is used to obtain point cloud lines and feed back a third signal to the controller. The controller is used to obtain the line height of the etching factor according to the third signal.

4. The etching factor measuring device according to claim 2, characterized in that: The optical magnification of the first microscope lens is 10X to 20X, the focal length of the first microscope lens is 10 mm to 20 mm, and the numerical aperture of the first microscope lens is 0.28 to 0.29; And / or, the depth of field of the first microscope lens is 1.7 to 3.5 μm, and the working distance of the first microscope lens is 30.8 to 34 mm.

5. The etching factor measuring device according to claim 2, characterized in that: The imaging mechanism further includes an annular light source, which is located at the bottom end of the first micro lens and is arranged around the outer circumference of the first micro lens. The central axis of the annular light source and the central axis of the first micro lens are coaxially arranged along the second direction.

6. The etching factor measuring device according to claim 5, characterized in that: The etching factor measuring device also includes a third driving module, which is arranged on a side of the second driving module close to the bottom end of the first micro lens, and the third driving module is driven and connected to the annular light source. The third driving module is used to drive the annular light source to move along the second direction to adjust the distance between the annular light source and the first micro lens.

7. The etching factor measuring device according to claim 6, characterized in that: The third driving module includes a first driver and a first mounting seat, the first driver is driven and connected to the first mounting seat, the first mounting seat is movably arranged on the second driving module along the second direction, the annular light source is arranged on the first mounting seat, and the first driver is used to drive the first mounting seat to drive the annular light source to move along the second direction.

8. The etching factor measuring device according to claim 5, characterized in that: The camera mechanism also includes a point light source and a second mounting seat connected to each other, the first camera also includes a connecting seat, the first microscope lens is arranged on the connecting seat, the point light source and the second mounting seat are both located above the annular light source, and the second mounting seat is arranged on the connecting seat.

9. The etching factor measuring device according to claim 8, characterized in that: A connecting portion is provided on a side of the connecting seat close to the second mounting seat, the second mounting seat is connected to the connecting portion, and the second mounting seat has an inclined portion on a side facing away from the first camera, the inclined portion is inclined from the point light source toward the side of the ring light source, and the inclined portion is used to refract the light generated by the point light source into the first camera.

10. The etching factor measuring device according to any one of claims 1 to 9, characterized in that: The etching factor measuring device also includes an exhaust device. The measuring platform has a plurality of through holes. The plurality of through holes are arranged in the placement area. The plurality of through holes are connected to the exhaust device. The exhaust device is used to exhaust the plurality of through holes to a vacuum state.

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