A control method of a driving circuit of a 3D ultrasonic power transmission fitting

Abstract

The application discloses a kind of transmission fittings 3D ultrasonic drive circuit and its switching control method, including, through digital signal generation module generation ultrasonic drive signal, utilize multistage delay control module to carry out phase and delay adjustment to drive signal;Through high-gain low-noise power amplification module amplifies drive signal, and is passed to high-speed switch control module, and adopts high-speed switch control module control signal switching, in turn excite each array element;Through control and synchronization module coordinates the operation of each module described above, realizes the accurate control of signal generation, processing, amplification and switching.The application adopts wavelet transform and sparse signal recovery algorithm in signal processing module, significantly enhances the resolution ability to small defect, overall provides a kind of efficient, reliable and flexible technical solution for the nondestructive testing of transmission fittings.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of nondestructive testing, and in particular to a control method of a driving circuit of 3D ultrasonic for power transmission fittings. BACKGROUND

[0002] With the large-scale development of power transmission systems and the increasing requirements for operational reliability, the quality detection of power transmission fittings is particularly important. Current power transmission fitting detection techniques mainly include appearance size detection, grip strength testing, and X-ray flaw detection technology. However, these traditional methods have many shortcomings, such as the inability of appearance size detection to reflect internal defect conditions, the destructive nature of grip strength testing and its inapplicability to in-service equipment, the bulkiness of X-ray flaw detection equipment, which is unsuitable for field high-altitude operations and poses radiation safety hazards. In addition, the resolution and analysis capabilities of traditional methods are limited, and they cannot fully meet the fine detection needs of modern power transmission equipment. Therefore, there is an urgent need for a high-resolution, flexible, reliable, and suitable nondestructive testing technology for complex working environments to replace existing methods. SUMMARY

[0003] In view of the above existing problems, the present application is proposed.

[0004] Therefore, the present application provides a control method of a driving circuit of 3D ultrasonic for power transmission fittings, which can achieve flexible beam control and high-resolution detection with low noise interference and high reliability through high-speed precise phase control, delay control, switch switching, and power amplification.

[0005] To solve the above technical problems, the present application provides the following technical solution, a control method of a driving circuit of 3D ultrasonic for power transmission fittings, comprising:

[0006] An ultrasonic driving signal is generated by a digital signal generation module, and a multi-stage delay control module is used to adjust the phase and delay of the driving signal;

[0007] The driving signal is amplified by a high-gain low-noise power amplification module and transmitted to a high-speed switch control module, and the high-speed switch control module is used to control signal switching to sequentially excite each array element;

[0008] The operation of each module is coordinated by a control and synchronization module to achieve precise control of signal generation, processing, amplification, and switching.

[0009] As a preferred scheme of the control method of the power transmission fitting 3D ultrasonic driving circuit, the digital signal generation module generates a driving signal with a frequency range of 1 MHz to 10 MHz by using a direct digital synthesizer, dynamically adjusts the frequency and amplitude of the signal through an internal control circuit, adapts to the material properties and structural morphology of different detection objects, and communicates with the control and synchronization module, sets the frequency range and amplitude through an external programming interface, and generates a driving signal meeting the ultrasonic detection requirements.

[0010] As a preferred scheme of the control method of the power transmission fitting 3D ultrasonic driving circuit, the multi-stage delay control module is composed of a plurality of digital delay units, each unit independently controls the signal delay of one transducer array element, and the delay unit is realized by a field programmable gate array (FPGA) or a programmable delay chip, and the precision of delay adjustment reaches nanoseconds.

[0011] The delay control module inserts delay in the signal propagation path, so that the signals of each array element have synchronous focusing characteristics, the input end of the delay control module is connected to the digital signal generation module, and the output end is connected to the high-gain low-noise power amplification module.

[0012] As a preferred scheme of the control method of the power transmission fitting 3D ultrasonic driving circuit, the high-gain low-noise power amplification module includes a wideband power amplifier with a working frequency covering a range of 1 MHz to 10 MHz, providing a signal gain of at least 30 dB, and the input end of the power amplifier is connected to the output end of the multi-stage delay control module, for amplifying the signal after delay adjustment to the power level required for excitation.

[0013] The power amplification module further includes an isolation circuit for separating the high-power output signal and the control signal to avoid interference from being transmitted to the control and synchronization module.

[0014] As a preferred scheme of the control method of the power transmission fitting 3D ultrasonic driving circuit, the high-speed switch control module includes a plurality of high-speed response MOSFET or GaN transistors, each transducer array element corresponds to an independent switch unit, and the switch unit controls the on-off of the excitation signal through the signal sent by the control and synchronization module.

[0015] The response time of the switch control module is nanoseconds, and the switch control module is connected with the high-gain low-noise power amplification module and sequentially transmits the excitation signal to each array element.

[0016] As a kind of preferred scheme of the control method of the driving circuit of 3D ultrasonic of power transmission fitting, wherein: the control and synchronization module is with FPGA unit as core, built-in high-precision clock source, for generating synchronization signal to coordinate the work of digital signal generation module, multistage delay control module and high-speed switch control module;

[0017] The module receives control instruction from external device through high-speed parallel data channel, and distributes phase adjustment and delay parameter to corresponding module, and control and synchronization module also carries out unified management to overall driving circuit through special communication interface, to realize accurate coordination of delay adjustment and switch switching.

[0018] As a kind of preferred scheme of the control method of the driving circuit of 3D ultrasonic of power transmission fitting, wherein: the FPGA unit includes, for completing local signal delay adjustment and excitation power control, receiving the instruction of control and synchronization module simultaneously, executing signal switching task, and local power management circuit is responsible for adjusting the power output level of transducer array element, to ensure that driving signal meets design requirements.

[0019] As a kind of preferred scheme of the control method of the driving circuit of 3D ultrasonic of power transmission fitting, wherein: the driving circuit is connected with external device through high-speed communication interface, and the communication interface includes SPI serial peripheral interface, I2C inter-integrated circuit communication or Ethernet interface, communication interface is used for data exchange between external device and control and synchronization module, can receive control instruction sent by external device and feedback working state of driving circuit;

[0020] The interface also supports remote configuration of distributed control module, to realize real-time adjustment and monitoring of array element excitation parameter.

[0021] A kind of computer equipment, including memory and processor, the memory is stored with computer program, characterized in that, the processor executes the step of the control method of the driving circuit of 3D ultrasonic of power transmission fitting when the computer program.

[0022] A kind of computer readable storage medium, it is stored with computer program thereon, characterized in that, the step of the control method of the driving circuit of 3D ultrasonic of power transmission fitting is realized when the computer program is executed by processor.

[0023] The application has the advantages that the application realizes accurate control and fast response of the 3D ultrasonic detection signal of the power transmission fitting by integrating a digital signal generation module, a multi-stage delay control module, a high-gain power amplification module, and a high-speed switching control module. The distributed control architecture significantly improves the modularity and flexibility of the system, adapting to the needs of different detection scenarios. Through the integration of multi-physical field detection modules, the application range of the detection method is expanded, and defects can be evaluated more comprehensively. In addition, the application adopts wavelet transform and sparse signal recovery algorithm in the signal processing module, which significantly enhances the resolution capability of small defects, and as a whole, provides an efficient, reliable and flexible technical solution for non-destructive testing of power transmission fittings. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0025] Figure 1 A control method flow chart of a driving circuit of a 3D ultrasonic of a power transmission fitting according to an embodiment of the present application is provided. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned purposes, features and advantages of the present application more apparent and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the drawings in the specification. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor should be within the scope of protection of the present application.

[0027] In the following description, many specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in other ways different from those described herein, and those skilled in the art can make similar generalizations without departing from the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0028] Secondly, the "one embodiment" or "embodiment" referred to herein means that the specific features, structures or characteristics can be included in at least one implementation of the present application. "In one embodiment" appearing in different places in the specification does not mean the same embodiment, nor is it an independent or alternative embodiment that excludes other embodiments.

[0029] The application is described in detail in combination with the schematic diagram. In the detailed description of the embodiments of the application, the cross-sectional view of the device structure is partially enlarged without the general proportion for the convenience of illustration, and the schematic diagram is only an example, which should not limit the scope of protection of the application herein. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in actual production.

[0030] Meanwhile, in the description of the application, it should be noted that the terms "upper, lower, inner and outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the application. In addition, the terms "first, second or third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0031] Unless otherwise specifically defined and limited in the application, the terms "mounting, connecting, connecting" should be broadly understood, for example: it can be fixed connection, detachable connection or integral connection; it can also be mechanical connection, electrical connection or direct connection, it can also be indirectly connected through intermediate medium, or the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0032] Embodiment 1, reference Figure 1 As the first embodiment of the application, the embodiment provides a control method of a power transmission fitting 3D ultrasonic driving circuit, comprising:

[0033] S1: generating an ultrasonic driving signal through a digital signal generation module, and adjusting the phase and delay of the driving signal by using a multi-stage delay control module.

[0034] S2: amplifying the driving signal by a high-gain low-noise power amplification module, and transmitting it to a high-speed switch control module, and using the high-speed switch control module to control signal switching to sequentially excite each array element.

[0035] S3: coordinating the operation of the above modules by a control and synchronization module to realize accurate control of signal generation, processing, amplification and switching.

[0036] The digital signal generation module includes a direct digital synthesizer for generating a driving signal with a frequency range of 1 MHz to 10 MHz, and dynamically adjusting the frequency and amplitude of the signal through an internal control circuit to adapt to the material properties and structural morphology of different detection objects. At the same time, the digital signal generation module is in communication connection with the control and synchronization module, and the frequency range and amplitude are set through an external programming interface, and a driving signal meeting the ultrasonic detection requirements is generated.

[0037] The multi-stage delay control module is composed of multiple digital delay units, each unit independently controls the signal delay of one transducer array element, the delay unit is realized by a field programmable gate array (FPGA) or a programmable delay chip, and the precision of delay adjustment reaches nanoseconds.

[0038] The delay control module inserts delay in the signal propagation path, so that the signal of each array element has synchronous focusing characteristics, the input end of the delay control module is connected with the digital signal generation module, and the output end is connected to the high-gain low-noise power amplification module.

[0039] The high-gain low-noise power amplification module includes a wideband power amplifier, the working frequency covers the range of 1 MHz to 10 MHz, and provides a signal gain of at least 30 dB, the input end of the power amplifier is connected to the output end of the multi-stage delay control module, and is used to amplify the signal after delay adjustment to the power level required for excitation.

[0040] The power amplification module also includes an isolation circuit for separating high-power output signals and control signals to avoid interference from being transmitted to the control and synchronization module.

[0041] The high-speed switch control module includes multiple high-speed response MOSFETs or GaN transistors, each transducer array element corresponds to an independent switch unit, and the switch unit controls the on-off of the excitation signal through the signal sent by the control and synchronization module.

[0042] The response time of the switch control module is nanoseconds, and the switch control module is connected with the high-gain low-noise power amplification module and sequentially transmits the excitation signal to each array element.

[0043] The control and synchronization module takes the FPGA unit as the core and has a built-in high-precision clock source for generating synchronization signals to coordinate the work of the digital signal generation module, the multi-stage delay control module and the high-speed switch control module.

[0044] The module receives control instructions from external devices through a high-speed parallel data channel, and distributes phase adjustment and delay parameters to corresponding modules, and the control and synchronization module also uniformly manages the overall driving circuit through a special communication interface to realize accurate coordination of delay adjustment and switch switching.

[0045] The FPGA unit includes a local signal delay adjustment and excitation power control, receives instructions from the control and synchronization module, and performs signal switching tasks, and a local power management circuit is responsible for adjusting the power output level of the transducer array element to ensure that the driving signal meets the design requirements.

[0046] The driving circuit is connected with external equipment through a high-speed communication interface, and the communication interface includes an SPI serial peripheral interface, an I2C inter-integrated circuit communication, or an Ethernet interface.

[0047] The interface also supports remote configuration of the distributed control module, realizing real-time adjustment and monitoring of the array element excitation parameters.

[0048] The driving circuit further includes a multi-physical field detection module composed of an infrared thermal imaging sensor or an electromagnetic induction sensor. The multi-physical field detection module works together with the ultrasonic signal acquisition module to simultaneously acquire the thermal response signal and electromagnetic characteristic signal of the material. The output end of the module is connected with the central data processing system through a high-speed data channel, and the detection signal is input to a unified analysis platform for data processing and result output.

[0049] The driving circuit includes a signal processing module, which performs multi-scale analysis on the collected ultrasonic signal through wavelet transform or sparse signal recovery algorithm. The input end of the signal processing module is connected with the output end of the ultrasonic signal acquisition module and the multi-physical field detection module, which is used to remove noise in the signal and enhance the characteristics of micro defects. The processed signal is output to the control and synchronization module through a data interface for further use.

[0050] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced equivalently without departing from the spirit and scope of the present application, and they should be covered in the scope of the claims of the present application.

[0051] Embodiment 2, the second embodiment of the present application, which is different from the previous embodiment is:

[0052] If the functions are implemented in the form of software function units and sold or used as independent products, they can be stored in a computer readable storage medium. Based on this understanding, the technical solutions of the present application essentially or the parts of the prior art that make contributions or parts of the technical solutions can be embodied in the form of software products. The computer software product is stored in a storage medium and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk or an optical disk, and various media that can store program codes.

[0053] The present application is described with reference to flowcharts and / or block diagrams according to the methods, devices (systems), and computer program products of the embodiments of the present application. It should be understood that each flow and / or block in the flowcharts and / or block diagrams, and the combination of the flows and / or blocks in the flowcharts and / or block diagrams can be implemented by computer program instructions. These computer program instructions can be provided to a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing devices to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing devices generate a means for implementing the functions specified in the flowcharts and / or block diagrams. Figure 1 The functions specified in one flow or multiple flows and / or blocks Figure 1 The functions specified in one block or multiple blocks.

[0054] These computer program instructions can also be stored in a computer readable storage medium that can guide the computer or other programmable data processing devices to work in a specific way, so that the instructions stored in the computer readable storage medium produce a product including instruction means, which implements the functions specified in the flowcharts and / or block diagrams. Figure 1 The functions specified in one flow or multiple flows and / or blocks Figure 1 The functions specified in one block or multiple blocks.

[0055] These computer program instructions can also be loaded into a computer or other programmable data processing device, so that a series of operation steps are executed on the computer or other programmable device to produce a computer implemented process, so that the instructions executed on the computer or other programmable device provide a means for implementing the functions specified in the flowcharts and / or block diagrams. Figure 1 The functions specified in one flow or multiple flows and / or blocks Figure 1 The functions specified in one block or multiple blocks.

[0056] While the preferred embodiments of the application have been described, additional variations and modifications can be made to these embodiments by those skilled in the art once they have the benefit of the present disclosure without departing from the spirit and scope of the application. Accordingly, it is intended that such additions and modifications be included within the scope of the application. It is the following claims, including any amendments thereto, which define the scope of the application.

[0057] Obviously, numerous modifications and variations of the present application are possible in light of the above teachings. It is therefore to be understood that within the scope of the appended claims and their equivalents, the application can be practiced otherwise than as specifically described.

Claims

1. A control method of a driving circuit of a 3D ultrasonic power transmission fitting, characterized by, The application relates to an ultrasonic driving circuit, which comprises the following modules: a digital signal generation module, a multi-stage delay control module, a high-gain low-noise power amplification module and a high-speed switch control module. The ultrasonic driving circuit generates an ultrasonic driving signal through the digital signal generation module, adjusts the phase and delay of the driving signal through the multi-stage delay control module, amplifies the driving signal through the high-gain low-noise power amplification module, and controls the signal switching through the high-speed switch control module to sequentially excite each transducer array element. The control and synchronization module coordinates the operation of the above modules to realize accurate control of signal generation, processing, amplification and switching. The digital signal generation module generates a driving signal with a frequency range of 1 MHz to 10 MHz by using a direct digital synthesizer, dynamically adjusts the frequency and amplitude of the signal through an internal control circuit to adapt to the material properties and structural morphology of different detection objects, and is in communication connection with the control and synchronization module to set the frequency range and amplitude through an external programming interface and generate a driving signal meeting the ultrasonic detection requirements. The multi-stage delay control module is composed of multiple digital delay units, each unit independently controls the signal delay of one transducer array element, the delay unit is realized by a field programmable gate array (FPGA) or a programmable delay chip, and the delay adjustment precision reaches the nanosecond level. The multi-stage delay control module inserts delay in the signal propagation path, so that the signals of each transducer array element have synchronous focusing characteristics, the input end of the delay control module is connected with the digital signal generation module, and the output end is connected with the high-gain low-noise power amplification module. The high-gain low-noise power amplification module comprises a wideband power amplifier with a working frequency covering 1 MHz to 10 MHz and providing a signal gain of at least 30 dB, the input end of the power amplifier is connected with the output end of the multi-stage delay control module, and is used for amplifying the delay-adjusted signal to the power level required for excitation. The power amplification module further comprises an isolation circuit for separating the high-power output signal and the control signal to avoid interference from being transmitted to the control and synchronization module. The high-speed switch control module comprises multiple high-speed response MOSFETs or GaN transistors, each transducer array element corresponds to an independent switch unit, and the switch unit is controlled by the signal transmitted by the control and synchronization module to control the on-off of the excitation signal. The response time of the switch control module is in the nanosecond level, the switch control module is connected with the high-gain low-noise power amplification module, and sequentially transmits the excitation signal to each array element. The control and synchronization module takes an FPGA unit as the core and internally embeds a high-precision clock source to generate a synchronization signal to coordinate the operation of the digital signal generation module, the multi-stage delay control module and the high-speed switch control module. The module receives control instructions from external equipment through a high-speed parallel data channel, distributes phase adjustment and delay parameters to corresponding modules, and uniformly manages the overall driving circuit through a special communication interface to realize accurate coordination of delay adjustment and switch switching. ​ The FPGA unit includes a local signal delay adjustment and excitation power control, receives instructions of a control and synchronization module, and performs a signal switching task. The driving circuit is connected with external equipment through a high-speed communication interface, and the communication interface includes an SPI serial peripheral interface, an I2C integrated circuit communication interface, or an Ethernet interface. The communication interface also supports remote configuration of a distributed control module, and realizes real-time adjustment and monitoring of the excitation parameters of the transducer array elements. 2.A computer device, comprising a memory and a processor, wherein the memory stores a computer program, and the computer device is characterized in that, The processor executes the computer program to realize the steps of the control method of the driving circuit of the 3D ultrasonic power transmission fitting according to claim 1.

3. A computer-readable storage medium having stored thereon a computer program, characterized in that, The computer program is executed by the processor to realize the steps of the control method of the driving circuit of the 3D ultrasonic power transmission fitting according to claim 1.

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