Automatic test equipment for chip

Abstract

The invention discloses automatic testing equipment for a chip. The automatic testing equipment comprises a feeding device, a testing device, a transferring device and at least one clamping device. The at least one clamping device is used for moving the to-be-tested chip on the feeding device to the transfer device and moving the to-be-tested chip on the transfer device to the testing device for performance testing. The chip to be tested is moved through the clamping device, automatic testing of the chip on the automatic testing equipment is achieved, the manual participation rate in the chip testing process is reduced, and the chip testing efficiency is improved. Meanwhile, the transfer device is arranged for transferring the to-be-tested chip, so that the distance of moving the to-be-tested chip at one time by the clamping device can be reduced, the situations of movement error and the like caused by long-time movement of the clamping device are avoided, and the operation efficiency of the automatic test equipment is further improved.

Description

Technical Field

[0001] The present application relates to the field of chip testing technology, and in particular to an automatic chip testing device. Background Art

[0002] Chip, also known as microcircuit, microchip, integrated circuit (English: integrated circuit, IC). It refers to a silicon chip containing an integrated circuit. It is very small and is often part of a computer or other electronic device. Existing chips will be tested for performance after preparation to verify the performance and reliability of the chip.

[0003] Manual testing of the chip will increase the workload of the tester and cannot guarantee the accuracy of the chip test. Therefore, it is necessary to design an automatic chip test device to test the chip to reduce the workload of the tester and improve the accuracy of the chip test. Summary of the invention

[0004] In order to solve the above technical problems, the present application provides an automatic chip testing device, which is used to test the chip to be tested, and includes:

[0005] A loading device storing chips to be tested;

[0006] A testing device, spaced apart from the loading device, for performing a performance test on the chip to be tested;

[0007] A transfer device is arranged at intervals from the feeding device and the testing device, and the feeding device and the testing device are respectively arranged on two opposite sides of the transfer device;

[0008] At least one clamping device, disposed above the feeding device, the transfer device and the testing device;

[0009] The clamping device is used to move the chip to be tested at the loading device to the transfer device, and to move the chip to be tested on the transfer device to the testing device for performance testing.

[0010] The transfer device comprises a first transport component and a bearing seat, wherein the bearing seat is slidably disposed on the first transport component.

[0011] The testing device comprises a second transport component and at least one detection seat, wherein the at least one detection seat is slidably disposed on the second transport component, and an extension direction of the first transport component is perpendicular to an extension direction of the second transport component;

[0012] Wherein, the second transport component has a receiving position and a testing position, and the testing seat located at the receiving position is used to receive the chip to be tested on the supporting seat;

[0013] When the testing seat slides along the second transport assembly to the receiving position, the clamping device moves the chip to be tested on the supporting seat to the testing seat.

[0014] Wherein, the testing device further comprises:

[0015] A testing component, disposed above the second transport component and corresponding to the testing seat, and used for testing the chip to be tested on the testing seat;

[0016] A lifting assembly, the detection seat is arranged on the lifting assembly, and the lifting assembly is used to drive the detection seat to move along the height direction of the testing device to approach the testing assembly;

[0017] Among them, when the detection seat drives the chip to be tested to slide along the second transport assembly to the bottom of the test assembly, the detection seat is located at the test position, and the lifting assembly drives the detection seat at the test position to move along the height direction of the test device to make the detection seat close to the test assembly, and the test assembly contacts the chip to be tested on the detection seat to perform performance testing on the chip to be tested.

[0018] Wherein, the lifting assembly includes a bearing member, a first driving member and an encoder, the detection seat is arranged on the bearing member, the bearing member is connected to the first driving member, the first driving member is used to drive the bearing member to rotate so that the detection seat moves along the height direction of the test device, and the encoder is spaced apart from the detection seat and is used to detect the moving distance of the detection seat;

[0019] Wherein, the encoder is a magnetic encoder or a photoelectric encoder.

[0020] Wherein, the clamping device includes a supporting assembly and a plurality of clamping assemblies, wherein the plurality of clamping assemblies are arranged at intervals on the supporting assembly, and at least one of the plurality of clamping assemblies is used to move the chip to be tested at the loading device to the transfer device, and / or to move the chip to be tested on the transfer device to the testing device for performance testing.

[0021] Wherein, the clamping device further comprises a pressing assembly and a driving assembly, wherein the pressing assembly is movably arranged on the supporting assembly, each of the clamping jaw assemblies is respectively provided with a first pushing member, one end of the first pushing member is arranged on a side of the supporting assembly close to the pressing assembly, and the driving assembly is connected to the pressing assembly, and is used to drive the pressing assembly to move close to any of the first pushing members and press the first pushing members;

[0022] The driving component drives the pressing component to move close to any of the first pushing members, and after pressing the first pushing member, the clamping claw component corresponding to the first pushing member moves close to the chip to be tested to clamp the chip to be tested.

[0023] Wherein, the clamping device also includes a second pushing member, which is connected to the multiple clamping jaw assemblies. After the driving assembly drives the pressing assembly to press the second pushing member, all the clamping jaw assemblies move close to the chip to be tested to clamp the chip to be tested.

[0024] Wherein, the feeding device comprises:

[0025] A material bin, used for storing a material tray loaded with the chip to be tested;

[0026] A placing component, arranged above the material bin and below the clamping device, for placing a material tray loaded with the chip to be tested;

[0027] A moving component is spaced apart from the silo and the placement component;

[0028] When the moving component moves to the bottom of the material bin, the moving component receives the material tray in the material bin and moves the material tray to the placement component, the clamping device clamps the chip to be tested in the material tray of the placement component and moves the chip to be tested to the transfer device.

[0029] Among them, the moving assembly includes a moving seat and a negative pressure member, and the negative pressure member is connected to the moving seat. After the moving seat moves to the bottom of the material bin and receives the material tray, the negative pressure member is used to provide negative pressure to the moving seat to fix the material tray and the chip to be tested in the material tray.

[0030] The placement assembly includes a limiting ring, a base and four moving parts, the limiting ring is arranged on the base, and the limiting ring is provided with four limiting grooves, the distance between any limiting groove and the adjacent limiting groove is equal, and the limiting groove is extended along the center close to the limiting ring;

[0031] The four moving parts are arranged on the base at intervals and are slidably arranged with the base. Each moving part is provided with a limiting rod, and the limiting rod is arranged in the corresponding limiting groove. The moving part is movably connected to the limiting ring through the cooperation of the limiting rod and the limiting groove.

[0032] Beneficial effects of the present application: Different from the prior art, the automatic testing equipment of the present application includes a loading device, a testing device, a transfer device and at least one clamping device. The loading device stores the chip to be tested, the testing device is spaced apart from the loading device, and is used to perform performance tests on the chip to be tested, the transfer device is spaced apart from the loading device and the testing device, and the loading device and the testing device are respectively arranged on two opposite sides of the transfer device, and at least one clamping device is used to move the chip to be tested at the loading device to the transfer device, and to move the chip to be tested on the transfer device to the testing device for performance testing. By moving the chip to be tested by the clamping device, the chip can be automatically tested on the automatic testing equipment, the manual participation rate in the chip testing process can be reduced, and the chip testing efficiency can be improved. At the same time, since a transfer device is provided for transferring the chip to be tested, the distance that the clamping device moves the chip to be tested at one time can be reduced, and the occurrence of movement errors caused by the long-term movement of the clamping device can be avoided, further improving the operating efficiency of the automatic testing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0034] in:

[0035] Figure 1 It is a structural schematic diagram of an embodiment of the automatic testing equipment of the present application;

[0036] Figure 2 It is a structural schematic diagram of an embodiment of the transfer device of the present application;

[0037] Figure 3 It is a structural schematic diagram of an embodiment of the test device of the present application;

[0038] Figure 4 It is a structural schematic diagram of an embodiment of the clamping device of the present application;

[0039] Figure 5 yes Figure 4 Schematic diagram of the structure of the local area B;

[0040] Figure 6It is a structural schematic diagram of an embodiment of a feeding device of the present application;

[0041] Figure 7 It is a structural schematic diagram of an embodiment of a mobile component of the present application;

[0042] Figure 8 It is a structural schematic diagram of an embodiment of a placement component of the present application.

[0043] Figure numbers: automatic testing equipment A; feeding device 1; silo 11; placing component 12; limiting ring 121; limiting groove 1211; base 122; moving member 123; limiting rod 1231; moving component 13; moving seat 131; testing device 2; second transport component 21; detection seat 22; testing component 23; transfer device 3; first transport component 31; supporting seat 32; clamping device 4; supporting component 41; clamping claw component 42; first pushing member 421; second pushing member 422; pressing component 43. DETAILED DESCRIPTION

[0044] The scheme of the embodiment of the present application is described in detail below in conjunction with the drawings of the specification.

[0045] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0046] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0047] The term "and / or" in this application is only a description of the association relationship of associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the objects associated before and after are in an "or" relationship. In addition, "many" in this article means two or more than two. In addition, the term "at least one" in this article means any combination of at least two of any one or more of a plurality of, for example, including at least one of A, B, and C, and can mean including any one or more elements selected from the set consisting of A, B, and C. In addition, the terms "first", "second", and "third" in this application are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.

[0048] See also Figure 1 , Figure 1 The automatic testing device A of the embodiment of the present application is used to test the chip to be tested, and includes a loading device 1, a testing device 2, a transfer device 3 and at least one clamping device 4.

[0049] Among them, the loading device 1 stores the chip to be tested, the testing device 2 is arranged at a distance from the loading device 1, and is used to perform performance tests on the chip to be tested; the transfer device 3 is arranged at a distance from the loading device 1 and the testing device 2, and the loading device 1 and the testing device 2 are respectively arranged on opposite sides of the transfer device 3; at least one clamping device 4 is arranged above the loading device 1, the transfer device 3 and the testing device 2. Then the clamping device 4 can be used to move the chip to be tested at the loading device 1 to the transfer device 3, and move the chip to be tested on the transfer device 3 to the testing device 2 for performance testing.

[0050] Through the cooperation of the loading device 1, the clamping device 4, the transfer device 3 and the testing device 2, the automation of the performance testing process of the chip to be tested is realized by moving the chip to be tested from the loading device 1 to the testing device 2, thereby reducing the manual participation rate in the testing process of the chip to be tested and improving the testing efficiency of the chip to be tested.

[0051] At the same time, when the clamping device 4 moves the chip to be tested from the loading device 1 to the testing device 2, the chip to be tested can be temporarily placed on the transfer device 3 to avoid the long-term movement of the clamping device 4 affecting the movement accuracy of the clamping device 4 and the risk of the chip to be tested shifting and falling during the long-term movement of the clamping device 4. The safety and movement accuracy of the clamping device 4 in the process of clamping and moving the chip to be tested are improved.

[0052] Optionally, in some embodiments, see Figure 2-3 , Figure 2 is a structural diagram of an embodiment of the transfer device of the present application, Figure 3 It is a structural diagram of an embodiment of the test device of the present application. In this embodiment, the transfer device 3 includes a first transport component 31 and a bearing seat 32, and the bearing seat 32 is slidably arranged on the first transport component 31; the test device 2 includes a second transport component 21 and at least one detection seat 22, and at least one detection seat 22 is slidably arranged on the second transport component 21, and the extension direction of the first transport component 31 is perpendicular to the extension direction of the second transport component 21.

[0053] The second transport component 21 has a receiving position and a testing position. The receiving position can be set at one end of the second transport component 21 close to the first transport component 31, and the testing seat 22 located at the receiving position is used to receive the chip to be tested on the supporting seat 32.

[0054] Specifically, the clamping device 4 can move the chip to be tested on the loading device 1 to the supporting seat 32 for temporary storage, and when the detection seat 22 slides along the second transport component 21 to the receiving position of the second transport component 21, that is, the detection seat 22 and the supporting seat 32 are spaced apart at this time, the clamping device 4 can move the chip to be tested on the supporting seat 32 to the detection seat 22, thereby reducing the moving path of the chip to be tested to the detection seat 22, and improving the moving efficiency of the chip to be tested.

[0055] Among them, Figure 2 As shown, the detection seats 22 may include two, and the corresponding second transport components 21 may also include two groups, and the two detection seats 22 are respectively slidably arranged on the corresponding second transport components 21. The two second transport components 21 are arranged parallel to one side of the first transport component 31 along the extension direction of the first transport component 31, and the two detection seats 22 are respectively moved to the receiving position of the second transport component 21 to receive the chip to be tested, and after receiving the chip to be tested, they move along the second transport component 21 to the detection position of the second transport component 21 to perform performance detection on the chip to be tested.

[0056] It can be understood that since the testing device 2 includes two testing seats 22, that is, while the performance test of the chip to be tested on one testing seat 22 can be implemented, the other idle testing seat 22 can be moved to the receiving position of the second transport component 21 to receive the chip to be tested, and after the performance test of the chip to be tested on the previous testing seat 22 is completed, the performance test of the chip to be tested received by itself is immediately performed, thereby improving the performance test efficiency of the testing device 2 on the chip to be tested.

[0057] In other embodiments, Figure 2 and Figure 3 As shown, the automatic testing equipment A may also include two testing devices 2, the two testing devices 2 are spaced apart and arranged on the same side of the first transport component 31 along the extension direction of the first transport component 31, and the transfer device 3 includes a plurality of first transport components 31 and a plurality of bearing seats 32;

[0058] Then, after the clamping device 4 moves the chip to be tested at the loading device 1 to one of the multiple supporting seats 32, the supporting seat 32 can be moved along the first transport component 31 to any corresponding area of ​​the two testing devices 2, and then the clamping device 4 can move the chip to be tested on the supporting seat 32 to the detection seat 22 located at the receiving position, so as to supply the chip to be tested to the testing device 2, thereby further improving the detection efficiency of the automatic testing equipment A for the chip to be tested.

[0059] Among them, the above-mentioned performance test of the chip can be a high and low temperature test of the chip. High and low temperature test refers to placing the chip in a high temperature or low temperature environment, performing functional tests on part or all of the functions of the chip, and analyzing the test results. The design and implementation of automatic test equipment A is intended to meet the performance test requirements of the chip in different environments, provide more accurate data support for the performance evaluation of the chip to be tested, and improve test efficiency.

[0060] Alternatively, if Figure 3 As shown, the test device 2 also includes a test assembly 23 and a lifting assembly. The test assembly 23 is arranged above the second transport assembly 21 and corresponds to the detection seat 22, and is used to detect the chip to be tested on the detection seat 22. Among them, the area corresponding to the second transport assembly 21 and the test assembly 23 is the test position mentioned above. The detection seat 22 is arranged on the lifting assembly, and the lifting assembly is used to drive the detection seat 22 to move along the height direction of the test device 2 to approach the test assembly 23.

[0061] Specifically, after receiving the chip to be tested, the detection seat at the receiving position drives the chip to be tested to slide along the second transport component 21 to the bottom of the test component 23. At this time, the detection seat 22 is located at the test position, and then the lifting component can drive the detection seat 22 at the test position to move along the height direction of the test device 2, so that the detection seat 22 is close to the test component 23, and the probe of the test component 23 contacts the chip to be tested on the detection seat 22 to perform a performance test on the chip to be tested. After the test component 23 has finished testing the chip to be tested, the lifting component can further drive the detection seat 22 to move away from the test component 23 to unload the chip to be tested after the test is completed.

[0062] Optionally, the lifting assembly can also be slidably disposed on the second transport assembly 21, and the detection seat 22 is slidably disposed on the second transport assembly 21 through the lifting assembly, and then when the detection seat 22 is located at the test position, the lifting assembly can drive the detection seat 22 to rise and fall.

[0063] In one embodiment, when the testing device 2 includes two detection sockets 22, the testing component 23 may include a base, a first test probe and a second test probe, the first test probe and the second test probe are arranged on both sides of the base, the first test probe is arranged corresponding to one of the detection sockets 22, and the second test probe is arranged corresponding to the other detection socket 22, the first test probe is used to perform performance testing on the chip to be tested on the corresponding detection socket 22, and the second test probe is used to perform performance testing on the chip to be tested on the corresponding detection socket 22.

[0064] Specifically, the first test probe and the second test probe of the test component 23 are used to press and contact with the chip to be tested so as to perform performance test on the chip to be tested. The first test probe and the second test probe are arranged on both sides of the base, and the test component 23 is used to perform performance test on the chips to be tested on the two detection seats 22 through the first test probe and the second test probe. It can be understood that in this embodiment, the chip to be tested on one detection seat 22 is tested by the first test probe, and the chip to be tested on the other detection seat 22 is tested by the second test probe, so that the chips to be tested on the two detection seats 22 can be tested for performance at the same time or in time-sharing, further improving the test efficiency of the test device 2.

[0065] In another embodiment, the test component 23 includes a base and a test probe, which is slidably connected to the base. The test probe is used to slide to correspond to the first detection seat 22 to perform a performance test on the chip to be tested on the first detection seat 22, and to slide to correspond to the second detection seat 22 to perform a performance test on the chip to be tested on the second detection seat 22.

[0066] Specifically, the test probe is slidably connected to the base, and the test probe can slide on the base so that the test probe is located above the test position of the first second transport component 21 or the test position of the second second transport component 21. The sliding track of the test probe on the base can be, but not limited to, a straight line, a semicircle, a circle, an ellipse, a square, a polygon or an irregular shape, and it can also be understood that a sliding track can be provided on the base, and the shape of the sliding track can be, but not limited to, a straight line, a semicircle, a circle, an ellipse, a square, a polygon or an irregular shape.

[0067] In this embodiment, two detection sockets 22 share one test probe to reduce the increase of parts and components and reduce costs. In addition, the test probe can be used to perform staggered time tests on the chips to be tested on the two detection sockets 22 to improve the test efficiency of the test device 2.

[0068] Optionally, the lifting assembly includes a bearing member, a first driving member and an encoder, the detection seat 22 is arranged on the bearing member, the bearing member is connected to the first driving member, and the first driving member is used to drive the bearing member to rotate so that the detection seat 22 moves along the height direction of the testing device 2; the encoder is spaced apart from the detection seat 22 and is used to detect the moving distance of the detection seat 22. Since the movement of the detection seat 22 is realized by the rotation of the bearing member, the encoder can be used to detect the rotation of the bearing member to realize the detection of the moving distance of the detection seat 22.

[0069] Specifically, the first driving member can be a device that can output kinetic energy, such as a motor or an electric cylinder. In a possible implementation, the bearing member can include a bearing and a rotating shaft; the lifting assembly also includes a seat body, the bearing is respectively connected to the detection seat 22 and the first driving member, the rotating shaft can be fixed on the seat body, and the first driving member drives the bearing to rotate around the rotating shaft, so that the bearing rises relative to the seat body and drives the detection seat 22 to move up, or the rotating shaft is respectively connected to the detection seat 22 and the first driving member, the bearing is fixed on the seat body, and the first driving member drives the rotating shaft to rotate relative to the bearing, so that the rotating shaft rises relative to the seat body and drives the detection seat 22 to move up.

[0070] The encoder is used to detect the mechanical rotation position of the bearing member and convert it into an electrical signal. Specifically, the lifting assembly may also include a power control circuit, which is connected to the encoder and the first drive member respectively, and the power control circuit is used to obtain the electrical signal of the rotation position of the bearing member detected by the encoder, and to perform power control on the first drive member based on the electrical signal, so as to realize the control and monitoring of the rotation accuracy of the bearing member. Through the above-mentioned method, the chip testing equipment of the present application can improve the accuracy of the rise of the detection seat 22, so as to ensure the accuracy of the contact position between the chip to be tested and the probe of the test assembly 23 after the detection seat 22 rises, so as to reduce the accident of the chip to be tested being squeezed and damaged due to excessive upward movement of the chip to be tested, and reduce the accident of invalid test of the chip to be tested due to insufficient upward movement of the chip to be tested.

[0071] The encoder of this embodiment is a magnetic encoder or a photoelectric encoder.

[0072] Specifically, the present embodiment can convert the mechanical displacement on the bearing part into a pulse or digital signal through the magneto-electric conversion of the magnetic encoder, for example, the rotation position of the bearing part can be detected through the Hall code disk (magnetic ring) and the Hall element. Alternatively, the present embodiment can also convert the mechanical displacement on the bearing part into a pulse or digital signal through the photoelectric conversion of the photoelectric encoder, for example, the rotation position of the bearing part can be detected through the change of the light-transmitting and light-opaque lines on the grating disk, thereby improving the rotation accuracy of the bearing part, thereby improving the docking accuracy between the chip to be tested and the test component 23, and improving the test effect of the automatic test equipment A.

[0073] Optionally, see Figure 4 and Figure 5 , Figure 4 is a structural schematic diagram of an embodiment of the clamping device of the present application, Figure 5 yes Figure 4Schematic diagram of the structure of the local area B. The clamping device 4 provided in the embodiment of the present application includes a support component 41 and a plurality of clamping components 42, the plurality of clamping components 42 are arranged on the support component 41 at intervals, and at least one clamping component 42 of the plurality of clamping components 42 is used to move the chip to be tested at the loading device 1 to the transfer device 3, and / or, to move the chip to be tested on the transfer device 3 to the test device 2 for performance testing.

[0074] The gripper assembly 42 refers to an important end effector in the field of industrial automation, which is mainly used in robots or other automation equipment to achieve accurate gripping and handling of objects. In the embodiment of the present application, the gripper assembly 42 is used to grip the chip to be tested.

[0075] Specifically, Figure 4 As shown, the support assembly 41 is used to support the clamping jaw assembly 42, wherein the support assembly 41 can be a support plate, etc. The extension direction of the plurality of clamping jaw assemblies 42 is parallel to the height direction of the automatic test equipment A, and is spaced apart on the surface of the support assembly 41 along a direction perpendicular to the height direction of the automatic test equipment A.

[0076] Then the clamping jaw assembly 42 can be raised and lowered in a direction parallel to the height direction of the automatic test equipment A to absorb the chip to be tested at the loading device 1. After the clamping jaw assembly 42 absorbs the chip to be tested, the clamping jaw assembly 42 returns to its original position, and the support assembly 41 can drive the clamping jaw assembly 42 with the chip to be tested to move to the transfer device 3. Then the clamping jaw assembly 42 is raised and lowered again to place the chip to be tested on the transfer device 3. Among them, the clamping jaw assembly 42 moves the chip to be tested at the transfer device 3 to the test device 2, which is the same step, so this application will not repeat it here.

[0077] It can be understood that the clamping jaw assembly 42 only moves up and down relative to the support assembly 41 in a direction parallel to the height of the automatic test equipment A, while the movement of the clamping jaw assembly 42 in a direction perpendicular to the height of the automatic test equipment A to approach the loading device 1, the transfer device 3 and the test device 2 is driven by the support assembly 41. This simplifies the movement of the clamping jaw assembly 42 and improves the efficiency of the clamping jaw assembly 42 in clamping the chip to be tested.

[0078] Furthermore, the clamping device 4 also includes a pressing assembly 43 and a driving assembly (not shown in the figure). The pressing assembly 43 is movably arranged on the supporting assembly 41. Each clamping jaw assembly 42 is respectively provided with a first pushing member 421. One end of the first pushing member 421 is arranged on a side of the supporting assembly 41 close to the pressing assembly 43. The driving assembly is connected to the pressing assembly 43 and is used to drive the pressing assembly 43 to move close to any first pushing member 421 and press the first pushing member 421.

[0079] Specifically, the driving component drives the pressing component 43 to move close to any first pushing member 421, and after pressing the first pushing member 421, the clamping jaw component 42 corresponding to the first pushing member 421 moves close to the chip to be tested to clamp the chip to be tested. By using multiple clamping jaw components 42 and corresponding first pushing members 421, precise clamping of a single chip to be tested is achieved, thereby improving the operational accuracy of clamping a single chip to be tested, and improving the reliability and flexibility of the clamping device 4.

[0080] Optionally, the clamping device 4 also includes a second pushing member 422, which is connected to multiple clamping jaw assemblies 42. After the driving assembly drives the pressing assembly 43 to press the second pushing member 422, all the clamping jaw assemblies 42 move close to the chip to be tested to clamp the chip to be tested.

[0081] Specifically, since the second pusher 422 is connected to multiple clamping assemblies 42, after the pressing assembly 43 presses the second pusher 422, all the clamping assemblies 42 connected to the second pusher 422 move closer to the chip to be tested to clamp the chip to be tested, thereby improving the clamping efficiency of the chip to be tested.

[0082] In one embodiment, the distance between a clamping jaw assembly 42 and an adjacent clamping jaw assembly 42 can be equal to the distance between a chip to be tested and an adjacent chip to be tested, so that when multiple clamping jaw assemblies 42 clamp the chip to be tested at the same time, each clamping jaw assembly 42 can clamp the chip to be tested, thereby improving the clamping efficiency of the clamping jaw assembly 42 on the chip to be tested.

[0083] It can be understood that, in the process of the clamping device 4 moving the chip to be tested at the loading device 1 to the transfer device 3, the pressing assembly 43 can press the second pushing member 422 so that all the clamping jaw assemblies 42 in the clamping device 4 clamp the chip to be tested, thereby improving the efficiency of moving the chip to be tested at the loading device 1 to the transfer device 3.

[0084] While the clamping device 4 moves the chip to be tested on the transfer device 3 to the test device 2, since each detection seat 22 can only receive one chip to be tested, the pressing component 43 can press one of the first pushing members 421 so that the corresponding clamping claw component 42 clamps a chip to be tested, and moves a chip to be tested on the transfer device 3 to the detection seat 22, so as to perform performance testing on the chip to be tested.

[0085] By cooperating with the pressing assembly 43 and the first pusher 421 and the second pusher 422, the clamping device 4 can clamp a single chip to be tested and multiple chips to be tested, thereby improving the flexibility and reliability of the clamping device 4. Furthermore, the automatic test equipment A can include only one clamping device 4 to move the chip to be tested from the loading device 1 to the transfer device 3, and to move the chip to be tested at the transfer device 3 to the test device 2.

[0086] In other possible embodiments, the automatic testing equipment A may also include two or more clamping devices 4, the first clamping device 4 is used to move the chip to be tested at the loading device 1 to the transfer device 3, and the second clamping device 4 can be used to move the chip to be tested at the transfer device 3 to the testing device 2. When the number of chips to be tested on the transfer device 3 is insufficient, since the second clamping device 4 can also clamp multiple chips to be tested, the second clamping device 4 can temporarily execute the operation of moving the chip to be tested at the loading device 1 to the transfer device 3, thereby avoiding the situation where the transfer device 3 is short of chips to be tested, affecting the testing efficiency of the testing device 2 on the chips to be tested, and improving the orderliness and reliability of the automatic testing equipment A.

[0087] When there is no vacant position for placing the chip to be tested in the transfer device 3, since the first clamping device 4 can also clamp a single chip to be tested, the first clamping device 4 can move the chip to be tested at the transfer device 3 to the test device 2, so as to improve the efficiency of moving the chip to be tested to the test device 2, thereby improving the testing efficiency of the test device 2 on the chip to be tested.

[0088] In summary, through the cooperation between the pressing component 43 and the first pushing member 421 and the second pushing member 422, the clamping device 4 can clamp a single chip to be tested and multiple chips to be tested, which can realize the reuse of the clamping device 4 in the automatic testing equipment A, improve the clamping efficiency of the clamping device 4 for the chip to be tested, improve the flexibility and reliability of the clamping device 4, and improve the operating efficiency and practicality of the automatic testing equipment A.

[0089] Optionally, see Figure 6 to Figure 8 , Figure 6 It is a structural schematic diagram of an embodiment of the feeding device of the present application. Figure 7 is a structural diagram of an embodiment of a mobile component of the present application, Figure 8 The loading device 1 provided in the embodiment of the present application comprises a silo 11 , a placing component 12 and a moving component 13 .

[0090] Among them, the silo 11 is used to store trays loaded with chips to be tested, the placement component 12 is arranged above the silo 11 and below the clamping device 4, and is used to place the trays loaded with chips to be tested, and the moving component 13 is spaced apart from the silo 11 and the placement component 12.

[0091] When the moving component 13 moves to the bottom of the silo 11, the moving component 13 receives the material tray in the silo 11 and moves the material tray to the placement component 12. The clamping device 4 clamps the chip to be tested in the material tray of the placement component 12 and moves the chip to be tested to the transfer device 3.

[0092] Specifically, since the material trays are stacked in sequence along the height direction of the material bin 11, it is difficult for the clamping device 4 to clamp the chip to be tested in the material bin 11, so a placement component 12 is provided to place the material trays to reduce the clamping difficulty of the clamping device 4. At the same time, since the placement component 12 is provided above the material bin 11, the moving distance of the clamping device 4 in the process of clamping the chip to be tested can be reduced, thereby improving the clamping efficiency of the clamping device 4 for the chip to be tested.

[0093] The moving component 13 is used to move the material tray in the material bin 11 to the placement component 12. In one embodiment, the moving component 13 includes a moving seat 131 and a negative pressure member (not shown). The negative pressure member is connected to the moving seat 131. After the moving seat 131 moves to the bottom of the material bin 11 and receives the material tray, the negative pressure member is used to provide negative pressure to the moving seat 131 to fix the material tray and the chip to be tested in the material tray.

[0094] Specifically, since the chips to be tested are neatly placed on the tray in advance, it is convenient for the clamping device 4 to clamp them. When the movable seat 131 receives and moves the tray, the chips to be tested in the tray may be displaced due to the bumps of the movable seat 131, which affects the subsequent clamping of the clamping device 4. Therefore, this embodiment proposes to set a negative pressure member to be connected with the movable seat 131, and provide negative pressure to the movable seat 131 when the movable seat 131 receives and moves the tray, so that the tray is tightly connected with the movable seat 131 under the action of negative pressure, so as to prevent the tray from falling on the movable seat 131 and improve the safety of the movable seat 131 in moving the tray. At the same time, the chips to be tested in the tray will be tightly connected with the tray under the action of negative pressure, so as to reduce the displacement of the chips to be tested and further improve the moving efficiency of the tray by the movable seat 131.

[0095] Optionally, in one embodiment, if Figure 8 As shown, the placement assembly 12 includes a limiting ring 121 , a base 122 and four moving parts 123 .

[0096] Among them, the limiting ring 121 is arranged on the base 122, and four limiting grooves 1211 are arranged on the limiting ring 121. The distance between any limiting groove 1211 and the adjacent limiting groove 1211 is equal, and the limiting groove 1211 is extended along the center close to the limiting ring 121; four moving parts 123 are arranged at intervals on the base 122, and are slidably arranged with the base 122. Each moving part 123 is provided with a limiting rod 1231, and the limiting rod 1231 is arranged in the corresponding limiting groove 1211. The moving part 123 is movably connected to the limiting ring 121 through the cooperation of the limiting rod 1231 and the limiting groove 1211.

[0097] Specifically, when the moving component 13 moves the material tray from the silo 11 to the placement component 12, the moving seat 131 can place the material tray in the limiting ring 121, and the limiting ring 121 can rotate relative to the base 122, and the limiting rod 1231 in the limiting groove 1211 will move accordingly, that is, the moving part 123 will slide relative to the base 122. Since the four moving parts 123 are connected to the limiting ring 121 through the limiting rod 1231, the four moving parts 123 will slide synchronously and abut the four sides of the material tray respectively to center the material tray.

[0098] by Figure 8 As an example, after the movable seat 131 places the material tray in the limiting ring 121, the limiting ring 121 will Figure 8 The viewing angle shown rotates counterclockwise, and the limiting rod 1231 in the limiting slot 1211 will follow and move from the first end of the limiting slot 1211 to the second end of the limiting slot 1211, and the movable member 123 will move close to the material tray under the drive of the limiting rod 1231. Since the four movable members 123 respectively abut the side edges of the material tray, the four movable members 123 can position and fix the material tray, and the rear clamping device 4 can clamp the chip to be tested on the material tray, thereby avoiding the situation in which the material tray shakes and affects the clamping efficiency of the clamping device 4 during the process of clamping the chip to be tested by the clamping device 4, thereby improving the operating efficiency of the automatic testing equipment A.

[0099] Furthermore, after the chip to be tested on the tray is clamped, the limiting ring 121 can rotate clockwise, and then the limiting rod 1231 in the limiting groove 1211 will move from the second end of the limiting groove 1211 to the first end of the limiting groove 1211, and the four moving parts 123 move in the direction away from the tray to release the unloaded tray.

[0100] In one embodiment, the placement component 12 may further include a motor, which may provide power for the rotation of the limiting ring 121 .

[0101] The following describes the operation process of automatic test equipment A:

[0102] The movable seat 131 moves to the bottom of the silo 11 to receive the material tray in the silo 11. After the movable seat 131 receives the material tray, the negative pressure member provides negative pressure to the movable seat 131. At the same time, the movable seat 131 drives the material tray to move to the placement component 12. When the movable seat 131 moves to the placement component 12, the negative pressure member stops providing negative pressure to the movable seat 131. The movable seat 131 moves the material tray to the limiting ring 121. The limiting ring 121 rotates to drive the four movable members 123 to respectively abut the sides of the material tray to center the material tray.

[0103] The support assembly 41 drives the multiple clamping assemblies 42 to move close to the placement assembly 12 until they move to the top of the placement assembly 12, the pressing assembly 43 presses the second pusher 422, and all the clamping assemblies 42 move close to the tray in the placement assembly 12 along the height direction of the automatic test equipment A to clamp the chip to be tested in the tray, and then the clamping assemblies 42 that clamp the chip to be tested return to their original positions, and the support assembly 41 drives the multiple clamping assemblies 42 to move close to the transfer device 3 until they move to the top of the transfer device 3. The clamping assemblies 42 that clamp the chip to be tested move downward to place the chip to be tested on the carrier 32.

[0104] The carrier 32 carrying the chip to be tested moves along the first transport component 31 and stays in the corresponding area of ​​the test device 2. The test seat 22 moves to the receiving position along the second transport component 21, and the support component 41 drives multiple clamping components 42 to move close to the carrier 32, and when located above the carrier 32, the pressing component 43 presses the first pusher 421, and the corresponding clamping component 42 moves close to the chip to be tested on the carrier 32 and clamps a single chip to be tested. The rear support component 41 drives the clamping component 42 to move above the test seat 22 located at the receiving position, and the clamping component 42 places the chip to be tested on the test seat 22.

[0105] The detection seat 22 that has received the chip to be tested moves along the second transport component 21 to the test position, and the lifting component drives the detection seat 22 to rise and move close to the test component 23. At the same time, the encoder of the lifting component detects the rising distance of the detection seat 22 until the chip to be tested on the detection seat 22 contacts the probe of the test component 23, and the test component 23 performs performance testing on the component to be tested.

[0106] After the chip to be tested is tested, the lifting assembly drives the test seat 22 to descend, and the rear test seat 22 drives the tested chip to be tested to return to the receiving position, and the clamping device 4 moves the tested chip to another support seat 32. If the test result of the chip to be tested is normal, the clamping device 4 moves the chip on the test seat 22 to the second support seat 32; if the test result of the chip to be tested is abnormal, the clamping device 4 moves the chip on the test seat 22 to the third support seat 32.

[0107] After the number of chips carried on the carrier 32 reaches a preset number, the clamping device 4 moves the chips on the second carrier 32 and the third carrier 32 to the corresponding empty trays on the placement component 12 to classify the chips that have been tested.

[0108] In summary, the automatic testing equipment A provided in the present application realizes the automation of the testing of the chip to be tested through the loading device 1, the clamping device 4, the transfer device 3 and the testing device 2. At the same time, the cooperation between the clamping device 4 and the transfer device 3 improves the orderliness of the automatic testing equipment A in moving the chip to be tested, improves the practicality and operation efficiency of the automatic testing equipment A, and improves the user experience of the automatic testing equipment A.

[0109] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An automatic chip testing device, characterized in that: Applied to test the chip to be tested, including: A loading device storing chips to be tested; A testing device, spaced apart from the loading device, for performing a performance test on the chip to be tested; A transfer device is arranged at intervals from the feeding device and the testing device, and the feeding device and the testing device are respectively arranged on two opposite sides of the transfer device; At least one clamping device, disposed above the feeding device, the transfer device and the testing device; The clamping device is used to move the chip to be tested at the loading device to the transfer device, and to move the chip to be tested on the transfer device to the testing device for performance testing.

2. The automatic testing equipment according to claim 1, characterized in that: The transfer device comprises a first transport component and a bearing seat, wherein the bearing seat is slidably disposed on the first transport component; The testing device comprises a second transport component and at least one detection seat, wherein the at least one detection seat is slidably disposed on the second transport component, and an extension direction of the first transport component is perpendicular to an extension direction of the second transport component; Wherein, the second transport component has a receiving position and a testing position, and the testing seat located at the receiving position is used to receive the chip to be tested on the supporting seat; When the testing seat slides along the second transport assembly to the receiving position, the clamping device moves the chip to be tested on the supporting seat to the testing seat.

3. The automatic testing equipment according to claim 2, characterized in that: The testing device also includes: A testing component, disposed above the second transport component and corresponding to the testing seat, and used for testing the chip to be tested on the testing seat; A lifting assembly, the detection seat is arranged on the lifting assembly, and the lifting assembly is used to drive the detection seat to move along the height direction of the testing device to approach the testing assembly; Among them, when the detection seat drives the chip to be tested to slide along the second transport assembly to the bottom of the test assembly, the detection seat is located at the test position, and the lifting assembly drives the detection seat at the test position to move along the height direction of the test device to make the detection seat close to the test assembly, and the test assembly contacts the chip to be tested on the detection seat to perform performance testing on the chip to be tested.

4. The automatic testing equipment according to claim 3, characterized in that: The lifting assembly includes a bearing member, a first driving member and an encoder, the detection seat is arranged on the bearing member, the bearing member is connected to the first driving member, the first driving member is used to drive the bearing member to rotate so that the detection seat moves along the height direction of the test device, and the encoder is spaced apart from the detection seat and is used to detect the moving distance of the detection seat; Wherein, the encoder is a magnetic encoder or a photoelectric encoder.

5. The automatic testing equipment according to claim 1, characterized in that: The clamping device includes a supporting assembly and a plurality of clamping assemblies, wherein the plurality of clamping assemblies are arranged at intervals on the supporting assembly, and at least one of the plurality of clamping assemblies is used to move the chip to be tested at the loading device to the transfer device, and / or to move the chip to be tested on the transfer device to the testing device for performance testing.

6. The automatic testing equipment according to claim 5, characterized in that: The clamping device further comprises a pressing assembly and a driving assembly, wherein the pressing assembly is movably arranged on the supporting assembly, each of the clamping jaw assemblies is respectively provided with a first pushing member, one end of the first pushing member is arranged on a side of the supporting assembly close to the pressing assembly, and the driving assembly is connected to the pressing assembly and is used to drive the pressing assembly to move close to any of the first pushing members and press the first pushing members; The driving component drives the pressing component to move close to any of the first pushing members, and after pressing the first pushing member, the clamping claw component corresponding to the first pushing member moves close to the chip to be tested to clamp the chip to be tested.

7. The automatic testing equipment according to claim 6, characterized in that: The clamping device also includes a second pushing member, which is connected to the multiple clamping jaw assemblies. After the driving assembly drives the pressing assembly to press the second pushing member, all the clamping jaw assemblies move close to the chip to be tested to clamp the chip to be tested.

8. The automatic testing equipment according to claim 1, characterized in that: The feeding device comprises: A material bin, used for storing a material tray loaded with the chip to be tested; A placing component, arranged above the material bin and below the clamping device, for placing a material tray loaded with the chip to be tested; A moving component is spaced apart from the silo and the placement component; When the moving component moves to the bottom of the material bin, the moving component receives the material tray in the material bin and moves the material tray to the placement component, the clamping device clamps the chip to be tested in the material tray of the placement component and moves the chip to be tested to the transfer device.

9. The automatic testing equipment according to claim 8, characterized in that: The moving assembly includes a moving seat and a negative pressure member, wherein the negative pressure member is connected to the moving seat. After the moving seat moves to the bottom of the material bin and receives the material tray, the negative pressure member is used to provide negative pressure to the moving seat to fix the material tray and the chip to be tested in the material tray.

10. The automatic testing equipment according to claim 8, characterized in that: The placement assembly includes a limiting ring, a base and four moving parts, the limiting ring is arranged on the base, and the limiting ring is provided with four limiting grooves, the distance between any limiting groove and the adjacent limiting groove is equal, and the limiting groove is extended along the center close to the limiting ring; The four moving parts are arranged on the base at intervals and are slidably arranged with the base. Each moving part is provided with a limiting rod, and the limiting rod is arranged in the corresponding limiting groove. The moving part is movably connected to the limiting ring through the cooperation of the limiting rod and the limiting groove.

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