Optical fiber vertical integration unit and manufacturing method

Abstract

The invention provides an optical fiber vertical integration unit and a manufacturing method, and the method comprises the steps: an optical fiber insertion core fixing pedestal which is disposed on a planar chip and carries an optical fiber insertion core, and the optical fiber insertion core is provided with an optical fiber monomer in a penetrating manner; wherein the first surface, close to the planar chip, of the optical fiber ferrule fixing base is provided with a colloid filling groove corresponding to a first size, and the second surface, far away from the planar chip, of the optical fiber ferrule fixing base is provided with an optical fiber ferrule limiting hole which is concentric with and communicated with the colloid filling groove and corresponds to a second size. The optical fiber insertion core penetrates through the optical fiber insertion core limiting hole to the end part of the optical fiber insertion core and extends into the colloid filling groove, the optical fiber monomer is abutted against the planar chip, and a high-temperature glue layer is arranged in an interval space formed between the optical fiber insertion core and the colloid filling groove.

Description

Technical Field

[0001] The invention relates to data processing technology, and in particular to an optical fiber vertical integration unit and a manufacturing method thereof. Background Art

[0002] The traditional integration method of optical fiber and planar chip is FA (Fiber Array) packaging solution, which is the mainstream technology in the industry today.

[0003] The so-called FA is an array formed by installing a bundle of optical fibers or an optical fiber ribbon on a substrate at specified intervals using a V-groove substrate. The processing process of the optical fiber array is to place the exposed optical fiber part with the optical fiber coating removed in the V-groove, pressurize it with a pressurizer component, bond it with an adhesive, and finally grind and polish the surface to the required accuracy.

[0004] The advantage of this method is its low cost, but it cannot meet the application requirements in special environments. In addition, the adhesives represented by resin glue have low working temperatures and are prone to aging, which makes the integration of optical fiber and planar chip prone to dislocation due to glue curing, high temperature resistance, corrosion resistance, and easy to fall off after long-term use. Summary of the invention

[0005] Based on the above problems, the present invention is proposed to provide an optical fiber vertical integration unit that overcomes the above problems or at least partially solves the above problems.

[0006] According to one aspect of the present invention, there is provided an optical fiber vertical integration unit, comprising: An optical fiber ferrule fixing base provided on the planar chip and equipped with an optical fiber ferrule, wherein an optical fiber monomer is inserted through the optical fiber ferrule; Among them, the first surface of the optical fiber ferrule fixing base close to the planar chip is provided with a colloid-filled groove corresponding to the first size, and the second surface of the optical fiber ferrule fixing base away from the planar chip is provided with an optical fiber ferrule limiting hole corresponding to the second size that is concentric with and connected to the colloid-filled groove, the optical fiber ferrule passes through the optical fiber ferrule limiting hole until the end of the optical fiber ferrule extends into the colloid-filled groove and the optical fiber monomer is abutted against the planar chip, and a high-temperature glue layer is provided in the spacing space formed between the optical fiber ferrule and the colloid-filled groove.

[0007] Optionally, in the method according to the present invention, two optical fiber end face observation grooves are arranged opposite to each other on the surface edge of the first surface of the optical fiber ferrule fixing base, and the two optical fiber end face observation grooves extend toward the center position of the corresponding colloid filling groove respectively until they are connected with the colloid filling groove.

[0008] Optionally, in the method according to the present invention, the optical fiber ferrule fixing base is made of at least one of aluminum oxide, fused quartz, silicon carbide and single crystal magnesium oxide.

[0009] Optionally, in the method according to the present invention, the optical fiber ferrule is made of at least one of quartz or ceramic.

[0010] Optionally, in the method according to the present invention, the optical fiber core is provided with an optical fiber transmission channel, the first end of the optical fiber transmission channel has a horn structure, and the optical fiber monomer is passed through the first end and the second end of the optical fiber transmission channel until the optical fiber monomer abuts against the planar chip.

[0011] According to another aspect of the present invention, there is provided a method for manufacturing an optical fiber vertical integration unit, comprising the following steps: Mechanically drilling holes is performed on the first surface and the second surface of the optical fiber ferrule fixing base, respectively, to obtain a colloid-filled groove with a first size corresponding to the opening of the first surface and an optical fiber ferrule limiting hole with a second size corresponding to the opening of the second surface, wherein the optical fiber ferrule limiting hole is concentric with and connected to the colloid-filled groove; Insert the optical fiber core into the optical fiber core limiting hole, and fill and solidify the interval space formed between the optical fiber core and the colloid filling groove based on the high temperature glue layer; After the high-temperature adhesive layer is filled and cured, the planar chip is fixed to the first surface corresponding to the optical fiber ferrule fixing base; The optical fiber monomer is passed through the optical fiber ferrule until the end of the optical fiber monomer abuts against a side of the planar chip close to the optical fiber ferrule fixing base.

[0012] Optionally, in the method according to the present invention, the space formed between the optical fiber ferrule and the colloid-filled groove is filled and cured based on the high-temperature glue layer, comprising: Filling the high temperature adhesive layer into the space formed between the optical fiber ferrule and the colloid filling groove, and performing a static operation on the high temperature adhesive layer for a preset static time at room temperature; After the static operation is completed, a first baking operation is performed on the high-temperature adhesive layer at a preset first baking temperature for a preset first baking time; After the preset first baking operation is completed, a second baking operation is performed on the high temperature adhesive layer at a preset second baking temperature for a preset second baking time; After the second baking operation is completed, the high-temperature adhesive layer is naturally cooled.

[0013] Optionally, in the method according to the present invention, fixing the planar chip to the first surface corresponding to the optical fiber ferrule fixing base comprises: Determine welding points corresponding to a preset welding number and at preset distances from the groove body contour on the first surface of the optical fiber ferrule fixing base around the groove body contour of the colloid-filled groove; Perform welding operations on each welding point based on femtosecond laser welding, so that the planar chip is fixed to the second surface corresponding to the optical fiber ferrule fixing base; After the femtosecond laser welding is completed, the optical fiber ferrule fixing base and the planar chip are cleaned.

[0014] Optionally, in the method according to the present invention, performing a cleaning operation on the optical fiber ferrule fixing base and the planar chip includes: Performing organic cleaning on the optical fiber ferrule fixing base and the planar chip; After the organic cleaning is completed, the optical fiber ferrule fixing base and the planar chip are inorganically cleaned; After the inorganic cleaning is completed, a nitrogen-based drying operation is performed on the optical fiber ferrule fixing base and the planar chip.

[0015] Optionally, in the method according to the present invention, the optical fiber ferrule fixing base and the planar chip are organically cleaned, comprising: Performing acetone-based organic cleaning on the optical fiber ferrule fixing base and the planar chip for a preset first cleaning time; After the acetone-based organic cleaning is completed, the optical fiber ferrule fixing base and the planar chip are subjected to ethanol-based organic cleaning for a preset second cleaning time. Optionally, in the method according to the present invention, inorganic cleaning is performed on the optical fiber ferrule fixing base and the planar chip, comprising: Performing inorganic cleaning of the optical fiber ferrule fixing base and the planar chip with a first inorganic mixed liquid for a preset third cleaning time at a preset first cleaning temperature, wherein the first inorganic mixed liquid includes concentrated sulfuric acid and hydrogen peroxide corresponding to a preset first mixing ratio; After the inorganic cleaning based on the first inorganic mixed liquid is completed, the optical fiber core fixing base and the planar chip are subjected to inorganic cleaning based on the second inorganic mixed liquid for a preset fourth cleaning time at a preset second cleaning temperature, wherein the second inorganic mixed liquid includes ammonia water, hydrogen peroxide and water corresponding to a preset second mixing ratio; After the inorganic cleaning based on the second inorganic mixed liquid is completed, the optical fiber core fixing base and the planar chip are rinsed with deionized water.

[0016] According to the solution of the present invention, a high-temperature adhesive layer is provided between the optical fiber ferrule fixing base and the optical fiber ferrule, thereby avoiding the problems of low working temperature, easy aging, corrosion resistance and the like of traditional organic adhesives, which may lead to reduced integration accuracy and insufficient reliability. The high-temperature adhesive layer can remain stable in a high-temperature environment, thereby ensuring that the vertical integration of the optical fiber and the planar chip is more secure, and reducing the risk of misalignment and falling off due to aging or deformation of the colloid. In addition, by providing an optical fiber end face observation groove on the optical fiber ferrule fixing base, the installation posture of the optical fiber monomer can be conveniently observed, thereby ensuring that the optical fiber monomer is in vertical contact with the planar chip, thereby improving the efficiency of optical data transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A front view of an optical fiber vertical integration unit according to an embodiment of the present invention is shown; Figure 2 shows a cross-sectional view of the optical fiber vertical integration unit in this embodiment; Figure 3 A flow chart showing a method for manufacturing an optical fiber vertical integration unit according to another embodiment of the present invention; Figure 4 A schematic diagram of a plurality of optical fiber ferrule fixing bases after fixing the optical fiber ferrules in this embodiment is shown; Figure 5 : shows a schematic structural diagram of the optical fiber ferrule fixing base and the planar chip after femtosecond laser welding in this embodiment; Figure 6 The microscopic result image of the femtosecond laser bonding interface in this embodiment is shown; Figure 7 A real-life picture of the optical fiber end face observation groove in this embodiment is shown. DETAILED DESCRIPTION

[0018] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0019] In order to solve the problems existing in the above background technology, the inventor proposes the solution of the present invention. Specifically, the present invention provides an optical fiber vertical integration unit and a manufacturing method thereof.

[0020] Figure 1 FIG. 4 shows a schematic structural diagram of an optical fiber vertical integration unit according to an embodiment of the present invention. Figure 1As shown, the optical fiber vertical integration unit may include an optical fiber ferrule fixing base and an optical fiber ferrule through which an optical fiber monomer is penetrated.

[0021] For example, combined with Figure 2 As shown, in this embodiment, the optical fiber vertical integration unit in this embodiment is mainly used for integration with the planar chip, that is, the optical fiber ferrule fixing base is relatively fixed to the planar chip, and the first surface of the optical fiber ferrule fixing base close to the planar chip is provided with a colloid filling groove corresponding to the first size, and at the same time, the second surface of the optical fiber ferrule fixing base away from the planar chip is provided with an optical fiber ferrule limiting hole corresponding to the second size which is concentric with and connected to the colloid filling groove; wherein, the optical fiber ferrule passes through the optical fiber ferrule limiting hole until the end of the optical fiber ferrule extends into the colloid filling groove, and the optical fiber monomer abuts against the planar chip, and in order to achieve relative fixation between the optical fiber ferrule and the optical fiber ferrule fixing base, a high-temperature glue layer is also correspondingly provided in the spacing space formed between the optical fiber ferrule and the colloid filling groove.

[0022] Based on the above content, it can be known that the optical fiber vertical integration unit proposed in this embodiment uses a high-temperature adhesive layer to achieve relative fixation between the optical fiber ferrules inserted through the optical fiber ferrule fixing base. In response to the prior art, it avoids the problems of low working temperature, easy aging, corrosion resistance, and easy deformation of organic glue, and effectively improves the reliability and accuracy of the vertical integration of optical fiber and planar chip.

[0023] It should be noted that the first dimension of the corresponding colloid-filled groove may be larger than the second dimension of the corresponding optical fiber core limiting hole. In the present embodiment, both the first dimension and the second dimension may refer to the corresponding dimensions of the colloid-filled groove and the optical fiber core limiting hole on the horizontal cross section. The high-temperature adhesive layer used above may adopt the double-bond chemical high-temperature inorganic adhesive DB5012.

[0024] Furthermore, in the process of preparing the optical fiber vertical integration unit of the present embodiment, it is necessary to ensure that the optical fiber monomer can abut against the planar chip in a vertical posture, so as to ensure that the optical data transmitted by the optical fiber monomer can be well transmitted to the planar chip during subsequent use. In order to judge whether the optical fiber monomer located in the optical fiber ferrule abuts against the planar chip in a vertical posture, a corresponding optical fiber end face observation groove is also provided in the optical fiber vertical integration unit of the present embodiment; For example, two optical fiber end surface observation grooves are arranged opposite to the surface edge of the first surface of the optical fiber ferrule fixing base, and the two optical fiber end surface observation grooves extend toward the center position of the corresponding colloid filling groove to communicate with the colloid filling groove.

[0025] It should be noted that, since the optical fiber end face observation groove is correspondingly connected to the colloid filling groove, during the production and preparation process, the internal cleaning of the optical fiber vertical integration unit can also be performed based on the optical fiber end face observation groove to ensure the internal cleanliness. Specifically, the cleaning method may include the corresponding standard cleaning method, for example, inorganic cleaning such as Rca-1, Rca-3 and organic cleaning; Among them, organic cleaning can specifically include: acetone water bath ultrasonication for 5 minutes, anhydrous ethanol water ultrasonication for 5 minutes, deionized water rinsing for 2 minutes, and nitrogen blowing dry; inorganic cleaning can specifically include: RCA-1 (concentrated H2SO4:H2O2=3:1, hot plate 150℃, 15 minutes), RCA-3 (NH4OH:H2O2:H2O=7:2:1, water bath 60℃, 5 minutes), deionized water rinsing for 2 minutes, and nitrogen blowing dry.

[0026] Furthermore, in the present embodiment, in the above-mentioned optical fiber vertical integration unit, the corresponding optical fiber ferrule fixing base can be made of at least one material selected from the group consisting of aluminum oxide (ie, sapphire), fused quartz, silicon carbide, and single crystal magnesium oxide; Likewise, in this embodiment, in the above-mentioned optical fiber vertical integration unit, the corresponding optical fiber ferrule is made of at least one material of quartz or ceramic.

[0027] Furthermore, in the present embodiment, in order to facilitate the insertion of the optical fiber monomer into the corresponding optical fiber ferrule during the production and preparation process, the optical fiber ferrule is provided with a corresponding optical fiber transmission channel, the first end of the optical fiber transmission channel has a horn structure, and the optical fiber monomer passes through the second end of the optical fiber transmission channel from the first end to the optical fiber monomer abutting against the planar chip.

[0028] It can be explained that the planar chip mentioned in this embodiment can be a chip of any model, and this embodiment does not limit the specific model of the planar chip.

[0029] Another embodiment of the present invention provides a method for manufacturing an optical fiber vertical integration unit. Figure 3 A schematic diagram showing the manufacturing method is shown in FIG. Figure 3 As shown, the method includes steps S101 to S104, starting from step S101, wherein step S101 includes the following contents: Mechanical drilling is performed on the first surface and the second surface of the optical fiber ferrule fixing base which are arranged opposite to each other, respectively, to obtain a colloid-filled groove with a first size corresponding to the opening on the first surface and an optical fiber ferrule limiting hole with a second size corresponding to the opening on the second surface, wherein the optical fiber ferrule limiting hole is concentric with and connected to the colloid-filled groove.

[0030] For example, in this embodiment, the corresponding optical fiber core fixing base in this embodiment can be as described above, specifically made of at least one material selected from alumina, fused quartz, silicon carbide and single crystal magnesium oxide, and in the horizontal direction, the first dimension of the corresponding colloid filling groove is larger than the second dimension of the corresponding optical fiber core limiting hole.

[0031] In step S102, the following contents are included: The optical fiber ferrule is passed through the optical fiber ferrule limiting hole, and the interval space formed between the optical fiber ferrule and the colloid filling groove is filled and cured based on the high-temperature glue layer.

[0032] For example, after forming the corresponding colloid-filled groove and the optical fiber ferrule limiting hole on the optical fiber ferrule fixing base based on the above-mentioned mechanical drilling, the corresponding optical fiber ferrule can be inserted into the corresponding optical fiber ferrule limiting hole until one end of the corresponding optical fiber ferrule is placed in the colloid-filled groove and the corresponding other end extends out of the optical fiber ferrule limiting hole, that is, the second end is outside the optical fiber ferrule limiting hole. Since the first end of the optical fiber ferrule is placed in the colloid-filled groove, a corresponding spacing space is formed between the corresponding optical fiber ferrule and the colloid-filled groove, and then the spacing space can be filled and cured based on the high-temperature glue layer, thereby realizing the mutual fixation between the optical fiber ferrule and the optical fiber ferrule fixing base.

[0033] Furthermore, in this embodiment, the high temperature adhesive layer can be specifically double-bond chemical high temperature inorganic adhesive DB5012, and the above-mentioned "filling and curing the interval space formed between the optical fiber ferrule and the colloid filling groove based on the high temperature adhesive layer" can also include the following steps: Filling the high temperature adhesive layer into the space formed between the optical fiber ferrule and the colloid filling groove, and performing a static operation on the high temperature adhesive layer for a preset static time at room temperature; After the static operation is completed, a first baking operation is performed on the high-temperature adhesive layer at a preset first baking temperature for a preset first baking time; After the preset first baking operation is completed, a second baking operation is performed on the high temperature adhesive layer at a preset second baking temperature for a preset second baking time; After the second baking operation is completed, the high-temperature adhesive layer is naturally cooled.

[0034] For example, in the present embodiment, after the corresponding high-temperature adhesive layer is filled into the corresponding spacing space, the optical fiber vertical integration unit (that is, the high-temperature adhesive layer) can be subjected to a static operation for a preset static time (for example, 1 hour) at room temperature (that is, room temperature 25°C); then, after the corresponding static operation is completed, the optical fiber vertical integration unit (that is, the high-temperature adhesive layer) can be subjected to a first baking operation for a corresponding first baking time (for example, greater than 1 hour) at a preset first baking temperature (for example, 70°C to 90°C), so that the corresponding high-temperature adhesive layer can be in a slightly fixed state; after the corresponding first baking operation is completed, the optical fiber vertical integration unit (that is, the high-temperature adhesive layer) can be further subjected to a second baking operation for a corresponding second baking time (for example, greater than one hour) at a preset second baking temperature (for example, 130°C to 150°C), so that the corresponding high-temperature adhesive layer can be in a fully cured state; after the corresponding second baking operation is completed, the optical fiber vertical integration unit can be subjected to a corresponding natural cooling operation, that is, the optical fiber vertical integration unit is cooled at room temperature, so as to reduce the colloid temperature of the corresponding high-temperature adhesive layer.

[0035] For example, Figure 4 As shown, Figure 4 A schematic diagram of a plurality of optical fiber ferrule fixing bases after fixing the optical fiber ferrules is shown.

[0036] In step S103, the following steps are included: After the filling and curing of the high-temperature adhesive layer is completed, the planar chip is fixed to the first surface corresponding to the optical fiber core fixing base.

[0037] For example, in this embodiment, after the filling and curing of the corresponding high-temperature adhesive layer is completed, the planar chip can be further fixed on the first surface of the corresponding optical fiber ferrule fixing base, thereby completing the assembly process between the optical fiber vertical integration unit and the planar chip.

[0038] Furthermore, in this embodiment, the above-mentioned “fixing the planar chip to the first surface corresponding to the optical fiber ferrule fixing base” may also include the following steps: Determine welding points corresponding to a preset welding number and at preset distances from the groove body contour on the first surface of the optical fiber ferrule fixing base around the groove body contour of the colloid-filled groove; Perform welding operations on each welding point based on femtosecond laser welding, so that the planar chip is fixed to the second surface corresponding to the optical fiber ferrule fixing base; After the femtosecond laser welding is completed, the optical fiber ferrule fixing base and the planar chip are cleaned.

[0039] For example, in this embodiment, the assembly between the optical fiber ferrule fixing base and the planar chip can be fixed by corresponding welding based on a femtosecond laser. For example, the corresponding preset welding number of welding points can be first determined on the first side of the corresponding optical fiber ferrule fixing base based on the groove contour of the colloid-filled groove, and each welding point can be at the same preset distance from the groove contour; then, the welding operation can be performed on each welding point based on femtosecond laser welding, so that the planar chip can be fixed on the second side of the corresponding optical fiber ferrule fixing base, thereby realizing the assembly between the planar chip and the optical fiber ferrule fixing base; finally, after completing the corresponding femtosecond laser welding, the optical fiber ferrule fixing base and the planar chip can be further cleaned to ensure the overall cleanliness.

[0040] The corresponding femtosecond laser parameters may include: average power 20W, pulse width less than 290fs, single pulse repetition rate 1MHz, wavelength 1030nm, single pulse energy 200μj, beam quality 1.2M2, and beam pointing stability < 20 µrad / °C.

[0041] For example, in this embodiment, Figure 5 : shows a schematic structural diagram of the optical fiber ferrule fixing base and the planar chip after femtosecond laser welding in this embodiment; Figure 6 The microscopic result of the femtosecond laser bonding interface in this embodiment is shown.

[0042] Furthermore, in this embodiment, the above-mentioned “performing a cleaning operation on the optical fiber ferrule fixing base and the planar chip” may also include the following steps: Performing organic cleaning on the optical fiber ferrule fixing base and the planar chip; After the organic cleaning is completed, the optical fiber ferrule fixing base and the planar chip are inorganically cleaned; After the inorganic cleaning is completed, a nitrogen-based drying operation is performed on the optical fiber ferrule fixing base and the planar chip.

[0043] For example, based on the above content, it can be known that the cleaning operation of the optical fiber ferrule fixing base and the planar chip can be performed based on the standard cleaning method, that is, based on organic cleaning and inorganic cleaning. After completing the corresponding cleaning operation, the optical fiber ferrule fixing base and the planar chip can be further blown dry based on nitrogen, so that the acidic or alkaline solution in the inorganic cleaning liquid in the corresponding inorganic cleaning can be removed to prevent the planar chip from being corroded.

[0044] Furthermore, in this embodiment, the above-mentioned “performing organic cleaning on the optical fiber ferrule fixing base and the planar chip” may also include the following steps: Performing acetone-based organic cleaning on the optical fiber ferrule fixing base and the planar chip for a preset first cleaning time; After the acetone-based organic cleaning is completed, the optical fiber ferrule fixing base and the planar chip are subjected to ethanol-based organic cleaning for a preset second cleaning time.

[0045] For example, in this embodiment, organic cleaning of the optical fiber ferrule fixing base and the planar chip can be performed based on acetone and ethanol, wherein the organic cleaning performed with acetone can last for a preset first cleaning time (e.g., 5 minutes), while the organic cleaning performed with ethanol can last for a preset second cleaning time (e.g., 5 minutes).

[0046] Similarly, in this embodiment, the above-mentioned “performing inorganic cleaning on the optical fiber ferrule fixing base and the planar chip” may also include the following steps: Performing inorganic cleaning of the optical fiber ferrule fixing base and the planar chip with a first inorganic mixed liquid for a preset third cleaning time at a preset first cleaning temperature, wherein the first inorganic mixed liquid includes concentrated sulfuric acid and hydrogen peroxide corresponding to a preset first mixing ratio; After the inorganic cleaning based on the first inorganic mixed liquid is completed, the optical fiber core fixing base and the planar chip are subjected to inorganic cleaning based on the second inorganic mixed liquid for a preset fourth cleaning time at a preset second cleaning temperature, wherein the second inorganic mixed liquid includes ammonia water, hydrogen peroxide and water corresponding to a preset second mixing ratio; After the inorganic cleaning based on the second inorganic mixed liquid is completed, the optical fiber core fixing base and the planar chip are rinsed with deionized water.

[0047] For example, in this embodiment, the inorganic cleaning of the optical fiber ferrule fixing base and the planar chip can be divided into three steps: 1. Based on a preset first cleaning temperature, the optical fiber ferrule fixing base and the planar chip are inorganically cleaned with a first inorganic mixed liquid corresponding to a preset third cleaning time (for example, 15 minutes), wherein the first inorganic mixed liquid may include concentrated sulfuric acid and hydrogen peroxide corresponding to a preset first mixing ratio; 2. After the inorganic cleaning corresponding to the first inorganic mixed liquid is completed, the optical fiber ferrule fixing base and the planar chip can be further inorganically cleaned with a second inorganic mixed liquid corresponding to a preset fourth cleaning time (for example, 5 minutes) based on a preset second cleaning temperature, wherein the second inorganic mixed liquid can include ammonia water, hydrogen peroxide and water corresponding to a preset second mixing ratio; 3. After completing the inorganic cleaning of the corresponding second inorganic mixed liquid, the optical fiber ferrule fixing base and the planar chip can be rinsed with corresponding deionized water to complete the corresponding cleaning operation.

[0048] For example, in this embodiment, in order to determine whether the optical fiber unit is in a vertical position against the planar chip in the corresponding optical fiber ferrule fixing base, two corresponding optical fiber end face observation grooves that are arranged opposite to each other can be formed on the optical fiber ferrule fixing base by, for example, mechanical drilling, wherein the two optical fiber end face observation grooves extend toward the center of the corresponding colloid filling groove to communicate with the colloid filling groove respectively; after the corresponding optical fiber end face observation groove is opened, the internal condition of the corresponding optical fiber ferrule fixing groove can be obtained based on the optical fiber end face observation groove (for example, Figure 7 As shown in the figure, since the overall size of the corresponding optical fiber vertical integration unit is small, if manual observation is used, the subjectivity brought by manual observation may lead to corresponding observation deviations, thus causing subjectivity and inconsistency in the observation results.

[0049] In order to solve this problem, in this embodiment, an automated observation method can be used to replace the manual observation method, for example, a corresponding image acquisition method is used to acquire images of the optical fiber end face observation groove, and then the posture of the optical fiber is determined based on the acquired image. Here, in order to reduce the corresponding data processing amount, pixel marking of preset pixels can be performed on the optical fiber unit in advance to form a corresponding position marker. When the optical fiber unit is in a vertical posture against the planar chip, the corresponding position marker should be at the image center point of the corresponding acquired image, so that the posture of the optical fiber unit can be automatically determined. Here, the specific process can be described as follows: Controlling the shooting unit to collect images of any optical fiber end face observation slot to obtain a collected image corresponding to the optical fiber end face observation slot; Binarization is performed on the acquired image, and pixelation is performed based on the acquired binary image to obtain the acquired pixel points constituting the acquired binary image; In response to the existence of any collected pixel point among the collected pixel points having the same pixel value as the marked pixel point corresponding to the position marker, the collected pixel point is determined as the target pixel point, and an image center point corresponding to the collected image is obtained; When the target pixel point coincides with the center point of the image, determining that the installation posture of the corresponding optical fiber unit is a vertical posture; When the target pixel point does not coincide with the center point of the image, the optical fiber unit is adjusted based on a vertical adjustment strategy.

[0050] For example, in this embodiment, the corresponding shooting unit can be first controlled to perform an image acquisition operation on any optical fiber end face observation slot, thereby obtaining an acquisition image directly associated with the optical fiber end face observation slot; this step ensures that the image data for subsequent processing is derived from the optical fiber unit to be detected; Next, the acquired image is subjected to binarization processing, which is a process for simplifying the pixels in the image to contain only two different brightness (or color) levels for the convenience of subsequent analysis. Based on the acquired binary image, a pixelation process is further performed to identify and distinguish the individual acquired pixel points constituting the acquired binary image. Then, by detecting each collected pixel point, if it is found that any collected pixel point has a completely consistent pixel value with the marked pixel point of the corresponding position marker, the collected pixel point is determined to be the target pixel point. At the same time, the image center point corresponding to the collected image needs to be obtained, and this center point is used as the reference point for judging the installation posture of the optical fiber unit; Furthermore, this embodiment designs a judgment logic: if the target pixel point coincides with the center point of the image, it is automatically confirmed that the corresponding optical fiber unit is in a vertical installation posture, indicating that its installation position is accurate; conversely, if the target pixel point does not coincide with the center point of the image, the vertical adjustment strategy is activated, and the position or angle of the optical fiber unit is adjusted accordingly according to the strategy to ensure that it meets the predetermined vertical installation requirements, thereby determining that the corresponding optical fiber unit can be in a corresponding vertical posture to ensure good optical data transmission efficiency.

[0051] Further, in this embodiment, the above-mentioned “when the target pixel point does not coincide with the center point of the image, adjusting the optical fiber unit based on the first vertical adjustment strategy” may also include the following steps: Coordinate processing is performed on the collected image, and based on the obtained image coordinate system, a target coordinate point and a center coordinate point corresponding to the target pixel point and the image center point are obtained respectively; Connecting the target coordinate point with the image coordinate point, and comparing the obtained center connection line with the Y axis of the corresponding image coordinate system; In response to the center connection line coinciding with the Y axis, controlling the optical fiber unit to adjust its position toward the direction close to the planar chip corresponding to a preset first speed; In response to the central connection line not coinciding with the Y-axis, the optical fiber unit is controlled to adjust its position away from the planar chip at a corresponding preset first speed.

[0052] For example, in this embodiment, first, coordinate processing can be performed on the acquired image. This process aims to map each acquired pixel point in the acquired image to a two-dimensional image coordinate system, so that any acquired pixel point in the acquired image can be accurately located. Based on this processing, the target coordinate point and the center coordinate point corresponding to the target pixel point and the center point of the image can be obtained respectively. These two coordinate points can be used as key references for subsequent analysis; Next, in this embodiment, the target coordinate point and the center coordinate point may be connected to form a center connection line; and the center connection line may be further compared with the Y axis of the image coordinate system to evaluate the relative position relationship of the optical fiber unit with respect to the planar chip; According to the comparison results, the present invention designs two different response strategies: When the center connection line coincides with the Y axis of the image coordinate system, it means that the position of the optical fiber unit relative to the planar chip is in an ideal state in the vertical direction. However, since the target pixel point of the corresponding optical fiber unit does not coincide with the center point of the image, it can be known that the optical fiber unit does not abut against the planar chip. At this time, the optical fiber unit can be controlled to perform fine adjustment in the direction close to the planar chip at a preset first speed, so as to ensure the precise docking between the optical fiber unit and the planar chip and avoid position deviation caused by excessive adjustment. On the contrary, if the center connecting line does not coincide with the Y-axis, it means that although the optical fiber unit is in contact with the planar chip, the optical fiber unit is in an over-extended state, causing the optical fiber unit to be in contact with the planar chip, so that the optical fiber unit is bent. At this time, it is necessary to control the optical fiber unit to move at the same preset first speed, but in the opposite direction, that is, to adjust the position in the direction away from the planar chip to gradually correct this deviation until the ideal vertical alignment state is achieved.

[0053] In summary, this embodiment realizes accurate judgment and automatic adjustment of the position of the optical fiber unit through coordinate processing and comparative analysis based on the coordinate system, and significantly improves the accuracy and efficiency of docking the optical fiber unit with the planar chip.

[0054] It can be explained that in the above process, it is explained that when the corresponding target pixel point appears in the collected image, the optical fiber unit that is not in a vertical posture is adjusted based on the relative position of the target pixel point in the collected image; and when the corresponding target pixel point does not appear in the collected image, it means that the optical fiber unit has not extended to a position where the corresponding position identifier can be viewed by the optical fiber end face observation slot. Therefore, based on this situation, the following method can be further used to make corresponding adjustments so that the corresponding position identifier can be viewed by the optical fiber end face observation slot: In response to the fact that none of the collected pixel points has the same pixel value as the marking pixel point corresponding to the position marker, a vertical maximum coordinate point corresponding to the Y-axis maximum value is determined based on the image coordinate system, and a difference is calculated between the vertical maximum coordinate point and the center coordinate point to obtain a vertical coordinate difference; Controlling the optical fiber unit to adjust its position away from the planar chip at a corresponding preset second speed and having the same distance as the vertical coordinate difference; Controlling the shooting unit to collect images of any optical fiber end face observation slot to obtain an updated image corresponding to the optical fiber end face observation slot; Binarizing the updated image, and performing pixelation processing based on the updated binary image to obtain updated pixel points constituting the updated binary image; In response to the fact that any updated pixel point among the updated pixel points has the same pixel value as the marked pixel point corresponding to the position marker, the collected pixel point is determined as the target pixel point.

[0055] For example, in this embodiment, when it is detected that none of the collected pixel points has the same pixel value as the marked pixel point of the corresponding position marker, the vertical maximum coordinate point with the maximum value in the Y-axis direction can be identified and determined based on the image coordinate system established above. Then, the difference between this vertical maximum coordinate point and the preset center coordinate point is calculated to obtain the vertical coordinate difference; Based on the vertical coordinate difference calculated above, the optical fiber unit can be controlled to adjust its position in a direction away from the planar chip at a preset second speed, wherein the adjustment distance is equal to the vertical coordinate difference; Next, the image acquisition is performed on any optical fiber end face observation slot by instructing the shooting unit to obtain an updated image corresponding to the optical fiber end face observation slot; Subsequently, the acquired updated image is binarized to distinguish different regions in the image. Based on the processed updated binary image, pixelation is further performed to obtain each updated pixel point constituting the updated binary image; Finally, by checking all the updated pixels, if it is found that any updated pixel has the same pixel value as the corresponding marked pixel in the preset position marker, the updated pixel is determined as the target pixel.

[0056] In summary, according to the scheme of this embodiment, this embodiment avoids the problems of low working temperature, easy aging, corrosion resistance and other problems of traditional organic glue caused by low integration accuracy and insufficient reliability by setting a high-temperature glue layer between the optical fiber core fixing base and the optical fiber core. The high-temperature glue layer can remain stable in a high temperature environment, ensuring that the vertical integration of the optical fiber and the planar chip is more solid, and reducing the risk of misalignment and falling off caused by aging or deformation of the colloid. In addition, by setting a fiber optic end face observation groove on the optical fiber core fixing base, the installation posture of the optical fiber monomer can also be easily observed to ensure that the optical fiber monomer is in a vertical posture against the planar chip, thereby improving the efficiency of optical data transmission. It should be noted that, here, when there are acquisition pixel points in the acquisition image that have the same pixel value as the marking pixel points of the corresponding position marker, it means that the corresponding optical fiber unit is extended to a position where the position marker can be viewed by the optical fiber end face observation slot. Therefore, in this case, the position adjustment of the optical fiber unit can be performed based on a relatively slow speed (that is, the preset first speed) to ensure the accuracy of the corresponding adjustment; and when there are no acquisition pixel points in the acquisition image that have the same pixel value as the marking pixel points of the corresponding position marker, it means that the corresponding optical fiber unit has not been extended to a position where the position marker can be viewed by the optical fiber end face observation slot. Therefore, in this case, the position adjustment of the optical fiber unit can be performed based on a relatively fast speed (that is, the preset second speed) to ensure the efficiency of the corresponding adjustment.

[0057] In the description provided herein, algorithms and displays are not inherently related to any particular computer, virtual system or other device. Various general purpose systems can also be used together with the examples of the present invention. According to the above description, it is obvious that the structure required for constructing such systems. In addition, the present invention is not directed to any specific programming language either. It should be understood that various programming languages ​​can be utilized to implement the content of the present invention described herein, and the above description of specific languages ​​is for the purpose of disclosing the preferred embodiment of the present invention.

[0058] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0059] Similarly, it should be understood that in order to streamline the present disclosure and aid in understanding one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, various features of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof.

[0060] Those skilled in the art will appreciate that the modules or units or components of the devices in the examples disclosed herein may be arranged in the devices described in the embodiment, or alternatively may be located in one or more devices different from the devices in the examples. The modules in the foregoing examples may be combined into one module or may be divided into multiple submodules.

[0061] Those skilled in the art will appreciate that the modules in the devices in the embodiments may be adaptively changed and arranged in one or more devices different from the embodiments. The modules or units or components in the embodiments may be combined into one module or unit or component, and furthermore may be divided into a plurality of submodules or subunits or subcomponents.

[0062] Furthermore, those skilled in the art will appreciate that although some embodiments described herein include certain features included in other embodiments but not other features, the combination of features from different embodiments is meant to be within the scope of the present invention and to form different embodiments.

[0063] In addition, some of the embodiments are described herein as methods or combinations of method elements that can be implemented by a processor of a computer system or by other devices that perform the functions. Therefore, a processor with necessary instructions for implementing the method or method elements forms a device for implementing the method or method elements. In addition, the elements described herein of the device embodiments are examples of devices for implementing the functions performed by the elements for the purpose of implementing the invention.

[0064] As used herein, unless otherwise specified, the use of ordinal numbers "first," "second," "third," etc. to describe common objects merely indicates that different instances of similar objects are involved, and is not intended to imply that the objects so described must have a given order in time, space, order, or in any other manner.

[0065] Although the present invention has been described according to a limited number of embodiments, it will be apparent to those skilled in the art, with the benefit of the above description, that other embodiments may be envisioned within the scope of the invention thus described. In addition, it should be noted that the language used in this specification is primarily selected for readability and instructional purposes, rather than for explaining or limiting the subject matter of the present invention.

Claims

1. An optical fiber vertical integration unit, characterized in that: include: An optical fiber ferrule fixing base provided on the planar chip and equipped with an optical fiber ferrule, wherein an optical fiber monomer is inserted through the optical fiber ferrule; Among them, the first surface of the optical fiber ferrule fixing base close to the planar chip is provided with a colloid-filled groove corresponding to the first size, and the second surface of the optical fiber ferrule fixing base away from the planar chip is provided with an optical fiber ferrule limiting hole corresponding to the second size that is concentric with and connected to the colloid-filled groove, the optical fiber ferrule passes through the optical fiber ferrule limiting hole until the end of the optical fiber ferrule extends into the colloid-filled groove and the optical fiber monomer is abutted against the planar chip, and a high-temperature glue layer is provided in the spacing space formed between the optical fiber ferrule and the colloid-filled groove.

2. The optical fiber vertical integration unit according to claim 1, characterized in that: Two optical fiber end surface observation grooves are arranged opposite to the surface edge of the first surface of the optical fiber ferrule fixing base, and the two optical fiber end surface observation grooves extend toward the center position of the corresponding colloid filling groove to communicate with the colloid filling groove.

3. The optical fiber vertical integration unit according to claim 1, characterized in that: The optical fiber core fixing base is made of at least one material selected from the group consisting of aluminum oxide, fused quartz, silicon carbide and single crystal magnesium oxide.

4. The optical fiber vertical integration unit according to claim 1, characterized in that: The optical fiber ferrule is made of at least one of quartz and ceramic.

5. The optical fiber vertical integration unit according to claim 1, characterized in that: The optical fiber ferrule is provided with an optical fiber transmission channel, a first end of the optical fiber transmission channel has a horn structure, and the optical fiber monomer passes through the first end and the second end of the optical fiber transmission channel until the optical fiber monomer abuts against the planar chip.

6. A method for manufacturing the optical fiber vertical integration unit according to any one of claims 1 to 5, characterized in that: The following steps are involved: Mechanically drilling holes is performed on the first surface and the second surface of the optical fiber ferrule fixing base, respectively, to obtain a colloid-filled groove with a first size corresponding to the opening of the first surface and an optical fiber ferrule limiting hole with a second size corresponding to the opening of the second surface, wherein the optical fiber ferrule limiting hole is concentric with and connected to the colloid-filled groove; Insert the optical fiber core into the optical fiber core limiting hole, and fill and solidify the interval space formed between the optical fiber core and the colloid filling groove based on the high temperature glue layer; After the high-temperature adhesive layer is filled and cured, the planar chip is fixed to the first surface corresponding to the optical fiber ferrule fixing base; The optical fiber monomer is passed through the optical fiber ferrule until the end of the optical fiber monomer abuts against a side of the planar chip close to the optical fiber ferrule fixing base.

7. The method for manufacturing an optical fiber vertical integration unit according to claim 6, characterized in that: Filling and curing the space formed between the optical fiber ferrule and the colloid-filled groove with a high-temperature adhesive layer includes: Filling the high temperature adhesive layer into the space formed between the optical fiber ferrule and the colloid filling groove, and performing a static operation on the high temperature adhesive layer for a preset static time at room temperature; After the static operation is completed, a first baking operation is performed on the high-temperature adhesive layer at a preset first baking temperature for a preset first baking time; After the preset first baking operation is completed, a second baking operation is performed on the high temperature adhesive layer at a preset second baking temperature for a preset second baking time; After the second baking operation is completed, the high-temperature adhesive layer is naturally cooled.

8. The method for manufacturing an optical fiber vertical integration unit according to claim 7, characterized in that: Fixing the planar chip to the first surface corresponding to the optical fiber ferrule fixing base comprises: Determine welding points corresponding to a preset welding number and at preset distances from the groove body contour on the first surface of the optical fiber ferrule fixing base around the groove body contour of the colloid-filled groove; Perform welding operations on each welding point based on femtosecond laser welding, so that the planar chip is fixed to the second surface corresponding to the optical fiber ferrule fixing base; After the femtosecond laser welding is completed, the optical fiber ferrule fixing base and the planar chip are cleaned.

9. The method for manufacturing an optical fiber vertical integration unit according to claim 8, characterized in that: Performing a cleaning operation on the optical fiber ferrule fixing base and the planar chip includes: Performing organic cleaning on the optical fiber ferrule fixing base and the planar chip; After the organic cleaning is completed, the optical fiber ferrule fixing base and the planar chip are inorganically cleaned; After the inorganic cleaning is completed, a nitrogen-based drying operation is performed on the optical fiber ferrule fixing base and the planar chip.

10. The method for manufacturing an optical fiber vertical integration unit according to claim 9, characterized in that: The optical fiber ferrule fixing base and the planar chip are organically cleaned, including: Performing acetone-based organic cleaning on the optical fiber ferrule fixing base and the planar chip for a preset first cleaning time; After the acetone-based organic cleaning is completed, the optical fiber ferrule fixing base and the planar chip are subjected to ethanol-based organic cleaning for a preset second cleaning time.

11. The method for manufacturing an optical fiber vertical integration unit according to claim 9, characterized in that: Inorganic cleaning of the optical fiber ferrule fixing base and the planar chip includes: Performing inorganic cleaning of the optical fiber ferrule fixing base and the planar chip with a first inorganic mixed liquid for a preset third cleaning time at a preset first cleaning temperature, wherein the first inorganic mixed liquid includes concentrated sulfuric acid and hydrogen peroxide corresponding to a preset first mixing ratio; After the inorganic cleaning based on the first inorganic mixed liquid is completed, the optical fiber core fixing base and the planar chip are subjected to inorganic cleaning based on the second inorganic mixed liquid for a preset fourth cleaning time at a preset second cleaning temperature, wherein the second inorganic mixed liquid includes ammonia water, hydrogen peroxide and water corresponding to a preset second mixing ratio; After the inorganic cleaning based on the second inorganic mixed liquid is completed, the optical fiber core fixing base and the planar chip are rinsed with deionized water.

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