Bolt type capacitor temperature control method, device, equipment and medium

By obtaining the temperature information of the bolt capacitor and the external ambient temperature in real time, combining the heat analysis model to analyze the heat accumulation rate and distribution, predicting the temperature change trend and generating a temperature control strategy, and dynamically adjusting the heating and cooling device, the problem of temperature control of the bolt capacitor is solved, and the stability and safe control of temperature are achieved.

CN119806247AActive Publication Date: 2025-04-11SHENZHEN XINZHONGYUAN ELECTRONICS CO LTD

Patent Information

Application Number
CN202510296490.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-13
Publication Date
2025-04-11
Estimated Expiration
2045-03-13

AI Technical Summary

Technical Problem

Bolt capacitors generate a lot of heat during operation. If the temperature cannot be controlled effectively in time, it may cause the capacitor to overheat, performance attenuation, and even failure or damage.

Method used

By obtaining the real-time temperature information of the bolt capacitor and the external ambient temperature information, combining the heat analysis model to analyze the heat accumulation rate and distribution, predict the temperature change trend, generate a temperature control strategy, and dynamically adjust the working status of the heating and cooling device to achieve adaptive temperature control.

Benefits of technology

Accurate monitoring and dynamic adjustment of the temperature of bolt capacitors is achieved, excessive heating or cooling is avoided, temperature stability and safety is ensured, and the service life of the capacitor is extended.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The invention relates to the technical field of temperature control of a bolt type capacitor. The bolt type capacitor temperature control method comprises the steps that based on real-time temperature information and external environment temperature information, the heat accumulation rate and the heat distribution diagram of a bolt type capacitor are analyzed through a heat analysis model, according to the heat accumulation rate, the temperature change trend is predicted, and according to the heat distribution diagram, the temperature of the bolt type capacitor is calculated. The method comprises the steps of determining a temperature control demand of the bolt type capacitor, generating a corresponding temperature control strategy, adjusting working states of a heating device and a cooling device based on the temperature control strategy and a temperature change trend, obtaining a real-time temperature adjustment result, obtaining a preset temperature target range, and comparing the real-time temperature adjustment result with the preset temperature target range. And on the basis of the temperature comparison result, the control system carries out self-adaptive adjustment on the heating device or the cooling device. The bolt type capacitor temperature monitoring device has the effect of accurately monitoring the temperature of the bolt type capacitor.
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Description

Technical Field

[0001] The present invention relates to the technical field of temperature control of bolt-type capacitors, and in particular to a temperature control method, device, equipment and medium for bolt-type capacitors. Background Art

[0002] Bolt-on capacitors are high-voltage, high-capacity energy storage devices that are widely used in power systems, electrical equipment, and various industrial applications. In order to ensure stable operation during operation, it is essential to control their temperature. Bolt-on capacitors have a complex internal structure and generate a lot of heat during operation. If the temperature cannot be effectively controlled in a timely manner, the capacitor may overheat, degrade in performance, or even fail or be damaged. Summary of the invention

[0003] In order to achieve accurate temperature monitoring of bolt-type capacitors, the present application provides a temperature control method, device, equipment and medium for bolt-type capacitors.

[0004] The above-mentioned invention objective of the present application is achieved through the following technical solutions: A temperature control method for a bolt-type capacitor, the temperature control method for a bolt-type capacitor comprising: Acquiring real-time temperature information of the bolt-type capacitor and external environment temperature information; Based on the real-time temperature information and the external environment temperature information, using a thermal analysis model to analyze the heat accumulation rate and heat distribution diagram of the bolt-type capacitor; Predicting the temperature change trend according to the heat accumulation rate, determining the temperature control requirement of the bolt-type capacitor according to the heat distribution diagram, and generating a corresponding temperature control strategy; Based on the temperature control strategy and the temperature change trend, the working states of the heating device and the cooling device are adjusted to obtain a real-time temperature adjustment result; A preset temperature target range is obtained, and the real-time temperature adjustment result is compared with the preset temperature target range to obtain a temperature comparison result. Based on the temperature comparison result, the control system adaptively adjusts the heating device or the cooling device.

[0005] By adopting the above technical solution, by acquiring real-time temperature information and external environment temperature information, and combining the thermal analysis model to analyze the heat accumulation rate and distribution of the bolt-type capacitor, it is possible to predict the temperature change trend and heat distribution in real time, ensure that the heating and cooling devices are adjusted very accurately, avoid overheating or cooling, and thus stabilize the temperature. Dynamic adjustment and adaptive control are important advantages of this solution. The temperature control strategy can be flexibly adjusted according to the real-time temperature change trend, and automatically adjust the power and intensity of the heating or cooling device according to the deviation between the actual temperature and the target temperature range. This adaptive control can effectively respond to environmental changes and ensure that the temperature is always within the ideal range.

[0006] In a preferred example, the present application may be further configured as follows: based on the real-time temperature information and the external environment temperature information, using a thermal analysis model to analyze the heat accumulation rate and heat distribution diagram of the bolt-type capacitor includes: Based on the real-time temperature information and the external environment temperature information, the thermal analysis model calculates the heat accumulation rate of each part of the bolt-type capacitor based on the heat conduction equation and the heat convection equation; After the heat accumulation rate is calculated, the heat distribution diagram of each area inside the bolt-type capacitor is simulated by the thermal analysis model.

[0007] By adopting the above technical solution, based on real-time temperature information and external ambient temperature information, the heat accumulation rate of each part of the bolt-type capacitor is calculated through the thermal analysis model combined with the heat conduction equation and the heat convection equation, and the heat distribution map of each internal area is further simulated. It is possible to accurately grasp the heat flow and accumulation of the bolt-type capacitor under different working conditions, so as to formulate a more accurate temperature control strategy and avoid abnormal temperature fluctuations. Through the distribution simulation of each area by the thermal analysis model, it is possible to more clearly understand the impact of temperature changes on different parts of the capacitor, so that the temperature control strategy can be adjusted in a targeted manner according to regional differences in actual applications, ensuring that the temperature of each area can be within the ideal range, and improving the accuracy and stability of temperature control.

[0008] In a preferred example, the present application may be further configured as follows: based on the real-time temperature information and the external environment temperature information, the heat analysis model calculates the heat accumulation rate of each part of the bolt-type capacitor based on the heat conduction equation and the heat convection equation, including: The heat conduction equation is: , where q cond is the heat conduction heat flow, k is the thermal conductivity of the material, A is the cross-sectional area through which the heat flows, ΔT is the temperature difference, and Δx is the distance the heat flows; The heat convection equation is: , where q conv is the heat convection heat flow, h is the convection heat transfer coefficient, X is the capacitor surface area, T surface is the capacitor surface temperature, the T ambient is the external ambient temperature; Combining the heat conduction heat flux and the heat convection heat flux, the heat accumulation rate is obtained by the following formula: , where W refers to the heat accumulation rate, and γ j refers to the temperature regulation feedback coefficient, the △T j Refers to the temperature difference in the current area.

[0009] By adopting the above technical solution, by combining the heat conduction equation and the heat convection equation, the heat conduction heat flow and the heat convection heat flow of each area in the capacitor can be calculated respectively, and the heat accumulation rate can be obtained through the corresponding formula. This method can fully consider the interaction of different heat flow processes and accurately simulate the heat flow and changes in the bolt-type capacitor. By introducing the temperature adjustment feedback coefficient and the temperature difference of the current area, the heat accumulation rate can be flexibly adjusted according to the temperature change during the actual working process, so that the temperature control effect inside the capacitor can be optimized in real time. This feedback adjustment mechanism ensures that the system can continuously adjust the temperature according to changes in the environment and working conditions, further improving the adaptability and accuracy of temperature control.

[0010] In a preferred example, the present application may be further configured as follows: after calculating the heat accumulation rate, simulating the heat distribution diagram of each area inside the bolt-type capacitor by the heat analysis model, including: Acquiring geometric structure information of the bolt-type capacitor, and based on the geometric structure information, the thermal analysis model divides the bolt-type capacitor into a plurality of thermodynamic sub-regions; The heat analysis model uses the calculated heat accumulation rate and combines the thermal properties of each sub-region to simulate the distribution of heat in each sub-region, and generates the heat distribution map by calculating the heat flow and accumulation of each region.

[0011] By adopting the above technical solution, the geometric structure information of the bolt-type capacitor is obtained and divided into multiple thermodynamic sub-regions, and a refined thermal analysis is performed in combination with the thermal characteristics of each sub-region, avoiding the errors that may be caused by the unified treatment of the entire capacitor in the traditional method, thereby improving the accuracy of the thermal analysis. Secondly, based on the heat accumulation rate and thermal properties, the distribution of heat in each sub-region is simulated to generate an accurate heat distribution map, which provides an accurate basis for the formulation and optimization of the temperature control strategy. In addition, by performing detailed calculations on the heat flow and accumulation in each region, the system can accurately predict the temperature change trend and dynamically adjust the temperature control strategy, thereby effectively keeping the bolt-type capacitor within the optimal operating temperature range and avoiding the risk of overheating or insufficient cooling.

[0012] In a preferred example, the present application may be further configured as follows: predicting the temperature change trend according to the heat accumulation rate includes: The temperature change trend is predicted based on the following formula: , where the T next is the predicted temperature at the next moment, T0 is the temperature at the current moment, m is the mass of the capacitor, and C p refers to the specific heat capacity of the capacitor, the W refers to the heat accumulation rate, the h refers to the heat convection heat transfer coefficient, the L refers to the surface area of ​​the capacitor, the T cap refers to the internal temperature of the capacitor, the T env refers to the external ambient temperature, and Δt refers to the time step.

[0013] By adopting the above technical solution, the temperature change at the next moment is calculated based on the current capacitor temperature, physical properties (such as mass and specific heat capacity) and external factors (such as ambient temperature and heat convection heat transfer coefficient), combined with the heat accumulation rate and surface area of ​​the capacitor. Through this dynamic prediction based on the physical model, the temperature change trend can be grasped in advance, thereby optimizing the temperature control strategy.

[0014] In a preferred example, the present application may be further configured as follows: the preset temperature target range is obtained, the real-time temperature adjustment result is compared with the preset temperature target range to obtain a temperature comparison result, and based on the temperature comparison result, the control system performs adaptive adjustment on the heating device or the cooling device, including: Based on the temperature comparison result, if the real-time temperature adjustment result is lower than the preset temperature target range, the control system determines that it is necessary to increase the heat to increase the temperature, starts the heating device and adjusts the heating power according to the deviation between the current temperature and the lower limit temperature; Based on the temperature comparison result, if the real-time temperature adjustment result is higher than the preset temperature target range, the control system determines that heat needs to be reduced to lower the temperature, starts the cooling device and adjusts the cooling intensity according to the deviation between the current temperature and the upper limit temperature; Based on the temperature comparison result, if the real-time temperature adjustment result is within the preset temperature target range, the control system maintains the current temperature control state, continuously monitors temperature changes, and ensures that the real-time temperature adjustment result is stable within the preset temperature target range.

[0015] By adopting the above technical solution, based on the comparison between the real-time temperature adjustment result and the preset temperature target range, the working state of the heating device and the cooling device can be flexibly adjusted to ensure that the temperature always remains within the set optimal range. When the temperature is lower than the target range, the system can automatically increase the heat, start the heating device, and dynamically adjust the heating power according to the deviation between the temperature and the lower limit temperature; when the temperature is higher than the target range, the system will start the cooling device and lower the temperature by adjusting the cooling intensity; if the temperature is within the target range, the system will maintain the current temperature control state, continuously monitor the temperature changes, and ensure temperature stability.

[0016] In a preferred example, the present application can be further configured as follows: the temperature control method of the bolt-type capacitor further includes: After obtaining the real-time temperature adjustment result, a real-time feedback mechanism is started to continuously track the temperature change trend and analyze the law of temperature fluctuation; Based on the law of the temperature fluctuation, the temperature control strategy is adjusted, and the response time and adjustment range of the heating device and the cooling device are optimized by analyzing the temperature change rate and deviation.

[0017] By adopting the above technical solutions, the real-time feedback mechanism can continuously track the temperature change trend, and by analyzing the laws of temperature fluctuations, predict possible temperature change trends and fluctuation patterns, thereby providing a basis for adjusting the temperature control strategy. Based on these laws, the temperature control strategy will be dynamically adjusted according to the actual temperature fluctuations, optimizing the response time and adjustment range of the heating and cooling devices, ensuring that the system can respond to temperature changes quickly and effectively.

[0018] The second object of the invention is achieved by the following technical solutions: A bolt-type capacitor temperature control device, the bolt-type capacitor temperature control device comprising: A real-time temperature acquisition module, used to acquire real-time temperature information of the bolt-type capacitor and external environment temperature information; A heat analysis module, configured to analyze the heat accumulation rate and heat distribution diagram of the bolt-type capacitor using a heat analysis model based on the real-time temperature information and the external environment temperature information; A temperature trend prediction module, used to predict the temperature change trend according to the heat accumulation rate, determine the temperature control requirement of the bolt-type capacitor according to the heat distribution diagram, and generate a corresponding temperature control strategy; A temperature control monitoring and adjustment module, used to adjust the working states of the heating device and the cooling device based on the temperature control strategy and the temperature change trend, and obtain real-time temperature adjustment results; The temperature comparison and adjustment module is used to obtain a preset temperature target range, compare the real-time temperature adjustment result with the preset temperature target range, obtain a temperature comparison result, and based on the temperature comparison result, the control system adaptively adjusts the heating device or the cooling device.

[0019] By adopting the above technical solution, by acquiring real-time temperature information and external environment temperature information, and combining the thermal analysis model to analyze the heat accumulation rate and distribution of the bolt-type capacitor, it is possible to predict the temperature change trend and heat distribution in real time, ensure that the heating and cooling devices are adjusted very accurately, avoid overheating or cooling, and thus stabilize the temperature. Dynamic adjustment and adaptive control are important advantages of this solution. The temperature control strategy can be flexibly adjusted according to the real-time temperature change trend, and automatically adjust the power and intensity of the heating or cooling device according to the deviation between the actual temperature and the target temperature range. This adaptive control can effectively respond to environmental changes and ensure that the temperature is always within the ideal range.

[0020] The third objective of the present application is achieved through the following technical solutions: A computer device comprises a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the temperature control method of the bolted capacitor when executing the computer program.

[0021] The fourth objective of the present application is achieved through the following technical solutions: A computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the temperature control method of the bolt-type capacitor are implemented.

[0022] In summary, the present application includes at least one of the following beneficial technical effects: 1. By acquiring real-time temperature information and external ambient temperature information, and combining the thermal analysis model to analyze the heat accumulation rate and distribution of the bolt-type capacitor, it is possible to predict the temperature change trend and heat distribution in real time, ensure that the heating and cooling devices are adjusted very accurately, avoid overheating or cooling, and thus stabilize the temperature. Dynamic adjustment and adaptive control are important advantages of this solution. The temperature control strategy can be flexibly adjusted according to the real-time temperature change trend, and automatically adjust the power and intensity of the heating or cooling device according to the deviation between the actual temperature and the target temperature range. This adaptive control can effectively respond to environmental changes and ensure that the temperature is always within the ideal range; 2. By combining the heat conduction equation and the heat convection equation, the heat conduction heat flow and the heat convection heat flow of each area in the capacitor can be calculated separately, and the heat accumulation rate can be obtained through the corresponding formula. This method can fully consider the interaction of different heat flow processes and accurately simulate the flow and change of heat in the bolt-type capacitor. By introducing the temperature adjustment feedback coefficient and the temperature difference of the current area, the heat accumulation rate can be flexibly adjusted according to the temperature change during the actual working process, so that the temperature control effect inside the capacitor can be optimized in real time. This feedback adjustment mechanism ensures that the system can continuously adjust the temperature according to changes in the environment and working conditions, further improving the adaptability and accuracy of temperature control; 3. Based on the comparison between the real-time temperature adjustment result and the preset temperature target range, the working state of the heating device and the cooling device are flexibly adjusted to ensure that the temperature is always kept within the set optimal range. When the temperature is lower than the target range, the system can automatically increase the heat, start the heating device, and dynamically adjust the heating power according to the deviation between the temperature and the lower limit temperature; when the temperature is higher than the target range, the system will start the cooling device and lower the temperature by adjusting the cooling intensity; if the temperature is within the target range, the system will maintain the current temperature control state, continuously monitor the temperature changes, and ensure temperature stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of a temperature control method for a bolt-type capacitor in an embodiment of the application; Figure 2 It is a flowchart for implementing step S20 in the temperature control method of a bolt-type capacitor in one embodiment of the present application; Figure 3 It is a flowchart for implementing step S201 in the temperature control method of a bolt-type capacitor in one embodiment of the present application; Figure 4 It is a flowchart for implementing step S202 in the temperature control method of a bolt-type capacitor in one embodiment of the present application; Figure 5 It is a flowchart for implementing step S30 in the temperature control method of a bolt-type capacitor in one embodiment of the present application; Figure 6It is a flowchart for implementing step S50 in the temperature control method of a bolt-type capacitor in one embodiment of the present application; Figure 7 This is a flowchart of the implementation after step S50 in the temperature control method of a bolt-type capacitor in one embodiment of the present application; Figure 8 This is a principle block diagram of a bolt-type capacitor temperature control device in one embodiment of the present application; Fig. 9 It is a schematic diagram of a device in an embodiment of the present application. DETAILED DESCRIPTION

[0024] The present application is further described in detail below in conjunction with the accompanying drawings.

[0025] In one embodiment, if Figure 1 As shown, the present application discloses a temperature control method for a bolt-type capacitor, which specifically includes the following steps: S10: Acquire real-time temperature information of the bolt-type capacitor and external environment temperature information.

[0026] Specifically, by installing temperature sensors at multiple locations of bolt-on capacitors, such as the surface of the capacitor casing, internal electrodes, and isolation layers, these sensors can monitor temperature changes inside and outside the capacitor in real time. The sensors use high-precision temperature measurement technology, such as thermocouples or platinum resistance temperature detectors (RTDs). In addition, an ambient temperature sensor is set in the environment around the capacitor to obtain temperature information outside the capacitor in real time.

[0027] S20: Based on the real-time temperature information and the external environment temperature information, a heat accumulation rate and a heat distribution diagram of the bolt-type capacitor are analyzed using a heat analysis model.

[0028] Specifically, using the acquired real-time temperature information and external ambient temperature information, the heat accumulation rate and heat distribution map of the capacitor are used as model inputs, and the heat inside the capacitor is simulated through the thermal analysis model. The model calculates the heat accumulation rate in different areas based on the heat conduction equation and the heat convection equation. In this process, the material properties, shape, internal structure and external ambient temperature of the capacitor are comprehensively considered. Specifically, first, based on the geometric parameters of the capacitor (such as volume, surface area, wall thickness, etc.), combined with the measured temperature information, the heat accumulation rate inside the capacitor is obtained by calculating the conduction and convection effects of heat. Subsequently, the thermal analysis model will simulate the heat distribution of each sub-area of ​​the capacitor according to the thermal characteristics of each area (such as thermal conductivity, specific heat capacity, etc.), and generate the corresponding heat distribution map.

[0029] S30: predicting the temperature change trend according to the heat accumulation rate, determining the temperature control requirement of the bolt-type capacitor according to the heat distribution diagram, and generating a corresponding temperature control strategy.

[0030] Specifically, by combining the heat accumulation rate with the thermal properties of the bolt-type capacitor (such as heat capacity, thermal conductivity, etc.), the thermal model can be used to infer the temperature change trend of the capacitor at different time nodes. For example, through the calculation formula, combined with the accumulation rate and the mass of the capacitor, the temperature increase or decrease of the capacitor within a certain period of time can be estimated. At the same time, according to the heat distribution map, the temperature distribution of each area inside the capacitor can be analyzed, and the areas with higher or lower temperatures can be identified, and further inferred which areas require additional heating or cooling. Combining this information, the temperature control strategy can be generated according to the real-time temperature demand, including determining the start time and adjustment range of the heating device or cooling device. For example, if the temperature change trend indicates that the temperature is about to exceed the upper limit, the strategy will recommend starting the cooling device. If the temperature is too low, the heating device will be started for heating.

[0031] S40: Based on the temperature control strategy and the temperature change trend, the working states of the heating device and the cooling device are adjusted to obtain a real-time temperature adjustment result.

[0032] Specifically, based on the temperature control strategy and the temperature change trend, the real-time temperature is first compared with the target range in the temperature control strategy. If the current temperature deviates from the target range, the heating device and the cooling device are adjusted according to the temperature change trend. If the temperature rises too fast, the temperature rise is slowed down by reducing the heating power or increasing the cooling intensity of the cooling device; conversely, if the temperature drops too fast, the power of the heating device is appropriately increased or the working intensity of the cooling device is reduced to maintain temperature stability. This adjustment process will be dynamically updated based on the temperature change trend and feedback results. For example, if the temperature change trend shows that the temperature is approaching the upper limit, the power of the heating device is reduced, or the work of the cooling device is further strengthened; if the temperature is approaching the lower limit, the output power of the heating device is increased, or the cooling intensity of the cooling device is reduced. After each adjustment, the actual temperature after adjustment needs to be measured and fed back through the real-time monitoring system, and compared with the target temperature range until it reaches or remains within the target temperature range, and finally the real-time temperature adjustment result is obtained.

[0033] S50: Obtain a preset temperature target range, compare the real-time temperature adjustment result with the preset temperature target range, obtain a temperature comparison result, and based on the temperature comparison result, the control system adaptively adjusts the heating device or the cooling device.

[0034] In this embodiment, the control system refers to an automated equipment adjustment mechanism that can dynamically adjust the working state of the heating device and the cooling device according to the real-time temperature monitoring data and the preset temperature target range. Specifically, the control system calculates the deviation between the real-time temperature and the target temperature range through a temperature comparison algorithm, and makes adjustment decisions based on the size of the deviation, such as by adjusting the heating power or cooling intensity to keep the temperature within the preset range. The control system may include components such as sensors, actuators, feedback loops, and control algorithms, wherein the sensors collect the temperature data of the capacitor in real time, and the actuators adjust the working state of the heating or cooling device according to the control signal.

[0035] Specifically, by obtaining the preset temperature target range, the real-time monitoring results are compared with the preset temperature target range. First, if the current temperature is lower than the lower limit of the target range, it is determined that the heat needs to be increased, the heating device is started, and the heating power is adjusted according to the difference between the current temperature and the lower limit. If the current temperature is higher than the upper limit of the preset temperature target range, the heat needs to be reduced, the cooling device is started, and the cooling intensity is adjusted according to the difference between the current temperature and the upper limit. When the current temperature is within the preset temperature target range, the control system maintains the current temperature control state and continues to monitor temperature changes to ensure that the temperature is stable within the target range. Through the temperature comparison results, the control system dynamically adjusts the working state of the heating device and the cooling device according to the deviation in real time to ensure that the equipment operates within the optimal working temperature range.

[0036] In one embodiment, if Figure 2 As shown, in step S20, the heat accumulation rate and heat distribution diagram of the bolt-type capacitor are analyzed using a heat analysis model based on the real-time temperature information and the external environment temperature information, including: S201: Based on the real-time temperature information and the external environment temperature information, the thermal analysis model calculates the heat accumulation rate of each part of the bolt-type capacitor based on the heat conduction equation and the heat convection equation.

[0037] Specifically, the thermal analysis model first calculates the heat accumulation rate of each part based on the principles of heat conduction and heat convection, based on the real-time temperature information and external ambient temperature information, combined with the material properties and geometric structure of different parts of the capacitor. In terms of heat conduction, the model considers the heat transfer process caused by the temperature difference between the various parts of the capacitor, and uses the thermal conductivity of the capacitor material and the cross-sectional area of ​​the heat flow propagation to estimate how the heat flows from the higher temperature part to the lower temperature part. In terms of thermal convection, the model analyzes the heat exchange between the capacitor surface and the external environment, mainly considering the heat carried away by the air flow, especially the difference between the capacitor surface temperature and the surrounding environment temperature. Through the comprehensive analysis of these two heat transfer methods, the thermal analysis model can calculate the heat accumulation rate of each part of the capacitor.

[0038] S202: After calculating the heat accumulation rate, a heat distribution diagram of each area inside the bolt-type capacitor is simulated by a heat analysis model.

[0039] Specifically, after calculating the heat accumulation rate of each part, the thermal analysis model divides the different areas inside the capacitor in detail, and simulates the heat distribution in each area based on the previously obtained heat accumulation rate data. The model divides the capacitor into multiple thermodynamic sub-areas according to the geometric shape and material properties of the capacitor. The heat distribution of each sub-area is affected by the temperature and heat flow of the surrounding area. Through the thermal analysis model, combined with the thermal properties of different areas, such as thermal conductivity, specific heat capacity, etc., the heat propagation process inside the capacitor is simulated. The model takes into account how heat is transferred from areas with higher temperatures to areas with lower temperatures, and also takes into account the dissipation of heat between the surface and the external environment. The heat distribution map output by the model can show the heat distribution status of each sub-area of ​​the capacitor in detail.

[0040] In one embodiment, if Figure 3 As shown, in step S201, based on the real-time temperature information and the external environment temperature information, the thermal analysis model calculates the heat accumulation rate of each part of the bolt-type capacitor based on the heat conduction equation and the heat convection equation, including: S2011: The heat conduction equation is: , where q cond is the heat flow rate of heat conduction, k is the thermal conductivity of the material, A is the cross-sectional area through which the heat flows, △T is the temperature difference, and △x is the distance the heat flows.

[0041] Specifically, the heat conduction equation describes the process of heat transfer through materials inside an object, where the heat conduction heat flow (q cond ) is closely related to the thermal conductivity of the material (k), the cross-sectional area (A) through which the heat flows, the temperature difference (△T), and the distance (△x) through which the heat flows. Through this equation, the amount of heat that passes through a unit area per unit time can be calculated, and the heat distribution inside the material can be predicted. For example, when the metal part of a capacitor or other thermally conductive material is heated, the heat will flow from the high-temperature area to the low-temperature area through the thermal conduction path. The use of the equation can help accurately evaluate the efficiency of heat flow. In practical applications, the temperature difference (△T) refers to the temperature difference between adjacent areas, the thermal conductivity of the material (k) determines the ease of heat flow, and the distance (△x) through which the heat flows and the cross-sectional area (A) through which the heat flows affect the range and intensity of heat conduction.

[0042] Further, suppose a bolt-on capacitor whose external material is copper, and we want to calculate the heat flow of the copper material through thermal conduction. The following parameters are known: Thermal conductivity k: The thermal conductivity of copper is 398W / m·°C, Cross-sectional area A: Assume that the cross-sectional area through which the heat flows is 0.01m² (i.e. 10cm×10cm). Temperature difference △T: Assume that the temperature difference is 20°C (for example, the temperature on one side of the capacitor is 60°C and the other side is 40°C). Distance △x that the heat flow travels: The distance that the heat flow travels is 0.1m (i.e. 10cm). Substitute these values ​​into the heat conduction equation: , so the heat flux q cond is 796 watts (W). This means that the rate of heat transfer through the copper material is 796 joules per second.

[0043] S2012: The heat convection equation is: , where q conv is the heat convection heat flow, h is the convection heat transfer coefficient, X is the surface area of ​​the capacitor, T surface is the surface temperature of the capacitor, T ambient is the external ambient temperature.

[0044] Specifically, the convection equation describes the heat exchange process between the fluid and the surface of the object. The heat is transferred through the temperature difference between the fluid and the surface of the object. The various variables in the convection equation, such as the convection heat transfer coefficient (h), surface area (X), capacitor surface temperature (T surface ) and external ambient temperature (T ambient ), which determines the efficiency and flow rate of heat flow. Through this equation, the heat flow through the capacitor surface per unit time can be calculated, and then the change in surface temperature can be predicted to help evaluate the heat transfer capacity. Specific thermal convection processes include: when the capacitor surface is affected by an external fluid, the fluid transfers heat through the temperature difference between the fluid and the surface. If the surface temperature is higher than the ambient temperature, the heat will flow to the outside, otherwise heat will be absorbed. The efficiency of heat exchange between the fluid and the surface can be measured by the convection heat transfer coefficient (h). The surface area (X) affects the total range of heat flow, and the temperature difference (T surface -T ambient ) directly affects the heat transfer rate. The greater the difference between the surface temperature and the external ambient temperature, the faster the heat transfer. This equation can effectively predict and regulate heat transfer.

[0045] Furthermore, for example, when the capacitor surface is 0.2 m², the heat transfer coefficient is 50 W / m²·°C, the surface temperature is 80°C, and the external ambient temperature is 25°C, the heat convection equation can be used to calculate the heat flow, and the result is: At this time, the heat flow rate exchanged between the capacitor and the external environment through convection is 550 watts.

[0046] S2013: Combining the heat flow of thermal conduction and the heat flow of thermal convection, the heat accumulation rate is obtained by the following formula: , where W is the heat accumulation rate, γ j Refers to the temperature regulation feedback coefficient, △T j Refers to the temperature difference in the current area.

[0047] Specifically, the heat accumulation rate describes how the heat inside the capacitor gradually accumulates due to heat conduction and convection within a given time, thereby affecting the temperature change. By combining the heat conduction heat flow (q cond ) and convection heat flux (q conv ), can provide a more comprehensive estimate of the rate at which heat accumulates within the capacitor. Specifically, the heat accumulation rate (W) is the result of the combined effect of conduction and convection heat fluxes, and is controlled by the temperature-regulated feedback factor (γ j ) and the current regional temperature difference (△T j ). The temperature regulation feedback coefficient (γ j ) reflects the response characteristics between the capacitor and the ambient temperature change. The temperature difference (△T j ) directly affects the speed of heat flow. When the temperature difference is large, the speed of heat flow will also increase, and vice versa.

[0048] Furthermore, in practical applications, if the temperature difference between the capacitor surface and the environment (△T j ) is 10°C, the heat conduction heat flow (q cond ) is 500W, the heat convection heat flux (q conv ) is 300W, and the temperature regulation feedback coefficient (γ j ) is 1.2, then the heat accumulation rate can be calculated by the above formula: , which means that in this case, the rate at which the capacitor accumulates heat per unit time is 9600 watts.

[0049] In one embodiment, if Figure 4 As shown, in step S202, after the heat accumulation rate is calculated, the heat distribution diagram of each area inside the bolt-type capacitor is simulated by a heat analysis model, including: S2021: Obtain the geometric structure information of the bolt-type capacitor. Based on the geometric structure information, the thermal analysis model divides the bolt-type capacitor into multiple thermodynamic sub-regions.

[0050] Specifically, the geometric structure information of the bolt-type capacitor is first obtained by scanning, measuring or using CAD (computer-aided design) software, including the size, shape and relative position relationship between the components. Based on this information, the thermal analysis model can identify the various parts of the capacitor and divide the geometric structure information of the bolt-type capacitor into multiple thermodynamic sub-regions. For example, for a capacitor with multiple bolts and different thermal conductivity materials, the model can be divided into different thermodynamic sub-regions, each of which represents different physical properties, such as thermal conductivity, specific heat capacity, etc.

[0051] S2022: The thermal analysis model uses the calculated heat accumulation rate and the thermal properties of each sub-region to simulate the distribution of heat in each sub-region. By calculating the heat flow and accumulation in each region, a heat distribution map is generated.

[0052] Specifically, according to the geometric structure information of the bolt-type capacitor (such as shape, size, material distribution, etc.), the capacitor is divided into multiple small thermodynamic sub-regions. The size and shape of each sub-region should be as accurate as possible to ensure the accuracy of the calculation. For capacitors with complex shapes, mesh generation technology can be used to discretize the entire area into multiple small calculation units. Common mesh types include tetrahedral meshes, hexahedral meshes, etc. For each sub-region, the heat conduction equation is used for analysis. The heat conduction equation is usually based on the law of conservation of energy and Fourier's law: , where T is the temperature, α is the thermal diffusivity (related to the thermal conductivity, density and specific heat capacity of the material), ▽ 2 T is the spatial second-order derivative of temperature, representing the diffusion of heat, Q is the heat source density, ρ is the density of the material, and Cp is the specific heat capacity. This equation is used to describe the diffusion and accumulation of heat in each sub-region. Boundary conditions and initial conditions: In the calculation, boundary conditions and initial conditions need to be set. Boundary conditions can be heat exchange conditions between the capacitor surface and the external environment (such as convection boundary conditions, radiation boundary conditions, etc.), for example: , k is the thermal conductivity, is the normal heat flux, h is the convective heat transfer coefficient, T surface and T ambientare the surface temperature and the ambient temperature, respectively. The initial condition is the temperature distribution of the capacitor at the initial moment, and it is usually assumed that the temperature is uniformly distributed at the initial moment or is set according to the actual situation. The above equations are discretized by numerical methods (such as the finite element method, the finite difference method, or the finite volume method) to solve the temperature changes in each sub-region. In these methods, spatial discretization divides the temperature field into multiple grid nodes, and time discretization handles the evolution of temperature through the Euler method or the implicit method. For each time step, the temperature change of each sub-region is calculated and updated according to the heat accumulation rate. During the calculation process, it is necessary to track the heat flow in each region and calculate the process of heat transfer from one region to another. For example, if a heat source or heat flow flows into a sub-region, the heat accumulation value of the region needs to be adjusted. By calculating the temperature of each sub-region, combined with the position and shape of each sub-region, a heat distribution map can be drawn.

[0053] In one embodiment, if Figure 5 As shown, in step S30, the temperature change trend is predicted according to the heat accumulation rate, including: S301: Predict the temperature change trend based on the following formula: , where T next refers to the predicted temperature at the next moment, T0 refers to the temperature at the current moment, m refers to the mass of the capacitor, C p refers to the specific heat capacity of the capacitor, W refers to the heat accumulation rate, h refers to the heat convection heat transfer coefficient, L refers to the surface area of ​​the capacitor, T cap Refers to the internal temperature of the capacitor, T env refers to the external ambient temperature, and △t refers to the time step.

[0054] Specifically, starting from the current temperature T0, according to the mass m and specific heat capacity C of the capacitor p , we can calculate the temperature change. The temperature change is determined by the heat accumulation rate W of the capacitor and the influence of thermal convection, as follows: Heat accumulation rate (W), the heat accumulation rate W represents the heat absorbed or released by the capacitor due to heating or cooling, which is the main factor causing the temperature to rise or fall. The heat flow of thermal convection ( ): This part is the heat exchange rate between the capacitor surface and the external environment. If the capacitor temperature T cap Higher than the ambient temperature T env , then heat will be transferred from the capacitor to the environment and vice versa. This term is quantified by the convection heat transfer coefficient h and the surface area L. Combining these two parts together, we get the heat convection: , where the heat accumulation rate W will increase the temperature of the capacitor, while the thermal convection It will consume some heat and reduce the temperature. The difference between the two represents the total energy of temperature change per unit time. Then, according to the heat capacity of the capacitor , the effect of this heat on the capacitor temperature is adjusted proportionally. Ultimately, the change in capacitor temperature is related to the ratio of heat accumulation and dissipation, as well as the thermal capacity of the capacitor. Finally, combined with the time step △t, the temperature at the next moment can be calculated.

[0055] In one embodiment, if Figure 6 As shown, in step S50, the preset temperature target range is obtained, the real-time temperature adjustment result is compared with the preset temperature target range to obtain a temperature comparison result, and based on the temperature comparison result, the control system performs adaptive adjustment on the heating device or the cooling device, including: S501: Based on the temperature comparison result, if the real-time temperature adjustment result is lower than the preset temperature target range, the control system determines that additional heat is needed to increase the temperature, starts the heating device and adjusts the heating power according to the deviation between the current temperature and the lower limit temperature.

[0056] Specifically, when the real-time temperature adjustment result is lower than the preset temperature target range, the control system first detects this deviation and confirms that additional heat is needed to increase the temperature. At this time, the heating device is activated, and the intensity (power) of the heating is adjusted according to the difference between the current temperature and the lower limit of the target temperature. In actual operation, the control system first calculates the deviation between the current temperature and the lower limit of the target. For example, if the current temperature is T current , the target lower limit temperature is T lower , then the temperature deviation is T lower -T current . Based on this temperature difference, the control system determines how much heat is needed to raise the temperature so that the heating device can work effectively. Next, the control system adjusts the power of the heating device according to this temperature difference. If the temperature difference is large, the control system will let the heating device run at full power to increase the temperature as quickly as possible; if the temperature difference is small, the control system will adjust the power of the heating device to a lower value to avoid overheating and ensure that the temperature changes smoothly and does not exceed the preset range. In addition, in order to accurately control the heating process, the control system usually uses some adjustment algorithms, such as PID control (proportional-integral-differential control), which continuously monitors temperature changes during the heating process and adjusts the power output in real time so that the temperature can be stable and accurately close to the target temperature.

[0057] S502: Based on the temperature comparison result, if the real-time temperature adjustment result is higher than the preset temperature target range, the control system determines that heat needs to be reduced to lower the temperature, starts the cooling device and adjusts the cooling intensity according to the deviation between the current temperature and the upper limit temperature.

[0058] Specifically, when the real-time temperature adjustment result is higher than the preset temperature target range, the control system first detects this deviation and determines that heat needs to be reduced to lower the temperature. The control system starts the cooling device and adjusts the cooling intensity according to the deviation between the current temperature and the target upper limit temperature. Specifically, the control system first calculates the deviation between the current temperature and the upper limit temperature. For example, if the current temperature is T current , the target upper limit temperature is T upper , then the temperature deviation is T current -T upper . Based on the temperature difference, the control system will determine how much heat needs to be consumed to lower the temperature and adjust the working state of the cooling device. If the deviation is large, the control system will start a high-intensity cooling mode, such as increasing the fan speed or increasing the flow of coolant to accelerate the temperature drop; if the deviation is small, the control system will adjust the intensity of the cooling device to a moderate level to avoid overcooling and ensure that the temperature slowly drops back to the target range. In addition, the control system can use a PID control algorithm (proportional-integral-differential control), which monitors temperature changes in real time and automatically adjusts the intensity of the cooling device to stabilize the temperature within the target range.

[0059] S503: Based on the temperature comparison result, if the real-time temperature adjustment result is within the preset temperature target range, the control system maintains the current temperature control state, continuously monitors the temperature change, and ensures that the real-time temperature adjustment result is stable within the preset temperature target range.

[0060] Specifically, when the real-time temperature adjustment result is within the preset temperature target range, the control system will determine whether further adjustment is needed by detecting whether the temperature remains within the range. In this case, the control system will not make significant adjustments to the heating device or cooling device, but maintain the current temperature control state. The control system continuously monitors the real-time temperature and compares it with the upper and lower limits of the target temperature range. When the temperature is stable within the target range, the control system will collect data in real time through sensors and continuously compare it with the target value to confirm that the temperature has not deviated from the target range. If the temperature fluctuates slightly, the control system will fine-tune the output of the heating device or cooling device to ensure that the temperature continues to remain within the set target range.

[0061] In one embodiment, if Figure 7 As shown, after step S50, the temperature control method of the bolted capacitor further includes: S60: After obtaining the real-time temperature adjustment result, start the real-time feedback mechanism to continuously track the temperature change trend and analyze the law of temperature fluctuation.

[0062] Specifically, after obtaining the real-time temperature adjustment result, the system will start the real-time feedback mechanism, which continuously monitors and records the real-time temperature changes and analyzes the law of temperature fluctuations. In specific operation, the temperature sensor continuously collects the operating temperature of the capacitor and transmits the information to the control system in real time. After each temperature acquisition, the control system compares the current temperature with the preset target range to detect whether the temperature has deviated or fluctuated. The control system will also identify the trend and law of temperature fluctuations by analyzing the rate and amplitude of temperature change. For example, if the temperature continues to rise or fall, the system will identify whether there are periodic fluctuations or sudden temperature fluctuations through statistical data analysis. These analysis results will provide a basis for subsequent temperature control strategies, helping the system to determine whether it is necessary to adjust the working mode of the heating or cooling equipment, or optimize the response speed of temperature adjustment.

[0063] S70: Based on the law of temperature fluctuation, the temperature control strategy is adjusted, and the response time and adjustment range of the heating device and the cooling device are optimized by analyzing the temperature change rate and deviation.

[0064] Specifically, based on the law of temperature fluctuation, the control system first analyzes the temperature change rate and deviation. These data come from real-time temperature monitoring and previous temperature fluctuation trends. By comparing the difference between the current temperature and the target temperature, the control system can identify the speed and amplitude of the temperature change. If the temperature changes quickly, the system will identify that the response demand for temperature regulation is strong. If the temperature changes slowly, it means that the response demand for regulation is weak. According to these analysis results, the control system will adjust the temperature control strategy. If it is found that the temperature change rate is high, it means that the response of the heating or cooling equipment needs to be accelerated. The system will shorten the adjustment cycle of the heating or cooling device and increase the working intensity of the equipment. If the temperature changes slowly, the system will appropriately extend the adjustment cycle and slow down the adjustment intensity of the heating or cooling device to avoid overreaction. In addition, when the temperature deviation is large, the control system will increase the adjustment amplitude of the heating or cooling device to quickly correct the temperature deviation. If the deviation is small, the system will reduce the adjustment amplitude and finely control the temperature. Through the adjustment of these strategies, the temperature control system can flexibly adjust the working state of the heating and cooling equipment under different temperature change environments, optimize the response time and adjustment amplitude, so as to ensure that the bolt-type capacitor operates stably within the set temperature target range.

[0065] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0066] In one embodiment, a temperature control device for a bolt-type capacitor is provided, and the temperature control device for a bolt-type capacitor corresponds one-to-one with the temperature control method for a bolt-type capacitor in the above embodiment. Figure 8As shown, the bolt-type capacitor temperature control device includes a real-time temperature acquisition module, a heat analysis module, a temperature trend prediction module, a temperature control monitoring and adjustment module, and a temperature comparison and adjustment module. The detailed description of each functional module is as follows: A real-time temperature acquisition module is used to obtain the real-time temperature information of the bolt-type capacitor and the external environment temperature information; A thermal analysis module, for analyzing the heat accumulation rate and heat distribution diagram of the bolt-type capacitor using a thermal analysis model based on real-time temperature information and external environment temperature information; The temperature trend prediction module is used to predict the temperature change trend according to the heat accumulation rate, determine the temperature control requirements of the bolt-type capacitor according to the heat distribution diagram, and generate the corresponding temperature control strategy; The temperature control monitoring and adjustment module is used to adjust the working status of the heating device and the cooling device based on the temperature control strategy and temperature change trend to obtain real-time temperature adjustment results; The temperature comparison and adjustment module is used to obtain a preset temperature target range, compare the real-time temperature adjustment result with the preset temperature target range, and obtain a temperature comparison result. Based on the temperature comparison result, the control system adaptively adjusts the heating device or the cooling device.

[0067] Optional thermal analysis modules include: The heat accumulation rate calculation submodule is used to calculate the heat accumulation rate of each part of the bolt-type capacitor based on the real-time temperature information and the external environment temperature information, and the heat analysis model is based on the heat conduction equation and the heat convection equation; The heat distribution diagram submodule is used to simulate the heat distribution diagram of each area inside the bolt-type capacitor through a thermal analysis model after calculating the heat accumulation rate.

[0068] Optionally, the heat accumulation rate calculation submodule includes: Heat conduction equation unit, used for heat conduction equation is: , where q cond is the heat flow rate of heat conduction, k is the thermal conductivity of the material, A is the cross-sectional area through which the heat flows, △T is the temperature difference, and △x is the distance the heat flows; The heat convection equation unit is used for the heat convection equation: , where q conv is the heat convection heat flow, h is the convection heat transfer coefficient, X is the surface area of ​​the capacitor, T surface is the surface temperature of the capacitor, T ambient is the external ambient temperature; The comprehensive calculation unit is used to combine the heat flow of thermal conduction and the heat flow of thermal convection to obtain the heat accumulation rate through the following formula: , where W is the heat accumulation rate, γ j Refers to the temperature regulation feedback coefficient, △T j Refers to the temperature difference in the current area.

[0069] Optionally, the heat distribution map submodule includes: A geometric structure analysis unit is used to obtain geometric structure information of the bolt-type capacitor. Based on the geometric structure information, the thermal analysis model divides the bolt-type capacitor into multiple thermodynamic sub-regions; The heat distribution simulation unit is used for the heat analysis model to use the calculated heat accumulation rate and the thermal properties of each sub-area to simulate the distribution of heat in each sub-area. By calculating the heat flow and accumulation in each area, a heat distribution map is generated.

[0070] Optionally, the temperature trend prediction module includes: The temperature change trend prediction submodule is used to predict the temperature change trend based on the following formula: , where T next refers to the predicted temperature at the next moment, T0 refers to the temperature at the current moment, m refers to the mass of the capacitor, C p refers to the specific heat capacity of the capacitor, W refers to the heat accumulation rate, h refers to the convection heat transfer coefficient, L refers to the surface area of ​​the capacitor, Tcap refers to the internal temperature of the capacitor, Tenv refers to the external ambient temperature, and △t refers to the time step.

[0071] Optionally, the temperature comparison and adjustment module includes: The temperature adjustment submodule is used to determine the need to increase heat to increase the temperature based on the temperature comparison result, if the real-time temperature adjustment result is lower than the preset temperature target range, the control system starts the heating device and adjusts the heating power according to the deviation between the current temperature and the lower limit temperature; The temperature reduction regulation submodule is used to determine the need to reduce heat to lower the temperature based on the temperature comparison result, if the real-time temperature adjustment result is higher than the preset temperature target range, the control system starts the cooling device and adjusts the cooling intensity according to the deviation between the current temperature and the upper limit temperature; The temperature stability monitoring submodule is used to maintain the current temperature control state based on the temperature comparison result, if the real-time temperature adjustment result is within the preset temperature target range, and continuously monitor the temperature changes to ensure that the real-time temperature adjustment result is stable within the preset temperature target range.

[0072] Optionally, the temperature comparison and adjustment module includes: The real-time feedback mechanism module is used to start the real-time feedback mechanism after obtaining the real-time temperature adjustment results, continuously track the temperature change trend, and analyze the law of temperature fluctuation; The temperature control strategy optimization module is used to adjust the temperature control strategy based on the law of temperature fluctuations. By analyzing the temperature change rate and deviation, the response time and adjustment range of the heating and cooling devices are optimized.

[0073] The specific definition of the bolt-type capacitor temperature control device can be found in the definition of the bolt-type capacitor temperature control method above, which will not be repeated here. Each module in the above-mentioned bolt-type capacitor temperature control device can be implemented in whole or in part by software, hardware and a combination thereof. The above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to the above modules.

[0074] In one embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as follows: Fig. 9 As shown. The computer device includes a processor, a memory, a network interface and a database connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a bolt-type capacitor temperature control method is implemented.

[0075] In one embodiment, a computer device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the following steps when executing the computer program: Obtain real-time temperature information of bolt-type capacitors and external environment temperature information; Based on real-time temperature information and external environment temperature information, the heat accumulation rate and heat distribution diagram of the bolt-type capacitor are analyzed using a thermal analysis model; According to the heat accumulation rate, the temperature change trend is predicted, and according to the heat distribution diagram, the temperature control requirements of the bolt-type capacitor are determined, and the corresponding temperature control strategy is generated; Based on the temperature control strategy and temperature change trend, adjust the working status of the heating device and the cooling device to obtain real-time temperature adjustment results; Obtain a preset temperature target range, compare the real-time temperature adjustment result with the preset temperature target range, obtain a temperature comparison result, and based on the temperature comparison result, the control system adaptively adjusts the heating device or the cooling device.

[0076] In one embodiment, a computer readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the following steps are implemented: Obtain real-time temperature information of bolt-type capacitors and external environment temperature information; Based on real-time temperature information and external environment temperature information, the heat accumulation rate and heat distribution diagram of the bolt-type capacitor are analyzed using a thermal analysis model; According to the heat accumulation rate, the temperature change trend is predicted, and according to the heat distribution diagram, the temperature control requirements of the bolt-type capacitor are determined, and the corresponding temperature control strategy is generated; Based on the temperature control strategy and temperature change trend, adjust the working status of the heating device and the cooling device to obtain real-time temperature adjustment results; Obtain a preset temperature target range, compare the real-time temperature adjustment result with the preset temperature target range, obtain a temperature comparison result, and based on the temperature comparison result, the control system adaptively adjusts the heating device or the cooling device.

[0077] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0078] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0079] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A temperature control method for a bolt-type capacitor, characterized in that: The temperature control method of the bolt-type capacitor comprises: Acquiring real-time temperature information of the bolt-type capacitor and external environment temperature information; Based on the real-time temperature information and the external environment temperature information, using a thermal analysis model to analyze the heat accumulation rate and heat distribution diagram of the bolt-type capacitor; Predicting the temperature change trend according to the heat accumulation rate, determining the temperature control requirement of the bolt-type capacitor according to the heat distribution diagram, and generating a corresponding temperature control strategy; Based on the temperature control strategy and the temperature change trend, the working states of the heating device and the cooling device are adjusted to obtain a real-time temperature adjustment result; A preset temperature target range is obtained, and the real-time temperature adjustment result is compared with the preset temperature target range to obtain a temperature comparison result. Based on the temperature comparison result, the control system adaptively adjusts the heating device or the cooling device.

2. The temperature control method of bolt-type capacitor according to claim 1, characterized in that: The method of analyzing the heat accumulation rate and heat distribution diagram of the bolt-type capacitor by using a heat analysis model based on the real-time temperature information and the external environment temperature information includes: Based on the real-time temperature information and the external environment temperature information, the thermal analysis model calculates the heat accumulation rate of each part of the bolt-type capacitor based on the heat conduction equation and the heat convection equation; After the heat accumulation rate is calculated, the heat distribution diagram of each area inside the bolt-type capacitor is simulated by the thermal analysis model.

3. The temperature control method of bolt-type capacitor according to claim 2, characterized in that: Based on the real-time temperature information and the external environment temperature information, the heat analysis model calculates the heat accumulation rate of each part of the bolt-type capacitor based on the heat conduction equation and the heat convection equation, including: The heat conduction equation is: , where q cond is the heat conduction heat flow, k is the thermal conductivity of the material, A is the cross-sectional area through which the heat flows, ΔT is the temperature difference, and Δx is the distance the heat flows; The heat convection equation is: , where q conv is the heat convection heat flow, h is the convection heat transfer coefficient, X is the capacitor surface area, T surface is the capacitor surface temperature, the T ambient is the external ambient temperature; Combining the heat conduction heat flux and the heat convection heat flux, the heat accumulation rate is obtained by the following formula: , where W refers to the heat accumulation rate, and γ j refers to the temperature regulation feedback coefficient, the △T j Refers to the temperature difference in the current area.

4. The temperature control method of bolt-type capacitor according to claim 2, characterized in that: After calculating the heat accumulation rate, simulating the heat distribution diagram of each area inside the bolt-type capacitor by using the heat analysis model includes: Acquiring geometric structure information of the bolt-type capacitor, and based on the geometric structure information, the thermal analysis model divides the bolt-type capacitor into a plurality of thermodynamic sub-regions; The heat analysis model uses the calculated heat accumulation rate and combines the thermal properties of each sub-region to simulate the distribution of heat in each sub-region, and generates the heat distribution map by calculating the heat flow and accumulation of each region.

5. The temperature control method of bolt-type capacitor according to claim 1, characterized in that: The predicting of the temperature change trend according to the heat accumulation rate includes: The temperature change trend is predicted based on the following formula: , where the T next is the predicted temperature at the next moment, T0 is the temperature at the current moment, m is the mass of the capacitor, and C p refers to the specific heat capacity of the capacitor, the W refers to the heat accumulation rate, the h refers to the heat convection heat transfer coefficient, the L refers to the surface area of ​​the capacitor, the T cap refers to the internal temperature of the capacitor, the T env refers to the external ambient temperature, and Δt refers to the time step.

6. The temperature control method of bolt-type capacitor according to claim 1, characterized in that: The step of obtaining a preset temperature target range, comparing the real-time temperature adjustment result with the preset temperature target range to obtain a temperature comparison result, and based on the temperature comparison result, the control system adaptively adjusting the heating device or the cooling device comprises: Based on the temperature comparison result, if the real-time temperature adjustment result is lower than the preset temperature target range, the control system determines that it is necessary to increase the heat to increase the temperature, starts the heating device and adjusts the heating power according to the deviation between the current temperature and the lower limit temperature; Based on the temperature comparison result, if the real-time temperature adjustment result is higher than the preset temperature target range, the control system determines that heat needs to be reduced to lower the temperature, starts the cooling device and adjusts the cooling intensity according to the deviation between the current temperature and the upper limit temperature; Based on the temperature comparison result, if the real-time temperature adjustment result is within the preset temperature target range, the control system maintains the current temperature control state, continuously monitors temperature changes, and ensures that the real-time temperature adjustment result is stable within the preset temperature target range.

7. The temperature control method of bolt-type capacitor according to claim 1, characterized in that: The temperature control method of the bolt-type capacitor further includes: After obtaining the real-time temperature adjustment result, a real-time feedback mechanism is started to continuously track the temperature change trend and analyze the law of temperature fluctuation; Based on the law of the temperature fluctuation, the temperature control strategy is adjusted, and the response time and adjustment range of the heating device and the cooling device are optimized by analyzing the temperature change rate and deviation.

8. A bolt-type capacitor temperature control device, characterized in that: The bolt-type capacitor temperature control device comprises: A real-time temperature acquisition module, used to acquire real-time temperature information of the bolt-type capacitor and external environment temperature information; A heat analysis module, configured to analyze the heat accumulation rate and heat distribution diagram of the bolt-type capacitor using a heat analysis model based on the real-time temperature information and the external environment temperature information; A temperature trend prediction module, used to predict the temperature change trend according to the heat accumulation rate, determine the temperature control requirement of the bolt-type capacitor according to the heat distribution diagram, and generate a corresponding temperature control strategy; A temperature control monitoring and adjustment module, used to adjust the working states of the heating device and the cooling device based on the temperature control strategy and the temperature change trend, and obtain real-time temperature adjustment results; The temperature comparison and adjustment module is used to obtain a preset temperature target range, compare the real-time temperature adjustment result with the preset temperature target range, obtain a temperature comparison result, and based on the temperature comparison result, the control system adaptively adjusts the heating device or the cooling device.

9. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the steps of the temperature control method for a bolt-type capacitor as claimed in any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the steps of the temperature control method for a bolt-type capacitor as claimed in any one of claims 1 to 7 are implemented.

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