Bolt-Type Capacitor Temperature Control Method, Device, Equipment and Medium

Abstract

The present invention relates to the technical field of temperature control of bolt-type capacitors. Specifically, it relates to a temperature control method, device, equipment and medium for bolt-type capacitors. The method includes analyzing the heat accumulation rate and heat distribution map of the bolt-type capacitor by using a heat analysis model based on real-time temperature information and external environmental temperature information, predicting the temperature change trend according to the heat accumulation rate, determining the temperature control requirements of the bolt-type capacitor according to the heat distribution map, generating a corresponding temperature control strategy, adjusting the working states of the heating device and the cooling device based on the temperature control strategy and the temperature change trend to obtain a real-time temperature adjustment result, obtaining a preset temperature target range, comparing the real-time temperature adjustment result with the preset temperature target range to obtain a temperature comparison result, and adaptively adjusting the heating device or the cooling device by the control system based on the temperature comparison result. The present invention has the effect of realizing precise temperature monitoring of the bolt-type capacitor.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature control of bolt-type capacitors, and in particular, to a temperature control method, device, equipment and medium for bolt-type capacitors. Background Art

[0002] As a high-voltage and high-capacity energy storage device, bolt-type capacitors are widely used in power systems, electrical equipment, and various industrial applications. To ensure its stable operation during work, controlling its temperature becomes crucial. The internal structure of bolt-type capacitors is complex, and a large amount of heat is generated during operation. If the temperature cannot be controlled in a timely and effective manner, it may lead to overheating inside the capacitor, performance degradation, or even failure or damage. Summary of the Invention

[0003] To achieve precise monitoring of the temperature of bolt-type capacitors, the present application provides a temperature control method, device, equipment and medium for bolt-type capacitors.

[0004] The first above-mentioned invention object of the present application is achieved through the following technical solutions:

[0005] A temperature control method for bolt-type capacitors, the temperature control method for bolt-type capacitors includes:

[0006] Obtain the real-time temperature information and external environment temperature information of the bolt-type capacitor;

[0007] Based on the real-time temperature information and the external environment temperature information, use a heat analysis model to analyze the heat accumulation rate and heat distribution map of the bolt-type capacitor;

[0008] According to the heat accumulation rate, predict the temperature change trend, and according to the heat distribution map, determine the temperature control requirements of the bolt-type capacitor, and generate a corresponding temperature control strategy;

[0009] Based on the temperature control strategy and the temperature change trend, adjust the working states of the heating device and the cooling device to obtain a real-time temperature adjustment result;

[0010] Obtain a preset temperature target range, compare the real-time temperature adjustment result with the preset temperature target range to obtain a temperature comparison result, and based on the temperature comparison result, the control system adaptively adjusts the heating device or the cooling device.

[0011] By adopting the above technical solution, by obtaining real-time temperature information and external environmental temperature information, and analyzing the heat accumulation rate and distribution of the bolt-type capacitor in combination with the heat analysis model, it is possible to predict the temperature change trend and heat distribution in real time, ensure that the adjustment of the heating and cooling devices is very precise, avoid overheating or overcooling, and thus stabilize the temperature. Dynamic adjustment and adaptive control are important advantages of this solution. The temperature control strategy can be flexibly adjusted according to the real-time temperature change trend, and automatically adjust the power and intensity of the heating or cooling device according to the deviation between the actual temperature and the target temperature range. This adaptive control can effectively respond to environmental changes and ensure that the temperature is always within the ideal range.

[0012] In a preferred example of the present application, it can be further configured that: based on the real-time temperature information and the external environmental temperature information, using the heat analysis model to analyze the heat accumulation rate and heat distribution map of the bolt-type capacitor, including:

[0013] Based on the real-time temperature information and the external environmental temperature information, the heat analysis model calculates the heat accumulation rate of each part of the bolt-type capacitor based on the heat conduction equation and the heat convection equation;

[0014] After calculating the heat accumulation rate, the heat analysis model simulates the heat distribution map of each region inside the bolt-type capacitor.

[0015] By adopting the above technical solution, based on the real-time temperature information and the external environmental temperature information, by combining the heat analysis model with the heat conduction equation and the heat convection equation to calculate the heat accumulation rate of each part of the bolt-type capacitor, and further simulating the heat distribution map of each region inside, it is possible to accurately master the heat flow and accumulation of the bolt-type capacitor under different working conditions, so as to formulate a more accurate temperature control strategy and avoid abnormal temperature fluctuations. By simulating the distribution of each region through the heat analysis model, it is possible to more clearly understand the influence of temperature changes on different parts of the capacitor, so that the temperature control strategy can be adjusted targeted according to regional differences in actual applications, ensuring that the temperature of each region can be within the ideal range and improving the accuracy and stability of temperature control.

[0016] In a preferred example of the present application, it can be further configured that: based on the real-time temperature information and the external environmental temperature information, the heat analysis model calculates the heat accumulation rate of each part of the bolt-type capacitor based on the heat conduction equation and the heat convection equation, including:

[0017] The heat conduction equation is:

[0018] , where the q condwhere \(q_{cond}\) is the heat conduction heat flux, \(k\) is the thermal conductivity of the material, \(A\) is the cross-sectional area through which the heat flux passes, \(\Delta T\) is the temperature difference, and \(\Delta x\) is the distance over which the heat flux propagates;

[0019] The heat convection equation is:

[0020] , where \(q\) conv is the heat convection heat flux, \(h\) is the convective heat transfer coefficient, \(X\) is the surface area of the capacitor, \(T\) surface is the surface temperature of the capacitor, and \(T\) ambient is the external ambient temperature;

[0021] Combining the heat conduction heat flux and the heat convection heat flux, the heat accumulation rate is obtained through the following formula:

[0022] , where \(W\) refers to the heat accumulation rate, \(\gamma\) j refers to the temperature regulation feedback coefficient, and \(\Delta T\) j refers to the temperature difference in the current region.

[0023] By adopting the above technical solution, by combining the heat conduction equation and the heat convection equation, the heat conduction heat flux and the heat convection heat flux in each region of the capacitor can be calculated respectively, and the heat accumulation rate can be obtained through the corresponding formula. This method can fully consider the interaction of different heat flow processes and accurately simulate the heat flow and change in the bolt-type capacitor. By introducing the temperature regulation feedback coefficient and the temperature difference in the current region, the heat accumulation rate can be flexibly adjusted according to the temperature change during the actual working process, so that the temperature control effect inside the capacitor can be optimized in real time. This feedback regulation mechanism ensures that the system can continuously adjust the temperature according to the changes in the environment and working conditions, further improving the adaptability and accuracy of temperature control.

[0024] In a preferred example of the present application, it can be further configured that: after calculating the heat accumulation rate, the heat distribution map of each region inside the bolt-type capacitor is simulated through the heat analysis model, including:

[0025] Obtain the geometric structure information of the bolt-type capacitor. Based on the geometric structure information, the heat analysis model divides the bolt-type capacitor into multiple thermodynamic sub-regions;

[0026] The heat analysis model uses the calculated heat accumulation rate and combines the thermal properties of each sub-region to simulate the distribution of heat in each sub-region. By calculating the heat flow and accumulation in each region, the heat distribution map is generated.

[0027] By adopting the above technical solution, the geometric structure information of the bolt-type capacitor is obtained and divided into multiple thermodynamic sub-regions. Fine heat analysis is carried out by combining the thermal characteristics of each sub-region, avoiding the errors that may be brought by the unified treatment of the whole capacitor in the traditional method, thereby improving the accuracy of heat analysis. Secondly, based on the heat accumulation rate and thermal properties, the distribution of heat in each sub-region is simulated to generate an accurate heat distribution map, providing an accurate basis for the formulation and optimization of the temperature control strategy. In addition, by calculating the heat flow and accumulation in each region in detail, the system can accurately predict the temperature change trend and dynamically adjust the temperature control strategy, so as to effectively keep the bolt-type capacitor within the optimal operating temperature range and avoid the risk of overheating or insufficient cooling.

[0028] In a preferred example of the present application, it can be further configured that: predicting the temperature change trend according to the heat accumulation rate includes:

[0029] Predicting the temperature change trend based on the following formula:

[0030] , where the T next refers to the predicted temperature at the next moment, the T 0 refers to the current temperature, the m refers to the mass of the capacitor, the C p refers to the specific heat capacity of the capacitor, the W refers to the heat accumulation rate, the h refers to the convective heat transfer coefficient, the L refers to the surface area of the capacitor, the T cap refers to the internal temperature of the capacitor, the T env refers to the external environmental temperature, and the △t refers to the time step.

[0031] By adopting the above technical solution, according to the current capacitor temperature, physical properties (such as mass and specific heat capacity) and external factors (such as environmental temperature and convective heat transfer coefficient), combined with the heat accumulation rate and surface area of the capacitor, the temperature change at the next moment is calculated. Through this dynamic prediction based on the physical model, the temperature change trend can be grasped in advance, and then the temperature control strategy can be optimized.

[0032] In a preferred example of the present application, it can be further configured that: obtaining the preset temperature target range, comparing the real-time temperature adjustment result with the preset temperature target range to obtain a temperature comparison result, and based on the temperature comparison result, the control system adaptively adjusts the heating device or the cooling device, including:

[0033] Based on the temperature comparison result, if the real-time temperature adjustment result is lower than the preset temperature target range, the control system determines that heat needs to be increased to raise the temperature, activates the heating device, and adjusts the heating power according to the deviation between the current temperature and the lower limit temperature;

[0034] Based on the temperature comparison result, if the real-time temperature adjustment result is higher than the preset temperature target range, the control system determines that heat needs to be reduced to lower the temperature, activates the cooling device, and adjusts the cooling intensity according to the deviation between the current temperature and the upper limit temperature;

[0035] Based on the temperature comparison result, if the real-time temperature adjustment result is within the preset temperature target range, the control system maintains the current temperature control state, continuously monitors the temperature change, and ensures that the real-time temperature adjustment result is stable within the preset temperature target range.

[0036] By adopting the above technical solution, based on the comparison between the real-time temperature adjustment result and the preset temperature target range, the working states of the heating device and the cooling device are flexibly adjusted to ensure that the temperature always remains within the set optimal range. When the temperature is lower than the target range, the system can automatically increase heat, activate the heating device, and dynamically adjust the heating power according to the deviation between the temperature and the lower limit temperature; when the temperature is higher than the target range, the system will activate the cooling device and reduce the temperature by adjusting the cooling intensity; if the temperature is within the target range, the system will maintain the current temperature control state and continuously monitor the temperature change to ensure temperature stability.

[0037] In a preferred example of the present application, it can be further configured as follows: The bolt-type capacitor temperature control method further includes:

[0038] After obtaining the real-time temperature adjustment result, activate the real-time feedback mechanism, continuously track the temperature change trend, and analyze the law of temperature fluctuation;

[0039] Based on the law of temperature fluctuation, adjust the temperature control strategy, and optimize the response time and adjustment range of the heating device and the cooling device by analyzing the temperature change rate and deviation.

[0040] By adopting the above technical solution, the real-time feedback mechanism can continuously track the temperature change trend, and by analyzing the law of temperature fluctuation, predict the possible temperature change trend and fluctuation mode, thereby providing a basis for adjusting the temperature control strategy. Based on these laws, the temperature control strategy will be dynamically adjusted according to the actual temperature fluctuation situation, optimizing the response time and adjustment range of the heating device and the cooling device to ensure that the system can quickly and effectively respond to temperature changes.

[0041] The above second invention object of the present application is achieved by the following technical solutions:

[0042] A bolt - type capacitor temperature control device, the bolt - type capacitor temperature control device comprising:

[0043] A real - time temperature acquisition module for acquiring the real - time temperature information of the bolt - type capacitor and the external environment temperature information;

[0044] A heat analysis module for analyzing the heat accumulation rate and heat distribution map of the bolt - type capacitor based on the real - time temperature information and the external environment temperature information by using a heat analysis model;

[0045] A temperature trend prediction module for predicting the temperature change trend according to the heat accumulation rate, determining the temperature control requirements of the bolt - type capacitor according to the heat distribution map, and generating a corresponding temperature control strategy;

[0046] A temperature control monitoring and adjustment module for adjusting the working states of the heating device and the cooling device based on the temperature control strategy and the temperature change trend to obtain a real - time temperature adjustment result;

[0047] A temperature comparison and adjustment module for obtaining a preset temperature target range, comparing the real - time temperature adjustment result with the preset temperature target range to obtain a temperature comparison result, and based on the temperature comparison result, the control system adaptively adjusts the heating device or the cooling device.

[0048] By adopting the above - mentioned technical solution, by acquiring the real - time temperature information and the external environment temperature information, and combining with the heat analysis model to analyze the heat accumulation rate and distribution of the bolt - type capacitor, it is possible to predict the temperature change trend and heat distribution in real time, ensure that the adjustment of the heating and cooling devices is very precise, avoid over - heating or over - cooling, and thus stabilize the temperature. Dynamic adjustment and adaptive control are important advantages of this solution. The temperature control strategy can be flexibly adjusted according to the real - time temperature change trend, and the power and intensity of the heating or cooling device are automatically adjusted according to the deviation between the actual temperature and the target temperature range. This adaptive control can effectively respond to environmental changes and ensure that the temperature is always within the ideal range.

[0049] The above - mentioned third object of the present application is achieved by the following technical solution:

[0050] A computer device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the steps of the above - mentioned bolt - type capacitor temperature control method are implemented.

[0051] The above - mentioned fourth object of the present application is achieved by the following technical solution:

[0052] A computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the above-mentioned temperature control method for bolt-type capacitors are implemented.

[0053] In summary, the present application includes at least one of the following beneficial technical effects:

[0054] 1. By obtaining real-time temperature information and external environmental temperature information, and analyzing the heat accumulation rate and distribution of bolt-type capacitors in combination with a heat analysis model, it is possible to predict the temperature change trend and heat distribution in real time, ensure that the adjustment of heating and cooling devices is very precise, avoid overheating or overcooling, and thus stabilize the temperature. Dynamic adjustment and adaptive control are important advantages of this solution. The temperature control strategy can be flexibly adjusted according to the real-time temperature change trend, and the power and intensity of the heating or cooling device are automatically adjusted according to the deviation between the actual temperature and the target temperature range. This adaptive control can effectively respond to environmental changes and ensure that the temperature is always within the ideal range;

[0055] 2. By combining the heat conduction equation and the heat convection equation, it is possible to calculate the heat conduction heat flux and heat convection heat flux in each region of the capacitor respectively, and obtain the heat accumulation rate through corresponding formulas. This method can fully consider the interaction of different heat flow processes and accurately simulate the heat flow and change in bolt-type capacitors. By introducing a temperature adjustment feedback coefficient and the temperature difference in the current region, the heat accumulation rate can be flexibly adjusted according to temperature changes during the actual working process, so that the temperature control effect inside the capacitor can be optimized in real time. This feedback adjustment mechanism ensures that the system can continuously adjust the temperature according to changes in the environment and working conditions, further improving the adaptability and accuracy of temperature control;

[0056] 3. Based on the comparison between the real-time temperature adjustment result and the preset temperature target range, flexibly adjust the working states of the heating device and the cooling device to ensure that the temperature always remains within the set optimal range. When the temperature is lower than the target range, the system can automatically increase heat, start the heating device, and dynamically adjust the heating power according to the deviation between the temperature and the lower limit temperature; when the temperature is higher than the target range, the system will start the cooling device and reduce the temperature by adjusting the cooling intensity; if the temperature is within the target range, the system will maintain the current temperature control state, continuously monitor the temperature change, and ensure temperature stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Figure 1 is a schematic structural diagram of the temperature control method for bolt-type capacitors in an embodiment of the application;

[0058] Figure 2 is a flowchart of the implementation in step S20 of the temperature control method for bolt-type capacitors in an embodiment of the present application;

[0059] Figure 3 It is the implementation flowchart in step S201 of the temperature control method for bolt-type capacitors in an embodiment of the present application;

[0060] Figure 4 It is the implementation flowchart in step S202 of the temperature control method for bolt-type capacitors in an embodiment of the present application;

[0061] Figure 5 It is the implementation flowchart in step S30 of the temperature control method for bolt-type capacitors in an embodiment of the present application;

[0062] Figure 6 It is the implementation flowchart in step S50 of the temperature control method for bolt-type capacitors in an embodiment of the present application;

[0063] Figure 7 It is the implementation flowchart after step S50 of the temperature control method for bolt-type capacitors in an embodiment of the present application;

[0064] Figure 8 It is a principle block diagram of a temperature control device for bolt-type capacitors in an embodiment of the present application;

[0065] Figure 9 It is a schematic diagram of the device in an embodiment of the present application. Detailed implementation manners

[0066] The present application will be further described in detail below with reference to the accompanying drawings.

[0067] In one embodiment, as Figure 1 shown, the present application discloses a temperature control method for bolt-type capacitors, which specifically includes the following steps:

[0068] S10: Obtain the real-time temperature information and external environmental temperature information of the bolt-type capacitor.

[0069] Specifically, by installing temperature sensors at multiple positions of the bolt-type capacitor, such as the surface of the capacitor housing, internal electrodes, and isolation layers, these sensors can monitor the temperature changes inside and outside the capacitor in real time. The sensors adopt high-precision temperature measurement technologies, such as thermocouples or platinum resistance temperature detectors (RTDs). In addition, environmental temperature sensors are set in the environment around the capacitor to obtain the temperature information outside the capacitor in real time.

[0070] S20: Based on the real-time temperature information and external environmental temperature information, use a heat analysis model to analyze the heat accumulation rate and heat distribution map of the bolt-type capacitor.

[0071] Specifically, using the acquired real-time temperature information and external ambient temperature information, the heat accumulation rate and heat distribution map of the capacitor are used as model inputs, and the heat inside the capacitor is simulated through the thermal analysis model. The model calculates the heat accumulation rate in different areas based on the heat conduction equation and the heat convection equation. In this process, the material properties, shape, internal structure and external ambient temperature of the capacitor are comprehensively considered. Specifically, first, based on the geometric parameters of the capacitor (such as volume, surface area, wall thickness, etc.), combined with the measured temperature information, the heat accumulation rate inside the capacitor is obtained by calculating the conduction and convection effects of heat. Subsequently, the thermal analysis model will simulate the heat distribution of each sub-area of ​​the capacitor according to the thermal characteristics of each area (such as thermal conductivity, specific heat capacity, etc.), and generate the corresponding heat distribution map.

[0072] S30: predicting the temperature change trend according to the heat accumulation rate, determining the temperature control requirement of the bolt-type capacitor according to the heat distribution diagram, and generating a corresponding temperature control strategy.

[0073] Specifically, by combining the heat accumulation rate with the thermal properties of the bolt-type capacitor (such as heat capacity, thermal conductivity, etc.), the thermal model can be used to infer the temperature change trend of the capacitor at different time nodes. For example, through the calculation formula, combined with the accumulation rate and the mass of the capacitor, the temperature increase or decrease of the capacitor within a certain period of time can be estimated. At the same time, according to the heat distribution map, the temperature distribution of each area inside the capacitor can be analyzed, and the areas with higher or lower temperatures can be identified, and further inferred which areas require additional heating or cooling. Combining this information, the temperature control strategy can be generated according to the real-time temperature demand, including determining the start time and adjustment range of the heating device or cooling device. For example, if the temperature change trend indicates that the temperature is about to exceed the upper limit, the strategy will recommend starting the cooling device. If the temperature is too low, the heating device will be started for heating.

[0074] S40: Based on the temperature control strategy and the temperature change trend, the working states of the heating device and the cooling device are adjusted to obtain a real-time temperature adjustment result.

[0075] Specifically, based on the temperature control strategy and the temperature change trend, first compare the real-time temperature with the target range in the temperature control strategy. If the current temperature deviates from the target range, adjust the heating device and the cooling device according to the temperature change trend. Suppose the temperature rises too fast, then slow down the temperature rise by reducing the heating power or increasing the cooling intensity of the cooling device; conversely, if the temperature drops too fast, appropriately increase the power of the heating device or reduce the working intensity of the cooling device to maintain the temperature stability. This adjustment process will be dynamically updated continuously according to the temperature change trend and the feedback result. For example, if the temperature change trend shows that the temperature is approaching the upper limit value, reduce the power of the heating device, or further strengthen the working of the cooling device; if the temperature is approaching the lower limit value, increase the output power of the heating device, or reduce the cooling intensity of the cooling device. After each adjustment, it is necessary to measure and feedback the actual temperature after adjustment through the real-time monitoring system, and compare it with the target temperature range until it reaches or maintains within the target temperature range, and finally obtain the real-time temperature adjustment result.

[0076] S50: Obtain the preset temperature target range, compare the real-time temperature adjustment result with the preset temperature target range to obtain the temperature comparison result, and based on the temperature comparison result, the control system adaptively adjusts the heating device or the cooling device.

[0077] In this embodiment, the control system refers to an automated device adjustment mechanism that can dynamically adjust the working states of the heating device and the cooling device according to the real-time temperature monitoring data and the preset temperature target range. Specifically, the control system calculates the deviation between the real-time temperature and the target temperature range through a temperature comparison algorithm, and makes adjustment decisions according to the size of the deviation. For example, keep the temperature within the preset range by adjusting the heating power or the cooling intensity. The control system may include components such as sensors, actuators, feedback loops, and control algorithms. Among them, the sensors collect the temperature data of the capacitor in real time, and the actuators adjust the working states of the heating or cooling equipment according to the control signals.

[0078] Specifically, by obtaining the preset temperature target range and comparing the real-time monitoring result with the preset temperature target range. First, if the current temperature is lower than the lower limit value of the target range, it is judged that heat needs to be increased, start the heating device and adjust the heating power according to the gap between the current temperature and the lower limit value. If the current temperature is higher than the upper limit value of the preset temperature target range, heat needs to be reduced, start the cooling device and adjust the cooling intensity according to the gap between the current temperature and the upper limit value; when the current temperature is within the preset temperature target range, the control system maintains the current temperature control state and continues to monitor the temperature change to ensure that the temperature is stable within the target range. Through the temperature comparison result, the control system dynamically adjusts the working states of the heating device and the cooling device in real time according to the size of the deviation, ensuring that the equipment operates within the optimal working temperature range.

[0079] In one embodiment, as Figure 2 shown, in step S20, based on the real-time temperature information and the external environmental temperature information, the heat analysis model analyzes the heat accumulation rate and the heat distribution map of the bolt-type capacitor, including:

[0080] S201: Based on the real-time temperature information and the external environmental temperature information, the heat analysis model calculates the heat accumulation rate of each part of the bolt-type capacitor based on the heat conduction equation and the heat convection equation.

[0081] Specifically, the heat analysis model first calculates the heat accumulation rate of each part according to the real-time temperature information and the external environmental temperature information, in combination with the material properties and geometric structure of different parts of the capacitor, through the principles of heat conduction and heat convection. In terms of heat conduction, the model considers the heat transfer process caused by the temperature difference between different parts of the capacitor, and uses the thermal conductivity of the capacitor material and the cross-sectional area of heat flow propagation to estimate how heat flows from the higher-temperature part to the lower-temperature part. In terms of heat convection, the model analyzes the heat exchange between the capacitor surface and the external environment, mainly considering the heat carried away by air flow, especially the difference between the capacitor surface temperature and the surrounding environment temperature. Through the comprehensive analysis of these two heat transfer methods, the heat analysis model can calculate the heat accumulation rate of each part of the capacitor.

[0082] S202: After calculating the heat accumulation rate, simulate the heat distribution map of each region inside the bolt-type capacitor through the heat analysis model.

[0083] Specifically, after calculating the heat accumulation rate of each part, the heat analysis model carefully divides different regions inside the capacitor, and based on the previously obtained heat accumulation rate data, simulates the heat distribution in each region. The model divides the capacitor into multiple thermodynamic sub-regions according to the geometric shape and material properties of the capacitor. The heat distribution in each sub-region is affected by the temperature and heat flow of the surrounding regions. Through the heat analysis model, combined with the thermal properties of different regions, such as thermal conductivity, specific heat capacity, etc., simulate the heat propagation process inside the capacitor. The model takes into account how heat is transferred from the higher-temperature region to the lower-temperature region, and also considers the heat dissipation between the surface and the external environment. The output heat distribution map of the model can detail the heat distribution state of each sub-region of the capacitor.

[0084] In one embodiment, as Figure 3 shown, in step S201, based on the real-time temperature information and the external environmental temperature information, the heat analysis model calculates the heat accumulation rate of each part of the bolt-type capacitor based on the heat conduction equation and the heat convection equation, including:

[0085] S2011: The heat conduction equation is:

[0086] , where q cond is the heat conduction heat flux, k is the thermal conductivity of the material, A is the cross-sectional area through which the heat flux passes, ΔT is the temperature difference, and Δx is the distance of heat flux propagation.

[0087] Specifically, the heat conduction equation describes the process of heat propagation within an object through a material, where the heat conduction heat flux (q cond ) is closely related to the thermal conductivity of the material (k), the cross-sectional area through which the heat flux passes (A), the temperature difference (ΔT), and the distance of heat flux propagation (Δx). Through this equation, the amount of heat passing through a unit area per unit time can be calculated, and thus the heat distribution within the material can be predicted. For example, when the metal part of a capacitor or other heat-conducting material is heated, the heat will flow from the high-temperature region to the low-temperature region through the heat conduction path, and the use of the equation can help accurately evaluate the efficiency of heat flow. In practical applications, the temperature difference (ΔT) refers to the temperature difference between adjacent regions, the thermal conductivity of the material (k) determines the ease of heat flow, and the distance of heat flux propagation (Δx) and the cross-sectional area through which the heat flux passes (A) affect the range and intensity of heat conduction.

[0088] Further, assume a bolt-type capacitor with its external material being copper, and we want to calculate the heat conduction heat flux of the copper material. Given the following parameters: Thermal conductivity k: The thermal conductivity of copper is 398 W / m·°C. Cross-sectional area A: Assume the cross-sectional area through which the heat flux passes is 0.01 m² (i.e., 10 cm × 10 cm). Temperature difference ΔT: Assume the temperature difference is 20 °C (for example, the temperature on one side of the capacitor is 60 °C and on the other side is 40 °C). Distance of heat flux propagation Δx: The distance of heat flux propagation is 0.1 m (i.e., 10 cm). Substitute these values into the heat conduction equation:

[0089] , so the heat conduction heat flux q cond is 796 watts (W). This means that the rate of heat transfer through the copper material is 796 joules per second.

[0090] S2012: The heat convection equation is:

[0091] , where q conv is the heat convection heat flux, h is the convective heat transfer coefficient, X is the surface area of the capacitor, T surface is the surface temperature of the capacitor, and T ambient is the external ambient temperature.

[0092] Specifically, the heat convection equation describes the heat exchange process between a fluid and the surface of an object, where heat is transferred through the temperature difference between the fluid and the object surface. Each variable in the heat convection equation, such as the convective heat transfer coefficient (h), surface area (X), the surface temperature of the capacitor (T surface ) and the external ambient temperature (T ambient ), determines the efficiency and flow rate of heat transfer. Through this equation, the heat flow rate through the surface of the capacitor per unit time can be calculated, and then the change in surface temperature can be predicted to help evaluate the heat transfer capacity. The specific heat convection process is as follows: When the surface of the capacitor is affected by an external fluid, the fluid transfers heat through the temperature difference with the surface. If the surface temperature is higher than the ambient temperature, heat will flow to the outside; otherwise, heat absorption will occur. The convective heat transfer coefficient (h) can measure the efficiency of heat exchange between the fluid and the surface, the surface area (X) affects the total range of heat flow, and the temperature difference (T surface -T ambient ) directly affects the heat transfer rate. The greater the difference between the surface temperature and the external ambient temperature, the faster the heat transfer. Through this equation, the heat transfer can be effectively predicted and regulated.

[0093] Furthermore, for example, when the surface area of the capacitor is 0.2 m², the heat transfer coefficient is 50 W / m²·°C, the surface temperature is 80 °C, and the external ambient temperature is 25 °C, the heat flow can be calculated using the heat convection equation to obtain:

[0094] , at this time, the heat flow rate exchanged between the capacitor and the external environment through convection is 550 watts.

[0095] S2013: Combine the heat conduction heat flow and the heat convection heat flow to obtain the heat accumulation rate through the following formula:

[0096] , where W refers to the heat accumulation rate, γ j refers to the temperature regulation feedback coefficient, and △T j refers to the temperature difference in the current area.

[0097] Specifically, the heat accumulation rate describes how the heat inside the capacitor gradually accumulates due to the effects of heat conduction and heat convection within a given time, thereby affecting the temperature change. By combining the heat conduction heat flow (q cond ) and the heat convection heat flow (q conv ), the accumulation rate of heat in the capacitor can be estimated more comprehensively. Specifically, the heat accumulation rate (W) is the result of the combined action of the heat flows of conduction and convection, and is affected by the temperature regulation feedback coefficient (γ j ) and the temperature difference in the current area (△T jThe influence of (). The temperature regulation feedback coefficient (γ j in the formula reflects the response characteristics between the capacitor and the ambient temperature change. The temperature difference (△T j directly affects the heat flow rate. When the temperature difference is large, the heat flow rate will also increase, and vice versa.

[0098] Furthermore, in practical applications, if the temperature difference (△T j between the capacitor surface and the environment is 10°C during a certain period of time, the heat conduction heat flow rate (q cond is 500W, the heat convection heat flow rate (q conv is 300W, and the temperature regulation feedback coefficient (γ j is 1.2, then the heat accumulation rate can be calculated through the above formula:

[0099] , which means that in this case, the heat accumulation rate of the capacitor per unit time is 9600 watts.

[0100] In one embodiment, as Figure 4 shown, in step S202, that is, after calculating the heat accumulation rate, the heat distribution map of each region inside the bolt-type capacitor is simulated through the heat analysis model, including:

[0101] S2021: Obtain the geometric structure information of the bolt-type capacitor. Based on the geometric structure information, the heat analysis model divides the bolt-type capacitor into multiple thermodynamic sub-regions.

[0102] Specifically, first obtain the geometric structure information of the bolt-type capacitor through scanning, measurement or using CAD (Computer Aided Design) software, including dimensions, shapes, and the relative position relationships between components. According to this information, the heat analysis model can identify each part of the capacitor and divide the geometric structure information of the bolt-type capacitor into multiple thermodynamic sub-regions. For example, for a capacitor with multiple bolts and different thermal conductivity materials, the model can be divided into different thermodynamic sub-regions, and each sub-region represents different physical properties, such as thermal conductivity, specific heat capacity, etc.

[0103] S2022: The heat analysis model uses the calculated heat accumulation rate, combines the thermal properties of each sub-region, simulates the heat distribution in each sub-region, and generates a heat distribution map through the calculation of heat flow and accumulation in each region.

[0104] Specifically, according to the geometric structure information of the bolted capacitor (such as shape, size, material distribution, etc.), the capacitor is divided into multiple small thermodynamic sub-regions. The size and shape of each sub-region should be as precise as possible to ensure the accuracy of the calculation. For capacitors with complex shapes, mesh generation techniques can be used to discretize the entire region into multiple small computational units. Common mesh types include tetrahedral meshes, hexahedral meshes, etc. For each sub-region, the heat conduction equation is used for analysis. The heat conduction equation is usually based on the law of conservation of energy and Fourier's law:

[0105] , where T is the temperature, α is the thermal diffusivity (related to the thermal conductivity, density, and specific heat capacity of the material), ▽ 2 T is the second spatial derivative of the temperature, representing the diffusion of heat, Q is the heat source density, ρ is the density of the material, and Cp is the specific heat capacity. This equation is used to describe the diffusion and accumulation of heat in each sub-region. Boundary conditions and initial conditions setting: In the calculation, boundary conditions and initial conditions need to be set. The boundary conditions can be the heat exchange conditions between the capacitor surface and the external environment (such as convective boundary conditions, radiative boundary conditions, etc.). For example: , k is the thermal conductivity, is the normal heat flux, h is the convective heat transfer coefficient, T surface and T ambient are the surface temperature and the ambient temperature respectively. The initial condition is the temperature distribution of the capacitor at the initial moment, usually assuming a uniform temperature distribution at the beginning or setting it according to the actual situation. Through numerical methods (such as the finite element method, finite difference method, or finite volume method), the above equation is discretized to solve the temperature change in each sub-region. In these methods, spatial discretization divides the temperature field into multiple grid nodes, and time discretization deals with the evolution of temperature through the Euler method or implicit method. For each time step, calculate the temperature change in each sub-region and update it according to the heat accumulation rate. During the calculation process, it is necessary to trace the heat flux in each region and calculate the process of heat transfer from one region to another. For example, if there is a heat source or heat flux flowing into a certain sub-region, the heat accumulation value of that region needs to be adjusted. By calculating the temperature of each sub-region and combining the position and shape of each sub-region, a heat distribution map can be drawn.

[0106] In one embodiment, as Figure 5 shown, in step S30, that is, according to the heat accumulation rate, predict the temperature change trend, including:

[0107] S301: Predict the temperature change trend based on the following formula:

[0108] , where T next refers to the predicted temperature at the next moment, T0 refers to the temperature at the current moment, m refers to the mass of the capacitor, C p refers to the specific heat capacity of the capacitor, W refers to the heat accumulation rate, h refers to the heat convection coefficient, L refers to the surface area of the capacitor, T cap refers to the internal temperature of the capacitor, T env refers to the external ambient temperature, and △t refers to the time step.

[0109] Specifically, starting from the current temperature T 0 and based on the mass m and specific heat capacity C of the capacitor p , we can calculate the magnitude of the temperature change. The temperature change is jointly determined by the heat accumulation rate W of the capacitor and the effect of heat convection, as follows: Heat accumulation rate (W), the heat accumulation rate W represents the heat absorbed or released by the capacitor due to heating or cooling, and it is the main factor causing the temperature to rise or fall. Heat flux of heat convection ( ): This part is the heat exchange rate between the surface of the capacitor and the external environment. If the capacitor temperature T cap is higher than the external ambient temperature T env , then heat will be transferred from the capacitor to the environment, and vice versa. This term is quantified by the convective heat transfer coefficient h and the surface area L. Combining these two parts together, we get heat convection: , where the heat accumulation rate W will increase the temperature of the capacitor, while heat convection will consume a part of the heat and reduce the temperature. The difference between the two represents the total energy of temperature change per unit time. Then, according to the heat capacity of the capacitor , the influence of this heat on the capacitor temperature is adjusted proportionally. Finally, the change in the capacitor temperature is related to the ratio of heat accumulation and dissipation, as well as the heat capacity of the capacitor. Finally, combined with the time step △t, the temperature at the next moment can be calculated.

[0110] In one embodiment, as Figure 6 shown, in step S50, that is, obtaining the preset temperature target range, comparing the real-time temperature adjustment result with the preset temperature target range to obtain a temperature comparison result, and based on the temperature comparison result, the control system adaptively adjusts the heating device or the cooling device, including:

[0111] S501: Based on the temperature comparison result, if the real-time temperature adjustment result is lower than the preset temperature target range, the control system determines that heat needs to be increased to raise the temperature, starts the heating device, and adjusts the heating power according to the deviation between the current temperature and the lower limit temperature.

[0112] Specifically, when the real-time temperature adjustment result is lower than the preset temperature target range, the control system first detects this deviation and confirms that heat needs to be increased to raise the temperature. At this time, the heating device is started, and the heating intensity (power) is adjusted according to the difference between the current temperature and the lower limit of the target temperature. In actual operation, the control system first calculates the deviation between the current temperature and the target lower limit. For example, if the current temperature is T current , and the target lower limit temperature is T lower , then the temperature deviation is T lower - T current . Based on this temperature difference, the control system determines how much heat is needed to raise the temperature so that the heating device can operate effectively. Next, the control system adjusts the power of the heating device according to this temperature difference. If the temperature difference is large, the control system will let the heating device operate at full power to raise the temperature as soon as possible; if the temperature difference is small, the control system will adjust the power of the heating device to a lower value to avoid overheating and ensure that the temperature changes smoothly and does not exceed the preset range. In addition, to precisely control the heating process, the control system usually adopts some adjustment algorithms, such as PID control (Proportional-Integral-Derivative control), to continuously monitor the temperature change during the heating process and adjust the power output in real time, so that the temperature can stabilize and accurately approach the target temperature.

[0113] S502: Based on the temperature comparison result, if the real-time temperature adjustment result is higher than the preset temperature target range, the control system determines that heat needs to be reduced to lower the temperature, starts the cooling device, and adjusts the cooling intensity according to the deviation between the current temperature and the upper limit temperature.

[0114] Specifically, when the real-time temperature adjustment result is higher than the preset temperature target range, the control system first detects this deviation and determines that heat needs to be reduced to lower the temperature. The control system starts the cooling device and adjusts the cooling intensity according to the deviation between the current temperature and the target upper limit temperature. Specifically, the control system first calculates the deviation between the current temperature and the upper limit temperature. For example, if the current temperature is T current , and the target upper limit temperature is T upper , then the temperature deviation is T current - T upper . Based on the temperature difference, the control system decides how much heat needs to be consumed to lower the temperature and adjusts the working state of the cooling device. If the deviation is large, the control system will start a high-intensity cooling mode, such as increasing the fan speed or increasing the coolant flow rate, to accelerate the temperature drop; if the deviation is small, the control system will adjust the intensity of the cooling device to a moderate level to avoid overcooling and ensure that the temperature slowly drops back to the target range. In addition, the control system can use the PID control algorithm (Proportional-Integral-Derivative control), which will monitor the temperature change in real time and automatically adjust the intensity of the cooling device to keep the temperature stable within the target range.

[0115] S503: Based on the temperature comparison result, if the real-time temperature adjustment result is within the preset temperature target range, the control system maintains the current temperature control state, continuously monitors the temperature change, and ensures that the real-time temperature adjustment result is stable within the preset temperature target range.

[0116] Specifically, when the real-time temperature adjustment result is within the preset temperature target range, the control system determines whether further adjustment is needed by detecting whether the temperature remains within this range. In this case, the control system does not significantly adjust the heating device or the cooling device, but maintains the current temperature control state. The control system continuously monitors the real-time temperature and compares it with the upper and lower limits of the target temperature range. When the temperature is stable within the target range, the control system will collect data in real time through sensors and continuously compare it with the target value to confirm that the temperature does not deviate from the target range. If there are slight temperature fluctuations, the control system will fine-tune the output of the heating device or the cooling device to ensure that the temperature continues to be maintained within the set target range.

[0117] In one embodiment, as Figure 7 shown, after step S50, that is, the bolt-type capacitor temperature control method, further includes:

[0118] S60: After obtaining the real-time temperature adjustment result, start the real-time feedback mechanism, continuously track the temperature change trend, and analyze the law of temperature fluctuation.

[0119] Specifically, after obtaining the real-time temperature adjustment result, the system starts the real-time feedback mechanism, which analyzes the law of temperature fluctuation by continuously monitoring and recording the real-time temperature change. In specific operations, the temperature sensor continuously collects the operating temperature of the capacitor and transmits the information to the control system in real time. After each temperature collection, the control system compares the current temperature with the preset target range to detect whether there is a deviation or fluctuation in the temperature. The control system also analyzes the rate and amplitude of the temperature change to identify the trend and law of temperature fluctuation. For example, if the temperature continues to rise or fall, the system will identify whether there are periodic fluctuations or sudden temperature fluctuations through statistical data analysis. These analysis results will provide a basis for subsequent temperature control strategies, helping the system determine whether it is necessary to adjust the working mode of the heating or cooling equipment, or optimize the response speed of temperature adjustment.

[0120] S70: Based on the law of temperature fluctuation, adjust the temperature control strategy, and optimize the response time and adjustment amplitude of the heating device and the cooling device by analyzing the temperature change rate and deviation.

[0121] Specifically, based on the law of temperature fluctuations, the control system first analyzes the temperature change rate and deviation. These data are sourced from real-time temperature monitoring and previous temperature fluctuation trends. By comparing the difference between the current temperature and the target temperature, the control system can identify the speed and magnitude of temperature changes. If the temperature changes rapidly, the system will recognize that the response demand for temperature regulation is strong; if the temperature changes slowly, it indicates that the response demand for regulation is weak. According to these analysis results, the control system adjusts the temperature control strategy. If it is found that the temperature change rate is high, which means that the response of the heating or cooling equipment needs to be accelerated, the system will shorten the adjustment cycle of the heating or cooling device and increase the working intensity of the equipment. If the temperature changes slowly, the system will appropriately extend the adjustment cycle and reduce the adjustment intensity of the heating or cooling device to avoid overreaction. Additionally, when the temperature deviation is large, the control system will increase the adjustment amplitude of the heating or cooling equipment to quickly correct the temperature deviation. If the deviation is small, the system will reduce the adjustment amplitude to precisely control the temperature. Through the adjustment of these strategies, the temperature control system can flexibly adjust the working state of the heating and cooling equipment in different temperature change environments, optimize the response time and adjustment amplitude, thereby ensuring the stable operation of the bolt-type capacitor within the set temperature target range.

[0122] It should be understood that the magnitudes of the sequence numbers of the steps in the above embodiments do not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of this application.

[0123] In one embodiment, a temperature control device for a bolt-type capacitor is provided, and this temperature control device for a bolt-type capacitor corresponds one-to-one with the bolt-type capacitor temperature control method in the above embodiment. As Figure 8 shown, this temperature control device for a bolt-type capacitor includes a real-time temperature acquisition module, a heat analysis module, a temperature trend prediction module, a temperature control monitoring and adjustment module, and a temperature comparison and adjustment module. The detailed description of each functional module is as follows:

[0124] The real-time temperature acquisition module is used to acquire the real-time temperature information of the bolt-type capacitor and the external environment temperature information;

[0125] The heat analysis module is used to analyze the heat accumulation rate and heat distribution map of the bolt-type capacitor based on the real-time temperature information and the external environment temperature information by using a heat analysis model;

[0126] The temperature trend prediction module is used to predict the temperature change trend according to the heat accumulation rate, determine the temperature control requirements of the bolt-type capacitor according to the heat distribution map, and generate corresponding temperature control strategies;

[0127] The temperature control monitoring and adjustment module is used to adjust the working states of the heating device and the cooling device based on the temperature control strategy and the temperature change trend to obtain the real-time temperature adjustment result;

[0128] A temperature comparison and adjustment module is used to obtain a preset temperature target range, compare the real-time temperature adjustment result with the preset temperature target range to obtain a temperature comparison result, and based on the temperature comparison result, the control system adaptively adjusts the heating device or the cooling device.

[0129] Optionally, the heat analysis module includes:

[0130] A heat accumulation rate calculation sub-module is used to calculate the heat accumulation rate of each part of the bolt-type capacitor based on the real-time temperature information and the external environment temperature information, and the heat analysis model calculates it based on the heat conduction equation and the heat convection equation;

[0131] A heat distribution map sub-module is used to simulate the heat distribution map of each region inside the bolt-type capacitor through the heat analysis model after calculating the heat accumulation rate.

[0132] Optionally, the heat accumulation rate calculation sub-module includes:

[0133] A heat conduction equation unit, where the heat conduction equation is:

[0134] , where q cond is the heat conduction heat flux, k is the thermal conductivity of the material, A is the cross-sectional area through which the heat flux passes, △T is the temperature difference, and △x is the distance of heat flux propagation;

[0135] A heat convection equation unit, where the heat convection equation is:

[0136] , where q conv is the heat convection heat flux, h is the convective heat transfer coefficient, X is the surface area of the capacitor, T surface is the surface temperature of the capacitor, and T ambient is the external environment temperature;

[0137] An integrated calculation unit is used to combine the heat conduction heat flux and the heat convection heat flux to obtain the heat accumulation rate through the following formula:

[0138] , where W refers to the heat accumulation rate, γ j refers to the temperature adjustment feedback coefficient, and △T j refers to the temperature difference of the current region.

[0139] Optionally, the heat distribution map sub-module includes:

[0140] A geometric structure analysis unit is used to obtain the geometric structure information of the bolt-type capacitor, and based on the geometric structure information, the heat analysis model divides the bolt-type capacitor into multiple thermodynamic sub-regions;

[0141] A heat distribution simulation unit is used for a heat analysis model to utilize the calculated heat accumulation rate, combine with the thermal properties of each sub-region, simulate the heat distribution in each sub-region, and generate a heat distribution map by calculating the heat flow and accumulation in each region.

[0142] Optionally, the temperature trend prediction module includes:

[0143] A temperature change trend prediction sub-module is used to predict the temperature change trend based on the following formula:

[0144] , where T next refers to the predicted temperature at the next moment, T 0 refers to the current temperature, m refers to the mass of the capacitor, C p refers to the specific heat capacity of the capacitor, W refers to the heat accumulation rate, h refers to the heat convection coefficient, L refers to the surface area of the capacitor, Tcap refers to the internal temperature of the capacitor, Tenv refers to the external environment temperature, and △t refers to the time step.

[0145] Optionally, the temperature comparison and regulation module includes:

[0146] A temperature regulation sub-module is used to, based on the temperature comparison result, if the real-time temperature adjustment result is lower than the preset temperature target range, the control system determines that heat needs to be increased to raise the temperature, starts the heating device and adjusts the heating power according to the deviation between the current temperature and the lower limit temperature;

[0147] A cooling regulation sub-module is used to, based on the temperature comparison result, if the real-time temperature adjustment result is higher than the preset temperature target range, the control system determines that heat needs to be reduced to lower the temperature, starts the cooling device and adjusts the cooling intensity according to the deviation between the current temperature and the upper limit temperature;

[0148] A temperature stability monitoring sub-module is used to, based on the temperature comparison result, if the real-time temperature adjustment result is within the preset temperature target range, the control system maintains the current temperature control state, continuously monitors the temperature change, and ensures that the real-time temperature adjustment result is stable within the preset temperature target range.

[0149] Optionally, after the temperature comparison and regulation module includes:

[0150] A real-time feedback mechanism module is used to, after obtaining the real-time temperature adjustment result, start the real-time feedback mechanism, continuously track the temperature change trend, and analyze the law of temperature fluctuation;

[0151] A temperature control strategy optimization module is used to, based on the law of temperature fluctuation, adjust the temperature control strategy, and optimize the response time and adjustment amplitude of the heating device and the cooling device by analyzing the temperature change rate and deviation.

[0152] For the specific limitations of the bolt - type capacitor temperature control device, reference can be made to the limitations of the bolt - type capacitor temperature control method in the above text, which will not be elaborated here. Each module in the above bolt - type capacitor temperature control device can be implemented in whole or in part by software, hardware, and their combination. Each of the above modules can be embedded in the processor of the computer device in hardware form or be independent of it, or be stored in the memory of the computer device in software form, so as to facilitate the processor to call and execute the operations corresponding to each of the above modules.

[0153] In one embodiment, a computer device is provided. The computer device can be a server, and its internal structure diagram can be as Figure 9 shown. The computer device includes a processor, a memory, a network interface, and a database connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non - volatile storage medium and an internal memory. The non - volatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non - volatile storage medium. The network interface of the computer device is used to communicate with external terminals through a network connection. When the computer program is executed by the processor, it realizes a bolt - type capacitor temperature control method.

[0154] In one embodiment, a computer device is provided, including a memory, a processor, and a computer program stored on the memory and executable on the processor. When the processor executes the computer program, the following steps are implemented:

[0155] Obtain the real - time temperature information and external environment temperature information of the bolt - type capacitor;

[0156] Based on the real - time temperature information and external environment temperature information, use a heat analysis model to analyze the heat accumulation rate and heat distribution map of the bolt - type capacitor;

[0157] According to the heat accumulation rate, predict the temperature change trend. According to the heat distribution map, determine the temperature control requirements of the bolt - type capacitor and generate a corresponding temperature control strategy;

[0158] Based on the temperature control strategy and temperature change trend, adjust the working states of the heating device and the cooling device to obtain a real - time temperature adjustment result;

[0159] Obtain a preset temperature target range, compare the real - time temperature adjustment result with the preset temperature target range to obtain a temperature comparison result, and based on the temperature comparison result, the control system adaptively adjusts the heating device or the cooling device.

[0160] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the following steps are implemented:

[0161] Obtain the real-time temperature information and external environmental temperature information of the bolt-type capacitor;

[0162] Based on the real-time temperature information and external environmental temperature information, use a heat analysis model to analyze the heat accumulation rate and heat distribution map of the bolt-type capacitor;

[0163] According to the heat accumulation rate, predict the temperature change trend. According to the heat distribution map, determine the temperature control requirements of the bolt-type capacitor and generate a corresponding temperature control strategy;

[0164] Based on the temperature control strategy and temperature change trend, adjust the working states of the heating device and the cooling device to obtain a real-time temperature adjustment result;

[0165] Obtain a preset temperature target range, compare the real-time temperature adjustment result with the preset temperature target range to obtain a temperature comparison result, and based on the temperature comparison result, the control system adaptively adjusts the heating device or the cooling device.

[0166] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, storage, database, or other medium used in the various embodiments provided in the present application can include non-volatile and / or volatile memories. Non-volatile memories can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memories can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0167] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the division of the above-mentioned functional units and modules is used as an example. In actual applications, the above functions can be allocated to different functional units and modules according to needs, that is, the internal structure of the device is divided into different functional units or modules to complete all or part of the functions described above.

[0168] The above-mentioned embodiments are only used to illustrate the technical solutions of the present application, rather than limiting them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A temperature control method for a bolt-type capacitor, characterized in that: The temperature control method of the bolt-type capacitor comprises: Acquiring real-time temperature information of the bolt-type capacitor and external environment temperature information; Based on the real-time temperature information and the external environment temperature information, using a thermal analysis model to analyze the heat accumulation rate and heat distribution diagram of the bolt-type capacitor; Predicting the temperature change trend according to the heat accumulation rate, determining the temperature control requirement of the bolt-type capacitor according to the heat distribution diagram, and generating a corresponding temperature control strategy; Based on the temperature control strategy and the temperature change trend, the working states of the heating device and the cooling device are adjusted to obtain a real-time temperature adjustment result; A preset temperature target range is obtained, and the real-time temperature adjustment result is compared with the preset temperature target range to obtain a temperature comparison result. Based on the temperature comparison result, the control system adaptively adjusts the heating device or the cooling device.

2. The temperature control method of bolt-type capacitor according to claim 1, characterized in that: The method of analyzing the heat accumulation rate and heat distribution diagram of the bolt-type capacitor by using a heat analysis model based on the real-time temperature information and the external environment temperature information includes: Based on the real-time temperature information and the external environment temperature information, the thermal analysis model calculates the heat accumulation rate of each part of the bolt-type capacitor based on the heat conduction equation and the heat convection equation; After the heat accumulation rate is calculated, the heat distribution diagram of each area inside the bolt-type capacitor is simulated by the thermal analysis model.

3. The temperature control method of bolt-type capacitor according to claim 2, characterized in that: Based on the real-time temperature information and the external environment temperature information, the heat analysis model calculates the heat accumulation rate of each part of the bolt-type capacitor based on the heat conduction equation and the heat convection equation, including: The heat conduction equation is: , where q cond is the heat conduction heat flow, k is the thermal conductivity of the material, A is the cross-sectional area through which the heat flows, ΔT is the temperature difference, and Δx is the distance the heat flows; The heat convection equation is: , where q conv is the heat convection heat flow, h is the convection heat transfer coefficient, X is the capacitor surface area, T surface is the capacitor surface temperature, the T ambient is the external ambient temperature; Combining the heat conduction heat flux and the heat convection heat flux, the heat accumulation rate is obtained by the following formula: , where W refers to the heat accumulation rate, and γ j refers to the temperature regulation feedback coefficient, the △T j Refers to the temperature difference in the current area.

4. The temperature control method of bolt-type capacitor according to claim 2, characterized in that: After calculating the heat accumulation rate, simulating the heat distribution diagram of each area inside the bolt-type capacitor by using the heat analysis model includes: Acquiring geometric structure information of the bolt-type capacitor, and based on the geometric structure information, the thermal analysis model divides the bolt-type capacitor into a plurality of thermodynamic sub-regions; The heat analysis model uses the calculated heat accumulation rate and combines the thermal properties of each sub-region to simulate the distribution of heat in each sub-region, and generates the heat distribution map by calculating the heat flow and accumulation of each region.

5. The temperature control method of bolt-type capacitor according to claim 1, characterized in that: The predicting of the temperature change trend according to the heat accumulation rate includes: The temperature change trend is predicted based on the following formula: , where the T next is the predicted temperature at the next moment, T0 is the temperature at the current moment, m is the mass of the capacitor, and C p refers to the specific heat capacity of the capacitor, the W refers to the heat accumulation rate, the h refers to the heat convection heat transfer coefficient, the L refers to the surface area of ​​the capacitor, and the T cap refers to the internal temperature of the capacitor, the T env refers to the external ambient temperature, and Δt refers to the time step.

6. The temperature control method of bolt-type capacitor according to claim 1, characterized in that: The step of obtaining a preset temperature target range, comparing the real-time temperature adjustment result with the preset temperature target range to obtain a temperature comparison result, and based on the temperature comparison result, the control system adaptively adjusting the heating device or the cooling device comprises: Based on the temperature comparison result, if the real-time temperature adjustment result is lower than the preset temperature target range, the control system determines that it is necessary to increase the heat to increase the temperature, starts the heating device and adjusts the heating power according to the deviation between the current temperature and the lower limit temperature; Based on the temperature comparison result, if the real-time temperature adjustment result is higher than the preset temperature target range, the control system determines that heat needs to be reduced to lower the temperature, starts the cooling device and adjusts the cooling intensity according to the deviation between the current temperature and the upper limit temperature; Based on the temperature comparison result, if the real-time temperature adjustment result is within the preset temperature target range, the control system maintains the current temperature control state, continuously monitors temperature changes, and ensures that the real-time temperature adjustment result is stable within the preset temperature target range.

7. The temperature control method of bolt-type capacitor according to claim 1, characterized in that: The temperature control method of the bolt-type capacitor further includes: After obtaining the real-time temperature adjustment result, a real-time feedback mechanism is started to continuously track the temperature change trend and analyze the law of temperature fluctuation; Based on the law of the temperature fluctuation, the temperature control strategy is adjusted, and the response time and adjustment range of the heating device and the cooling device are optimized by analyzing the temperature change rate and deviation.

8. A bolt-type capacitor temperature control device, characterized in that: The bolt-type capacitor temperature control device comprises: A real-time temperature acquisition module, used to acquire real-time temperature information of the bolt-type capacitor and external environment temperature information; A heat analysis module, configured to analyze the heat accumulation rate and heat distribution diagram of the bolt-type capacitor using a heat analysis model based on the real-time temperature information and the external environment temperature information; A temperature trend prediction module, used to predict the temperature change trend according to the heat accumulation rate, determine the temperature control requirement of the bolt-type capacitor according to the heat distribution diagram, and generate a corresponding temperature control strategy; A temperature control monitoring and adjustment module, used to adjust the working states of the heating device and the cooling device based on the temperature control strategy and the temperature change trend, and obtain real-time temperature adjustment results; The temperature comparison and adjustment module is used to obtain a preset temperature target range, compare the real-time temperature adjustment result with the preset temperature target range, obtain a temperature comparison result, and based on the temperature comparison result, the control system adaptively adjusts the heating device or the cooling device.

9. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the steps of the temperature control method for a bolt-type capacitor as claimed in any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the steps of the temperature control method for a bolt-type capacitor as claimed in any one of claims 1 to 7 are implemented.

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