Control system based on packaging device and monitoring method thereof
Through edge model method and RPN training, actual inspection areas are generated, parameter analysis and adjustment are performed, and the controlled object is run, which solves the problem of packaging quality degradation caused by packaging process problems in the packaging device, and effectively monitors and adjusts the dynamic and static goals of the packaging device.
Patent Information
- Application Number
- CN202510278994.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-11
- Publication Date
- 2025-04-11
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
During the packaging process, there may be problems with a certain or several packaging processes in the packaging device, resulting in a decline in packaging quality and the packaging process needs to be monitored and adjusted.
Multiple inspection areas are pre-set through the edge model method, RPN training is carried out to generate actual inspection areas, obtain attribute information of each actual inspection area, perform parameter analysis to determine whether there are dynamic and static targets, and adjust the operation of the controlled object according to the analysis results.
The monitoring and adjustment of dynamic goals and static goals in each inspection area of the packaging device is achieved to ensure the consistency of packaging quality and avoid the shutdown of the packaging device due to dynamic goals.
Smart Images

Figure CN119810754A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of monitoring or surveillance of control systems, and in particular relates to a control system based on a packaging device and a monitoring method thereof, which are used for controlling or monitoring the packaging device. Background Art
[0002] Packaging devices are equipment used to package products. Packaging devices are classified according to automation into manual packaging machines, semi-automatic packaging machines and fully automatic packaging machines. At present, fully automatic packaging machines are mainly used for packaging products. The entire fully automatic packaging process, including product transportation, packaging material supply, packaging molding and packaging sealing, is completed entirely through automation without manual intervention. It is efficient, stable and accurate, and can greatly improve production efficiency, reduce labor costs and ensure the consistency of packaging quality.
[0003] However, during the process of packaging products, if problems occur in one or several sections of the entire packaging process of the packaging device, such as parts falling off the packaging device in one or several sections of the packaging process, the packaging quality of the entire packaging process will be reduced. Therefore, in the entire packaging process of the packaging device, it is necessary to monitor each section of the packaging process, and control or adjust the operation of each inspection area or each section of the packaging process according to the monitoring status of each section of the packaging process. Summary of the invention
[0004] The technical problem to be solved by the present invention is how the control system of a packaging device controls or adjusts the operation status of each inspection area. The present invention provides a control system based on a packaging device and a monitoring method thereof, performs RPN training on multiple pre-set inspection areas to generate multiple actual inspection areas, obtains attribute information in each actual inspection area, and performs parameter analysis on each actual inspection area to determine whether there are dynamic targets and static targets in each actual inspection area. If there are dynamic targets in one or more actual inspection areas, the actual inspection areas with dynamic targets are stopped from operating, and the entire packaging device is stopped; if there are no dynamic targets in any actual inspection areas, each actual inspection area continues to operate.
[0005] In order to achieve the above object, the present invention is implemented by the following technical solutions:
[0006] A monitoring method based on a packaging device comprises the following steps:
[0007] Step 1): pre-set multiple inspection areas using the edge model method, monitor the multiple pre-set inspection areas, collect data in each pre-set inspection area, perform RPN training on the data in each pre-set inspection area to generate multiple actual inspection areas, set the multiple actual inspection areas as attribute information, and store the attribute information;
[0008] Step 2): Parameter analysis is performed on the attribute information in multiple actual inspection areas to determine whether there are dynamic targets and static targets in each actual inspection area, and the type of the dynamic target is obtained when it is determined that there are dynamic targets, and the type of the static target is obtained when it is determined that there are static targets; wherein the parameter analysis of the actual inspection areas adopts the parameter type analysis method;
[0009] Step 3): Analyze whether there are dynamic targets and static targets in each actual inspection area; wherein, analyze whether there are dynamic targets in each actual inspection area;
[0010] Step 4): adjusting the operation status of each actual inspection area; wherein, adjusting the controlled objects in each actual inspection area according to the operation status of each actual inspection area;
[0011] Step 5): Track the dynamic targets and static targets in each actual inspection area.
[0012] Optionally, in step 1), the edge model method pre-sets multiple inspection areas, using the following steps:
[0013] Step 11): stacking a plurality of pre-set inspection areas into a three-dimensional model by using a layer stacking method, wherein the three-dimensional model is a triangular column or a cylinder;
[0014] Step 12): Calculate the degree of parallelism of each contour line of the three-dimensional model relative to the axis line of the three-dimensional model; if each of the contour lines is parallel to the axis line of the three-dimensional model, the degree of fit of the three-dimensional model formed by stacking multiple inspection areas is high; if each contour line has an angle with respect to the axis line of the three-dimensional model, the degree of fit of the three-dimensional model formed by stacking multiple inspection areas is low.
[0015] Furthermore, in step 12), the parallelism of the contour line relative to the axis line of the three-dimensional model is determined by the following steps:
[0016] Step a): Detect whether the axis line of the three-dimensional model is a straight line, and detect whether the axis line of the three-dimensional model is perpendicular to the horizontal plane;
[0017] Step b): When the axis line is a straight line and is perpendicular to the horizontal plane, if each contour line of the three-dimensional model is parallel to the axis line of the three-dimensional model, the stacked three-dimensional model is a triangular column or a cylinder; if each contour line of the three-dimensional model has an angle with the axis line of the three-dimensional model, the stacked three-dimensional model is an irregular body.
[0018] Optionally, in step 1), multiple inspection areas in the three-dimensional model are selected, and the selected multiple inspection areas are subjected to RPN training to generate actual inspection areas. For RPN training, the following formula (1) is used:
[0019] (1);
[0020] in, The three-dimensional model has a vector height, and the vector height of the three-dimensional model is perpendicular to the horizontal plane. has a high magnitude and direction, To set the vector height direction of the 3D model from bottom to top;
[0021] is the vector height On height position, For the vector height Select the first height position, For the Inspection area at a height position, To remove the Inspection areas at different heights;
[0022] For the vector height Select the first height position and remove the Data merging of inspection areas at different height positions;
[0023] Along the vector height direction of the 3D model, in the vector height direction of the 3D model Select the first Height position , will Inspection area at a height position take out;
[0024] The first Height position and Inspection area at a height position .
[0025] Optionally, in step 2), the parameter type analysis method used is the following formula (2):
[0026] (2);
[0027] in, is the vector height direction in the 3D model Select the first Height position The actual inspection area on the To calculate the actual inspection area area;
[0028] The actual inspection area The edge line, The actual inspection area The edge line To the actual inspection area The geometric center shrinks, and the actual inspection area The edge line Finally shrink to the actual inspection area The geometric center of
[0029] In the actual inspection area The edge line Shrink to the actual inspection area When the geometric center of The parameter type on
[0030] To calculate the specific actual inspection area After the area is determined, the actual inspection area of the specific area is determined. The parameter type on The actual inspection area The result of judging the parameter type on .
[0031] Optionally, in step 3), the specific analysis is that as long as there is a dynamic target in one or more actual inspection areas, all the controlled objects in the actual inspection areas stop working.
[0032] Optionally, in step 4), the specific analysis is that if there are dynamic targets in one or more actual inspection areas, the entire packaging device stops working, and if there are no dynamic targets in any actual inspection areas, the entire packaging device operates normally.
[0033] Optionally, in step 5), the dynamic targets and static targets in each actual inspection area are tracked or monitored in real time.
[0034] A control system based on a packaging device, comprising:
[0035] Multiple inspection area processing modules are used to pre-set multiple inspection areas, monitor and obtain data of multiple inspection areas, and conduct RPN training. Through RPN training, multiple pre-set inspection areas are generated into multiple actual inspection areas.
[0036] Data module, used to store attribute information;
[0037] Monitoring data analysis module, used to analyze parameters in each actual inspection area;
[0038] Data tracking module, used to track dynamic and static targets in each actual inspection area;
[0039] The inspection area processing module is connected to the monitoring data analysis module through the data module circuit, and the monitoring data analysis module circuit is connected to the data tracking module.
[0040] Optionally, the monitoring data analysis module circuit is connected to the control unit, and the control unit is used to control or adjust the controlled object.
[0041] Beneficial effects of the present invention:
[0042] 1. The present invention performs RPN training on multiple pre-set inspection areas to generate multiple actual inspection areas, obtains attribute information in each actual inspection area, and performs parameter analysis on each actual inspection area to determine whether there are dynamic targets and static targets in each actual inspection area. As long as there is a dynamic target in one or more actual inspection areas, the actual inspection area with the dynamic target is stopped from running, and the entire packaging device stops running. If there is no dynamic target in any actual inspection area, each actual inspection area continues to run, and the dynamic targets and static targets in each actual inspection area are also monitored.
[0043] 2. The present invention stacks various inspection areas into a three-dimensional model, extracts multiple inspection areas from the three-dimensional model, extracts multiple inspection areas as candidate inspection areas (i.e., actual inspection areas), performs dynamic target and static target analysis on the multiple actual inspection areas, adjusts the controlled objects according to the analysis results, and finally, tracks or monitors the dynamic targets and static targets in the multiple actual inspection areas in real time. BRIEF DESCRIPTION OF THE DRAWINGS
[0044] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0045] Figure 1 It is a schematic diagram of the system structure of the present invention;
[0046] Figure 2 It is a schematic diagram of the workflow of the present invention;
[0047] Figure 3 A three-dimensional model of a plurality of inspection areas of the present invention stacked into a cylindrical shape;
[0048] Figure 4 The three-dimensional model is a triangular column-shaped model in which multiple inspection areas of the present invention are stacked. DETAILED DESCRIPTION
[0049] The embodiments of the present application are described in detail below with reference to the accompanying drawings.
[0050] Example 1
[0051] like Figure 1 As shown, this embodiment provides a control system based on a packaging device. The control system of the packaging device is used to monitor or supervise the operation of the controlled object (the controlled object is each part or component in the inspection area) to control or adjust the work of the controlled object. The control or adjustment of the controlled object is automatic and is adjusted according to the monitoring situation. The control system of the packaging device includes: an inspection area processing module, a data module, a monitoring data analysis module, a data tracking module and a control unit.
[0052] There can be multiple inspection area processing modules. The inspection area processing modules (equivalent to the combination of an image monitor and a data processor) are used to pre-set multiple inspection areas, monitor and obtain data of multiple inspection areas, and perform RPN training. Through RPN training, the pre-set multiple inspection areas are generated into multiple actual inspection areas. It can be understood here that each inspection area processing module pre-sets one inspection area, and each inspection area processing module monitors and obtains the monitoring data in its corresponding inspection area (that is, one inspection area processing module only sets one inspection area, and one inspection area processing module only monitors and obtains the data in the inspection area set by the inspection area processing module).
[0053] The data module is used to store attribute information;
[0054] The monitoring data analysis module is used to analyze the parameters in each actual inspection area, that is, to analyze the dynamic targets and static targets in each actual inspection area;
[0055] The data tracking module is used to track dynamic and static targets in each actual inspection area;
[0056] Control unit, used to control or adjust the controlled object.
[0057] The inspection area processing module generates multiple actual inspection areas from the pre-set multiple inspection areas; the monitoring data analysis module analyzes the dynamic targets and static targets in each actual inspection area; the control unit controls or adjusts the operation of the controlled object based on the dynamic targets and static targets in each actual inspection area analyzed by the monitoring data analysis module; the data tracking module monitors or tracks the dynamic targets and static targets in each actual inspection area.
[0058] The control unit controls or adjusts the controlled object according to whether the respective components in each actual inspection area are working. If a component in one or several actual inspection areas fails (i.e., there are dynamic targets in one or several actual inspection areas), the operation of the components in one or several actual inspection areas will be stopped, causing the entire packaging device to stop working. If all components in the actual inspection areas do not fail (i.e., there are no dynamic targets in all actual inspection areas, and all actual inspection areas are static targets), the entire packaging device operates normally.
[0059] The inspection area processing module is connected to the monitoring data analysis module through a data module circuit, and the monitoring data analysis module circuit is connected to the control unit and the data tracking module.
[0060] In this embodiment, each inspection area processing module is respectively pre-set with an inspection area, and each inspection area processing module can only monitor within the pre-set inspection area.
[0061] Example 2
[0062] Based on Example 1, Figure 2 As shown, this embodiment provides a monitoring method based on a packaging device, comprising the following steps:
[0063] Step 1): Use the edge model method to pre-set multiple inspection areas, monitor the multiple pre-set inspection areas (that is, each inspection area processing module monitors and obtains the monitoring data in its corresponding inspection area), collect data in each pre-set inspection area, perform RPN training on the data in each pre-set inspection area to generate multiple actual inspection areas, set the multiple actual inspection areas as attribute information (that is, the data in each actual inspection area is the data in each inspection area, each inspection area has attribute information, and the attribute information in the inspection area includes dynamic targets and static targets), and store the attribute information;
[0064] Step 2): Parameter analysis is performed on the attribute information in multiple actual inspection areas to determine whether there are dynamic targets (such as slippage between the wheel and the belt, loose screws, and bending at the connection between the structural parts, as dynamic targets) and whether there are static targets (such as smooth operation of the wheel and the belt, no screw falling, and no bending at the connection between the structural parts, as static targets) in each actual inspection area, and the type of dynamic target is obtained when it is determined that there are dynamic targets (i.e., slippage between the wheel and the belt and loose screws are determined as the type of dynamic targets) and the type of static target is obtained when it is determined that there are static targets (i.e., smooth operation of the wheel and the belt and no screw falling are determined as the type of static targets); wherein, the parameter type analysis method is used for parameter analysis of the actual inspection areas;
[0065] Step 3): Analyze whether there are dynamic targets and static targets in each actual inspection area; wherein, analyze whether there are dynamic targets in each actual inspection area;
[0066] Step 4): adjusting the operation status of each actual inspection area; wherein, adjusting the controlled objects in each actual inspection area according to the operation status of each actual inspection area;
[0067] Step 5): Track the dynamic targets and static targets in each actual inspection area.
[0068] This embodiment uses RPN training on multiple pre-set inspection areas to generate actual inspection areas, obtains attribute information of multiple actual inspection areas, and performs parameter analysis on each actual inspection area to determine whether there are dynamic targets and static targets in each actual inspection area. As long as there are dynamic targets in one or more actual inspection areas, the actual inspection areas with dynamic targets are stopped from operating, and the entire packaging device stops operating. If there are no dynamic targets in any actual inspection areas, each actual inspection area continues to operate, and at the same time, the dynamic targets and static targets in each actual inspection area are monitored.
[0069] Example 3
[0070] Based on Example 2, Figure 3 As shown or Figure 4 As shown, in step 1), the edge model method pre-sets multiple inspection areas, using the following steps:
[0071] Step 11): stack multiple pre-set inspection areas into a three-dimensional model using a layer stacking method, wherein the three-dimensional model is a triangular cylinder (ie, Figure 4 as shown) or a cylinder (i.e., as Figure 3 shown); Figure 3 is to move a1 to a N The circular sheets are stacked into a cylinder. Figure 4 is to move a1 to a N The triangular sheets are stacked into triangular columns, specifically, Figure 3 and Figure 4 a1 to a N They all represent various inspection areas, that is, each inspection area is either a triangular slice or a circular slice;
[0072] Step 12): Calculate the degree of parallelism of each contour line of the three-dimensional model relative to the axis line of the three-dimensional model; if each contour line is parallel to the axis line of the three-dimensional model, the three-dimensional model formed by stacking multiple inspection areas has a high degree of fit; if each contour line has an angle relative to the axis line of the three-dimensional model, the three-dimensional model formed by stacking multiple inspection areas has a low degree of fit.
[0073] Among them, in step 12), the following steps are used to judge whether the contour line is parallel to the axis line of the three-dimensional model:
[0074] Step a): Detect whether the axis line of the three-dimensional model is a straight line, and detect whether the axis line of the three-dimensional model is perpendicular to the horizontal plane;
[0075] Step b): When the axis line is a straight line and is perpendicular to the horizontal plane, if each contour line of the three-dimensional model is parallel to the axis line of the three-dimensional model, the stacked three-dimensional model is a triangular column or a cylinder (the three-dimensional model has a high degree of fitting); if there is an angle between each contour line of the three-dimensional model and the axis line of the three-dimensional model, the stacked three-dimensional model is an irregular body (the three-dimensional model has a low degree of fitting, because the angles between each contour line of the three-dimensional model and the axis line of the three-dimensional model are different, resulting in the stacked three-dimensional model being an irregular body, which is not convenient for the subsequent formation of actual inspection areas).
[0076] In this way, it can be detected whether each contour line of the three-dimensional model is parallel to the axis line of the three-dimensional model.
[0077] In step 1), multiple inspection areas in the three-dimensional model are selected, and the selected inspection areas are trained with RPN to generate actual inspection areas. For RPN training, the following formula (1) is used:
[0078] (1);
[0079] in, The three-dimensional model has a vector height, and the vector height of the three-dimensional model is perpendicular to the horizontal plane. has a high magnitude and direction, To set the vector height direction of the 3D model from bottom to top;
[0080] is the vector height On height position, For the vector height Select the first height position, For the Inspection area at a height position, To remove the Inspection areas at different heights;
[0081] For the vector height Select the first height position and remove the Data merging of inspection areas at different height positions;
[0082] Along the vector height direction of the 3D model, in the vector height direction of the 3D model Select the first Height position , will Inspection area at a height position take out.
[0083] The first Height position and Inspection area at a height position .
[0084] Since the vector height of the 3D model The vector height direction is from bottom to top, so on the three-dimensional model, it is from bottom to top. Height position , will Inspection area at a height position Take it out and use the taken out inspection area as the actual inspection area.
[0085] Example 4
[0086] Based on Example 2, in step 2), the parameter type analysis method used is the following formula (2):
[0087] (2);
[0088] in, is the vector height direction in the 3D model Select the first Height position The actual inspection area on the To calculate the actual inspection area area;
[0089] The actual inspection area The edge line, The actual inspection area The edge line To the actual inspection area The geometric center shrinks, and the actual inspection area The edge line Finally shrink to the actual inspection area The geometric center, that is, the actual inspection area The edge line Finally, focus on the actual inspection area The geometric center of
[0090] In the actual inspection area The edge line Shrink to the actual inspection area When the geometric center of The parameter type on (to determine the actual inspection area whether there are dynamic targets and static targets on the network);
[0091] To calculate the specific actual inspection area After the area is determined, the actual inspection area of the specific area is determined. The parameter type on The actual inspection area The parameter type judgment result (that is, the actual inspection area The parameter types above are two types: dynamic target and static target);
[0092] Parameter type analysis method is to analyze the actual inspection area The edge line Shrink to the actual inspection area In the process of determining the geometric center of the actual inspection area Whether there are dynamic targets and static targets on the network, calculate the specific actual inspection area After the area is determined, the actual inspection area of the specific area is determined. The parameter type on .
[0093] Example 5
[0094] Based on Example 2, in step 3), the specific analysis is that as long as there is a dynamic target in one or more actual inspection areas, all the controlled objects in the actual inspection areas stop working.
[0095] In step 4), the specific adjustment is that if there is a dynamic target in one or more actual inspection areas, the entire packaging device stops working, and if there is no dynamic target in any actual inspection area, the entire packaging device operates normally.
[0096] In step 5), the dynamic targets and static targets in each actual inspection area are tracked or monitored in real time.
[0097] Example 6
[0098] Based on all the above embodiments, the present invention stacks each inspection area into a three-dimensional model, extracts multiple inspection areas in the three-dimensional model, extracts multiple inspection areas as candidate inspection areas (i.e., actual inspection areas), performs dynamic target and static target analysis on the multiple actual inspection areas, adjusts the controlled objects according to the analysis results, and finally, tracks or monitors the dynamic targets and static targets in the multiple actual inspection areas in real time.
[0099] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope of the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.
Claims
1. A monitoring method based on a packaging device, characterized in that: The steps include: Step 1): pre-set multiple inspection areas using the edge model method, monitor the multiple pre-set inspection areas, collect data in each pre-set inspection area, perform RPN training on the data in each pre-set inspection area to generate multiple actual inspection areas, set the multiple actual inspection areas as attribute information, and store the attribute information; Step 2): Parameter analysis is performed on the attribute information in multiple actual inspection areas to determine whether there are dynamic targets and static targets in each actual inspection area, and the type of the dynamic target is obtained when it is determined that there are dynamic targets, and the type of the static target is obtained when it is determined that there are static targets; wherein the parameter analysis of the actual inspection areas adopts the parameter type analysis method; Step 3): Analyze whether there are dynamic targets and static targets in each actual inspection area; wherein, analyze whether there are dynamic targets in each actual inspection area; Step 4): adjusting the operation status of each actual inspection area; wherein, adjusting the controlled objects in each actual inspection area according to the operation status of each actual inspection area; Step 5): Track the dynamic targets and static targets in each actual inspection area.
2. A monitoring method based on a packaging device according to claim 1, characterized in that: In the step 1), the edge model method pre-sets a plurality of inspection areas, using the following steps: Step 11): stacking a plurality of pre-set inspection areas into a three-dimensional model by using a layer stacking method, wherein the three-dimensional model is a triangular column or a cylinder; Step 12): Calculate the degree of parallelism of each contour line of the three-dimensional model relative to the axis line of the three-dimensional model; if each of the contour lines is parallel to the axis line of the three-dimensional model, the degree of fit of the three-dimensional model formed by stacking multiple inspection areas is high; if each contour line has an angle with respect to the axis line of the three-dimensional model, the degree of fit of the three-dimensional model formed by stacking multiple inspection areas is low.
3. A monitoring method based on a packaging device according to claim 2, characterized in that: In step 12), the parallelism of the contour line relative to the axis line of the three-dimensional model is determined by using the following steps: Step a): Detect whether the axis line of the three-dimensional model is a straight line, and detect whether the axis line of the three-dimensional model is perpendicular to the horizontal plane; Step b): When the axis line is a straight line and is perpendicular to the horizontal plane, if each contour line of the three-dimensional model is parallel to the axis line of the three-dimensional model, the stacked three-dimensional model is a triangular column or a cylinder; if each contour line of the three-dimensional model has an angle with the axis line of the three-dimensional model, the stacked three-dimensional model is an irregular body.
4. A monitoring method based on a packaging device according to claim 2, characterized in that: In the step 1), multiple inspection areas in the three-dimensional model are selected, and RPN training is performed on the selected inspection areas to generate actual inspection areas. For RPN training, the following formula (1) is used: (1); in, The three-dimensional model has a vector height, and the vector height of the three-dimensional model is perpendicular to the horizontal plane. has a high magnitude and direction, To set the vector height direction of the 3D model from bottom to top; is the vector height On height position, For the vector height Select the first height position, For the Inspection area at a height position, To remove the Inspection areas at different heights; For the vector height Select the first height position and remove the Data merging of inspection areas at different height positions; Along the vector height direction of the 3D model, in the vector height direction of the 3D model Select the first Height position , will Inspection area at a height position take out; The first Height position and Inspection area at a height position .
5. The monitoring method based on a packaging device according to claim 1, characterized in that: In the step 2), the parameter type analysis method used is the following formula (2): (2); in, is the vector height direction in the 3D model Select the first Height position The actual inspection area on the To calculate the actual inspection area area; The actual inspection area The edge line, The actual inspection area The edge line To the actual inspection area The geometric center shrinks, and the actual inspection area The edge line Finally shrink to the actual inspection area The geometric center of In the actual inspection area The edge line Shrink to the actual inspection area When the geometric center of The parameter type on ; To calculate the specific actual inspection area After the area is determined, the actual inspection area of the specific area is determined. The parameter type on ; The actual inspection area The result of judging the parameter type on .
6. A monitoring method based on a packaging device according to claim 1, characterized in that: In the step 3), the specific analysis is that as long as there is the dynamic target in one or more of the actual inspection areas, the controlled objects in all the actual inspection areas stop working.
7. A monitoring method based on a packaging device according to claim 1, characterized in that: In step 4), the specific analysis is that if there is a dynamic target in one or more of the actual inspection areas, the entire packaging device stops working, and if there is no dynamic target in any actual inspection area, the entire packaging device operates normally.
8. The monitoring method based on a packaging device according to claim 1, characterized in that: In the step 5), the dynamic targets and the static targets in each of the actual inspection areas are tracked or monitored in real time.
9. A control system based on a packaging device, used to execute a monitoring method based on a packaging device according to any one of claims 1 to 8, characterized in that: include: Multiple inspection area processing modules are used to pre-set multiple inspection areas, monitor and obtain data of multiple inspection areas, and conduct RPN training. Through RPN training, multiple pre-set inspection areas are generated into multiple actual inspection areas. Data module, used to store attribute information; Monitoring data analysis module, used to analyze parameters in each actual inspection area; Data tracking module, used to track dynamic and static targets in each actual inspection area; The inspection area processing module is connected to the monitoring data analysis module through the data module circuit, and the monitoring data analysis module circuit is connected to the data tracking module.
10. A control system based on a packaging device according to claim 9, characterized in that: The monitoring data analysis module circuit is connected to a control unit, and the control unit is used to control or adjust a controlled object.