Display module and display device

Abstract

This application provides a display module and a display device. The display module includes: a flexible circuit board with a connection area; a display panel located on one side of the flexible circuit board, the display panel including a bonding area and a display area, the orthographic projection of the display panel on the flexible circuit board being located in the connection area, and the orthographic projection of the flexible circuit board on the display panel being located in the bonding area; bonding pads located in the bonding area, the bonding pads being located on the side of the display panel closer to the flexible circuit board; an isolation structure located on the side of the bonding pads away from the display area; in the thickness direction of the display panel, the two ends of the isolation structure abut against the display panel and the flexible circuit board respectively; and circuit connection material disposed between the bonding pads and the flexible circuit board, located on the side of the isolation structure closer to the display area. By providing an isolation structure in the bonding area between the flexible circuit board and the display panel to prevent the overflow of circuit connection material, overflow is prevented from causing holes in the adhesive at the overflow point, thereby preventing corrosion of the bonding area.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and display device that prevents moisture from entering the bonding area through the adhesive holes during artificial sweat testing. Background Technology

[0002] With the development of display technology, the testing items for terminal displays are increasing and the testing requirements are becoming more stringent. In reliability testing, multiple products failed the artificial sweat test, with the failure path as follows: Figure 1 Failed products enter the bonding area through adhesive holes, causing corrosion in the bonding area. The causes of these adhesive holes are as follows: Figure 2 When applying the adhesive, the glue valve sprays the glue close to the edge of the display panel. The glue first comes into contact with the already cured area of ​​the anisotropic conductive film. Due to its weaker affinity, the UV (Ultraviolet Rays) glue preferentially fills part of the FPC (Flexible Printed Circuit), causing adhesive voids. Current improvement methods increase the distance between the flexible circuit board pads and the cutting edge, causing the ACF (Anisotropic Conductive Film) to shift inward and reduce ACF overflow, thus improving the UV coating effect of the adhesive. However, this cannot fundamentally solve this problem. In addition, this solution increases the panel size, which does not meet the size requirements of some customers. Summary of the Invention

[0003] In view of this, the present application aims to provide a display module and display device that can prevent moisture from entering the bonding area through the adhesive holes during artificial sweat testing, thereby eliminating the risk of adhesive holes.

[0004] According to one aspect of the inventive concept of this application, a display module is provided, comprising: a flexible circuit board, a display panel, bonding pads, an isolation structure, and circuit connection material. The flexible circuit board has a connection area. The display panel is located on one side of the flexible circuit board, and includes a bonding area and a display area. The orthographic projection of the display panel onto the flexible circuit board is located in the connection area, and the orthographic projection of the flexible circuit board onto the display panel is located in the bonding area. The bonding pads are located in the bonding area, and are situated on the side of the display panel closest to the flexible circuit board. The isolation structure is located on the side of the bonding pads away from the display area; in the thickness direction of the display panel, both ends of the isolation structure abut against the display panel and the flexible circuit board, respectively. The circuit connection material is disposed between the bonding pads and the flexible circuit board, and is located on the side of the isolation structure closest to the display area.

[0005] According to some embodiments of this application, the connection area of ​​the flexible circuit board is provided with a groove, and the orthographic projection of the groove on the display panel is located on the side of the isolation structure near the display area, and does not overlap with the orthographic projection of the isolation structure on the display panel.

[0006] Preferably, the orthographic projection of the groove on the display panel is located between the orthographic projection of the isolation structure on the display panel and the orthographic projection of the bonding pad on the display panel; or, the orthographic projection of the groove on the display panel is located within the orthographic projection of the bonding pad on the display panel.

[0007] According to some embodiments of this application, the circuit connection material fills the area defined by the isolation structure, the groove, the bonding area, and the connection area.

[0008] According to some embodiments of this application, the cross-sectional shape of the groove is rectangular, semi-circular, trapezoidal, or arc-shaped.

[0009] According to some embodiments of this application, the bonding structure further includes an adhesive backing located on the side of the isolation structure away from the display area.

[0010] Preferably, the adhesive backing covers at least a portion of the area on the flexible circuit board outside the connection area.

[0011] The adhesive backing includes: UV-curable adhesive, thermosetting adhesive, and structural adhesive.

[0012] According to some embodiments of this application, the isolation structure extends from the bonding area of ​​the display panel toward the connection area in a direction perpendicular to the plane of the display panel.

[0013] According to some embodiments of this application, the isolation structure extends from the connection area of ​​the flexible circuit board toward the bonding area in a direction perpendicular to the plane where the connection area is located.

[0014] According to some embodiments of this application, the isolation structure is bonded to one of the flexible circuit board and the display panel, and abuts against the other.

[0015] Preferably, the orthographic projection of the isolation structure onto the display panel is rectangular.

[0016] According to some embodiments of this application, the flexible circuit board includes: a substrate layer, a conductive layer, and a protective film layer. The conductive layer is located on one side of the substrate layer. The protective film layer is located on the side of the conductive layer away from the substrate layer, and the protective film layer covers the area on the flexible circuit board other than the connection area.

[0017] Preferably, the protective film is made of polyimide or polyester.

[0018] According to another aspect of the inventive concept of this application, a display device is also provided, including a display module as described in the foregoing embodiments.

[0019] According to the embodiments of this application, the display module and display device provide an isolation structure in the bonding area between the flexible circuit board and the display panel to prevent the overflow of circuit connection material, thereby preventing the back adhesive from having holes at the overflow point and thus causing corrosion of the bonding area. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a display module used in existing technologies for artificial sweat testing.

[0021] Figure 2 This is a schematic diagram of the existing technology used to address the issue of module overflow during artificial sweat testing.

[0022] Figure 3 This is a schematic diagram of the structure of a display module according to an embodiment of this application.

[0023] Figure 4 This is a partial structural exploded view of the display module before binding according to an embodiment of this application.

[0024] Figure 5 This is a partial structural exploded view of the display module before it is bound, according to another embodiment of this application.

[0025] Figure 6 This is a partial structural exploded view of the display module before binding, according to another embodiment of this application.

[0026] Figure 7 This is a flowchart of the bonding process of the display module according to an embodiment of this application.

[0027] Figure 8 yes Figure 7 The flowchart shown is a sub-step flowchart of step S2.

[0028] Figure 9 yes Figure 7 The flowchart shown is a sub-step flowchart of step S7.

[0029] Figure 10 This is a schematic diagram of the planar structure of the display device provided in the embodiments of this application.

[0030] Explanation of reference numerals in the attached figures:

[0031] 1-Flexible circuit board;

[0032] 101 - Connection Area;

[0033] 110 - Substrate layer;

[0034] 120 - Conductive layer;

[0035] 130 - Protective film layer;

[0036] 2-Display panel;

[0037] 201 - Binding Area;

[0038] 202 - Display Area;

[0039] 210 - Screen body;

[0040] 220 - Functional Layer;

[0041] 3- Bonding pads;

[0042] 4-Isolation structure;

[0043] 5-Circuit connection materials;

[0044] 6-groove;

[0045] 7- Adhesive backing;

[0046] 100 - Display device. Detailed Implementation

[0047] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0048] In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," etc., indicating orientation or positional relationships are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0049] The directional terms appearing in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the embodiments of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0050] Figure 1 This is a schematic diagram of the structure of a display module used in existing technologies for artificial sweat testing. Figure 2 This is a schematic diagram of the existing technology used to address the issue of module overflow during artificial sweat testing.

[0051] In related technologies, such as Figure 1 As shown, the display module includes a flexible circuit board 1 and a display panel 2. The flexible circuit board 1 includes a substrate layer 110, a conductive layer 120, and a protective film layer 130, wherein a connection area 101 is provided on the flexible circuit board 1. The display panel 2 includes a screen body 210 and a functional layer 220, wherein the display panel 2 includes a bonding area 201 and a display area 202. Electrical connection is required between the flexible circuit board 1 and the display panel 2; that is, the connection area 101 of the flexible circuit board 1 and the bonding area 201 of the display panel 2 are aligned and bonded together using a circuit connection material 5. During the bonding process, the circuit connection material 5 diffuses outward from the center along the contact cross-section of the two, with some of the circuit connection material 5 extending beyond the bonding area. Figure 1 For example, the circuit connection material 5 overflows into an area beyond the left end of the display panel 2. This area needs to be coated with adhesive 7 later. When the adhesive 7 is applied, the circuit connection material 5 has already cured. Due to the weak affinity between the adhesive 7 and the circuit connection material 5, the adhesive 7 cannot completely fill the area beyond the left end of the display panel 2, leaving adhesive holes in this area. These adhesive holes expose the circuit connection material 5 or the bonding area 201 directly or indirectly to the external environment. During artificial sweat testing, artificial sweat can corrode the components in the bonding area 201 through these adhesive holes, leading to test failure.

[0052] In the prior art, in order to solve the above-mentioned technical problems, such as Figure 2 As shown, a common method is to increase the distance from the pad to the cutting edge of the flexible circuit board 1, and to move the circuit connection material 5 inward (e.g., Figure 2The method shown (shifting to the right) is used to reduce excess adhesive in the circuit connection material 5, thereby reducing adhesive voids generated in subsequent processes. The above method can only reduce excess adhesive and adhesive voids, but cannot eliminate them. Furthermore, increasing the distance from the flexible circuit board 1 pads to the cutting edge will increase the size of the screen 210, affecting the product's dimensions.

[0053] Figure 3 This is a schematic diagram of the structure of a display module according to an embodiment of this application. Figure 4 This is a partial structural exploded view of the display module before binding according to an embodiment of this application. Figure 5 This is a partial structural exploded view of the display module before binding, according to another embodiment of this application. Figure 6 This is a partial structural exploded view of the display module before binding, according to another embodiment of this application.

[0054] According to one aspect of the inventive concept of this application, a display module is provided, such as... Figures 3 to 6 As shown, the display module includes: a flexible circuit board 1, a display panel 2, bonding pads 3, an isolation structure 4, and circuit connection material 5. The flexible circuit board 1 has a connection area 101. The display panel 2 is located on one side of the flexible circuit board 1, and includes a bonding area 201 and a display area 202. The orthographic projection of the display panel 2 onto the flexible circuit board 1 is located in the connection area 101, and the orthographic projection of the flexible circuit board 1 onto the display panel 2 is located in the bonding area 201. The bonding pads 3 are located in the bonding area 201, and are located on the side of the display panel 2 closest to the flexible circuit board 1. The isolation structure 4 is located on the side of the bonding pads 3 furthest from the display area 202; in the thickness direction of the display panel, both ends of the isolation structure 4 abut against the display panel 2 and the flexible circuit board 1, respectively. The circuit connection material 5 is disposed between the bonding pads 3 and the flexible circuit board 1, and is located on the side of the isolation structure 4 closest to the display area 202.

[0055] In this embodiment, by setting an isolation structure 4 in the bonding area 201 between the flexible circuit board 1 and the display panel 2 to block the overflow of the circuit connection material 5, the overflow is prevented from causing holes in the adhesive at the overflow point, which in turn leads to corrosion of the bonding area 201.

[0056] According to some embodiments of this application, the functional layer 220 includes functional structural layers such as an insulating layer, a planarization layer, a packaging layer, and a printed circuit board. Optionally, the bonding pads 3 are located on the printed circuit board; preferably, the bonding pads 3 are located on top of the functional layer 220 (i.e., Figure 4The outermost layer (the side furthest from the screen 210) facilitates the connection between electronic components and the printed circuit board. Plating pads on the top layer shorten the signal transmission path, thereby reducing signal loss and latency. This is especially important for the display panel 2, which requires high-speed, low-latency signal transmission.

[0057] According to some embodiments of this application, the bonding area 201 is generally located on the periphery of the display area 202. One or more bonding pads 3 are provided within the bonding area 201 for subsequent bonding of the driver chip or flexible circuit board 1, providing drive signals for the signal traces within the display area 202. Specifically, the bonding pads 3 are coupled to components such as light-emitting devices or touch electrodes inside the display panel 2 via signal leads. These signal leads are responsible for transmitting drive signals and data signals to enable the normal operation of the display panel 2.

[0058] According to some embodiments of this application, metal pads are typically made of copper (Cu) or other highly conductive metals and are tin-plated, gold-plated, or otherwise surface-treated to enhance their solderability and corrosion resistance.

[0059] According to some embodiments of this application, the circuit connection material 5 is an anisotropic conductive film (ACF).

[0060] According to some embodiments of this application, such as Figure 3 As shown in (a), the connection area of ​​the flexible circuit board 1 is provided with a groove 6. The orthographic projection of the groove 6 on the display panel 2 is located on the side of the isolation structure 4 near the display area 202, and does not overlap with the orthographic projection of the isolation structure on the display panel.

[0061] In this embodiment, during the process of using the circuit connection material 5 to bind the connection area 101 and the bonding pad 3, the circuit connection material 5 that diffuses towards the side of the coated adhesive area will enter the groove 6, further reducing the risk of adhesive overflow.

[0062] According to some optional embodiments of this application, such as Figure 3 As shown in (b), the orthographic projection of the groove 6 on the display panel 2 is located between the orthographic projection of the isolation structure 4 on the display panel 2 and the orthographic projection of the bonding pad 3 on the display panel 2.

[0063] In this embodiment, by misaligning the groove 3 with the bonding pad 3, the bonding effect between the display panel 2 and the flexible circuit board 1 can be improved, avoiding the influence of the groove 6.

[0064] According to some alternative embodiments of this application, such as Figure 3As shown in (c), the orthographic projection of the groove 6 on the display panel 2 is located within the orthographic projection of the bonding pad 3 on the display panel 2.

[0065] In this embodiment, by placing the groove 6 within the bonding pad 3 (i.e., the groove 6 is located within the bonding area of ​​the bonding pad 3), the bonding width can be effectively reduced, the amount of adhesive used can be reduced, the overall size of the display module can be reduced, and the space occupied can be saved. It should be noted that the groove 6 occupying the bonding area of ​​the bonding pad 3 should not affect the bonding effect between the display panel 2 and the flexible circuit board 1, and should not affect the transmission of signals and power between the two.

[0066] According to some embodiments of this application, the isolation structure 4 extends along the boundary line of the bonding area 201 on the side away from the display area 202. Optionally, the isolation structure 4 may also extend along the boundary lines on both sides adjacent to the aforementioned boundary line to further improve the effect of preventing adhesive spillage.

[0067] According to some embodiments of this application, such as Figure 3 As shown in (a) to (c), the circuit connection material 5 fills the area defined by the isolation structure 4, the groove 6, the bonding area 201 and the connection area 101. The circuit connection material 5 will not overflow to the side of the isolation structure away from the display area 202, thereby ensuring that the cured circuit connection material 5 will not affect the subsequent coating operation of the backing adhesive 7.

[0068] According to some embodiments of this application, preferably, the groove 6 is disposed adjacent to the isolation structure 4.

[0069] According to some embodiments of this application, the cross-sectional shape of the groove 6 is rectangular, semi-circular, trapezoidal, or arc-shaped.

[0070] In this embodiment, the cross section refers to a section cut along the width direction of the groove 6, that is, a cut perpendicular to the length or extension direction of the groove 6 (correspondingly, the longitudinal section refers to a cut parallel to the length or extension direction of the groove 6). The groove 6 can be prepared by etching.

[0071] According to some embodiments of this application, the groove 6 can be formed by patterning etching during the fabrication of a flexible circuit board.

[0072] According to some embodiments of this application, the bonding structure further includes an adhesive backing 7 located on the side of the isolation structure 4 away from the display area 202. Preferably, the adhesive backing 7 at least covers a portion of the area on the flexible circuit board 1 outside the connection area 101.

[0073] In this embodiment, the adhesive 7 mainly serves two purposes: firstly, it enhances the connection strength between the flexible circuit board 1 and the display panel 2, preventing them from tearing on the side of the bonding area 201 near the isolation structure 4 due to the deformation of the flexible circuit board 1; secondly, it improves the sealing performance, preventing moisture, sweat, etc. from invading the bonding area 201 and corroding the components inside.

[0074] According to some embodiments of this application, the adhesive 7 formed by spraying is in the form of strips, extending along the boundary of the bonding area 201, thereby enhancing the connection strength and sealing effect between the flexible circuit board 1 and the display panel 2.

[0075] According to some embodiments of this application, the materials of the adhesive backing include: ultraviolet (UV) curing adhesive, thermosetting adhesive, and structural adhesive.

[0076] According to some embodiments of this application, such as Figure 4 As shown, the isolation structure 4 is configured to extend from the bonding area 201 of the display panel 2 toward the connection area 101 in a direction perpendicular to the plane of the display panel 2.

[0077] In this embodiment, the isolation structure 4 is disposed on the display panel 2. The isolation structure 4 is formed by deposition or etching to form a structure protruding from the surrounding plane. During the bonding process, the circuit connection material 5 is coated on the bonding pad 3 and cured by hot pressing. At this time, the protruding end of the isolation structure 4 abuts against the flexible circuit board 1, thereby preventing the liquid circuit connection material 5 from overflowing.

[0078] According to some embodiments of this application, and the embodiments described above ( Figure 4 The difference is, such as Figure 5 As shown, the isolation structure 4 is configured to extend from the connection area 101 of the flexible circuit board 1 toward the bonding area 201 along the plane direction of the vertical connection area 101.

[0079] In this embodiment, the isolation structure 4 is disposed on the flexible circuit board 1. The isolation structure 4 is formed by deposition or etching to form a structure protruding from the surrounding plane. During the bonding process, the circuit connection material 5 is coated on the bonding pad 3 and cured by hot pressing. At this time, the protruding end of the isolation structure 4 abuts against the display panel 2, thereby preventing the liquid circuit connection material 5 from overflowing.

[0080] According to some embodiments of this application, and the embodiments described above ( Figure 4 , Figure 5 The difference is, such as Figure 6 As shown, the isolation structure 4 is bonded to one of the flexible circuit board 1 and the display panel 2, and abuts against the other. Preferably, the orthographic projection of the isolation structure 4 on the display panel 3 is rectangular.

[0081] In this embodiment, the isolation structure 4 is independent of the display panel 2 and the flexible circuit board 1. During the bonding process, the isolation structure 4 needs to be first pasted onto the display panel 2 or the flexible circuit board 1, and then the circuit connection material 5 is coated on the bonding pads 3 and cured by hot pressing. At this time, one end of the isolation structure 4 abuts against the display panel 2 or the flexible circuit board 1, and the other end is pasted onto the flexible circuit board 1 or the display panel 2, thereby preventing the liquid circuit connection material 5 from overflowing. Compared with the previous two embodiments, which use deposition and etching to form the isolation structure, the independently set isolation structure 4 combined with the pasting process is more efficient and less costly.

[0082] According to some embodiments of this application, the flexible circuit board 1 includes a substrate layer 110, a conductive layer 120, and a protective film layer 130. The conductive layer 120 is located on one side of the substrate layer 110. The protective film layer 130 is located on the side of the conductive layer 120 away from the substrate layer 110, and the protective film layer 130 covers the area on the flexible circuit board 1 other than the connection area 101.

[0083] According to some embodiments of this application, the substrate layer 110 is the supporting structure of the flexible circuit board 1, providing the overall shape and stability of the circuit board. Common materials include polyimide (PI) and polyester (PET). PI has high heat resistance and insulation, and is often used in applications with high heat resistance requirements; PET has lower cost, better flexibility and processability, but relatively poor heat resistance, and is mostly used in general consumer electronics products. The conductive layer 120 is commonly made of copper (CU). The copper foil layer is used as the conductive layer 120 of the FPC, and the required circuit pattern is formed by etching. The copper foil is often electrolytic copper foil or rolled copper foil. Electrolytic copper foil has lower cost and is suitable for applications with low flexibility requirements; rolled copper foil has good ductility and is suitable for scenarios requiring high flexibility and high-frequency bending. In some special applications, other metals or alloys may be used to replace copper foil to provide better conductivity, corrosion resistance, or high-temperature resistance. The protective film layer 130 is used to protect the copper foil circuitry from external environmental influences (such as moisture, dust, mechanical damage, etc.). It is typically made of the same material as the substrate layer 110, such as polyimide (PI) and polyester (PET). In some applications, other high-performance insulating materials may be used to replace the cover film to improve the overall performance and reliability of the circuit board.

[0084] In addition, flexible circuit boards also include adhesive layers, which are mainly used to bond materials from different layers together, ensuring the overall structural stability of the circuit board. Examples of adhesives used include acrylic and epoxy resins. These two adhesives perform well in terms of heat resistance, chemical resistance, and flexibility. Other types of adhesives or bonding agents can also be selected to provide better bonding performance and stability, depending on the application requirements.

[0085] According to some embodiments of this application, the flexible circuit board 1 may also include other layer structures as needed, such as solder resist layer, surface treatment layer, reinforcing plate, electromagnetic shielding film, etc., which will not be described in detail here.

[0086] Figure 7 This is a flow chart of the bonding process of the display module according to an embodiment of this application. Figure 8 yes Figure 7 The flowchart shown is a sub-step flowchart of step S2. Figure 9 yes Figure 7 The flowchart shown is a sub-step flowchart of step S7.

[0087] According to some embodiments of this application, such as Figures 7 to 9 As shown, the bonding of the flexible circuit board and the display panel includes steps S1 to S7.

[0088] Step S1: Preparation work, including: cleaning the bonding area of ​​the display panel and flexible circuit board, removing oil, dust and other impurities, and checking whether the pads are intact, free from oxidation and damage.

[0089] Step S2: Bonding process, bonding the connection area and the bonding pads. Specifically, as shown... Figure 8 As shown, step S2 includes sub-steps S201 to S204.

[0090] Sub-step S201: ACF application. Peel the ACF adhesive film off the protective film (release film) and apply it to the pads of the flexible circuit board or display panel, ensuring that the ACF adhesive film is flat, free of bubbles, and completely covers the pad area.

[0091] Sub-step S202: Alignment and pre-pressing. Align the flexible circuit board with the display panel to ensure that the pads and ACF film are correctly aligned. Use a pre-pressing device to pre-press the ACF film so that it initially contacts the pads and removes some air bubbles.

[0092] Sub-step S203: In-situ curing. The aligned flexible circuit board and display panel are placed in the in-situ curing equipment. According to the ACF specifications, the appropriate temperature, time and pressure conditions are set, and the in-situ curing equipment is started to cure the ACF film under specific temperature and pressure to form a stable conductive connection.

[0093] Sub-step S204: Inspection and testing. Use a microscope or other inspection equipment to check for defects such as bubbles and cracks in the ACF bonding area, and perform a continuity test to ensure that the circuit connection between the flexible circuit board and the display panel is normal.

[0094] Step S3: Cleaning. Use a lint-free cloth or special cleaning agent to clean the area to be sprayed and the surrounding area, and dry it thoroughly to ensure that the area to be sprayed and the surrounding area are clean and free of oil, dust and other impurities.

[0095] Step S4: Adhesive preparation and spraying equipment parameter setting;

[0096] Step S5: Adjust the spraying equipment to the preset parameters and perform adhesive spraying on the area to be sprayed and the surrounding area. During the spraying process, take care to avoid the adhesive flowing onto the bonding area or overflowing the edges. Maintain a stable distance between the spray gun and the bonding area to ensure uniform spraying.

[0097] Step S6: Curing. Adjust the curing equipment parameters, place the display panel with the adhesive backing onto the curing machine, start the curing machine, and cure according to the preset parameters. During the curing process, carefully observe the curing status of the adhesive backing to avoid under-curing or over-curing.

[0098] Step S7: Inspection and Testing. Specifically, such as... Figure 9 As shown, step S7 includes sub-steps S701 to S703.

[0099] Sub-step S701: Visual inspection. Use a microscope or magnifying glass to check the spraying quality and curing status of the adhesive backing to ensure that the adhesive backing evenly covers the edge of the bonding area and is free of defects such as bubbles, cracks, and holes.

[0100] Sub-step S702: Sealing test. Perform sealing tests, such as artificial sweat test, bubble test, water pressure test, etc., to ensure that the binding area is well sealed.

[0101] Sub-step S703: Electrical performance test, conduct a continuity test to ensure that the circuit connection between the flexible circuit board and the display panel is normal.

[0102] According to some embodiments of this application, in step S2, before pressing, the conductive particles in the ACF adhesive are approximately uniformly distributed and do not contact each other. When the ACF adhesive is placed between the bonding pads of the display panel and the FPC, and pressure and heat are applied, the ACF adhesive softens, and the conductive particles begin to flow and distribute uniformly. Under sufficient pressure, the insulating film of the conductive particles ruptures, allowing the particles to make contact with the pads and electrodes on the FPC. The conductive particles form a stable electrical connection during the pressing process, ensuring signal transmission between the display panel and the FPC. Due to the anisotropic conductivity of the ACF adhesive, short circuits will not form between adjacent electrodes due to the presence of conductive particles.

[0103] According to some optional embodiments of this application, in sub-step S203, the FOG (Film On Glass) ACF bonding temperature range is 150–205°C. The ACF application and pre-compression time is approximately 12 seconds, and the compression time is generally approximately 58 seconds. The bursting effect of the conductive particles in the ACF is mainly affected by the pressure, and the bursting pressure is determined by the hardness of the plastic core.

[0104] According to some embodiments of this application, the display panel can be a flexible display panel or a rigid display panel. The light extraction method of the display panel can be a bottom light extraction method or a top light extraction method.

[0105] According to some embodiments of this application, the display panel can be applied to any product or component with display function, such as television, digital camera, mobile phone, watch, tablet computer, laptop computer, navigator, e-book reader, player, laptop computer, in-vehicle computer, desktop computer or set-top box.

[0106] According to some embodiments of this application, the display panel can be applied to a display device, which can be a variety of electronic display products, including but not limited to at least one of mobile phones, tablet computers, e-book readers, media players, digital cameras, laptop computers, in-vehicle computers, desktop computers, set-top boxes, smart TVs, and wearable devices.

[0107] In addition, depending on actual needs, the display device may also include other structures such as a touch panel.

[0108] It should be noted that, for clarity, the complete structure of the display panel and display device described above is not presented. To achieve the necessary functions of the display panel or display device, those skilled in the art can configure other structures according to specific application scenarios.

[0109] Figure 10 This is a schematic diagram of the planar structure of the display device provided in the embodiments of this application.

[0110] According to another aspect of the inventive concept of this application, a display device is also provided, including a display module as described in the foregoing embodiments. The display device 100 includes the display panel 2 as described in any of the preceding claims.

[0111] The display device 100 provided in this embodiment can be a mobile phone, laptop, tablet computer, smartwatch, smart bracelet, navigator, monitor, personal digital assistant (PDA), or other products or components with display functions.

[0112] Since the display device 100 has the aforementioned display panel 2, the display device 100 has at least the beneficial effects of any one or more of the aforementioned display panels 2. The specific effects are as described above and will not be repeated here.

[0113] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications or equivalent substitutions made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display module, characterized in that, include: A flexible circuit board having a connection area, wherein the connection area has a groove; A display panel is located on one side of the flexible circuit board. The display panel includes a bonding area and a display area. The orthographic projection of the display panel on the flexible circuit board is located in the bonding area, and the orthographic projection of the flexible circuit board on the display panel is located in the bonding area. Bonding pads are located in the bonding area, and the bonding pads are located on the side of the display panel close to the flexible circuit board; An isolation structure is located on the side of the bonding pad away from the display area; in the thickness direction of the display panel, the two ends of the isolation structure abut against the display panel and the flexible circuit board, respectively; Adhesive backing is located on the side of the isolation structure away from the display area; The circuit connection material is disposed between the bonding pad and the flexible circuit board, and is located on the side of the isolation structure closer to the display area; The orthographic projection of the groove on the display panel is located on the side of the isolation structure closer to the display area, and does not overlap with the orthographic projection of the isolation structure on the display panel.

2. The display module according to claim 1, characterized in that, The orthographic projection of the groove on the display panel is located between the orthographic projection of the isolation structure on the display panel and the orthographic projection of the bonding pad on the display panel; Alternatively, the orthographic projection of the groove on the display panel lies within the orthographic projection of the bonding pad on the display panel.

3. The display module according to claim 2, characterized in that, The circuit connection material fills the area defined by the isolation structure, the groove, the bonding area, and the connection area.

4. The display module according to claim 2, characterized in that, The cross-sectional shape of the groove is rectangular, semi-circular, trapezoidal, or arc-shaped.

5. The display module according to any one of claims 1 to 4, characterized in that, The adhesive backing at least covers a portion of the area on the flexible circuit board outside the connection area.

6. The display module according to claim 4, characterized in that, The adhesive backing includes: UV-curable adhesive, thermosetting adhesive, and structural adhesive.

7. The display module according to claim 1, characterized in that, The isolation structure extends from the bonding area of ​​the display panel toward the connection area in a direction perpendicular to the plane of the display panel.

8. The display module according to claim 1, characterized in that, The isolation structure is bonded to one of the flexible circuit board and the display panel, and abuts against the other.

9. The display module according to claim 8, characterized in that, The orthographic projection of the isolation structure onto the display panel is a rectangle.

10. The display module according to claim 1, characterized in that, The flexible circuit board includes: Substrate layer; A conductive layer is located on one side of the substrate layer; A protective film layer is located on the side of the conductive layer away from the substrate layer, and the protective film layer covers the area on the flexible circuit board other than the connection area.

11. The display module according to claim 10, characterized in that, The protective film is made of materials including polyimide and polyester.

12. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 11.

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