Gold tearing equipment and gold tearing method

Abstract

The invention provides gold tearing equipment and a gold tearing method, and belongs to the field of wafer processing equipment. The gold tearing equipment comprises a stripping mechanism, the stripping mechanism comprises a slide holder, a rolling shaft, a scraper and a manipulator, the surface of the slide holder is provided with a collecting tank and a rotating column, the rotating column is rotatably installed in the collecting tank and used for containing wafers, the scraper is connected to the manipulator, and the rotating column is connected to the manipulator. The manipulator is used for controlling the scraper to move; a blue film is wound on the rolling shaft, and the mechanical arm is further used for pulling the blue film on the rolling shaft to be pressed on the rotating column in a covering mode. According to the embodiment of the invention, the problem that metal residues easily exist on the wafer during metal stripping can be improved, and the metal stripping efficiency is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of wafer processing equipment, and in particular to a gold stripping device and a gold stripping method. Background Art

[0002] In the process of making wafers, metal is evaporated on the surface of the wafer. Since the evaporation is carried out on the entire surface of the wafer, there will be excess metal that is not needed. Electrode stripping is often required to strip the excess metal from the wafer.

[0003] In the related art, the electrode stripping process is manual stripping, which uses a manual roller to press the film to peel off the gold.

[0004] However, the problem with manual stripping is that the edges of the wafer are not stripped cleanly, and there is metal residue on the surface, resulting in thinning and broken pieces. Some products also require secondary stripping, which affects the gold tearing efficiency. Summary of the invention

[0005] The disclosed embodiments provide a gold stripping device and a gold stripping method, which can improve the problem of metal residue on the wafer when stripping the metal, and improve the gold stripping efficiency. The technical solution is as follows:

[0006] On the one hand, an embodiment of the present disclosure provides a gold tearing device, which includes a stripping mechanism, which includes a wafer stage, a rolling shaft, a scraper and a manipulator. The surface of the wafer stage has a collecting groove and a rotating column, and the rotating column can be rotatably installed in the collecting groove. The rotating column is used to hold wafers, and the scraper is connected to the manipulator, and the manipulator is used to control the movement of the scraper; a blue film is wrapped around the rolling shaft, and the manipulator is also used to pull the blue film on the rolling shaft to press it onto the rotating column.

[0007] In one implementation of the present disclosure, the rotating column has a suction channel running through the rotating column, and the first end of the suction channel is located on the end surface of the rotating column; the stripping mechanism also includes a vacuum pump, which is connected to the second end of the suction channel.

[0008] In another implementation of the present disclosure, the peeling mechanism further includes at least two lifting members, and the at least two lifting members are evenly distributed circumferentially on the end surface of the rotating column, and one end of each of the lifting members is connected to the end surface of the rotating column.

[0009] In another implementation of the present disclosure, the height of the rotating column is less than or equal to the depth of the collecting tank.

[0010] In another implementation of the present disclosure, the peeling mechanism further includes a first position sensor, and the first position sensor is located on the surface of the rolling shaft for the blue film to be wound around.

[0011] In another implementation of the present disclosure, the gold tearing equipment also includes an edge-finding mechanism, which includes: an edge-finding shaft, a material box and a first motor, the material box having two opposite open ends; two opposite inner walls in the material box each have a plurality of spaced-apart limit bars, the limit bars extend from one open end of the material box to the other open end, the material box is used to hold wafers, and two adjacent limit bars are used to clamp the side edges of the wafers; the edge-finding shaft is located at an open end of the material box, and the outer wall of the edge-finding shaft contacts the side edge of the wafer, and the edge-finding shaft is transmission-connected to the output shaft of the first motor.

[0012] In another implementation of the present disclosure, the edge-finding mechanism further includes a second position sensor, the second position sensor and the edge-finding axis are located on different sides of the material box, and the second position sensor is used to detect whether the flat edges of each wafer are aligned.

[0013] In another implementation of the present disclosure, the peeling mechanism further includes a second motor, and an output shaft of the second motor is drivingly connected to the rotating column.

[0014] In another implementation of the present disclosure, the surface of the wafer stage has a plurality of collection slots arranged at intervals, and each of the collection slots is correspondingly provided with the rotating column.

[0015] On the other hand, the disclosed embodiment also provides a gold tearing method, which is implemented using the gold tearing equipment as described above, including: mounting a wafer on the end face of a rotating column; controlling a robot to pull a blue film on a rolling shaft to press onto the wafer on the rotating column, and then tearing the blue film off the wafer; controlling the rotating column to rotate, and controlling the robot to manipulate the scraper to move to contact the surface of the wafer, so that the scraper scrapes off the metal on the surface of the wafer.

[0016] The beneficial effects brought by the technical solution provided by the embodiments of the present disclosure include at least:

[0017] The stripping mechanism of the gold stripping device provided in the embodiment of the present disclosure includes a wafer stage, a rolling shaft, a scraper and a manipulator. The surface of the wafer stage is provided with a collection tank, and a rotating column rotatably installed in the collection tank. When performing the gold stripping operation, the wafer is mounted on the end face of the rotating column; then, the manipulator grabs the blue film from the rolling shaft and pulls the blue film to adhere to the wafer of the rotating column, and then, the manipulator tears the blue film off the wafer, thereby completing the preliminary gold stripping; at this time, there will still be some residual metal on the wafer. Then, the manipulator grabs the scraper and controls the scraper to move to contact the surface of the wafer, and at the same time controls the rotating column to rotate in the collection tank, so that during the process of the rotating column carrying the wafer to rotate, the surface of the wafer will continuously rub against the scraper, so that the scraper can scrape the metal remaining on the surface of the wafer off the wafer and throw it into the collection tank for metal recovery. In this way, the scraping method in which the wafer contacts the scraper during rotation can completely remove the metal remaining on the edge of the wafer, thereby avoiding the problem of thinning and fragmentation, and eliminating the need for secondary peeling, which can effectively improve the gold tearing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 is a schematic diagram of a gold tearing device provided by an embodiment of the present disclosure;

[0020] Figure 2 is a schematic diagram of an edge-finding mechanism provided in an embodiment of the present disclosure;

[0021] Figure 3 It is a flow chart of a gold tearing method provided in an embodiment of the present disclosure.

[0022] The descriptions of the marks in the figure are as follows:

[0023] 10. Stripping mechanism;

[0024] 11. Slide stage; 110. Collection tank; 111. Rotating column; 112. Suction channel; 113. Vacuum pump; 114. Lifting member; 115. First position sensor;

[0025] 12. Rolling shaft; 13. Scraper; 14. Robot; 15. Second motor;

[0026] 20. Border-finding agency;

[0027] 21. Find the edge axis;

[0028] 22. material box; 220. limit strip;

[0029] 23. a first motor; 24. a second position sensor;

[0030] 30. Wafer; 31. Flat edge;

[0031] 40. Blue film. DETAILED DESCRIPTION

[0032] In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

[0033] Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by persons with ordinary skills in the field to which the present disclosure belongs. The words "first", "second", "third" and similar words used in the patent application specification and claims of the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "one" do not indicate a quantity limitation, but indicate the existence of at least one. Words such as "include" or "comprise" and similar words mean that the elements or objects appearing before "include" or "comprise" include the elements or objects listed after "include" or "comprise" and their equivalents, and do not exclude other elements or objects. Words such as "connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right", "top", "bottom" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0034] Figure 1 Schematic diagram of a gold tearing device provided by an embodiment of the present disclosure. Figure 1 As shown, the gold stripping device includes a stripping mechanism 10, which includes a wafer carrier 11, a rolling shaft 12, a scraper 13 and a manipulator 14. The surface of the wafer carrier 11 has a collecting groove 110 and a rotating column 111, and the rotating column 111 is rotatably installed in the collecting groove 110.

[0035] The rotating column 111 is used to hold the wafer 30 , and the scraper 13 is connected to the robot 14 , and the robot 14 is used to control the movement of the scraper 13 .

[0036] like Figure 1 As shown, a blue film 40 is wound around the rolling shaft 12 , and the manipulator 14 is also used to pull the blue film 40 on the rolling shaft 12 to press onto the rotating column 111 .

[0037] The stripping mechanism 10 of the gold stripping device provided in the embodiment of the present disclosure includes a wafer stage 11, a rolling shaft 12, a scraper 13 and a manipulator 14. The surface of the wafer stage 11 is provided with a collecting tank 110 and a rotating column 111 rotatably installed in the collecting tank 110. When performing the gold stripping operation, the wafer 30 is mounted on the end face of the rotating column 111; then, the manipulator 14 grabs the blue film 40 from the rolling shaft 12, and pulls the blue film 40 to adhere to the wafer 30 of the rotating column 111, and then, the manipulator 14 tears the blue film 40 off the wafer 30, thereby completing the preliminary gold stripping; at this time, there will still be some residual metal on the wafer 30. Then, let the robot 14 grab the scraper 13, and control the scraper 13 to move to contact the surface of the wafer 30, and control the rotating column 111 to rotate in the collection tank 110. In this way, when the rotating column 111 carries the wafer 30 to rotate, the surface of the wafer 30 will continuously rub against the scraper 13, so that the scraper 13 can scrape the metal remaining on the surface of the wafer 30 off the wafer 30 and drop it into the collection tank 110 for metal recovery. In this way, the scraping method of contacting the scraper 13 during the rotation of the wafer 30 can completely sweep away the metal remaining on the edge of the wafer 30, thereby avoiding the problem of thinning and broken pieces, and no secondary peeling is required, which can effectively improve the gold tearing efficiency.

[0038] Alternatively, if Figure 1 As shown, the rotating column 111 has a suction channel 112 penetrating the rotating column 111 , and a first end of the suction channel 112 is located on an end surface of the rotating column 111 .

[0039] like Figure 1 As shown, the peeling mechanism 10 further includes a vacuum pumping member 113 , which is connected to the second end of the suction channel 112 .

[0040] For example, the other end of the suction channel 112 can also pass through the wafer stage 11, so that the suction channel 112 can extend to the bottom of the wafer stage 11, that is, the second end is located at the bottom surface of the wafer stage 11. In this way, the vacuum pumping member 113 can have a large enough placement space, so that the vacuum pumping member 113 can be connected to the second end of the suction channel 112.

[0041] In the disclosed embodiment, a suction channel 112 is provided in the rotating column 111, and the first end of the suction channel 112 is located at the end face of the rotating column 111, and the second end of the suction channel 112 is connected to the vacuum pump 113. In this way, when the wafer 30 is placed on the end face of the rotating column 111, the vacuum pump 113 is used to evacuate the suction channel 112 to a certain vacuum degree, so that the wafer 30 can be adsorbed on the rotating column 111. The wafer 30 is prevented from being thrown off the rotating column 111 during the rotation of the rotating column 111, and the connection reliability between the wafer 30 and the rotating column 111 is improved.

[0042] Exemplarily, the vacuum pump 113 may be a vacuum pump, and a suction port of the vacuum pump is in communication with the second end of the suction channel 112 .

[0043] Alternatively, if Figure 1 As shown, the peeling mechanism 10 further includes at least two lifting members 114 , which are evenly distributed on the end surface of the rotating column 111 in the circumferential direction, and one end of each lifting member 114 is connected to the end surface of the rotating column 111 .

[0044] For example, the lifting member 114 may be a telescopic cylinder. The cylinder body of the telescopic cylinder is located in a groove on the end face of the rotating column 111, and the telescopic rod of the telescopic cylinder protrudes from the groove. In this way, when the telescopic cylinder is extended and retracted, it can be ensured that the telescopic rod is completely retracted into the groove, that is, the telescopic rod is prevented from protruding from the end face of the rotating column 111 when the telescopic cylinder is in a retracted state.

[0045] In the above implementation, before the wafer 30 is installed on the rotating column 111, the telescopic rod of the telescopic cylinder is first controlled to extend, that is, the telescopic rod is allowed to protrude from the end face of the rotating column 111, so as to provide sufficient space for the robot 14, so that the robot 14 can grab the wafer 30 and place it on the telescopic rod; then, the robot 14 is controlled to grab the wafer 30 in the material box 22 onto the telescopic rod of the telescopic cylinder, and the telescopic rod is controlled to descend into the groove, so that the wafer 30 falls onto the end face of the rotating column 111 and covers the suction channel 112 on the rotating column 111.

[0046] Alternatively, if Figure 1 As shown, the height of the rotating column 111 is less than or equal to the depth of the collecting tank 110 .

[0047] In the disclosed embodiment, the height of the rotating column 111 is made smaller than the depth of the collecting tank 110, so that after the wafer 30 is mounted on the rotating column 111, the surface of the wafer 30 will also be lower than the opening of the collecting tank 110. When the wafer 30 rotates with the rotating column 111, the residual metal scraped by the scraper 13 can be blocked by the side wall of the collecting tank 110 after being thrown out, and then fall into the collecting tank 110, thereby preventing the scraped metal from splashing and improving the metal tearing efficiency.

[0048] Exemplarily, the height of the rotating column 111 is 1 cm to 5 cm less than the depth of the collecting tank 110. This ensures that the residual metal scraped by the scraper 13 is blocked by the side wall of the collecting tank 110 after being thrown out, preventing metal splashing and improving safety.

[0049] Alternatively, if Figure 1 As shown, the peeling mechanism 10 further includes a first position sensor 115 , which is located on the surface of the rolling shaft 12 for the blue film 40 to be wound around.

[0050] Exemplarily, the first position sensor 115 may be an infrared sensor.

[0051] In the above implementation, the first position sensor 115 is located on the rolling shaft 12, and when the blue film 40 is wound on the rolling shaft 12, the first position sensor 115 is also wrapped. When the blue film 40 is wound on the rolling shaft 12, the first position sensor 115 is blocked by the blue film 40, and the first position sensor 115 detects a first signal; when the blue film 40 on the rolling shaft 12 is removed, the first position sensor 115 is not blocked by the blue film 40, and the first position sensor 115 detects a second signal. Therefore, based on the signal detected by the first position sensor 115, it is possible to determine whether the blue film 40 on the rolling shaft 12 is used up.

[0052] In the disclosed embodiment, the peeling mechanism 10 may further include an alarm and a controller, and the alarm and the first position sensor 115 are both electrically connected to the controller. The controller can obtain the signal value detected by the first position sensor 115, and control the alarm to sound an alarm based on the signal value, thereby reminding the technician to replace the blue film 40 in time.

[0053] For example, when the controller obtains the first signal detected by the first position sensor 115 , the blue film 40 is still wrapped around the rolling shaft 12 , and therefore, the controller will not control the alarm to issue an alarm to remind the technician to replace the blue film 40 .

[0054] For example, when the controller obtains the second signal detected by the first position sensor 115 , there is no blue film 40 wrapped around the rolling shaft 12 , so the controller controls the alarm to send out an alarm to remind the technician to replace the blue film 40 .

[0055] Figure 2 Schematic diagram of an edge-finding mechanism 20 provided in an embodiment of the present disclosure. Figure 1 , 2 As shown, the gold tearing device further includes an edge-finding mechanism 20, which includes an edge-finding shaft 21, a material box 22 and a first motor 23, wherein the material box 22 has two opposite opening ends.

[0056] like Figure 1 , 2 As shown, two opposite inner walls of the material box 22 have a plurality of spaced-apart limit bars 220 , which extend from one opening end of the material box 22 to the other opening end. The material box 22 is used to hold the wafer 30 , and two adjacent limit bars 220 are used to clamp the sides of the wafer 30 .

[0057] like Figure 1 , 2As shown, the edge-finding shaft 21 is located at an open end of the material box 22 , and the outer wall of the edge-finding shaft 21 contacts the side of the wafer 30 , and the edge-finding shaft 21 is drivingly connected to the output shaft of the first motor 23 .

[0058] In the disclosed embodiment, the material box 22 is a U-shaped structure with two ends open, and the edge-finding shaft 21 is placed at an open end of the material box 22 so that the edge-finding shaft 21 can rotate under the drive of the first motor 23 .

[0059] At the same time, the inner wall of the material box 22 is also provided with a plurality of spaced limiting bars 220, and the gaps between adjacent limiting bars 220 are used to insert the side edges of the wafer 30. When the gold stripping operation is required, the technician inserts the wafer 30 into the gaps between the corresponding limiting bars 220.

[0060] like Figure 1 , 2 As shown, the wafer 30 is usually non-circular, and part of the side edge of the wafer 30 is a flat edge 31. In order to facilitate the robot 14 to grab the wafer 30, when the wafer 30 is placed in the material box 22, the flat edges 31 of each wafer 30 need to face the same side. Therefore, the embodiment of the present disclosure is further provided with an edge-finding shaft 21 below the material box 22, so that the outer wall of the edge-finding shaft 21 contacts the side edge of the wafer 30. When the edge-finding shaft 21 rotates under the drive of the first motor 23, if the flat edge 31 of the wafer 30 contacts the edge-finding shaft 21, at this time, the flat edge 31 of the wafer 30 is not easy to roll under the drive of the edge-finding shaft 21; if the arc edge of the wafer 30 contacts the edge-finding shaft 21, at this time, the wafer 30 will roll under the drive of the edge-finding shaft 21 until the flat edge 31 of the wafer 30 contacts the edge-finding shaft 21. Therefore, the edge-finding axis 21 can make the flat edges 31 of the wafers 30 placed in the material box 22 face the edge-finding axis 21, thereby automatically making the flat edges 31 of each wafer 30 face the same side.

[0061] Alternatively, if Figure 1 As shown, the edge-finding mechanism 20 further includes a second position sensor 24 . The second position sensor 24 and the edge-finding axis 21 are located on different sides of the material box 22 , and the second position sensor 24 is used to detect whether the flat edges 31 of each wafer 30 are aligned.

[0062] By way of example, the second position sensor 24 may be an infrared sensor.

[0063] In the embodiment of the present disclosure, the second position sensor 24 is disposed above the material box 22. Figure 1 For the two wafers 30 on the left side, when the flat edges 31 of all the wafers 30 face downward, that is, the flat edges 31 of the wafers 30 face the edge-finding axis 21, the height of the wafers 30 in the vertical direction is less than the diameter of the wafers 30; see Figure 1The wafer 30 on the right side is shown in FIG. 1 , and when the flat edge 31 of the wafer 30 faces the horizontal direction, the height of the wafer 30 in the vertical direction is equal to the diameter of the wafer 30. Therefore, when the flat edges 31 of all wafers 30 do not face the same side, the heights of some wafers 30 may be inconsistent.

[0064] When the flat edges 31 of all wafers 30 face the same side, there is no obstruction in front of the second position sensor 24, and the second position sensor 24 detects a signal value; when the flat edges 31 of some wafers 30 face different directions from the flat edges 31 of other wafers 30, there is an obstruction in front of the second position sensor 24, and the second position sensor 24 detects another signal value. Therefore, the controller can determine whether the wafers 30 are aligned based on the signal value detected by the second position sensor 24, and control the alarm to sound an alarm to remind the technicians.

[0065] Alternatively, if Figure 1 As shown, the peeling mechanism 10 further includes a second motor 15 , and an output shaft of the second motor 15 is drivingly connected to the rotating column 111 .

[0066] For example, Figure 1 As shown, at least part of the rotating column 111 is rotatably inserted in the bottom of the collecting tank 110, that is, the bottom of the collecting tank 110 has a groove for inserting the rotating column 111. The part of the rotating column 111 inserted in the bottom of the collecting tank 110 is connected to the output shaft of the second motor 15 through a gear transmission, so that the transmission component can be hidden in the carrier 11 to save space.

[0067] Optionally, the surface of the wafer stage 11 has a plurality of collection slots 110 arranged at intervals, and a rotating column 111 is correspondingly provided in each collection slot 110 .

[0068] By providing a plurality of collecting slots 110 , the gold stripping operation of a plurality of wafers 30 can be performed simultaneously on the wafer carrier 11 , so as to improve the efficiency of the gold stripping operation.

[0069] Exemplarily, a plurality of collection slots 110 may be arranged in a rectangular array on the surface of the wafer stage 11 .

[0070] Figure 3 is a flow chart of a gold-tearing method provided by an embodiment of the present disclosure. The gold-tearing method is implemented by using the gold-tearing device as described above. Figure 3 As shown, the gold tearing method includes:

[0071] Step S11: Mount the wafer on the end surface of the rotating column.

[0072] Specifically, the method may include: placing the wafer on the end face of the rotating column by using a robot, and then evacuating the suction channel to a certain vacuum degree by using a vacuum pump, so that the wafer can be adsorbed on the rotating column.

[0073] Alternatively, the wafer may include a substrate and epitaxial layers and metal layers deposited on the substrate.

[0074] For example, the substrate may be a sapphire substrate. The sapphire substrate has a relatively high light transmittance, that is, the substrate is a transparent substrate. In addition, the sapphire material is relatively hard and has relatively stable chemical properties, so that the light-emitting diode has good light-emitting effect and stability.

[0075] Optionally, one of the first semiconductor layer and the second semiconductor layer is a p-type layer, and the other of the first semiconductor layer and the second semiconductor layer is an n-type layer.

[0076] Exemplarily, the first semiconductor layer is an n-type layer, and the second semiconductor layer is a p-type layer.

[0077] Optionally, the first semiconductor layer is a silicon-doped n-type GaN layer, and the thickness of the n-type GaN layer may be 0.5 μm to 3 μm.

[0078] Optionally, the multi-quantum well layer includes alternately grown InGaN quantum well layers and GaN quantum barrier layers, wherein the multi-quantum well layer may include 3 to 8 periods of alternately stacked InGaN quantum well layers and GaN quantum barrier layers.

[0079] As an example, in the embodiment of the present disclosure, the multi-quantum well layer includes five periods of alternately stacked InGaN quantum well layers and GaN quantum barrier layers.

[0080] Optionally, the thickness of the multi-quantum well layer may be 150 nm to 200 nm.

[0081] Optionally, the second semiconductor layer is a magnesium-doped p-type GaN layer. The thickness of the p-type GaN layer may be 0.5 μm to 3 μm.

[0082] Optionally, the light emitting diode further includes an AlN buffer layer and a u-type GaN layer, the AlN buffer layer and the u-type GaN layer are sequentially stacked on the substrate, and the epitaxial layer is located on the u-type GaN layer.

[0083] Illustratively, the metal layer may include a first Al layer, a first Ti layer, a second Al layer, a second Ti layer, and an Au layer stacked in sequence.

[0084] When a metal layer is prepared on the epitaxial layer, it is often easy for the metal layer to adhere to the wafer or other areas where metal deposition is not required. Therefore, a gold stripping process is required to peel off this part of the metal layer and recycle it.

[0085] Step S12: Control the robot to pull the blue film on the rolling shaft to press onto the wafer on the rotating column, and then tear off the blue film from the wafer.

[0086] Specifically, it may include: controlling the robot arm to grab the blue film from the rolling shaft, and pulling the blue film to adhere to the wafer on the rotating column; then, letting the robot arm tear the blue film off the wafer, thereby completing the initial gold tearing.

[0087] Step S13: Control the rotating column to rotate, and control the robot to manipulate the scraper to move to contact the surface of the wafer, so that the scraper scrapes off the metal on the surface of the wafer.

[0088] Specifically, it may include: controlling the robot to grab the scraper, and controlling the scraper to move to contact the surface of the wafer, and controlling the rotating column to rotate in the collection tank. During the process of the rotating column carrying the wafer to rotate, the surface of the wafer will continuously rub against the scraper, so that the scraper can scrape the metal remaining on the surface of the wafer off the wafer and drop it into the collection tank for metal recovery.

[0089] The gold tearing device provided in the embodiment of the present disclosure utilizes a robot to tear the blue film off the wafer during the gold tearing operation, thereby completing the initial gold tearing. At the same time, the wafer is brought into contact with the scraper during rotation, thereby completely cleaning off the metal remaining on the edge of the wafer, thereby avoiding the problem of thinning and fragmentation, and eliminating the need for secondary peeling, thereby effectively improving the gold tearing efficiency.

[0090] The above description is only an optional embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A gold tearing device, characterized in that: The gold stripping device comprises a stripping mechanism (10), the stripping mechanism (10) comprises a wafer carrier (11), a rolling shaft (12), a scraper (13) and a manipulator (14), the surface of the wafer carrier (11) is provided with a collecting groove (110) and a rotating column (111), the rotating column (111) is rotatably installed in the collecting groove (110), the rotating column (111) is used to hold the wafer (30), the scraper (13) is connected to the manipulator (14), and the manipulator (14) is used to control the movement of the scraper (13); A blue film (40) is wound on the rolling shaft (12), and the manipulator (14) is also used to pull the blue film (40) on the rolling shaft (12) to press onto the rotating column (111).

2. The gold tearing device according to claim 1, characterized in that: The rotating column (111) has a suction channel (112) penetrating the rotating column (111), and a first end of the suction channel (112) is located on an end surface of the rotating column (111); The stripping mechanism (10) further comprises a vacuum pumping member (113), wherein the vacuum pumping member (113) is connected to the second end of the suction channel (112).

3. The gold tearing device according to claim 2, characterized in that: The peeling mechanism (10) further comprises at least two lifting members (114), wherein the at least two lifting members (114) are evenly distributed circumferentially on the end surface of the rotating column (111), and one end of each lifting member (114) is connected to the end surface of the rotating column (111).

4. The gold tearing device according to claim 2, characterized in that: The height of the rotating column (111) is less than or equal to the depth of the collecting tank (110).

5. The gold tearing device according to claim 1, characterized in that: The peeling mechanism (10) further comprises a first position sensor (115), wherein the first position sensor (115) is located on a surface of the rolling shaft (12) for winding the blue film (40).

6. The gold tearing device according to any one of claims 1 to 5, characterized in that: The metal tearing device further comprises an edge-finding mechanism (20), wherein the edge-finding mechanism (20) comprises: an edge-finding shaft (21), a material box (22) and a first motor (23), wherein the material box (22) has two opposite opening ends; Two opposite inner walls of the material box (22) are each provided with a plurality of spaced-apart limiting strips (220), the limiting strips (220) extending from one opening end of the material box (22) to the other opening end, the material box (22) being used to hold the wafer (30), and two adjacent limiting strips (220) being used to clamp the side edges of the wafer (30); The edge-finding shaft (21) is located at an open end of the material box (22), and the outer wall of the edge-finding shaft (21) contacts the side of the wafer (30). The edge-finding shaft (21) is drivingly connected to the output shaft of the first motor (23).

7. The gold tearing device according to claim 6, characterized in that: The edge-finding mechanism (20) further comprises a second position sensor (24), wherein the second position sensor (24) and the edge-finding axis (21) are located on different sides of the material box (22), and the second position sensor (24) is used to detect whether the flat edges (31) of each wafer (30) are aligned.

8. The gold tearing device according to any one of claims 1 to 5, characterized in that: The stripping mechanism (10) further comprises a second motor (15), the output shaft of the second motor (15) being in transmission connection with the rotating column (111).

9. The gold tearing device according to any one of claims 1 to 5, characterized in that: The surface of the wafer carrier (11) has a plurality of collection slots (110) arranged at intervals, and each of the collection slots (110) is correspondingly provided with the rotating column (111).

10. A gold tearing method, characterized in that: The gold stripping method is implemented by using the gold stripping device according to any one of claims 1 to 9, comprising: Mounting the wafer on the end surface of the rotating column; Controlling the robot to pull the blue film on the rolling shaft to press the blue film onto the wafer on the rotating column, and then tearing the blue film off the wafer; The rotating column is controlled to rotate, and the robot is controlled to manipulate the scraper to move to contact the surface of the wafer, so that the scraper scrapes off the metal on the surface of the wafer.

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