Wafer cleaning machine for wafer processing

Abstract

The invention relates to the technical field of wafer cleaning, in particular to a wafer cleaning machine for wafer processing, which comprises a cleaning box, a cleaning component is arranged in the cleaning box, a top frame is mounted on the top surface of the cleaning box, and a double-vibration generation module is mounted on the top frame. The double-vibration generating module is in transmission connection with a double-vibration frame capable of synchronously moving front and back and moving up and down in a reciprocating mode and a cleaning shaft capable of rotating, a set of bidirectional elastic reset pieces are installed between the double-vibration frame and the top frame, the cleaning shaft is rotationally installed on the double-vibration frame, and a gear sleeve capable of rotating is rotationally installed on the double-vibration frame. Through the arrangement of the double-vibration structure of the double-vibration frame and the arrangement of the reciprocating rotation structure of the cradle, multi-direction movement during wafer cleaning can be achieved, multi-direction washing of cleaning liquid on the wafer is achieved through the multi-direction movement, then the cleaning effect of the wafer is improved, and the device can achieve self-rotation during wafer body cleaning during cleaning, so that the wafer cleaning efficiency is improved. Therefore, the dirt throwing strength of the wafer body is improved through the centrifugal force.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning, and in particular to a wafer cleaning machine used for wafer processing. Background Art

[0002] A wafer refers to the silicon chip used to make silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer. During the wafer processing process, organic matter, particles, metal impurities, natural oxide layer, quartz, plastic and other pollutants on the wafer surface must be removed as needed without destroying the surface characteristics of the wafer.

[0003] There are many types of wafer cleaning devices in the prior art, but the existing wafer cleaning devices have the following technical problems when in use: the wafer cleaning direction is single, and the cleaning effect of pollutants before and after the accumulation of surface cleaning marks is inconsistent, resulting in poor cleaning effect; the traditional cleaning effect is poor, and pollutants are easily accumulated on the wafer surface after directional surface cleaning, and the post-flushing decontamination operation cannot be effectively performed, affecting the quality of subsequent processed wafers. Based on this, we propose a wafer cleaning machine for wafer processing. Summary of the invention

[0004] The purpose of the present invention is to solve the shortcomings existing in the background technology and to propose a wafer cleaning machine for wafer processing.

[0005] In order to achieve the above purpose, the technical solution adopted by the present invention is: a wafer cleaning machine for wafer processing, comprising a cleaning box, a cleaning assembly is arranged in the cleaning box, a top frame is installed on the top surface of the cleaning box, a double vibration generating module is installed on the top frame, a double vibration frame and a rotatable cleaning shaft are transmission-connected to the double vibration generating module, which can be synchronously displaced forward and backward and reciprocally moved up and down, and a group of bidirectional elastic reset parts are installed between the double vibration frame and the top frame, the cleaning shaft is rotatably installed on the double vibration frame, and the double vibration frame is rotatably mounted on the double vibration frame. A rotatable gear sleeve is installed, and a rocking shaft that can be reciprocated is rotatably installed in the gear sleeve, a reciprocating rocking module driven by a cleaning shaft is installed on the rocking shaft, a rocking frame is installed on the tail end of the rocking shaft, and two symmetrically arranged driving shafts are rotatably installed on the rocking frame, a synchronous belt is connected to the gear sleeve for transmission, and the two driving shafts are both connected to the synchronous belt for transmission, a wafer storage basket is clamped on the rocking frame, a wafer rotation generating module linked to the driving shaft is installed on the wafer storage basket, and a wafer body is carried on the wafer storage basket.

[0006] Preferably, the cleaning component includes a gate groove opened in the cleaning box, a gate plate is slidably installed on the gate groove, two symmetrically arranged electric heaters are installed on the cleaning box, a group of regularly distributed ultrasonic cleaning rods are installed at the bottom of the cleaning box, a drain valve is installed on the side of the cleaning box, and a single-chip computer is installed on the top frame.

[0007] Preferably, the reciprocating rocking module includes a rocking bevel gear installed on a rocking shaft, the rocking shaft is sleeved with a torsion spring connected to a double vibration frame, the rocking shaft is respectively installed with a first missing bevel gear and a second missing bevel gear, the first missing bevel gear and the second missing bevel gear are each provided with a tooth surface, the tooth surface is evenly distributed with teeth meshing with the rocking bevel gear, the gear sleeve and the cleaning shaft are both installed with linked bevel gears, and the two linked bevel gears are meshed with each other.

[0008] Preferably, the curvature of the tooth surface is 45°, the tooth surfaces on the first bevel-missing tooth and the second bevel-missing tooth are staggered by 180°, and the first bevel-missing tooth and the second bevel-missing tooth are respectively arranged on both sides of the rocking bevel tooth.

[0009] Preferably, the bidirectional elastic reset member includes a slide table slidably connected to the top frame, a vertical spring limited by the top frame is installed on the bottom surface of the slide table, a T-shaped guide rod is installed on the double vibration frame, the T-shaped guide rod is slidably connected to the slide table, and a flat spring limited by the T-shaped guide rod is sleeved on the T-shaped guide rod.

[0010] Preferably, the dual-vibration generating module includes a motor mounted on a top frame and a translation frame slidably connected to the top frame, the output shaft end of the motor is mounted with an inner square shaft, the translation frame is rotatably mounted with an outer square shaft linked to the inner square shaft, the top frame is respectively rotatably mounted with a front shaft and a rear shaft, the rear shaft and the inner square shaft are both mounted with a first bevel gear, the two first bevel gears are meshed with each other, the front shaft is transmission-connected to the rear shaft via a chain belt, a first half-tooth gear is mounted on the front shaft, a translation gear plate is mounted on the translation frame, the first half-tooth gear is transmission-connected to the translation gear plate, and a reciprocating guide is mounted on the dual-vibration frame and the translation gear plate.

[0011] Preferably, the reciprocating guide member includes a sleeve shaft rotatably connected to the translation frame, the sleeve shaft is linked to the cleaning shaft, the sleeve shaft and the outer square shaft are both equipped with a second bevel gear, the two second bevel gears are meshed with each other, a vertical tooth plate is installed on the double vibration frame, a circular shaft is rotatably installed on the translation frame, a second half-tooth gear is installed on the circular shaft, and the second half-tooth gear is transmission-connected to the vertical tooth plate.

[0012] Preferably, the outer square shaft is fixedly provided with a first square groove which is slidably connected to the inner square shaft, the sleeve shaft is fixedly provided with a second square groove which is open at both ends, the top of the cleaning shaft is provided with a square section which is slidably connected to the second square groove, and the cross-sections of the square section, the inner square shaft, the first square groove and the second square groove are all regular polygons.

[0013] Preferably, the wafer rotation generating module includes two fixed clamping shafts rotatably connected to the wafer storage basket, the tail end of the fixed clamping shaft and the front end of the driving shaft are both installed with friction disks, and the friction disks are evenly distributed with friction patterns, and a clamping screw and a transmission button are rotatably installed on the wafer storage basket, and the clamping screw is driven by the transmission button, and the clamping screw is symmetrically provided with positive thread sections and negative thread sections, and the positive thread sections and the negative thread sections are both transmission-mounted with clamps, and a dynamic clamping shaft is rotatably installed on the two clamps, and a group of regularly distributed silicone clamping wheels that cooperate with the wafer body are installed on the fixed clamping shaft and the dynamic clamping shaft.

[0014] Preferably, an electromagnetic block cooperating with the cradle is fixedly mounted on the wafer storage basket, and a slide groove cooperating with the wafer storage basket is provided at the bottom of the cradle.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention can realize multi-directional movement during wafer cleaning through the dual-vibration structure setting of the dual-vibration frame and the reciprocating rotation structure setting of the rocker. Through the multi-directional movement, the cleaning liquid can flush the wafer in multiple directions, thereby improving the cleaning effect of the wafer. In addition, the device can also realize the self-spinning of the wafer body during cleaning, thereby improving the dirt rejection intensity of the wafer body through centrifugal force.

[0016] The present invention arranges the tooth surfaces of the first and second conical teeth at an offset of 30° and the torsion springs, so that the rocking shaft can drive the rocking frame to rock back and forth within a set angle range. After the rocking frame rocked back and forth, it drives the wafer storage basket to rock back and forth within the set angle. The wafer storage basket rocked back and forth in the cleaning box, so that the cleaning liquid can flush the wafer body in the wafer storage basket back and forth, thereby improving the cleaning efficiency of the wafer body and the effect of removing impurities on the wafer body.

[0017] When the wafer body needs to be installed on the wafer storage basket in the present invention, the transmission button drives the clamping screw to make the two clamps move away from each other. After the two clamps move away from each other, the two movable clamping shafts are fully moved away from each other. After the two movable clamping shafts are fully moved away, it is convenient to place the wafer body on the wafer storage basket. When the wafer body is placed on the wafer storage basket, the transmission button drives the clamping screw to make the two movable clamping shafts cooperate with the fixed clamping shafts and realize four-point positioning of the wafer body on the wafer storage basket. Through the four-point positioning, the stability of the wafer body during cleaning is effectively improved. During cleaning, the wafer body placed on the wafer storage basket can rotate at a set speed through the drive shaft. The rotation of the wafer body during cleaning increases the flushing degree of the cleaning liquid on the wafer body and enables the ultrasonic cleaning rod to act evenly on the wafer body. The rotation of the wafer body during cleaning can improve the effect of throwing away dirt on the wafer body through centrifugal force. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of a wafer cleaning machine for wafer processing of the present invention; Figure 2 It is a schematic diagram of the structure of the cleaning box and the electric heater of the present invention; Figure 3 It is a structural schematic diagram of the double vibration frame and the motor of the present invention; Figure 4 For the present invention Figure 3 A schematic diagram of the local enlarged structure at point A in the middle; Figure 5 It is a schematic diagram of the structure of the square segment and the second half-tooth gear of the present invention; Figure 6 For the present invention Figure 5 A schematic diagram of the structure from another perspective; Figure 7 For the present invention Figure 6 A schematic diagram of the local enlarged structure at B in the middle; Figure 8 For the present invention Figure 6 A schematic diagram of the local enlarged structure at C in the middle; Fig. 9 It is a schematic structural diagram of the cleaning shaft of the present invention.

[0019] In the figure: 1, cleaning box; 2, top frame; 3, double vibration frame; 4, cleaning shaft; 5, gear sleeve; 6, rocking shaft; 7, rocking frame; 8, driving shaft; 9, wafer storage basket; 10, wafer body; 11, gate slot; 12, gate plate; 13, electric heater; 14, ultrasonic cleaning rod; 15, single chip microcomputer; 16, rocking cone gear; 17, first missing cone gear; 18, second missing cone gear; 19, slide; 20, vertical spring; 21, T-shaped guide rod; 22, flat spring; 23 , torsion spring; 24, motor; 25, translation frame; 26, inner square shaft; 27, outer square shaft; 28, front shaft; 29, rear shaft; 30, first half-tooth gear; 31, translation gear plate; 32, sleeve shaft; 33, vertical gear plate; 34, round shaft; 35, second half-tooth gear; 36, square segment; 37, fixed clamping shaft; 38, friction disk; 39, clamping screw; 40, transmission button; 41, clamp; 42, dynamic clamping shaft; 43, silicone clamping wheel; 44, electromagnetic block. DETAILED DESCRIPTION

[0020] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art may think of other obvious variations.

[0021] like Figure 1-Figure 9 A wafer cleaning machine for wafer processing shown includes a cleaning box 1, in which a cleaning component is arranged; A top frame 2 is installed on the top surface of the cleaning box 1; See also Figure 1 and Figure 2 As shown, the cleaning assembly includes a gate slot 11 opened in the cleaning box 1, a gate plate 12 is slidably installed on the gate slot 11, two symmetrically arranged electric heaters 13 are installed on the cleaning box 1, a group of regularly distributed ultrasonic cleaning rods 14 are installed at the bottom of the cleaning box 1, a sewage valve is installed on the side of the cleaning box 1, and a single-chip computer 15 is installed on the top frame 2; When the wafer storage basket 9 needs to be installed on the cradle 7, the gate 12 is opened. During cleaning, the gate 12 is installed in the gate groove 11, and then a sufficient amount of cleaning liquid is injected into the cleaning box 1. When the cleaning liquid is injected, it should be ensured that the injection height of the cleaning liquid overflows the wafer body 10. During cleaning, the electric heater 13 heats the cleaning liquid in the cleaning box 1 at a set power, and the ultrasonic cleaning rod 14 generates an ultrasonic frequency at a set power, thereby realizing ultrasonic cleaning of the wafer body 10; See also Figure 1 , Figure 3 , Figure 2 As shown, a double vibration module is installed on the top frame 2, and a double vibration frame 3 and a rotatable cleaning shaft 4 that can be synchronously displaced forward and backward and reciprocated up and down are connected to the double vibration module. A set of bidirectional elastic reset parts are installed between the double vibration frame 3 and the top frame 2, and the cleaning shaft 4 is rotatably installed on the double vibration frame 3; The bidirectional elastic reset member includes a slide table 19 slidably connected to the top frame 2, a vertical spring 20 limited by the top frame 2 is installed on the bottom surface of the slide table 19, a T-shaped guide rod 21 is installed on the double vibration frame 3, the T-shaped guide rod 21 is slidably connected to the slide table 19, and a flat spring 22 limited by the T-shaped guide rod 21 is sleeved on the T-shaped guide rod 21; When the double vibration frame 3 is displaced forward and backward and moved up and down, the double vibration frame 3 is elastically limited in both directions by setting the bidirectional elastic limiter; The double vibration generating module comprises a motor 24 mounted on the top frame 2 and a translation frame 25 slidably connected to the top frame 2. An inner square shaft 26 is mounted on the output shaft end of the motor 24. An outer square shaft 27 which is linked to the inner square shaft 26 is rotatably mounted on the translation frame 25. The outer square shaft 27 is fixedly provided with a first square groove which is slidably connected to the inner square shaft 26; See also Figure 5-Figure 9 As shown, the top frame 2 is rotatably mounted with a front shaft 28 and a rear shaft 29, and the rear shaft 29 and the inner square shaft 26 are both mounted with first bevel gears, the two first bevel gears are meshed with each other, and the front shaft 28 is connected to the rear shaft 29 through a chain belt; A first half-toothed gear 30 is installed on the front shaft 28, a translation gear plate 31 is installed on the translation frame 25, the first half-toothed gear 30 is in transmission connection with the translation gear plate 31, and a reciprocating guide is installed on the double vibration frame 3 and the translation gear plate 31; After the motor 24 outputs the rotation speed, the first half-toothed gear 30, the translation gear plate 31 and the bidirectional elastic reset member are arranged to realize the front and rear reciprocating movement of the translation frame 25. After the front and rear reciprocating movement of the translation frame 25, the wafer storage basket 9 is driven to reciprocate in the cleaning box 1. The reciprocating guide member includes a sleeve shaft 32 rotatably connected to the translation frame 25, and the sleeve shaft 32 is linked with the cleaning shaft 4; A second square groove with two ends opened is fixedly formed on the sleeve shaft 32, and a square section 36 slidably connected to the second square groove is provided on the top of the cleaning shaft 4; The cross sections of the square segment 36, the inner square axis 26, the first square groove and the second square groove are all regular polygons; The square section 36, the inner square shaft 26, the first square groove and the second square groove are arranged as regular polygonal cross sections, so that the motor 24 can continuously drive the cleaning shaft 4 during the synchronous forward and backward reciprocating movement and up and down reciprocating movement along the double vibration frame 3; A second bevel gear is mounted on each of the sleeve shaft 32 and the outer square shaft 27, and the two second bevel gears mesh with each other; See also Figure 5-Figure 9 As shown, a vertical tooth plate 33 is installed on the double vibration frame 3, a round shaft 34 is rotatably installed on the translation frame 25, a second half-tooth gear 35 is installed on the round shaft 34, and the second half-tooth gear 35 is transmission-connected with the vertical tooth plate 33; A rotatable gear sleeve 5 is rotatably mounted on the double vibration frame 3, a reciprocating rocking shaft 6 is rotatably mounted inside the gear sleeve 5, a reciprocating rocking module driven by the cleaning shaft 4 is mounted on the rocking shaft 6, and a cradle 7 is mounted at the tail end of the rocking shaft 6; The reciprocating shaking module includes a shaking bevel gear 16 mounted on a shaking shaft 6, a torsion spring 23 connected to the double vibration frame 3 is sleeved on the shaking shaft 6, a first missing bevel gear 17 and a second missing bevel gear 18 are respectively mounted on the shaking shaft 6, and a tooth surface is provided on the first missing bevel gear 17 and the second missing bevel gear 18, and teeth meshing with the shaking bevel gear 16 are evenly distributed on the tooth surface; The curvature of the tooth surface is 45°, and the tooth surfaces on the first missing bevel tooth 17 and the second missing bevel tooth 18 are staggered by 180°. The first missing bevel tooth 17 and the second missing bevel tooth 18 are respectively arranged on both sides of the shaking bevel tooth 16; By means of the 180° offset setting of the tooth surfaces of the first missing bevel tooth 17 and the second missing bevel tooth 18 and the setting of the torsion spring 23, the rocking shaft 6 can drive the rocking frame 7 to rock back and forth within the set angle range. After the rocking frame 7 rocked back and forth, the wafer storage basket 9 was driven to rock back and forth within the set angle. By means of the reciprocating rocking of the wafer storage basket 9 in the cleaning box 1, the cleaning liquid can realize the reciprocating flushing of the wafer body 10 in the wafer storage basket 9, thereby improving the cleaning efficiency of the wafer body 10 and the removal effect of the impurities on the wafer body 10. Linked bevel gears are installed on the gear sleeve 5 and the cleaning shaft 4, and the two linked bevel gears are meshed with each other; Two symmetrically arranged drive shafts 8 are rotatably mounted on the cradle 7, and a synchronous belt is connected to the gear sleeve 5 for transmission, and both drive shafts 8 are connected to the synchronous belt for transmission; Through the linkage bevel gear arrangement on the cleaning shaft 4 and the gear sleeve 5, after the cleaning shaft 4 rotates, the gear sleeve 5 can reciprocate, and after the gear sleeve 5 reciprocates, it drives the two drive shafts 8 to rotate synchronously at the same speed; A wafer storage basket 9 is clamped on the cradle 7; See also Figure 3 , Figure 4 and Figure 5 As shown, an electromagnetic block 44 cooperating with the cradle 7 is fixedly mounted on the wafer storage basket 9, a slideway cooperating with the wafer storage basket 9 is provided at the bottom of the cradle 7, and a guide rail portion cooperating with the slideway is fixedly provided on the wafer storage basket 9; Through the cooperation of the slide groove and the guide rail, the wafer storage basket 9 is accurately positioned and installed on the cradle 7. After the wafer storage basket 9 is accurately positioned and installed on the cradle 7, the wafer storage basket 9 can be magnetically attracted to the cradle 7 by the setting of the electromagnetic block 44, thereby realizing the accurate positioning of the wafer storage basket 9 on the cradle 7. A wafer rotation generating module linked with the driving shaft 8 is installed on the wafer storage basket 9 , and a wafer body 10 is carried on the wafer storage basket 9 .

[0022] The wafer rotation module includes two fixed clamping shafts 37 rotatably connected to the wafer storage basket 9, and the tail ends of the fixed clamping shafts 37 and the front ends of the driving shafts 8 are both equipped with friction discs 38, and the friction discs 38 are evenly distributed with friction lines; When the wafer storage basket 9 is installed on the cradle 7, the positions of the two fixed clamping shafts 37 correspond to the positions of the two driving shafts 8 respectively, and the friction disk 38 at the tail of the fixed clamping shaft 37 is pressed and fitted with the friction disk 38 at the front end of the driving shaft 8. When the friction disk 38 at the tail of the fixed clamping shaft 37 is pressed and fitted with the friction disk 38 at the front end of the driving shaft 8, the driving shaft 8 then drives the fixed clamping shaft 37 to rotate at a set speed. After the driving shaft 8 rotates, the wafer body 10 to be cleaned is driven to rotate at a set speed in the wafer storage basket 9; A clamping screw 39 and a transmission button 40 are rotatably installed on the upper end of the wafer storage basket 9. The clamping screw 39 is driven by the transmission button 40. The clamping screw 39 is symmetrically provided with a positive thread section and a negative thread section. The positive thread section and the negative thread section are both transmission-mounted with clamps 41. A movable clamping shaft 42 is rotatably installed on the two clamps 41. A group of regularly distributed silicone clamping wheels 43 that cooperate with the wafer body 10 are installed on the fixed clamping shaft 37 and the movable clamping shaft 42.

[0023] When the wafer body 10 needs to be installed on the wafer storage basket 9, the transmission button 40 drives the clamping screw 39 to make the two clamps 41 move away from each other. After the two clamps 41 move away from each other, the two movable clamping shafts 42 move away from each other. After the two movable clamping shafts 42 move away from each other, it is convenient to place the wafer body 10 on the wafer storage basket 9. When the wafer body 10 is placed on the wafer storage basket 9, the transmission button 40 drives the clamping screw 39, so that the two movable clamping shafts 42 can cooperate with the fixed clamping shaft 37 and realize the wafer body 10 on the wafer storage basket 9. The four-point positioning on the storage basket 9 can effectively improve the stability of the wafer body 10 during cleaning. During cleaning, the wafer body 10 placed on the wafer storage basket 9 can rotate at a set speed through the driving shaft 8. The rotation of the wafer body 10 during cleaning can improve the flushing degree of the cleaning liquid on the wafer body 10 and enable the ultrasonic cleaning rod 14 to act evenly on the wafer body 10. The rotation of the wafer body 10 during cleaning can improve the effect of throwing away dirt on the wafer body 10 through centrifugal force. Working principle: when it is necessary to install the wafer storage basket 9 on the cradle 7, the gate 12 is opened. During cleaning, the gate 12 is installed in the gate groove 11, and then a sufficient amount of cleaning liquid is injected into the cleaning box 1. When the cleaning liquid is injected, it should be ensured that the injection height of the cleaning liquid exceeds the wafer body 10. During cleaning, the electric heater 13 heats the cleaning liquid in the cleaning box 1 with a set power, and the ultrasonic cleaning rod 14 generates an ultrasonic frequency with a set power, thereby realizing ultrasonic cleaning of the wafer body 10. When it is necessary to install the wafer body 10 on the wafer storage basket 9, the transmission button 40 drives the clamping screw 39 to move the two clamps 41 away from each other. After the two clamps 41 move away from each other, the two movable clamp shafts 42 are fully moved away. After the two movable clamp shafts 42 are fully moved away, it is convenient to place the wafer body 10 on the wafer storage basket 9. When the wafer body 10 is placed on the wafer After the wafer storage basket 9 is placed, the transmission button 40 drives the clamping screw 39, so that the two dynamic clamping shafts 42 can cooperate with the fixed clamping shaft 37 and realize the four-point positioning of the wafer body 10 on the wafer storage basket 9. The four-point positioning can effectively improve the stability of the wafer body 10 during cleaning. During cleaning, the driving shaft 8 can drive the wafer body 10 placed on the wafer storage basket 9 to rotate at a set speed. The rotation of the wafer body 10 during cleaning can increase the flushing degree of the cleaning liquid on the wafer body 10 and enable the ultrasonic cleaning rod 14 to act evenly on the wafer body 10. The rotation of the wafer body 10 during cleaning can improve the effect of throwing away dirt on the wafer body 10 through centrifugal force. Through the double vibration movement of the double vibration frame 3, the wafer storage basket 9 can move in multiple directions during cleaning and realize a multi-directional cleaning effect.

[0024] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. A wafer cleaning machine for wafer processing, comprising a cleaning box (1), wherein a cleaning component is arranged in the cleaning box (1), characterized in that: The top surface of the cleaning box (1) is provided with a top frame (2), a double vibration generating module is provided on the top frame (2), a double vibration frame (3) and a rotatable cleaning shaft (4) are connected to the double vibration generating module in a transmission manner, the double vibration frame (3) being capable of synchronous forward and backward displacement and up and down reciprocating displacement, a group of bidirectional elastic reset parts are provided between the double vibration frame (3) and the top frame (2), the cleaning shaft (4) is rotatably provided on the double vibration frame (3), a rotatable gear sleeve (5) is rotatably provided on the double vibration frame (3), a reciprocating rocking shaft (6) is rotatably provided in the gear sleeve (5), The rocking shaft (6) is provided with a reciprocating rocking module driven by a cleaning shaft (4); the tail end of the rocking shaft (6) is provided with a rocking frame (7); two symmetrically arranged drive shafts (8) are rotatably provided on the rocking frame (7); a synchronous belt is connected to the gear sleeve (5); the two drive shafts (8) are both connected to the synchronous belt for transmission; a wafer storage basket (9) is clamped on the rocking frame (7); a wafer rotation generating module linked to the drive shaft (8) is provided on the wafer storage basket (9); and a wafer body (10) is carried on the wafer storage basket (9).

2. A wafer cleaning machine for wafer processing according to claim 1, characterized in that: The cleaning component comprises a gate groove (11) opened in a cleaning box (1), a gate plate (12) being slidably mounted on the gate groove (11), two symmetrically arranged electric heaters (13) being mounted on the cleaning box (1), a group of regularly distributed ultrasonic cleaning rods (14) being mounted on the bottom of the cleaning box (1), a sewage valve being mounted on the side of the cleaning box (1), and a single-chip computer (15) being mounted on the top frame (2).

3. The wafer cleaning machine for wafer processing according to claim 1, characterized in that: The reciprocating rocking module comprises a rocking bevel gear (16) mounted on a rocking shaft (6); a torsion spring (23) connected to a double rocking frame (3) is sleeved on the rocking shaft (6); a first missing bevel gear (17) and a second missing bevel gear (18) are respectively mounted on the rocking shaft (6); the first missing bevel gear (17) and the second missing bevel gear (18) are each provided with a tooth surface; teeth meshing with the rocking bevel gear (16) are evenly distributed on the tooth surface; linkage bevel gears are mounted on the gear sleeve (5) and the cleaning shaft (4); the two linkage bevel gears mesh with each other.

4. A wafer cleaning machine for wafer processing according to claim 3, characterized in that: The curvature of the tooth surface is 45°, the tooth surfaces on the first missing bevel tooth (17) and the second missing bevel tooth (18) are arranged at a 180° offset, and the first missing bevel tooth (17) and the second missing bevel tooth (18) are respectively arranged on both sides of the rocking bevel tooth (16).

5. The wafer cleaning machine for wafer processing according to claim 1, characterized in that: The bidirectional elastic reset member comprises a slide table (19) slidably connected to the top frame (2), a vertical spring (20) limited by the top frame (2) is installed on the bottom surface of the slide table (19), a T-shaped guide rod (21) is installed on the double vibration frame (3), the T-shaped guide rod (21) is slidably connected to the slide table (19), and a flat spring (22) limited by the T-shaped guide rod (21) is sleeved on the T-shaped guide rod (21).

6. A wafer cleaning machine for wafer processing according to claim 5, characterized in that: The dual vibration generating module comprises a motor (24) mounted on a top frame (2) and a translation frame (25) slidably connected to the top frame (2); an inner square shaft (26) is mounted on the output shaft end of the motor (24); an outer square shaft (27) linked to the inner square shaft (26) is rotatably mounted on the translation frame (25); a front shaft (28) and a rear shaft (29) are rotatably mounted on the top frame (2); first bevel gears are mounted on the rear shaft (29) and the inner square shaft (26); the two first bevel gears are meshed with each other; the front shaft (28) is transmission-connected to the rear shaft (29) via a chain belt; a first half-tooth gear (30) is mounted on the front shaft (28); a translation tooth plate (31) is mounted on the translation frame (25); the first half-tooth gear (30) is transmission-connected to the translation tooth plate (31); and a reciprocating guide is mounted on the dual vibration frame (3) and the translation tooth plate (31).

7. A wafer cleaning machine for wafer processing according to claim 6, characterized in that: The reciprocating guide member comprises a sleeve shaft (32) rotatably connected to the translation frame (25), the sleeve shaft (32) being linked to the cleaning shaft (4), the sleeve shaft (32) and the outer square shaft (27) being both provided with a second bevel gear, the two second bevel gears being meshed with each other, a vertical tooth plate (33) being provided on the double vibration frame (3), a round shaft (34) being rotatably installed on the translation frame (25), a second half-tooth gear (35) being installed on the round shaft (34), and the second half-tooth gear (35) being transmission-connected to the vertical tooth plate (33).

8. The wafer cleaning machine for wafer processing according to claim 7, characterized in that: The outer square shaft (27) is fixedly provided with a first square groove which is slidably connected to the inner square shaft (26); the sleeve shaft (32) is fixedly provided with a second square groove which is open at both ends; the top of the cleaning shaft (4) is provided with a square section (36) which is slidably connected to the second square groove; the cross-sections of the square section (36), the inner square shaft (26), the first square groove and the second square groove are all regular polygons.

9. The wafer cleaning machine for wafer processing according to claim 1, characterized in that: The wafer rotation generating module comprises two fixed clamping shafts (37) rotatably connected to the wafer storage basket (9), the tail end of the fixed clamping shaft (37) and the front end of the driving shaft (8) are both equipped with friction disks (38), and the friction disks (38) are evenly distributed with friction lines. A clamping screw (39) and a transmission button (40) are rotatably installed on the wafer storage basket (9), and the clamping screw (39) is driven by the transmission button (40). The clamping screw (39) is symmetrically provided with positive thread segments and negative thread segments, and the positive thread segments and the negative thread segments are both transmission-mounted with clamps (41), and the two clamps (41) are both rotatably equipped with a dynamic clamping shaft (42), and a group of regularly distributed silicone clamping wheels (43) that cooperate with the wafer body (10) are both installed on the fixed clamping shaft (37) and the dynamic clamping shaft (42).

10. The wafer cleaning machine for wafer processing according to claim 9, characterized in that: An electromagnetic block (44) cooperating with the cradle (7) is fixedly mounted on the wafer storage basket (9), and a sliding groove cooperating with the wafer storage basket (9) is provided at the bottom of the cradle (7).

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