Chip packaging equipment and chip packaging method

Abstract

The invention provides chip packaging equipment and a chip packaging method. According to the chip packaging equipment provided by the invention, the vacuum pump is connected with the loading chamber, air in the loading chamber is pumped out through the vacuum pump after the heat dissipation cover and the first middleware are loaded into the loading chamber every time, the vacuum space in the loading chamber is formed, and at the moment, the gate between the loading chamber and the vacuum chamber is opened; then a robot with a mechanical arm is used for transferring the heat dissipation cover and the first intermediate piece into hot pressing equipment to form a piece to be processed, at the moment, due to the vacuum working environment, a negative pressure area is formed between the heat dissipation cover and the interface heat dissipation material preformed piece, in the hot pressing process, the interface heat dissipation material preformed piece can fill an uneven area on the heat dissipation cover, and the heat dissipation effect is improved. The interface heat dissipation material preformed part is in surface contact with the heat dissipation cover, bubbles are prevented from being formed between the interface heat dissipation material preformed part and the heat dissipation cover, and the heat conductivity and the mechanical stability of the chip packaging structure can be improved.

Description

Technical Field

[0001] The present application relates to the field of chip packaging technology, and in particular to a chip packaging device and a chip packaging method. Background Art

[0002] In the field of semiconductor packaging, efficient heat transfer is essential for the reliable operation of the chip. Interface thermal interface material preforms (TIMs) are applied between the chip and the heat sink to promote heat dissipation. However, when the chip and the heat sink are fixed with the interface thermal interface material preform, large bubbles will be formed between the chip and the heat sink, which seriously affects the heat transfer and structural stability of the chip packaging structure. Summary of the invention

[0003] In view of this, the present application provides a chip packaging device and a chip packaging method to solve the problem of bubbles generated when welding the heat dissipation cover and the chip using an interface heat dissipation material preform, so as to improve the heat transferability and structural stability of the chip packaging structure.

[0004] Specifically, the present application is implemented through the following technical solutions:

[0005] In a first aspect, the present application provides a chip packaging device, the chip packaging device comprising a loading chamber, a vacuum chamber, a vacuum pump and a controller; the loading chamber and the vacuum chamber are connected through a gate; the loading chamber and the vacuum pump are connected through a pipeline;

[0006] The loading chamber includes a first accommodating portion and a second accommodating portion; the first accommodating portion is used to accommodate a heat dissipation cover; the second accommodating portion is used to accommodate a first intermediate piece; wherein the first intermediate piece includes a substrate, a chip fixed on the substrate, and an interface heat dissipation material preform placed on the chip, and a sealant for fixing the heat dissipation cover is provided on the substrate;

[0007] The vacuum chamber includes a robot with a mechanical arm and a hot pressing device;

[0008] The controller is used to control the vacuum pump to evacuate the loading chamber when the heat dissipation cover to be packaged is loaded into the first accommodating portion of the loading chamber and the first intermediate piece is loaded into the second accommodating portion of the loading chamber, and to control the gate to open when the loading chamber is in a vacuum environment;

[0009] The controller is further used to control the robot to transfer the intermediate piece from the second accommodating portion to the hot pressing device, and place the heat dissipation cover on the intermediate piece to form a piece to be processed;

[0010] The controller is further used to control the hot pressing device to apply temperature and pressure to the workpiece to be processed, so that the sealant is cured and the heat dissipation cover is fixed on the substrate to form a second intermediate piece; wherein, when the temperature and pressure are applied to the workpiece to be processed in a vacuum environment, under the action of negative pressure, the lower surface of the heat dissipation cover is tightly fitted with the upper surface of the interface heat dissipation material preform to form a surface contact

[0011] A second aspect of the present application provides a chip packaging method, which is implemented based on any of the chip packaging devices provided above, and includes:

[0012] Installing the heat dissipation cover to be packaged into the first accommodation portion of the loading chamber, and installing the first intermediate piece to be packaged into the second accommodation portion of the loading chamber;

[0013] Controlling the vacuum pump to evacuate the loading chamber, and when the loading chamber is in a vacuum environment, opening the gate between the loading chamber and the vacuum chamber;

[0014] Control the robot to transfer the first intermediate piece from the second accommodating part to the hot pressing device in the vacuum chamber, and place the heat dissipation cover on the intermediate piece to form a piece to be processed;

[0015] The hot pressing device is controlled to apply temperature and pressure to the workpiece to be processed so that the sealant is cured and the heat dissipation cover is fixed on the substrate to form a second intermediate piece; wherein, when temperature and pressure are applied to the workpiece to be processed in a vacuum environment, under the action of negative pressure, the lower surface of the heat dissipation cover is tightly fitted with the upper surface of the interface heat dissipation material preform to form surface contact.

[0016] The chip packaging equipment and chip packaging method provided by the present application connect a vacuum pump to a loading chamber. After each time the heat dissipation cover and the first intermediate piece are loaded into the loading chamber, the air inside the loading chamber is extracted by the vacuum pump to form a vacuum space inside the loading chamber. At this time, the gate between the loading chamber and the vacuum chamber is opened, and the heat dissipation cover and the first intermediate piece are transferred to a hot pressing device by a robot with a mechanical arm to form a workpiece to be processed. At this time, due to the vacuum working environment, there is a negative pressure area between the heat dissipation cover and the interface heat dissipation material preform. In this way, during hot pressing, the interface heat dissipation material preform can fill the uneven area on the heat dissipation cover and form a surface contact with the heat dissipation cover, thereby avoiding the formation of bubbles between the interface heat dissipation material preform and the heat dissipation cover, thereby improving the thermal conductivity and mechanical stability of the chip packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of a first embodiment of a chip packaging device provided in the present application;

[0018] Figure 2A schematic diagram of a first middleware shown as an exemplary embodiment of the present application;

[0019] Figure 3 Schematic diagram of chip packaging for traditional chip packaging equipment;

[0020] Figure 4 A schematic diagram of the chip packaging implementation of the chip packaging device provided in this application;

[0021] Figure 5 A schematic diagram of a chip packaging structure shown in another exemplary embodiment of the present application;

[0022] Figure 6 A top view of a middleware to be packaged according to an exemplary embodiment of the present application;

[0023] Figure 7 This is a flow chart of Example 1 of the chip packaging method provided in this application.

[0024] Description of reference numerals:

[0025] 1: Loading room;

[0026] 11: first accommodating portion;

[0027] 12: second accommodating portion;

[0028] 2: Vacuum chamber;

[0029] 21: Robot;

[0030] 22: Hot pressing equipment;

[0031] 3: Vacuum pump;

[0032] 4: Pipeline;

[0033] 5: Gate;

[0034] 6: Heat dissipation cover;

[0035] 7: The first middleware;

[0036] 71: Substrate;

[0037] 72: Chip;

[0038] 73: Interface heat dissipation material preform;

[0039] 74: Sealant;

[0040] 8: Pending items. DETAILED DESCRIPTION

[0041] Here, exemplary embodiments are described in detail, and examples thereof are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application.

[0042] The terms used in this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used in this article refers to and includes any or all possible combinations of one or more associated listed items.

[0043] It should be understood that although the terms first, second, third, etc. may be used in the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0044] In the field of chip packaging, efficient heat transfer inside the chip packaging structure is crucial for the reliable operation of the chip. In order to improve the heat transfer inside the chip packaging structure, an interface heat dissipation material preform is often set between the chip and the heat dissipation cover to promote heat dissipation. However, when the heat dissipation cover is welded to the chip through the interface heat dissipation material preform to form a chip packaging structure, air may be trapped between the interface heat dissipation material preform and the heat dissipation cover, forming large bubbles between the interface heat dissipation material preform and the heat dissipation cover, resulting in thermal resistance, hot spots and unstable mechanical structure of the chip packaging structure.

[0045] In particular, when the chip is packaged using conventional chip packaging equipment, the chip is fixed on the substrate, the interface heat dissipation material preform is placed on the chip, and then the heat dissipation cover is placed above the interface heat dissipation material preform and contacts the sealant on the substrate, initially fits together, and is assembled into a workpiece to be processed. After that, the workpiece to be processed is subjected to temperature and pressure by a hot pressing device to promote the curing of the sealant, fix the substrate and the heat dissipation cover, and at the same time, the interface heat dissipation material preform is further closely fitted with the heat dissipation cover to form a surface contact; it should be noted that, since the surface of the heat dissipation cover facing the interface heat dissipation material preform is uneven, after the substrate and the heat dissipation cover are fixed by the hot pressing device, small air pockets will be generated between the heat dissipation cover and the interface heat dissipation material preform. In addition, during the process of curing the sealant, the interface heat dissipation material preform has not yet melted, and a reflow soldering operation is required to make the unmelted interface heat dissipation material preform melt during the reflow soldering process, and the heat dissipation cover and the chip are adhered together by the melted interface heat dissipation material preform. However, during the reflow process, small air pockets will further grow and form larger bubbles, which will then form larger bubbles in the final chip packaging structure, seriously affecting the heat transfer and structural stability of the chip packaging structure. Therefore, how to avoid the formation of bubbles between the interface heat dissipation material preform and the heat dissipation cover has become an urgent problem to be solved in the chip packaging process.

[0046] The present application provides a chip packaging device and a chip packaging method, which are used to solve the problem of bubbles generated when welding a heat dissipation cover and a chip using an interface heat dissipation material preform, so as to improve the heat transferability and structural stability of the chip packaging structure.

[0047] Specific embodiments are given below to introduce the technical solution of the present application in detail.

[0048] Figure 1 This is a schematic diagram of a first embodiment of the chip packaging device provided in the present application. Figure 1 Figures (A), (B) and (C) are schematic diagrams of the chip packaging equipment at different nodes in the chip packaging process. Figure 1 Figure (A) is a schematic diagram of the loading chamber in the initial state; Figure 1 Figure (B) is a schematic diagram of the robot in the vacuum chamber when it is in working state. Figure 1 Figure (C) is a schematic diagram of the hot pressing equipment in the vacuum chamber when it is in operation. Figure 1 The chip packaging device provided in this embodiment includes a loading chamber 1, a vacuum chamber 2, a vacuum pump 3 and a controller (not shown in the figure); the loading chamber 1 and the vacuum chamber 2 are connected through a gate 5; the loading chamber 1 and the vacuum pump 3 are connected through a pipeline 4;

[0049] The loading chamber 1 includes a first accommodating portion 11 and a second accommodating portion 12; the first accommodating portion 11 is used to accommodate the heat dissipation cover 6; the second accommodating portion 12 is used to accommodate the first intermediate component 7; wherein the first intermediate component 7 includes a substrate 71, a chip 72 fixed on the substrate, and an interface heat dissipation material preform 73 placed on the chip, and a sealant 74 for fixing the heat dissipation cover 6 is provided on the substrate 71;

[0050] The vacuum chamber 2 includes a robot 21 with a mechanical arm and a hot pressing device 22;

[0051] The controller is used to control the vacuum pump 3 to evacuate the loading chamber 1 when the heat dissipation cover 6 to be packaged is loaded into the first accommodating portion 11 of the loading chamber 1 and the first intermediate piece 7 is loaded into the second accommodating portion 12 of the loading chamber, and control the gate 5 to open when the loading chamber 1 is in a vacuum environment;

[0052] The controller is further used to control the robot to transfer the first intermediate piece 7 from the second accommodating portion 12 to the hot pressing device 22, and place the heat dissipation cover 6 on the first intermediate piece 7 to form a to-be-processed piece 8;

[0053] The controller is also used to control the hot pressing equipment 22 to apply temperature and pressure to the workpiece 8 to be processed, so that the sealant 74 is cured and the heat dissipation cover 6 is fixed on the substrate 71 to form a second intermediate piece; wherein, when temperature and pressure are applied to the workpiece 8 in a vacuum environment, under the action of negative pressure, the lower surface of the heat dissipation cover 6 is tightly fitted with the upper surface of the interface heat dissipation material preform 73 to form surface contact.

[0054] Specifically, a gate 5 is provided on the left side of the loading chamber 1. When the chip packaging equipment is required to perform chip packaging operations, the gate 5 is opened, the heat dissipation cover 6 and the first intermediate component 7 are placed in the loading chamber 1, and then the gate 5 is closed to perform the next operation.

[0055] Please continue to refer to Figure 1 The loading chamber 1 includes a first accommodating portion 11 and a second accommodating portion 12, wherein the first accommodating portion 11 is used to accommodate the heat dissipation cover 6, and the second accommodating portion 12 is used to accommodate the first middle piece 7. That is, when the heat dissipation cover 6 and the first middle piece 7 are placed in the loading chamber 1, the heat dissipation cover 6 is placed in the first accommodating portion 11, and the first middle piece 7 is placed in the second accommodating portion 12.

[0056] Figure 2 This is a schematic diagram of the first middleware shown in an exemplary embodiment of the present application, please refer to Figure 2The first intermediate component 7 includes a substrate 71, a chip 72 fixed on the substrate, and an interface heat dissipation material preform 73 placed on the chip, and a sealant 74 for fixing the heat dissipation cover is provided on the substrate.

[0057] It should be noted that, in the first middle piece 7, the substrate 71, as the basic part, is often made of a material with good thermal conductivity, which can not only be used to support other structures of the first middle piece 7, but also help transfer the heat generated by the chip and help the chip dissipate heat.

[0058] Furthermore, a gate 5 is provided between the loading chamber 1 and the vacuum chamber 2. A robot 21 with a mechanical arm and a hot pressing device 22 are provided in the vacuum chamber 2.

[0059] Specifically, the vacuum chamber 2 is a space with a completely vacuum inside, and is used to place the workpiece 8 to be processed in the vacuum space and apply temperature and pressure to it using the hot pressing equipment 22. It should be noted that the interior of the loading chamber 1 is not a vacuum area. When the first middle piece 7 and the heat dissipation cover 6 are transferred from the loading chamber 1 to the vacuum chamber 2, the vacuum area inside the vacuum chamber 2 will be destroyed. Therefore, in this embodiment, a vacuum pump 3 is provided, and the loading chamber 1 is connected to the vacuum pump 3 through a pipe 4. After the heat dissipation cover 6 and the first middle piece 7 are initially loaded from the outside into the first receiving portion 11 and the second receiving portion 12 of the loading chamber 1, respectively, the vacuum pump 3 can be used to evacuate the loading chamber 1 so that the loading chamber 1 is in a vacuum environment. In this way, after the loading chamber 1 is in a vacuum environment, Figure 1 As shown in Figure (B), open the gate 5 between the loading chamber 1 and the vacuum chamber 2. At this time, no air will enter the vacuum chamber 2 and the vacuum environment inside the vacuum chamber 2 will not be destroyed. At this time, the robot 21 with a mechanical arm can be used to take out the first intermediate piece 7 from the second accommodating portion 12 and place it on the hot pressing device 22. Further, take out the heat dissipation cover 6 from the first accommodating portion 11 and place it on the first intermediate piece 7. The first intermediate piece 7 and the heat dissipation cover 6 can be preliminarily fixed by the sealant 74 on the substrate 71 in the first intermediate piece 7 to form a workpiece 8. After that, close the gate between the loading chamber 1 and the vacuum chamber 2. For further information, see Figure 1 As shown in Figure (C), subsequently, the heat pressing device 22 can be used to apply temperature and pressure to the workpiece 8 to solidify the sealant 74 and fix the heat dissipation cover 6 on the substrate 71 to form a second intermediate piece; wherein, when temperature and pressure are applied to the workpiece 8 in a vacuum environment, under the action of negative pressure, the lower surface of the heat dissipation cover 6 is tightly fitted with the upper surface of the interface heat dissipation material preform 73 to form a surface contact.

[0060] The effects of the chip packaging equipment provided by this application are introduced below:

[0061] Figure 3 The implementation principle diagram of chip packaging for traditional chip packaging equipment, Figure 4 This is a schematic diagram of the chip packaging implementation principle of the chip packaging device provided in this application.

[0062] Please refer to Figure 3 ,In traditional chip packaging equipment, such as Figure 3 As shown in FIG. (A), first, the heat dissipation cover 6 is placed on the interface heat dissipation material preform 73 of the first intermediate member 7 to obtain a workpiece to be processed. At this time, the side of the heat dissipation cover 6 facing the chip 72 is uneven and has a plurality of small air holes; further, as Figure 3 As shown in FIG. (B), the workpiece to be processed is placed in the hot pressing device 22; further, as Figure 3 As shown in FIG. (C), the heat press device 22 is used to apply temperature and pressure to the workpiece to cure the sealant 74, thereby obtaining a Figure 3 The second intermediate member shown in FIG. (D) at this time, the heat dissipation material preform 73 has not yet melted, and there is a small air pocket between the heat dissipation cover 6 and the interface heat dissipation material preform 73; the second intermediate member is further subjected to a reflow soldering process to obtain Figure 3 As shown in the chip packaging structure in Figure (E), during the reflow process, small air pockets expand due to heat to form larger bubbles.

[0063] For further information, please refer to Figure 4 , the chip packaging device provided in this embodiment, such as Figure 4 As shown in FIG. 1A , before placing the heat dissipation cover 6 on the first intermediate member 7 , a negative pressure region can be formed at the uneven region of the heat dissipation cover 6 by vacuum treatment, that is, small air pockets are converted into negative pressure regions. Figure 4 As shown in FIG. (B) and FIG. (C), after the heat dissipation cover 6 is placed on the first intermediate piece 7 to form a to-be-processed piece, and the to-be-processed piece is processed by the hot pressing device 22, the interface heat dissipation material preform 73 fills the negative pressure area and forms a surface contact with the heat dissipation cover 6. Further, see Figure 4 In the (D) figure, at this time, in the prepared second middle piece, the interface heat dissipation material preform 73 and the heat dissipation cover 6 form a surface foundation, and there is no small air pocket between the interface heat dissipation material preform 73 and the heat dissipation cover 6. Further, the second middle piece is subjected to a reflow soldering process to obtain the following Figure 4 In the chip packaging structure shown in Figure (E), the chip 72 is adhered to the heat dissipation cover 6 through the interface heat dissipation material preform 73, and the interface heat dissipation material preform 73 forms a surface contact with the heat dissipation cover 6. At this time, the thermal conductivity and structural stability of the chip packaging structure are good.

[0064] It should be noted that the chip packaging equipment provided in this embodiment assembles the heat dissipation cover and the interface heat dissipation preform under a vacuum environment, which can solve the air entrapment problem, ensure the absence of air during the bonding process, and eliminate gaps to improve heat transfer efficiency and reliability.

[0065] The chip packaging equipment provided in this embodiment connects the vacuum pump to the loading chamber. After each time the heat dissipation cover and the first middle piece are loaded into the loading chamber, the air inside the loading chamber is extracted by the vacuum pump to form a vacuum space inside the loading chamber. At this time, the gate between the loading chamber and the vacuum chamber is opened, and the heat dissipation cover and the first middle piece are transferred to the hot pressing equipment by a robot with a mechanical arm to form a workpiece to be processed. At this time, due to the vacuum working environment, there is a negative pressure area between the heat dissipation cover and the interface heat dissipation material preform. In this way, during hot pressing, the interface heat dissipation preform can fill the uneven area on the heat dissipation cover and form a surface contact with the heat dissipation cover, thereby avoiding the formation of bubbles between the interface heat dissipation material preform and the heat dissipation cover, thereby improving the thermal conductivity and mechanical stability of the chip packaging structure.

[0066] Figure 5 FIG. 1 is a schematic diagram of a chip packaging structure according to another exemplary embodiment of the present application. Figure 5 Figure (A) is a schematic diagram of the chip packaging structure in an initial state; Figure 5 Figure (B) is a schematic diagram of the robot arm in the loading chamber 1 when it is in working state; Figure 5 Figure (C) is a schematic diagram of the hot pressing device 22 in the vacuum chamber 2 when it is in working state. Figure 5 In the chip packaging structure provided in this embodiment, the loading chamber 1 is provided with a mechanical arm; the controller is further used to place the heat dissipation cover 6 on the interface heat dissipation material preform 73 of the middle piece to be packaged to form an initial package when the heat dissipation cover 6 to be packaged is loaded into the first accommodating portion 11 of the loading chamber 1 and the middle piece to be packaged is loaded into the second accommodating portion 12 of the loading chamber, wherein the sealant 74 for fixing the heat dissipation cover 6 on the middle piece to be packaged has a notch;

[0067] The controller is further used to control the vacuum pump 3 to evacuate the loading chamber 1 so that the air between the heat dissipation cover 6 and the substrate 71 in the initial package overflows from the gap;

[0068] The controller is further used to control the gate 5 to open when the loading chamber 1 is in a vacuum environment, and to control the robot 21 to transfer the initial package to the hot pressing device 22;

[0069] The controller is further used to control the hot pressing device 22 to apply temperature and pressure to the initial package so as to solidify the sealant 74 and fix the heat dissipation cover 6 on the substrate 71 .

[0070] Specifically, in the chip packaging equipment provided in this embodiment, when packaging a chip, first, after the heat dissipation cover to be packaged is loaded into the first accommodation part of the loading chamber and the intermediate piece to be packaged is loaded into the second accommodation part of the loading chamber, the heat dissipation cover to be packaged is placed on the interface heat dissipation material preform of the intermediate piece to be packaged by the robot arm of the loading chamber to form an initial package. At this time, in the initial package, there is air between the interface heat dissipation material preform and the heat dissipation cover.

[0071] Figure 6 FIG. 1 is a top view of a middleware to be packaged according to an exemplary embodiment of the present application. Figure 6 , the sealant for fixing the heat dissipation cover on the middle piece to be packaged has a gap.

[0072] Furthermore, after the initial package is formed, the loading chamber 1 is evacuated, that is, the air in the loading chamber 1 is extracted using the vacuum pump 3 to form a vacuum area. In this way, after evacuation, in the initial package, the air between the heat dissipation cover 6 and the interface heat dissipation material preform 73 can overflow from the gap at the sealant 74, and a negative pressure area is formed between the heat dissipation cover 6 and the interface heat dissipation material preform 73.

[0073] For further information, see Figure 5 In (B), when the loading chamber 1 is in a vacuum environment, the valve between the loading chamber 1 and the vacuum chamber 2 is opened, and the initial package is transferred to the middle of the hot pressing device 22 by the robot 21; further, see Figure 5 In FIG. (C), the heat press device 22 is used to apply temperature and pressure to the initial package, so that the sealant 74 is cured, and the heat dissipation cover 6 is fixed on the substrate 71 to form a second intermediate member. It can be understood that during the treatment of the heat press device 22, the interface heat dissipation material preform 73 fills the negative pressure area and forms a surface contact with the heat dissipation cover 6.

[0074] Referring to the above description, it should be noted that a chip packaging device of any of the above structures can be selected according to actual needs, and is not limited in the present application.

[0075] It should be noted that, in the chip packaging equipment provided by the present application, when the heat dissipation cover to be packaged is loaded into the first receiving portion of the loading chamber and the intermediate piece to be packaged is loaded into the second receiving portion of the loading chamber, the heat dissipation cover is placed on the interface heat dissipation material preform of the intermediate piece to be packaged to form an initial package, and the vacuum pump is further controlled to evacuate the loading chamber, so that the air between the heat dissipation cover and the substrate in the initial package can overflow from the notch, and a negative pressure area is formed between the heat dissipation cover and the substrate. In this way, when the initial package is applied with temperature and pressure by using a hot pressing device to solidify the sealant and fix the heat dissipation cover on the substrate, the interface heat dissipation material preform can be filled into the negative pressure area to form a surface contact with the heat dissipation cover. In this way, bubbles will not be formed in the chip packaging structure, and the thermal conductivity and stability of the chip packaging structure can be improved.

[0076] Optionally, in a possible implementation, the vacuum chamber is further provided with an optical detection device;

[0077] Wherein, the optical detection device is used to detect whether the placement position of the heat dissipation cover is accurate after the heat dissipation cover is placed on the middle piece.

[0078] Specifically, the optical monitoring device is disposed in the vacuum chamber, and is used to detect whether the heat dissipation cover is placed at a correct position on the middle piece after the heat dissipation cover is placed on the middle piece.

[0079] The chip packaging equipment provided in this embodiment can ensure that the heat dissipation cover is placed in the correct position by arranging optical detection equipment in the vacuum chamber. In this way, when temperature and pressure are applied by hot pressing equipment in the subsequent process, the packaging quality of the obtained second intermediate piece can be ensured, and packaging defects caused by incorrect positioning of the heat dissipation cover can be reduced.

[0080] Furthermore, in a possible implementation, the vacuum chamber is further provided with a reflow soldering station;

[0081] Wherein, the controller is further used to control the robot to transfer the second middleware to the reflow soldering station;

[0082] The reflow soldering station is used to perform reflow soldering on the second middle piece, so that the chip and the heat dissipation cover of the second middle piece are fixed together through the interface heat dissipation material preform to form a chip packaging structure.

[0083] It should be noted that after the second intermediate piece is obtained by applying temperature and pressure to the initial package or the piece to be processed using the hot pressing equipment, the interface heat dissipation material preform in the second intermediate piece has not yet melted, and a tight connection has not been achieved between the interface heat dissipation material preform and the heat dissipation cover. Therefore, a reflow soldering station is installed in the vacuum chamber, and the second intermediate piece is transferred to the reflow soldering station. The reflow soldering station is used to perform a reflow soldering operation on the second intermediate piece, and the second intermediate piece is heated to melt the interface heat dissipation material preform. After a certain period of time, the melted interface heat dissipation material preform is tightly fitted with the heat dissipation cover, and then the second intermediate piece is cooled. At this time, the interface heat dissipation material preform is cooled and solidified, and the heat dissipation cover, the interface heat dissipation material preform and the chip are fixed together to form a chip packaging structure.

[0084] The chip packaging equipment provided in this embodiment sets a reflow soldering station in a vacuum chamber to perform a reflow soldering operation on the formed second intermediate piece, melts the interface heat dissipation material preform and solidifies it, so that the heat dissipation cover and the interface heat dissipation material preform form a tight fixed fit, thereby improving the stability of the chip packaging structure, simplifying the chip packaging process, and improving the efficiency of chip packaging.

[0085] Furthermore, in a possible implementation, the loading chamber is also provided with a dispensing device; wherein the dispensing device is used to dispense sealant for fixing the heat dissipation cover onto the substrate in the substrate assembly placed in the second receiving portion; wherein the substrate assembly includes a substrate and a chip fixed on the substrate.

[0086] It should be noted that, in one possible implementation, the sealant on the substrate in the first middle piece or the middle piece to be packaged can be applied to the substrate before being loaded into the second accommodating portion; in another possible implementation, the substrate assembly can be placed in the second accommodating portion, and then the sealant for fixing the heat dissipation cover can be dispensed onto the substrate of the substrate assembly using a dispensing device.

[0087] The chip packaging device provided in this embodiment has a glue dispensing device in the loading chamber, and after the substrate assembly is placed in the second accommodation portion in the loading chamber, the sealant can be dispensed onto the substrate of the substrate assembly to fix the heat dissipation cover, so that the position of the sealant can be prevented from shifting during transportation, thereby affecting the fixing effect with the heat dissipation cover. In addition, the integration level of the chip packaging device can be improved.

[0088] Corresponding to the aforementioned chip packaging device, the present application also provides a chip packaging method. The chip packaging method provided by the present application is introduced below:

[0089] Figure 7 This is a flowchart of the first embodiment of the chip packaging method provided by this application. Please refer to Figure 7The chip packaging method provided in this embodiment is implemented based on any one of the chip packaging devices provided in the first aspect of the present application, and the chip packaging method includes:

[0090] S701, loading the heat dissipation cover to be packaged into the first accommodating portion of the loading chamber, and loading the first intermediate component to be packaged into the second accommodating portion of the loading chamber.

[0091] S702, controlling the vacuum pump to evacuate the loading chamber, and when the loading chamber is in a vacuum environment, opening the gate between the loading chamber and the vacuum chamber.

[0092] S703, controlling the robot to transfer the first intermediate piece from the second accommodating part to the hot pressing device in the vacuum chamber, and placing the heat dissipation cover on the intermediate piece to form a piece to be processed.

[0093] S704, controlling the hot pressing equipment to apply temperature and pressure to the workpiece to be processed so that the sealant is cured and the heat dissipation cover is fixed on the substrate to form a second intermediate piece; wherein, when temperature and pressure are applied to the workpiece to be processed in a vacuum environment, under the action of negative pressure, the lower surface of the heat dissipation cover is tightly fitted with the upper surface of the interface heat dissipation material preform to form surface contact.

[0094] Optionally, the temperature range of the treated part is 30°C-150°C, and the pressure range of the treated part is 0.1MPa to 1MPa. It should be noted that the temperature and pressure applied by the hot pressing equipment to the treated part can be selected according to actual needs, and are not limited in this application.

[0095] Furthermore, in a possible implementation, the method further includes:

[0096] The second middle piece is subjected to a reflow soldering operation, so that the chip and the heat dissipation cover of the second middle piece are fixed together through the interface heat dissipation material preform, so as to form a chip packaging structure.

[0097] Specifically, during reflow soldering, the interface heat dissipation material preform is melted, so that the melted interface heat dissipation material preform fills the negative pressure area between the interface heat dissipation material preform and the heat dissipation cover, and surface contact is formed between the two.

[0098] Optionally, the temperature of the reflow soldering is 160° C. to 300° C. It should be noted that the specific temperature of the reflow soldering can be selected according to actual needs, and is not limited in the present application.

[0099] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A chip packaging device, characterized in that: The chip packaging equipment comprises a loading chamber, a vacuum chamber, a vacuum pump and a controller; the loading chamber and the vacuum chamber are connected through a gate; the loading chamber and the vacuum pump are connected through a pipeline; The loading chamber includes a first accommodating portion and a second accommodating portion; the first accommodating portion is used to accommodate a heat dissipation cover; the second accommodating portion is used to accommodate a first intermediate piece; wherein the first intermediate piece includes a substrate, a chip fixed on the substrate, and an interface heat dissipation material preform placed on the chip, and a sealant for fixing the heat dissipation cover is provided on the substrate; The vacuum chamber includes a robot with a mechanical arm and a hot pressing device; The controller is used to control the vacuum pump to evacuate the loading chamber when the heat dissipation cover to be packaged is loaded into the first accommodating portion of the loading chamber and the first intermediate piece is loaded into the second accommodating portion of the loading chamber, and to control the gate to open when the loading chamber is in a vacuum environment; The controller is further used to control the robot to transfer the first middle piece from the second accommodating portion to the hot pressing device, and place the heat dissipation cover on the first middle piece to form a piece to be processed; The controller is also used to control the hot pressing equipment to apply temperature and pressure to the workpiece to be processed so that the sealant is cured and the heat dissipation cover is fixed on the substrate to form a second intermediate piece; wherein, when temperature and pressure are applied to the workpiece to be processed in a vacuum environment, under the action of negative pressure, the lower surface of the heat dissipation cover is tightly fitted with the upper surface of the interface heat dissipation material preform to form surface contact.

2. The chip packaging device according to claim 1, characterized in that: The loading chamber is provided with a mechanical arm; the controller is further used to place the heat dissipation cover on the interface heat dissipation material preform of the middle piece to be packaged to form an initial package when the heat dissipation cover to be packaged is loaded into the first accommodation part of the loading chamber and the middle piece to be packaged is loaded into the second accommodation part of the loading chamber; wherein the sealant for fixing the heat dissipation cover on the middle piece to be packaged has a notch; The controller is further used to control the vacuum pump to evacuate the loading chamber so that the air between the heat dissipation cover and the substrate in the initial package overflows from the gap; The controller is further used to control the gate to open when the loading chamber is in a vacuum environment, and to control the robot arm to transfer the initial package to the hot pressing device; The controller is further used to control the heat pressing device to apply temperature and pressure to the initial package so as to solidify the sealant and fix the heat dissipation cover on the substrate.

3. The chip packaging device according to claim 1, characterized in that: The vacuum chamber is also provided with an optical detection device; Wherein, the optical detection device is used to detect whether the placement position of the heat dissipation cover is accurate after the heat dissipation cover is placed on the middle piece.

4. The chip packaging device according to claim 1 or 3, characterized in that: The vacuum chamber is also provided with a reflow soldering station; Wherein, the controller is further used to control the robot to transfer the second middleware to the reflow soldering station; The reflow soldering station is used to perform reflow soldering on the second middle piece, so that the chip and the heat dissipation cover of the second middle piece are fixed together through the interface heat dissipation material preform to form a chip packaging structure.

5. The chip packaging device according to claim 1, characterized in that: The loading chamber is also provided with a dispensing device; The glue dispensing device is used to dispense sealant for fixing the heat dissipation cover onto the substrate in the substrate assembly placed in the second accommodation portion; wherein the substrate assembly includes a substrate and a chip fixed on the substrate.

6. The chip packaging device according to claim 1, characterized in that: The interface heat dissipation material preform on the intermediate piece is a flux-free interface heat dissipation material preform.

7. A chip packaging method, characterized in that: The chip packaging method is implemented based on the chip packaging device according to any one of claims 1 to 6, and the chip packaging method includes: Installing the heat dissipation cover to be packaged into the first accommodation portion of the loading chamber, and installing the first intermediate piece to be packaged into the second accommodation portion of the loading chamber; Controlling the vacuum pump to evacuate the loading chamber, and when the loading chamber is in a vacuum environment, opening the gate between the loading chamber and the vacuum chamber; Control the robot to transfer the first intermediate piece from the second accommodating part to the hot pressing device in the vacuum chamber, and place the heat dissipation cover on the intermediate piece to form a piece to be processed; The hot pressing device is controlled to apply temperature and pressure to the workpiece to be processed so that the sealant is cured and the heat dissipation cover is fixed on the substrate to form a second intermediate piece; wherein, when temperature and pressure are applied to the workpiece to be processed in a vacuum environment, under the action of negative pressure, the lower surface of the heat dissipation cover is tightly fitted with the upper surface of the interface heat dissipation material preform to form surface contact.

8. The method according to claim 7, characterized in that The temperature range applied to the workpiece to be processed is 30° C.-150° C., and the pressure range applied to the workpiece to be processed is 0.1 MPa to 1 MPa.

9. The method according to claim 7 or 8, characterized in that: The method further comprises: The second middle piece is subjected to reflow soldering, so that the chip and the heat dissipation cover of the second middle piece are fixed together through the interface heat dissipation material preform, so as to form a chip packaging structure.

10. The method according to claim 9, characterized in that The temperature of the reflow soldering is 160°C to 300°C.

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