Laser debonding equipment

Abstract

The invention provides laser de-bonding equipment which comprises a feeding mechanism, a first taking and placing mechanism, a positioning mechanism, a second taking and placing mechanism, a transferring mechanism, a laser processing mechanism, a third taking and placing mechanism, a demolding mechanism and a discharging mechanism, and the feeding mechanism is used for placing a to-be-processed product; the blanking mechanism is used for placing the processed wafer; the first taking and placing mechanism is used for being arranged between the feeding mechanism and the positioning mechanism. The positioning mechanism is used for carrying out edge searching and positioning on the product and the wafer; the second taking and placing mechanism is used for carrying out taking and placing actions between the positioning mechanism and the transferring mechanism; the transferring mechanism comprises a moving assembly and a platform. The third taking and placing mechanism is used for taking down the substrate; the demolding mechanism is used for taking down the adhesive film; the transferring mechanism drives the products to move among the taking and placing station of the second taking and placing mechanism, the demolding station and the taking and placing station of the third taking and placing mechanism. By means of the arrangement, the full-automatic process from feeding to discharging is achieved, manual intervention is reduced, the production efficiency is improved, and the cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of laser processing, and in particular to a laser debonding device. Background Art

[0002] As chip stacking technologies represented by 2.5D and 3D packaging continue to promote the development of wafer thinning processes, coping with some of the challenges brought about by wafer thinning (such as wafer debonding) has become the key to the success of multi-layer wafer stacking technology. Wafer debonding involves separating the wafer from its carrier substrate. Traditional debonding methods include chemical, mechanical or thermal treatment processes, which may have problems such as low efficiency, high cost, environmental pollution or damage to the wafer.

[0003] With the development of technology, laser debonding technology has gradually gained attention due to its precision, controllability and environmental friendliness. Laser debonding is a process that utilizes the high energy and high precision characteristics of lasers to selectively irradiate the material interface and instantly release the binding force at the interface, thereby achieving material separation. This technology is mainly used in fields such as semiconductor manufacturing. The specific process is as follows: First, a layer of laser debonding adhesive (Laser Release Layer) is coated or bonded on a temporary substrate, and the subsequent process is carried out on this substrate. After the packaging process is completed, the temporary substrate is separated from the wafer by quickly irradiating the adhesive with laser energy to partially dissociate the adhesive. In this process, the laser will pass through the transparent glass sheet and reach the surface of the adhesive, and evenly apply the laser energy to the adhesive in a scanning manner to quickly separate the adhesive and the glass.

[0004] However, existing laser debonding equipment usually has the following problems: the equipment has a complex structure and cumbersome operation, resulting in low production efficiency; the lack of a precise positioning mechanism increases the risk of wafer damage during the debonding process; automation cannot be achieved and manual participation is required, increasing costs and the possibility of operational errors; the processing of wafers and substrates after debonding is not efficient enough, affecting the subsequent processes.

[0005] Therefore, it is necessary to design a laser debonding device to solve the above problems. Summary of the invention

[0006] The object of the present invention is to provide a laser debonding device which improves the efficiency and safety of the debonding process.

[0007] To achieve the above object, the present invention adopts the following technical solution: a laser debonding device, which includes a loading mechanism, a first pick-and-place mechanism, a positioning mechanism, a second pick-and-place mechanism, a transfer mechanism, a laser processing mechanism, a third pick-and-place mechanism, a demolding mechanism and a unloading mechanism, wherein:

[0008] The loading mechanism is used to place the product to be processed, and the product includes a substrate, a film and a wafer stacked in sequence; the unloading mechanism is used to place the processed wafer;

[0009] The first pick-and-place mechanism is used to perform pick-and-place actions between the loading mechanism and the positioning mechanism, and between the positioning mechanism and the unloading mechanism;

[0010] The positioning mechanism is used to perform edge-finding and positioning of products and wafers;

[0011] The second pick-and-place mechanism is used to perform a pick-and-place action between the positioning mechanism and the transfer mechanism;

[0012] The transfer mechanism includes a moving component and a platform disposed on the moving component, and the product is fixed on the platform with the substrate facing upward;

[0013] The laser processing mechanism is used to perform laser debonding on the product on the platform;

[0014] The third pick-and-place mechanism is used to remove the substrate of the product after laser processing;

[0015] The film stripping mechanism is used to remove the film of the product on the platform;

[0016] The transfer mechanism drives the product to move between the pick-up and place station of the second pick-up and place mechanism, the demolding station of the demolding mechanism and the pick-up and place station of the third pick-up and place mechanism.

[0017] As a further improved technical solution of the present invention, the film stripping mechanism includes a film stripping bracket, a first power roller group arranged on the film stripping bracket, a lamination roller assembly, a second power roller group, and a debonding film continuously arranged on the first power roller group, the lamination roller assembly, and the second power roller group, and the lamination roller assembly drives the debonding film to pass through the platform and stick the film off.

[0018] As a further improved technical solution of the present invention, the lamination roller assembly includes a lamination bracket, a mounting plate arranged on the lamination bracket through a rotating shaft, a lamination roller arranged at one end of the mounting plate and a telescopic member arranged at the other end of the mounting plate, the telescopic member and the lamination roller are respectively located on both sides of the rotating shaft, and the telescopic member drives the mounting plate to rotate about the rotating shaft as the axis to drive the lamination roller to move up and down.

[0019] As a further improved technical solution of the present invention, the telescopic part includes a cylinder and a bearing arranged at the end of the output shaft of the cylinder, a vertical plate and a horizontal rod arranged on the vertical plate are provided on the mounting plate, the bearing sleeve is arranged on the horizontal rod, and when the output shaft of the cylinder is extended and retracted, the bearing rotates with the horizontal rod as the axis.

[0020] As a further improved technical solution of the present invention, the lamination roller assembly further includes a linear module, the lamination bracket is arranged on the linear module, and the linear module drives the lamination roller to move horizontally.

[0021] As a further improved technical solution of the present invention, the first power roller includes a first motor, a first active roller driven to rotate by the first motor, and a first driven roller arranged in parallel with the first active roller; the second power roller includes a second motor, a second active roller driven to rotate by the second motor, and a second driven roller arranged in parallel with the second active roller; the first active roller is a discharge roller of the degummed film, and the second active roller is a receiving roller of the degummed film; a steering roller is also provided on the mounting plate, and the steering roller is provided between the first driven roller and the pressing roller, and is parallel to the first driven roller and the pressing roller.

[0022] As a further improved technical solution of the present invention, the first pick-and-place mechanism includes a horizontal linear module and a dual-arm multi-axis manipulator arranged on the horizontal linear module.

[0023] As a further improved technical solution of the present invention, the second pick-and-place mechanism includes a horizontal linear module, a lifting module arranged on the horizontal linear module, and a horizontal suction cup group driven to rise and fall by the lifting module.

[0024] As a further improved technical solution of the present invention, the third picking and placing mechanism includes a horizontal rotating module, a lifting module, a horizontal cantilever and a horizontal suction cup group arranged in sequence, and the laser debonding equipment also includes a substrate recovery mechanism, which includes a recovery bin opening upward and a lifting module arranged at the bottom of the recovery bin.

[0025] As a further improved technical solution of the present invention, the moving component is a horizontal linear module, the platform is a heatable platform, and a suction cup component is also provided on the periphery of the platform to absorb the product on the platform.

[0026] It can be seen from the above technical solutions that the laser debonding device of the present invention has the following technical effects:

[0027] High degree of automation: By integrating the loading mechanism, the first pick-and-place mechanism, the positioning mechanism, the second pick-and-place mechanism, the transfer mechanism, the laser processing mechanism, the third pick-and-place mechanism and the demolding mechanism, a fully automated process from loading to unloading is realized, reducing manual intervention, which not only improves production efficiency but also reduces labor costs.

[0028] Precise positioning: The positioning mechanism accurately locates the product and wafer, and the platform and mobile components work together to ensure the accuracy of laser processing and reduce the risk of wafer damage, thereby reducing material waste and overall production costs.

[0029] By setting up a debonding mechanism, the bonding film can be directly separated and rolled up. During the separation process, the pressing force can be accurately controlled to avoid excessive pressure on the wafer and prevent mechanical damage.

[0030] The products on the platform are processed by setting up a laser processing mechanism. The laser debonds the adhesive material in a non-mechanical contact manner. On the one hand, the non-contact processing method generates extremely low stress on the separation of the wafers. On the other hand, the laser action time is short and the thermal effect generated is low, so there is no risk of damaging the wafer. In addition, it can achieve high output speed and improve processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A three-dimensional diagram of a laser debonding device according to an embodiment of the present invention.

[0032] Figure 2 for Figure 1 Top view of the laser debonding equipment.

[0033] Figure 3 for Figure 1 A three-dimensional diagram of the first pick-and-place mechanism.

[0034] Figure 4 for Figure 1 A three-dimensional diagram of the middle positioning mechanism, the second pick-and-place mechanism and the transfer mechanism.

[0035] Figure 5 for Figure 1 A three-dimensional diagram of the film stripping mechanism.

[0036] Figure 6 for Figure 5 A partial perspective view of the middle pressure roller assembly.

[0037] Figure 7 for Figure 1 A three-dimensional diagram of the third pick-and-place mechanism and the substrate recovery mechanism.

[0038] Figure 8 for Figure 1 Workflow diagram of laser debonding equipment. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0040] Please refer to Figure 1 and Figure 2 As shown, the present invention provides a laser debonding device, which includes a loading mechanism 1, an unloading mechanism 2, a first pick-and-place mechanism 20, a machine table 10, a positioning mechanism 30 arranged on the machine table 10, a second pick-and-place mechanism 40, a transfer mechanism 50, a demolding mechanism 60, a laser processing mechanism 70, a third pick-and-place mechanism 80 and a substrate recovery mechanism 90.

[0041] The loading mechanism 1 is used to place the products to be processed, which include substrates, films and wafers stacked in sequence; the unloading mechanism 2 is used to place the processed wafers. In this embodiment, the loading mechanism 1 and the unloading mechanism 2 are arranged side by side, and both adopt the method of cooperating with the lifting component and the basket. The products and wafers are placed in the basket through the iron ring. In this way, the loading mechanism 1 and the unloading mechanism 2 can both be highly positioned.

[0042] The first pick-and-place mechanism 20 is used to perform pick-and-place actions between the loading mechanism 1 and the positioning mechanism 30, and between the positioning mechanism 30 and the unloading mechanism 2. Figure 3 As shown, the first pick-and-place mechanism 20 includes a horizontal linear module 21 and a dual-arm multi-axis manipulator disposed on the horizontal linear module 21. In this embodiment, the horizontal linear module 21 is arranged along the Y-axis direction, and the loading mechanism 1 and the unloading mechanism 2 are arranged side by side on one side of the horizontal linear module 21 along the Y-axis direction. The dual-arm multi-axis manipulator includes a rotating base 22 and two multi-axis manipulators 23 and 24 disposed on the rotating base 22. The rotating axes of the rotating base 22 and the two multi-axis manipulators 23 and 24 are all arranged vertically, and the two multi-axis manipulators 23 and 24 can independently drive the product to move in the horizontal direction.

[0043] The positioning mechanism 30 is used to find the edge and position the product and wafer placed thereon. In this embodiment, a mechanical edge finder is used. By clamping the product and rotating it at a low speed on the machine tool, the eccentric effect is used to automatically adjust and align the machining center position. In other embodiments, a photoelectric edge finder or an infrared distance measuring edge finder can also be used, which is not limited here.

[0044] The second pick-and-place mechanism 40 is used to perform pick-and-place operations between the positioning mechanism 30 and the transfer mechanism 40. Figure 4 As shown, the second pick-and-place mechanism 40 includes a support 41, a horizontal linear module 42 disposed on the support 41, a lifting module 43 disposed on the horizontal linear module 42, and a horizontal suction cup group 44 driven to rise and fall by the lifting module 43. The horizontal linear module 42 is arranged along the X-axis direction and is located above the positioning mechanism 30 and the transfer mechanism 50. The horizontal suction cup group 44 sucks the product or wafer to transfer it between the positioning mechanism 30 and the transfer mechanism 50.

[0045] The transfer mechanism 50 is used to drive the product to move between the pick-and-place station of the second pick-and-place mechanism 40, the demolding station of the demolding mechanism 60, and the pick-and-place station of the third pick-and-place mechanism 80. The transfer mechanism 50 includes a moving component 51, a platform 52 disposed on the moving component, and a suction cup component 53 disposed on the periphery of the platform 52. The moving component 51 is a horizontal linear module disposed along the Y-axis direction. The platform 52 is a heatable platform to heat the product when necessary, such as a heat treatment debonding operation.

[0046] The laser processing mechanism 70 is arranged on the moving route of the platform 52. When the platform 52 moves to the processing station of the laser processing mechanism 70, the laser debonding processing of the product on the platform 52 begins. In this embodiment, the laser processing mechanism 70 includes a laser, a bracket, a horizontal moving module arranged along the X-axis direction on the bracket, and a processing head arranged on the horizontal moving module. The horizontal moving module cooperates with the moving component 51 to move the product in the X / Y direction.

[0047] The third pick-and-place mechanism 80 is used to remove the substrate of the product after laser processing. Figure 7 As shown, the third pick-and-place mechanism 80 includes a bracket 81, a horizontal rotation module 82, a lifting module 83, a horizontal cantilever 84, and a horizontal suction cup group 84 provided at one end of the horizontal cantilever 83. The substrate recovery mechanism 90 includes a recovery bin 91 with an upward opening and a lifting module 92 provided at the bottom of the recovery bin 91. The horizontal rotation module 82 drives the horizontal cantilever 84 and the horizontal suction cup group 84 to rotate between the platform 52 and the recovery bin 91 to pick up and place the substrate into the recovery bin 91.

[0048] The film stripping mechanism 60 is used to remove the film of the product on the platform 52. Figure 5 As shown, the film stripping mechanism 60 includes a film stripping bracket, a first power roller group 61 arranged on the film stripping bracket, a pressing roller assembly 63, a second power roller group 62, and a debonding film 64 continuously arranged on the first power roller group 61, the pressing roller assembly 63, and the second power roller group 62.

[0049] The first power roller 61 includes a first motor 611, a first active roller 612 driven to rotate by the first motor 611, and a first driven roller 613 arranged in parallel with the first active roller 612. The first active roller is a discharge roller of the degummed film, the degummed film reel is sleeved on the first active roller 612, and the first motor 611 drives the first active roller 612 to rotate. The first driven roller 613 can be set to one or more to adjust the discharge path of the degummed film. The second power roller 62 includes a second motor 621, a second active roller 622 driven to rotate by the second motor 621, and a second driven roller 623 arranged in parallel with the second active roller 622. The second active roller 622 is a receiving roller of the degummed film, the degummed film receiving reel is sleeved on the second active roller 622, and the second motor 621 drives the second active roller 622 to rotate. The second driven roller 623 can be set to one or more to adjust the receiving path of the degummed film.

[0050] The pressing roller assembly 63 is arranged between the first power roller 61 and the second power roller 62, and is used to drive the debonding film 64 to pass through the platform 52 and press the debonding film 64 to the upper surface of the product to stick the film off the product. Figure 6 As shown, the lamination roller assembly 63 includes a linear module 637, a lamination bracket 631 disposed on the linear module 637, a mounting plate 632 disposed on the lamination bracket 631 through a rotating shaft 633, a lamination roller 635 disposed at one end of the mounting plate 632, and a telescopic member 634 disposed at the other end of the mounting plate 632. The linear module 637 is disposed along the X-axis direction, and drives the lamination roller 635 to move horizontally in the X-axis direction. The telescopic member 634 and the lamination roller 635 are respectively located on both sides of the rotating shaft 633, and the telescopic member 634 drives the mounting plate 632 to rotate with the rotating shaft 633 as the axis, so as to drive the lamination roller 635 to move up and down.

[0051] There are two telescopic members 634, which are arranged on both sides of the mounting plate 632. The telescopic member 634 includes a cylinder 6341 and a bearing 6343 arranged at the end of an output shaft 6342 of the cylinder 6341. The mounting plate 632 is provided with a vertical plate 6344 and a horizontal rod 6345 arranged on the vertical plate 6344. The bearing 6343 is sleeved on the horizontal rod 6345. When the output shaft 6342 of the cylinder 6341 is extended and retracted, the bearing 6343 rotates with the horizontal rod 6345 as the axis.

[0052] A steering roller 636 is also provided on the mounting plate 632. The steering roller 636 is provided between the first driven roller 613 and the pressing roller 636 and is parallel to the first driven roller 613 and the pressing roller 636. In this embodiment, the debonded film 64 first passes over the steering roller 636 and then bypasses from under the pressing roller 635. The steering roller 636 supports the debonded film 64 upward for a certain distance to prevent the debonded film 64 from touching the mounting plate 632 during movement.

[0053] Specifically, the action flow of the degumming mechanism 60 is as follows:

[0054] First, the degumming mechanism 60 is in standby state, at which time the telescopic part 634 is retracted, that is, the output shaft of the cylinder is in a retracted state, so the other end of the mounting plate 632 is tilted, and the lamination roller 635 is in a high position; at the same time, the lamination bracket 631 is located on the left side of the linear module 637, that is, the lamination roller 635 is away from the transfer mechanism 50 in the X-axis direction. When the platform 52 carries the product (the substrate has been removed, and only the film and wafer are left, with the film located on the upper surface of the wafer) to the degumming station of the degumming mechanism 60, the linear module 637 drives the laminating bracket 631 and the components thereon to move toward the platform 52, and stops moving above the edge of the product. Further, the output shaft of the cylinder extends, and the other end of the mounting plate 632 drives the laminating roller 635 down to the upper surface of the product. At this time, the first motor 611 and the second motor 621 are started, and the linear module 637 is started at the same time, and the linear speeds of the three are equal, that is, the unloading speed, the receiving speed and the moving speed of the laminating roller 635 are equal. In the process of the laminating roller 635 moving from one side of the product to the other side, the degumming film 64 sticks to the film and is rolled up by the second power roller 62.

[0055] Please refer to Figure 2 and Figure 8 As shown, the working steps of the laser debonding device of the present invention are as follows:

[0056] 1. The product is placed on the loading mechanism 1, and the product is lifted and positioned. At this time, the products to be processed are substrate, film, and wafer from top to bottom. In the following steps, the up and down directions of the product do not change.

[0057] 2. The software matches the product ID (RFID / barcode).

[0058] 3. The first pick-and-place mechanism 20 measures and maps the products in the feeding mechanism 1.

[0059] 4. The first pick-and-place mechanism 20 takes the material from the loading mechanism 1 and places it in the positioning mechanism 30 for positioning

[0060] 5. The platform 52 moves to the pick-and-place station of the second pick-and-place mechanism 40 . The second pick-and-place mechanism 40 picks and places the positioned product onto the platform 52 , and the suction cup assembly 53 absorbs and fixes the product.

[0061] 6. The platform 52 moves to the processing station of the laser processing mechanism 70 for laser debonding.

[0062] 7. After the debonding is completed, the platform 52 moves to the pick-and-place station of the third pick-and-place mechanism 80 to remove the uppermost substrate from the product.

[0063] 8. The substrate is placed into the recovery bin 91 by the third pick-and-place mechanism 80; at the same time, the platform 52 moves to the film stripping station, and the film stripping mechanism 60 strips and reels the products on the platform 52 (the film and wafer from top to bottom at this time).

[0064] 9. After the product is stripped, the second pick-and-place mechanism 40 picks up the product (only the wafer is left at this time) and places it on the positioning mechanism 30 for positioning.

[0065] 10. The first pick-and-place mechanism 20 takes materials from the positioning mechanism 30 and then places them on the unloading mechanism 2.

[0066] The wafer product completes a laser debonding operation through the above steps.

[0067] Terms such as "upper", "lower", "front", "back", "left", "right" and the like used herein to indicate spatial relative positions are used for the purpose of convenience to describe the relationship of one feature relative to another feature as shown in the drawings. It is understood that, depending on the different positions of the products, the terms of spatial relative positions may be intended to include different orientations in addition to the orientations shown in the drawings, and should not be construed as limitations on the claims.

[0068] In addition, the above embodiments are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. The understanding of this specification should be based on the technical personnel in the relevant technical field. Although this specification has described the present invention in detail with reference to the above embodiments, ordinary technical personnel in the field should understand that the technical personnel in the relevant technical field can still modify or replace the present invention with equivalents, and all technical solutions and improvements thereof that do not depart from the spirit and scope of the present invention should be covered within the scope of the claims of the present invention.

Claims

1. A laser debonding device, characterized in that: It includes a loading mechanism, a first pick-and-place mechanism, a positioning mechanism, a second pick-and-place mechanism, a transfer mechanism, a laser processing mechanism, a third pick-and-place mechanism, a demolding mechanism and a material unloading mechanism, wherein: The loading mechanism is used to place the product to be processed, and the product includes a substrate, a film and a wafer stacked in sequence; the unloading mechanism is used to place the processed wafer; The first pick-and-place mechanism is used to perform pick-and-place actions between the loading mechanism and the positioning mechanism, and between the positioning mechanism and the unloading mechanism; The positioning mechanism is used to perform edge-finding and positioning of products and wafers; The second pick-and-place mechanism is used to perform a pick-and-place action between the positioning mechanism and the transfer mechanism; The transfer mechanism includes a moving component and a platform disposed on the moving component, and the product is fixed on the platform with the substrate facing upward; The laser processing mechanism is used to perform laser debonding on the product on the platform; The third pick-and-place mechanism is used to remove the substrate of the product after laser processing; The film stripping mechanism is used to remove the film of the product on the platform; The transfer mechanism drives the product to move between the pick-up and place station of the second pick-up and place mechanism, the demolding station of the demolding mechanism and the pick-up and place station of the third pick-up and place mechanism.

2. The laser debonding device according to claim 1, characterized in that: The film stripping mechanism includes a film stripping bracket, a first power roller group, a pressing roller assembly, a second power roller group and a debonding film continuously arranged on the first power roller group, the pressing roller assembly and the second power roller group. The pressing roller assembly drives the debonding film to pass through the platform and stick the film off.

3. The laser debonding device according to claim 2, characterized in that: The lamination roller assembly includes a lamination bracket, a mounting plate arranged on the lamination bracket through a rotating shaft, a lamination roller arranged at one end of the mounting plate and a telescopic member arranged at the other end of the mounting plate, the telescopic member and the lamination roller are respectively located on both sides of the rotating shaft, and the telescopic member drives the mounting plate to rotate around the rotating shaft as the axis to drive the lamination roller to move up and down.

4. The laser debonding device according to claim 3, characterized in that: The telescopic member includes a cylinder and a bearing arranged at the end of the output shaft of the cylinder. A vertical plate and a horizontal rod arranged on the vertical plate are provided on the mounting plate. The bearing sleeve is arranged on the horizontal rod. When the output shaft of the cylinder is extended and retracted, the bearing rotates with the horizontal rod as the axis.

5. The laser debonding device according to claim 2, characterized in that: The lamination roller assembly further comprises a linear module, the lamination bracket is arranged on the linear module, and the linear module drives the lamination roller to move horizontally.

6. The laser debonding device according to claim 2, characterized in that: The first power roller includes a first motor, a first active roller driven to rotate by the first motor, and a first driven roller arranged in parallel with the first active roller; the second power roller includes a second motor, a second active roller driven to rotate by the second motor, and a second driven roller arranged in parallel with the second active roller; the first active roller is a discharge roller of the degummed film, and the second active roller is a receiving roller of the degummed film; a steering roller is also provided on the mounting plate, and the steering roller is provided between the first driven roller and the pressing roller, and is parallel to the first driven roller and the pressing roller.

7. The laser debonding device according to claim 1, characterized in that: The first pick-and-place mechanism includes a horizontal linear module and a double-arm multi-axis manipulator arranged on the horizontal linear module.

8. The laser debonding device according to claim 1, characterized in that: The second pick-and-place mechanism includes a horizontal linear module, a lifting module arranged on the horizontal linear module, and a horizontal suction cup group driven to rise and fall by the lifting module.

9. The laser debonding device according to claim 1, characterized in that: The third pick-and-place mechanism includes a horizontal rotating module, a lifting module, a horizontal cantilever and a horizontal suction cup group arranged in sequence. The laser debonding equipment also includes a substrate recovery mechanism, which includes a recovery bin opening upward and a lifting module arranged at the bottom of the recovery bin.

10. The laser debonding device according to claim 1, characterized in that: The moving component is a horizontal linear module, the platform is a heatable platform, and a suction cup component is provided on the periphery of the platform to absorb the product on the platform.

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